Cooling plates, hybrid cooling systems, and methods for cooling data center electronic enclosures

Abstract

This disclosure relates to cooling plates, hybrid cooling systems, and methods for cooling data center electronic enclosures. Systems, apparatus, and methods for providing hybrid cooling for servers in a data center are described. A cooling plate includes an inlet port for receiving coolant from a coolant source. The coolant is a two-phase coolant that transforms from a liquid state to a vapor state upon attachment to electronic equipment to extract heat from the electronic equipment. The cooling plate includes an outlet port for outputting at least a portion of the coolant back to the coolant source. The cooling plate includes a vapor port for outputting vapor generated from the coolant to a condenser configured to condense the vapor back to a liquid state.

Description

Technical Field

[0001] The embodiments of this disclosure generally relate to data center cooling. More specifically, embodiments of this disclosure relate to a hybrid system for servers. Background Technology

[0002] Cooling is a critical factor in computer system and data center design. The number of high-performance electronic components, such as high-performance processors, encapsulated within servers is steadily increasing, leading to a rise in heat generated and dissipated during normal server operation. If the ambient temperature that allows servers to operate within a data center rises over time, server reliability will decrease. Maintaining a suitable thermal environment is essential for the operation, performance, and lifespan of servers in data centers. Existing cooling technologies are insufficient to effectively and efficiently cool high-performance servers.

[0003] Existing cooling technologies for single-phase immersion cooling are inefficient at addressing hotspots. Existing cooling technologies for two-phase immersion systems rely solely on rack-level fluid recirculation without any localized cooling. Summary of the Invention

[0004] According to one aspect of this disclosure, a cooling plate is provided, comprising: an inlet port for receiving coolant from a coolant source, wherein the coolant is a two-phase coolant that transforms from a liquid state to a vapor state upon attachment to an electronic device to extract heat from the electronic device; an outlet port for outputting at least a portion of the coolant back to the coolant source; and a first vapor port for outputting the vapor generated from the coolant to a condenser configured to condense the vapor back to the liquid state.

[0005] According to another aspect of this disclosure, a hybrid cooling system is provided, comprising: one or more cooling plates, at least one of the one or more cooling plates including a plurality of cooling channels, a first inlet port coupled to the plurality of cooling channels, a first outlet port coupled to the plurality of cooling channels, and a first steam port coupled to the plurality of cooling channels; and one or more server units having one or more electronic devices attached to the one or more cooling plates, at least one of the one or more server units including: a second inlet port coupled to the first inlet port of the at least one of the one or more cooling plates to receive coolant from a coolant source, wherein the coolant is a two-phase coolant, the two-phase coolant being attached to the cooling plates... The device comprises: a liquid-to-vapor state transitioning from liquid to vapor in the presence of one or more electronic devices to extract heat from the one or more electronic devices; a second outlet port coupled to the first outlet port of at least one of the one or more cooling plates to output at least a portion of the coolant back to the coolant source; a vapor channel coupled to the first vapor port to output the vapor generated from the coolant to a condenser configured to condense the vapor back to the liquid state; a liquid supply channel coupled to the second inlet port of at least one of the one or more server units; and a liquid return channel coupled to the second outlet port of at least one of the one or more server units.

[0006] According to another aspect of this disclosure, a method for cooling a data center electronic enclosure is provided, the data center electronic enclosure including one or more server units and one or more cooling plates coupled to the one or more server units, the method comprising: operating a first pump coupled to the one or more cooling plates at a first speed to supply coolant from a coolant source, wherein the coolant is a two-phase coolant that changes from a liquid state to a vapor state upon contact with one or more electronic devices to extract heat from the one or more electronic devices; operating a second pump coupled to the one or more cooling plates at a second speed to return at least a portion of the coolant to the coolant source; monitoring the power status of the electronic rack; and adjusting the first speed based on the monitoring. Attached Figure Description

[0007] The accompanying drawings illustrate examples and are therefore exemplary embodiments and not intended to limit the scope.

[0008] Figure 1This is a view illustrating a cooling system for a server chassis according to one embodiment.

[0009] Figure 2A This is a view showing a cooling plate according to one embodiment.

[0010] Figure 2B This is a view showing a cooling plate according to another embodiment.

[0011] Figure 3 A top view of a server with a cooling system according to one embodiment is shown.

[0012] Figure 4 This is a view of a hybrid cooling system according to one embodiment.

[0013] Figure 5 This is a view of a hybrid cooling system with a controller device according to one embodiment.

[0014] Figure 6 This is a flowchart of a method for cooling an electronic rack in a data center according to one embodiment. Detailed Implementation

[0015] Systems and methods for providing hybrid systems for servers are described. Equipment, server and rack co-design, systems, and methods for designing and deploying immersion and phase-change cooling systems for high power density servers and electronic devices are also described.

[0016] In at least some embodiments, the cooling plate includes an inlet port for receiving coolant from a coolant source. The coolant is a two-phase coolant that transforms from a liquid state to vapor upon attachment to an electronic device to extract heat from the device. The cooling plate includes an outlet port for outputting at least a portion of the coolant back to the coolant source. The cooling plate also includes a vapor port for outputting vapor generated from the coolant to a condenser configured to condense the vapor back into a liquid state.

[0017] In at least some embodiments, the hybrid cooling system includes one or more cooling plates. At least one of the one or more cooling plates includes a plurality of cooling channels. An inlet port is coupled to the plurality of cooling channels. An outlet port is coupled to the plurality of cooling channels. A steam port is coupled to the plurality of cooling channels. The hybrid cooling system includes one or more server units having one or more electronic devices attached to the one or more cooling plates. At least one of the one or more server units includes an inlet port coupled to an inlet port of at least one of the cooling plates to receive coolant from a coolant source. The coolant is a two-phase coolant that transforms from a liquid to a vapor upon attachment to the one or more electronic devices to extract heat from the one or more electronic devices. At least one of the one or more server units includes an outlet port coupled to an outlet port of at least one of the one or more cooling plates to output at least a portion of the coolant back to the coolant source. At least one of the one or more server units includes a steam port coupled to a steam port of at least one of the one or more cooling plates. The steam passage is coupled to the steam port of at least one of the one or more server units to output steam generated from the coolant to a condenser configured to condense the steam back into a liquid state.

[0018] In at least some embodiments, a method for cooling a data center electronic rack is described, the data center electronic rack including one or more server units and one or more cooling plates coupled to the one or more server units. A first pump coupled to the one or more cooling plates operates at a first speed to supply coolant from a coolant source. A second pump coupled to the one or more cooling plates operates at a second speed to return at least a portion of the coolant to the coolant source. The power status of the electronic rack is monitored. The speeds of the first and second pumps are controlled and adjusted based on the monitoring.

[0019] Examples of co-designed cooling equipment, servers, and overall systems are used to construct hybrid cooling systems employing single-phase immersion and phase-change technologies. The described techniques can be efficiently used to design and deploy high-power-density servers.

[0020] In at least some embodiments, the advanced cooling (cold) plate includes three ports. The three ports of the advanced cooling plate include a two-phase liquid inlet port, a two-phase liquid outlet port, and a vapor port. The inlet and outlet ports are connected to dedicated fluid channels within the cold plate. The vapor port is encapsulated on one side of the cold plate, which is the top side once the server, including electronic components, is installed in the system. The fluid channels include a vapor outlet channel connected to the vapor release port. The cooling plate uses a two-phase coolant, which is converted from a liquid phase to a vapor phase by heat generated from the electronic components. The vapor and liquid are largely separated within the cold plate. Three distribution units are integrated into the system. The liquid loop is equipped with at least two pumps. These at least two pumps operate at different speeds based on power density, as described in further detail below.

[0021] In at least some embodiments, the described technology provides a cooling plate for two-phase immersion cooling. The described technology provides efficient cooling to eliminate hot spots in single-phase immersion systems. The described technology is adaptable to different server hardware and configurations. The described technology supports increased power density. The described technology is flexible for different electronic devices. The described technology provides efficient vapor and liquid separation. The described technology simplifies deployment and operation; and improves the efficiency of cooling systems in IT data centers.

[0022] Various embodiments and aspects of this disclosure will be described with reference to the details discussed below, and the accompanying drawings will illustrate the various embodiments. The following description and drawings are illustrative of this disclosure and should not be construed as limiting it. Numerous specific details are described to provide a full understanding of the various embodiments of this disclosure. However, in some cases, well-known or conventional details have not been described in order to provide a concise discussion of embodiments of this disclosure.

[0023] The reference to "an embodiment" or "an embodiment" in the specification means that a particular feature, structure, or characteristic described in connection with that embodiment may be included in at least one embodiment of this disclosure. The phrase "in an embodiment" appearing in various places in the specification does not necessarily refer to the same embodiment.

[0024] Figure 1 This is a view 100 illustrating a cooling system for a server chassis according to one embodiment. The cooling system 101 includes a cooling module (device) 102. The cooling device 102 includes cold (cooling) plates, such as cooling plate 103, cooling plate 104, cooling plate 105, and cooling plate 106, for removing at least a portion of the heat generated by IT components located thereon.

[0025] In at least some embodiments, the cooling plate has at least three ports. For example... Figure 1As shown, cooling plate 103 includes an inlet port 107 for receiving coolant from coolant source 114. Cooling plate 103 includes an outlet port 108 for discharging the liquid portion of the coolant. Cooling plate 103 includes a steam port 109 for back-coupling the steam generated from the coolant to cooler / condenser 115 of coolant source 114 when the coolant temperature is above a predetermined threshold. Cooling plate 105 includes an inlet port 111 for receiving coolant from outlet port 108. Cooling plate 105 includes an outlet port 112 for discharging the liquid portion of the coolant back to coolant source. Cooling plate 105 includes a steam port 113 for back-coupling the steam generated from the coolant due to heat to cooler / condenser 115 of coolant source 114.

[0026] like Figure 1 As shown, the cooling system 101 includes a liquid return loop 121, which includes a loop input terminal 123 (for receiving liquid coolant from the coolant source 114) and a loop output terminal 124 (for returning the liquid coolant to the coolant source 114). The cooling system 101 also includes a vapor return loop 122. The liquid return loop 121 includes an inlet port 107 and an outlet port 108 for cooling plate 103, and an inlet port 111 and an outlet port 112 for cooling plate 105, which are connected in series. The liquid return loop 121 also includes inlet and outlet ports for cooling plates 104 and 106 connected in series. Figure 1 As shown, cooling plates 103 and 105 are connected in parallel with cooling plates 104 and 106. In at least some embodiments, the liquid (fluid) ports of the cooling plates are fluid quick disconnectors. In at least some embodiments, the fluid circuit is located within the server chassis. In at least some embodiments, the fluid circuit 121 is located within an immersion tank. In at least some embodiments, the server has multiple cold plate circuits coupled to a vapor circuit connected to a tank vapor circuit, as referenced below. Figure 4 Further detailed description.

[0027] The steam return loop 122 includes a loop input 123 and a loop output 126. The loop input is used to receive two-phase liquid coolant from coolant source 114, and the loop output is used to return steam generated from the two-phase liquid coolant to cooler / condenser 115 when the temperature of the liquid coolant exceeds a predetermined temperature threshold. The steam return loop 122 includes corresponding steam ports of cooling plates 103, 104, 105, and 106 connected in parallel. The cooling system 101 includes a pump 116 coupled to inlet port 107 to pump coolant from coolant source 114. The cooling system 101 includes a pump 117 coupled to outlet port 112 to pump the heated liquid portion of the coolant back to coolant source 114. In at least some embodiments, the coolant from coolant source 114 is a two-phase liquid coolant. Figure 1 As shown, cooling system 101 uses two-phase coolant pumping and recirculation throughout the system. A liquid two-phase coolant is pumped into the cold plates using pump 116, a portion of the liquid two-phase coolant leaves the cold plates, and a portion of the two-phase liquid coolant that has turned into vapor is released into condenser 115.

[0028] In at least some embodiments, the cooling system 101 includes a hybrid cooling environment using a combination of single-phase immersion cooling and pumped two-phase cooling. For example... Figure 1 As shown, pump 1 116 is used to pump liquid into the server, and pump 2 117, on the return section of loop 121, is used to pump a portion of the fluid back to coolant source 114. Vapor is condensed back to liquid 125 at condenser 115, which returns directly to coolant source 114. Figure 1 As shown, the IT components on the cold plate are mounted vertically, and the entire cooling module 102 is mounted vertically. Steam ports such as steam port 109 and steam port 113 of the cooling plate are assembled on the top side of the cooling plate to improve the efficiency of managing steam to the condenser 115.

[0029] Figure 2A This is a view 200 showing a cooling plate 201 according to one embodiment. (See image 200) Figure 2A As shown, cooling channel 208 is located at the bottom of cooling plate 201, and cooling channel 209 is located at the top of cooling plate 201. Figure 2A As shown, cooling channels 208 and 209 extend horizontally along the X direction on the cooling plate 201. Figure 2A As shown, multiple internal cooling channels 202 extend vertically in the Y direction on the cooling plate 201 between the bottom cooling channel 208 and the top cooling channel 209. An inlet port 205 is coupled to the bottom of the cooling channel 208 to allow liquid coolant to be introduced from a coolant source (e.g., coolant source 114 or other coolant source) through the cooling channels 208, 202, and 209. Figure 2AAs shown, cooling channel 209 is a top channel connected to steam outlet channel 204. Outlet port 206 (port #3) is coupled to the end of cooling channel 209 to output the liquid portion of the coolant back to the coolant source after the coolant from inlet port 205 (port #1) has passed through cooling channels 208, 202, and 209. In at least some embodiments, the coolant passing through the channel of cooling plate 201 is a two-phase liquid coolant. In at least some embodiments, inlet port 205 is a two-phase liquid inlet port. In at least some embodiments, outlet port 206 is a two-phase liquid outlet port. Inlet port 205 is connected to internal cooling channel 202 via cooling channel 208. Outlet port 206 is connected to internal cooling channel 202 via cooling channel 209. In at least some embodiments, the liquid coolant is pumped from inlet port 205 to outlet port 206 by a pump.

[0030] In one embodiment, outlet port 206 is fluidly connected to one or more cooling channels within the cooling plate closer to the outlet port, and fluidly connected to a channel located at the top of the cooling plate.

[0031] Cooling plate 201 has a steam output port 207 (port #2) of the cooler / condenser coupled to the cooling channel to recouple the steam output generated from the coolant due to heat back to the coolant source. For example... Figure 2A As shown, the cooling plate 201 includes a steam outlet channel 204 connected to a steam outlet port 207. In an embodiment, the steam outlet channel is machined into an optimized shape for isolating the steam from the two-phase liquid. Figure 2A As shown, a steam outlet channel 204 is located on and extends along a cooling channel 209. The steam outlet channel 204 is used to release steam generated from the liquid exiting the cold plate 201 through the cooling channel 209 and outlet port 206. A steam outlet port 207 is located on the top side of the cooling plate 201. The steam outlet port 207 extends vertically above the steam outlet channel 204 to increase the velocity of steam exiting the cold plate. The cooling channel 202 is separated by heat sinks 203. In one embodiment, the cooling channel 202 and the heat sinks 203 are staggered. The outlet port 206 and the inlet port 205 are located on opposite sides of the cooling plate 201. In at least some embodiments, the outlet port and the inlet port are located at different heights along the side of the cooling plate. The outlet port 206 is positioned at a height greater than the inlet port 205 relative to the bottom of the cooling plate 201.

[0032] Figure 2B This is a view 210 showing a cooling plate 211 according to another embodiment. The cooling plate 211 and... Figure 2A The difference in the cooling plate shown is that the inlet and outlet ports of cooling plate 211 are designed to be at the same height along the side of the cooling plate. For example... Figure 2B As shown, the cooling plate 211 includes a cooling channel 218 located at the bottom of the cooling plate 211 and a cooling channel 219 located at the top of the cooling plate 211, wherein an internal cooling channel 212 extends on the cooling plate 211 between the bottom cooling channel 218 and the top cooling channel 219, as described above. Figure 2B As shown, the cooling plate 211 includes an inlet port 215 (port #1) that is coupled to the end of the cooling channel 218 to receive liquid coolant from a coolant source, as described above. Figure 2B As shown, the cooling plate 211 includes an outlet port 216 (port #3) coupled to the end of an internal cooling channel 221 that extends vertically Y-direction along the cooling plate 211 from the cooling channel 219. The outlet port 216 is used to output the liquid portion of the coolant after the coolant from the inlet port 215 has passed through the cooling channel 218, internal cooling channel 212, cooling channel 219, and internal cooling channel 221 back to the coolant source.

[0033] In at least some embodiments, the coolant passing through the channel of cooling plate 211 is a two-phase liquid coolant. In at least some embodiments, inlet port 215 is a two-phase liquid inlet port. In at least some embodiments, outlet port 216 is a two-phase liquid outlet port. Inlet port 215 is connected to internal cooling channel 212 via cooling channel 218. Outlet port 216 is connected to cooling channel 219 and internal cooling channel 212 via internal cooling channel 221. In at least some embodiments, the liquid coolant is pumped from inlet port 215 to outlet port 216 by a pump, as described above.

[0034] Cooling plate 211 has a steam output port 217 (port #2) of the cooler / condenser coupled to the cooling channel to recouple the steam output generated from the coolant due to heat back to the coolant source. For example... Figure 2B As shown, the cooling plate 211 includes a steam outlet passage 214 connected to the steam outlet port 217. (As...) Figure 2B As shown, the steam outlet passage 214 is located on and extends along the cooling passage 219. The steam outlet passage 214 is used to release steam generated from the liquid exiting the cold plate 211 through the cooling passage 219, the internal cooling passage 221, and the outlet port 216. Figure 2B As shown, the steam output port 217 is located on the top side of the cooling plate 211. Figure 2B As shown, the steam output port 217 extends vertically at the top of the steam outlet channel 214 to increase the speed at which steam leaves the cold plate. Figure 2B As shown, the cooling channel 212 is separated by the heat sink 213. In one embodiment, the cooling channel 212 and the heat sink 213 are staggered. Figure 2BAs shown, outlet port 216 and inlet port 215 are located on opposite sides of cooling plate 211. In at least some embodiments, the outlet port and inlet port are at similar heights along the side of the cooling plate. Figure 2B As shown, relative to the bottom of cooling plate 211, outlet port 216 is positioned at a height similar to that of inlet port 215. Different cooling plates can be used to adapt to different cooling scenarios. Cooling plates can be optimized for separating vapor from liquid. The embodiments of the cooling plates described herein increase the liquid flow of the two-phase liquid coolant, efficiently separate the vapor flow from the liquid flow of the two-phase coolant, and provide full heat loop recirculation. Figure 2A and Figure 2B As shown, the liquid port is located below the steam port. The steam port is located at the top of the cooling system.

[0035] Figure 3 A view 300 of a server cooling system 301 according to one embodiment is shown. In at least some embodiments, the cooling system 301 includes an electronics rack. In at least some embodiments, the cooling system 301 includes a server chassis including an immersion tank having an immersion coolant 307. In at least some embodiments, the cooling system 301 represents one of the aforementioned cooling systems. The cooling system 301 includes electronics boards on a server chassis 313 submerged in the immersion coolant 307. Figure 3 As shown, cooling module 302 is attached to server chassis 313. Cooling module 302 includes a cooling plate 303, a liquid inlet port 309 coupled to the cooling plate 303, a liquid outlet port 311 coupled to the cooling plate 303, and a vapor port 312 coupled to the cooling plate 303. In at least some embodiments, cooling plate 303 represents as shown in the diagram. Figure 2A and Figure 2B One of the cooling plates shown. In at least some embodiments, cooling plate 303 represents an integral cooling module having more than one cooling plate internally, wherein the cooling plates are arranged in series or parallel. In at least some embodiments, cooling module 302 represents one of the aforementioned cooling modules. Cooling system 301 includes a liquid inlet port 304 connected to a liquid inlet port 309 via one or more liquid lines 315 to deliver two-phase liquid coolant from a coolant source to the fluid passages of cooling plate 303. Cooling system 301 includes a liquid outlet port 305 connected to a liquid outlet port 311 via one or more liquid lines 316 to deliver two-phase liquid coolant back to the coolant source. Cooling system 301 includes a vapor outlet port 306 connected to a vapor port 312 via one or more vapor lines 308 to deliver vapor generated from the two-phase liquid coolant back to the condenser coupled to the coolant source when the temperature of the liquid coolant is greater than a predetermined temperature threshold. Figure 3As shown, the cooling system 301 includes three ports (e.g., liquid inlet port 304, liquid outlet port 305, and steam outlet port 306) and connections to corresponding ports of the cooling module 302. The cooling system 301 enables connections between the system loop and the three ports of the cold plate. The liquid inlet port 304 is used to connect to one or more liquid inlet ports of the cold plate. The steam outlet port 306 is used to connect to one or more steam outlet ports of the cold plate. The liquid outlet port 305 is used to connect to one or more liquid outlet ports of the cold plate. In at least some embodiments, the liquid inlet port 304, liquid outlet port 305, and steam outlet port 306 are connected to the liquid inlet port 309, liquid outlet port 311, and steam port 312, respectively, via flexible connectors. In embodiments, ports 305, 306, and 304 are drip-free quick-disconnect devices.

[0036] Figure 4 This is a view of a hybrid cooling system 400 according to one embodiment. The hybrid cooling system 400 includes an immersion container 401 containing a single-phase coolant 417 for housing a server unit 402. Figure 4 As shown, server unit 402 includes a high-power chip 404 (e.g., server equipment, processor, memory, and / or other electronic devices) on a cooling plate assembly (module) 403 on chassis 405. In at least some embodiments, as described above, cooling plate module 403 represents one of the cooling plate modules (assemblies). In at least some embodiments, cooling plate module 403 includes a plurality of cooling channels and an inlet port coupled to the plurality of cooling channels for input of a two-phase coolant from coolant source 415. Cooling plate module 403 includes an outlet port coupled to the plurality of cooling channels for outputting a heated liquid portion of the two-phase coolant back to coolant source 415. As described above, cooling plate module 403 includes a vapor port coupled to the plurality of cooling channels. In at least some embodiments, server unit 402 represents as referenced above. Figure 3 The described cooling system 301. Server unit 402 includes an inlet port coupled to an inlet port of cooling plate module 403. Server unit 402 includes an outlet port coupled to an outlet port of cooling plate module 403. Server unit 402 includes a steam outlet port coupled to a steam outlet port of cooling plate module 403. Hybrid cooling system 400 includes a liquid supply passage 406, a liquid return passage 407, and a steam passage 408. Figure 4As shown, steam passage 408 is part of the steam circuit. Liquid supply passage 406 includes a liquid supply port 410 connected to the inlet port of server unit 402 to supply two-phase liquid coolant from coolant source 415 to cooling plate 403 using liquid supply pump 413. Liquid return passage 407 includes a liquid return port 411 connected to the outlet port of server unit 402 to return heated liquid coolant from cooling plate 403 to coolant source 415 using liquid return pump 414. Steam passage 408 includes a steam port 409 connected to the steam output port of server unit 402 to output steam generated from the two-phase coolant due to heat to condenser 416 via steam line 412. Figure 4 As shown, the condenser / cooler 416 is attached to the coolant source 415. (As indicated...) Figure 4 As shown, in the hybrid cooling system 400, a server unit 402, including an advanced cooling plate module 403 and a high-power chip 404, is immersed in a single-phase liquid coolant in an immersion container 401. Figure 4 As shown, server unit 402 is vertically mounted in a single-phase liquid coolant. Cooling plate 403 operates in a two-phase liquid coolant pumping system. Mixed cooling system 400 includes a two-phase liquid circuit equipped with a liquid supply pump 413 and a liquid return pump 414. Figure 4 As shown, the two-phase circuit is equipped with two pumps 413 and 414 and three different channels for managing the fluid, such as a liquid supply channel, a liquid return channel, and a vapor return channel. Figure 4 As shown, the vapor passage 408 is located at the top of the system, the liquid supply passage 406 is located below the vapor passage 408 and above the liquid return passage 407, which is located at the bottom of the system. In at least some embodiments, the condenser 416 and the coolant source 415 are used to connect to more than one IT housing.

[0037] Figure 5 This is a view of a hybrid cooling system 500 with a controller according to one embodiment. The hybrid cooling system 500 includes a single-phase coolant 517 and an immersion container 501 for housing server units 502 and 518. Figure 5As shown, server unit 502 includes a high-power chip 504 on a cooling plate module 503 located on chassis 505, as described above. In at least some embodiments, cooling plate module 503 represents one of the cooling plate modules (devices) described above. In at least some embodiments, server unit 502 represents one of server units 402. Hybrid cooling system 500 includes a liquid supply channel 506, a liquid return channel 507, and a vapor channel 508. Liquid supply channel 506 includes a liquid supply port 510 connected to an inlet port of server unit 502 to supply two-phase liquid coolant from a coolant source to cooling plate 503 using a liquid supply pump 513. Liquid return channel 507 includes a liquid return port 511 connected to an outlet port of server unit 502 to return heated liquid coolant from cooling plate 503 to coolant source using a liquid return pump 514. Steam passage 508 includes steam port 509, which is connected to the steam output port of server unit 502 to output steam generated from the two-phase coolant due to heat to the condenser via steam line 512. Figure 5 As shown, server unit 518 includes a controller device 519 (e.g., a processor and / or other controller) on a printed circuit board 520. Controller 519 monitors one or more power conditions for each server unit in server unit 502. Controller 519 monitors one or more power conditions for the entire immersion system, including immersion container 501. In one embodiment, the controller collects the total power input to the IT enclosure. In at least some embodiments, the one or more power conditions are electrical power. In at least some embodiments, the one or more power conditions are temperature, frequency, other power conditions, or any combination thereof. Figure 5 As shown, controller 519 controls the operating speeds of pumps 513 and 514 in the liquid loop based on monitored power conditions. Controller 519 collects power conditions from each server and the entire immersion system to adjust pump speeds. Controller 519 adjusts the speed of pump 513, which supplies two-phase coolant from the coolant source, based on one or more power conditions of server unit 502 and the entire immersion system. Controller 519 adjusts the speed of pump 514, which returns the heated liquid portion of the two-phase coolant to the coolant source, based on one or more power conditions of server unit 502 and the entire immersion system. In at least some embodiments, pumps 513 and 514 operate at different speeds. In at least some embodiments, pumps 513 and 514 operate at similar speeds. In one embodiment, pumps 513 and 514 are integrated into a housing. In another embodiment, pumps 513 and 514 are designed to be located at the system level. Integrating the pumps into a housing simplifies the overall control of both pumps by an internal controller.

[0038] Figure 6This is a flowchart of a method 600 for cooling an electronic rack in a data center according to one embodiment. As described above, in at least some embodiments, the electronic rack includes one or more server units and one or more cooling plates. Method 600 begins at operation 601, which involves operating a first pump (e.g., liquid supply pump 513) to supply coolant from a coolant source to one or more cooling plates at an initial liquid supply (“first”) rate, and operating a second pump (e.g., liquid return pump 514) to return a liquid portion of the coolant from the one or more cooling plates to the coolant source at an initial liquid return (“second”) rate. In at least some embodiments, the liquid supply rate is different from the liquid return rate. In at least some embodiments, the liquid supply rate is similar to the liquid return rate. In at least some embodiments, the difference between the liquid supply rate and the liquid return rate is determined based on system power. At operation 602, the electronic rack power status is monitored. In at least some embodiments, the electronic rack power status includes one or more power statuses of individual server units, such as server unit 502. In at least some embodiments, the electronic rack power status includes, as referenced above... Figure 5 One or more power conditions of the entire immersion system are described. In at least some embodiments, the one or more power conditions are electrical power. In at least some embodiments, the one or more power conditions are temperature, frequency, other power conditions, or any combination thereof. At operation 603, it is determined whether the electronic rack power condition is greater than a predetermined value. If the electronic rack power condition is greater than the predetermined value, method 600 continues at operation 604, which includes increasing the speed of the supply pump. At operation 605, the speed of the liquid return pump is maintained or adjusted based on the speed of the liquid supply pump. In one embodiment, when the speed of the liquid supply pump is increased, the speed of the liquid return pump remains unchanged or is set back to its initial speed. Method 600 then returns to operation 602.

[0039] If the power condition of the electronic rack is not greater than a predetermined value, method 600 continues at operation 606, which includes determining whether the power condition of the electronic rack is less than a predetermined value. If the power condition of the electronic rack is not less than the predetermined value, method 600 returns to operation 602. If the power condition of the electronic rack is less than the predetermined value, at operation 607, the speed of the liquid return pump is reduced. At operation 608, the speed of the liquid supply pump is maintained or adjusted based on the speed of the liquid return pump. In one embodiment, when the speed of the liquid return pump decreases, the speed of the liquid supply pump remains unchanged or is set back to its initial speed. Then, method 600 returns to operation 602.

[0040] In the foregoing description, embodiments of the present disclosure have been described with reference to specific exemplary embodiments. It will be apparent that various modifications may be made to the present disclosure without departing from the broader spirit and scope of the disclosure as set forth in the appended claims. Therefore, the description and drawings should be considered illustrative rather than restrictive.

Claims

1. A hybrid cooling system comprising: one or more cooling panels, at least one of the one or more cooling panels including a plurality of cooling channels, a first inlet port coupled to the plurality of cooling channels, a first outlet port coupled to the plurality of cooling channels, and a first vapor port coupled to the plurality of cooling channels; one or more server units having one or more electronic devices attached to the one or more cooling panels, at least one of the one or more server units including: a second inlet port coupled to the first inlet port of the at least one of the one or more cooling panels to receive coolant from a coolant source, wherein the coolant is a two-phase coolant that transitions from a liquid state to a vapor when attached to the one or more electronic devices to extract heat from the one or more electronic devices; a second outlet port coupled to the first outlet port of the at least one of the one or more cooling panels to output at least a portion of the coolant back to the coolant source; a vapor channel coupled to the first vapor port to output the vapor generated from the coolant to a condenser configured to condense the vapor back to the liquid state; a liquid supply channel coupled to the second inlet port of the at least one of the one or more server units; a liquid return channel coupled to the second outlet port of the at least one of the one or more server units; and an immersion container including a single-phase coolant to contain the one or more cooling panels, wherein a first pump coupled to the one or more cooling panels is operated at a first speed to supply coolant from the coolant source, a second pump coupled to the one or more cooling panels is operated at a second speed to return at least a portion of the coolant to the coolant source, and wherein the first speed and the second speed are adjusted based on both one or more power conditions of each of the one or more server units and one or more power conditions of an entire immersion system including the immersion container.

2. The hybrid cooling system of claim 1, wherein: the at least one cooling panel includes one or more fins that partition the plurality of cooling channels.

3. The hybrid cooling system of claim 1, wherein, the first vapor port is disposed on a top side of the at least one cooling panel.

4. The hybrid cooling system of claim 1, wherein, the first outlet port and the first inlet port are disposed on opposite sides of the at least one cooling panel.

5. The hybrid cooling system of claim 1, wherein, the first outlet port and the first inlet port are disposed at different heights along a side of the at least one cooling panel, or wherein the first outlet port and the first inlet port are disposed at similar heights along a side of the at least one cooling panel.

6. The hybrid cooling system of claim 1, wherein, the first vapor port is connected to one or more fluid channels.

7. The hybrid cooling system of claim 1, further comprising one or more second vapor ports for outputting the vapor generated from the coolant.

8. The hybrid cooling system of claim 1, further comprising: a controller coupled to the one or more cooling panels to adjust at least one of the first speed and the second speed.

9. The hybrid cooling system of claim 1, wherein, the one or more cooling panels comprise at least two cooling panels connected in series or in parallel.

10. The hybrid cooling system of claim 1, wherein, the one or more server units comprise a plurality of vapor outlet ports.

11. A method for cooling a data center electronic enclosure comprising one or more server units and one or more cooling panels coupled to the one or more server units, the one or more cooling panels housed in an immersion vessel comprising a single-phase coolant, the method comprising: operating a first pump coupled to the one or more cooling panels at a first speed to supply coolant from a coolant source, wherein the coolant is a two-phase coolant that transitions from a liquid state to a vapor state upon attachment to one or more electronic devices to extract heat from the one or more electronic devices; operating a second pump coupled to the one or more cooling panels at a second speed to return at least a portion of the coolant to the coolant source; monitoring electronic rack power conditions comprising one or more power conditions of each server unit of the one or more server units and one or more power conditions of an entire immersion system comprising the immersion vessel; and adjusting the first speed and the second speed based on the monitoring.

12. The method of claim 11, wherein, at least one cooling panel of the one or more cooling panels comprises a plurality of cooling channels, a first inlet port coupled to the plurality of cooling channels to receive the coolant from the coolant source, a first outlet port coupled to the plurality of cooling channels to output the at least a portion of the coolant back to the coolant source, and a first vapor port coupled to the plurality of cooling channels.

13. The method of claim 11, further comprising: adjusting the second speed based on the first speed.

14. The method of claim 11, wherein, a difference between the first speed and the second speed is set based on system power.

15. The method of claim 11, further comprising: increasing the first speed of the first pump when the electronic rack power conditions are greater than a predetermined value.

16. The method of claim 11, further comprising: decreasing the second speed of the second pump when the electronic rack power conditions are less than a predetermined value.

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