Ceramic waveguide diplexer

Abstract

The present invention provides a ceramic waveguide diplexer including a plurality of resonance cavities defined by sections divided by a plurality of through partitions formed by penetrating one face and the other face of a single ceramic block in a predetermined pattern; a common interface formed as a hole structure penetrating the ceramic block in a section of a common resonance cavity in which signal input and output with a common antenna is performed among the plurality of resonance cavities, and as a stepped hole structure in which the hole diameter of the other face side of the ceramic block is smaller than the hole diameter of the one face side; and a metal layer formed on an outer face of the ceramic block and in which an annular groove is formed by removing a stepped area parallel to the one face of the ceramic block in the common interface of the stepped hole structure, thereby enabling input and output of signals of a wide band required for the diplexer, and reducing the risk of breakage.

Description

TECHNICAL FIELD

[0001] The present invention relates to a ceramic waveguide duplexer, and more particularly, to a ceramic waveguide duplexer having input / output ports with a common hole resonator structure. BACKGROUND

[0002] As the data transmission speed is increased with the development of communication services, the system band also needs to be increased, and it is necessary to improve the reception sensitivity and minimize the interference caused by the carrier of other communication systems. For this reason, there is a situation where the demand for a low insertion loss, high rejection, filter is continuously increasing. A coaxial resonator made of a metal material has advantages in terms of loss, size, and price compared to other resonators such as a dielectric resonator, and thus is mainly used for the implementation of a filter for a mobile communication system.

[0003] However, due to the low output and miniaturization of a base station system such as a massive MIMO antenna, there is a constraint in terms of size even if the existing coaxial resonator is used, and the necessity of implementing an ultra-small filter has arisen. For this reason, a ceramic waveguide filter is being actively researched as a filter to replace the filter using the existing coaxial resonator. The ceramic waveguide filter is a filter in which a cavity is filled with a ceramic material having a low loss and a high dielectric constant, and can significantly reduce the size compared to the existing coaxial resonator filter and also provide excellent loss characteristics. The existing general ceramic waveguide filter needs a process of combining the respective cavities after the respective ceramic cavities are independently manufactured and a partition wall is formed. The combination of the cavities is implemented by welding or the like.

[0004] However, the cavity combination process frequently occurs misalignment tolerance in the combination process, and thus a characteristic change occurs, and there is a problem that the product yield is significantly reduced. Also, in the case where a characteristic change occurs due to a machining error, a process of adjusting one side of the ground ceramic by polishing is required, but ceramic is a very hard material, and thus there is a problem that high technology is required and fine adjustment is difficult. Furthermore, if a transmission zero point for improving the attenuation characteristics of the ceramic waveguide filter is to be provided, cross coupling is mainly used, but there is a problem that additional additional work is required to implement cross coupling between cavities that are not adjacent to each other.

[0005] To solve such a problem, an integrated ceramic waveguide filter is proposed, which includes a plurality of resonant cavities defined by a plurality of through-partition walls passing through one side and the other side of a division of a single ceramic block in a predetermined pattern to distinguish the division of the ceramic block.

[0006] Figure 1 An example of a conventional integrated ceramic waveguide filter is shown. Figure 2 Show about Figure 1 Cross-sectional view of the input and output ports of a ceramic waveguide filter.

[0007] Figure 1 This is a perspective view of the lower part of the integrated ceramic waveguide filter. Figure 1 As described above, the integrated ceramic waveguide filter is implemented in an integrated manner and includes multiple resonant cavities 111-116 defined by multiple through-walls 121 and 122 formed between one surface and the other surface of a single ceramic block 100. The multiple through-walls 121 and 122 function as cavity walls that separate the multiple resonant cavities 111-116. The spaces between the multiple through-walls 121 and 122, which are spaced apart from each other, form the junction surfaces between the multiple resonant cavities 111-116, functioning as coupling windows. Furthermore, within each of the multiple resonant cavities 111-116, a resonant slot 111-116 may be formed on one surface of the ceramic block 100 that lowers the resonant frequency.

[0008] In addition, if Figure 2 As shown, two of the multiple resonant cavities 111 to 116 of the ceramic waveguide filter are formed with interface slots 141 and 142, serving as input and output ports for signals to and from the ceramic waveguide filter. Interface slots 141 and 142 can be formed on the other side of the ceramic block 100 at the locations of their corresponding resonant slots 131 and 136. In this manner, when interface slots 141 and 142 face their corresponding resonant slots 131 and 136 in the ceramic block 100, signals can be transferred between the interface slots 141 and 142 and the corresponding resonant slots 131 and 136 via capacitive coupling.

[0009] Furthermore, in the integrated ceramic waveguide filter, the metal layer 160 is formed on the entire outer surface of the single ceramic block 100. The metal layer 160 is formed inside the plurality of through walls 121, 122, the plurality of resonant slots 111 to 116, and the interface slots 141, 142. Figure 2As shown, the periphery of the interface grooves 141, 142 is formed with an annular groove 151 that is a region where the metal layer 160 is removed, to isolate the metal layer 161 formed inside the interface grooves 141, 142 from the metal layer 160 outside. That is, the annular groove 151 separates the metal layer 161 formed inside the interface grooves 141, 142 from the metal layer 160 outside so as to be isolated from each other. This is to apply an input / output signal to the metal layer 161 formed inside the interface grooves 141, 142 and to apply a ground voltage to the metal layer 160 formed outside.

[0010] Such a ceramic waveguide filter is developed and used as a band pass filter (BPF) for a single frequency band for a TDD (Time Division Duplex) large MIMO device. However, recently, there is a rising demand for FDD (Frequency Division Duplex) or dual frequency TDD application. Accordingly, there is a rising demand for an integrated ceramic waveguide duplexer that can replace a filter for TDD to be applied to FDD or dual frequency TDD.

[0011] PRIOR ART DOCUMENTS

[0012] PATENT DOCUMENTS

[0013] Korean Registered Patent No. 10-2241217 (Registration Date: 2021.04.12) SUMMARY

[0014] TECHNICAL PROBLEM

[0015] An object of the present application is to provide an integrated ceramic waveguide duplexer that can be manufactured in a small size using a common resonator having a hole having a stepped structure capable of inputting and outputting a wideband signal required for a duplexer.

[0016] TECHNICAL SOLUTION

[0017] A ceramic waveguide duplexer according to one embodiment of the present application for achieving the above object includes: a plurality of resonant cavities defined by regions divided by a plurality of through partitions formed by penetrating one face and the other face of a single ceramic block in a predetermined pattern; a common interface formed as a hole structure penetrating the ceramic block in a region of a common resonant cavity in which a signal is input and output with a common antenna, and formed as a stepped hole structure in which a hole diameter of the other face side of the ceramic block is smaller than that of the one face side; and a metal layer formed on an outer face of the ceramic block and formed with an inner annular groove in an annular shape in a stepped region of the common interface of the stepped hole structure parallel to the one face of the ceramic block.

[0018] The common interface can be formed in a hole shape of a multi-step structure in which the diameter is periodically and repeatedly reduced from the one side of the ceramic block.

[0019] The width of the internal annular groove can be adjusted according to the frequency band of signals inputted and outputted to the common antenna.

[0020] The metal layer can be formed with an annular groove in an annular shape in which an internal circle having a predetermined interval from the hole periphery of the common interface is removed in the other side of the ceramic block.

[0021] The plurality of resonance cavities are formed in a structure symmetrical to each other in the both sides of the ceramic block through the plurality of through partition walls, and the common resonance cavity can be located on the central axis of the ceramic block symmetrical to each other in the both sides.

[0022] A predetermined transmission resonance cavity among the plurality of resonance cavities band-pass filters a false transmission signal to an adjacent resonance cavity in a capacitive coupling manner to be transmitted to the common resonance cavity, and the common resonance cavity band-pass filters a reception signal applied thereto to an adjacent resonance cavity in a capacitive coupling manner to be transmitted to a predetermined reception resonance cavity.

[0023] The ceramic waveguide duplexer can further include a transmission interface and a reception interface which pass through the ceramic block in the respective regions of the transmission resonance cavity and the reception resonance cavity, have a stepped hole structure in which the diameter of the other side of the ceramic block is smaller than the diameter of the one side, and in which an internal annular groove is formed in a ring shape in which the metal layer is removed in the stepped area parallel to the one side of the ceramic block.

[0024] The ceramic waveguide duplexer can further include a transmission interface and a reception interface which are formed in a groove shape in the respective positions of the transmission resonance cavity and the reception resonance cavity in the other side of the ceramic block, and in which the metal layer is formed to be spaced apart from the annular groove formed in a ring shape in which the metal layer is removed in the other side of the ceramic block.

[0025] The ceramic waveguide duplexer can further include at least one resonance groove which is formed in a groove shape in the position of at least one resonance cavity among the plurality of resonance cavities in the one side of the ceramic block, and in which the metal layer is formed to the inner wall.

[0026] The ceramic waveguide duplexer can further include at least one coupling hole which is formed by passing through the ceramic block between at least two resonance cavities adjacent to each other among the plurality of resonance cavities, and is formed in a stepped hole structure in which the hole diameter of the other side of the ceramic block is smaller than the hole diameter of the one side, and in which the metal layer is formed in the inner side.

[0027] Technical Effects

[0028] Accordingly, the ceramic waveguide duplexer according to the present application can be manufactured in a small size, while the ceramic block is less likely to be damaged and can stably operate in a wide band, by using the common resonant cavity having the interface of the hole shape formed in a stepped structure capable of inputting and outputting a signal required for the wide band of the duplexer. BRIEF DESCRIPTION OF DRAWINGS

[0029] Figure 1 is a schematic diagram showing an example of a conventional integrated ceramic waveguide filter;

[0030] Figure 2 shows a cross-sectional view of an input / output port of a ceramic waveguide filter according to Figure 1

[0031] Figure 3 is a top perspective view showing an integrated ceramic waveguide duplexer according to one embodiment of the present application;

[0032] Figure 4 is a top view showing the integrated ceramic waveguide duplexer of Figure 3

[0033] Figure 5 is a side cross-sectional view showing the integrated ceramic waveguide duplexer of Figure 3

[0034] is a side cross-sectional view showing an interface hole of a common hole resonator structure according to Figure 6 Figure 3 is a schematic diagram for explaining a frequency band of a signal inputted and outputted from the interface hole of

[0035] Figure 7 Figure 6

[0036] Figure 8 is a top perspective view showing an integrated ceramic waveguide duplexer according to another embodiment of the present application;

[0037] Figure 9 is a top view showing the integrated ceramic waveguide duplexer of Figure 8

[0038] Figure 10 is a side cross-sectional view showing the integrated ceramic waveguide duplexer of Figure 8

[0039] is a schematic diagram showing an example of an interface substrate inputting and outputting a signal to the integrated ceramic waveguide duplexer of Figure 11 Figure 8 is a top view showing the interface substrate of

[0040] Figure 12 Figure 11

[0041] ​​​​​​​​​Figure 13 shows Figure 11 a side sectional view of an interface substrate;

[0042] Figure 14 is a schematic view showing a structure of a monolithic ceramic waveguide duplexer and Figure 8 an interface substrate combined. Figure 11

[0043] BRIEF DESCRIPTION OF DRAWINGS

[0044] 200, 300: ceramic block 211-215, 311-319: resonant cavity

[0045] 221, 222, 321-313: through partition 231, 232, 331-338: resonant groove

[0046] 341: transmission interface 342: reception interface

[0047] 251, 351, 352: ring groove 260, 360: metal layer

[0048] 270, 370: common interface 381, 382: coupling hole

[0049] 400: interface substrate 431, 441, 451: transmission line

[0050] 432, 442, 452: signal plate 433, 443, 453: plate ring groove

[0051] 434, 444, 454: through-hole electrode DETAILED DESCRIPTION

[0052] For a full understanding of the application, the conceptions of the application, the advantages thereof, and the objects accomplished by the application, reference should be made to the following detailed description of the preferred embodiments of the application and to the accompanying drawings.

[0053] Hereinafter, the preferred embodiments of the application will be described in detail with reference to the accompanying drawings, so as to explain the application in detail. However, the application can be realized in various different forms, and is not limited to the embodiments described below. Also, in order to clearly explain the application, parts irrelevant to the explanation are omitted, and the same parts are designated by the same reference numerals in the drawings.

[0054] Throughout the specification, if a certain part "comprises" a certain constituent element, it means that another constituent element can be further included unless otherwise specifically described. Also, the terms "…portion", "…device", "…module", "…block", etc. described in the specification mean a unit processing at least one function or action, which can be realized by hardware or software or a combination of hardware and software.

[0055] ​Figure 3 Fig. 1 is a top view showing a ceramic waveguide duplexer according to an embodiment of the present application, Figure 4 Fig. 2 is a side sectional view showing the ceramic waveguide duplexer of Figure 3 Fig. 3 is a top view showing the ceramic waveguide duplexer of Figure 5 Fig. 4 is a side sectional view showing the ceramic waveguide duplexer of Figure 3 Fig. 5 is a side sectional view showing an interface hole with respect to a shared hole resonator structure of Figure 6 Fig. 6 is a diagram for explaining a frequency band of signals input and output from the interface hole of Figure 3 Fig. 7 is a diagram for explaining a frequency band of signals input and output from the interface hole of Figure 7 Figure 6 Referring to , the ceramic waveguide duplexer of the present embodiment is also implemented as an integrated type, including a plurality of resonant cavities 211 to 215 defined by a plurality of through partitions 221, 222 formed through one face and the other face of a single ceramic block 200 in a predetermined pattern.

[0056] Figures 3 to 5 Among them, in the ceramic block 200, the ceramic block 100 is divided into five sections by two through partitions 221, 222 formed in a T shape through the ceramic block 200 on both sides. Thus, five resonant cavities 211 to 215 are defined. Among the two T-shaped through partitions 221, 222, the first through partition 221 divides the first to third resonant cavities 211 to 213 sections from each other, and the second through partition 222 divides the first resonant cavity 211 and the fourth and fifth resonant cavities 214, 215 sections from each other. Figure 1 Among them, as an example, a case where the through partitions 221, 222 are formed in a shape of passing through the ceramic block 200 in a T shape is illustrated, but the plurality of through partitions 221, 222 can be formed in a linear shape spaced apart from each other, and in addition to the T shape, can be formed in various branched pattern shapes such as a Y shape or a cross. Here, the through partitions 221, 222 are not only formed to be spaced apart from each other, but also not formed to the side surface boundary of the ceramic block 200, so the plurality of resonant cavities 211 to 215 are not completely separated by the through partitions. Thus, between the resonant cavities adjacent to each other among the plurality of resonant cavities 211 to 215 divided by the through partitions 221, 222, coupling can be achieved through the area where the through partitions 221, 222 are not formed. In this regard, the through partitions 221, 222 not only simply divide the sections of the ceramic block 200 to define the resonant cavities 211 to 215, but also form a signal transmission path that transmits signals through coupling between the resonant cavities 211 to 215.

[0057]

[0058]

[0059] ​​​The duplexer performs an action of separating a transmission signal (TX) and a reception signal (RX) according to a frequency in order to transmit and receive signals using a shared antenna. In this regard, Figures 3 to 5 In the duplexer according to the embodiment shown, the first to fifth resonant cavities 211 to 215 divided by the through partitions 221 and 222 can be formed in a structure symmetrical to both sides of the ceramic block 200, and the first resonant cavity 211 located at the center is a shared resonant cavity serving as a shared path for transmitting a transmission signal (TX) to a shared antenna through a shared interface 270 and applying a reception signal (RX) from the shared antenna. However, it is obvious to those skilled in the art that the present application is not limited to the ceramic block symmetrical to both sides. Also, it is assumed that the third and second resonant cavities 213 and 212 located at one side of the first resonant cavity 211 form a transmission path for sequentially transmitting a transmission signal (TX) transmitted from a transmitter (not shown) to the first resonant cavity 211, and that the fourth and fifth resonant cavities 214 and 215 located at the other side of the first resonant cavity 211 form a reception path for sequentially transmitting a reception signal (RX) transmitted from the first resonant cavity 211 to a receiver (not shown).

[0060] Here, the first to third resonant cavities 211 to 213 function as a band pass filter (BPF) corresponding to a frequency band of the transmission signal (TX), which makes the reception signal (RX) not transmitted to the transmitter, and the first, fourth and fifth resonant cavities 211, 214 and 215 function as a BPF corresponding to a frequency band of the reception signal (RX), which makes the transmission signal (TX) not transmitted to the receiver.

[0061] However, the two through partitions 221 and 222 do not completely divide the first resonant cavity 211 from the adjacent third and fifth resonant cavities 213 and 215, and thus, on the one hand, coupling of the first resonant cavity 211 with the second and fourth resonant cavities 212 and 214 is achieved, and also cross-coupling with the third and fifth resonant cavities 213 and 215 is achieved. This cross-coupling generates a transmission zero at a frequency lower than a passband, thereby improving an attenuation characteristic of the ceramic waveguide duplexer.

[0062] Also, at least one of the plurality of resonant cavities 211 to 215 (of which the third and fifth resonant cavities 213, 215 are an example) can be formed with a resonant slot 231, 232. The resonant slots 231, 232 can be formed in one face of the ceramic block 200, and are shown as slots formed in a circular shape as an example. However, the form of the resonant slots 231, 232 can be varied in a plurality of ways. In particular, each resonant slot 231, 232 can be formed in the center of the region in which the electric field is concentrated in the corresponding resonant cavity 213, 215. This is to induce the effect of lowering the resonance frequency by increasing the capacitance component of each of the plurality of resonant cavities 211 to 215, so that the size of the ceramic waveguide duplexer can be reduced compared to the case in which the resonant slots 231, 232 are not formed.

[0063] In addition, at least one interface can be formed in the ceramic waveguide duplexer of the present embodiment. The duplexer is an input / output port for inputting and outputting signals to and from a transmitter and a receiver and a shared antenna, and requires three interfaces. Of the three interfaces, a transmission interface (not shown) receives a transmission signal (TX) from the transmitter, a reception interface (not shown) transmits a reception signal (RX) to the receiver, and a shared interface 270 inputs and outputs a transmission signal (TX) or a reception signal (RX) to and from a shared antenna (not shown).

[0064] Of the three interfaces, a transmission interface (not shown) receives a transmission signal (TX) from the transmitter, a reception interface (not shown) transmits a reception signal (RX) to the receiver, and a shared interface 270 inputs and outputs a transmission signal (TX) or a reception signal (RX) to and from a shared antenna (not shown). Figure 1 and Figure 2 As shown in the interface slots 141, 142, the transmission interface and the reception interface can be formed in the form of a slot in the position corresponding to the resonant slots 231, 232 in the other face of the ceramic block 200. In the case in which the transmission interface and the reception interface are formed in the form of a slot as in the interface slots 141, 142, the transmission interface and the reception interface capacitively couple signals with each of the corresponding resonant slots 231, 232.

[0065] However, in the case in which signals are input and output using a coaxial cable or the like, the inner conductor of the coaxial cable is directly inserted into the specified position in the ceramic block 200, so that signals can be capacitively coupled with the corresponding resonant slots 231, 232. Therefore, the transmission interface and the reception interface can not be formed in a specific shape depending on the situation, and can be omitted as shown in Figures 3 to 5

[0066] In addition, a metal layer 260 is formed on the entire outer face of the single ceramic block 200. In particular, the metal layer 260 is also formed inside the plurality of through partitions 221, 222 and the plurality of resonant slots 231, 232. However, in the case in which the transmission interface and the reception interface are formed in the form of a slot, the metal layer 260 can be formed in the form of a slot as shown in Figure 1 ​As shown, an annular groove removing the metal layer 260 from the periphery of the groove can be formed. That is, the transmission interface and the reception interface can be formed in the same structure as the interface configuration of the conventional integrated ceramic waveguide filter.

[0067] However, in the present embodiment, unlike the conventional interface configuration, the common interface 270 is formed in a hole shape penetrating the ceramic block 200. In particular, as shown in Figure 5 and Figure 6 As shown, the common interface 270 is formed in a step structure in which the diameter of one side of the ceramic block 200 is larger than that of the other side in the hole formed penetrating the ceramic block 200.

[0068] Referring to Figure 6 , the common interface 270 is basically formed in a hole shape of a cylindrical shape penetrating the ceramic block 200, but is formed in a multi-step structure having a plurality of step regions 272a, 272b having a stage expansion in which the upper diameter of one side of the ceramic block 200 is larger than the lower portion 271 of the other side. Among them, although it is shown that the common interface 270 has a multi-step structure in which the diameter is increased in stages from the other side to the one side of the ceramic block 200, it can also be formed in a single step structure according to circumstances.

[0069] Also, the inside of the hole-shaped common interface 270 is formed with a metal layer 261. However, the other side of the ceramic block 200 is formed with an annular groove 251 to the periphery of the common interface 270, so that the metal layer 261 formed inside the common interface 270 is separated from the metal layer 260 formed outside the common interface 270 in the other side of the ceramic block 200. Here, the annular groove 251 can be formed so that the inner circle is separated from the hole of the common interface 270 in the other side of the ceramic block 200 by a predetermined interval, so that the metal layer 261 formed inside the common interface 270 is extended to a part of the other side of the ceramic block 200. This is to enable the common interface 270 to input and output signals with a planar line type input and output terminal formed on a PCB or the like in addition to a coaxial cable or the like input and output terminal inserted into the inside to be able to transmit signals.

[0070] Meanwhile, the step regions 272a, 272b are also formed with an annular inner groove 273 separating the metal layer formed inside the common interface 270 and the metal layer formed on the one side of the ceramic block 200 from each other. Among them, the annular inner groove 273 formed in the step regions 272a, 272b expands the frequency band of signals input and output through the common interface 270 together with the multi-step hole structure. As shown in Figure 6As shown, the inner annular groove 273 can be formed to be parallel to one face of the ceramic block 200 at the stepped regions 272a, 272b. By forming the inner annular groove 273, the common interface 270 transmits signals in a capacitive coupling manner together with the metal layer 261 formed inside. Here, the frequency band of signals that can be transmitted in a capacitive coupling manner can be adjusted according to the width of the inner annular groove 273.

[0071] As such, the common interface 270 is formed in a hole shape of a stepped structure, one stepped region forms the inner annular groove 273, and in the case of transmitting signals in a capacitive coupling manner, the frequency band of signals that can be transmitted is greatly expanded.

[0072] As described above, the duplexer receives transmission signals (TX) and reception signals (RX) of different frequency bands and performs band-pass filtering. Also, the transmission interface receives only transmission signals (TX) and transmits them, and the reception interface receives only reception signals (RX) and transmits them. Therefore, as shown, Figure 7 as shown, the common interface 270 can be configured to input and output signals of the transmission frequency band (TX band) in the transmission interface and output signals of the reception frequency band (RX band) in the reception interface.

[0073] However, the common interface 270, which needs to input and output transmission signals (TX) and reception signals (RX) to the common antenna, needs to be configured to cover both the transmission frequency band (TX band) and the reception frequency band (RX band). That is, the frequency band of signals that can be input and output is required to be very large compared to the transmission interface or the reception interface. For example, in the case where the transmission frequency band (TX band) and the reception frequency band (RX band) are 300 MHz, respectively, the required band of the common interface 270 is, as shown, Figure 7 not simply 600 MHz, which is the sum of the transmission frequency band (TX band) and the reception frequency band (RX band), but also needs to include a transmission-reception guard band (TRX guard band) set to distinguish between transmission signals (TX) and reception signals (RX). That is, the common interface 270 needs to be configured to be able to input and output signals of a frequency band corresponding to the sum of the transmission frequency band (TX band), the reception frequency band (RX band), and the transmission-reception guard band (TRX guard band).

[0074] As Figure 2As shown, when the corresponding resonant slots 131, 136 and interface slots 141, 142 are formed to face each other on one side and the other side of the ceramic block 100, the smaller the gap g between the resonant slots 131, 136 and the interface slots 141, 142, the greater the capacitance formed by capacitive coupling, thereby increasing the frequency band of signals that can be input and output. However, even if the gap g between the resonant slots 131, 136 and the interface slots 141, 142 is further reduced, the frequency band that can be expanded is limited. Furthermore, if the gap g between the resonant slots 131, 136 and the interface slots 141, 142 is extremely small (for example, less than 2 mm), there is a risk of ceramic breakage in that area during firing or handling.

[0075] In contrast, in this embodiment, the shared interface 270 is formed as a hole in a stepped structure that penetrates the ceramic block 200. By adjusting the width of an internal annular groove 273 formed in the stepped region, a capacitive coupling frequency band is achieved, enabling transmission of broadband signals up to 800 MHz without risk of damage. This ensures stable implementation of the broadband transmission characteristics required for the duplexer interface 270, enabling miniaturization of the integrated ceramic waveguide duplexer.

[0076] Figure 8 FIG. 1 is an upper perspective view showing an integrated ceramic waveguide duplexer according to another embodiment of the present invention, Figure 9 Show Figure 8 Top view of the integrated ceramic waveguide duplexer. Figure 10 Show Figure 8 Side cross-sectional view of the integrated ceramic waveguide duplexer.

[0077] Figures 8 to 10 The integrated ceramic waveguide duplexer shown is also Figures 3 to 5 The duplexer shown is also formed in an integrated type and includes a plurality of resonant cavities 311 to 319 and 31X defined by a plurality of through partition walls 321 to 323 formed between one surface and the other surface of a single ceramic block 300 .

[0078] Among the multiple through-walls 321-323, the first through-wall 321 comprises two cross-connected components, thereby dividing the first and Xth resonant cavities 311 and 31X in the center of the ceramic block 300 from the resonant cavities 312-315 and 316-319 on either side, and further dividing the first and Xth resonant cavities 311 and 31X from each other. The first resonant cavity 311 transmits a transmit signal (TX) to the shared antenna via a shared interface 370 and serves as a shared resonant cavity for receiving signals (RX) from the shared antenna. This shared resonant cavity can be referred to as a shared resonator.

[0079] Further, the second through-separation wall 322 formed in a cross shape separates the four resonant cavities 312 to 315 located on one side in the ceramic block 300 from each other, and the third through-separation wall 323 formed in a cross shape separates the four resonant cavities 312 to 315 located on the other side in the ceramic block 300 from each other.

[0080] In this case, it is assumed that the four resonant cavities 312 to 315 located on one side form a transmission path that transmits a transmission signal (TX) applied from a transmitter to the first resonant cavity 311, and the four resonant cavities 316 to 317 located on the other side form a reception path that transmits a reception signal (RX) applied from a receiver to the first resonant cavity 311. That is, the first to fifth resonant cavities 311 to 315 function as a BPF corresponding to a frequency band of the transmission signal (TX) so that the reception signal (RX) is not transmitted to the transmitter, and the first and sixth to ninth resonant cavities 311, 316 to 319 function as a BPF corresponding to a frequency band of the reception signal (RX) so that the transmission signal (TX) is not transmitted to the receiver. The Xth resonant cavity 31X is an unusable area generated when the division of the first resonant cavity 311 is divided.

[0081] Further, Figures 8 to 10 One side of the ceramic block 300 of each of the eight resonant cavities 312 to 319 located on both sides in the duplexer is formed with resonant grooves 331 to 338. Each of the resonant grooves 331 to 338 induces an effect of lowering a resonant frequency by increasing a capacitive component of the corresponding resonant cavity 312 to 319, so that the size of the resonant cavities 312 to 319 can be made smaller. That is, the duplexer can be miniaturized. Further, on the other side of the ceramic block 300, a slot-shaped transmission interface 341 is formed at a position corresponding to the resonant groove 334 of the fifth resonant cavity 315, and a slot-shaped reception interface 342 is formed at a position corresponding to the resonant groove 338 of the ninth resonant cavity 319. The slot-shaped transmission interface 341 and the reception interface 342 are formed to be capacitively coupled with the resonant grooves 334, 338 of the fifth resonant cavity 315 and the ninth resonant cavity 319 to transmit signals. Figure 1 The interface grooves 141, 142 are formed to be capacitively coupled with the resonant grooves 334, 338 of the fifth resonant cavity 315 and the ninth resonant cavity 319 to transmit signals, as with the interface grooves 141, 142.

[0082] Here, on the other side of the ceramic block 300, annular grooves 351, 352 in which the metal layer 160 is removed are formed around the slot-shaped transmission interface 341 and the reception interface 342, respectively. The inner circle of the annular grooves 351, 352 can be formed to have a size corresponding to the grooves in which the transmission interface 341 and the reception interface 342 are formed, but the inner circle can also be formed to be spaced apart from the grooves by a predetermined interval, so that the metal layer inside the transmission interface 341 and the reception interface 342 is formed to a partial area of the other side of the ceramic block 300, thereby allowing signals to be input and output from the planar line type input and output terminals formed on a PCB or the like.

[0083] In addition, a common interface 370 for inputting and outputting a transmit signal (TX) and a receive signal (RX) to and from a common antenna is formed in the first resonant cavity 311. Figures 8 to 10 In the duplexer shown in FIG, since the first resonant cavity 311 is a common resonant cavity that transmits a transmit signal (TX) to the common antenna and receives a receive signal (RX) from the common antenna, a common interface 370 is formed in the first resonant cavity 311. The common interface 370 is connected to the common resonant cavity 311. Figures 3 to 5 The common interface 270 shown is similarly formed as a hole with a stepped structure, with a diameter on one side of the ceramic block 300 being larger than the diameter on the other side. This structure can be a single-step structure or a multi-step structure. Furthermore, at least one of the stepped regions of the common interface 370 includes an internal annular groove parallel to one side of the ceramic block 300, enabling signal transmission via capacitive coupling over a wide bandwidth. Here, the first to third through-walls 321-322 are spaced apart from each other, creating cross-coupling between the second resonant cavity 312 and the fifth resonant cavity 315, and between the sixth resonant cavity 316 and the ninth resonant cavity 319. This creates a transmission zero at frequencies lower than the passband, thereby improving the attenuation characteristics of the ceramic waveguide duplexer.

[0084] In the duplexer constructed as described above, a transmit signal (TX) applied through the transmit interface 341 is capacitively coupled to the resonant slot 334 formed in the fifth resonant cavity 315. The transmit signal (TX) transmitted to the fifth resonant cavity 315 is bandpass filtered through the fourth, third, and second resonant cavities 314, 313, and 312, respectively, through capacitive coupling, before being transmitted to the first resonant cavity 311. The shared interface 370 of the first resonant cavity 311 transmits the transmitted transmit signal (TX) to the shared antenna. Furthermore, a receive signal (RX) transmitted from the shared antenna to the shared interface 370 is capacitively coupled through the sixth through ninth resonant cavities 319. The receive interface 342 formed in the ninth resonant cavity 319 receives the signal through capacitive coupling with the resonant slot 338, and outputs it to the connected output terminal.

[0085] in addition, Figures 8 to 10The illustrated duplexer can also be formed with at least one coupling hole 381, 382 that penetrates the ceramic block 300 between resonant cavities that are adjacent to each other among the plurality of resonant cavities 311 ~ 319. Among them, as an example, the coupling holes 381, 382 are shown to be formed between the third and fourth resonant cavities 313, 314 and between the seventh and eighth resonant cavities 317, 318, but the coupling holes 381, 382 can also be formed between another resonant cavity adjacent to each other. Also, each of the coupling holes 381, 382 can be formed as a single step or a multi-step structure with a diameter on one side of the ceramic block 300 larger than a diameter on the other side, similar to the common interface 370. The coupling holes 381, 382 function to convert the sign of the cross-coupling suitable for between the resonant slots 331, 334 or between the resonant slots 335, 338 to negative (-), thereby enabling a capacitive cross-coupling that forms a transmission zero on the lower side of the passband.

[0086] It can be formed in a small size, and the resonant frequency can be further reduced by being formed between adjacent resonant cavities. Thus, it can be applied together with the resonant slots 331 ~ 338 to further miniaturize the duplexer.

[0087] As described above, the duplexer of the present embodiment is formed in an integrated type within a single ceramic block 200, 300, and a plurality of resonant cavities 212 ~ 215, 312 ~ 319 formed on both sides of the first resonant cavity 211, 311 located at the center of the ceramic block 200, 300 form a transmission path and a reception path that respectively pass a band-pass filter to transmit and receive a signal (TX) and a signal (RX). Here, the common interface 270, 370 formed in a hole shape with a stepped structure in the first resonant cavity 211, 311 that is a common resonator connected to a common antenna is implemented to be able to input and output a signal in a wide band, and thus, it is possible to stably input and output a transmission signal (TX) and a reception signal (RX).

[0088] Although it is shown that only the common interface 270, 370 is formed in a hole shape with a stepped structure, the transmission interface and the reception interface can also be formed in a hole shape with a stepped structure the same as the common interface 270, 370, according to circumstances.

[0089] Figure 11 An example of an interface substrate that inputs and outputs a signal to / from the integrated ceramic waveguide duplexer of Figure 8 , Figure 12 A top view of the interface substrate of Figure 11 , Figure 13 A side cross-sectional view of the interface substrate of Figure 11 . Also Figure 14 A structure in which the integrated ceramic waveguide duplexer of Figure 8 and the interface substrate of Figure 11 are combined.

[0090] As described above, in the integrated ceramic waveguide duplexer according to this embodiment, the inner circular shapes of the annular grooves 351 and 352 are formed to be spaced a predetermined distance apart from the outer contours of the grooves or holes of the transmitting and receiving interfaces 341 and 342, and the common interfaces 270 and 370. Here, the inner metal layer 261 of the transmitting and receiving interfaces 341 and 342, and the common interfaces 270 and 370, is formed to extend to the other surface of the ceramic blocks 200 and 300. This is to enable signal input and output not only with coaxial cable-type input and output terminals, but also with planar line-type input and output terminals of a substrate structure.

[0091] And, in Figures 11 to 13 To implement planar line-type input and output terminals, a stripline structure is implemented as an example on the interface substrate 400. The stripline interface substrate 400 is implemented as a three-layer structure consisting of a dielectric plate 410 and metal plates 421 and 422 formed on one and other surfaces of the dielectric plate 410, respectively. Furthermore, signal plates 432, 442, and 452 are formed on one surface of the interface substrate 400 in areas corresponding to the duplexer's shared interfaces 270 and 370, and the transmit interface 341 and receive interface 342, respectively. Ring-shaped grooves 433, 443, and 453 are formed in the metal plate 421, removing a predetermined distance from the perimeter of the signal plate. This electrically isolates the metal plate 421 from the signal plates 432, 442, and 452.

[0092] In addition, the dielectric plate 410 has positions formed inside that are connected to the signal plates 432, 442, and 452 so that the transmit signal (TX) and the receive signal (RX) are transmitted. Through-hole electrodes 434, 444, and 454 are formed between the signal plates 432, 442, and 452 corresponding to one end of each transmission line 431, 441, and 451 to electrically connect the signal plates 432, 442, and 452 corresponding to the transmission lines 431, 441, and 451.

[0093] like Figure 14 As shown, the interface substrate 400 of this structure is bonded to the other side of the ceramic waveguide duplexer. In this case, the three signal plates 432, 442, and 452 are electrically connected to the internal metal layer 261 formed within the shared interfaces 270, 370, the transmission interface 341, and the reception interface 342, extending to the other side of the ceramic blocks 200, 300. Therefore, the shared interfaces 270, 370, the transmission interface 341, and the reception interface 342 can input and output signals to and from the corresponding transmission lines 431, 441, and 451 via the three signal plates 432, 442, and 452. In other words, signals can be easily input and output to and from the duplexer using planar line-type input / output terminals, rather than coaxial cables or other similar input / output terminals.

[0094] The application has been described with reference to the embodiments illustrated in the drawings, but this is merely an example, and a person of ordinary skill in the art should understand that various modifications and equivalent other embodiments can be made therefrom.

[0095] Therefore, the true technical protection scope of the application is determined by the technical idea of the scope of the appended claims.

Claims

1. A ceramic waveguide duplexer, comprising: a plurality of resonant cavities defined by partitions formed by a plurality of through walls penetrating one side and the other side of a single ceramic block in a predetermined pattern; a common interface formed as a hole structure penetrating the ceramic block within a region of a common resonant cavity for inputting and outputting signals with a common antenna among the plurality of resonant cavities, and formed as a stepped hole structure in which the hole diameter on the other side of the ceramic block is smaller than the hole diameter on the one side; and a metal layer formed on the outer surface of the ceramic block, and removing a ring shape from a step region parallel to one side of the ceramic block in the common interface of the step hole structure to form an inner annular groove; The plurality of resonant cavities are formed into a symmetrical structure on both sides of the ceramic block by the plurality of through partition walls, and the common resonant cavity is located on the central axis of the ceramic block on both sides. The predetermined transmitting resonant cavity among the multiple resonant cavities band-pass filters the applied transmitting signal to the adjacent resonant cavity in a capacitive coupling manner so as to be transmitted to the common resonant cavity, and the common resonant cavity band-pass filters the applied receiving signal to the adjacent resonant cavity in a capacitive coupling manner so as to be transmitted to the predetermined receiving resonant cavity.

2. The ceramic waveguide duplexer according to claim 1, wherein: The common interface is formed in a hole shape having a multi-step structure in which the diameter repeatedly decreases in stages from one surface side of the ceramic block.

3. The ceramic waveguide duplexer according to claim 1, wherein: The width of the inner annular groove is adjusted according to the frequency band of the signal input to and output from the common antenna.

4. The ceramic waveguide duplexer according to claim 3, wherein: The metal layer is formed with an annular groove on the other surface of the ceramic block, which is formed by removing an inner circle having a predetermined interval around the hole of the common interface.

5. The ceramic waveguide duplexer according to claim 1, wherein: The ceramic waveguide duplexer further includes a transmitting interface and a receiving interface. The transmitting interface and the receiving interface pass through the ceramic block within the respective areas of the transmitting resonant cavity and the receiving resonant cavity, and have a step hole structure in which the diameter of the other side of the ceramic block is smaller than the diameter of the one side. In the step hole structure, an internal annular groove in which the metal layer is removed in a ring shape is formed in a step area parallel to one side of the ceramic block.

6. The ceramic waveguide duplexer according to claim 1, wherein: The ceramic waveguide duplexer further includes a transmitting interface and a receiving interface. The transmitting interface and the receiving interface are formed in the form of grooves at the respective positions of the transmitting resonant cavity and the receiving resonant cavity on the other side of the ceramic block, and the grooves are surrounded by a metal layer formed by removing annular grooves in a ring shape from the metal layer formed on the other side of the ceramic block.

7. The ceramic waveguide duplexer according to claim 1, wherein: The ceramic waveguide duplexer further includes at least one resonant slot, The at least one resonant groove is formed in a groove shape at a predetermined position of at least one resonant cavity among the plurality of resonant cavities in one surface of the ceramic block, and the metal layer is formed inside.

8. The ceramic waveguide duplexer according to claim 1, wherein: The ceramic waveguide duplexer further includes at least one coupling hole, The at least one coupling hole is formed by passing through the ceramic block between at least two adjacent resonant cavities among the multiple resonant cavities, and is formed into a stepped hole structure in which the hole diameter on the other side of the ceramic block is smaller than the hole diameter on the one side, and the metal layer is formed on the inner side.

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