Inductor component and method of manufacturing an inductor component

Abstract

The present application provides an inductor component capable of improving the adhesion of an insulating layer to a green body and also capable of improving the inductor characteristics, and a manufacturing method for the inductor component. The inductor component includes a green body having a first magnetic layer and a second magnetic layer sequentially stacked along a first direction, a coil having an inductor wiring extending along a plane orthogonal to the first direction between the first magnetic layer and the second magnetic layer, and an insulating layer of a non-magnetic body having a top surface portion, a bottom surface portion, a first side surface portion, a second side surface portion, a top surface protruding portion, and a bottom surface protruding portion, the bottom surface protruding portion being located between the first magnetic layer and the second magnetic layer, the first magnetic layer and the second magnetic layer being in contact at a front end of the bottom surface protruding portion, and the protruding length of the bottom surface protruding portion in a direction parallel to a third direction or a fourth direction being longer than the protruding length of the top surface protruding portion in the direction parallel to the third direction or the fourth direction.

Description

Technical Field

[0001] This disclosure relates to inductor components and methods for manufacturing inductor components. Background Technology

[0002] Conventionally, as an inductor component, there is the component described in International Patent Publication No. 2019 / 044459 (Patent Document 1). This inductor component includes: a blank having a magnetic layer, a coil disposed within the blank and wound into a helical shape along the axial direction, and an insulating layer disposed within the blank and covering the coil (a non-magnetic material). The insulating layer has a first cylindrical portion covering the coil and a second portion connected to the lower end of the first portion and covering the entire area of ​​the inner and outer magnetic circuits of the coil. In a cross-section including the axis of the coil, the inner and outer peripheral surfaces of the first portion are straight.

[0003] Patent Document 1: International Publication No. 2019 / 044459

[0004] However, in conventional inductor components, the inner and outer circumferential surfaces of the first portion of the insulating layer are straight in the cross-section containing the coil shaft, resulting in poor adhesion between the insulating layer and the blank. Furthermore, in conventional inductor components, the second portion of the insulating layer covers the entire area of ​​both the inner and outer magnetic circuits of the coil, raising concerns about reduced inductance efficiency. Summary of the Invention

[0005] Therefore, this disclosure provides an inductor component and a method for manufacturing the inductor component that can improve the adhesion between the insulating layer and the blank, and also improve the inductor characteristics.

[0006] To address the aforementioned issues, an inductor component according to one embodiment of this disclosure comprises: a substrate blank, a coil disposed within the substrate blank, and an insulating layer of non-magnetic material covering at least a portion of the coil.

[0007] The aforementioned blank has a first magnetic layer and a second magnetic layer stacked sequentially along a first direction.

[0008] The coil described above has inductor wiring, wherein the inductor wiring extends between the first magnetic layer and the second magnetic layer along a plane orthogonal to the first direction.

[0009] On the first cross section orthogonal to the extension direction of the aforementioned inductor wiring,

[0010] The aforementioned inductor wiring has: a top surface facing the first direction, a bottom surface facing a second direction opposite to the first direction, a first side surface facing a third direction orthogonal to the first direction, and a second side surface facing a fourth direction opposite to the third direction.

[0011] The above-mentioned insulating layer has the following characteristics:

[0012] The top surface is located closer to the first direction than the aforementioned top surface;

[0013] The bottom surface is located closer to the second direction than the aforementioned bottom surface;

[0014] The first side face is in contact with the aforementioned first side face;

[0015] The second side surface is in contact with the aforementioned second side surface;

[0016] A top surface protrusion is provided at a position in at least one of the following directions: a position where it protrudes further in a third direction from the top surface portion than the first side surface portion and a position where it protrudes further in a fourth direction from the top surface portion than the second side surface portion; and

[0017] The bottom protrusion is located at at least one of the following directions: a position where it protrudes further in a third direction than the first side surface and a position where it protrudes further in a fourth direction than the second side surface.

[0018] The aforementioned bottom protrusion is located between the aforementioned first magnetic layer and the aforementioned second magnetic layer.

[0019] The first magnetic layer and the second magnetic layer are in contact at the front end of the bottom protrusion.

[0020] The protruding length of the bottom protrusion in the direction parallel to the third or fourth direction is longer than the protruding length of the top protrusion in the direction parallel to the third or fourth direction.

[0021] According to the above method, since the bottom protrusion is located between the first magnetic layer and the second magnetic layer, and the protrusion length of the bottom protrusion in the direction parallel to the third or fourth direction is longer than the protrusion length of the top protrusion in the same direction, the tightness of the first and second magnetic layers can be ensured via the bottom protrusion. Furthermore, the contact area between the insulating layer and the blank is increased by the top protrusion, and the tightness of the insulating layer and the blank is improved by the top protrusion penetrating into the blank. Thus, the tightness of the insulating layer and the blank can be improved. Additionally, since the first and second magnetic layers contact at the front end of the bottom protrusion, the inductance acquisition efficiency can be improved. Therefore, according to the above embodiment, the tightness of the insulating layer and the blank can be improved, and the inductor characteristics can also be improved.

[0022] Preferably, in one embodiment of the inductor component,

[0023] The aforementioned inductor wiring has multiple layers along the first direction.

[0024] The aforementioned coil connects multiple inductor wires in series to form one or more turns.

[0025] The aforementioned third direction is the direction of the inner surface of the aforementioned coil.

[0026] According to this embodiment, since the bottom protrusion protrudes into the inner magnetic circuit where the contact area between the first magnetic layer and the second magnetic layer is relatively large, the adhesion between the insulating layer and the blank can be improved.

[0027] Preferably, in one embodiment of the inductor component,

[0028] There are three or more of the aforementioned top surface protrusions and bottom surface protrusions in the aforementioned first cross-section.

[0029] In the first cross section, at least three of the top protrusions and the bottom protrusions have different protrusion lengths in a direction parallel to the third or fourth direction.

[0030] According to the above embodiments, by extending the protrusion length of a portion of the protrusion, the adhesion between the insulating layer and the blank can be further improved. Furthermore, by shortening the protrusion length of a portion of the protrusion, the magnetic reluctance of the magnetic circuit can be reduced, thereby improving the efficiency of inductance acquisition.

[0031] Preferably, in one embodiment of the inductor component,

[0032] The aforementioned inductor wiring has multiple layers along the first direction.

[0033] In the first cross section, the closer the inductor wiring is to the first direction, the shorter the protrusion length of the top surface protrusion in the direction parallel to the third or fourth direction.

[0034] According to the above embodiment, since the protrusion length of the top surface protrusion is shorter the inductor wiring is closer to the first direction, the magnetic circuit area of ​​the coil is wider the further it is towards the first direction. Therefore, when filling the second magnetic layer into the coil from the first direction side towards the second direction during manufacturing, it becomes easier to fill the coil with the second magnetic layer, the filling rate is increased, and the inductance can be improved.

[0035] Preferably, in one embodiment of the inductor component,

[0036] The aforementioned inductor wiring has multiple layers along the first direction.

[0037] In the first cross section, the top protrusion is inclined in the second direction.

[0038] According to the above embodiment, since the top protrusion is inclined in the second direction, when the second magnetic layer is filled into the coil from the first direction side to the second direction during manufacturing, the filling of the second magnetic layer into the coil becomes smoother. In addition, since the top protrusion is inclined in the second direction, after the second magnetic layer is filled, it can resist the detachment of the second magnetic layer in the first direction, and can further improve the adhesion between the insulating layer and the blank.

[0039] Preferably, in one embodiment of the inductor component,

[0040] In the first cross section described above, the protruding direction of the bottom protrusion is parallel to the third or fourth direction described above.

[0041] According to the above embodiment, since the filling of the second magnetic layer from the first direction side of the coil to the second direction is performed in a stable state on the first magnetic layer side during manufacturing, the magnetic layer can be filled into the magnetic circuit more reliably. Therefore, the inductance can be improved.

[0042] Preferably, in one embodiment of the inductor component,

[0043] In the first cross section described above, the bottom protrusion is inclined in the first direction described above.

[0044] According to the above embodiments, the adhesion between the insulating layer and the blank can be further improved.

[0045] Preferably, in one embodiment of the inductor component,

[0046] The aforementioned inductor wiring has multiple layers along the first direction.

[0047] The aforementioned coil connects the wiring of the multiple inductors in series to form one or more turns.

[0048] In the first cross section described above, all of the aforementioned top surface protrusions and bottom surface protrusions are located in either the inner magnetic circuit or the outer magnetic circuit of the coil.

[0049] According to the above embodiments, the adhesion between the insulating layer and the blank can be further improved.

[0050] Preferably, in one embodiment of the inductor component,

[0051] The aforementioned top surface protrusion includes a protrusion protruding in the aforementioned third direction and a protrusion protruding in the aforementioned fourth direction.

[0052] The aforementioned bottom protrusion includes a protrusion protruding in the aforementioned third direction and a protrusion protruding in the aforementioned fourth direction.

[0053] According to the above embodiments, the adhesion between the insulating layer and the blank can be further improved.

[0054] Preferably, in one embodiment of the inductor component,

[0055] The aforementioned top surface protrusion includes a protrusion protruding in the aforementioned third direction and a protrusion protruding in the aforementioned fourth direction.

[0056] In the first cross section described above, the protrusion length of the protrusion protruding to the third direction in the direction parallel to the third direction is different from the protrusion length of the protrusion protruding to the fourth direction in the direction parallel to the fourth direction.

[0057] According to the above embodiment, by extending the length of the protrusion in one direction, the adhesion between the insulating layer and the blank can be further improved. Furthermore, by shortening the length of the protrusion in another direction, the magnetic reluctance of the magnetic circuit can be reduced, thereby improving the efficiency of inductance acquisition.

[0058] Preferably, in one embodiment of the inductor component,

[0059] The aforementioned bottom protrusion includes a protrusion protruding in the aforementioned third direction and a protrusion protruding in the aforementioned fourth direction.

[0060] In the first cross section described above, the protrusion length of the protrusion protruding to the third direction in the direction parallel to the third direction is different from the protrusion length of the protrusion protruding to the fourth direction in the direction parallel to the fourth direction.

[0061] According to the above embodiment, by extending the length of one side of the protrusion, the adhesion between the insulating layer and the blank can be further improved. Furthermore, by shortening the length of the other side of the protrusion, the magnetic reluctance of the magnetic circuit can be reduced, thereby improving the efficiency of inductance acquisition.

[0062] Preferably, in one embodiment of the inductor component,

[0063] In the first cross section, the top protrusion is inclined in the first direction or the second direction.

[0064] According to the above embodiments, the adhesion between the insulating layer and the blank can be further improved.

[0065] Preferably, in one embodiment of the inductor component,

[0066] The thickness of the bottom portion of the aforementioned insulating layer is thinner than the thickness of the top portion.

[0067] According to the above implementation method, the inductance can be improved.

[0068] Preferably, in one embodiment of the inductor component,

[0069] The aforementioned inductor wiring has n (n: a natural number, n≥2) layers along the first direction.

[0070] The material of the insulating layer covering the inductor wiring of the first layer is different from the material of the insulating layer covering the inductor wiring of the m-th layer (m: a natural number, 2≤m≤n).

[0071] According to the above embodiments, design freedom can be improved. For example, the material of the insulating layer covering the inductor wiring of the first layer is preferably selected with consideration for peeling and stress from the substrate. On the other hand, the material of the insulating layer covering the inductor wiring of the m-th layer is preferably selected based on factors such as laser performance, photolithographic resolution, and coverage of steps.

[0072] Preferably, in one embodiment of the method for manufacturing an inductor component, the following steps are included:

[0073] The process of forming inductor wiring, wherein the inductor wiring has a top surface facing the first direction, a bottom surface facing the second direction opposite to the first direction, a first side surface facing the third direction orthogonal to the first direction, and a second side surface facing the fourth direction opposite to the third direction in a first cross section orthogonal to the extension direction.

[0074] The process of forming an insulating layer results in the first cross-section having: a top portion located closer to the first direction than the top surface, a bottom portion located closer to the second direction than the bottom surface, a first side portion contacting the first side portion, a second side portion contacting the second side portion, a top surface protrusion located at at least one of a position protruding from the top surface beyond the first side portion in a third direction and a position protruding from the top surface beyond the second side portion in a fourth direction, and a bottom surface protrusion located at at least one of a position protruding from the bottom surface beyond the first side portion in a third direction and a position protruding from the bottom surface beyond the second side portion in a fourth direction; and

[0075] The process of stacking a first magnetic layer and a second magnetic layer along the first direction to hold the inductor wiring and the insulating layer to form a blank.

[0076] In the process of forming the above-mentioned insulating layer, the bottom protrusion is located between the first magnetic layer and the second magnetic layer, the first magnetic layer and the second magnetic layer are in contact at the front end of the bottom protrusion, and the protrusion length of the bottom protrusion in the direction parallel to the third or fourth direction is longer than the protrusion length of the top protrusion in the direction parallel to the third or fourth direction.

[0077] According to the above embodiments, the adhesion between the insulating layer and the blank can be improved, and the characteristics of the inductor can also be improved.

[0078] Preferably, in one embodiment of the method for manufacturing an inductor component,

[0079] The process of forming the inductor wiring further involves forming dummy wiring at positions that overlap with the top surface protrusion when viewed from the first direction.

[0080] After the process of forming the inductor wiring described above, there is also a process of removing the aforementioned dummy wiring.

[0081] The process of forming the above-mentioned blank further involves filling the positions where the above-mentioned dummy wiring has been removed with the above-mentioned first magnetic layer or the above-mentioned second magnetic layer.

[0082] According to the above embodiments, a magnetic layer that is in close contact with the top protrusion can be manufactured at low cost.

[0083] According to the inductor component and the manufacturing method of the inductor component as an embodiment of the present disclosure, the adhesion between the insulating layer and the blank can be improved, and the inductor characteristics can also be improved. Attached Figure Description

[0084] Figure 1 This is a top view showing a first embodiment of the inductor component.

[0085] Figure 2 yes Figure 1 AA sectional view.

[0086] Figure 3 yes Figure 2 An enlarged view of part A.

[0087] Figure 4A This is an explanatory diagram illustrating the manufacturing method of an inductor component.

[0088] Figure 4B This is an explanatory diagram illustrating the manufacturing method of an inductor component.

[0089] Figure 4C This is an explanatory diagram illustrating the manufacturing method of an inductor component.

[0090] Figure 4D This is an explanatory diagram illustrating the manufacturing method of an inductor component.

[0091] Figure 4E This is an explanatory diagram illustrating the manufacturing method of an inductor component.

[0092] Figure 4F This is an explanatory diagram illustrating the manufacturing method of an inductor component.

[0093] Figure 4G This is an explanatory diagram illustrating the manufacturing method of an inductor component.

[0094] Figure 4H This is an explanatory diagram illustrating the manufacturing method of an inductor component.

[0095] Figure 4I This is an explanatory diagram illustrating the manufacturing method of an inductor component.

[0096] Figure 4J This is an explanatory diagram illustrating the manufacturing method of an inductor component.

[0097] Figure 4K This is an explanatory diagram illustrating the manufacturing method of an inductor component.

[0098] Figure 4L This is an explanatory diagram illustrating the manufacturing method of an inductor component.

[0099] Figure 4M This is an explanatory diagram illustrating the manufacturing method of an inductor component.

[0100] Figure 4N This is an explanatory diagram illustrating the manufacturing method of an inductor component.

[0101] Figure 5 This is a cross-sectional view showing a second embodiment of the inductor component.

[0102] Figure 6 This is a cross-sectional view showing a third embodiment of the inductor component.

[0103] Figure 7 This is a cross-sectional view showing a fourth embodiment of the inductor component.

[0104] Figure 8 This is a cross-sectional view showing the fifth embodiment of the inductor component.

[0105] Figure 9 This is a top view showing the sixth embodiment of the inductor component.

[0106] Figure 10 This is a cross-sectional view showing the sixth embodiment of the inductor component.

[0107] Explanation of reference numerals in the attached figures

[0108] 1, 1A, 1B, 1C, 1D, 1E…Inductor components; 10…Blank; 10a…First main surface; 10b…Second main surface; 11…First magnetic layer; 12…Second magnetic layer; 15, 15E…Coils; 21, 21E…First inductor wiring; 211…Top surface; 212…Bottom surface; 213…First side surface; 214…Second side surface; 22, 22E…Second inductor wiring; 221…Top surface; 222…Bottom surface; 223…First side surface; 224…Second side surface; 25…Conductive wiring; 31, 32, 33…First columnar wiring, second columnar wiring, third columnar wiring; 41, 42, 43…First external terminal, second external terminal, third external terminal; 50…Covering film; 51, 52, 53…First vertical wiring, second vertical wiring, third vertical wiring… Straight wiring; 60, 60A, 60B, 60C, 60D, 60E… Insulation layer; 61… Top surface; 611, 612… First top surface, second top surface; 62… Bottom surface; 63, 64… First side surface, second side surface; 65… Top surface protrusion; 65a, 65aA, 65aB… First top surface protrusion; 65b, 65bA, 65bB… Second top surface protrusion; 651, 652… First top surface protrusion, second top surface protrusion; 66, 66C… Bottom surface protrusion; 661, 662… First bottom surface protrusion, second bottom surface protrusion; 81, 82… First connecting wiring, second connecting wiring; 91, 92… First dummy wiring, second dummy wiring; L1, L2, L3… Length of protrusion; t1, t2, t3… Thickness of insulation layer. Detailed Implementation

[0109] The following is a detailed description of an inductor component and a method for manufacturing the inductor component, which are embodiments of the present disclosure, through illustrated examples. Furthermore, the accompanying drawings contain only schematic structures and may not reflect actual dimensions or proportions.

[0110] <First Implementation>

[0111] (structure)

[0112] Figure 1 This is a top view showing a first embodiment of the inductor component. Figure 2 yes Figure 1 AA sectional view. Figure 3 yes Figure 2 An enlarged view of part A.

[0113] The inductor component 1 is, for example, a component mounted in electronic devices such as personal computers, DVD players, digital cameras, TVs, mobile phones, and automotive electronics, and is generally rectangular in shape. However, there is no particular limitation on the shape of the inductor component 1, and it can also be cylindrical, polygonal cylindrical, frustum conical, or polygonal frustum conical.

[0114] like Figure 1 and Figure 2 As shown, the inductor component 1 includes: a blank 10, a coil 15 disposed within the blank 10, an insulating layer 60 of a non-magnetic body covering at least a portion of the coil 15, a first vertical wiring 51 and a second vertical wiring 52 disposed within the blank 10 such that their end faces are exposed from a first main surface 10a of the blank 10, a first external terminal 41 and a second external terminal 42 exposed on the first main surface 10a of the blank 10, and a cover film 50 disposed on the first main surface 10a of the blank 10.

[0115] In the figure, the thickness direction of inductor component 1 is defined as the Z direction, the positive Z direction is defined as the upper side, and the negative Z direction is defined as the lower side. In a plane orthogonal to the Z direction of inductor component 1, the length direction of the long side of inductor component 1, which is the direction in which the first external terminal 41 and the second external terminal 42 are arranged, is defined as the X direction, and the direction orthogonal to the length direction, that is, the width direction of inductor component 1, is defined as the Y direction.

[0116] The blank 10 has a first main surface 10a and a second main surface 10b, and a first side surface 10c, a second side surface 10d, a third side surface 10e and a fourth side surface 10f located between the first main surface 10a and the second main surface 10b and connecting the first main surface 10a and the second main surface 10b.

[0117] The first principal surface 10a and the second principal surface 10b are arranged on opposite sides in the Z direction, with the first principal surface 10a positioned in the positive Z direction and the second principal surface 10b positioned in the negative Z direction. The first side surface 10c and the second side surface 10d are arranged on opposite sides in the X direction, with the first side surface 10c positioned in the negative X direction and the second side surface 10d positioned in the positive X direction. The third side surface 10e and the fourth side surface 10f are arranged on opposite sides in the Y direction, with the third side surface 10e positioned in the negative Y direction and the fourth side surface 10f positioned in the positive Y direction.

[0118] The blank 10 has a first magnetic layer 11 and a second magnetic layer 12 stacked sequentially along the positive Z direction. The word "sequentially" only indicates the positional relationship between the first magnetic layer 11 and the second magnetic layer 12, and is not related to the formation order of the first magnetic layer 11 and the second magnetic layer 12.

[0119] The first magnetic layer 11 and the second magnetic layer 12 each comprise magnetic powder and a resin containing the magnetic powder. The resin is, for example, an organic insulating material composed of epoxy, phenolic, liquid crystal polymer, polyimide, acrylic, or mixtures thereof. The magnetic powder is, for example, an FeSi alloy such as FeSiCr, an FeCo alloy, an Fe alloy such as NiFe, or an amorphous alloy thereof. Therefore, compared to a magnetic layer composed of ferrite, the DC superposition characteristics can be improved using magnetic powder, and because the magnetic powder particles are insulated from each other by the resin, losses (iron losses) at high frequencies are reduced. Furthermore, the magnetic layer may also be a sintered body of ferrite or magnetic powder that does not contain organic resin.

[0120] The coil 15 has a first inductor wiring 21 and a second inductor wiring 22. The first inductor wiring 21 and the second inductor wiring 22 extend along a plane orthogonal to the Z direction between the first magnetic layer 11 and the second magnetic layer 12, respectively. Specifically, the first magnetic layer 11 exists in the anti-Z direction of the first inductor wiring 21 and the second inductor wiring 22, and the second magnetic layer 12 exists in the positive Z direction of the first inductor wiring 21 and the second inductor wiring 22, as well as in a direction orthogonal to the positive Z direction.

[0121] The first inductor wiring 21 is a wiring provided closer to the reverse Z-direction side than the second inductor wiring 22, and extending in a spiral shape along the first main surface 10a of the blank 10. The number of turns of the first inductor wiring 21 preferably exceeds one turn. This improves inductance. For example, viewed from the Z-direction, the first inductor wiring 21 is wound in a spiral shape clockwise from the inner peripheral end 21a to the outer peripheral end 21b.

[0122] The second inductor wiring 22 is a spiral wiring extending along the first main surface 10a of the blank 10. The number of turns of the second inductor wiring 22 preferably exceeds one turn. This improves inductance. Viewed from the Z direction, the second inductor wiring 22 is wound clockwise from the outer peripheral end 22b towards the inner peripheral end 22a in a spiral shape. The second inductor wiring 22 is disposed between the first inductor wiring 21 and the second magnetic layer 12. Thus, the first inductor wiring 21 and the second inductor wiring 22 are respectively arranged along the Z direction.

[0123] The outer peripheral end 21b of the first inductor wiring 21 is connected to the second external terminal 42 via a second vertical wiring 52 that contacts the upper surface of the outer peripheral end 21b. The outer peripheral end 22b of the second inductor wiring 22 is connected to the first external terminal 41 via a first vertical wiring 51 that contacts the upper surface of the outer peripheral end 22b. The inner peripheral end 22a of the second inductor wiring 22 is connected to the inner peripheral end 21a of the first inductor wiring 21 via a conductive wiring (not shown) that contacts the lower surface of the inner peripheral end 22a. With the above structure, the first inductor wiring 21 and the second inductor wiring 22 are connected in series and electrically connected to the first external terminal 41 and the second external terminal 42.

[0124] Furthermore, in this embodiment, the first connecting wire 81 and the first inductor wire 21 are disposed on the same layer. The first connecting wire 81 is disposed below the outer peripheral end 22b of the second inductor wire 22 (reverse Z direction side), and is connected only to the lower surface of the second inductor wire 22 via the conductive wire 25. The first connecting wire 81 is not connected to the first inductor wire 21, but is electrically independent. By providing the first connecting wire 81, the outer peripheral end 22b of the second inductor wire 22 and the winding portion of the second inductor wire 22 can be disposed on the same layer, which can suppress wire breakage and the like.

[0125] The thickness of the first inductor wiring 21 and the second inductor wiring 22 is preferably 40 μm or more and 120 μm or less. As an example of the first inductor wiring 21 and the second inductor wiring 22, the thickness is 30 μm and the wiring width is 45 μm.

[0126] The first inductor wiring 21 and the second inductor wiring 22 are made of conductive materials, such as low-resistance metals like Cu, Ag, Au, and Al. Alternatively, the inductor wiring can be a two-layer structure consisting of a seed layer and an electroplated layer; the seed layer may also contain Ti or Ni.

[0127] The first lead wire 201 is connected to the outer peripheral end 22b of the second inductor wiring 22 and the first connecting wiring 81, respectively, and the first lead wire 201 is exposed from the first side 10c. The second lead wire 202 is connected to the outer peripheral end 21b of the first inductor wiring 21 and the second vertical wiring 52 (specifically, the second connecting wiring 82 described later), respectively, and the second lead wire 202 is exposed from the second side 10d.

[0128] The first lead wire 201 and the second lead wire 202 are added during the manufacturing process of the inductor component 1 after the shapes of the first inductor wire 21 and the second inductor wire 22 are formed, and are connected to the power supply wire during electrolytic plating. In the state of the inductor substrate before the inductor component 1 is monolithically formed by these power supply wires, electrolytic plating can be easily performed by adding them, and the distance between the wires can be narrowed. Furthermore, by adding electrolytic plating and narrowing the distance between the first inductor wire 21 and the second inductor wire 22, the magnetic coupling of the first inductor wire 21 and the second inductor wire 22 can be improved. In addition, by providing the first lead wire 201 and the second lead wire 202, strength can be ensured when cutting the blank 10 during the monolithic formation of the inductor component 1, and the yield rate during manufacturing can be improved.

[0129] The first vertical wiring 51 is made of conductive material, extends along the Z direction from the upper surface of the second inductor wiring 22, and penetrates the interior of the second magnetic layer 12. The first vertical wiring 51 is disposed on the upper surface of the outer peripheral end 22b of the second inductor wiring 22, and includes a conductive wiring 25 and a first columnar wiring 31. The conductive wiring 25 penetrates the interior of the insulating layer 60, and the first columnar wiring 31 extends from the upper surface of the conductive wiring 25 along the positive Z direction and penetrates the interior of the second magnetic layer 12, with its end face exposed on the first main surface 10a of the blank 10. The conductive wiring 25 is a conductor with a linewidth (diameter, cross-sectional area) smaller than that of the first columnar wiring 31.

[0130] The second vertical wiring 52 is made of a conductive material and extends from the upper surface of the first inductor wiring 21 along the Z direction, penetrating the interior of the insulating layer 60 and the second magnetic layer 12. The second vertical wiring 52 is disposed on the upper surface of the outer peripheral end 21b of the first inductor wiring 21 and includes a conductive wiring 25, a second connecting wiring 82, and a second columnar wiring 32. The conductive wiring 25 penetrates the interior of the insulating layer 60. The second connecting wiring 82 extends from the upper surface of the conductive wiring 25 along the positive Z direction and penetrates the interior of the insulating layer 60. The conductive wiring 25 is disposed on the upper surface of the second connecting wiring 82 and penetrates the interior of the insulating layer 60. The second columnar wiring 32 extends from the upper surface of the conductive wiring 25 along the positive Z direction and penetrates the interior of the second magnetic layer 12, with its end face exposed on the first main surface 10a of the blank 10. The first vertical wiring 51 and the second vertical wiring 52 are preferably made of the same material as the first inductor wiring 21.

[0131] The first external terminal 41 and the second external terminal 42 are disposed on the first main surface 10a of the blank 10. The first external terminal 41 and the second external terminal 42 are made of conductive material, for example, a three-layer structure in which Cu (low resistance and excellent stress resistance), Ni (excellent corrosion resistance), and Au (excellent solder wettability and reliability) are arranged sequentially from the inside to the outside. The thickness of each Cu / Ni / Au layer is, for example, 5 / 5 / 0.01 μm.

[0132] The first external terminal 41 contacts the end face of the first vertical wiring 51 exposed from the first main surface 10a of the blank 10 and is electrically connected to the first vertical wiring 51. Thus, the first external terminal 41 is electrically connected to the outer peripheral end 22b of the second inductor wiring 22. The second external terminal 42 contacts the end face of the second vertical wiring 52 exposed from the first main surface 10a of the blank 10 and is electrically connected to the second vertical wiring 52. Thus, the second external terminal 42 is electrically connected to the outer peripheral end 21b of the first inductor wiring 21.

[0133] The insulating layer 60 is made of an insulating material that does not contain magnetic materials. Examples of the insulating layer 60 include organic resins such as epoxy resin, phenolic resin, polyimide resin, liquid crystal polymer, and combinations thereof; sintered bodies such as glass and alumina; and thin films such as silicon oxide films, silicon nitride films, and silicon oxynitride films.

[0134] like Figure 3 As shown, in a first cross-section orthogonal to the extension direction of the first inductor wiring 21, the first inductor wiring 21 has a top surface 211 facing the positive Z direction, a bottom surface 212 facing the negative Z direction, a first side surface 213 facing the positive X direction, and a second side surface 214 facing the negative X direction. In the first cross-section, the second inductor wiring 22 has a top surface 221 facing the positive Z direction, a bottom surface 222 facing the negative Z direction, a first side surface 223 facing the positive X direction, and a second side surface 224 facing the negative X direction.

[0135] exist Figure 3 In this embodiment, the positive Z-direction corresponds to the "first direction" as stated in the claims, the negative Z-direction corresponds to the "second direction opposite to the first direction" as stated in the claims, the positive X-direction corresponds to the "third direction orthogonal to the first direction" as stated in the claims, and the negative X-direction corresponds to the "fourth direction opposite to the third direction" as stated in the claims. In this embodiment, the third direction is the radially inner side of the coil 15, and the fourth direction is the radially outer side of the coil 15. Hereinafter, the directions will be described as the first to the fourth directions.

[0136] In the case where the inductor wiring exceeds one turn, as in this embodiment, there are multiple portions in the first cross-section corresponding to each turn of the inductor wiring. In this case, the term "top surface" refers to all the top surfaces formed by the individual top surfaces of the multiple portions. The term "bottom surface" refers to all the bottom surfaces formed by the individual bottom surfaces of the multiple portions. The term "first side surface" refers to the side surface facing the third direction of the portion located on the third direction side of the multiple portions. The term "second side surface" refers to the side surface facing the fourth direction of the portion located on the fourth direction side of the multiple portions.

[0137] The insulating layer 60 has a first top surface portion 611, a bottom surface portion 62, a first side surface portion 63, a second side surface portion 64, a first top surface protrusion 65a, and a bottom surface protrusion 66. The first top surface portion 611 is located closer to a first direction than the top surface 211 of the first inductor wiring 21, the bottom surface portion 62 is located closer to a second direction than the bottom surface 212, the first side surface portion 63 contacts the first side surface 213, and the second side surface portion 64 contacts the second side surface 214. The first top surface protrusion 65a is located at at least one of the following directions: a position where the first top surface portion 611 protrudes further to a third direction than the first side surface portion 63, and a position where the first top surface portion 611 protrudes further to a fourth direction than the second side surface portion 64. The bottom surface protrusion 66 is located at at least one of the following directions: a position where the bottom surface portion 62 protrudes further to a third direction than the first side surface portion 63, and a position where the bottom surface portion 62 protrudes further to a fourth direction than the second side surface portion 64.

[0138] Furthermore, the insulating layer 60 has a second top surface portion 612, a first side surface portion 63, a second side surface portion 64, and a second top surface protrusion 65b. The second top surface portion 612 is located closer to the top surface 221 of the second inductor wiring 22 in a first direction. The first side surface portion 63 contacts the first side surface 223, and the second side surface portion 64 contacts the second side surface 224. The second top surface protrusion 65b is located in at least one of two directions: a position where it protrudes from the second top surface portion 612 in a third direction beyond the first side surface portion 63, and a position where it protrudes from the second top surface portion 612 in a fourth direction beyond the second side surface portion 64. In addition, when multiple inductor wirings are stacked as in this embodiment, there may be multiple top surface protrusions along the Z direction. In this case, as described above, each top surface protrusion is sequentially referred to as "first top surface protrusion," "second top surface protrusion," ..., "Pth top surface protrusion (P: a natural number greater than 2)" with respect to the bottom surface protrusion and moving towards the positive Z direction.

[0139] In this embodiment, the first top surface protrusion 65a, the second top surface protrusion 65b, and the bottom surface protrusion 66 are respectively positioned to protrude further in a third direction than the first side surface portion 63. The protrusion directions of the first top surface protrusion 65a, the second top surface protrusion 65b, and the bottom surface protrusion 66 are parallel to the third direction. The first top surface portion 611 contacts the top surface 211, the first side surface portion 63, and the second side surface portion 64. The second top surface portion 612 contacts the top surface 221, the first side surface portion 63, and the second side surface portion 64. The bottom surface portion 62 contacts the bottom surface 212, the first side surface portion 63, and the second side surface portion 64. Specifically, the first top surface protrusion 65a protrudes from the third-direction side end face of the first top surface portion 611 in a direction parallel to the third direction. The second top surface protrusion 65b protrudes from the third-direction side end face of the second top surface portion 612 in a direction parallel to the third direction. The bottom surface protrusion 66 protrudes from the third-direction side end face of the bottom surface portion 62 in a direction parallel to the third direction.

[0140] Here, in the case of multiple inductor wirings stacked as in this embodiment, the so-called bottom portion refers to the portion of the inductor wiring located closer to the insulating layer in the second direction than the bottom surface of the first layer. In this specification, the portion of the inductor wiring located below the second layer that is closer to the insulating layer in the second direction is not the bottom portion, but rather the top portion corresponding to the inductor wiring present in the next layer. Therefore, in this embodiment, the portion located closer to the insulating layer 60 in the second direction than the bottom surface 222 of the second inductor wiring 22 is not the bottom portion corresponding to the second inductor wiring 22, but rather the first top portion 611 corresponding to the first inductor wiring 21.

[0141] The bottom protrusion 66 is located between the first magnetic layer 11 and the second magnetic layer 12. The first magnetic layer 11 and the second magnetic layer 12 are in contact at the front end of the bottom protrusion 66. In other words, the bottom protrusion 66 is located between the first magnetic layer 11 and the second magnetic layer 12, and its lower surface on the second direction side is in contact with the contact surface of the first magnetic layer 11 with the second magnetic layer 12, and its front end is in contact with the second magnetic layer 12. The protrusion length L1 of the bottom protrusion 66 in the direction parallel to the third direction is longer than the protrusion length L2 of the first top protrusion 65a in the direction parallel to the third direction and the protrusion length L3 of the second top protrusion 65b in the direction parallel to the third direction. The protrusion length L1 is preferably 10 μm or more and 100 μm or less, and 45 μm is an example. The protrusion lengths L2 and L3 are preferably 5 μm or more and 40 μm or less, and 25 μm is an example.

[0142] According to inductor component 1, the bottom protrusion 66 is located between the first magnetic layer 11 and the second magnetic layer 12, and the protrusion length L1 of the bottom protrusion 66 in the direction parallel to the third direction is longer than the protrusion length L2 of the first top protrusion 65a in the direction parallel to the third direction and the protrusion length L3 of the second top protrusion 65b in the direction parallel to the third direction. Therefore, the bottom protrusion 66 ensures the tightness of the first magnetic layer 11 and the second magnetic layer 12. In addition, the contact area between the insulating layer 60 and the blank 10 is increased by the first top protrusion 65a and the second top protrusion 65b, and the tightness of the insulating layer 60 and the blank 10 is improved by the first top protrusion 65a and the second top protrusion 65b penetrating into the blank 10. Thus, the tightness of the insulating layer 60 and the blank 10 can be improved.

[0143] Furthermore, according to inductor component 1, the first magnetic layer 11 and the second magnetic layer 12 contact at the front end of the bottom protrusion 66. Therefore, compared to the case where the bottom protrusion 66 extends towards the center of the coil 15, covering the entire area of ​​the inner magnetic circuit of the coil 15, the volume of the second magnetic layer 12 can be increased. As a result, the inductance acquisition efficiency can be improved. In this way, according to inductor component 1, the adhesion between the insulating layer 60 and the blank 10 can be improved, and the inductor characteristics can also be improved.

[0144] Preferably, the inductor wiring has multiple layers along the first direction, and the coil 15 connects multiple inductor wirings in series to form more than one turn, and the third direction is the inner surface direction of the coil 15.

[0145] According to the above structure, since the bottom protrusion 66 protrudes into the inner magnetic circuit where the contact area of ​​the first magnetic layer 11 and the second magnetic layer 12 is relatively large, the tightness of the insulating layer 60 and the blank 10 can be improved.

[0146] Preferably, there are three or more top surface protrusions 65 and bottom surface protrusions 66 in the first cross-section, and in the first cross-section, at least three of the top surface protrusions 65 and bottom surface protrusions 66 have different protrusion lengths in a direction parallel to the aforementioned third or fourth direction. For example, in Figure 2 In the first cross section shown, the top protrusion 65 and the bottom protrusion 66 have six protrusions: a first top protrusion 65a on the opposite X-direction side, a second top protrusion 65b on the opposite X-direction side, a bottom protrusion 66 on the opposite X-direction side, a first top protrusion 65a on the positive X-direction side, a second top protrusion 65b on the positive X-direction side, and a bottom protrusion 66 on the positive X-direction side.

[0147] According to the above structure, by extending the protruding length of some of the protrusions in the top surface protrusion 65 and the bottom surface protrusion 66, the adhesion between the insulating layer 60 and the blank 10 can be further improved. Furthermore, by shortening the protruding length of some of the protrusions in the top surface protrusion 65 and the bottom surface protrusion 66, the magnetic reluctance of the magnetic circuit can be reduced, and the efficiency of inductance acquisition can be improved.

[0148] Preferably, in the first cross-section, the protruding direction of the bottom protrusion 66 is parallel to a third or fourth direction.

[0149] According to the above structure, when filling the second magnetic layer 12 from the first direction side of the coil 15 to the second direction during manufacturing, the filling is performed in a stable state on the first magnetic layer 11 side, thus enabling more reliable filling of the magnetic circuit with the magnetic layer. Therefore, the inductance can be improved.

[0150] Preferably, the inductor wiring has multiple layers along the first direction, and the coil 15 connects multiple inductor wirings in series to form more than one turn. In the first cross-section, all the top surface protrusions 65 and the bottom surface protrusions 66 are located in any one of the inner magnetic circuit and the outer magnetic circuit of the coil 15.

[0151] Based on the above structure, the adhesion between the insulating layer 60 and the blank 10 can be further improved.

[0152] Preferably, such as Figure 3 As shown, the thickness t1 of the bottom surface 62 of the insulating layer 60 is thinner than the thickness t2 of the first top surface 611 and the thickness t3 of the second top surface 612.

[0153] Based on the above structure, inductance can be improved. Furthermore, since the interlayer insulating layer is affected by the unevenness of the inductor wiring in the lower layer, its thickness needs to be relatively increased. On the other hand, the bottom surface 62, which forms the bottom layer of the insulating layer 60, can be relatively thinned by grinding or the like. Additionally, when manufacturing the inductor component 1, if the insulating layer 60 is formed on a flat substrate, it is even easier to thin the thickness of the bottom surface 62, which forms the bottom layer of the insulating layer 60.

[0154] There are n (n: natural number, n≥2) layers of inductor wiring along the first direction. The material of the insulation layer covering the first layer of inductor wiring is different from the material of the insulation layer covering the m (m: natural number, 2≤m≤n) layer of inductor wiring.

[0155] Here, the term "insulating layer covering the first layer of inductor wiring" refers not only to the insulating layers located on the top, first, and second side surfaces of the first layer of inductor wiring, but also to the insulating layer located on the bottom surface. This structure increases design flexibility. For example, the material of the insulating layer covering the first layer of inductor wiring is preferably selected with consideration for peel strength and stress from the substrate. On the other hand, the material of the insulating layer covering the m-th layer of inductor wiring is preferably selected based on factors such as laser and photolithographic resolution and coverage of steps. Specifically, for example, the material of the insulating layer (bottom surface) at the bottom of the first layer of inductor wiring can be non-photosensitive polyimide, while the material of the insulating layer of the m-th layer of inductor wiring can be photosensitive polyimide. Thus, even if the resin type is the same, different additives and polymer materials will result in different materials. Furthermore, the material of the insulating layer covering the first layer of inductor wiring can be polyimide, while the material of the insulating layer of the m-th layer of inductor wiring can be a combination of an epoxy resin with excellent laser processing and insulating properties and added fillers.

[0156] In the first embodiment, the inductor wiring has two layers, but it can also have three or more layers. If it has three or more layers, the number of turns in the inductor wiring can be increased, thus improving the inductance.

[0157] Here, for example, when adding inductor wiring, the inductor wiring can be stacked one layer, two layers, up to m layers (m is a natural number greater than 3). In this case, the first direction (stacking direction) can be determined based on the wiring shape, etc. For example, in the manufacturing process of inductor wiring, the bottom surface is generally flat, and the top surface is curved. Therefore, the next layer is stacked sequentially along the curved side of the inductor wiring, so the first direction can be said to be from the flat side of the inductor wiring towards the curved side. For example, regarding the diameter of the conductive wires connecting the inductor wirings, in the manufacturing process, the diameter on the top side is larger than the diameter on the bottom side. Therefore, since the larger diameter of the conductive wires is stacked, the first direction can be said to be from the connection surface of the smaller diameter conductive wire towards the connection surface of the larger diameter conductive wire. For example, when using a seed layer to form the inductor wiring, the first direction can be said to be from the side where the seed layer exists towards the side where the seed layer does not exist. Furthermore, the above method for determining the first direction can also be applied in the case of a single layer.

[0158] In the first embodiment, such as Figure 2As shown, the top protrusion 65 and the bottom protrusion 66 protrude into the inner magnetic circuit of the coil 15, but preferably also into the outer magnetic circuit of the coil 15. Specifically, when the first cross-section is set as, for example, the YZ plane including the axis of the coil 15, the insulating layer 60 preferably also has the following in the first cross-section: a first top protrusion provided at a position protruding in a fourth direction from the first top surface portion beyond the second side surface portion; a second top protrusion provided at a position protruding in a fourth direction from the second top surface portion beyond the second side surface portion; and a bottom protrusion provided at a position protruding in a fourth direction from the bottom surface portion beyond the second side surface portion. According to the above structure, the top protrusion 65 and the bottom protrusion 66 also protrude into the outer magnetic circuit, thus further improving the adhesion between the insulating layer 60 and the blank 10.

[0159] (Manufacturing method)

[0160] Next, the manufacturing method of inductor component 1 will be described. Figures 4A to 4N Corresponding to Figure 1 AA section ( Figure 2 ).

[0161] like Figure 4A As shown, a substrate 70 is prepared. The substrate 70 is made of inorganic materials such as ceramic, glass, or silicon. A copper foil 80 is disposed on the main surface of the substrate 70, and a first insulating layer 71 is coated on the copper foil 80 and then cured.

[0162] like Figure 4B As shown, a seed layer (Ti / Cu, not shown) is formed on the first insulating layer 71 by a known method such as sputtering or vapor deposition. Then, a DFR (dry film resist) 75 is attached, and a prescribed pattern is formed on the DFR 75 using a photolithography method.

[0163] like Figure 4C As shown, power is supplied to the seed layer, and the first inductor wiring 21, the first connection wiring 81, and the first dummy wiring 91 are formed on the first insulating layer 71 using electrolytic plating. Then, the DFR 75 is stripped, and the seed layer is etched. This creates a gap between the first inductor wiring 21, the first connection wiring 81, and the first dummy wiring 91.

[0164] like Figure 4DAs shown, a second insulating layer 72 is coated and cured on the first inductor wiring 21, the first connecting wiring 81, and the first dummy wiring 91. At this time, the second insulating layer 72 also fills the aforementioned gaps. Then, the second insulating layer 72 is laser-irradiated to form an opening 72a, exposing portions of the connecting conductive wiring 25 on the upper surfaces of the first dummy wiring 91, the first connecting wiring 81, and the first inductor wiring 21. At this time, a portion of the second insulating layer 72 overlaps with the first dummy wiring 91. This overlapping portion of the second insulating layer 72 corresponds to the first top surface protrusion. Here, the central portion of the second insulating layer 72 on the first dummy wiring 91 may not be removed; for example, a ring-shaped opening may be formed by laser irradiation along the outer periphery of the first dummy wiring 91. This shortens the laser irradiation time. Furthermore, the central portion of the second insulating layer 72 on the first dummy wiring 91 can be removed by peeling it off when removing the first dummy wiring 91.

[0165] like Figure 4E As shown, a seed layer (Ti / Cu, not shown) is formed on the second insulating layer 72 using a known method such as sputtering or vapor deposition. Then, a dry film resist (DFR) 75 is attached, and a predetermined pattern is formed on the DFR 75 using photolithography. Power is supplied to the seed layer, and electroplating is used to form conductive wiring 25, second inductor wiring 22, second connection wiring 82, and second dummy wiring 92 within the opening 72a and on the second insulating layer 72. Then, the DFR 75 is stripped, and the seed layer is etched. This creates gaps between the second inductor wiring 22, the second connection wiring 82, and the second dummy wiring 92.

[0166] like Figure 4FAs shown, a third insulating layer 73 is coated and cured on the second inductor wiring 22, the second connecting wiring 82, and the second dummy wiring 92. At this time, the third insulating layer 73 also fills the aforementioned gaps. Then, the third insulating layer 73 is laser-irradiated to form an opening 73a, exposing portions of the connecting conductive wiring 25 on the upper surfaces of the second dummy wiring 92, the second connecting wiring 82, and the second inductor wiring 22. At this time, a portion of the third insulating layer 73 overlaps with the second dummy wiring 92. This overlapping portion of the third insulating layer 73 corresponds to a second top surface protrusion. Then, a seed layer is formed on the third insulating layer 73. The DFR is then pasted again, and a predetermined pattern is formed on the DFR using photolithography. The predetermined pattern consists of through-holes corresponding to the positions where the first columnar wiring 31 and the second columnar wiring 32 are located on the second inductor wiring 22 and the second connecting wiring 82. Electrolytic plating is used to form conductive wiring 25, first pillar wiring 31, and second pillar wiring 32 on the second inductor wiring 22 and the second connection wiring 82. Afterwards, the DFR is stripped, and the seed layer is etched.

[0167] like Figure 4G As shown, DFR75 is configured to protect the first post wiring 31 and the second post wiring 32.

[0168] like Figure 4H As shown, the first dummy wiring 91 and the second dummy wiring 92 are etched. As a result, the first top surface protrusion 65a, the second top surface protrusion 65b, and the first side surface portion 63 of the insulating layer 60 are formed.

[0169] like Figure 4I As shown, DFR75 is peeled off, and a portion of the first insulating layer 71 is laser-irradiated to form an opening 71a. This forms a bottom protrusion 66 of the insulating layer 60. At this time, copper foil 80 is used as a laser stop layer. Alternatively, copper foil 80 may not be provided, and the first insulating layer 71 may be opened using a laser in each portion of the substrate, or the first insulating layer 71 may be patterned from the beginning using laser, photolithography, or other patterning processes.

[0170] like Figure 4JAs shown, a magnetic sheet is pressed from above the main surface of the substrate 70 toward the first inductor wiring 21 and the second inductor wiring 22 to form a second magnetic layer 12, covering the first inductor wiring 21, the second inductor wiring 22, the first columnar wiring 31, and the second columnar wiring 32. Then, the upper surface of the second magnetic layer 12 is ground so that the end faces of the first columnar wiring 31 and the second columnar wiring 32 are exposed from the upper surface of the second magnetic layer 12. Next, an insulating layer forming a cover film 50 is coated on the upper surface of the second magnetic layer 12. Then, the insulating layer is formed into a predetermined pattern using photolithography and cured. The predetermined pattern is a pattern that allows the cover film 50 to cover the area on the upper surface of the second magnetic layer 12, excluding the area forming the first external terminal 41 and the second external terminal 42.

[0171] like Figure 4K As shown, the substrate 70 and copper foil 80 are removed by grinding. At this time, a portion of the first insulating layer 71 can also be removed.

[0172] like Figure 4L As shown, other magnetic sheets are pressed from below the first inductor wiring 21 toward the first inductor wiring 21 and the second inductor wiring 22 to form the first magnetic layer 11, covering the first inductor wiring 21 and the second inductor wiring 22 through the first magnetic layer 11. Then, the first magnetic layer 11 is ground to a predetermined thickness.

[0173] like Figure 4M As shown, the first external terminals 41 and the second external terminals 42 are formed by electroless electroplating to cover the end faces of the first columnar wiring 31 and the second columnar wiring 32 exposed from the first main surface 10a. The first external terminals 41 and the second external terminals 42 are, for example, Cu / Ni / Au layers stacked sequentially from the first main surface 10a side. Furthermore, before forming the first external terminals 41 and the second external terminals 42, a catalyst such as Pd (not shown) may be applied to the portions of the first external terminals 41 and the second external terminals 42 that contact the upper surface of the blank 10 and the end faces of the first columnar wiring 31 and the second columnar wiring 32.

[0174] like Figure 4N As shown, the inductor component 1 is monolithically formed by cutting line D. The inductor component 1 is manufactured as described above.

[0175] The above describes the manufacturing method of the inductor component, which includes the steps of forming the first inductor wiring 21 and the second inductor wiring 22, forming the insulating layer 60, and forming the blank 10.

[0176] In the process of forming the first inductor wiring 21 and the second inductor wiring 22, the first inductor wiring 21 and the second inductor wiring 22 are formed in a first cross section orthogonal to the extension direction, having a top surface, a bottom surface, a first side surface and a second side surface.

[0177] In the process of forming the insulating layer 60, the insulating layer 60 is formed such that in the first cross section, it has a first top surface portion 611, a second top surface portion 612, a bottom surface portion 62, a first side surface portion 63, a second side surface portion 64, a first top surface protrusion 65a, a second top surface protrusion 65b, and a bottom surface protrusion 66.

[0178] In the process of forming the blank 10, a first magnetic layer 11 and a second magnetic layer 12 are stacked along a first direction to hold the first inductor wiring 21 and the second inductor wiring 22, thereby forming the blank 10.

[0179] Furthermore, in the process of forming the insulating layer 60, the bottom protrusion 66 is located between the first magnetic layer 11 and the second magnetic layer 12, the first magnetic layer 11 and the second magnetic layer 12 are in contact at the front end of the bottom protrusion 66, and the protrusion length of the bottom protrusion 66 in the direction parallel to the third or fourth direction is longer than the protrusion length of the first top protrusion 65a in the direction parallel to the third or fourth direction and the protrusion length of the second top protrusion 65b in the direction parallel to the third or fourth direction.

[0180] According to the above structure, the adhesion between the insulating layer 60 and the blank 10 can be improved, and the characteristics of the inductor can also be improved.

[0181] Preferably, the process of forming the first inductor wiring 21 and the second inductor wiring 22 further includes forming a first dummy wiring 91 at a position that overlaps with the first top surface protrusion 65a when viewed from the first direction, and forming a second dummy wiring 92 at a position that overlaps with the second top surface protrusion 65b. After forming the first inductor wiring 21 and the second inductor wiring 22, a process of removing the first dummy wiring 91 and the second dummy wiring 92 is also included. The process of forming the blank 10 further includes filling the positions where the first dummy wiring 91 and the second dummy wiring 92 have been removed with a second magnetic layer 12. Alternatively, a first magnetic layer 11 may be filled instead of a second magnetic layer 12.

[0182] According to the above structure, a magnetic layer that is in close contact with the first top surface protrusion 65a and the second top surface protrusion 65b can be manufactured at low cost.

[0183] <Second Implementation>

[0184] Figure 5 This is a cross-sectional view showing a second embodiment of the inductor component. Figure 5Is with Figure 2 The corresponding sectional view. The second embodiment differs from the first embodiment in the protrusion length of the top surface protrusion. This difference will be described below. Other structures are the same as in the first embodiment, and the same reference numerals are used as in the first embodiment, with their descriptions omitted.

[0185] like Figure 5 As shown in the first cross-section, the closer the inductor wiring is to the first direction (positive Z direction), the shorter the protrusion length of the top surface protrusion 65A in the direction parallel to the third direction. Specifically, the second inductor wiring 22 is located closer to the first direction side than the first inductor wiring 21. Moreover, the protrusion length of the second top surface protrusion 65bA corresponding to the second inductor wiring 22 in the direction parallel to the third direction is shorter than the protrusion length of the first top surface protrusion 65aA corresponding to the first inductor wiring 21 in the direction parallel to the third direction.

[0186] According to this embodiment, the closer the inductor wiring is to the first direction, the shorter the protrusion length of the top surface protrusion 65A. Therefore, the closer it is to the first direction, the wider the area of ​​the magnetic circuit of the coil 15. As a result, when filling the second magnetic layer 12 from the first direction side of the coil 15 to the second direction during manufacturing, it becomes easier to fill the second magnetic layer 12 into the coil 15, the filling rate is increased, and the inductance can be improved.

[0187] <Third Implementation Method>

[0188] Figure 6 This is a cross-sectional view showing a second embodiment of the inductor component. Figure 6 Is with Figure 2 The corresponding sectional view. The third embodiment differs from the first embodiment in that the top surface protrusion is inclined. This different structure will be described below. Other structures are the same as those in the first embodiment, and the same reference numerals are used as in the first embodiment, with their descriptions omitted.

[0189] like Figure 6 As shown, in the first cross-section, the top surface protrusion 65B is inclined in the second direction (opposite to the Z direction). Specifically, the first top surface protrusion 65aB and the second top surface protrusion 65bB are both inclined in the second direction. The first top surface protrusion 65aB is located closer to the second direction than the top surface 211 of the first inductor wiring 21. The second top surface protrusion 65bB is located closer to the second direction than the top surface 221 of the second inductor wiring 22. Furthermore, in the first cross-section, the first top surface protrusion 65aB and the second top surface protrusion 65bB can also be inclined in the first direction. This helps to suppress the detachment of the first inductor wiring 21 and the second inductor wiring 22 from the blank 10 radially outward.

[0190] According to this embodiment, since the top protrusion 65B is inclined in the second direction, filling the second magnetic layer 12 into the coil 15 from the first direction side to the second direction during manufacturing becomes smoother. Furthermore, due to the inclination of the top protrusion 65B in the second direction, after filling the second magnetic layer 12, it is possible to prevent the second magnetic layer 12 from detaching in the first direction, further improving the adhesion between the insulating layer 60B and the blank 10.

[0191] <Fourth Implementation>

[0192] Figure 7 This is a cross-sectional view showing a fourth embodiment of the inductor component. Figure 7 Is with Figure 2 The corresponding sectional view. The fourth embodiment differs from the third embodiment in that the bottom protrusion is inclined. This different structure will be described below. Other structures are the same as in the third embodiment, and the same reference numerals are used as in the third embodiment, with their descriptions omitted.

[0193] like Figure 7 As shown, in the first cross-section, the bottom protrusion 66C is inclined in the first direction (positive Z direction). The bottom protrusion 66C is located closer to the first direction than the bottom surface 212 of the first inductor wiring 21. Furthermore, similar to the first embodiment, the protrusion length L1 of the bottom protrusion 66C in the direction parallel to the third direction is longer than the protrusion length L2 of the first top protrusion 65aB in the direction parallel to the third direction, and the protrusion length L3 of the second top protrusion 65bB in the direction parallel to the third direction. Thus, the tightness of the first magnetic layer 11 and the second magnetic layer 12 can be ensured via the bottom protrusion 66C.

[0194] According to this embodiment, since the bottom protrusion 66C is inclined in the first direction, filling the first magnetic layer 11 into the coil 15 from the second direction side to the first direction during manufacturing becomes smoother. Furthermore, due to the inclination of the bottom protrusion 66C in the first direction, after filling the first magnetic layer 11, it can resist the first magnetic layer 11 from falling off in the second direction, further improving the adhesion between the insulating layer 60C and the blank 10.

[0195] <Fifth Implementation>

[0196] Figure 8 This is a cross-sectional view showing the fifth embodiment of the inductor component. Figure 8 Is with Figure 2The corresponding sectional view. The fifth embodiment differs from the first embodiment in the structure of the insulating layer and the vertical wiring. This different structure will be described below. Other structures are the same as in the first embodiment, and the same reference numerals are used as in the first embodiment, with their descriptions omitted.

[0197] like Figure 8 As shown, the inductor component 1D of this embodiment is a structure derived from the inductor component 1 of the first embodiment by primarily removing the second top surface portion, the first side surface portion that contacts the first side surface 223 of the second inductor wiring 22, and the second top surface protrusion. Specifically, the top surface 221 and the first side surface 223 of the second inductor wiring 22 are not covered by the insulating layer 60D and are in contact with the second magnetic layer 12. In other words, the insulating layer 60D is not provided on the top surface 221 and the first side surface 223 of the second inductor wiring 22, nor on a portion of the upper surface of the second connecting wiring 82. Furthermore, the area of ​​the upper surface of the second connecting wiring 82 other than the area where the second vertical wiring 52D is provided is not covered by the insulating layer 60D and is in contact with the second magnetic layer 12. In other words, the insulating layer 60D is not provided on the upper surface of the second connecting wiring 82 other than the area where the second vertical wiring 52D is provided. The first vertical wiring 51D is composed only of the first columnar wiring 31. The first columnar wiring 31 is directly connected to the upper surface of the second inductor wiring 22. The second vertical wiring 52D consists of a second columnar wiring 32, a second connecting wiring 82, and a conductive wiring 25. The upper surface of the second columnar wiring 32 is directly connected to the upper surface of the second connecting wiring 82.

[0198] According to this embodiment, since it is not necessary to provide an insulating layer on the top surface 221 and the first side surface 223 of the second inductor wiring 22, the manufacturing process can be simplified. In addition, compared with the case where an insulating layer is provided on the top surface 221 and the first side surface 223, the volume of the magnetic layer can be increased, thereby improving the L value.

[0199] <Sixth Implementation Method>

[0200] Figure 9 This is a top view showing the sixth embodiment of the inductor component. Figure 10 yes Figure 9 A sectional view (AA). The main difference between the sixth embodiment and the first embodiment is the structure of the coil and the insulating layer. This difference in structure will be described below. Other structures are the same as those in the first embodiment, and the same reference numerals are used as in the first embodiment, with their descriptions omitted.

[0201] like Figure 9 and Figure 10As shown, the inductor component 1E includes a blank 10, a coil 15E disposed within the blank 10, an insulating layer 60E of non-magnetic material covering at least a portion of the coil 15E, a first vertical wiring 51, a second vertical wiring 52, and a third vertical wiring 53 disposed within the blank 10 such that their end faces are exposed from a first main surface 10a of the blank 10, and a first external terminal 41, a second external terminal 42, and a third external terminal 43 exposed on the first main surface 10a of the blank 10. For convenience, in Figure 1 In the diagram, the first external terminal 41 to the third external terminal 43 are represented by double-dotted lines.

[0202] The coil 15E has a first inductor wiring 21E and a second inductor wiring 22E. The first inductor wiring 21E and the second inductor wiring 22E extend between the first magnetic layer 11 and the second magnetic layer 12 along a plane orthogonal to the positive Z-direction. Specifically, the first magnetic layer 11 exists in the anti-Z direction of the first inductor wiring 21E and the second inductor wiring 22E, and the second magnetic layer 12 exists in both the positive Z-direction and a direction orthogonal to the positive Z-direction of the first inductor wiring 21E and the second inductor wiring 22E.

[0203] When viewed from the Z direction, the first inductor wiring 21E extends in a straight line along the X direction. When viewed from the Z direction, a portion of the second inductor wiring 22E extends in a straight line along the X direction, and the remaining portion extends in a straight line along the Y direction, that is, it extends in an L-shape.

[0204] The first end 21a of the first inductor wiring 21E is electrically connected to the first vertical wiring 51, and the second end 21b of the first inductor wiring 21E is electrically connected to the second vertical wiring 52. That is, the first inductor wiring 21E has pad portions with large line widths at the first end 21a and the second end 21b, and the pad portions are directly connected to the first vertical wiring 51 and the second vertical wiring 52.

[0205] The first end 22a of the second inductor wiring 22E is electrically connected to the third vertical wiring 53, and the second end 22b of the second inductor wiring 22E is electrically connected to the second vertical wiring 52. That is, the second inductor wiring 22E has a pad portion at its first end 22a, which is directly connected to the third vertical wiring 53. The second end 22b of the second inductor wiring 22E is shared with the second end 21b of the first inductor wiring 21E.

[0206] When viewed from the Z direction, the first end 21a of the first inductor wiring 21E and the first end 22a of the second inductor wiring 22E are located on the first side 10c side of the blank 10. When viewed from the Z direction, the second end 21b of the first inductor wiring 21E and the second end 22b of the second inductor wiring 22E are located on the second side 10d side of the blank 10.

[0207] The first vertical wiring 51 to the third vertical wiring 53 extend along the Z direction from each inductor wiring 21E and 22E, penetrating the interior of the second magnetic layer 12. The first vertical wiring 51 extends from the upper surface of the first end 21a of the first inductor wiring 21E to the first main surface 10a of the blank 10, and the end face of the first vertical wiring 51 is exposed from the first main surface 10a of the blank 10. The second vertical wiring 52 extends from the upper surface of the second end 21b of the first inductor wiring 21A to the first main surface 10a of the blank 10, and the end face of the second vertical wiring 52 is exposed from the first main surface 10a of the blank 10. The third vertical wiring 53 extends from the upper surface of the first end 22a of the second inductor wiring 22E to the first main surface 10a of the blank 10, and the end face of the third vertical wiring 53 is exposed from the first main surface 10a of the blank 10.

[0208] Therefore, the first vertical wiring 51, the second vertical wiring 52, and the third vertical wiring 53 extend in a straight line from the first inductor wiring 21E and the second inductor wiring 22E to the end face exposed from the first main surface 10a, in a direction orthogonal to the first main surface 10a. This allows for the connection of the first external terminal 41, the second external terminal 42, the third external terminal 43, and the first inductor wiring 21E and the second inductor wiring 22E with a shorter distance, enabling low resistance and high inductance in the inductor component 1E.

[0209] The first vertical wiring 51 has a conductive wiring (not shown) and a first columnar wiring 31, wherein the conductive wiring penetrates the interior of the insulating layer 60, and the first columnar wiring 31 extends upward from the conductive wiring and penetrates the interior of the second magnetic layer 12. The second vertical wiring 52 has a conductive wiring (not shown) and a second columnar wiring 32, wherein the conductive wiring penetrates the interior of the insulating layer 60, and the second columnar wiring 32 extends upward from the conductive wiring and penetrates the interior of the second magnetic layer 12. The third vertical wiring 53 has a conductive wiring (not shown) and a third columnar wiring 33, wherein the conductive wiring penetrates the interior of the insulating layer 60, and the third columnar wiring 33 extends upward from the conductive wiring and penetrates the interior of the second magnetic layer 12.

[0210] First external terminals 41 to third external terminals 43 are disposed on the first main surface 10a of the blank 10. The first external terminal 41 contacts the end face of the first vertical wiring 51 exposed from the first main surface 10a of the blank 10 and is electrically connected to the first vertical wiring 51. Thus, the first external terminal 41 is electrically connected to the first end 21a of the first inductor wiring 21E. The second external terminal 42 contacts the end face of the second vertical wiring 52 exposed from the first main surface 10a of the blank 10 and is electrically connected to the second vertical wiring 52. Thus, the second external terminal 42 is electrically connected to the second end 21b of the first inductor wiring 21E and the second end 22b of the second inductor wiring 22E. The third external terminal 43 contacts the end face of the third vertical wiring 53 and is electrically connected to the third vertical wiring 53, and is electrically connected to the first end 22a of the second inductor wiring 22E.

[0211] like Figure 10 As shown, in a first cross section orthogonal to the extension directions of the first inductor wiring 21E and the second inductor wiring 22E, the first inductor wiring 21E and the second inductor wiring 22E respectively have a top surface 211 facing the positive Z direction, a bottom surface 212 facing the negative Z direction, a first side surface 213 facing the negative Y direction, and a second side surface 214 facing the positive Y direction.

[0212] exist Figure 10 In the claims, the positive Z direction corresponds to the "first direction" as stated in the claims, the negative Z direction corresponds to the "second direction opposite to the first direction" as stated in the claims, the negative Y direction corresponds to the "third direction orthogonal to the first direction" as stated in the claims, and the positive Y direction corresponds to the "fourth direction opposite to the third direction" as stated in the claims. The following are examples of directions referred to as the first to fourth directions.

[0213] The insulating layer 60E includes: a top portion 61 located closer to a first direction than the top surface 211; a bottom portion 62 located closer to a second direction than the bottom surface 212; a first side portion 63 contacting a first side portion 213; a second side portion 64 contacting a second side portion 214; a first top surface protrusion 651 located at a position protruding from the top portion 61 in a third direction beyond the first side portion 63; a second top surface protrusion 652 located at a position protruding from the top portion 61 in a fourth direction beyond the second side portion 64; a first bottom surface protrusion 661 located at a position protruding from the bottom portion 62 in a third direction beyond the first side portion 63; and a second bottom surface protrusion 662 located at a position protruding from the bottom portion 62 in a fourth direction beyond the second side portion 64. The top portion 61 contacts the top surface 211, the first side portion 63, and the second side portion 64, and the bottom portion 62 contacts the bottom surface 212, the first side portion 63, and the second side portion 64.

[0214] The first bottom protrusion 661 and the second bottom protrusion 662 are located between the first magnetic layer 11 and the second magnetic layer 12. The first magnetic layer 11 and the second magnetic layer 12 are in contact with the front ends of the first bottom protrusion 661 and the second bottom protrusion 662, respectively. In other words, the first bottom protrusion 661 and the second bottom protrusion 662 are located between the first magnetic layer 11 and the second magnetic layer 12, respectively, and their lower surfaces in the second direction are in contact with the contact surface of the first magnetic layer 11 with the second magnetic layer 12, and their front ends are in contact with the second magnetic layer 12. The protrusion length of the first bottom protrusion 661 in the direction parallel to the third direction is longer than the protrusion length of the first top protrusion 651 in the direction parallel to the third direction and the protrusion length of the second top protrusion 652 in the direction parallel to the fourth direction. The protrusion length of the second bottom protrusion 662 in the direction parallel to the third direction is longer than the protrusion length of the first top protrusion 651 in the direction parallel to the third direction and the protrusion length of the second top protrusion 652 in the direction parallel to the fourth direction.

[0215] According to this embodiment, by protruding the relatively long first bottom surface protrusion 661 and the second bottom surface protrusion 662, the tightness of the first magnetic layer 11 and the second magnetic layer 12 can be ensured. Furthermore, by protruding the first top surface protrusion 651 and the second top surface protrusion 652, the contact area between the insulating layer 60E and the blank 10 is increased, and by extending the first top surface protrusion 651 and the second top surface protrusion 652 into the blank 10, the tightness of the insulating layer 60E and the blank 10 is improved. Thus, the tightness of the insulating layer 60E and the blank 10 can be improved. Moreover, according to this embodiment, the first magnetic layer 11 and the second magnetic layer 12 are in contact at the front ends of the first bottom surface protrusion 661 and the second bottom surface protrusion 662. Therefore, compared to the case where the front ends of the first bottom surface protrusion 661 and the second bottom surface protrusion 662 are in contact and connected, the volume of the second magnetic layer 12 can be increased. As a result, the efficiency of inductance acquisition can be improved. Thus, according to the inductor component 1E, the adhesion between the insulating layer 60E and the blank 10 can be improved, and the inductor characteristics can also be improved.

[0216] Furthermore, due to the presence of the first top surface protrusion 651, the second top surface protrusion 652, the first bottom surface protrusion 661, and the second bottom surface protrusion 662, the contact area between the insulating layer 60E and the blank 10 can be increased more effectively. Additionally, the first top surface protrusion 651, the second top surface protrusion 652, the first bottom surface protrusion 661, and the second bottom surface protrusion 662 can penetrate deep into the blank 10. Therefore, the adhesion between the insulating layer 60E and the blank 10 can be further improved.

[0217] Preferably, in the first cross-section, the protrusion length of the first top surface protrusion 651 in the direction parallel to the third direction is different from the protrusion length of the second top surface protrusion 652 in the direction parallel to the fourth direction.

[0218] According to the above structure, by extending the length of one of the first top surface protrusion 651 and the second top surface protrusion 652, the adhesion between the insulating layer 60E and the blank 10 can be further improved. Furthermore, by shortening the length of the other of the first top surface protrusion 651 and the second top surface protrusion 652, the magnetic reluctance of the magnetic circuit can be reduced, thereby improving the efficiency of inductance acquisition.

[0219] Preferably, in the first cross-section, the protrusion length of the first bottom protrusion 661 in the direction parallel to the third direction is different from the protrusion length of the second top protrusion 652 in the direction parallel to the fourth direction.

[0220] According to the above structure, by extending the length of one of the first bottom surface protrusion 661 and the second bottom surface protrusion 662, the adhesion between the insulating layer 60E and the blank 10 can be further improved. Furthermore, by shortening the length of the other of the first bottom surface protrusion 661 and the second bottom surface protrusion 662, the magnetic reluctance of the magnetic circuit can be reduced, thereby improving the efficiency of inductance acquisition.

[0221] Furthermore, this disclosure is not limited to the embodiments described above, and design changes can be made without departing from the spirit of this disclosure. For example, various combinations of the various feature points of the first to sixth embodiments can be made.

[0222] In the above embodiments, the so-called "inductor wiring" refers to wiring that imparts inductance to an inductor component by generating magnetic flux in a magnetic layer when current flows. Its structure, shape, and material are not particularly limited. In particular, it is not limited to straight lines or curves (spirals = two-dimensional curves) extending on a plane as in the embodiments described above; various known wiring shapes, such as curved wiring, can be used.

[0223] In the first to fifth embodiments, the inductor wiring has two layers, but it can also be a single layer. In the sixth embodiment, the inductor wiring has one layer, but it can also have two or more layers. If it is a single layer, the thickness of the inductor component can be reduced. If it is two or more layers, the number of turns of the inductor wiring can be increased, thereby improving the inductance.

[0224] In the first to fifth embodiments, the top surface protrusion and the bottom surface protrusion are respectively positioned to protrude in a third direction beyond the first side surface. However, they can be positioned in at least one of the positions protruding in a third direction beyond the first side surface and protruding in a fourth direction beyond the second side surface. In other words, in the first embodiment, the top surface protrusion and the bottom surface protrusion are respectively positioned to protrude into the inner magnetic circuit of the coil. However, they can be positioned to protrude into either the inner magnetic circuit or the outer magnetic circuit of the coil.

[0225] In the sixth embodiment, the top protrusion and the bottom protrusion are respectively positioned at a position that protrudes in a third direction beyond the first side surface and a position that protrudes in a fourth direction beyond the second side surface, but they can be positioned in at least one of the positions that protrudes in a third direction beyond the first side surface and a position that protrudes in a fourth direction beyond the second side surface.

Claims

1. An inductor component comprising: The blank, the coil disposed within the blank, and the insulating layer of a non-magnetic body covering at least a portion of the coil. The aforementioned blank has a first magnetic layer and a second magnetic layer stacked sequentially along a first direction. The aforementioned coil has inductor wiring, wherein, The aforementioned inductor wiring extends between the first magnetic layer and the second magnetic layer along a plane orthogonal to the first direction. In the first cross section orthogonal to the extension direction of the aforementioned inductor wiring, The aforementioned inductor wiring has: a top surface facing the first direction, a bottom surface facing a second direction opposite to the first direction, a first side surface facing a third direction orthogonal to the first direction, and a second side surface facing a fourth direction opposite to the third direction. The above-mentioned insulating layer has the following characteristics: The top surface is located closer to the first direction than the aforementioned top surface; The bottom surface is located closer to the second direction than the aforementioned bottom surface; The first side face is in contact with the aforementioned first side face; The second side surface is in contact with the aforementioned second side surface; A top surface protrusion is provided at a position in at least one of the following directions: a position where it protrudes further in a third direction from the top surface portion than the first side surface portion and a position where it protrudes further in a fourth direction from the top surface portion than the second side surface portion; and The bottom protrusion is located in at least one of the following directions: a position where it protrudes further in a third direction than the first side surface and a position where it protrudes further in a fourth direction than the second side surface. The aforementioned bottom protrusion is located between the aforementioned first magnetic layer and the aforementioned second magnetic layer. The first magnetic layer and the second magnetic layer are in contact at the front end of the bottom protrusion. The protruding length of the bottom protrusion in the direction parallel to the third or fourth direction is longer than the protruding length of the top protrusion in the direction parallel to the third or fourth direction. The length of the bottom protrusion in the direction parallel to the third or fourth direction is at least 1.8 times the length of the top protrusion in the direction parallel to the third or fourth direction.

2. The inductor component according to claim 1, wherein, The aforementioned inductor wiring has multiple layers along the first direction. The aforementioned coil connects multiple inductors in series to form one or more turns. The aforementioned third direction is the direction of the inner surface of the aforementioned coil.

3. The inductor component according to claim 1 or 2, wherein, There are three or more of the aforementioned top surface protrusions and bottom surface protrusions in the aforementioned first cross-section. In the first cross section, at least three of the top protrusions and the bottom protrusions have different protrusion lengths in a direction parallel to the third or fourth direction.

4. The inductor component according to claim 1 or 2, wherein, The aforementioned inductor wiring has multiple layers along the first direction. In the first cross section, the closer the inductor wiring is to the first direction, the shorter the protrusion length of the top surface protrusion in the direction parallel to the third or fourth direction.

5. The inductor component according to claim 1 or 2, wherein, The aforementioned inductor wiring has multiple layers along the first direction. In the first cross section, the top protrusion is inclined in the second direction.

6. The inductor component according to claim 1 or 2, wherein, In the first cross section described above, the protruding direction of the bottom protrusion is parallel to the third or fourth direction described above.

7. The inductor component according to claim 1 or 2, wherein, In the first cross section, the bottom protrusion is inclined in the first direction.

8. The inductor component according to claim 1 or 2, wherein, The aforementioned inductor wiring has multiple layers along the first direction. The aforementioned coil connects multiple inductors in series to form one or more turns. In the first cross section described above, all of the aforementioned top surface protrusions and bottom surface protrusions are located in either the inner magnetic circuit or the outer magnetic circuit of the coil.

9. The inductor component according to claim 1 or 2, wherein, The aforementioned top surface protrusion includes a protrusion protruding in the aforementioned third direction and a protrusion protruding in the aforementioned fourth direction. The aforementioned bottom protrusion includes a protrusion protruding in the aforementioned third direction and a protrusion protruding in the aforementioned fourth direction.

10. The inductor component according to claim 1 or 2, wherein, The aforementioned top surface protrusion includes a protrusion protruding in the aforementioned third direction and a protrusion protruding in the aforementioned fourth direction. In the first cross section described above, the protrusion length of the protrusion protruding to the third direction in the direction parallel to the third direction is different from the protrusion length of the protrusion protruding to the fourth direction in the direction parallel to the fourth direction.

11. The inductor component according to claim 1 or 2, wherein, The aforementioned bottom protrusion includes a protrusion protruding in the aforementioned third direction and a protrusion protruding in the aforementioned fourth direction. In the first cross section described above, the protrusion length of the protrusion protruding to the third direction in the direction parallel to the third direction is different from the protrusion length of the protrusion protruding to the fourth direction in the direction parallel to the fourth direction.

12. The inductor component according to claim 1 or 2, wherein, In the first cross section, the top protrusion is inclined in the first direction or the second direction.

13. The inductor component according to claim 1 or 2, wherein, The thickness of the bottom portion of the aforementioned insulating layer is thinner than the thickness of the top portion.

14. The inductor component according to claim 1 or 2, wherein, The aforementioned inductor wiring has n layers along the first direction, where n is a natural number, n≥2. The material of the insulating layer covering the inductor wiring of the first layer is different from the material of the insulating layer covering the inductor wiring of the m-th layer, where m is a natural number and 2≤m≤n.

15. An inductor component comprising: The blank, the coil disposed within the blank, and the insulating layer of a non-magnetic body covering at least a portion of the coil. The aforementioned blank has a first magnetic layer and a second magnetic layer stacked sequentially along a first direction. The aforementioned coil has inductor wiring, wherein, The aforementioned inductor wiring extends between the first magnetic layer and the second magnetic layer along a plane orthogonal to the first direction. In the first cross section orthogonal to the extension direction of the aforementioned inductor wiring, The aforementioned inductor wiring has: a top surface facing the first direction, a bottom surface facing a second direction opposite to the first direction, a first side surface facing a third direction orthogonal to the first direction, and a second side surface facing a fourth direction opposite to the third direction. The above-mentioned insulating layer has the following characteristics: The top surface is located closer to the first direction than the aforementioned top surface; The bottom surface is located closer to the second direction than the aforementioned bottom surface; The first side face is in contact with the aforementioned first side face; The second side surface is in contact with the aforementioned second side surface; A top surface protrusion is provided at a position in at least one of the following directions: a position where it protrudes further in a third direction from the top surface portion than the first side surface portion and a position where it protrudes further in a fourth direction from the top surface portion than the second side surface portion; and The bottom protrusion is located in at least one of the following directions: a position where it protrudes further in a third direction than the first side surface and a position where it protrudes further in a fourth direction than the second side surface. The aforementioned bottom protrusion is located between the aforementioned first magnetic layer and the aforementioned second magnetic layer. The first magnetic layer and the second magnetic layer are in contact at the front end of the bottom protrusion. The protruding length of the bottom protrusion in the direction parallel to the third or fourth direction is longer than the protruding length of the top protrusion in the direction parallel to the third or fourth direction. The aforementioned inductor wiring has multiple layers along the first direction. In the plurality of the aforementioned inductor wirings, the top surface of the inductor wiring closest to the first direction side is not covered by the aforementioned top surface and is in contact with the aforementioned second magnetic layer.

16. An inductor component comprising: The blank, the coil disposed within the blank, and the insulating layer of a non-magnetic body covering at least a portion of the coil. The aforementioned blank has a first magnetic layer and a second magnetic layer stacked sequentially along a first direction. The aforementioned coil has inductor wiring, wherein, The aforementioned inductor wiring extends between the first magnetic layer and the second magnetic layer along a plane orthogonal to the first direction. In the first cross section orthogonal to the extension direction of the aforementioned inductor wiring, The aforementioned inductor wiring has: a top surface facing the first direction, a bottom surface facing a second direction opposite to the first direction, a first side surface facing a third direction orthogonal to the first direction, and a second side surface facing a fourth direction opposite to the third direction. The above-mentioned insulating layer has the following characteristics: The top surface is located closer to the first direction than the aforementioned top surface; The bottom surface is located closer to the second direction than the aforementioned bottom surface; The first side face is in contact with the aforementioned first side face; The second side surface is in contact with the aforementioned second side surface; A top surface protrusion is provided at a position in at least one of the following directions: a position where it protrudes further in a third direction from the top surface portion than the first side surface portion and a position where it protrudes further in a fourth direction from the top surface portion than the second side surface portion; and The bottom protrusion is located in at least one of the following directions: a position where it protrudes further in a third direction than the first side surface and a position where it protrudes further in a fourth direction than the second side surface. The aforementioned bottom protrusion is located between the aforementioned first magnetic layer and the aforementioned second magnetic layer. The first magnetic layer and the second magnetic layer are in contact at the front end of the bottom protrusion. The protruding length of the bottom protrusion in the direction parallel to the third or fourth direction is longer than the protruding length of the top protrusion in the direction parallel to the third or fourth direction. The aforementioned top protrusion is inclined in the aforementioned second direction, and the protrusion direction of the aforementioned bottom protrusion is parallel to the aforementioned third direction or the aforementioned fourth direction.

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