Wafer pre-calibration method and apparatus
By using displacement sensors and polynomial fitting technology, wafer offset can be quickly determined for coordinate axis calibration, solving the problem of low efficiency in existing technologies and achieving efficient and stable wafer pre-calibration.
CN116259567BActive Publication Date: 2026-06-09BEIJING JINGYI AUTOMATION EQUIP CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- BEIJING JINGYI AUTOMATION EQUIP CO LTD
- Filing Date
- 2022-12-16
- Publication Date
- 2026-06-09
AI Technical Summary
Technical Problem
Existing wafer pre-calibration methods require rotating the wafer one or more times to collect data, resulting in low efficiency and reduced positioning efficiency.
Method used
Distance information between the wafer edge and the measurement range boundary is obtained by using a displacement sensor. Extremum points are determined by polynomial fitting, and the offset is calculated for coordinate axis calibration, avoiding data collection by rotating the wafer one full turn.
Benefits of technology
It improves wafer calibration efficiency, ensures measurement accuracy and calibration process stability, reduces the number of rotations, and enhances positioning accuracy.
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Smart Images
Figure CN116259567B_ABST
Abstract
The application provides a wafer pre-calibration method and device, and belongs to the field of wafer manufacturing.The method comprises the following steps: obtaining distance information between the wafer edge and the boundary line of the sensor measurement range through a displacement sensor; determining the extreme point of the curve constituted by the edge along the direction of the second coordinate axis according to the distance information, and determining the offset of the wafer on the second coordinate axis according to the value of the second coordinate axis corresponding to the extreme point; after the calibration of the second coordinate axis of the wafer based on the offset, determining the offset of the first coordinate axis according to the maximum width of the wafer within the boundary line measured by the sensor and the maximum width of the wafer within the boundary line in the direction of the first coordinate axis determined based on the center of the turntable, and calibrating based on the offset of the first coordinate axis.The method is realized based on the distance between the wafer edge and the sensor boundary, a sufficient amount of effective information can be collected through one displacement collection, the efficiency of the wafer calibration process is improved, and one rotation or more than one rotation is not required, thereby further improving the calibration efficiency.
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