Hand of an industrial robot and industrial robot

Abstract

Provided is an industrial robot hand that can be used for different purposes while suppressing manufacturing costs, and an industrial robot having the industrial robot hand. The hand has a support portion configured to be able to support either of a suction wafer loading portion and a clamping wafer loading portion, the support portion having: an air flow path connected to a suction hole in a state in which the suction wafer loading portion is supported; only one of a suction unit including a connection member connecting a front end of an air pipe to the air flow path and a clamping unit capable of pressing an end surface of a wafer in a state in which the clamping wafer loading portion is supported, the support portion further having a mounting portion for mounting the other of the suction unit and the clamping unit.

Description

Technical Field

[0001] This invention relates to a hand for an industrial robot and an industrial robot equipped with the hand of the industrial robot. Background Technology

[0002] Previously, industrial robots for handling objects such as semiconductor wafers were known. For example, Patent Document 1 describes an industrial robot having: four hands for loading and handling objects; an arm rotatably connected to the four hands at its front end; and a main body rotatably connected to the base end of the arm. In this industrial robot, if the four hands are considered as a pair of first hands and a pair of second hands, the holding portion of either of the pair of first hands and the pair of second hands includes: an end face contact member having a contact surface for the end face of the object being handled to contact; and a pressing mechanism that presses the object being handled so that the end face of the object being handled is pressed against the contact surface. Furthermore, the holding portion of the other two hands constituting either the pair of first hands or the pair of second hands includes a suction hole for suction and holding the object being handled.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2017-119326 Summary of the Invention

[0006] The technical problem that the invention aims to solve

[0007] As for methods of holding semiconductor wafers in industrial robots, as shown in Patent Document 1, there are known clamping holding methods that hold the wafer by pressing its end face (outer peripheral surface) and suction holding methods that hold the wafer by suction. Even for the same industrial robot, there are cases where it is desirable to switch between clamping holding and suction holding methods depending on its application. Therefore, it is possible to manufacture a hand that incorporates both units for clamping holding and units for suction holding. However, such a hand has higher manufacturing costs and higher sales revenue to users. Therefore, users who do not need one of the units would incur additional costs.

[0008] The purpose of this invention is to provide an industrial robot hand and an industrial robot having the industrial robot hand that can be differentiated according to the intended use while suppressing manufacturing costs.

[0009] Technical solutions adopted to solve technical problems

[0010] According to one aspect of the present invention, the hand of an industrial robot is configured to replace a first loading section and a second loading section. The first loading section loads a transport object and has an end face contact member including an contact surface for the end face of the transport object to abut. The second loading section loads the transport object and has a suction port for suctioning and holding the transport object. The hand of the industrial robot includes a support section configured to support either the first loading section or the second loading section. The support section has: an airflow path connected to the suction port when supporting the second loading section; only one of a first unit and a second unit, the first unit including a connecting member connecting the front end of an air pipe housed in the industrial robot to the airflow path, the second unit being capable of pressing the end face of the transport object loaded on the first loading section when supporting the first loading section; and a mounting section for mounting the other of the first unit and the second unit.

[0011] An industrial robot according to one aspect of the present invention comprises: the hand; the air piping; an arm supporting the hand; and an arm support supporting the arm.

[0012] Invention Effects

[0013] According to the present invention, it is possible to provide an industrial robot hand and an industrial robot having the industrial robot hand that can be used differently depending on the purpose while suppressing manufacturing costs. Attached Figure Description

[0014] Figure 1 This is a diagram illustrating the schematic structure of a manufacturing system for illustrating embodiments of the present invention from the front side.

[0015] Figure 2 It is used to explain from the top. Figure 1 A diagram showing the general structure of the manufacturing system.

[0016] Figure 3 yes Figure 1 The side view of the horizontal multi-jointed robot shown.

[0017] Figure 4 yes Figure 3 The side view shown is of the arm support of a horizontal multi-joint robot in the rising position.

[0018] Figure 5 yes Figure 3 The image shows a top view of a horizontal, multi-jointed robot.

[0019] Figure 6 It means Figure 5 A schematic diagram showing the detailed structure near the support portion of the hand.

[0020] Figure 7 This indicates that the clamping unit is installed on Figure 6 A schematic diagram of the state of the support portion.

[0021] Figure 8 It means in Figure 7 The diagram shows a state in which a wafer mounting clamping part is installed on the support portion.

[0022] Figure 9 It means in Figure 7 The diagram shows a state in which a wafer loading section for suction is mounted on the support portion.

[0023] Figure 10 It is used for explanation Figure 3 A schematic diagram of the internal structure of the retaining part is shown.

[0024] Figure 11 It is used for explanation Figure 3 A cross-sectional view of the internal structure of the retaining part shown.

[0025] Explanation of reference numerals in the attached figures

[0026] 1… Manufacturing system; 2… Wafer (semiconductor wafer); 3… Processing device; 4… Processing unit; 5… Robot (horizontal multi-joint robot); 10… Reception unit; 11… Reception unit (second reception unit); 12… Lifting device; 14, 15… Hand; 14a… Wafer loading unit for clamping; 14c… Wafer loading unit for suction; 14b… Support unit; 144a2… Air flow path; 147… Suction unit; 147a… Connecting component; 146… Clamping unit; 146a… Cylinder; 146c… Roller; P… Air piping; 16… Arm; 17… Arm support; 18… Holding part; 19… Hand drive mechanism; 20… Arm drive mechanism; 21… Arm lifting mechanism; 24… First arm; 25… Second arm; 26… Third arm; 27… First drive mechanism; 28… Second drive mechanism; 61… Lifting mechanism. Detailed Implementation

[0027] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

[0028] (Overall structure of the manufacturing system)

[0029] Figure 1 This is a diagram illustrating the schematic structure of the manufacturing system 1, which is an embodiment of the present invention, from the front side. Figure 2 It is used to explain from the top. Figure 1 A diagram showing the schematic structure of manufacturing system 1.

[0030] The manufacturing system 1 of this method is a semiconductor manufacturing system for manufacturing semiconductors. This manufacturing system 1 includes a processing unit 4, which has multiple processing devices 3 that perform prescribed processes on semiconductor wafers 2 (hereinafter referred to as "wafer 2"). The processing unit 4 is composed of multiple layers, and multiple processing devices 3 are provided on each layer of the multiple layers. In addition, the manufacturing system 1 includes a horizontal articulated robot 5 (hereinafter referred to as "robot 5"), which is provided on each layer of the processing unit 4 to move the wafers 2 into and out of the processing devices 3. In this method, the wafer 2 is the object to be moved by the robot 5.

[0031] In the following explanation, the direction orthogonal to the up and down directions will be used. Figure 1 The X direction of the equation is set to the "left and right direction", which is orthogonal to the up and down and left and right directions. Figure 1 The Y-direction is set as the "front-back direction". In addition, the X1 direction side in the left-right direction is set as the "right" side, and its opposite side, the X2 direction side, is set as the "left" side. The Y1 direction side in the front-back direction is set as the "front" side, and its opposite side, the Y2 direction side, is set as the "back (rear)" side.

[0032] like Figure 1 As shown, the processing unit 4 of this method consists of two layers. A robot 5 is installed on both the first and second layers of the processing unit 4. The robot 5 is located inside the processing unit 4. Furthermore, for example, six processing devices 3 are installed on both the first and second layers of the processing unit 4. Specifically, as... Figure 2 As shown, on each of the first and second layers of the processing unit 4, three processing devices 3 are arranged adjacent to each other in the left-right direction and separated by a predetermined interval in the front-back direction. In addition, each processing device 3 has a wafer mounting section 6 for mounting a wafer 2.

[0033] Robot 5 is positioned between the three processing devices 3 located on the front side and the three processing devices 3 located on the rear side in the first and second layers of the processing unit 4, respectively. Furthermore, robot 5 is positioned at the center of the processing unit 4 in the left-right direction in both the first and second layers. Fixing frames 7 are provided in both the first and second layers of the processing unit 4 for fixing robot 5, and robot 5 is fixed to the fixing frames 7.

[0034] Manufacturing system 1 includes a lifting device 12, which has two receiving sections 10 and 11 for accommodating multiple wafers 2. The lifting device 12 is located on the right side inside the processing section 4. Furthermore, the lifting device 12 is positioned approximately at the same location as the robot 5 in the front-rear direction. The lifting device 12 is fixed to a fixed frame 7. Manufacturing system 1 also includes a horizontal articulated robot 13 (see reference). Figure 1Hereinafter referred to as "robot 13"), when viewed from above, this horizontal jointed robot 13 is configured to sandwich the lifting device 12 between it and robot 5 in the left-right direction. Robot 13 is located outside the processing unit 4 and is positioned approximately at the same location as the lifting device 12 in the front-back direction. Furthermore, in Figure 2 The illustration of robot 13 is omitted.

[0035] (Structure of a horizontal multi-joint robot)

[0036] Figure 3 yes Figure 1 The side view of robot 5 shown. Figure 4 yes Figure 3 The side view of the robot 5 with its arm support 17 in an ascending state is shown. Figure 5 yes Figure 3 The top view of robot 5 shown. Figure 6 It means Figure 5 A schematic diagram of the detailed structure near the support portion 14b of the hand 14 shown. Figure 7 This indicates that the clamping unit 146 is installed... Figure 6 A schematic diagram of the state of the support portion 14b. Figure 8 It means in Figure 7 This is a schematic diagram showing the state in which the support portion 14b is equipped with the clamping wafer loading portion 14a. Figure 9 It means in Figure 7 This is a schematic diagram showing the state in which the support portion 14b is fitted with the suction wafer loading portion 14c. Figure 10 It is used for explanation Figure 3 A schematic diagram of the internal structure of the retaining part 18 shown. Figure 11 It is used for explanation Figure 3 A cross-sectional view of the internal structure of the retaining part 18 shown.

[0037] Robot 5 is a three-bar linkage robot. This robot 5 has: two hands 14 and 15 for loading the wafer 2; an arm 16 rotatably connected to the hands 14 and 15 at its front end and capable of horizontal movement; an arm support 17 rotatably connected to the base end of the arm 16; and a retaining part 18 that vertically holds the arm support 17. Additionally, robot 5 includes a hand drive mechanism 19 for rotating the hands 14 and 15 relative to the arm 16, and an arm drive mechanism 20 for driving the arm 16 (see reference). Figure 3 Additionally, robot 5 includes an arm lifting mechanism 21 that raises and lowers the arm support 17 relative to the holding part 18 (see reference). Figure 10 , Figure 11 ).

[0038] Arm 16 comprises a first arm portion 24 rotatably connected to arm support portion 17 at its base end, a second arm portion 25 rotatably connected to the front end of the first arm portion 24 at its base end, and a third arm portion 26 rotatably connected to the front end of the second arm portion 25 at its base end. That is, arm 16 has three arms that are rotatably connected relative to each other. The first arm portion 24, the second arm portion 25, and the third arm portion 26 are hollow. Arm support portion 17, first arm portion 24, second arm portion 25, and third arm portion 26 are arranged in this order from the bottom in the vertical direction.

[0039] Hands 14 and 15 are formed into a roughly Y-shape when viewed from above. Hands 14 and 15 are configured such that the base-end portions of hand 14 and hand 15 overlap vertically. Hand 14 is positioned on the upper side, and hand 15 on the lower side. The base-end portions of hands 14 and 15 are rotatably connected to the front end of the third arm 26. The upper surface of the front end portion of hands 14 and 15 serves as a loading surface for a wafer 2, and a wafer 2 is loaded onto the upper surface of the front end portion of hands 14 and 15. Hands 14 and 15 are positioned above the third arm 26.

[0040] In addition, Figure 2 The illustration of hand 15 is omitted. Furthermore, while hands 14 and 15 sometimes overlap vertically during the movement of robot 5 in this configuration, they do not overlap vertically in most cases. For example, as shown... Figure 2 As shown by the double-dotted line, when hand 14 enters processing device 3, hand 15 rotates towards arm support 17 and does not enter processing device 3. At this time, the rotation angle of hand 15 relative to hand 14 is, for example, 120° to 150°.

[0041] The holding part 18 is formed in a generally rectangular box shape. The upper and lower end faces of the holding part 18 are planes orthogonal to the vertical direction. Furthermore, the front and rear sides of the holding part 18 are planes orthogonal to the vertical direction, and the left and right sides of the holding part 18 are planes orthogonal to the horizontal direction. As described above, the robot 5 is fixed to the fixing frame 7 of the processing unit 4. In this embodiment, the front side of the holding part 18 is fixed to the fixing frame 7. That is, the front side of the holding part 18 is fixed to the processing unit 4.

[0042] The arm support portion 17 is formed in a generally rectangular box shape. The upper and lower end faces of the arm support portion 17 are planes orthogonal to the vertical direction. Furthermore, the front and rear sides of the arm support portion 17 are planes orthogonal to the vertical direction, and the left and right sides of the arm support portion 17 are planes orthogonal to the horizontal direction. The base end of the first arm portion 24 is rotatably connected to the upper end face of the arm support portion 17. The arm support portion 17 is disposed behind the retaining portion 18, and the arm support portion 17 and the retaining portion 18 are offset in the vertical direction. Additionally, the arm support portion 17 can be raised and lowered along the rear side of the retaining portion 18. The height (vertical length) of the arm support portion 17 is lower than the height (vertical length) of the retaining portion 18.

[0043] like Figure 3 As shown, the arm drive mechanism 20 includes: a first drive mechanism 27 that rotates the first arm portion 24 and the second arm portion 25 together to extend and retract the arm 16; and a second drive mechanism 28 that rotates the third arm portion 26 relative to the second arm portion 25. The first drive mechanism 27 includes a motor 30, a reducer 31 for reducing the power of the motor 30 and transmitting it to the first arm portion 24, and a reducer 32 for reducing the power of the motor 30 and transmitting it to the second arm portion 25. The second drive mechanism 28 includes a motor 33 and a reducer 34 for reducing the power of the motor 33 and transmitting it to the third arm portion 26. Furthermore, the first drive mechanism 27 rotates the first arm portion 24 and the second arm portion 25 so that the connection between the second arm portion 25 and the third arm portion 26 moves linearly along an imaginary line parallel to the left-right direction.

[0044] The electric motor 30 is disposed inside the arm support portion 17. The reducer 31 forms a joint connecting the arm support portion 17 and the first arm portion 24. The reducer 32 forms a joint connecting the first arm portion 24 and the second arm portion 25. The electric motor 30 and the reducer 31 are connected via pulleys and belts (not shown), and the electric motor 30 and the reducer 32 are connected via pulleys and belts (not shown). The electric motor 33 is disposed inside the second arm portion 25. The reducer 34 forms a joint connecting the second arm portion 25 and the third arm portion 26. The electric motor 33 and the reducer 34 are connected via a gear train (not shown).

[0045] The hand-operated mechanism 19 includes an electric motor 35, a reducer 36 for reducing the power of the electric motor 35 and transmitting it to the hand 14, an electric motor 37, and a reducer 38 for reducing the power of the electric motor 37 and transmitting it to the hand 15. The electric motors 35 and 37, and the reducers 36 and 38 are disposed inside the third arm portion 26. The base end of the hand 14 is connected to the reducer 36 via a pulley and belt (not shown), and the base end of the hand 15 is connected to the reducer 38 via a pulley and belt (not shown).

[0046] like Figure 10 , Figure 11 As shown, the boom lifting mechanism 21 includes: a ball screw 39 axially arranged in the vertical direction; a motor 40 for rotating the ball screw 39; a nut component 41 that engages with the ball screw 39; and a guide rail 42 and a guide block 43 for guiding the boom support 17 in the vertical direction. The boom lifting mechanism 21 is disposed inside the holding part 18.

[0047] The ball screw 39 is rotatably held in a frame 44 that forms part of the retaining part 18. A pulley 45 is fixed to the lower end of the ball screw 39. The motor 40 is fixed to the frame 44. A pulley 46 is fixed to the output shaft of the motor 40. A belt 47 is mounted on the pulleys 45 and 46. A guide rail 42 is fixed to the frame 44. The guide rail 42 is configured such that its length direction is aligned with its vertical direction. In this configuration, the guide rail 42 is fixed to two locations on the left and right ends of the frame 44.

[0048] Nut component 41 is fixed to fixed component 48 (see reference) Figure 11 The fixing member 48 is fixed to the front side of the arm support portion 17. The guide block 43 is also fixed to the fixing member 48. A rearwardly protruding protrusion 48a is formed on the fixing member 48, and the rear end face of the protrusion 48a is fixed to the front side of the arm support portion 17. The fixing member 48 is covered by a cover 49 that forms part of the retaining portion 18. A slit-shaped mounting hole 49a for mounting the protrusion 48a is formed on the cover 49.

[0049] The boom lifting mechanism 21 causes the boom support 17 to... Figure 3 The lower limit position of the arm support 17 shown is... Figure 4 The arm support 17 shown rises and falls between its upper limit position. When the arm support 17 descends to its lower limit position, as... Figure 3 As shown, the upper end face of the retaining part 18 is located above the lower surface of the first arm part 24. Specifically, the upper end face of the retaining part 18 is located above the lower surface of the base end portion of the first arm part 24, which is rotatably connected to the upper end face of the arm support part 17.

[0050] Furthermore, when the arm support portion 17 descends to the lower limit position, the upper end face of the retaining portion 18 is located below the lower surface of the third arm portion 26. In this embodiment, when the arm support portion 17 descends to the lower limit position, the upper end face of the retaining portion 18 is located slightly below the upper surface of the second arm portion 25. That is, when the arm support portion 17 descends to the lower limit position, the upper end face of the retaining portion 18 is located between the upper surface and the lower surface of the second arm portion 25 in the vertical direction.

[0051] like Figure 1As shown, the robot 13 includes: two hands 52 and 53 for loading wafers 2; an arm 54 rotatably connected to the hands 52 at its front end; an arm 55 rotatably connected to the hands 53 at its front end; an arm support 56 rotatably connected to the base end of the arms 54 and 55; and a main body 57 that holds the arm support 56 in a height-adjustable manner. Multiple wafers 2 can be loaded onto the hands 52 and 53.

[0052] In addition, the robot 13 includes: a hand drive mechanism (not shown) for rotating the hand 52 relative to the arm 54; a hand drive mechanism (not shown) for rotating the hand 53 relative to the arm 55; an arm drive mechanism (not shown) for driving the arm 54; an arm drive mechanism (not shown) for driving the arm 55; an arm support drive mechanism (not shown) for rotating the arm support 56 relative to the main body 57; and an arm lifting mechanism (not shown) for raising and lowering the arm support 56 relative to the main body 57.

[0053] As described above, robot 13 is configured such that, when viewed from above, the lifting device 12 is sandwiched between it and robot 5 in the left-right direction. Specifically, as Figure 1 As shown, robot 13 is configured to sandwich lifting device 12 between it and robot 5, which is located on the same layer of processing unit 4, in the left-right direction. Robot 13 performs the loading and unloading of wafer 2 relative to receiving units 10 and 11.

[0054] (Detailed structure of the hand)

[0055] The detailed structure of the hands mounted on robots 5 and 13 will be described below. The hands mounted on robots 5 and 13 may have the same structure or different structures. The detailed structure of hand 14 of robot 5 will be described below as an example. In this specification, "fixed connection" refers to the state in which two parts that are fixedly connected are firmly integrated through bonding, press-fitting, threaded fixing, bolt tightening, or other methods.

[0056] Hand 14 is configured to have two loading parts that can be loaded and unloaded (in other words, can be replaced): a loading part for loading wafer 2 and a clamping wafer loading part 14a prepared for holding wafer 2 in a clamping manner (see reference). Figure 8 ) and a suction wafer loading section 14c (see reference) prepared for holding wafer 2 in a suction holding manner. Figure 5 Hereinafter, the first type of hand 14, which is equipped with the wafer loading section 14c for suction, will be described first. In addition, the hand 14 equipped with the wafer loading section 14a for clamping will be described as the second type of hand 14.

[0057] like Figure 5As shown, the first type of hand 14 has a suction wafer loading section for loading the wafer 2 and a support section 14b supporting the suction wafer loading section 14c at its base end. The first type of hand 14 is formed to be approximately linearly symmetrical about a predetermined axis when viewed from above. The front end of the suction wafer loading section 14c is formed in a forked shape, and the shape of the suction wafer loading section 14c when viewed from above is approximately Y-shaped. The suction wafer loading section 14c is formed in a flat plate shape.

[0058] A suction pad 14c1 is provided on the upper surface of the front end side of the forked suction wafer loading section 14c. The suction pad 14c1 includes suction holes 14c3 for suctioning and holding the back side of the wafer 2 loaded on the suction wafer loading section 14c. That is, two suction pads 14c1 are provided on the suction wafer loading section 14c. Loading section side flow paths 14c2 are formed inside the suction wafer loading section 14c, which are respectively connected to the two suction holes 14c3. The two loading section side flow paths 14c2 extend from a position near the suction hole 14c3 to the base end 14cs on the support section 14b side (see reference). Figure 6 It is formed by ).

[0059] like Figure 6 As shown, the support portion 14b has a generally flat base 144a parallel to the front-rear and left-right directions. A recess 144b is formed approximately at the center of the upper surface of the base 144a in the front-rear direction. A through hole 144c is formed at the rear end of the upper surface of the base 144a. The through hole 144c and... Figure 4 The arm 16, arm support 17, and retaining part 18 shown are internally connected. At least two air pipes P are inserted through the through hole 144c. One of the two air pipes P passes through the interior of the arm 16, arm support 17, and retaining part 18, and is connected to an air intake source and an air supply source (not shown) via a solenoid valve. The other of the two air pipes P passes through the interior of the arm 16, arm support 17, and retaining part 18, and is connected to an air intake source (not shown).

[0060] The aforementioned solenoid valve is controlled by a control unit (processor) (not shown) of robot 5. Through this control, one of the two air pipes P can switch between the state of air intake and the state of air delivery. In robot 5 equipped with the first-mode hand 14, both air pipes P are connected to an air intake source. Furthermore, it is possible to switch between the action of intake air and the action of not intake air.

[0061] In the first method of hand 14, air is drawn from the suction port 14c3, which is opposite to the back side of the wafer 2 mounted on the suction wafer loading section 14c, by activating an air intake source connected to two air pipes P. This suction action causes the wafer 2 to be held adsorbed on the suction pad 14c1. By stopping the operation of the air intake source, the adsorption of the wafer 2 can be released.

[0062] On the lower surface of the front end of the base 144a, recesses 144s (notches) are formed at both ends in the left-right direction. The two recesses 144s respectively accommodate the base end portion 14cs formed by the forking of the suction wafer loading portion 14c. In this state, the base end portion 14cs and the bottom surface of the recesses 144s are fixed by bolts or the like.

[0063] Inside the front end of the base 144a, two air flow paths 144a2 extending in the front-rear direction are formed separately in the left-right direction. The two air flow paths 144a2 partially overlap with the recesses 144s. A hole 144a1 is formed on the bottom surface of each recess 144s of the base 144a, connecting to the air flow path 144a2 overlapping with that recess 144s. The two holes 144a1 communicate with the loading section side flow path 14c2 of the wafer loading section 14c for suction. That is, in the first embodiment of the hand 14, the air flow path 144a2, the hole 144a1, the loading section side flow path 14c2, and the suction hole 14c3 are connected, thereby forming an air suction flow path.

[0064] Two suction units 147, including connecting members 147a for connecting each of the two air flow paths 144a2 to the front end 148a of the air pipe P, are fixedly attached to the recess 144b of the base 144a. Although not shown in the figure, each of the two suction units 147 houses various sensors for detecting pressure in the air suction flow paths, controllers for controlling the flow rate of air through the air suction flow paths, and other electronic components. The air pipe P is configured to be detachable from the suction units 147.

[0065] On the upper surface of the base 144a, two holes 144ha are formed between two recesses 144s arranged separately in the left-right direction for fastening the frame 146K of the clamping unit 146 (described later) with bolts. On the bottom surface of the recess 144b of the base 144a, four holes 144hb are also formed between two suction units 147 arranged separately in the left-right direction for fastening the frame 146K of the clamping unit 146 with bolts. The holes 144hb and 144ha constitute a mounting portion for mounting the clamping unit 146 to the support portion 14b. That is, the support portion 14b is configured to allow the clamping unit 146 to be mounted on the mounting portion. The number of holes constituting the mounting portion is not limited to six, and can be any number.

[0066] like Figure 7 As shown, the clamping unit 146 includes a frame 146K, a cylinder 146a housed in the frame 146K, a cylindrical roller 146c, and a roller support member 146b that supports the rotation shaft of the roller 146c. The roller 146c extends in the vertical direction. The roller support member 146b supports the roller 146c at its front end, allowing it to rotate freely. The rear end of the roller support member 146b is supported by the piston rod 146a2 of the cylinder 146a.

[0067] Cylinder 146a has an air inlet and an air outlet. Connectors 146a1 are connected to the air inlet and air outlet respectively. The front end 148a of the air hose P can be connected to each of the two connectors 146a1. When the second-mode hand 14 is mounted on the robot 5, by controlling the solenoid valve, one end of the two air hoses P is connected to an air intake source, and the other end of the two air hoses P is connected to an air supply source, enabling air supply and discharge operations.

[0068] Although the diagram is omitted, the clamping unit 146 also houses a controller for controlling air pressure, an regulator, and a position detection mechanism for detecting the front-rear position of the roller support component 146b. Because the clamping unit 146 requires a mechanism for moving the roller 146c and the aforementioned position detection mechanism, it has more components and higher manufacturing costs compared to the suction unit 147.

[0069] exist Figure 8 In the second embodiment of the hand 14 shown, the clamping wafer loading section 14a for loading the wafer 2 is supported by the support section 14b at its base end. The front end of the clamping wafer loading section 14a is formed in a forked shape, and the shape of the clamping wafer loading section 14a when viewed from above is approximately Y-shaped. The clamping wafer mounting section 14a is formed in a flat plate shape. The structure of the base end of the clamping wafer loading section 14a is approximately the same as that of the suction wafer loading section 14c. That is, the base end of the clamping wafer loading section 14a is configured in a forked shape and is fixed to each recess 144s of the support section 14b by bolts.

[0070] An end-face abutment member 141 is fixed to the upper surface of the front end side of the forked clamping wafer loading portion 14a. This end-face abutment member 141 has a first abutment surface 141b1 that abuts against the end face (outer peripheral surface) of the wafer 2 and a second abutment surface 141a1 that abuts against the back side of the wafer 2. That is, two end-face abutment members 141 are fixed to the clamping wafer loading portion 14a. Wafer loading members 142 for loading the wafer 2 are fixed to two locations on the upper surface of the base end side of the clamping wafer loading portion 14a. The wafer 2 is loaded onto the end-face abutment member 141 and the wafer loading member 142. An opening 143 is provided between the two wafer loading members 142 arranged in a left-right direction on the base end side of the clamping wafer loading portion 14a.

[0071] In the second method of hand 14, by actuating the cylinder 146a within the clamping unit 146, the end face of the wafer 2 can be pressed using the roller 146c. Through the actuation of the cylinder 146a, the roller 146c... Figure 8 As shown by the dashed line, the pressing position where the roller 146c contacts the end face of the wafer 2 and presses the wafer 2 toward the first abutment surface 141b1 is as follows: Figure 8 The solid line indicates that roller 146c moves linearly between a retracted position and a retracted position, moving away from the end face of wafer 2. This action allows wafer 2 to be held in the pressing position and released from holding in the retracted position.

[0072] Hand 14, for example, sells the support portion 14b and the suction wafer loading portion 14c as a set. Then, as an optional item to this set, a set of clamping unit 146 and clamping wafer loading portion 14a is sold. Users who purchase the support portion 14b and the suction wafer loading portion 14c can use the hand 14 in the first manner simply by installing the suction wafer loading portion 14c onto the support portion 14b. Users who additionally purchase the aforementioned optional items can use the hand 14 in the first manner by installing the clamping unit 146 onto the support portion 14b and the clamping wafer loading portion 14a onto the support portion 14b where the clamping unit 146 is installed. Figure 8 The second type of hand 14 is shown. Furthermore, even after the clamping unit 146 is installed, as... Figure 9 As shown, by replacing the clamping wafer loading section 14a with the suction wafer loading section 14c, the hand 14 of the first method can also be used. Figure 9 In the example, with the clamping unit 146 installed on the support portion 14b, the suction wafer loading portion 14c is installed on the support portion 14b. However, it is also possible to temporarily remove the clamping unit 146 and then install the suction wafer loading portion 14c on the support portion 14b where the clamping unit 146 is not installed.

[0073] (General outline of the manufacturing system's operations)

[0074] In manufacturing system 1, a cassette (not shown) for holding multiple wafers 2 is arranged on the right side of robot 13. Robot 13 moves wafers 2 between this cassette and receiving sections 10 and 11. When robot 13 moves wafers 2 into or out of receiving section 10, receiving section 10 descends to its lower limit position. Robot 5, located on the second layer of processing unit 4, moves wafers 2 between processing device 3, located on the second layer of processing unit 4, and receiving section 10. At this time, receiving section 10 rises to its upper limit position. Robot 5, located on the first layer of processing unit 4, moves wafers 2 between processing device 3, located on the first layer of processing unit 4, and receiving section 11.

[0075] (The main effects of this method)

[0076] Based on the above-described hand 14, only the suction unit 147 of the suction unit 147 and the clamping unit 146 are provided on the support portion 14b, and a mounting portion for mounting the clamping unit 146 is also provided. Therefore, compared with the structure in which both the suction unit 147 and the clamping unit 146 are pre-fixed to the support portion 14b, the manufacturing cost of the hand 14 can be reduced.

[0077] Furthermore, by installing the clamping unit 146 behind the mounting section, it is possible to handle both situations where the wafer 2 needs to be held using a clamping method and situations where the wafer 2 needs to be held using a suction method. As a result, users can choose to use the appropriate device based on their needs by purchasing a single hand 14 and additional optional accessories.

[0078] (Other implementation methods)

[0079] The above-described method is an example of a preferred embodiment of the present invention, but it is not limited thereto. Various modifications can be made without changing the spirit of the present invention.

[0080] For example, the support portion 14b may be configured such that only the suction unit 147 and the clamping unit 146 are provided, and a mounting portion for mounting the suction unit 147 is also provided. With this structure, the manufacturing cost of the hand 14 can also be reduced.

[0081] In addition to the mounting portion for mounting the clamping unit 146, the support portion 14b may also be provided with other mounting portions for additionally mounting other functional units, such as units that perform mapping functions to detect when the wafer 2 enters the housing containing the wafer 2. In this way, the function of the hand 14 can be updated.

[0082] In the above configuration, the receiving portion 11 is fixed to the columnar member 60, and the receiving portion 10 disposed on the upper side of the receiving portion 11 can move up and down between the first and second layers of the processing unit 4. Alternatively, for example, the receiving portion 10 disposed on the upper side of the receiving portion 11 can be fixed to the columnar member 60, allowing the receiving portion 11 to move up and down between the first and second layers of the processing unit 4. In this case, the receiving portion 10 is fixed at a position where the robot 5 disposed on the second layer of the processing unit 4 can move the wafer 2 in and out relative to the receiving portion 10. Furthermore, in this case, the robot 13 is configured to sandwich the lifting device 12 between itself and the robot 5 disposed on the second layer of the processing unit 4 in the left-right direction. That is, in this case, the robot 13 is disposed at the same height as the second layer of the processing unit 4. Additionally, in this case, the receiving portion 10 is a second receiving portion.

[0083] In the above-described manner, the lifting device 12 includes a receiving portion 11, but the lifting device 12 may also lack a receiving portion 11. In this case, the lifting mechanism 61 moves the receiving portion 10 between a position where the robot 5, located on the second layer of the processing unit 4, can move the wafer 2 in and out relative to the receiving portion 10, and a position where the robot 5, located on the first layer of the processing unit 4, can move the wafer 2 in and out relative to the receiving portion 10. In this case, for example, the wafer 2 processed by the processing device 3 located on the first layer of the processing unit 4 can be received in the receiving portion 10 and directly transported to the second layer of the processing unit 4.

[0084] In the above configuration, the processing unit 4 consists of two layers, but it can also consist of a single layer. In this case, the lifting device 12 is not required. Alternatively, the processing unit 4 can also consist of three or more layers. For example, the processing unit 4 can also consist of three layers. In this case, for example, the lifting device 12, in addition to the receiving portions 10 and 11, includes a receiving portion that can move up and down between the first and third layers of the processing unit 4, and in addition to the lifting mechanism 61, it also includes a lifting mechanism that moves the receiving portion up and down between the first and third layers of the processing unit 4.

[0085] Furthermore, when the processing unit 4 is composed of three layers, the lifting mechanism 61 can be used to move the receiving unit 10 between the first and third layers of the processing unit 4. That is, the receiving unit 10 can be moved between a position where the robot 5 installed on the second layer of the processing unit 4 can move the wafer 2 into and out of the receiving unit 10, and a position where the robot 5 installed on the third layer of the processing unit 4 can move the wafer 2 into and out of the receiving unit 10. In addition, when the processing unit 4 is composed of three layers, the receiving unit 10 is fixed, the receiving unit 11 moves between the first and second layers of the processing unit 4, and the lifting device 12 can also be equipped with a receiving unit that moves between the second and third layers of the processing unit 4.

[0086] In the above configuration, when the arm support 17 descends to its lower limit position, the upper end face of the retaining part 18 is positioned vertically between the upper surface and the lower surface of the second arm 25. Alternatively, for example, when the arm support 17 descends to its lower limit position, the upper end face of the retaining part 18 may be positioned vertically between the upper surface of the first arm 24 and the lower surface of the base end portion of the first arm 24. Furthermore, in the above configuration, the front side of the retaining part 18 is fixed to the fixing frame 7 of the processing unit 4, but the bottom surface of the retaining part 18 may also be fixed to the ground of each layer of the processing unit 4. Additionally, in the above configuration, two hands 14 and 15 are installed on the front end side of the third arm 26, but only one hand may be installed on the front end side of the third arm 26.

[0087] In the above configuration, six processing devices 3 are provided on both the first and second layers of the processing unit 4. However, it is also possible to provide five or fewer, or seven or more processing devices 3 on both the first and second layers of the processing unit 4. Furthermore, in the above configuration, processing devices 3 are arranged on both the front and rear sides of the robot 5. However, it is also possible to arrange processing devices 3 only on one side of the robot 5. Additionally, in the above configuration, the manufacturing system 1 is a semiconductor manufacturing system for manufacturing semiconductors. However, the manufacturing system 1 can also be a system for manufacturing objects other than semiconductors. That is, the robot 5 can, for example, handle objects other than wafers 2, such as glass substrates.

[0088] The following items are described in this specification at least. Additionally, the components corresponding to the above embodiments are shown in parentheses, but the scope is not limited thereto.

[0089] (1) A hand (hand 14) of an industrial robot (robot 5) is configured to replace a first loading section (clipping wafer loading section 14a) and a second loading section (suction wafer loading section 14c), wherein the first loading section (clipping wafer loading section 14a) loads a transport object (wafer 2) and has an end face contact member (end face contact member 141) including a contact surface (first contact surface 141b1) for contacting the end face of the transport object, and the second loading section (suction wafer loading section 14c) loads the transport object (wafer 2) and has a suction hole (suction hole 14c3) for suctioning and holding the transport object, wherein...

[0090] The hand of the industrial robot (robot 5) is configured to support a support portion (support portion 14b) capable of supporting either the first loading portion or the second loading portion.

[0091] The support portion includes an air flow path (air flow path 144a2), which is connected to the suction hole when supporting the second loading portion;

[0092] Only one of the first unit (suction unit 147) and the second unit (clamping unit 147) is provided. The first unit includes a connecting member (connecting member 146a) that connects the front end of the air pipe (air pipe P) housed in the industrial robot to the air flow path. The second unit is capable of pressing the end face of the transport object loaded on the first loading part while supporting the first loading part.

[0093] The mounting section is used to mount the other of the first unit and the second unit.

[0094] According to (1), a first unit and a second unit are provided on the support, and a mounting part for mounting the other of the first unit and the second unit is provided. This reduces manufacturing costs compared to a structure where both the first unit and the second unit are present on the support. Furthermore, by subsequently mounting the other of the first unit and the second unit to the mounting part, it is possible to address both situations where the first loading unit is used to hold the transported object and situations where the second loading unit is used to hold the transported object. As a result, it is possible to use the second unit with a single hand, depending on the application. Additionally, when the mounting part is used to mount the second unit, any one of several second units with different mechanisms can be selectively mounted. This allows for flexible customization according to user requirements.

[0095] (2) Based on the hand of the industrial robot described in (1), among which

[0096] The second unit has a cylinder (cylinder 146a).

[0097] The air piping is configured to be connected to the connecting component of the first unit and the inlet and outlet ports of the cylinder.

[0098] According to (2), the transported object can be held in different ways simply by changing the connection of the shared air piping between the first unit and the second unit. For example, if we assume that the support has both the first unit and the second unit, then each unit would require dedicated piping. In contrast, according to (2), since no dedicated piping is required for each unit, the manufacturing cost of the industrial robot can be reduced.

[0099] (3) The hand of the industrial robot as described in (1) or (2).

[0100] The mounting section is used to mount the second unit.

[0101] According to (3), a second unit with a more complex structure and higher cost than the first unit is not provided on the support. Therefore, the manufacturing cost of the hand can be reduced.

[0102] (4) An industrial robot, comprising:

[0103] The hand of an industrial robot described in any of (1) to (3);

[0104] The air piping;

[0105] The arm (arm 16) that supports the hand;

[0106] Arm support portion (arm support portion 17) that supports the arm.

Claims

1. A hand for an industrial robot, configured to replace a first loading section and a second loading section, wherein the first loading section loads a transport object and has an end face contact member including an contact surface for the end face of the transport object to abut, and the second loading section loads the transport object and has a suction port for suctioning and holding the transport object, wherein... The hand of the industrial robot has a support portion, which is configured to support either the first loading portion or the second loading portion. The support portion has an airflow path, which is connected to the suction hole when supporting the second loading portion; The first unit includes a connecting component that connects the front end of an air pipe housed in the industrial robot to the air flow path. as well as The mounting part is used to mount a second unit, which, while supporting the first loading part, can press the end face of the transport object loaded on the first loading part.

2. The hand of the industrial robot according to claim 1, wherein, The second unit has a cylinder. The air piping is configured to be connected to the connecting component of the first unit and the inlet and outlet ports of the cylinder.

3. An industrial robot, comprising: The hand of the industrial robot as described in claim 1 or 2; The air piping; The arm that supports the hand; and An arm support portion that supports the arm.

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