Electronic component backfilm method and apparatus

Abstract

The present application provides a kind of electronic component back film method and equipment, including: the lower side of a carrier plate adhering with multiple coils is conveyed to a glue dipping device by a conveying device, the lower side of the coil is dipped into the glue plate of the glue dipping device and adheres resin;The conveying device conveys the carrier plate away from the glue dipping device to a hardening device, and the resin adhered to the lower side of the coil is irradiated by a hardening light source to harden;The conveying device conveys the carrier plate away from the hardening device to a discharging device, and the coil is collected by the discharging device;The conveying device conveys the carrier plate away from the discharging device to a collection device, and the carrier plate is collected by the collection device;Thus, electronic component back film can be automatically performed.

Description

Technical Field

[0001] This invention relates to a backing film method and apparatus, and more particularly to a backing film method and apparatus for electronic components that forms a backing film on one side of a coil. Background Technology

[0002] Electronic components, such as inductors, typically require wire to be wound in the core between the two flanges of an iron core to form a coil. Since the electronic component needs to be attached to the surface of a circuit board using surface mount technology (SMT), a flat backing film is usually formed on the side of the electronic component without electrodes in order to make it easy for the mounting device to pick up the electronic component and attach it to the surface of the circuit board.

[0003] The electronic component can be disclosed as in Publication No. 567509, "Wire-wound Sheet Coil and Method for Adjusting its Characteristics". The coil after winding the wire is held on the support with the side without electrodes facing down, and a UV-curable resin is placed on the plate. Then, the coil is immersed in the resin to a preset depth and then lifted up. The resin adhering to the coil is cured by UV light to form a back film.

[0004] Existing methods for back film coating of electronic components mostly rely on manual labor, which is time-consuming and labor-intensive. When dealing with miniaturized inductors such as 0201, 0402, 0603, and 0805, the difficulty of manual operation increases. Therefore, automating the back film coating process for electronic components has become a trend in the industry. Summary of the Invention

[0005] Therefore, the object of the present invention is to provide an automated method for back-filming electronic components.

[0006] Another object of the present invention is to provide an apparatus for performing the electronic component backsheet method as described above.

[0007] The back coating method for electronic components according to the present invention includes: conveying a carrier plate with a plurality of coils adhered to its underside by a conveying device to a coating device, immersing the underside of the coils in a glue tray of the coating device to adhere resin; conveying the carrier plate away from the coating device to a curing device by the conveying device, curing the resin adhered to the underside of the coils by irradiation with a curing light source; conveying the carrier plate away from the curing device to a unloading device by the conveying device, collecting the coils by the unloading device; and conveying the carrier plate away from the unloading device to a collection device by the conveying device, collecting the carrier plate by the collection device.

[0008] An electronic component backsheet apparatus according to another object of the present invention is used to perform the electronic component backsheet method as described above.

[0009] The electronic component back-coating method and apparatus of the present invention, wherein the conveying device sequentially conveys the carrier plate with the coil adhered thereto to the adhesive device, the hardening device and the unloading device, not only automating the electronic component back-coating operation, but also automatically separating the coil after back-coating from the carrier plate, saving the time and manpower required for subsequent manual separation. Attached Figure Description

[0010] Figure 1 This is a schematic diagram of a back film formed on one side of the coil in an embodiment of the present invention.

[0011] Figure 2 This is a three-dimensional schematic diagram of the carrier plate and the adhesive film in an embodiment of the present invention.

[0012] Figure 3 This is a schematic diagram of a carrier plate simultaneously holding multiple coils in an embodiment of the present invention.

[0013] Figure 4 This is a three-dimensional schematic diagram of the back film device for electronic components in an embodiment of the present invention.

[0014] Figure 5 This is a front view of the conveying device in an embodiment of the present invention.

[0015] Figure 6 This is a schematic diagram of the nozzle holder being inverted in an embodiment of the present invention.

[0016] Figure 7 This is a three-dimensional schematic diagram of the correction device in an embodiment of the present invention.

[0017] Figure 8 This is a schematic diagram of the airway in an embodiment of the present invention.

[0018] Figure 9 This is a three-dimensional schematic diagram of the adhesive applicator in an embodiment of the present invention.

[0019] Figure 10 This is a schematic diagram of resin storage in the adhesive applicator in an embodiment of the present invention.

[0020] Figure 11 This is a schematic diagram of the driver of the adhesive applicator driving the connecting member to move the slide in an embodiment of the present invention.

[0021] Figure 12 This is a schematic diagram of the glue dispensing gap in an embodiment of the present invention.

[0022] Figure 13 This is a three-dimensional schematic diagram of the hardening device in an embodiment of the present invention.

[0023] Figure 14 This is a schematic diagram of the light-transmitting film being sandwiched between the pressure plate and the light-transmitting plate in an embodiment of the present invention.

[0024] Figure 15 This is a schematic diagram of the light-transmitting film being wound around the hardening mechanism and the film belt conveying mechanism in an embodiment of the present invention.

[0025] Figure 16 This is a three-dimensional schematic diagram of the unloading device in an embodiment of the present invention.

[0026] Figure 17 This is a schematic diagram showing the configuration relationship between the frame, unloading mechanism and unloading box in an embodiment of the present invention.

[0027] Figure 18 This is a perspective view of the supply device in an embodiment of the present invention.

[0028] Figure 19 This is a three-dimensional schematic diagram of the collection device in an embodiment of the present invention.

[0029] Figure 20 This is a schematic diagram of the unloading component stripping coil in an embodiment of the present invention.

[0030] [Symbol Explanation]

[0031] A: Transport device

[0032] A1: Longmen Mechanism

[0033] A11: Stand

[0034] A12: Rail frame

[0035] A121: Slide rail

[0036] A122: Slide

[0037] A123: Screw

[0038] A124: Driver

[0039] A125: Belt

[0040] A2: Lifting mechanism

[0041] A21: Driver

[0042] A22: Portable Seat

[0043] A3: Transporting Organization

[0044] A31: Suction nozzle holder

[0045] A311: Adsorption surface

[0046] A312: Suction nozzle

[0047] A313: Vent tube

[0048] A314: First positioning component

[0049] A315: Second positioning component

[0050] A316: First positioning hole

[0051] A317: Second positioning hole

[0052] A32: Universal Joint

[0053] B: Calibration device

[0054] B1: Calibration Platform

[0055] B11: Stand

[0056] B12: Calibration stand

[0057] B121: Correction surface

[0058] B122: Limiting component

[0059] B123: Limiting pin

[0060] B2: Cleaning Agency

[0061] B21: Air inlet

[0062] B22: Airway

[0063] B23: Ventilation tube

[0064] C: Adhesive application device

[0065] C1: Disc carrier

[0066] C11: Bracket

[0067] C12: Carrier

[0068] C121: Limiting component

[0069] C122: Limit pin

[0070] C2: Disc drive mechanism

[0071] C21: Slide rail

[0072] C22: Slide

[0073] C23: Drive

[0074] C3: Rubber disc

[0075] C31: Adhesive base

[0076] C32: Mounting component

[0077] C33: Stop

[0078] C34: Adhesive application area

[0079] C35: Magnetic component

[0080] C4: Glue scraping mechanism

[0081] C41: Scraper

[0082] C42: Rubber Storage Area

[0083] D: Hardening device

[0084] D1: Hardening mechanism

[0085] D11: Stand

[0086] D12: Fixture

[0087] D121: First hollowed-out section

[0088] D122: Bushing

[0089] D123: Guiding component

[0090] D13: Hardened Light Source

[0091] D14: Mounting bracket

[0092] D141: Second hollow section

[0093] D142: Limiting component

[0094] D143: Limit pin

[0095] D144: Installation Department

[0096] D15: Translucent panel

[0097] D16: Pressure Plate

[0098] D161: Third hollow section

[0099] D162: Long slot hole

[0100] D17: Lifting Mechanism

[0101] D171: Lifting rod

[0102] D172: lifting plate

[0103] D173: Driver

[0104] D2: Membrane conveyor mechanism

[0105] D21: Tape feeding mechanism

[0106] D211: Loading the tape reel

[0107] D22: Receiving mechanism

[0108] D221: Reel in the tape roll

[0109] D222: Driver

[0110] D23: Tension Adjustment Mechanism

[0111] D231: Driven component

[0112] D232: Bracket

[0113] D233: Sensor

[0114] E: Unloading device

[0115] E1: Frame

[0116] E11: Support Plate

[0117] E12: Limiting seat

[0118] E121: Discharge port

[0119] E122: Backrest

[0120] E123: Upper surface

[0121] E13: Mounting bracket

[0122] E2: Unloading mechanism

[0123] E21: Unloading component

[0124] E211: Upper surface

[0125] E212: Side surface

[0126] E22: Driver

[0127] E3: Unloading box

[0128] E31: Opening

[0129] E32: Grip

[0130] F: Supply device

[0131] F1: Supply Box

[0132] F11: Slot

[0133] F2: Material feeding lifting mechanism

[0134] F3: Material supply channel

[0135] F4: First Pushing Mechanism

[0136] G: Collection device

[0137] G1: Collection Box

[0138] G11: Slot

[0139] G2: Material receiving and lifting mechanism

[0140] G3: Material receiving channel

[0141] G4: Second Pushing Mechanism

[0142] M: Carrier plate

[0143] N: Adhesive film

[0144] P: Translucent membrane

[0145] T: Machine table surface

[0146] W1: Coil

[0147] W11: Core section

[0148] W12: Flange

[0149] W121: Electrode section

[0150] W13: Cable

[0151] W2: Back membrane

[0152] W2': Resin

[0153] d: Dispensing gap. Detailed Implementation

[0154] Please see Figure 1 The electronic component back film method and apparatus of the present invention form a back film W2 on one side of the coil W1;

[0155] The coil W1 has a Y-axis core portion W11 and two flanges W12 respectively located at both ends of the core portion W11; a wire W13, such as enameled wire, is wound around the core portion W11; an electrode portion W121 is provided on the upper side of the flanges W12, and the two ends of the wire W13 can be soldered to the electrode portion W121 of the two flanges W12 respectively;

[0156] The back film W2 is formed on the lower side of the coil W1 where the electrode portion W121 is not present, so that the lower side of the coil W1 has a flat surface to facilitate subsequent soldering operations; the back film W2 is made of, for example, a resin that can be cured after being irradiated with UV light.

[0157] Please see Figure 2 , 3 In this embodiment of the invention, a carrier plate M simultaneously holds multiple coils W1, allowing the coils W1 to be transported to different devices so that a back film W2 is formed on one side of the coil W1. Figure 1 );

[0158] A double-sided adhesive film N is provided between the carrier plate M and the coil W1. One side of the film is attached to the carrier plate M, and the other side is adhered to and holds the coil W1. Multiple coils W1 can be arranged in a matrix on the adhesive film N. The adhesive film N is, for example, a pyrolytic film that can eliminate stickiness when heated.

[0159] The carrier plate M is positioned with the side of the adhesive film N attached facing down, so that the adhesive film N adheres to the upper side of the coil W1 having the electrode portion W121, so that the lower side of the coil W1 without the electrode portion W12 is suspended and transported.

[0160] Please see Figure 3 , 4 The electronic component backsheet method of this invention can be as follows: Figure 4 The device shown is used as an example for explanation. This device is equipped with:

[0161] A conveying device A is mounted on a machine table T; the conveying device A can convey the carrier plate M to different devices through the X-axis conveying flow path to perform different operations on the multiple coils W1 held on the carrier plate M.

[0162] A calibration device B is installed on the table surface T of the machine tool, which can simultaneously calibrate multiple coils W1 held on the carrier plate M.

[0163] A glue-coating device C is provided on the table surface T of the machine and located downstream of the calibration device C in the conveying flow path. It can store the resin W2' to be cured for the multiple coils W1 held on the carrier plate M to be coated.

[0164] A hardening device D, disposed on the machine table T and located downstream of the adhesive applicator C in the conveying flow path, can harden the resin W2' adhering to the coil W1 to form the back film W2. Figure 1 );

[0165] A discharge device E is provided on the machine platform T and located downstream of the hardening device D in the conveying flow path. It can separate multiple coils W1 from the carrier plate M and collect the coils W1.

[0166] A supply device F and a collection device G are respectively located on both sides of the machine table T. The supply device F supplies a carrier plate M holding multiple coils W1, which is then sequentially transported by the conveying device A to the calibration device B, the adhesive device C, the hardening device D, and the unloading device E. The carrier plate M holding multiple coils W1 is then transported to the collection device G for collection. When the carrier plate M is transported, the coils W1 are held in a direction approximately perpendicular to the transport flow path with their long axis (which passes through the axes of both flanges W12).

[0167] Please see Figure 5 , 6 The conveying device A is equipped with a gantry mechanism A1, a lifting mechanism A2 and a conveying mechanism A3;

[0168] The gantry mechanism A1 is erected on the platform T of the machine. Figure 4 Two brackets A11 on the rail support a rail frame A12 along the X-axis; the front side of the rail frame A12 is provided with two slide rails A121 along the X-axis with upper and lower spacing for a slide block A122 to slide on; a screw A123 is provided between the two slide rails A121, which is driven by a belt A125 driven by a driver A124, such as a motor, so that the screw A123 drives the slide block A122 to move horizontally back and forth along the X-axis on the rail frame A12;

[0169] The lifting mechanism A2 is mounted on the slide A122. The lifting mechanism A2 is driven by a driver A21, such as a pneumatic cylinder, to move a movable seat A22 vertically back and forth along the Z-axis.

[0170] The conveying mechanism A3 is mounted on the movable seat A22 and can be driven to perform horizontal displacement along the X-axis and vertical displacement along the Z-axis. The conveying mechanism A3 has a suction nozzle seat A31 and a universal joint A32, which is connected between the suction nozzle seat A31 and the movable seat A22. The suction nozzle seat A31 has a flat suction surface A311, on which multiple suction nozzles A312 are provided. The suction nozzles A312 are connected to an external negative pressure unit (not shown) through multiple air pipes A313. The suction nozzle seat A31 has a first positioning member A314 and a second positioning member A315 on its two sides along the X-axis, respectively. The suction surface A311 is located between the two. The first positioning member A314 has a circular first positioning hole A316 recessed on it, and the second positioning member A315 has an elongated elliptical second positioning hole A317 recessed on it.

[0171] Please see Figure 7 , 8 The calibration device B is equipped with a calibration platform B1 and a cleaning mechanism B2;

[0172] The calibration platform B1 is supported by two upright supports B11, which support a calibration seat B12. The calibration seat B12 is provided with a horizontal calibration surface B121. A limiting member B122 is provided on each side of the calibration seat B12 along the X-axis. A limiting pin B123 is protruding on the limiting member B122. The calibration surface B121 is located between the two limiting members B122.

[0173] The cleaning mechanism B2 is located on the side of the calibration seat B12 located on the Y-axis. The cleaning mechanism B2 has a horizontal and elongated air port B21 near the calibration surface B121. The air port B21 is connected to an air passage B22. The air passage B22 is connected to an external positive pressure unit (not shown) via multiple air pipes B23.

[0174] Please see Figure 9 , 10 11. The adhesive applicator C is provided with an adhesive tray platform C1, an adhesive tray drive mechanism C2, an adhesive tray C3 and an adhesive scraping mechanism C4.

[0175] The tray platform C1 is supported by two upright brackets C11 and a base C12. The base C12 is provided with a limiting member C121 on each side of the X-axis. A limiting pin C122 protrudes from the limiting member C121.

[0176] The disc drive mechanism C2 is mounted on the disc platform C1. The disc drive mechanism C2 has a Y-axis slide rail C21 between the two limiting members C121 for a slide block C22 to slide on. Below the platform C12, there is a driver C23, such as a pneumatic cylinder, which can drive a connecting member C231 passing through the slot of the platform C12 to drive the slide block C22 to move horizontally back and forth in the Y-axis on the disc platform C1.

[0177] The rubber tray C3 is mounted on the slide C22 of the rubber tray drive mechanism C2, and can be driven to move horizontally back and forth in the Y-axis relative to the rubber tray platform C1. The rubber tray C3 is composed of a rubber seat C31 with a U-shaped cross section in the X-axis direction, two long strip-shaped mounting members C32, and two long strip-shaped stop members C33. The mounting members C32 are located on both sides of the rubber seat C31 in the Y-axis direction, and the stop members C33 are correspondingly located on the mounting members C32. The rubber seat C31, the mounting members C32, and the stop members C33 form a glue-coating area C34, and two long strip-shaped magnetic members C35 are provided on the mounting members C32 on both sides of the glue-coating area C34.

[0178] The glue-scraping mechanism C4 is mounted on the glue tray platform C1, and it has two scrapers C41 and a glue storage area C42; the scrapers C41 extend into the glue application area C34 and maintain a preset glue dispensing gap d with the upper surface of the glue holder C31. Figure 12 The resin storage area C42 is located between the two scrapers C41 to store the resin W2' to be cured. When the glue tray C3 moves horizontally back and forth relative to the scraper mechanism C4, the resin W2' can flow out through the gap d to the glue application area C31 and be smoothed to a preset height by the scraper C41.

[0179] Please see Figure 13 , 14The hardening device D is equipped with a hardening mechanism D1 and a membrane conveying mechanism D2;

[0180] The hardening mechanism D1 is supported by two upright brackets D11 and a fixed base D12. A hardening light source D13 that can emit, for example, UV light is located below the fixed base D12. The fixed base D12 is provided with a first hollow section D121 corresponding to the hardening light source D13. A bushing D122 is provided at each of the four corners of the fixed base D12. A guide member D123, for example, a roller is provided on each of the two sides of the fixed base D12 located on the Y-axis.

[0181] Above the fixed base D12 is a mounting base D14, which has a second hollow section D141 corresponding to the first hollow section D121; the mounting base D14 has a limiting member D142 on each side of the X-axis, and a limiting pin D143 protrudes from the limiting member D142; the mounting base D14 has a mounting part D144 on each side of the Y-axis, and a horizontal light-transmitting plate D15, such as glass, is installed between the mounting parts D144 on both sides and covers the second hollow section D141;

[0182] Above the light-transmitting plate D15 is a movable pressure plate D16, which has a third hollow section D161 corresponding to the light-transmitting plate D15; the pressure plate D16 has a long slot D162 on each side along the X-axis corresponding to the limiting member D142.

[0183] The pressure plate D16 is driven by a lifting mechanism D17. The lifting mechanism D17 has four lifting rods D171, the upper ends of which pass through the bushing D122 and connect to the pressure plate D16, and the lower ends of which pass through the machine table T and connect to a lifting plate D172. The lifting plate D172 is driven by a driver D173, such as a pneumatic cylinder, to move vertically back and forth along the Z-axis, so as to drive the lifting rods D171 to move the pressure plate D16 selectively closer to or away from the light-transmitting plate D15.

[0184] Please see Figure 14 , 15 The film conveying mechanism D2 is provided with a light-transmitting film P, a film feeding mechanism D21, a film taking-up mechanism D22 and a tension adjustment mechanism D23; the film feeding mechanism D21 is located on one side of the hardening mechanism D1 located in the Y-axis direction, and the film taking-up mechanism D22 and the tension adjustment mechanism D23 are located on the other side of the hardening mechanism D1 located in the Y-axis direction.

[0185] The light-transmitting film P is made of, for example, PFT material. The light-transmitting film P is fed out from the tape feeding mechanism D21, passes through the hardening mechanism D1, and is wound up by the tape taking mechanism D22. When the light-transmitting film P passes through the hardening mechanism D1, it is selectively moved closer to or further away from the light-transmitting plate D15 by the pressure plate D16, so as to selectively press and clamp the light-transmitting film P located between the light-transmitting plate D15 and the pressure plate D16.

[0186] The tape feeding mechanism D21 is provided with a tape feeding reel D211, such as a roller, and one end of the light-transmitting film P is wound around the tape feeding reel D211.

[0187] The take-up mechanism D22 is provided with a take-up reel D221, such as a roller, and the other end of the light-transmitting film P is wound onto the take-up reel D221; the take-up reel D221 can be selectively rotated clockwise by a driver D222, such as a motor, to pull the light-transmitting film P located in the unloading mechanism D21 away from the unloading mechanism D21 to the take-up mechanism D22;

[0188] The tension adjustment mechanism D23 is located between the hardening mechanism D1 and the take-up mechanism D22. The tension adjustment mechanism D23 has a driven component D231 that can be displaced in the Z-axis relative to a support D232. The support D232 has a sensor D233 that can sense the position of the driven component D231 and send a control signal to control the operation of the driver D222. The light-transmitting film P passes around and lifts the driven component D231. When the tension of the light-transmitting film P is large, the driven component D231 is lifted upward by the light-transmitting film P. After sensing the upward displacement of the driven component D231, the sensor D233 sends a control signal to control the driver D222 to stop operating. When the tension of the light-transmitting film P is small, the driven component D231 is displaced downward, and the sensor D233 sends a control signal to control the driver D222 to start operating.

[0189] Please see Figure 16 , 17 The unloading device E is equipped with a frame E1, an unloading mechanism E2 and an unloading box E3;

[0190] The frame E1 has a limiting seat E11 on a bracket E12. The limiting seat E11 is U-shaped with a notch facing the unloading mechanism E2 and has a hollowed-out unloading port E111. The unloading port E111 is located on the conveying flow path. The limiting seat E11 has two horizontal and equal-height abutment surfaces E112 on both sides of the unloading port E111. The height of the abutment surfaces E112 is slightly lower than the horizontal upper surface E113 of the limiting seat E11. The unloading port E111 is rectangular and corresponds to the carrier plate M. Figure 2 );

[0191] The unloading mechanism E2 is mounted on the frame E1 on one side of the conveying flow path and located on one side of the unloading port E111. The unloading mechanism E2 has an unloading component E21 with a wedge and a driver E22, such as a pneumatic cylinder. The driver E22 is mounted on a mounting bracket E13 of the frame E1. The unloading component E21 can be driven by the driver E22 to move horizontally back and forth in the Y-axis within the unloading port E111. The unloading component E21 has a horizontal upper surface E211 and an inclined side surface E212.

[0192] The unloading box E3 can be selectively stored below the limiting seat E11. The unloading box E3 has an opening E31 corresponding to the unloading port E111 and a handle E32 for the operator to hold and move the unloading box E3.

[0193] Please see Figure 18 The supply device F includes a supply box F1, a feeding lifting mechanism F2, a feeding channel F3, and a first pushing mechanism F4; the supply box F1 contains multiple slots F11 for supplying multiple carrier plates M. Figure 3 The supply boxes F1 are stacked at fixed intervals, and the two sides of the supply box F1 are provided with openings along the X-axis; the supply lifting mechanism F2 can drive the supply box F1 to move along the Z-axis to correspond to the supply channel F3; the first pushing mechanism F4 can push the carrier plate M stacked in the supply box F1 into the supply channel F3.

[0194] Please see Figure 19 The collection device G includes a collection box G1, a material receiving lifting mechanism G2, a material receiving channel G3, and a second pushing mechanism G4; the collection box G1 contains multiple slots G11 for multiple carrier plates M ( Figure 3 The collection boxes G1 are stacked at fixed intervals, and the two sides of the collection box G1 are provided with openings along the X-axis; the material receiving lifting mechanism G2 can drive the collection box G1 to move along the Z-axis to correspond to the material receiving channel G3; the second material pushing mechanism G4 can push the carrier plate M on the material receiving channel G3 into the collection box G1.

[0195] In the implementation of the electronic component back film method and apparatus of the present invention, a carrier plate M holding multiple coils W1 is placed on the supply device F with the side of the adhesive film N attached facing down; the conveying device A uses the suction nozzle A312 on the suction nozzle seat A31 to adsorb the upper side of the carrier plate M, so that the carrier plate M with multiple coils W1 attached to the lower side is taken out from the supply device F and conveyed to the calibration device B in an X-axis conveying flow path;

[0196] After the carrier plate M reaches the calibration device B, the suction nozzle seat A31 descends, causing the lower side of the coil W1 to press against the calibration surface B121 of the calibration device B, so that the lower side of the coil W1 is aligned at the same horizontal height. When the lower side of the coil W1 presses against the calibration surface B121, the suction nozzle seat A31 simultaneously presses against the two limiting members B122 on both sides of the calibration surface B121, and the limiting pins B123 pass through the corresponding first positioning hole A315 and the second positioning hole A316, so that the suction nozzle seat A31 is restricted to a preset height, so as not to descend excessively and damage the coil W1. At the same time, the air port B21 provides positive pressure gas to blow onto the coil W1 to clean the dust on the coil W1.

[0197] After calibration, the carrier plate M is then transported by the conveying device A from the calibration device B to the adhesive applicator C. Upon arrival at the adhesive applicator C, the suction nozzle A31 descends, immersing the lower side of the coil W1 into the adhesive tray C3 to adhere to the resin W2' located in the adhesive applicator area C34. Because the lower side of the coil W1 is first aligned at the same horizontal level before immersion, the risk of the coil W1 slipping off the adhesive film N under gravity is reduced. The difference between the preset depth and the actual depth of the immersion caused by the vertical drop; when the lower side of the coil W1 is immersed into the plastic tray C3, the suction nozzle seat A31 presses against the two limiting members C121 on both sides of the plastic tray C3, and the limiting pin C122 passes through the corresponding first positioning hole A315 and the second positioning hole A316, so that the suction nozzle seat A31 is restricted at the preset height, so that the coil W1 does not touch the upper surface of the plastic seat C31;

[0198] After the adhesive application is completed, the carrier plate M is then transported by the conveying device A from the adhesive application device C to the curing device D. Upon arrival at the curing device D, the suction nozzle A31 descends, causing the resin W2' adhering to the lower side of the coil W1 to first contact the light-transmitting film P, and then press against the light-transmitting plate D15, separating the light-transmitting plate D15 from the resin W2' by the light-transmitting film P to prevent the resin W2' from adhering and contaminating the light-transmitting plate D15. The resin W2' adhering to the lower side of the coil W1 is pressed against the light-transmitting plate D15 through the light-transmitting film P', forming a flat surface, and then irradiated by the curing light source D13, causing the resin W2' to adhere... The resin W2' on the lower side of the coil W1 is hardened by the hardening light source D13 to form the back film W2, which can reduce the unevenness caused by the resin W2' sagging or accumulating in specific parts of the coil W1 due to gravity; and when the resin W2' adhering to the lower side of the coil W1 is pressed against the light-transmitting plate D15, the suction nozzle seat A31 is pressed against the two limiting members D142 on both sides of the light-transmitting plate D15, and the limiting pin D143 passes through the corresponding first positioning hole A315 and the second positioning hole A316, so that the suction nozzle seat A31 is restricted to a preset height, so as not to drop excessively and damage the coil W1;

[0199] After hardening is complete, the carrier plate M is then transported by the conveying device A from the hardening device D to the unloading device E, whereby the coil W1 is collected by the unloading device E. Upon reaching the unloading device E, the suction nozzle seat A31 descends, pressing the two sides of the carrier plate M2 against the two contact surfaces E112 on either side of the unloading port E111. Then, the relative displacement between the carrier plate M and the unloading component E21 causes the coil W1 adhered to the carrier plate M to separate from it. When the coil W1 separates from the carrier plate M, the carrier plate M remains stationary on the two contact surfaces. On surface E112, and driven by driver E22, the unloading component E21 moves from one side of the unloading port E111 in a direction perpendicular to the conveying flow path toward the other side of the unloading port E111 to peel off the coil W1, so that the coil W1 falls into the unloading box E3 for collection; during the displacement process, the unloading component E21 maintains a preset distance from the carrier plate M and the upper surface E211 remains parallel to the carrier plate M, and the tip of the unloading component E21 only contacts one of the flanges W12 of the coil W1 and applies force to peel off the coil W1 (e.g. Figure 20 );

[0200] After unloading is completed, the carrier plate M without the coil W1 attached is then transported by the conveying device A away from the unloading device E to the collecting device G for collection; after the carrier plate M is collected by the collecting device G, the suction nozzle A31 can return to the top of the supply device F, thus completing one cycle of the electronic component back film.

[0201] In each cycle, after the resin W2' in the adhesive applicator C is impregnated, it will be smoothed again by the displacement of the adhesive tray C3 relative to the scraping mechanism C4. When a coil W1 falls into the adhesive tray C3, the coil W1 can also be pushed to both sides of the adhesive tray C3 by the scraper C41 and attracted by the magnetic component C35 without affecting the next impregnation. After the light-transmitting film P on the hardening device D is used, it can be driven to move relative to the light-transmitting plate D15, so that the unused light-transmitting film P moves to the light-transmitting plate D15. When the light-transmitting film P moves, the light-transmitting plate D15 and the pressure plate D16 do not clamp the light-transmitting film P.

[0202] The electronic component back-coating method and apparatus of the present invention, wherein the conveying device A sequentially conveys the carrier plate M on which the coil W1 is adhered to to the adhesive device C, the hardening device D and the unloading device E, not only automates the electronic component back-coating operation, but also automatically separates the coil W1 after back-coating from the carrier plate M, saving the time and manpower required for subsequent manual separation.

[0203] The above description is merely a preferred embodiment of the present invention and should not be construed as limiting the scope of the present invention. Any simple equivalent changes and modifications made in accordance with the scope of the patent application and the description of the invention shall still fall within the scope of the patent of the present invention.

Claims

1. An electronic component back-filming equipment, wherein a machine table is equipped with: A conveying device can convey a carrier plate holding multiple coils through a conveying flow path; the conveying device uses a suction nozzle to adsorb the carrier plate, and a double-sided adhesive film is provided between the carrier plate and the coils, with one side attached to the carrier plate and the other side adhering to and holding the coils. A calibration device is provided on the table of the machine tool, which can simultaneously calibrate the coil held on the carrier plate; the calibration device is provided with a calibration platform. A glue-applying device is located downstream of the calibration device in the conveying flow path, which can store resin to be cured for the coil held on the carrier plate to be applied; the glue-applying device is provided with a glue tray; A hardening device is located downstream of the adhesive applicator in the conveying flow path, which can harden the resin adhering to the coil; the hardening device is equipped with a hardening light source. A discharge device is located downstream of the hardening device in the conveying flow path, which can separate the coil from the carrier plate and collect the coil; the discharge device is provided with a discharge component and a discharge box; The conveying device transports the carrier plate sequentially to the alignment device, the adhesive application device, the hardening device, and the unloading device for different operations; in, The calibration platform has a horizontal calibration surface for the lower side of the coil to press against, so that the lower side of the coil is aligned with the same horizontal height.

2. The electronic component backsheet equipment as described in claim 1, wherein, The calibration platform is provided with a calibration seat, the calibration seat is provided with a calibration surface, and a limiting member is provided on each side of the calibration seat. A limiting pin is protruding on the limiting member, and the calibration surface is located between the two limiting members.

3. The electronic component backsheet equipment as described in claim 2, wherein, The calibration device is equipped with a cleaning mechanism located on one side of the calibration base. The cleaning mechanism has an air port near the calibration surface, which provides positive pressure gas to blow onto the coil to clean the dust located on the coil.

4. The electronic component backsheet equipment as described in claim 1, wherein, The carrier plate is attracted and transported by the suction nozzle seat of the conveying device; after the carrier plate arrives at the unloading device, the carrier plate is pressed against two surfaces on both sides of the unloading port of a limiting seat.

5. The electronic component backsheet apparatus as described in claim 4, wherein, The unloading component can be driven by a driver to move horizontally back and forth within the unloading port to peel off the coil; the unloading box is housed below the limiting seat, and the coil falls into the unloading box after separating from the carrier plate and is collected.

6. The electronic component backsheet apparatus as described in claim 5, wherein, When the coil separates from the carrier plate, the carrier plate remains stationary and the unloading component is driven to displace and peel off the coil.

7. The electronic component backsheet apparatus as described in claim 5, wherein, During the displacement process, the unloading component maintains a preset distance from the carrier plate; one end of the unloading component contacts one of the flanges of the coil.

8. The electronic component backsheet apparatus as described in claim 1, wherein, A supply device and a collection device are respectively located on both sides of the machine table. The supply device supplies a carrier plate holding the coil, and the carrier plate without the coil is transported to the collection device for collection.

9. The electronic component backsheet apparatus as described in claim 1, wherein, The curing device is provided with a horizontal light-transmitting plate, so that the resin adhering to the lower side of the coil is pressed against the light-transmitting plate to form a flat surface, and then irradiated by the curing light source; when the resin is pressed against the light-transmitting plate, the light-transmitting plate and the resin are separated by a light-transmitting film, which can be driven to move relative to the light-transmitting plate.

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