Liquid supply unit, apparatus for processing a substrate, and method of processing a substrate

By introducing a cooling gas supply line and controller into the substrate processing apparatus, the problem of overheating of aqueous phosphoric acid solution in emergency situations was solved, achieving effective cooling of the heater and protection of the apparatus.

CN116264176BActive Publication Date: 2026-06-26SYSTEM ENGINEERING MEGA SOLUTION CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SYSTEM ENGINEERING MEGA SOLUTION CO LTD
Filing Date
2022-12-08
Publication Date
2026-06-26

AI Technical Summary

Technical Problem

In the substrate processing apparatus, when the pumps and heaters stop operating, the temperature of the aqueous phosphoric acid solution in the circulation pipeline may rise to 200°C or higher, leading to component damage and liquid leakage.

Method used

A liquid supply unit is designed, including a cooling gas supply line and a controller, for stopping the operation of the pump in an emergency and cooling the heater unit with the cooling gas to prevent the residual liquid from overheating.

Benefits of technology

It effectively prevents high temperatures caused by residual heat in the heater, protects the device components, and avoids liquid leakage and damage.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention relates to a liquid supply unit, an apparatus for processing a substrate, and a method of processing a substrate. Disclosed is a method of processing a substrate, the method including adjusting a temperature of a process liquid by heating the process liquid using a heater unit installed in a circulation line coupled to a housing of a tank with the process liquid circulated in the housing, processing the substrate by supplying the substrate with the temperature-controlled process liquid in a normal mode, and discharging the process liquid in the circulation line to an outside of the circulation line through a discharge line connected to the circulation line in an emergency mode.
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Description

[0001] Cross-references to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2021-0178482, filed with the Korean Intellectual Property Office on December 14, 2021, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present invention relates to a substrate processing method and a substrate processing apparatus, and more particularly to a liquid supply unit for supplying high-temperature liquid to a substrate, as well as a substrate processing apparatus and a substrate processing method. Background Technology

[0004] Semiconductor processes include cleaning thin films, impurities, and particles from a substrate. These processes are performed by placing the substrate on a rotating head with the patterned sides facing up or down, supplying a processing solution to the substrate while the rotating head is rotating, and then drying the wafer.

[0005] In recent years, high-temperature liquids such as aqueous phosphoric acid solutions have been used as processing fluids. For example, an aqueous phosphoric acid solution contains phosphoric acid and water. The liquid supply unit includes a supply tank, a liquid supply line, and nozzles. The supply tank is regulated so that the temperature of the aqueous phosphoric acid solution and the concentration of phosphoric acid meet the process conditions. The aqueous phosphoric acid solution with the regulated concentration and temperature is supplied from the supply tank to the nozzles through the liquid supply line.

[0006] Figure 1 An illustration of an embodiment of the supply tank 900 is shown for illustrative purposes. (See reference...) Figure 1 The supply tank 900 includes a shell 920 and a circulation line 940. Furthermore, the shell 920 is connected to a liquid inlet line 960, a waste liquid discharge line 950, and an exhaust line 970. Liquid is supplied to the shell 920 from the outside through the liquid inlet line, the waste liquid discharge line is used to discharge waste liquid from the shell 920, and the exhaust line is used to discharge water vapor evaporated in the shell 920.

[0007] Pump (P) 942 and heater (H) 944 are installed in circulation line 940. The aqueous phosphoric acid solution in housing 920 is heated by heater 944 as it flows along circulation line 940. As the aqueous phosphoric acid solution circulates through circulation line 940, the concentration of phosphoric acid in the aqueous phosphoric acid solution is adjusted by evaporating water in the solution through heating.

[0008] Typically, heater 944 maintains a very high temperature because phosphoric acid is supplied to the substrate at temperatures above 150°C. However, in the event of an emergency in the equipment during this process, both pump 942 and heater 944 cease operation. Emergency situations can occur in various circumstances, such as when the processing fluid leaks during the process, or when the temperature or flow rate of the processing fluid exceeds the set range.

[0009] In the event of an emergency where the aqueous phosphoric acid solution circulates through circulation line 940 and pump 942 stops, the temperature of the aqueous phosphoric acid solution remaining in circulation line 940 may rise to 200°C or higher due to the residual heat of heater 944. In this situation, components in contact with the hot aqueous phosphoric acid solution may be damaged. If the components connecting the ports and fittings to heater 942 are damaged, the aqueous phosphoric acid solution may leak from circulation line 940. Summary of the Invention

[0010] The present invention aims to provide a substrate processing apparatus and method, and a liquid supply unit for the substrate processing apparatus and method, which can prevent the liquid from being heated to a high temperature by the residual heat of the heater in the circulation line provided in the tank, even in the event of an emergency in the apparatus and when the pump stops operating.

[0011] The purpose of this invention is not limited thereto, and other purposes not mentioned will be clearly understood by those skilled in the art from the following description.

[0012] Another exemplary embodiment of the present invention provides an apparatus for processing a substrate, the apparatus comprising: a cup-shaped object having a processing space disposed therein; a support unit for supporting and rotating the substrate in the processing space; a nozzle for supplying a processing liquid to the substrate; and a liquid supply unit for supplying the processing liquid to the nozzle, wherein the liquid supply unit comprises: a tank for storing the processing liquid, and the tank comprising: a housing having a space for storing the processing liquid therein; a circulation line connected to the housing to circulate the processing liquid within the housing; a heater unit mounted in the circulation line to heat the processing liquid; and a discharge line for discharging the processing liquid remaining in the circulation line, and the discharge line including an installed discharge valve.

[0013] According to an exemplary embodiment, the liquid supply unit may further include a cooling gas supply line that supplies cooling gas to the heater unit, and a cooling valve is installed in the cooling gas supply line.

[0014] According to an exemplary embodiment, the cooling gas supply line can be connected to the circulation line.

[0015] According to an exemplary embodiment, the cooling gas supply line can be connected to a circulation line downstream of the heater unit.

[0016] According to an exemplary embodiment, the cooling gas supply line can be connected to a circulation line to supply cooling gas in the direction toward the heater unit.

[0017] According to another exemplary embodiment, a cooling gas supply line can be connected to the housing.

[0018] According to an exemplary embodiment, the pump unit can be installed in the circulation line, and the discharge line can be connected to the circulation line between the pump unit and the heater unit.

[0019] According to an exemplary embodiment, the circulation pipeline may include: a first pipeline whose longitudinal direction is arranged in the vertical direction; a second pipeline extending from the first pipeline and connected to the housing so as to be arranged upstream of the first pipeline; and a third pipeline extending from the first pipeline and connected to the housing so as to be arranged downstream of the first pipeline, and a pump unit may be installed in the first pipeline, the cooling gas supply pipeline may be connected to the third pipeline, and the discharge pipeline may be connected to the first pipeline.

[0020] According to an exemplary embodiment, a cooling gas supply line may be connected to the housing, and an exhaust line for discharging the internal atmosphere may be connected to the housing.

[0021] According to an exemplary embodiment, the device may further include: a controller for controlling a liquid supply unit, wherein the controller can control the liquid supply unit to heat the processing liquid using a heater unit in a normal mode while the processing liquid circulates in the housing through a circulation line with the discharge valve closed, and to change the state of the discharge valve to an open state in an emergency mode to discharge the processing liquid remaining in the circulation line to the discharge line, and to stop the operation of the pump unit in an emergency mode.

[0022] According to an exemplary embodiment, the device may further include a controller for controlling the liquid supply unit, wherein the controller can control the liquid supply unit to heat the processing liquid using a heater unit in normal mode while the processing liquid circulates in the housing through a circulation line with the discharge valve closed, and to change the state of the discharge valve to an open state in emergency mode to discharge the processing liquid remaining in the circulation line to the discharge line, and to open a cooling valve to supply cooling gas to the circulation line, and to stop the operation of the pump unit in emergency mode.

[0023] Another exemplary embodiment of the present invention provides a liquid supply unit for supplying a processing liquid, the liquid supply unit comprising: a housing having a space for storing the processing liquid therein; a circulation line coupled to the housing to circulate the processing liquid within the housing; a heater unit mounted in the circulation line to heat the processing liquid; a pump unit mounted in the circulation line; and a discharge line for discharging the processing liquid remaining in the circulation line, the discharge line including an installed discharge valve.

[0024] The discharge line can be connected to the circulation line between the pump unit and the heater unit.

[0025] According to an exemplary embodiment, the liquid supply unit may further include a cooling gas supply line for supplying cooling gas to the heater unit and includes an installed cooling valve.

[0026] According to an exemplary embodiment, the liquid supply unit may further include a controller for controlling the liquid supply unit, wherein the controller may control the valve to heat the processing liquid by means of a heater unit in normal mode, wherein the processing liquid is circulated in the housing through the circulation line with the discharge valve closed, and to change the state of the discharge valve to open in emergency mode to discharge the processing liquid remaining in the circulation line to the discharge line, and the emergency mode is a mode in which the operation of the pump unit can be stopped.

[0027] According to an exemplary embodiment, the liquid supply unit may further include a controller for controlling the liquid supply unit, wherein the controller may control a valve to heat the processing liquid using a heater unit in normal mode while the processing liquid circulates in the housing through a circulation line with the discharge valve closed, and to change the state of the discharge valve to open in emergency mode to discharge the processing liquid remaining in the circulation line to the discharge line, and to open a cooling valve to supply cooling gas to the circulation line.

[0028] Another exemplary embodiment of the present invention provides a method for processing a substrate, the method comprising: adjusting the temperature of a processing liquid by heating the processing liquid using a heater unit installed in the circulation line while the processing liquid is circulated in the housing via a circulation line connected to the housing of the tank; processing the substrate in a normal mode by supplying the substrate with the temperature-controlled processing liquid; and discharging the processing liquid in the circulation line to the outside of the circulation line via a discharge line connected to the circulation line in an emergency mode.

[0029] According to an exemplary embodiment, the operation of the pump unit installed in the circulation line can be stopped in emergency mode, and in emergency mode, cooling gas can be supplied to the circulation line to cool the pump unit.

[0030] According to an exemplary embodiment, the discharge line can be connected to the circulation line between the pump unit and the heater unit.

[0031] According to an exemplary embodiment, the treatment fluid may contain phosphoric acid.

[0032] According to an exemplary embodiment of the present invention, even in the event of an emergency in the supply tank, it is possible to prevent the liquid from being heated to a high temperature by the residual heat of the heater.

[0033] Furthermore, according to an exemplary embodiment of the present invention, in the event of an emergency in the supply tank, damage to components in the supply tank caused by the processing fluid heated to high temperatures can be prevented.

[0034] The effects of the present invention are not limited to those described above, and those skilled in the art can clearly understand from this specification and the accompanying drawings the effects not mentioned. Attached Figure Description

[0035] Figure 1 The diagram illustrates the structure of a typical liquid supply unit.

[0036] Figure 2 A top plan view of a substrate processing apparatus according to an exemplary embodiment of the present invention is shown schematically.

[0037] Figure 3 For illustrative purposes only Figure 2 An illustration of an exemplary embodiment of a liquid handling chamber.

[0038] Figure 4 The illustration shows an embodiment of a liquid supply unit according to an exemplary embodiment of the present invention.

[0039] Figure 5 For illustrative purposes only Figure 4 An illustration of an embodiment of the heater unit.

[0040] Figures 6 to 8 To show Figure 4 The diagram illustrates the liquid supply unit in normal and emergency modes, the open and closed states of the valves in the supply tank, and the fluid flow in the circulation pipeline.

[0041] Figure 9 and Figure 10 Each of them showed Figure 4 The illustration shows a modified embodiment of the cooling gas supply pipeline in the liquid supply unit.

[0042] Figure 11 To illustrate Figure 4An illustration of another exemplary embodiment of the liquid supply unit.

[0043] Figures 12 to 14 To show Figure 11 The diagram illustrates the liquid supply unit in normal and emergency modes, the open and closed states of the valves in the supply tank, and the fluid flow in the circulation pipeline.

[0044] Figure 15 To illustrate Figure 4 A diagram illustrating another exemplary embodiment of the liquid supply unit.

[0045] Figures 16 to 18 To show Figure 15 The diagram illustrates the liquid supply unit in normal and emergency modes, the open and closed states of the valves in the supply tank, and the fluid flow in the circulation pipeline.

[0046] Figure 19 and Figure 20 The diagrams schematically illustrate the connection status of the liquid supply unit and the liquid processing chamber, respectively. Detailed Implementation

[0047] In the following description, exemplary embodiments of the invention will be described in more detail with reference to the accompanying drawings. These exemplary embodiments may be modified in various ways, and the scope of the invention should not be construed as limited to the following exemplary embodiments. These exemplary embodiments are provided to explain the invention more fully to those skilled in the art. Therefore, the shapes of the elements in the drawings are exaggerated for clearer illustration.

[0048] Figure 2 A top plan view of a substrate processing apparatus according to an exemplary embodiment of the present invention is shown schematically.

[0049] refer to Figure 2 The substrate processing apparatus includes an indexing module 10, a processing module 20, and a controller. According to an exemplary embodiment, the indexing module 10 and the processing module 20 are arranged along one direction. Hereinafter, the direction in which the indexing module 10 and the processing module 20 are arranged is referred to as a first direction 92, a direction perpendicular to the first direction 92 when viewed from above is referred to as a second direction 94, and a direction perpendicular to both the first direction 92 and the second direction 94 is referred to as a third direction 96.

[0050] The indexing module 10 transfers the substrate W from the container 80 containing the substrate W to the processing module 20, and accommodates the substrate W, which has already been fully processed in the processing module 20, within the container 80. The longitudinal direction of the indexing module 10 is arranged in the second direction 94. The indexing module 10 includes a loading port 12 and an index frame 14. Based on the index frame 14, the loading port 12 is located on the opposite side of the processing module 20. The container 80 containing the substrate W is placed on the loading port 12. Multiple loading ports 12 can be provided, and multiple loading ports 12 can be arranged in the second direction 94.

[0051] An airtight container F, such as a front-open unified pod (FOUP), can be used as container F. Container 80 can be placed on loading port 12 by means of a conveying device (not shown) such as an overhead conveyor, overhead transport, or automated guided vehicle, or by an operator.

[0052] An indexing robot 120 is disposed on an indexing frame 14. A guide rail 140 (with its longitudinal direction being a second direction 94) is disposed within the indexing frame 14, and the indexing robot 120 can be configured to be movable on the guide rail 140. The indexing robot 120 includes a hand 122 on which a substrate W is placed, and the hand 122 can be configured to be movable forward and backward, rotatable based on a third direction 96 as an axis, and movable in the third direction 96. A plurality of hands 122 are configured to be spaced apart in the vertical direction, and the hands 122 can move forward and backward independently of each other.

[0053] The processing module 20 includes a buffer unit 200, a transfer chamber 300, and a liquid processing chamber 400. The buffer unit 200 provides space for the substrate W loaded into and unloaded from the processing module 20 to temporarily reside. The liquid processing chamber 400 performs a liquid processing process on the substrate W by supplying liquid onto the substrate W. The transfer chamber 300 transfers the substrate W between the buffer unit 200 and the liquid processing chamber 400.

[0054] The transfer chamber 300 can be configured such that the longitudinal direction is a first direction 92. A buffer unit 200 can be disposed between the index module 10 and the transfer chamber 300. Multiple liquid processing chambers 400 are provided, and these chambers are disposed on the sides of the transfer chamber 300. The liquid processing chambers 400 and the transfer chamber 300 can be disposed in a second direction 94. The buffer unit 220 can be located at one end of the transfer chamber 300.

[0055] According to an embodiment, liquid processing chambers 400 can be respectively disposed on both sides of transfer chamber 300. On each side of transfer chamber 300, liquid processing chambers 400 can be arranged in an A×B array (each of A and B is a natural number of 1 or greater than 1) along a first direction 92 and a third direction 96.

[0056] The transfer chamber 300 includes a transfer manipulator 320. A guide rail 340 (with its longitudinal direction in a first direction 92) can be disposed in the transfer chamber 300, and the transfer manipulator 320 can be configured to be movable on the guide rail 340. The transfer manipulator 320 includes a hand 322 on which a base plate M is placed, and the hand 322 can be configured to be movable forward and backward, rotatable based on a third direction 96 as an axis, and movable in the third direction 96. A plurality of hands 322 are configured to be spaced apart in the vertical direction, and the hands 322 can move forward and backward independently of each other.

[0057] The buffer unit 200 includes a plurality of buffers 220 on which the substrate W is placed. The buffers 220 can be arranged to be spaced apart from each other in a third direction 96. The front and rear of the buffer unit 200 are open. The front is the face facing the index module 10, and the rear is the face facing the transfer chamber 300. The indexing robot 120 can access the buffer unit 200 through the front, and the transfer robot 320 can access the buffer unit 200 through the rear.

[0058] Figure 3 To illustrate Figure 2 An illustration of an exemplary embodiment of the liquid handling chamber 400. (Refer to...) Figure 3 The liquid handling chamber 400 includes a housing 410, a cup-shaped object 420, a support unit 440, a nozzle unit 460, a lifting unit 480, a supply unit, and a controller.

[0059] The housing 410 is configured in a generally cuboid shape. The cup-shaped object 420, the support unit 440, and the liquid supply unit 460 are disposed within the housing 410.

[0060] The cup-shaped object 420 has an open-top processing space where liquid is processed on the substrate W. A support unit 440 supports the substrate W within the processing space. A liquid supply unit 460 supplies liquid to the substrate W supported by the support unit 440. Liquid can be provided in various types and can be supplied sequentially to the substrate W. A lifting unit 480 adjusts the relative height between the cup-shaped object 420 and the support unit 440.

[0061] According to one embodiment, the cup-shaped object 420 includes a plurality of recovery containers 422, 424, and 426. Each of the recovery containers 422, 424, and 426 has a recovery space for recovering liquid used to process the substrate. Each of the recovery containers 422, 424, and 426 is configured in an annular shape surrounding the support unit 440. During a liquid processing process, the processing liquid sputtered by the rotation of the substrate W can be introduced into the recovery space through the inlets 422a, 424a, and 426a of the recovery containers 422, 424, and 426, which will be described later. According to one embodiment, the cup-shaped object 420 includes a first recovery container 422, a second recovery container 424, and a third recovery container 426. The first recovery container 422 is configured to surround the support unit 440, the second recovery container 424 is configured to surround the first recovery container 422, and the third recovery container 426 is configured to surround the second recovery container 424. The second inlet 424a can be located above the first inlet 422a, through which liquid is led to the second recycling container 424 and through the first inlet to the first recycling container 422. The third inlet 426a can be located above the second inlet 424a, through which liquid is led to the third recycling container 426.

[0062] The support unit 440 includes a support plate 442 and a drive shaft 444. The upper surface of the support plate 442 can be configured to be approximately circular and can have a diameter larger than that of the substrate W. A support pin 442a supporting the rear surface of the substrate W is disposed at the center of the support plate 442, and the upper end of the support pin 442a is configured to protrude from the support plate 442, such that the substrate W is spaced apart from the support plate 442 by a predetermined distance. A chuck pin 442b is disposed at the edge of the support plate 442. The chuck pin 442b is configured to protrude upward from the support plate 442 and support the lateral portion of the substrate W, such that the substrate W will not separate from the support unit 440 when the substrate W rotates. The drive shaft 444, driven by the driver 446, is connected to the center of the bottom surface of the substrate W and rotates the support plate 442 based on its central axis.

[0063] Nozzle unit 460 includes a first nozzle 462 and a second nozzle 464. The first nozzle 462 supplies a processing liquid to the substrate W. The processing liquid can be a liquid with a temperature above room temperature. According to one embodiment, the processing liquid can be an aqueous phosphoric acid solution. The aqueous phosphoric acid solution can be a mixture of phosphoric acid and water. Optionally, the aqueous phosphoric acid solution may further contain other substances. For example, other materials may be silicone resins. Alternatively, the processing liquid can be a sulfuric acid-containing liquid. For example, the processing liquid can be a mixture of sulfur peroxide. The second nozzle 464 supplies water to the substrate W. The water can be pure water or deionized water.

[0064] The first nozzle 462 and the second nozzle 464 are supported on different arms 461, and these arms 461 can move independently. Optionally, the first nozzle 462 and the second nozzle 464 can be mounted on the same arm and move simultaneously.

[0065] Optionally, the liquid supply unit may also include one or more nozzles in addition to the first nozzle 462 and the second nozzle 464. The additional nozzles can supply different types of processing liquids to the substrate. For example, other types of processing liquids may be acidic or alkaline solutions used to remove impurities from the substrate. Furthermore, another type of processing liquid may be an alcohol with a surface tension lower than that of water. For example, the alcohol may be isopropanol.

[0066] The lifting unit 480 moves the cup-shaped object 420 vertically. The vertical movement of the cup-shaped object 420 changes the relative height between it and the substrate W. Accordingly, since the recovery containers 422, 424, and 426 for recovering the processing liquid change according to the type of liquid supplied to the substrate W, the liquid can be separated and collected. Contrary to the description, the cup-shaped object 420 can be fixedly mounted, and the lifting unit 480 can move the support unit 440 vertically.

[0067] The liquid supply unit 1000 supplies processing liquid to the first nozzle 462. Hereinafter, as an example, the case where the processing liquid is an aqueous phosphoric acid solution will be described.

[0068] Figure 4 An illustration of an embodiment of a liquid supply unit according to an exemplary embodiment of the present invention is shown for illustrative purposes. Reference Figure 4 The liquid supply unit 1000 includes a supply tank 1200. The supply tank 1200 includes a housing 1220 and a circulation line 1240.

[0069] The housing 1220 is configured in a generally cuboid or cylindrical shape. The housing 1220 has a space for storing an aqueous phosphoric acid solution.

[0070] Inlet line 1420 and outlet line 1440 are connected to housing 1220. A valve (not shown) is installed in each of inlet line 1420 and outlet line 1440. An aqueous phosphoric acid solution is introduced into housing 1220 through inlet line 1420. The aqueous phosphoric acid solution can be introduced into housing 1220 through inlet line 1420 at a temperature lower than the set temperature for substrate processing. Furthermore, the aqueous phosphoric acid solution can be introduced into housing 1220 through inlet line 1420 at a concentration lower than the set phosphoric acid concentration for substrate processing. Optionally, the aqueous phosphoric acid solution can be introduced into housing 1220 through inlet line 1420 under controlled conditions of set temperature and set concentration. The temperature and concentration controlled processing solution is supplied from housing 1220 to the outside through outlet line 1440. Each of inlet line 1420 and outlet line 1440 can be connected to housing 1220 through the upper wall of housing 1220.

[0071] Waste liquid line 1460 is connected to housing 1220. A valve (not shown) is installed in waste liquid line 1460. When the aqueous phosphoric acid solution is discarded after being reused a certain number of times or for a certain period of time, the aqueous phosphoric acid solution in housing 1220 is discharged to the outside of housing 1220 through waste liquid line 1460.

[0072] Phosphoric acid replenishment line 1482 and water replenishment line 1484 can be connected to housing 1220. Valves (not shown) are installed in phosphoric acid replenishment line 1482 and water replenishment line 1484. Phosphoric acid replenishment line 1482 can replenish phosphoric acid to the aqueous phosphoric acid solution introduced into housing 1220, and water replenishment line 1484 can replenish water to the aqueous phosphoric acid solution introduced into housing 1220. The replenishment of phosphoric acid and water can be based on the water level of the aqueous phosphoric acid solution measured by a water level measuring sensor 1222 installed in housing 1220. Optionally, phosphoric acid and water can be replenished after the aqueous phosphoric acid solution has been reused a certain number of times or for a certain period of time and after the aqueous phosphoric acid solution has been discharged from housing 1220. When the aqueous phosphoric acid solution contains silicone resin, a silicone resin replenishment line 1486 can be further connected.

[0073] Exhaust line 1490 is connected to housing 1220. Exhaust line 1490 discharges water vapor evaporated from the aqueous phosphoric acid solution stored in housing 1220 to the outside of housing 1220. Exhaust line 1490 is connected to the upper surface of housing 1220. The diameter of exhaust line 1490 is set to be smaller than the diameter of other lines. When the internal pressure of housing 1220 is greater than or equal to a predetermined pressure, the gas in housing 1220 can be discharged through exhaust line 1490.

[0074] A circulation line 1240 is connected to a housing 1220. According to an embodiment, one end of the circulation line 1240 serves as an inlet 1240a and is connected to the bottom surface of the housing 1220. The other end of the circulation line 1240 serves as an outlet 1240b and is immersed in an aqueous phosphoric acid solution within the housing 1220. Optionally, the other end of the circulation line 1240 may be located at a higher level than the water level of the aqueous phosphoric acid solution stored in the housing 1220.

[0075] Pump unit (P) 1500 and heater unit (H) 1600 are mounted on circulation line 1240. Pump unit 1500 provides the flow pressure that allows the aqueous phosphoric acid solution in housing 1220 to flow in circulation line 1240. Heater unit 1600 heats the aqueous phosphoric acid solution flowing in circulation line 1240. According to an embodiment, heater unit 1600 is controlled to heat the aqueous phosphoric acid solution to a set temperature. The set temperature may be approximately 150°C to 180°C.

[0076] Figure 5 The illustration shows the heater unit 1600 schematically.

[0077] refer to Figure 5 The heater unit 1600 includes a body 1620 and a heater 1640. The heater 1640 is located within the body 1620. The body 1620 is provided with a first port 1622 and a second port 1624. An aqueous phosphoric acid solution flows into the heater unit 1600 through the first port 1622 and is discharged from the heater unit 1600 to the outside through the second port 1624. A flow path 1660 is formed in the body 1620 through which the aqueous phosphoric acid solution flows. The flow path 1660 is connected to the first port 1622 and the second port 1624. According to an embodiment, the flow path 1660 may include an inflow path 1662, an outlet path 1664, and a connecting path 1666. The first port 1622 is located at one end of the inflow path 1662, and the second port 1624 is located at one end of the outlet path 1664. The connecting path 1666 connects the inflow path 1662 and the outlet path 1664. The inflow path 1662 and the outlet path 1664 may be configured to face each other. The inflow path 1662 and the outlet path 1664 can be positioned parallel to each other and spaced apart by a predetermined distance. The heater 1640 can be located in the space surrounded by the inflow path 1662, the outlet path 1664, and the connecting path 1666. The structure of the heater unit 1600 is not limited to this and can be modified in various ways.

[0078] The circulation line 1240 includes a first line 1242, a second line 1244, and a third line 1246. The first line 1242 is located outside the housing 1220. According to an embodiment, the first line 1242 may be located in a substantially vertical direction. A flow path 1660 disposed in the heater unit 1600 may be configured as a part of the first line 1242. The second line 1244 includes an inlet 1240a of the circulation line 1240. The second line 1244 extends from the lower end of the first line 1242 and is connected to the lower surface of the housing 1220. The third line 1246 includes an outlet 1240b of the circulation line 1240. The third line 1246 extends from the upper end of the first line 1242 and is connected to the housing 1220 via the upper surface of the housing 1220. The outlet 1240b of the third line 1246 may be immersed in an aqueous phosphoric acid solution stored in the housing 1220. Valve V1 can be installed in the second pipeline 1244, and valve V2 can be installed in the third pipeline 1246.

[0079] According to an embodiment, heater unit 1600 may be installed in first pipeline 1242, and pump unit 1500 may be installed in second pipeline 1244.

[0080] The discharge line 1700 is connected to the circulation line 1240. A discharge valve V3 is installed in the discharge line 1700. Optionally, the discharge valve V3 may be configured as a three-way valve at the point where the discharge line 1700 branches off from the circulation line 1240. The discharge line 1700 is configured to discharge any aqueous phosphoric acid solution remaining in the circulation line 1240. The discharge line 1700 is connected to the circulation line 1240 upstream of the heater unit 1600. According to an embodiment, the discharge line 1700 may be connected to the point where the first line 1242 and the second line 1244 connect. Optionally, the discharge line 1700 may be connected to the first line 1242 between the aforementioned point and the first port 1622 of the heater unit 1600.

[0081] The supply tank 1200 is provided with a cooling gas supply line 1800. A cooling valve V4 is installed on the cooling gas supply line 1800. The cooling gas cools the heater unit 1600 in the emergency mode, described later. According to an embodiment, the cooling gas supply line 1800 is connected to a circulation line 1240. The cooling gas supply line 1800 can be connected to the circulation line 1240 downstream of the heater unit 1600. The cooling gas supply line 1800 can be connected to the point where the first line 1242 and the third line 1246 meet. In this case, the cooling gas supply line 1800 is configured to supply cooling gas from the upper end of the first line 1242 in a vertically downward direction. An inert gas such as nitrogen can be used as the cooling gas. Alternatively, air can be used as the cooling gas. The cooling gas can be supplied at room temperature. Alternatively, the cooling gas can be supplied at a temperature below room temperature.

[0082] In the above embodiment, each of the waste liquid line 1460 and the outlet line 1440 is shown as connected to the housing 1220. However, unlike this, the waste liquid line 1460 and the outlet line 1440 may be connected to the circulation line 1240.

[0083] In addition, although not shown, a concentration meter for measuring the phosphoric acid concentration in the aqueous phosphoric acid solution and a thermometer for measuring the temperature of the aqueous phosphoric acid solution can also be installed in the supply tank 1200. The concentration meter and thermometer can be installed in the housing 1220 or the circulation line 1240.

[0084] The controller 1900 controls the operation of each of the valves V1, V2, V3, and V4 disposed in the liquid supply unit 1000. According to an embodiment, the substrate processing apparatus 1 operates in a normal mode and an emergency mode. During substrate processing, the substrate processing apparatus 1 operates in normal mode. During operation in normal mode, if a problem is detected in the substrate processing apparatus 1, the substrate processing apparatus 1 is switched to emergency mode. For example, if a leak of the processing liquid is detected while supplying the processing liquid, or if the supply flow rate and concentration of the processing liquid exceed a set range, the substrate processing apparatus 1 can switch its operating mode to emergency mode. Furthermore, if the substrate processing apparatus 1 cannot operate normally while processing a substrate, the substrate processing apparatus 1 can switch its operating mode to emergency mode. For example, if the transfer robot cannot operate normally, the operating mode can be switched to emergency mode. When the normal mode is switched to emergency mode, normal operation of the substrate processing apparatus 1 is stopped. In emergency mode, the operation of the pump unit 1500 and the heater unit 1600 disposed in the liquid supply unit also stops.

[0085] Figures 6 to 8This illustration shows the open and closed states of the valves in the supply tank 1200 and the fluid flow in the circulation line 1240 in normal and emergency modes. Figure 6 A diagram illustrating the control state of the valve in normal mode, and Figure 7 and Figure 8 This diagram illustrates the valve's control status in emergency mode. Figures 6 to 8 In this configuration, valves that are empty are in the open state, while valves that are filled are in the closed state. Furthermore, in... Figures 6 to 8 In the diagram, solid arrows represent the flow of aqueous phosphoric acid solution, while dashed arrows represent the flow of cooling gas.

[0086] In normal mode, such as Figure 6 As shown, controller 1900 opens valves V1 and V2 installed in circulation line 1240 and closes discharge valve V3 installed in discharge line 1700 and cooling valve V4 installed in cooling gas supply line 1800. As a result, the aqueous phosphoric acid solution in housing 1220 circulates through circulation line 1240 and is heated by heater 1640 during circulation.

[0087] In emergency mode, such as Figure 7 As shown, controller 1900 closes valves V1 and V2 installed in circulation line 1240 and opens valve V3 installed in discharge line 1700. Cooling valve V4 remains closed. Therefore, the aqueous phosphoric acid solution remaining in circulation line 1240 is discharged through discharge line 1700. The aqueous phosphoric acid solution remaining in the first line 1242 of circulation line 1240 can be discharged into discharge line 1700 by its own weight. Thereafter, as... Figure 8 As shown, controller 1900 opens cooling valve V4. Valves V1 and V2, installed in circulation line 1240, remain closed, and discharge valve V3 remains open. Therefore, cooling gas is supplied from cooling gas supply line 1800 to heater unit 1600. The cooling gas cools heater unit 1600 and is discharged to the outside of circulation line 1240 via discharge line 1700.

[0088] In this exemplary embodiment, in emergency mode, the aqueous phosphoric acid solution remaining in the circulation line 1240 is discharged to the outside of the circulation line 1240. Therefore, even after the heater 1640 has stopped operating, the aqueous phosphoric acid solution remaining in the circulation line 1240 is prevented from being heated to a high temperature by the residual heat remaining in the heater 1640. Furthermore, since the heater 1640 is cooled by supplying cooling gas to the circulation line 1240 in emergency mode, damage to components surrounding the heater 1640 due to residual heat in the heater 1640 is prevented.

[0089] In the above embodiments, it has been described that in emergency mode, the drain valve V3 is opened first, followed by the cooling valve V4. However, unlike this, the drain valve V3 and the cooling valve V4 can be opened simultaneously.

[0090] exist Figure 6 The text already describes the installation of the cooling gas supply line 1800 at the point where the first line 1242 and the third line 1246 connect. However, unlike this, as... Figure 9 As shown, the cooling gas supply line 1800a can be connected to the first line 1242 downstream of the heater unit 1600, at a location adjacent to the heater unit 1600. The cooling gas supply line 1800a can be connected vertically to the first line 1242.

[0091] Optionally, such as Figure 10 As shown, the cooling gas supply line 1800b can be connected obliquely to the first line 1242 in the direction toward the heater unit 1600. In this case, most of the cooling gas supplied through the cooling gas supply line 1800b can be supplied directly in the direction toward the heater unit 1600.

[0092] Figure 11 To illustrate Figure 4 An illustration of another exemplary embodiment of the liquid supply unit. Hereinafter, the main description will focus on... Figure 4 Different parts of the exemplary implementation.

[0093] Figure 11 The liquid supply unit 2000 does not have a cooling gas supply line. Furthermore, in... Figure 11 In the liquid supply unit, the outlet 1240b of the third line 1246 of the circulation line 1240 is located at a position higher than the water level of the aqueous phosphoric acid solution in the housing 1220.

[0094] Figures 12 to 14 This illustration shows the open and closed states of the valves in the supply tank 1200 and the fluid flow in the circulation line 1240 in normal and emergency modes. Figure 12 A diagram illustrating the valve's control state in normal mode, and Figure 13 and Figure 14 This diagram illustrates the valve control status and the flow paths of the aqueous phosphoric acid solution and gas in emergency mode. Figures 12 to 14 In this configuration, valves that are empty are in the open state, while valves that are filled are in the closed state. Furthermore, in... Figures 12 to 14 In the diagram, solid arrows represent the flow of aqueous phosphoric acid solution, while dashed arrows represent the flow of gas.

[0095] In normal mode, such as Figure 12As shown, controller 1900 opens valves V1 and V2 installed in circulation line 1240 and closes discharge valve V3 installed in discharge line 1700. As a result, the aqueous phosphoric acid solution in housing 1220 circulates through circulation line 1240 and is heated by heater 1640 during circulation.

[0096] In emergency mode, such as Figure 13 and Figure 14 As shown, controller 1900 closes valve V1 installed in the second pipeline 1244 and opens valve V3 installed in the discharge pipeline 1700. Valve V2 installed in the third pipeline 1246 remains open. Therefore, as Figure 13 As shown, the aqueous phosphoric acid solution remaining in the circulation line 1240 is discharged through the discharge line 1700. When the aqueous phosphoric acid solution is discharged from the circulation line 1240 by gravity, the interior of the circulation line 1240 becomes negatively pressured compared to the interior of the housing 1220. Therefore, due to the pressure difference, the gas remaining in the housing 1220 flows into the third line 1246. Then, as... Figure 14 As shown, gas flows through heater unit 1600 and is then discharged to discharge line 1700. Typically, the temperature of the gas remaining in housing 1220 is approximately 60°C to approximately 70°C, which is lower than the temperature of heater 1640. Therefore, heater unit 1600 is cooled as the gas in housing 1220 passes through it. The gas in housing 1220 can be air.

[0097] Figure 15 To illustrate Figure 4 A further exemplary embodiment of the liquid supply unit is illustrated. Hereinafter, the main description will focus on... Figure 4 The exemplary implementations have different structures.

[0098] exist Figure 15 In the liquid supply unit 3000, the cooling gas supply line 1800c is connected to the housing 1220. Furthermore, in... Figure 11 In the liquid supply unit 3000, the outlet of the third pipeline 1246 of the circulation pipeline 1240 is located at a higher position than the water level of the aqueous phosphoric acid solution in the housing 1220.

[0099] Figures 16 to 18 This illustration shows the open and closed states of the valves in the supply tank 1200 and the fluid flow in the circulation line 1240 in normal and emergency modes. Figure 16 A diagram illustrating the valve's control state in normal mode, and Figure 17 and Figure 18 This diagram illustrates the valve control status in emergency mode and the flow paths of the aqueous phosphoric acid solution and gas. Figures 16 to 18In this configuration, valves that are empty are in the open state, while valves that are filled are in the closed state. Furthermore, in... Figures 16 to 18 In the diagram, solid arrows represent the flow of aqueous phosphoric acid solution, while dashed arrows represent the flow of cooling gas.

[0100] In normal mode, such as Figure 16 As shown, controller 1900 opens valves V1 and V2 installed in circulation line 1240 and closes discharge valve V3 installed in discharge line 1700 and cooling valve V4 installed in cooling gas supply line 1800. As a result, the aqueous phosphoric acid solution in housing 1220 circulates through circulation line 1240 and is heated by heater 1640 during circulation.

[0101] In emergency mode, such as Figure 17 As shown, controller 1900 closes valve V1 installed in the second pipeline 1244 and opens valve V3 installed in the discharge pipeline 1700. Valve V2 installed in the third pipeline 1246 remains open, and cooling valve V4 remains closed. Therefore, the aqueous phosphoric acid solution remaining in the circulation pipeline 1240 is discharged through the discharge pipeline 1700. The aqueous phosphoric acid solution remaining in the first pipeline 1242 of the circulation pipeline 1240 can be discharged into the discharge pipeline 1700 by its own weight. Thereafter, as... Figure 18 As shown, controller 1900 opens cooling valve V4. Valve V1, installed in the second line 1244, remains closed, while valves V2 and discharge valve V3, installed in the third line 1246, remain open. Therefore, gas is supplied from cooling gas supply line 1800 to housing 1220. The gas supplied to housing 1220 flows into the third line 1246 and then toward heater unit 1600. The cooling gas cools heater unit 1600 and is discharged to the outside of circulation line 1240 via discharge line 1700.

[0102] In the above embodiments, it has been described that in emergency mode, the drain valve V3 is opened first, followed by the cooling valve V4. However, unlike this, the drain valve V3 and the cooling valve V4 can be opened simultaneously.

[0103] In the above embodiments, it has been described that the cooling valve V4 is closed in normal mode and opened in emergency mode. However, unlike this, the cooling valve V4 can be opened even in normal mode. In this case, dry air can be used as the cooling gas. In normal mode, the dry air supplied to the housing 1220 can reduce the humidity in the housing 1220 and promote the evaporation of water from the aqueous phosphoric acid solution.

[0104] In the above embodiments, it has been described that valve V1 installed in the second pipeline 1244 is closed in emergency mode. However, conversely, valve V1 installed in the second pipeline 1244 can be opened in emergency mode.

[0105] Figure 19 and Figure 20 The diagrams schematically illustrate the connection status of the liquid supply unit and the liquid processing chamber.

[0106] like Figure 19 As shown, the inlet line 1420 connected to the housing 1220 of the supply tank 1200 can be directly connected to the liquid processing chamber 400. In this case, the processing liquid used for substrate processing in the liquid processing chamber 400 is directly recycled back to the housing 1220 of the supply tank 1200. Furthermore, the outlet line 1440 can be directly connected to the nozzle of the liquid processing chamber 400. In this case, an aqueous phosphoric acid solution, with temperature and concentration controlled in the supply tank 1200, is directly supplied to the nozzle of the liquid processing chamber 400.

[0107] In addition, such as Figure 20 As shown, the processing liquid used for substrate processing in the liquid processing chamber 400 is directly recycled to the recovery tank 5001. Afterward, the processing liquid can be introduced from the recovery tank 5001 to the supply tank 1200 through the inlet line 1420. Furthermore, an aqueous phosphoric acid solution, with temperature and concentration controlled in the supply tank 1200, can be supplied to the buffer tank 5002 through the outlet line 1440, and then the aqueous phosphoric acid solution can be supplied from the buffer tank 5002 to the nozzle. Either the recovery tank 5001 or the buffer tank 5002, or both, can be configured with the same or similar structure as the supply tank 1200.

[0108] In the above embodiments, it has been described that the processing liquid stored in the supply tank 1200 is an aqueous phosphoric acid solution. However, alternatively, the processing liquid stored in the supply tank 1200 can be another type of processing liquid supplied to the substrate in a heated state. For example, the processing liquid can be a sulfuric acid-containing liquid. For example, the processing liquid can be a mixture of sulfuric acid and hydrogen peroxide. Optionally, the processing liquid can be a mixture of ammonium hydroxide, hydrogen peroxide, and water. Optionally, the processing liquid can be an organic solvent, such as isopropanol.

[0109] The foregoing detailed description illustrates the present invention. Furthermore, the above description illustrates and describes exemplary embodiments of the invention, and the invention can be used in various other combinations, modifications, and environments. That is, changes or modifications are possible within the scope of the inventive concept disclosed herein, within the scope of equivalents to the written disclosure, and / or within the scope of skill or knowledge in the art. The foregoing exemplary embodiments describe the optimal state for carrying out the technical spirit of the invention, and various changes are possible in specific fields and uses of the invention. Therefore, the foregoing detailed description of the invention is not intended to limit the invention to the disclosed exemplary embodiments. Furthermore, the appended claims should be interpreted to include other exemplary embodiments.

Claims

1. An apparatus for processing a substrate, the apparatus comprising: A cup-shaped object, wherein a processing space is provided in the cup-shaped object; A support unit for supporting and rotating the substrate in the processing space; A nozzle for supplying a processing liquid to the substrate; as well as A liquid supply unit, the liquid supply unit being used to supply the treatment liquid to the nozzle, and Controller, the controller being used to control the liquid supply unit, The liquid supply unit includes a tank for storing the processing liquid, and The tank includes: A housing having space therein for storing the treatment liquid; A circulation line is connected to the housing to circulate the treatment fluid within the housing; A heater unit, installed in the circulation line, is used to heat the treatment fluid; and A discharge line for discharging the treated liquid remaining in the circulation line, and the discharge line includes an installed discharge valve. The liquid supply unit further includes a cooling gas supply line that supplies cooling gas to the heater unit, and a cooling valve is installed in the cooling gas supply line. The controller controls the liquid supply unit to heat the processing liquid using the heater unit in normal mode, while the processing liquid circulates in the housing through the circulation pipeline with the discharge valve closed, and to change the state of the discharge valve to open in emergency mode to discharge the processing liquid remaining in the circulation pipeline to the discharge pipeline, and to open the cooling valve to supply the cooling gas to the circulation pipeline.

2. The apparatus according to claim 1, wherein, The cooling gas supply line is connected to the circulation line.

3. The apparatus according to claim 2, wherein, The cooling gas supply line is connected to the circulation line downstream of the heater unit.

4. The apparatus according to claim 3, wherein, The cooling gas supply line is connected to the circulation line to supply the cooling gas in the direction toward the heater unit.

5. The apparatus according to claim 1, wherein, The cooling gas supply line is connected to the housing.

6. The apparatus according to any one of claims 1 to 5, wherein, A pump unit is installed in the circulation pipeline, and The discharge line is connected to the circulation line between the pump unit and the heater unit.

7. The apparatus according to any one of claims 1 to 5, wherein, The circulation pipeline includes: The first pipeline, wherein the longitudinal direction of the first pipeline is arranged in the vertical direction; A second pipeline, extending from the first pipeline and connected to the housing, is positioned upstream of the first pipeline; and A third pipeline extends from the first pipeline and connects to the housing, so as to be located downstream of the first pipeline, and A pump unit is installed in the first pipeline. The cooling gas supply line is connected to the third line, and The discharge line is connected to the first line.

8. The apparatus according to claim 1, wherein, The cooling gas supply line is connected to the housing, and An exhaust line for discharging internal atmosphere is connected to the housing.

9. The apparatus according to claim 7, in, In the emergency mode, the operation of the pump unit is stopped.

10. A liquid supply unit for supplying processing fluid, the liquid supply unit comprising: A housing having space therein for storing the treatment liquid; A circulation line is connected to the housing to circulate the treatment fluid within the housing; A heater unit is installed in the circulation line to heat the treatment liquid; A pump unit, wherein the pump unit is installed in the circulation pipeline; as well as A discharge line for discharging the treated liquid remaining in the circulation line, and the discharge line includes an installed discharge valve. A cooling gas supply line supplies cooling gas to the heater unit, and the cooling gas supply line includes an installed cooling valve, and Controller, the controller being used to control the valves in the liquid supply unit, The controller controls the valves in the liquid supply unit to heat the processing liquid using the heater unit in normal mode, while the processing liquid circulates in the housing through the circulation pipeline with the discharge valve closed; and in emergency mode, to change the state of the discharge valve to open to discharge the processing liquid remaining in the circulation pipeline to the discharge pipeline, and to open the cooling valve to supply the cooling gas to the circulation pipeline.

11. The liquid supply unit according to claim 10, wherein, The discharge line is connected to the circulation line between the pump unit and the heater unit.

12. The liquid supply unit according to claim 10 or 11, wherein, The emergency mode is a mode that stops the operation of the pump unit.

13. A method for processing a substrate, the method comprising: When the processing liquid is circulated in the housing through a circulation line connected to the housing of the tank, the temperature of the processing liquid is adjusted by heating the processing liquid using a heater unit installed in the circulation line. In normal mode, the substrate is processed by supplying a temperature-controlled processing solution to the substrate; and In emergency mode, the treated fluid in the circulation pipeline is discharged to the outside of the circulation pipeline via a discharge line connected to the circulation pipeline. In the emergency mode, cooling gas is supplied to the circulation line to cool the pump unit installed in the circulation line.

14. The method according to claim 13, wherein, In the emergency mode, the operation of the pump unit installed in the circulation pipeline is stopped.

15. The method according to claim 13 or 14, wherein, The discharge line is connected to the circulation line between the pump unit and the heater unit.

16. The method of claim 14, wherein, The treatment solution contains phosphoric acid.