Display device

Abstract

A display device includes a cover window, a display module attached to a bottom surface of the cover window, a core plate attached to a bottom surface of the display module, and a back cover accommodating the display module and the core plate, wherein the back cover is attached to a bottom surface of the cover window, and wherein the core plate includes a heat dissipation portion having a top surface attached to the display module and a heat insulation portion accommodated in a groove formed in the heat dissipation portion.

Description

Technical Field

[0001] This disclosure relates to a display device, and more specifically, to a thinner display device with improved heat dissipation performance. Background Technology

[0002] As society enters the mature information age, various display devices for processing and displaying large amounts of information have been developed. Flat panel displays, including liquid crystal displays (LCDs), organic light-emitting diode (OLEDs), and quantum dot displays, have attracted much attention.

[0003] Recently, research has been actively conducted on thin and lightweight display panels. A flexible display device in which the display panel can be bent or folded and unfolded has also been provided.

[0004] Flexible display devices are widely used in various information devices such as televisions, monitors, smartphones, tablets, laptops, and wearable devices.

[0005] In addition, various vehicle display devices, such as digital instrument clusters (or dashboards), central information displays (CIDs), and rear-seat entertainment (RSE) displays, are also used in vehicles, such as automobiles. Flexible display devices are used in these various vehicle displays. Research is underway to integrate digital instrument clusters and central information displays into a single display using flexible displays that can be implemented in various shapes. Summary of the Invention

[0006] When a display device is operating, the display panel generates a significant amount of heat. If this heat is not effectively dissipated, the lifespan of the display panel may be shortened. Furthermore, the control printed circuit board that controls the operation of the display panel also generates considerable heat during operation. When this heat is transferred to the display panel, it may also shorten its lifespan.

[0007] Therefore, a component design is needed that can effectively control internal heat while maintaining a thin structure for the display device.

[0008] The object of embodiments according to this disclosure is to provide a display device that can be thinner and has improved heat dissipation performance.

[0009] The purpose of this disclosure is not limited to the objectives described above. Other objectives and advantages not mentioned in this disclosure may be understood based on the following description and may become clearer based on embodiments of this disclosure. Furthermore, it will be readily understood that the objectives and advantages of this disclosure can be achieved using the solutions and combinations thereof shown in the claims.

[0010] A display device according to an embodiment of the present disclosure includes: a cover window; a display module attached to a bottom surface of the cover window; a core board attached to a bottom surface of the display module; and a rear cover for housing the display module and the core board, wherein the rear cover is attached to the bottom surface of the cover window, and wherein the core board includes: a heat dissipation portion having a top surface attached to the display module; and a heat insulation portion received in a groove formed in the heat dissipation portion.

[0011] A display device according to another embodiment of the present disclosure includes: a display module including a display panel and a heat sink disposed below the display panel; and a core board attached to the heat sink of the display module, wherein the core board includes a first portion having a first thermal conductivity and a second portion having a second thermal conductivity lower than the first thermal conductivity.

[0012] Specific details of other embodiments are included in the detailed description and the accompanying drawings.

[0013] According to embodiments of this disclosure, a core board with a heat dissipation section can be attached to a display module, thereby providing a thinner display device with improved heat dissipation performance.

[0014] According to embodiments of this disclosure, a core board with a heat insulation portion can be attached to a display module, thereby providing a display device capable of preventing heat generated by a control printed circuit board from being transferred to the display panel.

[0015] According to embodiments of this disclosure, the core board can be attached to the display module and the back cover can be attached to the bottom surface of the cover window, thereby providing a display device with a reduced bezel width.

[0016] The effects of this disclosure are not limited to those described above, and those skilled in the art will clearly understand other effects not mentioned through the following description. Attached Figure Description

[0017] Figure 1 This is a cross-sectional view showing a display device according to an embodiment of the present disclosure.

[0018] Figure 2 This is a perspective view showing a core board according to an embodiment of the present disclosure.

[0019] Figure 3 and Figure 4 This is a cross-sectional view showing a portion of a display device according to an embodiment of the present disclosure.

[0020] Figure 5 This is a cross-sectional view showing the display panel of a display device according to an embodiment of the present disclosure. Detailed Implementation

[0021] The advantages and features of this disclosure, as well as the methods for achieving these advantages and features, will become clear from reference to the embodiments described in detail below with reference to the accompanying drawings. However, this disclosure is not limited to the embodiments disclosed below, but can be implemented in various different forms. Therefore, these embodiments are set forth only to complete this disclosure and to fully convey the scope of this disclosure to those skilled in the art to which this disclosure pertains.

[0022] The shapes, dimensions, ratios, angles, quantities, etc., disclosed in the accompanying drawings used to describe embodiments of this disclosure are exemplary, and this disclosure is not limited thereto. Throughout this document, the same reference numerals refer to the same elements. Furthermore, for the sake of brevity, descriptions and details of well-known steps and elements have been omitted. Moreover, numerous specific details are set forth in the following detailed description of this disclosure to provide a thorough understanding of it. However, it should be understood that this disclosure can be practiced without these specific details. In other instances, well-known methods, procedures, components, and circuits have not been described in detail so as not to unnecessarily obscure aspects of this disclosure.

[0023] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit this disclosure. As used herein, the singular constructions “a” and “an” are intended to include the plural constructions as well, unless the context clearly indicates otherwise. It will be further understood that, when used in this specification, the terms “comprising,” “including,” “containing,” and “having” specify the presence of a stated feature, integer, action, element, and / or component, but do not exclude the presence or addition of one or more other features, integers, actions, elements, components, and / or portions thereof. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. Expressions such as “at least one of” preceding a list of elements may modify the entire list of elements without modifying the individual elements in the list. Errors or tolerances may occur when interpreting numerical values, even if they are not explicitly described.

[0024] Furthermore, it should be understood that when a first element or layer is referred to as existing "on" a second element or layer, the first element may be directly disposed on the second element or may be indirectly disposed on the second element through a third element or layer disposed between the first and second elements or layers. It should be understood that when an element or layer is referred to as being "connected to" or "bonded to" another element or layer, it may be directly on, directly connected to, or bonded to another element or layer, or one or more intermediate elements or layers may exist. Additionally, it should be understood that when an element or layer is referred to as being "between" two elements or layers, it may be the only element or layer between the two elements or layers, or one or more intermediate elements or layers may exist.

[0025] Furthermore, as used herein, when a layer, membrane, region, plate, etc., can be disposed "above" or "on top" of another layer, membrane, region, plate, etc., the former can directly contact the latter, or another layer, membrane, region, plate, etc., can be disposed between the former and the latter. As used herein, when a layer, membrane, region, plate, etc., is directly disposed "above" or "on top" of another layer, membrane, region, plate, etc., the former directly contacts the latter, and no other layer, membrane, region, plate, etc., is disposed between the former and the latter. Furthermore, as used herein, when a layer, membrane, region, plate, etc., can be disposed "below" or "underneath" another layer, membrane, region, plate, etc., the former can directly contact the latter, or another layer, membrane, region, plate, etc., can be disposed between the former and the latter. As used herein, when a layer, membrane, region, plate, etc., is directly disposed "below" or "underneath" another layer, membrane, region, plate, etc., the former directly contacts the latter, and no other layer, membrane, region, plate, etc., is disposed between the former and the latter.

[0026] It should be understood that although the terms “first,” “second,” “third,” etc., may be used herein to describe various elements, components, regions, layers, and / or portions, these elements, components, regions, layers, and / or portions should not be limited by these terms. These terms are used to distinguish one element, component, region, layer, or portion from another element, component, region, layer, or portion. Therefore, without departing from the spirit and scope of this disclosure, the first element, component, region, layer, or portion described below may be referred to as the second element, component, region, layer, or portion.

[0027] When interpreting numerical values, unless they are explicitly described separately, the value is interpreted to include a range of error.

[0028] It should be understood that when a component or layer is referred to as being "connected to" or "bonded to" another component or layer, it can be directly on another component or layer, directly connected to or bonded to another component or layer, or there can be one or more intermediate components or layers. Additionally, it should be understood that when a component or layer is referred to as being "between" two components or layers, it can be the only component or layer between the two components or layers, or there can be one or more intermediate components or layers.

[0029] The features of the disclosed embodiments can be combined with each other in part or in whole, and can be technically related or interoperable. The embodiments can be implemented independently of each other, or they can be implemented together in an associated relationship.

[0030] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which the concepts of this disclosure pertain. It will be further understood that terms (e.g., those defined in common dictionaries) should be interpreted as having the meaning consistent with their meaning in the context of the prior art and not as being interpreted in an idealized or overly formal sense, unless expressly defined herein.

[0031] In the following, a display device according to an embodiment of the present disclosure will be described in detail with reference to the accompanying drawings.

[0032] Figure 1 This is a cross-sectional view showing a display device according to an embodiment of the present disclosure. Figure 2 This is a perspective view showing a core board according to an embodiment of the present disclosure.

[0033] Reference Figure 1 and Figure 2 The display device according to embodiments of the present disclosure may include a cover window 10, a light control film 20, a polarizing film 30, a display panel 40, a support plate 50, a heat sink 60, a core board 70, a power printed circuit board 82, a control circuit board 84, and a back cover 90. Further, the display device according to embodiments of the present disclosure may also include a first adhesive layer 15, a second adhesive layer 25, a third adhesive layer 35, a fourth adhesive layer 45, a fifth adhesive layer 55, a sixth adhesive layer 65, and a seventh adhesive layer 95.

[0034] The cover window 10 can be made of a transparent material so that light emitted from the display panel 40 can pass through it. The cover window protects the display panel 40 from external impacts, moisture, heat, etc. The cover window 10 can be made of transparent glass or transparent plastic. A hard coating can be additionally formed on the surface of the cover window 10.

[0035] The light control film 20 can be attached to the bottom surface of the cover window 10 via the first adhesive layer 15. The light control film 20 can vertically or horizontally adjust the angle of light emitted from the display panel 110 to prevent the viewing angle from increasing unnecessarily in a certain direction. The first adhesive layer 15 can be made of a transparent adhesive component, such as OCA (Optically Transparent Adhesive) or OCR (Optically Transparent Resin).

[0036] The polarizing film 30 can be adhered to the bottom surface of the light-control film 20 via the second adhesive layer 25. The polarizing film 30 can prevent the reflection of light from the outside to provide the function of improving the visibility of the display panel 40. The second adhesive layer 25 can be made of a transparent adhesive component, such as OCA (Optically Clear Adhesive) or OCR (Optically Clear Resin).

[0037] The display panel 40 can be attached to the bottom surface of the polarizing film 30 via the third adhesive layer 35. The display panel 40 can be flexible. For example, the display panel 40 can be implemented as an organic light-emitting display panel, but is not limited thereto. The display panel 40 can be implemented in various types, such as liquid crystal display panels, quantum dot display panels, etc. When the display panel 40 is implemented as an organic light-emitting display panel, the display panel 40 can include: a substrate; a thin-film transistor array, including thin-film transistors (e.g., switching thin-film transistors and driving thin-film transistors) for pixels disposed on the substrate; organic light-emitting elements for pixel regions connected to the thin-film transistors; and an encapsulation layer covering the organic light-emitting elements to prevent moisture and oxygen from penetrating into the organic light-emitting elements from the outside. The display panel 40 may also include a touch sensor formed on the encapsulation layer. The third adhesive layer 35 can be made of a transparent adhesive member, such as OCA (Optically Transparent Adhesive) or OCR (Optically Transparent Resin).

[0038] In one embodiment, a touch panel may be additionally provided between the light control film 20 and the polarizing film 30.

[0039] The support plate 50 can be attached to the bottom surface of the display panel 40 via the fourth adhesive layer 45 and can support the display panel 40 thereon. For example, the support plate 40 can be made of a polymer material. The polymer material may include, but is not limited to, polymethyl methacrylate (PMMA), polycarbonate (PC), polyacrylate (PA), polyvinyl alcohol (PVA), acrylonitrile-butadiene-styrene (ABS), and polyethylene terephthalate (PET). The fourth adhesive layer 45 can be made of a transparent adhesive member or a thermally conductive adhesive member, such as OCA (optically clear adhesive) or OCR (optically clear resin).

[0040] The heat sink 60 can be attached to the bottom surface of the support plate 50 via the fifth adhesive layer 55, and can dissipate heat generated by the display panel 40. The heat sink 60 can be made of materials such as aluminum or copper. However, the material of the heat sink 120 is not limited to these. The heat sink 60 can be made of any one of gold, silver, magnesium, carbon fiber, graphite, graphene, or a combination of the foregoing materials, which have excellent thermal conductivity. The fifth adhesive layer 55 can be made of a transparent adhesive member or a thermally conductive adhesive member, such as OCA (optically transparent adhesive) or OCR (optically transparent resin).

[0041] When the display panel 40 is implemented as an organic light-emitting display panel, the organic light-emitting elements may degrade due to the heat generated during operation. Therefore, it is important to dissipate the heat to the outside.

[0042] According to this disclosure, the light control film 20, the polarizing film 30, the display panel 40, the support plate 50, and the heat sink 60 together constitute the display module.

[0043] The core board 70 can be attached to the bottom surface of the heat sink 60 via the sixth adhesive layer 65. In other words, the core board 70 can be attached to the bottom surface of the display module via the sixth adhesive layer 65. The sixth adhesive layer 65 can be made of a transparent adhesive component or a thermally conductive adhesive component, such as OCA (Optically Transparent Adhesive) or OCR (Optically Transparent Resin).

[0044] The core board 70 may include: a heat dissipation portion 71, the top surface of which is attached to the display module, i.e., attached to the heat sink 60; and a heat insulation portion 73, housed in a groove formed in the heat dissipation portion 71. The bottom surface of the heat insulation portion 73 and the bottom surface of the heat dissipation portion 71 may constitute the bottom surface of the core board 70. The thermal conductivity of the heat insulation portion 73 is lower than that of the heat dissipation portion 71. The heat dissipation portion 71 may be made of a metal with high thermal conductivity, and the heat insulation portion 73 may be made of a polymer with lower thermal conductivity than the metal. For example, the heat dissipation portion 71 may be made of metals such as gold, silver, copper, aluminum, or magnesium. For example, the heat insulation portion 73 may be made of a polymer, such as polyurethane, polyethylene, polycarbonate, or polystyrene. The core board 70, comprising different materials, may be manufactured by insert injection molding.

[0045] When the core board 70 is directly attached to the heat sink 60, heat is transferred through conduction. Therefore, heat dissipation is more efficient than forming an air gap between the core board 70 and the heat sink 60 for air convection. Furthermore, when the core board 70 is directly attached to the heat sink 60, the overall thickness of the display device can be reduced. Since the heat insulation portion 73 is housed in the recess of the heat sink 71, the overall thickness of the core board 70 does not increase. This facilitates the realization of a thinner display device.

[0046] The power printed circuit board 82 and the control printed circuit board 84 used to drive the display panel 40 can be disposed on the bottom surface of the core board 70.

[0047] Gate drivers for outputting scan signals to multiple gate lines can be disposed on one side (left or right) of the display panel 40. Depending on the driving mechanism, the gate driver may be located only on one side of the display panel 40 or on each of its opposite sides. The gate driver may include one or more gate driver integrated circuits. Each gate driver integrated circuit may be implemented as a chip-on-film (COF) mounted on a thin film connected to the display panel 40, or as a gate-in-panel (GIP) directly disposed on the display panel 40. Source drivers for outputting data voltages to multiple data lines can be disposed on the underside of the display panel 40. Source drivers may include one or more source driver integrated circuits. Source drivers may be implemented as chip-on-film (COF). That is, the source driver may include a flexible circuit film 81 and source driver integrated circuits mounted on the flexible circuit film 81. In this case, one end of the flexible circuit film 81 is coupled to the power printed circuit board 82, and the other end is coupled to the display panel 40.

[0048] Circuitry for processing signals supplied to the gate driver and source driver to switch the data direction and scan direction can be provided in the power printed circuit board 82.

[0049] A timing controller that provides control signals to control the operation of each of the gate driver and the source driver, as well as a power management integrated circuit (PMIC) that supplies various voltages or currents to the gate driver and the data driver or controls the various voltages or currents to be supplied, can be installed in the control printed circuit board 84.

[0050] The control printed circuit board 84 can be connected to the power printed circuit board 82 via a connection medium 83, such as a flexible flat cable (FFC) or a flexible printed circuit (FPC).

[0051] The positions of each of the power printed circuit board 82 and the control printed circuit board 84 can correspond to the positions of the heat insulation portion 73 of the core board 70. The power printed circuit board 82 can be configured to contact the heat insulation portion 73 of the core board 70, while the control printed circuit board 84 can be configured to be spaced apart from the heat insulation portion 73 of the core board 70. The control printed circuit board 84 can be supported by heat insulation pillars 73p protruding from the heat insulation portion 73 of the core board 70.

[0052] During operation of the display panel 40, the control printed circuit board 84 generates a significant amount of heat. To address this, the core board 70 includes a heat insulation portion 73 facing the control printed circuit board 84, thereby preventing the heat generated by the control printed circuit board 84 from being transferred to the display panel 40. The area of ​​the heat insulation portion 73 of the core board 70 can be larger than the area of ​​the control printed circuit board 84. This more effectively prevents the heat generated by the control printed circuit board 84 from being transferred to the display panel 40. Furthermore, the control printed circuit board 84 can be spaced apart from the heat insulation portion 73 of the core board 70, thereby preventing the heat generated by the control printed circuit board 84 from being directly transferred to the display panel 40.

[0053] Meanwhile, the heat dissipation part 71 of the core board 70 can dissipate the heat generated in the display panel 40 and transferred to the heat sink 60 to the outside.

[0054] In this way, the core board 70 is composed of a heat dissipation part 71 and a heat insulation part 73, so as to dissipate the heat generated by the display panel 40 to the outside, while preventing the heat generated by the control printed circuit board 84 from being transferred to the display panel 40.

[0055] In this way, the core plate 70, including the heat dissipation part 71 and the heat insulation part 73, can be attached to the heat dissipation plate 60, so that when the display panel 40 is implemented as an organic light-emitting display panel, the degradation of the organic light-emitting element can be prevented, thereby extending the service life of the organic light-emitting element.

[0056] The back cover 90 can accommodate the display module and the core board 70, and can be attached to the bottom surface of the cover window 10. The back cover 90 may include a bottom 90b and sidewalls 90s extending from the bottom 90b and covering the sides of the display module. The sidewalls 90s of the back cover 90 can be attached to the edge of the bottom surface of the cover window 10 via a seventh adhesive layer 95. The back cover 90 may be made of plastic, carbon fiber reinforced plastic (CFRP), or metal.

[0057] Multiple openings can be formed in the bottom 90b and sidewalls 90s of the back cover 90, thereby allowing external air to be introduced into the internal space defined by the back cover 90. As external air circulates through the multiple openings, heat transferred to the core board 70 and heat generated by the control printed circuit board 84 can be effectively exhausted to the outside.

[0058] The outer surface of the sidewall 90s of the rear cover 90 protrudes outward beyond the edge of the cover window 10. The outer surface of the sidewall 90s of the rear cover 90 can be aligned with the edge of the cover window 10. Therefore, compared with the case where the inner surface of the sidewall 90s of the rear cover 90 is attached to the outer surface of the cover window 10, the display device according to the embodiments of the present disclosure can achieve a much narrower bezel.

[0059] Figure 3 and Figure 4This is a cross-sectional view showing a portion of a display device according to an embodiment of the present disclosure. Figure 3 and Figure 4 It shows Figure 1 The components of the display device shown include a display panel 40, a support plate 50, a heat sink 60, a core plate 70, and adhesive layers 45, 55, and 65.

[0060] Reference Figure 3 A heat-dissipating coating 72 can be further provided on the top surface of the core plate 70. The heat-dissipating coating 72 can cover the entire top surface of the heat dissipation portion 71 of the core plate 70. The heat-dissipating coating 72 can include any one of carbon nanotubes, graphene, diamond, graphite, and carbon black. The heat-dissipating coating 72 allows heat transferred from the heat sink 60 to spread rapidly along the top surface of the core plate 70, thereby helping to dissipate heat that might not be transferred to the rear surface of the core plate 70 due to the heat insulation portion 73 to the outside. The heat-dissipating coating 72 can improve the heat dissipation performance of the core plate 70.

[0061] Reference Figure 4 An uneven pattern 71p can be further formed on the top surface of the core board 70. The uneven pattern 71p can be formed on the entire top surface of the heat dissipation portion 71 of the core board 70. The uneven pattern 71p can increase the thermal contact area to help dissipate the heat transferred from the heat sink 60 to the outside. The uneven pattern 71p can improve the heat dissipation performance of the core board 70.

[0062] Furthermore, in the presence of uneven pattern 71p, the bonding area of ​​core board 70 can be increased, thereby firmly forming an adhesive between heat sink 60 and core board 70.

[0063] Figure 3 The illustrated embodiments and Figure 4 The illustrated embodiments can be combined with each other. That is, the heat dissipation coating 72 can be applied to the top surface of the core board 70 on which the uneven pattern 71p has already been formed. In this case, the heat dissipation performance of the core board 70 can be further improved.

[0064] Figure 5 This is a cross-sectional view showing the display panel of a display device according to an embodiment of the present disclosure.

[0065] Display panel 40 includes a filter array 150 and a thin-film transistor array 160. Display panel 40 can be implemented as an organic light-emitting display panel.

[0066] The thin-film transistor array 160 may include a thin-film transistor 170 formed on a lower substrate 161 and an organic light-emitting element 180 formed on the thin-film transistor 170. The thin-film transistor 170 includes: a gate 172; a semiconductor layer 174 overlapping the gate 172 and with a gate insulating layer 162 interposed between the semiconductor layer 174 and the gate 172; and a source 176 and a drain 178 formed on the first passivation layer 164 and in contact with the semiconductor layer 174.

[0067] The anode 182 can be electrically connected to the drain 178 of the thin-film transistor 170. In one example, with... Figure 5 Unlike the example shown, anode 182 can be electrically connected to source 176 of thin-film transistor 170. Organic light-emitting layer 184 can be formed on anode 182 and in the light-emitting region defined by dam 168, and can emit white light. Organic light-emitting layer 184 can include a stacked structure of hole-dependent layer, light-emitting layer and electron-dependent layer stacked sequentially on anode 182 in this order or reverse order. Cathode 186 is formed on organic light-emitting layer 184 and dam 168. Encapsulation layer 138 is formed to cover organic light-emitting element 180. Encapsulation layer 138 can prevent moisture and oxygen from penetrating into organic light-emitting element layer.

[0068] A filter array 150 can be disposed on and attached to an encapsulation layer 138 via an adhesive layer 140. The filter array 150 may include a black matrix 154 and filters 152 stacked on an upper substrate 151. The filters 152 may include red, green, and blue filters. The red, green, and blue filters may be formed on the upper substrate 151 and in the transmission region defined by the black matrix 154, and may each achieve a corresponding color. In one example, with... Figure 5 As shown in the diagram, the black matrix 154 can be disposed between the upper substrate 151 and the filter 152.

[0069] like Figure 5 The structure of the display panel 40 shown is merely an example. Various display panel structures can be used in the display device. For example, the display panel can be implemented as an organic light-emitting display panel that does not include a filter and a black matrix. Organic light-emitting elements can be formed in the light-emitting area defined by the black matrix, and can include red, green, and blue light-emitting elements.

[0070] The display device according to embodiments of the present disclosure can be described as follows.

[0071] A first aspect of this disclosure provides a display device, comprising: a cover window; a display module attached to a bottom surface of the cover window; a core board attached to the bottom surface of the display module; and a rear cover accommodating the display module and the core board, wherein the rear cover is attached to the bottom surface of the cover window, and wherein the core board includes: a heat dissipation portion having a top surface attached to the display module; and a heat insulation portion accommodated in a groove formed in the heat dissipation portion.

[0072] In one embodiment of this disclosure, the display device further includes a control printed circuit board disposed on the bottom surface of the core board, wherein the heat insulation portion is located between the heat dissipation portion and the control printed circuit board.

[0073] In one embodiment of this disclosure, the area of ​​the heat insulation portion is larger than the area of ​​the control printed circuit board.

[0074] In one embodiment of this disclosure, the display module includes: a display panel; a support plate attached to the bottom surface of the display panel; and a heat sink attached to the bottom surface of the support plate, wherein the heat dissipation portion of the core board and the heat sink are attached to each other by a thermally conductive adhesive member.

[0075] In one embodiment of this disclosure, the heat dissipation part is made of metal, and the heat insulation part is made of a polymer with a thermal conductivity lower than that of metal.

[0076] In one embodiment of this disclosure, an uneven pattern is provided on the top surface of the heat dissipation portion.

[0077] In one embodiment of this disclosure, a heat dissipation coating is provided on the top surface of the heat dissipation part.

[0078] In one embodiment of this disclosure, the heat-dissipating coating includes at least one selected from the group consisting of carbon nanotubes, graphene, diamond, graphite, and carbon black.

[0079] In one embodiment of this disclosure, the back cover includes a bottom and a sidewall extending vertically from the bottom and covering the side of the display module, wherein the outer surface of the sidewall protrudes outward beyond the edge of the cover window.

[0080] In one embodiment of the first aspect, a plurality of openings are defined in the bottom and sidewalls of the back cover.

[0081] A second aspect of this disclosure provides a display device, comprising: a display module including a display panel and a heat sink disposed below the display panel; and a core board attached to the heat sink of the display module, wherein the core board includes a first portion having a first thermal conductivity and a second portion having a second thermal conductivity lower than the first thermal conductivity.

[0082] In one embodiment of this disclosure, the display device further includes a control printed circuit board disposed below the core board and configured to control the operation of the display panel, wherein a second portion has a larger area than the control printed circuit board and faces the control printed circuit board.

[0083] In one embodiment of this disclosure, the first portion is made of metal and the second portion is made of polymer.

[0084] In one embodiment of this disclosure, an uneven pattern is provided on the top surface of the first portion.

[0085] In one embodiment of this disclosure, a heat-dissipating coating is provided on the top surface of the first portion.

[0086] The scope of this disclosure should be interpreted based on the scope of the appended claims, and all technical concepts within the scope of the appended claims should be understood to be included within the scope of this disclosure. Although embodiments of this disclosure have been described in more detail with reference to the accompanying drawings, this disclosure is not necessarily limited to these embodiments. This disclosure can be implemented in various modifications without departing from the technical concept of this disclosure. Therefore, the embodiments disclosed in this disclosure are not intended to limit the technical concept of this disclosure, but are used to describe this disclosure. The scope of the technical concept of this disclosure is not limited by the embodiments. Therefore, it should be understood that the above embodiments are illustrative and not restrictive in all respects. The scope of this disclosure should be interpreted based on the appended claims, and all technical concepts within the scope of this disclosure should be understood to be included within the scope of this disclosure.

Claims

1. A display device comprising: a cover window; a display module attached to a bottom surface of the cover window; a core plate attached to a bottom surface of the display module; a back cover accommodating the display module and the core plate, wherein the back cover is attached to the bottom surface of the cover window; and a printed circuit board disposed on a bottom surface of the core plate, wherein the core plate comprises: a heat dissipation portion having a top surface attached to the display module; and a heat insulation portion disposed on at least a portion of the bottom surface of the core plate, wherein the printed circuit board is disposed on the heat insulation portion, wherein the display module comprises: a display panel; a support plate attached to a bottom surface of the display panel; and a heat dissipation plate attached to a bottom surface of the support plate, wherein the heat dissipation portion of the core plate is attached to a bottom surface of the heat dissipation plate. The printed circuit board comprises a control printed circuit board for driving the display module.

2. The display device according to claim 1, wherein An area of the heat insulation portion is greater than an area of the control printed circuit board.

3. The display device of claim 2, wherein, The heat dissipation portion of the core plate is attached to the bottom surface of the heat dissipation plate by a heat conductive adhesive member.

4. The display device according to claim 1, wherein The heat dissipation portion is made of a metal, and the heat insulation portion is made of a polymer having a thermal conductivity lower than that of the metal.

5. The display device according to claim 1, wherein A top surface of the heat dissipation portion comprises an uneven pattern.

6. The display device according to claim 1, wherein A heat dissipation coating is disposed on a top surface of the heat dissipation portion.

7. The display device according to claim 1, wherein The heat dissipation coating comprises at least one selected from the group consisting of carbon nanotubes, graphene, diamond, graphite, and carbon black.

8. The display device of claim 7, wherein, The back cover comprises a bottom and a sidewall vertically extending from the bottom and covering a side of the display module, 9. The display device according to claim 1, wherein wherein an outer surface of the sidewall protrudes outward by no more than an edge of the cover window. A plurality of openings are defined in the bottom and the sidewall of the back cover.

10. The display device of claim 9, wherein, The heat dissipation portion comprises a recess, and the heat insulation portion is disposed in the recess of the heat dissipation portion.

11. The display device according to claim 1, wherein 12.A display device comprising: a display module comprising a display panel, a support plate below the display panel, and a heat dissipation plate disposed below the support plate; a core plate attached to a bottom surface of the heat dissipation plate of the display module; and a printed circuit board disposed on a bottom surface of the core plate, wherein the core plate comprises a first portion having a first thermal conductivity and a second portion having a second thermal conductivity lower than the first thermal conductivity, wherein the second portion is disposed on at least a portion of the bottom surface of the core plate, wherein the printed circuit board is disposed on a heat insulation portion, wherein the first portion of the core plate is attached to the bottom surface of the heat dissipation plate. The printed circuit board comprises a control printed circuit board for driving the display module. The first portion is made of a metal, and the second portion is made of a polymer.

13. The display device of claim 12, wherein, A top surface of the first portion comprises an uneven pattern.

14. The display device of claim 12, wherein, A heat dissipation coating is disposed on a top surface of the first portion.

15. The display device of claim 12, wherein, The first portion comprises a recess, and the second portion is disposed in the recess of the first portion.

16. The display device of claim 12, wherein, ​ 17. The display device of claim 12, wherein, ​

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