Heat dissipating devices, apparatuses, racks and systems

Abstract

A heat dissipation device (10), equipment, rack (60) and system, the heat dissipation device (10) mainly includes heat-conducting plate (13), the first surface (121) of heat-conducting plate (13) is provided with liquid passage;Mounting base (12) is provided with containing cavity (122) for containing the area of heat-conducting plate (13) including second surface (126), first surface (121) and second surface (126) are oppositely arranged;Pressing plate (11) is used for fixing heat-conducting plate (13) in containing cavity (122);Wherein, pressing plate (11) is detachably fixedly connected with mounting base (12), and sealing cavity is formed between pressing plate (11) and the first surface (121) of heat-conducting plate (13), and the sealing cavity is used for containing liquid passage, and the liquid inlet connector (113) and liquid outlet connector (112) are provided on pressing plate (11) and communicated with liquid passage.In the above structure, the whole heat dissipation device (10) adopts modular standard split structure, and the pressing plate (11) and mounting base (12) can be made into standard parts, when the chips with different heat dissipation requirements are cooled, only the corresponding heat-conducting plate (13) needs to be selected according to the needs, and the mounting base (12) and pressing plate (11) can be continued to use, which improves the adaptability of the heat dissipation device (10).

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and in particular to a heat dissipation device, equipment, rack, and system. Background Technology

[0002] With the rapid development of information technology (IT), the processing speed of chips in devices (such as servers and storage devices) is getting faster and faster. As the processing power of chips increases, the heat they generate also increases. Traditional devices mostly use liquid cooling to dissipate heat from the chips.

[0003] Liquid cooling requires mounting a liquid cooling system on the chip, where a circulating liquid dissipates heat. When assembling a liquid cooling system, it is often a single, integrated structure, fixed to the chip using floating screws. However, this integrated structure requires adaptation to the specifications of each chip when cooling different chip sizes, and also necessitates consideration of the device layout within the device containing the chip. This results in a wide variety of cooling system specifications. Summary of the Invention

[0004] This application provides a heat dissipation device, equipment, rack, and system to improve the adaptability of the heat dissipation device.

[0005] Firstly, a heat dissipation device is provided for cooling a chip. This device employs a split structure, primarily comprising a heat-conducting plate, a mounting base, and a pressure plate, arranged in a sandwich-like stacked configuration, with the heat-conducting plate located between the mounting base and the pressure plate. The heat-conducting plate includes a first surface and a second surface arranged opposite to each other. The mounting base supports the heat-conducting plate and has a cavity for accommodating a portion of the heat-conducting plate, including the second surface. The heat-conducting plate serves as the main structure of the heat dissipation device, and its first surface has a liquid channel for liquid flow. The pressure plate secures the heat-conducting plate within the cavity of the mounting base. The pressure plate is detachably connected to the mounting base, forming a sealed cavity between the pressure plate and the first surface of the heat-conducting plate to accommodate the liquid channel. Furthermore, the pressure plate has an inlet connector and an outlet connector communicating with the liquid channel. In use, the inlet connector and outlet connector are connected to external pipes. Liquid flows into the liquid channel through the inlet connector to dissipate heat from the chip, and then flows out through the outlet connector to an external pipe, forming a circulation. In this structure, the entire heat dissipation device adopts a modular, standard, split-type structure. The pressure plate and mounting base can be made into standard parts. When dissipating heat from chips with different cooling requirements, only the corresponding heat-conducting plate needs to be selected as required, and the mounting base and pressure plate can still be reused. Compared to a monolithic liquid cooling device, it eliminates the need to select different liquid cooling devices for different chips, offering greater versatility and improved adaptability. Furthermore, the modular standard reduces the manufacturing difficulty of the heat dissipation device, simplifying the manufacturing process.

[0006] In one possible design, the heat-conducting plate includes a base plate for mounting within the receiving cavity, and a heat dissipation structure fixedly disposed on the base plate, wherein the heat dissipation structure is the liquid channel. The relative fixation of the base plate and the receiving cavity is achieved through the cooperation between the base plate and the receiving cavity.

[0007] In another possible design, the pressure plate is provided with a receiving groove to accommodate the heat dissipation structure. The receiving groove covers and seals the liquid channel.

[0008] In another possible design, the heat dissipation structure can be a pipe, a trench, or a capillary structure. That is, different structures can be used to form liquid channels.

[0009] In another possible design, the pressure plate and the base plate are sealed together by a gasket. The gasket achieves a seal between the pressure plate and the liquid channel.

[0010] In another possible design, a placement groove is provided on the substrate, and the sealing gasket is disposed in the placement groove.

[0011] In another possible design, a first limiting protrusion is provided within the receiving cavity of the mounting base; a second limiting protrusion is provided on the substrate to engage with the first limiting protrusion. The engagement of the first and second limiting protrusions allows the pressure plate to press the heat-conducting plate firmly onto the mounting base. The mounting base adopts a frame-shaped hollow structure, allowing the heat-conducting plate to be directly connected to the chip via thermally conductive adhesive or other thermally conductive media, thus improving the heat transfer effect of the heat-conducting plate to the chip.

[0012] In another possible design, the substrate is provided with a third limiting protrusion that presses against the surface of the mounting base. The engagement of the third limiting protrusion with the mounting base allows the pressure plate to press the heat-conducting plate firmly onto the mounting base.

[0013] In another possible design, the heat dissipation device further includes a pressure cap that is detachably fixed to the mounting base and presses the pressure plate against the heat-conducting plate.

[0014] In another possible design, the rigidity of the gland is greater than that of the pressure plate. The gland further secures the liquid channel between the pressure plate and the heat-conducting plate, preventing liquid leakage from the heat dissipation device. On the other hand, when the liquid flows too fast in the liquid channel, the pressure plate needs to bear a large force, which can easily cause it to expand. The reinforcing structure of the gland can also help the gland bear a certain force, preventing problems such as pressure plate expansion and liquid flow issues.

[0015] In another possible design, at least one of the inlet and outlet connectors is rotatably connected to the pressure plate. When the inlet or outlet connector is rotatably configured, the connection direction of the inlet and outlet connectors can be adjusted, thereby allowing for adjustments to the position of the inlet and outlet connectors connected to external pipes according to specific implementation needs. This reduces the space requirements of the radiator and improves its adaptability.

[0016] In another possible design, both the inlet connector and the outlet connector are fixedly connected to the pressure plate.

[0017] In another possible design, both the inlet and outlet connectors are inverted L-shaped connectors.

[0018] In another possible design, the inlet connector and the outlet connector are respectively sealed to the pressure plate by sealing rings, thereby ensuring the sealing of the connection.

[0019] In another possible design, the gland presses the outlet and inlet connectors against the pressure plate. The gland defines the position of the outlet and inlet connectors.

[0020] In another possible design, the pressure plate has bosses corresponding one-to-one with the liquid inlet connector and the liquid outlet connector, each boss having a mounting groove; the liquid inlet connector or the liquid outlet connector has a shoulder fitted into the mounting groove, and the pressure cap presses the shoulder into the mounting groove.

[0021] In another possible design, the shoulder can rotate relative to the mounting groove when the gland is not pressing the shoulder tightly into the mounting groove.

[0022] In another possible design, the sidewall of the mounting groove is provided with multiple limiting protrusions; and the shoulder is provided with a limiting groove that mates with each limiting protrusion; or, the sidewall of the mounting groove is provided with multiple limiting grooves, and the shoulder is provided with a limiting protrusion that mates with each limiting groove.

[0023] In another possible design, the pressure plate is rectangular, and the inlet and outlet connectors are arranged diagonally. Alternatively, the inlet and outlet connectors can be located on the same side of the pressure plate.

[0024] In another possible design, the mounting base is equipped with floating screws for connecting to the chip, ensuring sufficient pressure when connecting to the chip.

[0025] In another possible design, the second surface of the heat-conducting plate is at least greater than or equal to the surface area of ​​the chip to be cooled, wherein the second surface is the surface of the chip used for thermally conductive connection with the heat-conducting plate.

[0026] In another possible design, the sealed cavity is filled with liquid, which flows through the liquid channel.

[0027] In another possible design, the heat dissipation device is used to connect to a cooling system; the cooled liquid in the cooling system enters the sealed cavity of the heat dissipation device, the heat generated by the chip is transferred to the liquid through a heat-conducting plate, the liquid absorbs the heat and its temperature rises, and the high-temperature liquid flows back to the cooling system for cooling.

[0028] Secondly, a device is provided, comprising a motherboard, a chip mounted on the motherboard, and a heat dissipation device as described above, fixedly connected to the motherboard and used for heat dissipation of the chip. In this structure, the entire heat dissipation device adopts a modular, standard, split-type structure, wherein the pressure plate and mounting base can be made as standard parts. When dissipating heat from chips with different heat dissipation requirements, only the corresponding heat-conducting plate needs to be selected as required, and the mounting base and pressure plate can still be reused. Compared to the existing integrated liquid cooling devices that require different liquid cooling devices for different chips, this improves the adaptability of the heat dissipation device. Furthermore, the modular standard reduces the manufacturing difficulty of the heat dissipation device and facilitates processing.

[0029] In one possible design, a cooling system is also included, comprising an inlet pipe and an outlet pipe. The inlet pipe is sealed to the inlet connector, and the outlet pipe is sealed to the outlet connector. The cooling system and the heat dissipation device work together to form a loop for cooling the chip.

[0030] Thirdly, a rack is provided, which includes the aforementioned heat dissipation device or the aforementioned equipment.

[0031] Fourthly, a system is provided, comprising a heat dissipation device and a refrigeration system as described in the first aspect or any possible implementation thereof, wherein the refrigeration system includes a power device for realizing liquid flow in a liquid channel of the heat dissipation device and a refrigeration device for cooling the liquid in the heat dissipation device.

[0032] Based on the implementation methods provided in the above aspects, this application can be further combined to provide more implementation methods. Attached Figure Description

[0033] Figure 1 A schematic diagram of the structure of a device provided in this application;

[0034] Figure 2 A schematic diagram of a heat dissipation device provided in this application;

[0035] Figure 3 An exploded view of a heat dissipation device provided in this application;

[0036] Figure 4 This is a structural schematic diagram of the first type of mounting base provided in this application;

[0037] Figure 5 A schematic diagram illustrating the first type of mounting base and heat-conducting plate provided in this application;

[0038] Figure 6This is a structural schematic diagram of the second type of mounting base provided in this application;

[0039] Figure 7 A schematic diagram illustrating the fit between the second type of mounting base and the heat-conducting plate provided in this application;

[0040] Figure 8 A schematic diagram of the third type of mounting base provided in this application;

[0041] Figure 9 A cross-sectional view of the third type of mounting base provided in this application when it is in conjunction with the chip;

[0042] Figure 10 This is a schematic diagram of the structure of the first type of heat-conducting plate provided in this application;

[0043] Figure 11 An exploded view of the first type of heat-conducting plate provided in this application;

[0044] Figure 12 A cross-sectional view of a heat dissipation device provided in this application;

[0045] Figure 13 This is a schematic diagram of the structure of the second type of heat-conducting plate provided in this application;

[0046] Figure 14 This is a schematic diagram of the structure of the third type of heat-conducting plate provided in this application;

[0047] Figure 15 A schematic diagram of the structure of a pressure plate provided in this application;

[0048] Figure 16 for Figure 15 Sectional view at point AA;

[0049] Figure 17 An exploded view of the pressure plate provided in this application;

[0050] Figures 18-21 A schematic diagram of the rotation of the liquid outlet connector provided in this application;

[0051] Figure 22 A schematic diagram illustrating the fit between the pressure plate and the pressure cap provided in this application;

[0052] Figure 23 A schematic diagram illustrating the application of the heat dissipation device provided in this application;

[0053] Figure 24 A schematic diagram of the rack provided in this application;

[0054] Figure 25 This is a schematic diagram showing the connection between the heat dissipation device and the refrigeration system provided in this application.

[0055] Figure label:

[0056] 10-Heat dissipation device; 11-Pressure plate; 111-Receiving tank; 112-Liquid outlet connector

[0057] 113-Inlet connector; 1131-Protruding structure; 1132-Shoulder; 1133-Limiting groove

[0058] 114-Sealing ring; 115-Boss; 1151-Limiting protrusion; 1152-Mounting groove

[0059] 12-Mounting base; 121-Surface; 122-Receiving cavity; 123-Limiting protrusion

[0060] 124 - Assembly hole; 125 - Mounting hole; 126 - Surface; 13 - Heat-conducting plate

[0061] 131-Limiting protrusion; 132-Limiting protrusion; 133-Substrate; 1331-Placement groove

[0062] 134 - Sealing gasket; 135 - Heat dissipation structure; 1351 - Capillary structure; 1352 - Metal sheet

[0063] 1353-Pipeline 136-Surface 137-Surface 14-Gland

[0064] 141-Through Hole 20-Chip 30-Main Board 40-Connector

[0065] 50-Refrigeration unit; 51-Liquid inlet pipe; 52-Liquid outlet pipe; 60-Frame.

[0066] 61-Inlet pipe 62-Outlet pipe 70-Power unit Detailed Implementation

[0067] To facilitate understanding, the application scenarios of the heat dissipation device provided in this application will be explained first.

[0068] The heat dissipation device provided in this application is used to dissipate heat from the chips in the device. This device can be a server, storage device, router, or switch, etc. The storage device includes data storage devices such as storage arrays or backup devices. Figure 1 The schematic diagram of a device provided in this application is shown in the figure. The device includes a heat dissipation device 10, a chip 20, a motherboard 30, and a connector 40. During the assembly of the device, the chip 20 is supported by the motherboard 30 (also known as a printed circuit board, PCB). The heat dissipation device 10 and the motherboard 30 supporting the chip 20 are fixedly connected by the connector 40, and this fixed connection is detachable.

[0069] It should be understood that the chip carried by the motherboard 30 described above is only one example. The chip 20 can also be carried by other parts of the device, and this application does not limit this.

[0070] The heat dissipation device 10 can dissipate heat from the chip 20. The effective heat dissipation surface area of ​​the heat dissipation device can be greater than or equal to the surface area of ​​the chip to be cooled that contacts the heat dissipation device, so as to ensure effective heat dissipation of the chip. Herein, the effective heat dissipation surface of the heat dissipation device refers to the surface area of ​​the heat dissipation device used to connect with the chip to be cooled. This part is used to conduct the heat generated by the chip to be cooled to the heat dissipation device 10, and then the heat dissipation device 10 conducts the heat to the outside of the device, thereby realizing the heat dissipation function of the chip. Figure 1 The heat dissipation device 10 shown can dissipate heat for only one chip 20, or it can dissipate heat for multiple chips 20 at the same time.

[0071] Optionally, when the same heat dissipation device dissipates heat from multiple chips, to ensure effective heat dissipation for all chips, the area of ​​the effective heat dissipation surface of the heat dissipation device can be greater than or equal to the area of ​​the surfaces of all chips in contact with the heat dissipation device. For ease of description, in the following embodiments of this application, ... Figure 1 The following example illustrates how the same heat dissipation device can only dissipate heat from one chip.

[0072] Figure 2 This is a schematic diagram of a heat dissipation device provided in this application. Figure 3 This is an exploded view of a heat dissipation device provided in this application. Figure 2 and Figure 3 As shown, the heat dissipation device mainly includes a mounting base 12, a heat-conducting plate 13, and a pressure plate 11. The mounting base 12 is used for... Figure 1 The connector 40 is fixed to the motherboard 30, while the heat-conducting plate 13 is used to conduct heat to the chip 20, and the pressure plate 11 is used to fix the heat-conducting plate 13 to the mounting base 12. During assembly, the mounting base 12, heat-conducting plate 13, and pressure plate 11 are stacked in a sandwich-like manner, with the heat-conducting plate 13 located between the mounting base 12 and the pressure plate 11. The pressure plate 11 and the mounting base 12 are connected in a detachable manner, such as... Figure 3 The pressure plate 11 shown in the diagram presses the heat-conducting plate 13 onto the mounting base 12 via threaded connectors 14 (such as bolts or screws). The pressure plate 11 can be made of metal materials such as aluminum, iron, steel, or alloys, or it can be made of plastic or rubber materials. The dimensions of the pressure plate 11 are adapted to the heat-conducting plate 13, and the area of ​​the pressure plate 11 can be greater than or equal to the area of ​​the heat-conducting plate 13, thereby ensuring that the pressure plate 11 has sufficient size to cover the surface of the heat-conducting plate 13.

[0073] refer to Figure 4 and Figure 5 , Figure 4 This is a structural schematic diagram of the first type of mounting base provided in this application. Figure 5 This is a cross-sectional view of a mounting base combined with a heat-conducting plate provided in this application. Figure 5 For along Figure 2 The diagram shows a cross-sectional view of the mounting base, cut along its stacking direction, of the pressure plate, heat-conducting plate, and mounting base. The mounting base 12 is a hollow frame structure with two opposing surfaces: surface 121 and surface 126. Surface 121 is used to attach the heat-conducting plate, and surface 126 is used to connect to the chip. For ease of description, surface 121 can also be referred to as the first surface, and surface 126 as the second surface. (Reference) Figure 4 The mounting base 12 serves as a connection structure for the heat dissipation device to cooperate with the chip. Multiple mounting holes 125 are provided along the edge of the mounting base 12. When the heat dissipation device is fixed to the chip, it is connected to the motherboard supporting the chip via threaded connectors (bolts or screws) passing through the mounting holes 125. This connection structure is detachable. Figure 4 The mounting base 12 shown has four mounting holes 125, which are located in the corner area of ​​the frame. Additionally, the mounting base 12 has multiple assembly holes 124 for threaded fasteners (bolts or screws) to pass through, thus securing the pressure plate. These assembly holes 124 surround the hollow portion of the mounting base 12. Figure 4 Only one arrangement of mounting holes 125 and assembly holes 124 is shown. In specific implementation, the number of mounting holes 125 and assembly holes 124 does not constitute a limitation on this application. The number and position of mounting holes 125 and assembly holes 124 can be set on the mounting base 12 according to the actual installation needs.

[0074] refer to Figure 4 The hollow portion of the mounting base 12 serves as a receiving cavity 122 for placing the heat-conducting plate. The hollow portion of the mounting base 12 refers to a hole formed within an area centered on the center point of the mounting base 12. The cross-section of this area can be rectangular, square, circular, or other shapes, specifically matching the shape of the portion of the heat-conducting plate placed within the receiving cavity. The center point refers to the location of the center of the mounting base; for example, when the mounting base 12 has a rectangular structure, the center point is the intersection of the diagonals. (Reference) Figure 5 When assembling the heat-conducting plate 13, insert part of the heat-conducting plate 13 into... Figure 4 In the cavity 122 shown, as Figure 5 As shown, the structure of the heat-conducting plate 13 will also be explained. The heat-conducting plate 13 includes a substrate 133 and a heat dissipation structure 135 disposed on the substrate, wherein the substrate 133 is inserted into the receiving cavity. In specific assembly, as shown... Figure 5As shown, a limiting protrusion 123 is provided within the receiving cavity 122, and the limiting protrusion 123 is arranged around the inner wall of the receiving cavity 122, with its position close to the surface 126 of the mounting base 12. The base plate 133 of the heat-conducting plate 13 has a limiting protrusion 131 that engages with the limiting protrusion 123. The limiting protrusion 123 in the mounting base 12 can also be referred to as the first limiting protrusion, and the limiting protrusion 131 of the heat-conducting plate 13 can also be referred to as the second limiting protrusion. The volume of the receiving cavity 122 can be greater than or equal to the volume of the insertion portion of the heat-conducting plate 13 to ensure that the base 12 and the heat-conducting plate 13 can be smoothly assembled.

[0075] When the heat-conducting plate 13 is inserted into the receiving cavity 122, the limiting protrusion 131 contacts the limiting protrusion 123 and limits the insertion depth of the heat-conducting plate 13, so that the surface 136 of the heat-conducting plate 13 connected to the chip to be cooled is exposed on the surface 121 of the mounting base 12. The surface 136 of the heat-conducting plate 13 is the effective heat dissipation area of ​​the heat dissipation device described above; for simplicity, it can be referred to as the second surface, and the area of ​​the second surface is at least greater than or equal to the surface area of ​​the chip to be cooled. After the heat-conducting plate and the mounting base are assembled, the surface 136 of the heat-conducting plate 13 and the surface 126 of the mounting base 12 can be on the same horizontal plane, allowing the heat-conducting plate 13 to be directly connected to the chip via thermally conductive adhesive or other thermally conductive media.

[0076] Optionally, Figure 5 The middle limiting protrusion 123 is only one example. A structure with multiple limiting protrusions 123 can also be adopted, with multiple limiting protrusions 123 arranged at intervals around the side wall of the receiving groove. Alternatively, other limiting structures can be used to limit the insertion depth of the heat-conducting plate.

[0077] As one possible implementation, Figure 6 The structure of the second mounting base provided in this application is shown. Figure 6 The mounting base shown is in conjunction with Figure 4 or Figure 5 Parts with the same number can be referenced. Figure 4 or Figure 5 .like Figure 6 As shown, the mounting base 12 adopts a frame structure, and... Figure 4 The difference in the mounting base 12 shown is that Figure 6 The frame-shaped cavity 122 shown does not have a limiting protrusion; instead, a limiting structure is provided on the heat-conducting plate 13. For example... Figure 7 As shown, Figure 7 A cross-sectional view is shown when the mounting base 12 is engaged with the heat-conducting plate 13. Figure 7 For along Figure 2 A cross-sectional view of the mounting base cut along the stacking direction of the pressure plate, heat-conducting plate, and mounting base shown in the figure; Figure 7 Zhongyu Figure 5 For parts with the same number, please refer to Figure 5 The description states that a limiting protrusion 132 is provided on the heat-conducting plate 13, which presses against the surface 121 of the mounting base to limit the insertion depth of the heat-conducting plate. For ease of description and distinction... Figure 7 The limiting protrusion 132 shown and Figures 4 to 5 The first and second limiting protrusions mentioned above, and the limiting protrusion 132 can also be referred to as the third limiting protrusion. During assembly, the substrate 133 of the heat-conducting plate 13 is inserted into the receiving cavity 122, and the depth of the heat-conducting plate 13 inserted into the mounting base 12 is limited by the limiting protrusion 132. After assembly, the surface 136 of the heat-conducting plate 13 that is connected to the chip to be cooled and the surface 126 of the mounting base 12 can be located on the same horizontal plane or nearly on the same horizontal plane, and the heat-conducting plate 13 can be directly thermally connected to the chip.

[0078] Optionally, a sealing gasket may also be provided at the edge of the receiving cavity 122 to achieve further sealing and fixation with the limiting protrusion 132 of the heat-conducting plate 13.

[0079] As another possible embodiment Figure 8 This is a structural schematic diagram of the third type of mounting base provided in this application. Figure 9 This is a cross-sectional view of the third type of mounting base provided in this application when it is in conjunction with the chip. Figure 9 For along Figure 2 A cross-sectional view of the mounting base cut along the stacking direction of the pressure plate, heat-conducting plate, and mounting base shown in the figure; Figure 9 Zhongyu Figure 5 For parts with the same number, please refer to Figure 5 The third type of mounting base differs from the first and second types in that the first and second types have hollow frame-shaped cavities, while the third type has a groove structure. Specifically, the thickness of the bottom of the groove in the third type is a first value, which can be set according to specific requirements to ensure that the heatsink can conduct heat from the chip through the bottom of the groove, thereby effectively dissipating heat from the chip. Specifically, the mounting base 12 is a plate-like structure with opposing surfaces 121 and 126. Surface 121 is used to attach the heatsink 13, and surface 126 is used to connect with the chip 20. Surface 121 has a groove, the hollow portion of which forms a cavity 122 for accommodating the heatsink 13. During assembly, the heatsink 13 is fixed in the groove, and when the heatsink 13 is inserted into the groove, it connects to the bottom wall of the groove. When the heat dissipation device is combined with the chip, the heat generated by the chip is transferred to the bottom wall of the mounting base 12, and then conducted to the heat conduction plate 13 through the bottom wall of the mounting base 12.

[0080] Through the above Figure 4 , Figure 6 and Figure 8 It is understood that the mounting base provided in this application can be implemented in different structural forms. It is only necessary that the mounting base has a cavity for accommodating the heat-conducting plate. The specific structure of the cavity on the mounting base and the mating relationship between the mounting base and the heat-conducting plate can be set according to business needs.

[0081] The above text combined Figures 2 to 9 The structure of the mounting base provided in this application has been described. Next, in conjunction with... Figures 10 to 21 The structure of the heat-conducting plate provided in the embodiments of this application is further described.

[0082] The heat-conducting plate provided in this application, as a main component of a heat dissipation device, has opposing first and second surfaces. The first surface of the heat-conducting plate is provided with a liquid channel, and the second surface is used for connection with the chip. In specific implementations, such as... Figure 5 As shown, the heat-conducting plate 13 includes a substrate 133 and a heat dissipation structure 135 fixedly disposed on the substrate. The heat dissipation structure 135 can be different structures such as liquid channels, capillary structures, or pipes. The first surface and the second surface are two opposing surfaces 136 and 137 of the substrate 133. The thickness of the substrate 133 can be set according to the needs of specific implementations, and this application does not limit it. In order to improve the heat conduction effect, the substrate can be made as thin as possible.

[0083] like Figure 10 As shown, Figure 10 This is a schematic diagram of a heat-conducting plate provided in this application. As shown, the substrate 133 of the heat-conducting plate 13 can be wholly or partially fitted into the receiving cavity 122 of the mounting base 12. Furthermore, the shape and structure of the portion of the heat-conducting plate 13 fitted into the receiving cavity 122 match the shape and structure of the receiving cavity of the mounting base 12. When the mounting base 12 adopts... Figure 4 , Figure 6 or Figure 8 When using mounting bases 12 with different structural forms, the substrate 133 can adopt a corresponding structure to adapt to the mounting base 12. For ease of description, the mounting base 12 is described as adopting... Figure 4 Taking the structure shown as an example, refer to Figure 5 and Figure 10 , Figure 10 This is a schematic diagram of the structure of the first type of heat-conducting plate provided in this application. Figure 5 The first type of heat-conducting plate is shown along... Figure 2 A cross-sectional view of the heat-conducting plate cut along the stacking direction of the intermediate pressure plate, heat-conducting plate, and mounting base. First, refer to... Figure 10 The substrate 133 on the heat-conducting plate 13 adopts a rectangular plate structure, as shown in the reference. Figure 5The substrate 133 has opposing surfaces 136 and 137. For ease of description, surface 136 may also be referred to as the second surface of the heat-conducting plate 13, and surface 137 as the first surface of the heat-conducting plate 13. (Continue to the previous section) Figure 5 The sidewall of the substrate 133 is provided with the aforementioned limiting protrusion 131. When the substrate 133 is inserted into the receiving cavity 122, the surface 136 of the substrate 133 is exposed outside the mounting base 12 as a contact surface with the chip; the limiting protrusion 123 contacts the limiting protrusion 131 to limit the position of the heat-conducting plate 13 inserted into the mounting base 12. When the mounting base 12 adopts other structural forms, the substrate 133 of the heat-conducting plate 13 can be provided with corresponding structures so that the substrate 133 can be adapted to the receiving cavity of the mounting base 12.

[0084] refer to Figure 10 The heat dissipation structure 135 of the heat-conducting plate 13 can be a capillary structure 1351. The capillary structure 1351 has multiple interconnected holes that form liquid channels for flow. When the heat-conducting plate 13 is engaged with the mounting base 12, the capillary structure 1351 of the heat-conducting plate 13 is located on the surface 137 of the heat-conducting plate 13 and above the mounting base 12. "Above" refers to... Figure 5 The placement orientation of the heat-conducting plate 13 shown is a reference orientation. (Continue referring to...) Figure 10 , Figure 10 The capillary structure 1351 shown employs a porous structure, for example, a porous structure formed by sintering metal powder or metal mesh. When the capillary structure 1351 is formed using a metal mesh, the metal mesh is woven from metal wires and has a porous structure. It is welded to the substrate 133 through single or multiple layers of mesh to form interconnected liquid channels (not shown in the figure). When the capillary structure 1351 is sintered using metal powder, the metal powder is sintered into spherical granular structures, and gaps are formed between the spherical granular structures, which are interconnected to form liquid channels. However, regardless of whether metal powder or metal mesh is used to prepare the capillary structure 1351, the metal powder or metal mesh is made of metal, alloy, or other materials with good thermal conductivity, such as different metals like copper, aluminum, or iron.

[0085] When the heat-conducting plate adopts the above structure, the pressure plate can seal the liquid channels on the heat-conducting plate, preventing liquid leakage. (Reference) Figure 10 and Figure 11 , Figure 11 This is an exploded view of a heat-conducting plate provided in this application. A placement groove 1331 is provided on the substrate 133 for placing a sealing gasket 134. When the placement groove 1331 is provided, it surrounds the capillary structure 1351. The sealing gasket 134 is disposed in the placement groove 1331, and when the pressure plate contacts the heat-conducting plate 13, the sealing gasket 134 seals the pressure plate and the heat-conducting plate 13.

[0086] Figure 12 A cross-sectional view of a heat dissipation device provided in this application, wherein, Figure 12 For along Figure 2 A schematic diagram showing the cross-section of the stacked pressure plate, heat-conducting plate, and mounting base. As shown, when the pressure plate 11 covers the mounting base 12, the pressure plate 11 and the substrate 133 are sealed together by a sealing gasket 134, and the capillary structure 1351 is sealed within the sealed cavity formed by the substrate 133 and the pressure plate 11. Optionally, a placement groove can be provided on the pressure plate 11 to fix the sealing gasket 134 in the placement groove of the pressure plate 11, which can also achieve a sealed connection between the pressure plate 11 and the substrate 133.

[0087] As one possible embodiment, Figure 13 A schematic diagram of the second type of heat-conducting plate 13 provided in this application, wherein Figure 13 Zhongyu Figure 4 or Figure 5 For parts with the same number, please refer to Figure 11 Description of the heat-conducting plate structure shown. Figure 13 and Figure 11 The difference in the heat-conducting plate 13 shown lies in the different liquid channels of the heat-conducting plate 13. For example... Figure 13 As shown, a plurality of metal sheets 1352 are disposed on the substrate 133, and the plurality of metal sheets 1352 are arranged at intervals to form interconnected liquid channels (not shown in the figure). When the heat-conducting plate 13 mates with the mounting base 12 and the pressure plate, the following can be referenced: Figure 12 The example shown is described below. Of course, as a specific possible implementation, a protrusion can also be provided on the heat-conducting plate 13, and an S-shaped groove can be provided in the protrusion as a liquid channel.

[0088] As another possible embodiment, Figure 14 The third type of heat-conducting plate 13 provided in this application, wherein Figure 14 Zhongyu Figure 11 For parts with the same number, please refer to Figure 11 Description of the heat-conducting plate structure shown. Figure 14 The heat-conducting plate 13 shown is Figure 11 The difference in the heat-conducting plate 13 shown lies in the different liquid channel structure of the heat-conducting plate 13. For example... Figure 14 As shown, an S-shaped channel 1353 is provided on the base plate 133 of the heat-conducting plate 13, forming a liquid channel. When the heat-conducting plate 13 mates with the mounting base 12 and the pressure plate, it can be referred to... Figure 12 Description of the example shown.

[0089] It is worth noting that the different liquid channels of the above-mentioned heat-conducting plate can be combined with various implementation methods of the mounting base according to business needs, and this application does not limit the comparison.

[0090] refer to Figure 12 and Figure 15 , Figure 15 A schematic diagram of the pressure plate 11 is shown. This pressure plate 11 is used for fixed connection with the mounting base 12. (Refer to...) Figure 15 and Figure 16 , Figure 16 for Figure 15 Cross-sectional view at point AA. The pressure plate 11 is provided with receiving grooves 111 for accommodating multiple capillary structures (in...). Figure 15 The image is shown within a dashed box, which represents the internal structure of the receiving cavity, specifically the pressure plate 11. When the pressure plate 11 is fixedly connected to the mounting base, as... Figure 12 As shown, the substrate 133 of the heat-conducting plate 13 is located within the receiving cavity, while the capillary structure 1351 of the heat-conducting plate 13 is located within the receiving groove of the pressure plate 11. The groove wall of the receiving groove is sealed to the substrate 133 by a sealing gasket 134, thereby forming a sealed cavity between the pressure plate 11 and the heat-conducting plate 13. The liquid channel (capillary structure 1351) of the heat-conducting plate 13 is located within the sealed cavity. This sealed cavity is filled with liquid, which allows the pressure plate 11 and the substrate 133 to seal the capillary structure 1351, ensuring that the liquid filling the liquid channel does not leak. This liquid can be common liquids such as water or oil.

[0091] refer to Figure 15 and Figure 17 , Figure 17 for Figure 15 The diagram shows an exploded view of the pressure plate. The pressure plate 11 is provided with an inlet connector 113 and an outlet connector 112 that communicate with the liquid channel, wherein the inlet connector 113 and the outlet connector 112 are used to connect to external pipes.

[0092] refer to Figure 17 For ease of description, a coordinate system xyz is established, where the x-axis and y-axis are parallel to the two sides of the pressure plate, respectively, and the z-axis is perpendicular to both the x-axis and y-axis. For example... Figure 17 As shown, the connection method between the inlet connector 113 and the pressure plate 11 is the same as the connection method between the outlet connector 112 and the pressure plate 11. For simplicity, the following explanation will use the inlet connector 113 as an example. The pressure plate 11 has a boss 115 corresponding to the inlet connector 113. The boss 115 has a mounting groove 1152 and a through hole (not shown in the figure) communicating with the receiving groove of the pressure plate 11. This through hole communicates with the mounting groove 1152. The inlet connector 113 is an inverted L-shape, comprising a horizontal portion and a vertical portion connected to the horizontal portion, as shown below. Figure 17As shown, the horizontal portion is parallel to the x-axis, and the vertical portion is parallel to the z-axis. The horizontal portion of the inlet connector 113 includes multiple protrusions 1131 arranged along its length. These protrusions 1131 are used to hold the inlet pipe in place. When the inlet pipe is connected to the inlet connector 113, the protrusions 1131 lock the inlet pipe onto the inlet connector 113. The vertical portion of the inlet connector 113 has a shoulder 1132. When the shoulder 1132 is fitted into the mounting groove 1152, it is directly inserted into the mounting groove 1152, and the inlet connector 113 communicates with the receiving groove of the pressure plate 11 through a through hole in the mounting groove 1152. A sealing ring 114 is provided between the inlet connector 113 and the pressure plate 11 to seal the inlet connector 113 and the pressure plate 11. When the inlet connector 113 is connected to the pressure plate 11, the cavity inside the inlet connector 113 is connected to the receiving groove through the through hole, and after the pressure plate 11 and the base plate seal the liquid channel, the inlet connector 113 is connected to the liquid channel. After the outlet connector 112 is connected to the pressure plate 11, the outlet connector 112 is also connected to the liquid channel.

[0093] exist Figure 15 In this design, the shape of the pressure plate 11 matches the shape and size of the mounting base. When the mounting base is rectangular, the corresponding shape of the pressure plate 11 is also rectangular; when the mounting base uses other shapes, the shape of the pressure plate 11 matches. Figure 11 For example, the liquid inlet connector 113 and the liquid outlet connector 112 are arranged diagonally, so that when the liquid inlet connector 113 and the liquid outlet connector 112 are connected to the liquid channel, the liquid inlet connector 113 and the liquid outlet connector 112 can be connected to both ends of the liquid channel respectively, so that the liquid can flow through a relatively long distance in the liquid channel, increasing the area of ​​the heat dissipation device that the liquid medium can conduct, thereby improving the heat dissipation effect of the liquid on the chip when it flows.

[0094] Alternatively, in addition to Figure 15 In addition to the arrangement shown, the inlet connector 113 and the outlet connector 112 can also be located on the same side of the pressure plate 11. The specific arrangement can be determined according to the arrangement of the liquid channel. If both ends of the liquid channel are on the same side, then the inlet connector 113 and the outlet connector 112 are also on the same side. If both ends of the liquid channel are diagonally arranged, then the inlet connector 113 and the outlet connector 112 are also diagonally arranged.

[0095] refer to Figure 17The mounting groove 1152 can be a cylindrical groove, and the corresponding shoulder 1132 also adopts a cylindrical structure, thereby enabling the shoulder 1132 to rotate within the mounting groove 1152. Optionally, to limit the rotation of the shoulder 1132 within the mounting groove 1152, multiple limiting protrusions 1151 are provided on the side wall of the mounting groove 1152, and limiting grooves 1133 that mate with each limiting protrusion 1151 are provided on the shoulder 1132. When the shoulder 1132 is inserted into the mounting groove 1152, the limiting protrusions 1151 and the limiting grooves 1133 mate one-to-one, limiting the rotation of the shoulder 1132. The number of limiting protrusions 1151 can be set as needed, such as four, eight, or ten. Optionally, in addition to Figure 17 In addition to the limiting method shown, the sidewall of the mounting groove can also have multiple limiting grooves, and the shoulder can have a limiting protrusion that mates with each limiting groove. Alternatively, the mounting groove can be in the shape of a multi-faceted prism, and the corresponding shoulder can also be in the shape of a matching multi-faceted prism. With this structure, after selecting the angles of the inlet connector 113 and the outlet connector 112, they can be fixed by the shoulder 1132 and the mounting groove 1152, preventing equipment vibration or other collisions from causing changes in the angles of the inlet connector 113 and the outlet connector 112, which would affect the circulation of liquid in the liquid channel.

[0096] In Adoption Figure 17 In the structure shown, both the inlet connector 113 and the outlet connector 112 can rotate based on the pressure plate, meaning the orientation of both can be changed. Furthermore, the limiting protrusion 1151 and the limiting groove 1133 ensure a stable connection between the rotated inlet connector 113 and the pressure plate. (See also...) Figures 18-21 As shown, where Figures 18-21 The diagram shows the inlet connector 113 and outlet connector 112 rotated to different states. First, refer to... Figure 18 For ease of description, an xy coordinate system is established, where the x-axis is parallel to the long side of the pressure plate 11, and the y-axis is parallel to the short side of the pressure plate 11. The liquid inlet connector 113 is along the x-axis direction (with...). Figure 18 (The placement direction of the intermediate pressure plate 11 is the reference direction), the outlet connector 112 points obliquely upward, and forms a 60° angle with the x-axis. When it is necessary to adjust the orientation of the outlet connector 112, firstly, remove the shoulder of the outlet connector 112 from the mounting groove, and then move the inlet connector 113 along... Figure 18 Rotate the inlet connector 113 in the direction indicated by the middle arrow, and re-insert the shoulder of the inlet connector 113 into the mounting groove. The limiting groove on the shoulder cooperates with the limiting protrusion in the mounting groove to prevent the inlet connector 113 from rotating. The inlet connector 113 is oriented as follows: Figure 19 As shown, the outlet connector 112 rotates to the Y-axis direction. When it is necessary to... Figure 19 Repeat the above operation when the direction indicated by the middle arrow is adjusted again, and rotate the liquid outlet connector 112 to... Figure 20 In this state, the outlet connector 112 rotates to an angle of 120° with the x-axis. When it is necessary to follow... Figure 20 Repeat the above operation when adjusting in the direction indicated by the arrow, rotating the liquid outlet connector 112 to... Figure 21 As shown, the outlet connector 112 is rotated to the x-axis direction, and the outlet connector 112 points in the opposite direction to the inlet connector 113. Figures 18-21 As shown in the process, the liquid outlet connector 112 can be rotated to different angles as needed. When connected to the liquid outlet pipe of the refrigeration system, the position of the liquid outlet connector 112 can be adjusted according to the setting position of the liquid outlet pipe, which facilitates the connection between the liquid outlet connector 112 and the refrigeration system. The rotation method of the liquid inlet connector 113 can refer to the rotation of the liquid outlet connector 112 described above, and will not be repeated here.

[0097] As one possible embodiment, in Figures 18-21 Based on the existing structure, the aforementioned heat dissipation device can be further secured by a pressure cap. Figure 22 This is a schematic diagram of a pressure plate and a pressure cap provided in this application. Figure 22 Zhongyu Figure 17 For parts with the same number, please refer to Figure 17The structure of the pressure plate 11 is described below. As shown in the figure, when the inlet connector 113 and the outlet connector 112 are connected to the pressure plate 11 in the manner described above, a pressure cap 14 is used to fix the inlet connector 113 and the outlet connector 112 to the pressure plate 11. The pressure cap 14 is stacked on the side of the pressure plate 11 facing away from the receiving groove 111, and the pressure cap 14 is provided with through holes 141 that mate with the inlet connector 113 and the outlet connector 112. The pressure cap 14 is used for fixed connection with the mounting base. This fixed connection is detachable and achieves the pressing of the pressure plate 11 onto the heat-conducting plate. For example, the pressure cap 14 is connected to the mounting base by a threaded connector (bolt or screw), pressing the pressure plate 11 onto the mounting base. At the same time, the pressure cap 14 also presses the outlet connector and the inlet connector onto the pressure plate 11. During connection, the threaded connector passes through the pressure cap 14, the pressure plate 11, and the mounting base in sequence, fixing the pressure cap 14 and the pressure plate 11 onto the mounting base. When adjusting the angles of the inlet and outlet connectors, the pressure cap 14 can be removed first, then the inlet or outlet connector can be rotated to the desired angle. The pressure cap 14 can then be fixedly connected to the mounting base, and the inlet and outlet connectors can be pressed tightly onto the pressure plate 11. Optionally, the pressure cap 14 can be made of a material with high rigidity, such as stainless steel, iron, or aluminum alloy, while the pressure plate 11 can be made of plastic or other materials with lower rigidity. The pressure cap 14 enhances the pressure strength of the entire pressure plate 11 on the heat-conducting plate and the mounting base. During the flow of liquid in the heat-conducting plate, the pressure plate 11 and the pressure cap 14 can jointly fix the heat-conducting plate. On the other hand, in the event of a drop or inversion of the equipment, the pressure cap 14 can assist the pressure plate 11 in fixing the heat-conducting plate and the mounting base, preventing liquid from flowing out of the heat dissipation device and affecting its heat dissipation effect.

[0098] The above Figure 17 and Figure 22 This is merely an example of a pressure plate provided in this application. In specific implementations, the inlet connector 113 and the pressure plate can also be rotatably connected, as can the outlet connector 112 and the pressure plate. For example, the inlet connector 113 and / or the outlet connector 112 can be rotatably connected to the pressure plate 11. Specifically, it includes any one of the following methods:

[0099] In method 1, the inlet connector 113 and the pressure plate 11 can also be fixedly connected, while the outlet connector 112 is rotatably connected to the pressure plate 11.

[0100] Method 2: The inlet connector 113 is rotatably connected to the pressure plate 11, and the outlet connector 112 is fixedly connected to the pressure plate 11.

[0101] Method 3: The inlet connector 113 is rotatably connected to the pressure plate 11, and the outlet connector 112 is also rotatably connected to the pressure plate 11.

[0102] Optionally, the inlet connector 113 and outlet connector 112 can also be directly rotatably connected to the pressure plate 11 by a snap-fit ​​connection. In this case, a pressure cap is not required to ensure a reliable connection between the inlet connector 113 and outlet connector 112 and the pressure plate 11. However, when using this structure, the pressure plate 11 must have a certain strength. When the pressure plate 11 is fixedly connected to the mounting base, the pressure plate 11 must have sufficient rigidity to ensure the sealing effect between the pressure plate 11 and the base plate.

[0103] When the pressure plate 11 is connected to the mounting base, the pressure plate 11 is connected to the mounting base via a threaded connector (such as a bolt or screw). Furthermore, a waterproof sealing ring is fitted onto the threaded connector. When the pressure plate 11 and the mounting base are connected via the threaded connector, this waterproof sealing ring seals the gap between the threaded connector and the pressure plate, improving the sealing effect.

[0104] Furthermore, the inlet connector 113 and the outlet connector 112 can be fixedly connected to the pressure plate 11 respectively. In this case, neither the inlet connector 113 nor the outlet connector 112 can rotate relative to the pressure plate 11. In specific manufacturing, an integral molding process can be used to manufacture the inlet connector 113, the outlet connector 112, and the pressure plate 11, ensuring the sealing between the inlet connector 113, the outlet connector 112, and the pressure plate 11.

[0105] The aforementioned liquid cooling device can be applied in equipment, and the connection method between the cooling device and the refrigeration system in the equipment is as follows: Figure 23 As shown. The refrigeration system includes a power unit 70 for realizing liquid flow in the liquid channel, and a refrigeration unit 50 for cooling the liquid. (As shown...) Figure 23 As shown, the liquid outlet of the refrigeration device 50 is connected to the liquid inlet pipe 51, which is sealed to the liquid inlet connector 113. The liquid outlet pipe 52 is sealed to the liquid outlet connector 112 and is connected to the liquid inlet of the refrigeration device 50, thus forming a liquid circulation loop. During heat dissipation, the liquid flows in the circulation loop, such as... Figure 23 As indicated by the arrow, the liquid flows clockwise. During this flow, the cooled liquid in the cooling device 50 is driven by the power device 70 into the inlet pipe 51, and flows through the inlet connector 113 into the sealed cavity of the heat dissipation device 10. The heat generated by the chip is transferred to the liquid through the heat-conducting plate. After absorbing heat, the liquid's temperature rises, and the high-temperature liquid flows back to the cooling device 50 through the outlet connector 112 and the outlet pipe 52 for cooling. The cooled liquid then flows back into the heat dissipation device 10 through the inlet pipe 51 and the inlet connector 113, thus circulating and cooling the chip. The power device 70 can be a plunger pump or other pump, and the cooling device can be a condenser or other device that provides cooling. Furthermore... Figure 23In this case, the power unit 70 is installed on the liquid inlet pipe 51, but it should be understood that... Figure 23 The power unit 70 in the example is just one example; the power unit 70 can also be installed on the liquid outlet pipe 52.

[0106] Figure 23 The example only illustrates the connection between the refrigeration system and one heat dissipation device 10. When there are multiple heat dissipation devices, they can be connected in parallel or in series. When connected in parallel, the liquid flowing out of the refrigeration device 50 flows into multiple heat dissipation devices 10 simultaneously; when connected in series, the liquid flowing out of the refrigeration device 50 flows through multiple heat dissipation devices 10 sequentially.

[0107] As can be seen from the above description, the heat dissipation device provided in this application embodiment adopts a sandwich-like stacked arrangement. Furthermore, the mounting base and pressure plate can be set as standard parts; for chips with different heat dissipation requirements, only the heat-conducting plate needs to be replaced. For example, if a first chip and a second chip are present in the same device, and the heat dissipation requirements of the first chip and the second chip are different, during assembly, the mounting base can be fixed to the first chip and the second chip respectively, with the cavity in the middle of the mounting base facing the first chip or the second chip. Heat-conducting plates corresponding to the first chip and the second chip are selected according to the heat dissipation requirements, and then uniform pressure plates are assembled onto the corresponding mounting bases. Optionally, during the above assembly, the first surface of the heat-conducting plate should be at least not less than the surface area of ​​the second surface of the chip, where the first surface is the surface of the heat-conducting plate used for thermal contact with the chip, and the second surface is the surface of the chip used for thermal connection with the heat-conducting plate. That is, the area of ​​the accommodating cavity should be at least not less than the second surface of the chip during use; therefore, the area of ​​the mounting base should be larger than the area of ​​the corresponding chip. As can be seen from the above description, the only difference between the corresponding heat dissipation devices for chips with different heat dissipation requirements lies in the heat-conducting plate between the mounting base and the pressure plate. Therefore, the heat dissipation device provided in this application embodiment can be applied to chips with different heat dissipation requirements. Only the corresponding heat-conducting plate needs to be selected according to the heat dissipation requirements; there is no need to replace the entire heat dissipation device. Compared to integrated liquid cooling devices, it eliminates the need to select different liquid cooling devices for different chips, improving the adaptability of the heat dissipation device. Furthermore, during maintenance, only the heat-conducting plate needs to be replaced; the mounting base and pressure plate can continue to be used, reducing maintenance costs.

[0108] Furthermore, by adopting a modular standard, only the heat dissipation plate needs to be selected according to the corresponding chip requirements, while the mounting base and pressure plate can be prepared using a unified mold, which reduces the production difficulty and manufacturing cost of the heat dissipation device.

[0109] In addition, the inlet and outlet connectors connected to the pressure plate can also be made into standard parts, which facilitates connection with the piping of the refrigeration system.

[0110] This application provides a device, such as Figure 1 As shown, this device can be a server, storage device, router, or switch, etc. Figure 1 As shown, chip 20 is carried by the motherboard 30 of the device, and the heat dissipation device is detachably and fixedly connected to the motherboard 30 carrying chip 20. When using the heat dissipation device 10, refer to... Figure 23 When the heat dissipation device 10 is in use, the device includes a cooling device 50. The inlet pipe 51 of the cooling device 50 is connected to the inlet connector 113, and the outlet pipe 52 is connected to the outlet connector 112, thus forming a circulation loop. During use, liquid flows through the circulation loop, such as... Figure 23 As indicated by the arrow, the liquid flows clockwise. During this flow, the cooled liquid in the cooling device 50 enters the sealed cavity of the heat dissipation device 10 through the inlet pipe 51 and the inlet connector 113. The heat generated by the chip is transferred to the liquid through the heat-conducting plate. After absorbing the heat, the liquid's temperature rises, and the high-temperature liquid flows back to the cooling device 50 through the outlet connector 112 and the outlet pipe 52 for cooling. The cooled liquid then flows back into the heat dissipation device 10 through the inlet pipe 51 and the inlet connector 113, thus circulating heat dissipation for the chip.

[0111] As one possible embodiment, this application also provides a rack, such as Figure 24 and Figure 25 As shown, where, Figure 24 This is a schematic diagram of the rack.

[0112] Figure 25This is a schematic diagram showing the connection between the heat dissipation device and the cooling system. In use, the equipment is mounted in a rack 60, which may contain multiple devices or only one device, such as a server, storage device, router, or switch. The storage device includes data storage devices such as storage arrays or backup devices. A cooling system (not shown) is installed in the rack, connected to an inlet pipe 61 and an outlet pipe 62. The inlet pipe 61 is connected to the inlet connector of the heat dissipation device 10, and the outlet pipe 62 is connected to the outlet connector of the heat dissipation device. Optionally, the cooling system also includes a power device (e.g., a pump) to enable liquid flow in the liquid channel and a cooling device for cooling the liquid, thereby forming a circulation loop between the cooling system and the heat dissipation device, with the liquid flowing in a clockwise or counterclockwise direction. During the flow process, the cold liquid in the cooling device enters the sealed cavity of the heat dissipation device 10 through the liquid inlet pipe 61 and the liquid inlet connector. The heat generated by the chip is transferred to the liquid through the heat conduction plate. After the liquid absorbs the heat, its temperature rises. The high-temperature liquid flows back to the cooling device through the liquid outlet connector and the liquid outlet pipe 62 for cooling. The cooled liquid flows back into the heat dissipation device 10 through the liquid inlet pipe 61 and the liquid inlet connector 113, thereby circulating heat dissipation for the chip.

[0113] This application also provides a heat dissipation system, the structure of which is similar. Figure 23 or Figure 24 The structure includes a heat dissipation device and a cooling system, the heat dissipation device being as follows: Figure 1 The structure shown includes a cooling system comprising a power device for the flow of liquid in a liquid channel and a cooling device for cooling the liquid, thereby forming a loop between the cooling system and the heat dissipation device. The liquid flows in a clockwise or counterclockwise direction, transferring the heat of the chip to be cooled to the cooling device through the flow of liquid in the liquid channel. The cooling device then cools the liquid, thereby achieving heat dissipation for the chip to be cooled.

[0114] The term "first" in the first surface and first limiting protrusion mentioned in this application is used only for naming purposes and does not represent the first in order. The same rule applies to "second," "third," etc.

[0115] In this application, the term "and / or" is used to describe the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A existing alone, A and B existing simultaneously, and B existing alone. The character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0116] In this application, unless otherwise expressly specified and limited, the term "connection" shall be interpreted broadly. For example, "connection" may be a fixed connection, a detachable connection, or an integral part; it may be a direct connection or an indirect connection through an intermediate medium.

[0117] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A heat dissipating device, characterized by, The application relates to a heat dissipation device. The heat dissipation device comprises a heat conduction plate, a mounting base, and a pressing plate. The heat conduction plate comprises opposite first and second surfaces, and the first surface is provided with a liquid channel. The mounting base is provided with a containing cavity for containing the second surface of the heat conduction plate.

2. The heat dissipating device according to claim 1, wherein The second surface is used for abutting against a chip.

3. The heat dissipating device according to claim 2, wherein The pressing plate is detachably connected with the mounting base and is used for fixing the heat conduction plate in the containing cavity.

4. The heat dissipating device of claim 2, wherein The pressing plate abuts against the first surface of the heat conduction plate, and a sealed cavity is formed between the pressing plate and the first surface of the heat conduction plate.

5. The heat dissipating device according to any one of claims 2 to 4, wherein The sealed cavity is used for containing the liquid channel.

6. The heat dissipating device according to any one of claims 1 to 4, wherein The pressing plate is provided with an inlet joint and an outlet joint which are in communication with the liquid channel and are rotatably connected with the pressing plate.

7. The heat dissipating device according to any one of claims 2 to 4, wherein The heat conduction plate comprises a base plate for being clamped in the containing cavity and a heat dissipation structure fixedly arranged on the base plate.

8. The heat dissipating device of claim 6, wherein, The heat dissipation structure is the liquid channel.

9. The heat dissipating device of claim 8, wherein, The containing cavity of the mounting base is provided with a first limiting protrusion.

10. The heat dissipating device of claim 9, wherein, The base plate is provided with a second limiting protrusion which is clamped with the first limiting protrusion.

11. The heat dissipating device of claim 10, wherein, The base plate is provided with a limiting protrusion which abuts against the surface of the mounting base. The pressing plate is sealingly connected with the base plate through a sealing gasket.

12. The heat dissipating device according to any one of claims 1 to 4, wherein The application further comprises a pressing cover which is detachably fixedly connected with the mounting base and presses the pressing plate against the heat conduction plate.

13. The heat dissipating device according to any one of claims 1 to 4, wherein The pressing plate is provided with a containing groove for containing the heat dissipation structure.

14. The heat dissipating device according to any one of claims 1 to 4, wherein The pressing cover presses the outlet joint and the inlet joint against the pressing plate.

15. The heat dissipating device according to any one of claims 1 to 4, wherein The pressing plate is provided with a boss corresponding to the inlet joint and the outlet joint.

16. The heat dissipating device according to any one of claims 1 to 4, wherein Each boss has a mounting groove. The outlet joint or the inlet joint has a shoulder which is assembled in the mounting groove.

17. The heat dissipating device according to any one of claims 1 to 4, wherein When the pressing cover does not press the shoulder against the mounting groove, the shoulder can rotate relative to the mounting groove.

18. An apparatus, comprising: The side wall of the mounting groove has a plurality of limiting protrusions. The shoulder has a limiting groove matched with each limiting protrusion. Or, the side wall of the mounting groove has a plurality of limiting grooves. The shoulder has a limiting protrusion matched with each limiting groove. The pressing plate is rectangular. The inlet joint and the outlet joint are arranged in diagonal lines. The mounting base is provided with a floating screw for being connected with a chip. The area of the second surface of the heat conduction plate is greater than or equal to the surface area of the chip to be cooled. The sealed cavity is filled with liquid which flows in the liquid channel. The heat dissipation device is connected with a refrigeration system. Cold liquid in the refrigeration system enters the sealed cavity of the heat dissipation device. The heat generated by the chip is transmitted to the liquid through the heat conduction plate. The liquid absorbs heat and then flows back to the refrigeration system for cooling. The pressing cover has a rigidity greater than that of the pressing plate. The application relates to a heat dissipation device. The heat dissipation device comprises a main plate, a chip mounted on the main plate, and a heat dissipation device as claimed in any one of claims 1 to 17 which is fixedly connected with the main plate and is used for dissipating heat for the chip.

19. The apparatus of claim 18, wherein, The device is connected to a refrigeration system comprising an inlet pipe and an outlet pipe, the inlet pipe being in sealed connection with the inlet connection of the heat sink, the outlet pipe being in sealed connection with the outlet connection of the heat sink, the refrigeration system further comprising a power device for realizing the flow of liquid in the liquid channel, and a refrigeration device for cooling the liquid.

20. A rack, characterized by Comprising: a heat sink as claimed in any of claims 1-17, or a device as claimed in claim 18 or 19, mounted in the rack.

21. A system, comprising: Comprising a heat sink as claimed in any of claims 1-17, and a refrigeration system comprising a power device for realizing the flow of liquid in the liquid channel of the heat sink, and a refrigeration device for cooling the liquid in the heat sink.

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