Welding positioning tooling

Abstract

The present application relates to the field of substrate packaging technology, specifically providing a welding positioning tool, comprising a first positioning plate, a second positioning plate, a third positioning plate, and a pressing block; a positioning groove is provided on the first positioning plate; a first positioning hole is provided on the second positioning plate, the second positioning plate is located on the upper side of the first positioning plate, and the first positioning hole is aligned with the positioning groove. The first positioning hole is used to accommodate a positioning frame, and a first soldering tab is also provided between the bottom of the frame and the substrate; a second positioning hole is provided on the third positioning plate, and the third positioning plate is used to be assembled within the frame. The second positioning hole is used to accommodate a chip, and a second soldering tab is also provided between the chip and the substrate; the pressing block is used to simultaneously press the frame and the chip. The invention aims to solve the technical problem in the prior art that, due to the lack of a tool capable of simultaneously positioning the chip and the frame, the chip eutectic sintering cannot be performed simultaneously with the substrate frame welding, thereby affecting the reliability of the product.

Description

Technical Field

[0001] The present application relates to the technical field of substrate packaging, and more specifically, to a welding positioning tool. Background Art

[0002] In recent years, as the electronic information field has been developing in the direction of systematization, miniaturization, high integration and high reliability, LTCC / HTCC has played a huge role in promoting this development trend. On the one hand, LTCC / HTCC can greatly improve the internal systematization and integration of products through embedded circuits and some functional electronic components (resistors, capacitors, inductors, interconnects, etc.); on the other hand, LTCC / HTCC has better performance in extreme temperature resistance, dielectric constant and thermal expansion coefficient than traditional PCB substrates. Its proportion in the field of high value-added and high reliability products has increased year by year. From the perspective of industry development trends, the LTCC / HTCC industry has a large room for growth.

[0003] The micro-assembly process of packaging products based on LTCC / HTCC substrates involves chip eutectic welding, resistor, capacitor and inductor reflow soldering, gold wire bonding, frame welding, and capping. Among them, chip eutectic welding and frame welding are two important processes that determine product quality.

[0004] Chip eutectic bonding and enclosure bonding are two distinct processes in LTCC / HTCC component production. Chip eutectic bonding uses an alloy solder with a lower melting point than the base material. The LTCC / HTCC substrate, chip bonding surface, and alloy solder are heated to a temperature above the alloy's melting point but below the base material's melting point. The liquid alloy solder then wets the base material, filling interfacial gaps and allowing diffusion to form a bond. The size of the solder void affects the product's electrical performance and reliability. The enclosure bonding process shares the same principles as the chip eutectic bonding process, but the bonding target becomes the substrate and enclosure connection. Similarly, alloy solder is used to wet both substrate and enclosure, completing the interconnection. Sufficient solder wetting plays a crucial role in determining the product's airtightness.

[0005] In the existing process, since there is no tooling that can simultaneously position the chip and the frame, chip eutectic sintering (i.e., chip eutectic welding) cannot be carried out simultaneously with frame substrate welding. The chip eutectic sintering is before the frame substrate is welded, and the solder used is a gold-tin alloy system solder sheet widely used in the industry. The frame substrate is welded after the chip eutectic process. When the frame is welded, the product will be heated again to 30 to 50°C above the melting point of the gold-tin solder sheet. This means that the alloy solder formed in the chip eutectic process will melt again, and the solder alloy layer between the chip and the substrate that have completed eutectic sintering will be destroyed, thereby affecting the reliability of the product. Summary of the Invention

[0006] The purpose of this application is to provide a welding positioning tool, which aims to solve the technical problem in the prior art that due to the lack of a tool that can simultaneously position the chip and the frame, the chip eutectic sintering cannot be carried out simultaneously with the frame substrate welding, and the solder alloy layer between the eutectic sintered chip and the substrate will be destroyed during the frame welding, thereby affecting the reliability of the product.

[0007] To achieve the above objectives, the technical solution adopted in this application is to provide a welding positioning tool, comprising:

[0008] a first positioning plate, on which a positioning groove for accommodating and positioning the substrate is provided;

[0009] a second positioning plate, wherein a first positioning hole is provided on the second positioning plate, the second positioning plate is located on the upper side of the first positioning plate, and the first positioning hole is aligned with the positioning groove, the first positioning hole is used to accommodate the surrounding frame so as to position the surrounding frame on the substrate, and a first welding piece is further provided between the bottom of the surrounding frame and the substrate;

[0010] a third positioning plate, wherein a second positioning hole is defined on the third positioning plate, the third positioning plate being used to be assembled in the enclosure so that the second positioning hole is aligned with the chip soldering position on the substrate, the second positioning hole being used to accommodate the chip, and a second soldering pad being further provided between the chip and the chip soldering position on the substrate; and

[0011] A pressing block is used to press the frame and the chip simultaneously.

[0012] In one embodiment, the positioning groove, the first positioning hole, and the second positioning hole are all rectangular in shape, and arc-shaped gaps are provided at the end corners of the positioning groove, the first positioning hole, and the second positioning hole.

[0013] In one embodiment, there are multiple positioning grooves and they are arranged in multiple rows and columns on the first positioning plate, and there are multiple first positioning holes on the second positioning plate and they are arranged in a one-to-one correspondence with the positioning grooves.

[0014] In one embodiment, the third positioning plate includes a plate body and a protrusion connected to a plate edge of the plate body, and the protrusion is used to abut against an inner wall of the surrounding frame.

[0015] In one embodiment, the welding positioning tool also includes a fourth positioning plate, a third positioning hole is opened on the fourth positioning plate, the fourth positioning plate is arranged on the upper side of the second positioning plate and the third positioning hole is aligned with the first positioning hole, and the pressure block is arranged in the third positioning hole.

[0016] In one embodiment, the pressing block includes a block body and a pressing protrusion provided at a lower portion of the block body, the block body is used to press the surrounding frame, and the pressing protrusion is used to press the chip.

[0017] In one embodiment, the first positioning plate, the second positioning plate and the fourth positioning plate are arranged in sequence in the vertical direction, and the first positioning plate and the second positioning plate, and the second positioning plate and the fourth positioning plate are positioned in overlapping manner by means of plug-in positioning pins and slots.

[0018] In one embodiment, clamping grooves are provided at the edges of the first positioning plate, the second positioning plate, and the fourth positioning plate.

[0019] In one embodiment, the first positioning plate, the second positioning plate, the third positioning plate, the fourth positioning plate, and the pressing block are all made of graphite.

[0020] In one embodiment, the substrate is made of ceramic.

[0021] The beneficial effect of the welding positioning tool provided by the present application is that the tool can realize the simultaneous positioning of the frame and the substrate, and the chip and the substrate, so that the chip eutectic sintering and the frame welding can be carried out simultaneously, ensuring product quality. Specifically, the substrate is first positioned through the positioning groove on the first positioning plate, and then the frame is placed in the first positioning hole. Since the first positioning hole and the positioning groove are aligned with each other, the position of the frame on the substrate is positioned. The present device is also provided with a third positioning plate, which has a second positioning hole. The third positioning plate is positioned in the frame so that the second positioning hole is aligned with the chip welding position on the substrate. When the chip is placed in the second positioning hole, the welding position is automatically aligned, and the frame and the chip are also pressed separately by the pressing block. At this time, the tool is placed in the furnace of the atmosphere furnace to melt the first welding piece and the second welding piece to achieve welding connection. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0023] Figure 1 A schematic diagram of the exploded structure of the welding positioning tool provided in an embodiment of the present application;

[0024] Figure 2 for Figure 1 A schematic structural diagram of the first positioning plate;

[0025] Figure 3 for Figure 1 A schematic structural diagram of the second positioning plate;

[0026] Figure 4 for Figure 1 A schematic diagram of the structure of the third positioning plate;

[0027] Figure 5 for Figure 1 A schematic structural diagram of the fourth positioning plate;

[0028] Figure 6 for Figure 1 Schematic diagram of the structure of the medium pressure block.

[0029] In the figure, 1. first positioning plate; 2. positioning groove; 3. second positioning plate; 4. first positioning hole; 5. frame; 6. first soldering piece; 7. substrate; 8. third positioning plate; 9. second positioning hole; 10. chip; 11. second soldering piece; 12. pressing block; 13. block; 14. pressing protrusion; 15. clearance gap; 16. plate body; 17. protrusion; 18. fourth positioning plate; 19. third positioning hole; 20. positioning pin; 21. clamping groove. DETAILED DESCRIPTION

[0030] In order to make the technical problems, technical solutions and beneficial effects to be solved by this application more clearly understood, this application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0031] It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being “connected to” another element, it may be directly connected to the other element or indirectly connected to the other element.

[0032] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, "multiple" means two or more, unless otherwise clearly and specifically defined. "Several" means one or more, unless otherwise clearly and specifically defined.

[0033] In the description of this application, it is to be understood that the terms "center", "length", "width",

[0034]

[0035] The orientations or positional relationships indicated by “horizontal,” “top,” “bottom,” “inside,” and “outside” are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present application and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be understood as limitations on the present application.

[0036] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; they can refer to internal communication between two components or the interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0037] See also Figure 1-Figure 4 as well as Figure 5 The present application provides a specific embodiment of a welding positioning tool, including a first positioning plate 1, a second positioning plate 3, a third positioning plate 8, and a pressing block 12.

[0038] A positioning groove 2 for accommodating and positioning the substrate 7 is provided on the first positioning plate 1 .

[0039] A first positioning hole 4 is provided on the second positioning plate 3. The second positioning plate 3 is located on the upper side of the first positioning plate 1 and the first positioning hole 4 is aligned with the positioning groove 2. The first positioning hole 4 is used to accommodate the surrounding frame 5 so that the surrounding frame 5 is positioned on the substrate 7. A first welding piece 6 is also provided between the bottom of the surrounding frame 5 and the substrate 7.

[0040] A second positioning hole 9 is provided on the third positioning plate 8, and the third positioning plate 8 is used to be assembled in the frame 5 so that the second positioning hole 9 is aligned with the chip welding position on the substrate 7. The second positioning hole 9 is used to accommodate the chip 10, and a second welding piece 11 is also used to be set between the chip 10 and the chip 10 welding position of the substrate 7; the pressing block 12 is used to press the frame 5 and the chip 10 at the same time.

[0041] Specifically, the welding positioning fixture in this embodiment is used as follows: first, the first positioning plate 1 is laid flat, and then the substrate 7 is placed in the positioning groove 2. When the substrate 7 is placed in the positioning groove 2, the edge of the substrate 7 will abut the groove wall of the positioning groove 2, so that the substrate 7 cannot move, thereby achieving the positioning of the substrate 7. Then, the second positioning plate 3 is placed on the upper side of the first positioning plate 1. Specifically, it can be set to fit or maintain a certain gap. At this time, the first positioning hole 4 and the positioning groove 2 are aligned with each other. Then, the frame 5 is placed in the first positioning hole 4 to achieve the positioning of the frame 5.

[0042] Specifically, the shape of the positioning groove 2 is adapted to the shape of the substrate 7, and the shape of the first positioning hole 4 is adapted to the outer contour of the frame 5. In this way, when the frame 5 is placed in the first positioning hole 4, the bottom of the frame 5 is aligned with the edge of the substrate 7 where the frame 5 needs to be welded, thus achieving the positioning between the frame 5 and the substrate 7. Of course, in order to achieve welding, a first welding piece 6 is provided between the bottom of the frame 5 and the substrate 7. The shape of the first welding piece 6 is the same as that of the bottom of the frame 5.

[0043] The positioning between the chip 10 and the substrate 7 is achieved in this way: the third positioning plate 8 is used to be placed in the positioned frame 5. When the third positioning plate 8 is placed in the frame 5, the positioning of the third positioning plate 8 is also achieved. At this time, the second positioning hole 9 on the third positioning plate 8 is just aligned with the welding position on the substrate 7 where the chip 10 needs to be welded. Then the chip 10 is placed in the second positioning hole 9 to achieve the positioning between the chip 10 and the substrate 7, and a second welding piece 11 is set between the chip 10 and the substrate 7 to achieve welding of the chip 10 and the substrate 7.

[0044] After the frame 5 and substrate 7, and the chip 10 and substrate 7 are aligned, the tooling is placed in an atmosphere furnace. The furnace is set to a temperature that melts the first solder tab 6 and the second solder tab 11 to achieve a solder connection. Chip eutectic sintering, also known as chip eutectic welding, is similar to frame welding. Like the frame welding, the tooling is placed in an atmosphere furnace and heated to melt the first solder tab 6 and the second solder tab 11 to connect the chip to the substrate, and the frame to the substrate. The first solder tab 6 has the same cross-sectional shape as the frame 5 and is located at the bottom of the frame 5.

[0045] In order to enhance the welding effect, a pressing block 12 is further provided in this embodiment. The pressing block 12 presses the frame 5 and the chip 10 simultaneously, so that a certain pressure is applied to the welding surface during welding to avoid the generation of welding voids.

[0046] Therefore, the welding positioning tool provided in this embodiment can realize simultaneous positioning of the frame 5 and the substrate 7, and the chip 10 and the substrate 7, so that the chip eutectic sintering and the frame welding can be carried out simultaneously, ensuring product quality.

[0047] like Figure 1-Figure 4 In this embodiment, the general substrate 7 is rectangular, the chip 10 and the frame 5 are also rectangular, so the positioning groove 2, the first positioning hole 4, and the second positioning hole 9 are all rectangular in shape. The positioning groove 2, the first positioning hole 4, and the second positioning hole 9 are also provided with arc-shaped clearance notches 15 at the end corners.

[0048] When the substrate 7 is placed in the positioning groove 2 , the surrounding frame 5 is placed in the first positioning hole 4 , and the chip 10 is placed in the second positioning hole 9 , they cannot move, thus achieving positioning.

[0049] In order to facilitate taking and placing, a clearance notch 15 is provided at the end corners of the positioning groove 2, the first positioning hole 4 and the second positioning hole 9. At the same time, the clearance notch 15 can also serve as an exhaust channel during welding, because a certain amount of exhaust gas will be generated when the welding piece melts.

[0050] like Figure 2 and Figure 3 As a further embodiment, there are multiple positioning grooves 2 and they are arranged in multiple rows and columns on the first positioning plate 1, and there are multiple first positioning holes 4 on the second positioning plate 3 and they are arranged one-to-one corresponding to the positioning grooves 2.

[0051] In order to realize the welding of multiple groups of substrates 7, multiple positioning grooves 2 are set to accommodate multiple substrates 7, and multiple first positioning holes 4 are set to align with the positioning grooves 2 one by one. A frame 5 is set in each first positioning hole 4, and a third positioning plate 8 and a corresponding chip 10 are set in each frame 5, which greatly improves the welding efficiency.

[0052] like Figure 4 In this embodiment, the third positioning plate 8 includes a plate body 16 and a protrusion 17 connected to the plate edge of the plate body 16 , and the protrusion 17 is used to abut the inner wall of the surrounding frame 5 .

[0053] In this embodiment, the third positioning plate 8 includes a plate body 16 and a protrusion 17. The plate body 16 defines a second positioning hole 9 for accommodating the chip 10. The third positioning plate 8 is disposed within the frame 5 such that the protrusion 17 on the edge of the plate abuts against the inner wall of the frame 5, thereby achieving positioning of the third positioning plate 8 and saving material. Specifically, when the third positioning plate 8 is rectangular, the protrusion 17 is disposed in the middle of each of the four edges of the third positioning plate 8.

[0054] like Figure 5 and Figure 1 It can be understood that the function of the pressing block 12 is to press the frame 5 and the chip 10 at the same time. In order to enable the pressing block 12 to accurately press the frame 5 and the chip 10, this embodiment further provides a fourth positioning plate 18 for positioning the pressing block 12. The fourth positioning plate 18 is provided with a third positioning hole 19. The fourth positioning plate 18 is arranged on the upper side of the second positioning plate 3 and the third positioning hole 19 is aligned with the first positioning hole 4. The pressing block 12 is arranged in the third positioning hole 19.

[0055] Specifically, the fourth positioning plate 18 is located above the second positioning plate 3 and can be aligned with or spaced apart from the second positioning plate 3. At this point, the third positioning hole 19 is aligned with the first positioning hole 4 and the positioning groove 2. The pressing block 12 is positioned within the third positioning hole 19 to achieve positioning, and can be aligned with the frame 5 and the chip 10, thereby pressing both simultaneously. The third positioning hole 19 can also be rectangular, and arc-shaped clearance notches 15 can also be provided at the end corners, cooperating with the clearance notches 15 of the positioning groove 2 and the first positioning hole 4 to penetrate vertically and serve as exhaust gas discharge.

[0056] like Figure 1 and Figure 6 Furthermore, since the frame 5 and the chip 10 are not at the same height, in order to achieve simultaneous pressing of the two by the pressing block 12, the pressing block 12 includes a block body 13 and a pressing protrusion 14 arranged at the lower part of the block body 13. The block body 13 is used to press the frame 5, and the pressing protrusion 14 is used to press the chip 10.

[0057] Specifically, the outer contour shape of the block 13 can be set to match the outer contour shape of the frame 5. When the block 13 is set in the third positioning hole 19, it is aligned with the frame 5 to press the frame 5, and the shapes of the third positioning hole 19 and the first positioning hole 4 can be set to shapes that are respectively compatible with the outer contour of the pressing block 12 and the outer contour of the frame 5, so that the frame 5 is just assembled in the first positioning hole 4, the pressing block 12 is just assembled in the third positioning hole 19, and the outer contour of the pressing block 12 is just aligned with the outer contour of the frame 5, thereby achieving alignment and pressing.

[0058] Since the chip 10 is arranged in the frame 5 and is relatively low, a pressing protrusion 14 is provided on the lower surface of the block 13 . When the block 13 is placed on the frame 5 , the pressing protrusion 14 just extends into the frame 5 , thereby pressing the chip 10 .

[0059] Therefore, this embodiment enables the pressing block 12 to align and press the frame 5 and the chip 10 simultaneously.

[0060] It should be noted that the pressing force on the frame 5 and the chip 10 should not be too large or too small, and the weight of the pressing block 12 can be adjusted to achieve appropriate pressing. Specifically, structures can be added to the upper surface of the block 13 to increase the weight or removed to reduce the weight.

[0061] like Figure 1 In this embodiment, the first positioning plate 1, the second positioning plate 3 and the fourth positioning plate 18 are arranged in sequence in the vertical direction, the second positioning plate 3 is located between the first positioning plate 1 and the fourth positioning plate 18, and the first positioning plate 1 and the second positioning plate 3, and the second positioning plate 3 and the fourth positioning plate 18 are both superimposed and positioned by plug-in positioning pins 20 and slots.

[0062] Specifically, in order to ensure that the first positioning hole 4 is aligned with the positioning groove 2 and the third positioning hole 19 is aligned with the first positioning hole 4 when the three are stacked, mutually plugged positioning pins 20 and slots are provided between the positioning plates to achieve positioning when the three are stacked.

[0063] Specifically, it can be set up as follows: a positioning pin 20 is set on the upper surface of the first positioning plate 1, and a slot is set on the lower surface of the second positioning plate 3. The positioning pin 20 is inserted into the slot to achieve the positioning superposition between the first positioning plate 1 and the second positioning plate 3. A positioning pin 20 is set on the upper surface of the second positioning plate 3, and a slot is set on the lower surface of the fourth positioning plate 18. After the same insertion, the positioning superposition of the second positioning plate 3 and the fourth positioning plate 18 is achieved.

[0064] In this embodiment, the first positioning plate 1, the second positioning plate 3, the fourth positioning plate 18 and the third positioning plate 8 form a set of tooling modules. Specifically, multiple tooling modules can be set, and the multiple tooling modules can be stacked in the upper and lower directions.

[0065] Specifically, it can be set up like this: a positioning pin 20 can be set on the upper surface of the fourth positioning plate 18, and a slot can be set on the lower surface of the first positioning plate 1. The first positioning plate 1 of the upper module can be superimposed on the upper surface of the fourth positioning plate 18 of the lower module, specifically by plugging the positioning pin 20 and the slot to achieve positioning superposition.

[0066] Therefore, the tooling provided in this embodiment can be stacked and used in multiple pieces at the same time, forming a modular design. After multiple tooling pieces are stacked, they are simultaneously placed in an atmosphere furnace for temperature-raising welding, thereby improving welding efficiency.

[0067] In order to realize automatic operation, a clamping groove 21 is provided at the plate edges of the first positioning plate 1, the second positioning plate 3, and the fourth positioning plate 18. The clamping groove 21 can be provided at two opposite plate edges of the plate body.

[0068] The clamping groove 21 is used in conjunction with the clamping end of an automatic device, such as a robot. The robot can be placed in the clamping groove 21 on both sides to achieve clamping, so as to drive the plate to move and realize automatic assembly positioning.

[0069] In this embodiment, the first positioning plate 1, the second positioning plate 3, the third positioning plate 8, the fourth positioning plate 18, and the pressing block 12 are all made of graphite. Graphite has good high-temperature resistance and provides excellent performance. The substrate 7 can be made of ceramic. Compared to ordinary PCB substrates, ceramic substrates are more resistant to extreme temperatures and have a better dielectric constant and thermal expansion coefficient, making them suitable for the high-temperature environment of an atmosphere furnace.

[0070] It should be noted that chip eutectic welding and frame welding are a process in the micro-assembly project of LTCC / HTCC substrate packaging products. The entire process includes substrate 7 cleaning, chip eutectic / frame welding, resistor, capacitor and inductor reflow soldering, welding defect inspection, gold wire bonding, appearance inspection, and capping.

[0071] Specifically, the substrate 7 is cleaned by plasma cleaning the LTCC / HTCC substrate 7 to be assembled.

[0072] Chip eutectic / frame welding: Use this tool to position the substrate 7, chip 10 and frame 5 and select a vacuum atmosphere furnace or a box atmosphere furnace (without vacuum function). Set the temperature according to the process requirements and place the tool into the furnace for eutectic welding.

[0073] Reflow soldering of resistors, capacitors and inductors: Use Sn63Pb37 solder paste, use dispensing equipment to apply solder paste on the designated position of the substrate pad, use semi-automatic equipment to place the resistors, capacitors and inductors on the pad position, and place them in the reflow soldering machine for soldering.

[0074] Welding defect inspection: The welded product is placed in an X-Ray device to inspect welding defects and voids.

[0075] Wire bonding: For products that have completed the above steps, wire bonding (using gold wire) is performed according to the connection positions in the design drawing, and the bonding machine parameters are set according to normal process parameters.

[0076] Appearance inspection: Place the product under optical inspection equipment to observe the appearance of the product.

[0077] The welding positions of the substrate 7 and the chip 10 and the welding positions of the substrate 7 and the frame 5 performed by this tool are in good condition. When a vacuum atmosphere furnace is used, the void rate is ≤10%, and when a box-type atmosphere furnace is used, the void rate is ≤20%. The welding quality meets the product design requirements.

[0078] Therefore, when this tool is used for welding positioning, two different sintering furnaces are used, and the substrate 7, chip 10, and frame 5 can all be welded in one step with the quality meeting the standards. Therefore, this tool is universal in applicability. When a vacuum atmosphere furnace is used, the welding quality and air tightness of the product meet the product design requirements. When a box-type atmosphere furnace is used, although the welding voids of the product are relatively large, they still meet the welding quality requirements, and the air tightness also meets the requirements.

[0079] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present application should be included in the scope of protection of the present application.

Claims

1. Welding positioning tool, characterized in that: include: a first positioning plate, on which a positioning groove for accommodating and positioning the substrate is provided; a second positioning plate, wherein a first positioning hole is provided on the second positioning plate, the second positioning plate is located on the upper side of the first positioning plate, and the first positioning hole is aligned with the positioning groove, the first positioning hole is used to accommodate the surrounding frame so as to position the surrounding frame on the substrate, and a first welding piece is further provided between the bottom of the surrounding frame and the substrate; a third positioning plate, wherein a second positioning hole is defined on the third positioning plate, the third positioning plate being used to be assembled in the enclosure so that the second positioning hole is aligned with the chip soldering position on the substrate, the second positioning hole being used to accommodate the chip, and a second soldering pad being further provided between the chip and the chip soldering position on the substrate; and A pressure block is used to press the frame and the chip at the same time. The welding positioning tool also includes a fourth positioning plate. A third positioning hole is provided on the fourth positioning plate. The fourth positioning plate is arranged on the upper side of the second positioning plate and the third positioning hole is aligned with the first positioning hole. The pressure block is arranged in the third positioning hole.

2. The welding positioning tool according to claim 1, characterized in that: The positioning groove, the first positioning hole, and the second positioning hole are all rectangular in shape, and arc-shaped gaps are provided at the end corners of the positioning groove, the first positioning hole, and the second positioning hole.

3. The welding positioning tool according to claim 1, characterized in that: There are multiple positioning grooves and they are arranged in multiple rows and columns on the first positioning plate. There are multiple first positioning holes on the second positioning plate and they are arranged in one-to-one correspondence with the positioning grooves.

4. The welding positioning tool according to claim 1, characterized in that: The third positioning plate includes a plate body and a protruding portion connected to a plate edge of the plate body, and the protruding portion is used to abut against the inner wall of the surrounding frame.

5. The welding positioning tool according to claim 1, characterized in that: The pressing block includes a block body and a pressing protrusion arranged at the lower part of the block body. The block body is used to press the surrounding frame, and the pressing protrusion is used to press the chip.

6. The welding positioning tool according to claim 1, characterized in that: The first positioning plate, the second positioning plate and the fourth positioning plate are arranged in sequence in the vertical direction, and the first positioning plate and the second positioning plate, as well as the second positioning plate and the fourth positioning plate are stacked and positioned by plug-in positioning pins and slots.

7. The welding positioning tool according to claim 1, characterized in that: Clamping grooves are provided at the edges of the first positioning plate, the second positioning plate and the fourth positioning plate.

8. The welding positioning tool according to claim 1, characterized in that: The first positioning plate, the second positioning plate, the third positioning plate, the fourth positioning plate, and the pressing block are all made of graphite.

9. The welding positioning tool according to claim 1, characterized in that: The substrate is made of ceramic.

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