Electronic equipment racks, devices, and data center systems for data centers

Abstract

The present disclosure provides an electronic equipment rack, an apparatus, and a data center system for a data center. Systems and methods for providing a prefabricated module design for a heterogeneous data center are described. An apparatus for providing cooling for an electronic equipment rack of a data center includes a plurality of lines. A main chassis is coupled to the plurality of lines. The main chassis is configured to be integrated on the electronic equipment rack. An extension chassis is coupled to the main chassis. The extension chassis is configured to move relative to the main chassis. A plurality of connection ports is coupled to the extension chassis to provide a connection between the electronic equipment rack and one or more external sources. The plurality of connection ports is configured to move relative to the plurality of lines at a fixed location on the electronic equipment rack.

Description

TECHNICAL FIELD

[0001] Embodiments of the present disclosure generally relate to data center cooling. More specifically, embodiments of the present disclosure relate to a heterogeneous cooling system for a data center. BACKGROUND

[0002] Cooling is an important factor in computer system and data center design. The number of high performance electronic device components such as high performance processors packaged inside a server is steadily increasing, thereby increasing the amount of heat generated and dissipated by the server during normal operation. If the operating environment temperature of the servers used within a data center is allowed to increase over time, the reliability of the servers decreases. Maintaining an appropriate thermal environment is critical for the normal operation of these servers in a data center as well as for server performance and longevity. This requires more efficient and effective cooling solutions, particularly in the case of cooling these high performance servers.

[0003] Conventional cooling solutions for designing modular clusters do not take into account different fluid systems and different cluster requirements. Additionally, conventional solutions can not be used to house different information technology (IT) clusters to coexist. SUMMARY

[0004] The present disclosure provides an electronic device rack, an apparatus, and a data center system for a data center.

[0005] According to an aspect of the present disclosure, an apparatus for an electronic device rack of a data center is provided, comprising: a plurality of pipelines; a main chassis coupled to the plurality of pipelines, the main chassis configured to be fixed on the electronic device rack; an extension chassis coupled to the main chassis, the extension chassis configured to move with respect to the main chassis; and a plurality of connection ports coupled to the extension chassis to provide a connection between the electronic device rack and one or more external sources, wherein the plurality of connection ports are configured to move with respect to the plurality of pipelines located at a fixed position on the electronic device rack.

[0006] According to one aspect of this disclosure, an electronic device rack for a data center is provided, comprising: a server rack; a chassis coupled to the server rack, the chassis having a first pair of liquid lines mounted therein, the first pair of liquid lines including: a first liquid supply line for distributing a first coolant to the one or more electronic device racks when the chassis is positioned on top of the one or more electronic device racks, and a first liquid return line for receiving the first coolant from the one or more electronic device racks; and an expansion chassis coupled to the chassis, the expansion chassis being configured to move relative to the chassis, the expansion chassis including a first pair of external ports respectively coupled to the first pair of liquid lines, wherein the first pair of external ports are capable of being coupled to a first external cooling source to receive and return the first coolant, wherein the expansion chassis is capable of horizontally expanding beyond the physical dimensions of the electronic device rack from within the chassis, and the chassis and the first pair of liquid lines are fixedly mounted on top of the one or more electronic device racks or an immersion container.

[0007] According to one aspect of this disclosure, a data center system is provided, comprising: a first cluster of electronic device racks; a second cluster of electronic device racks, the second cluster of electronic device racks being positioned parallel to and spaced apart from the first cluster to form an aisle between the two; a first cooling device disposed on top of and across the first cluster of electronic device racks; and a second cooling device disposed on top of and across the second cluster of electronic device racks, wherein each of the first cooling device and the second cooling device includes: a chassis having a first pair of liquid lines mounted therein, the... The first pair of liquid lines includes a first liquid supply line for distributing first coolant to a corresponding electronic device rack and a first liquid return line for receiving the first coolant from the corresponding electronic device rack, and an expansion chassis coupled to the main chassis. The expansion chassis is configured to move relative to the main chassis and includes a first pair of external ports coupled to the first pair of liquid lines, wherein the first pair of external ports are capable of being coupled to a first external cooling source to receive and return the first coolant. The expansion chassis is capable of horizontally expanding from within the main chassis toward the center of the aisle to form a receiving area, while the main chassis and the first pair of liquid lines are fixedly mounted on top of the corresponding electronic device rack. Attached Figure Description

[0008] The accompanying drawings illustrate examples and are therefore exemplary embodiments, and are not intended to limit the scope.

[0009] Figure 1A A view of a cooling unit on an electronic equipment rack in a data center according to one embodiment is shown.

[0010] Figure 1B A view of a cooling unit on an electronic equipment rack in a data center according to one embodiment is shown.

[0011] Figure 1C A view is shown of a cooling unit on an electronic equipment rack in a data center according to one embodiment, the cooling unit being operated to provide a housing area.

[0012] Figure 2A A top view of a cooling device on an electronic device rack according to one embodiment is shown.

[0013] Figure 2B A top view of a cooling device on an electronic device rack according to one embodiment is shown.

[0014] Figure 3A It is a block diagram illustrating a perspective view of at least a portion of a data center including an IT cluster according to one embodiment.

[0015] Figure 3B It is a block diagram illustrating a perspective view of at least a portion of a data center including an IT cluster according to one embodiment.

[0016] Figure 3C It is a block diagram illustrating a perspective view of at least a portion of a data center including an IT cluster according to one embodiment.

[0017] Figure 4A A top view of a cooling device on an electronic device rack according to one embodiment is shown.

[0018] Figure 4B A top view of a cooling device on an electronic device rack according to another embodiment is shown.

[0019] Figure 5A A top view of a device on an electronic device rack according to one embodiment is shown.

[0020] Figure 5B A top view of a device on an electronic device rack according to one embodiment is shown.

[0021] Figure 6 This is a view of a heterogeneous IT cluster based on one embodiment.

[0022] Figure 7 A view of a heterogeneous data center system according to one embodiment is shown.

[0023] Figure 8 A view of a heterogeneous data center system according to one embodiment is shown.

[0024] Figure 9 This is a block diagram illustrating an electronic device rack according to one embodiment.

[0025] Figure 10 It is a block diagram illustrating a top view of at least a portion of a data center system according to one embodiment. Detailed Implementation

[0026] Systems and methods for providing prefabricated modular designs for heterogeneous data centers are described. Advanced modular design is used to manufacture highly prefabricated systems to configure diverse heterogeneous information technology (IT) clusters. The term "heterogeneous" as described in this application refers to different types of IT configurations and cooling systems coexisting in a single cluster.

[0027] In at least one embodiment, an apparatus for providing cooling for an electronics equipment rack in a data center includes multiple cablings. A mainframe chassis is coupled to the multiple cablings. The mainframe chassis is configured to be fixed to the electronics equipment rack. An expansion chassis is coupled to the mainframe chassis. The expansion chassis is configured to move relative to the mainframe chassis. Multiple connection ports are coupled to the expansion chassis to provide connectivity between the electronics equipment rack and one or more external sources. The multiple connection ports are configured to move relative to the multiple cablings located at fixed positions on the electronics equipment rack.

[0028] In at least some embodiments, the cooling device for the electronic equipment rack in a data center includes a cooler and a collector coupled to the cooler, and multiple fluid lines are coupled to the collector. A mainframe chassis is coupled to the multiple fluid lines and configured to be fixed to the electronic equipment rack. An expansion chassis is coupled to the mainframe chassis and configured to move relative to the mainframe chassis. Multiple fluid connection ports are coupled to the expansion chassis to provide fluid connectivity between the electronic equipment rack and one or more external sources. The multiple fluid connection ports are configured to move relative to the multiple fluid lines located at fixed positions on the electronic equipment rack.

[0029] In at least some embodiments, a cooling system for a data center includes multiple electronic device racks, including a first cooling device on a first electronic device rack and a second cooling device on a second electronic device rack. The first cooling device includes a cooler and a collector coupled to the cooler. Multiple pipelines are coupled to the collector. A chassis is coupled to the multiple pipelines. The chassis is configured to be fixed to the first electronic device rack. An expansion chassis is coupled to the chassis and configured to move relative to the chassis. Multiple connection ports are coupled to the expansion chassis to provide connectivity between the first electronic device rack and one or more external sources. At least one of the cooler or collector is located within the expansion chassis and extends outside the first electronic device rack to connect to the second cooling device, thereby providing a housing area.

[0030] In at least one embodiment, the cooling device is designed for use in rows of electronic equipment racks. In at least one embodiment, the cooling device is designed to be located on top of the electronic equipment rack. The cooling device is used to enable fluid connection between a single electronic equipment rack and an external source. The cooling device includes fluid lines and fluid connection ports. The cooling device also includes a vapor collector and a cooler located on top of the vapor collector. The cooler is used to cool airflow and / or vaporflow. In at least some embodiments, the cooler is part of an air-to-liquid heat exchanger. The cooling device includes a main chassis and an expansion chassis. The main chassis is located at a fixed position on the electronic equipment rack. The expansion chassis expands during normal operation. During operation, the fluid lines are fixed to the main chassis, as described in further detail below.

[0031] In at least some embodiments, modular and prefabricated architectures for data center clusters are used to deploy heterogeneous IT systems. At least some embodiments of this disclosure provide efficient cooling system architectures for designing and deploying heterogeneous information technology (IT) clusters. At least some embodiments of this disclosure provide hyperscale heterogeneous data center cooling systems. At least some embodiments of this disclosure provide efficient facility-side designs with integrated containment solutions. At least some embodiments of this disclosure provide co-design of facilities and IT containers. At least some embodiments of this disclosure provide integration of different cooling technologies. Embodiments of heterogeneous prefabricated modular designs provide highly reliable, rapid design, manufacturing, building, and deployment, and scalable solutions for different use cases. At least some embodiments of this disclosure enable different containment designs. At least some embodiments of this disclosure provide highly integrated architectures that allow different IT systems to coexist. At least some embodiments of this disclosure provide different types of servers coexisting in a cluster. At least some embodiments of this disclosure adapt to rapid system changes, as described in further detail below.

[0032] Various embodiments and aspects of this disclosure will be described with reference to the details discussed below, and the accompanying drawings will illustrate the various embodiments. The following description and drawings are illustrative of this disclosure and should not be construed as limiting. Numerous specific details are described to provide a full understanding of various embodiments of this disclosure. However, in some cases, well-known or conventional details have not been described to provide a concise discussion of embodiments of this disclosure.

[0033] In this specification, references to "one embodiment" or "an embodiment" mean that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this disclosure. The phrase "in one embodiment" appearing in various places in this specification does not necessarily refer to the same embodiment.

[0034] Figure 1A A view 100 shows a cooling device (apparatus) 101 on an electronic equipment rack 110 of a data center according to one embodiment. (See diagram 100.) Figure 1A As shown, the cooling device 101 includes multiple pipelines 102, a main unit chassis 103, an expansion chassis 104, and multiple connection ports 105. In at least some embodiments, the multiple pipelines 102 include fluid pipelines, power pipelines, or both power pipelines and fluid pipelines, for connecting to corresponding pipelines in the electronic equipment rack 110. The main unit chassis 103 is coupled to the multiple pipelines 102. In at least some embodiments, the multiple pipelines are located within the main unit chassis 103, such as... Figure 1A As shown. Figure 1A As shown, the main unit chassis 103 is located at a fixed position 113 on the electronic equipment rack 110. An expansion chassis 104 is coupled to the main unit chassis 103. The expansion chassis 104 is movable relative to the main unit chassis 103. Figure 1A As shown, multiple connection ports 105 are coupled to an expansion chassis 104. The connection ports 105 provide connectivity between the electronics rack 110 and one or more external sources (not shown). The multiple connection ports 105 are configured to move relative to multiple conduits 102 located at a fixed position 113 on the electronics rack.

[0035] Figure 1B View 120 shows a cooling unit 101 on an electronics rack 110 of a data center according to one embodiment. View 120 differs from view 100 in that an expansion chassis 104 is moved relative to a main chassis 103, causing connection ports 105 to move relative to multiple pipelines 102 located at fixed positions 113 on the electronics rack 110. Figure 1A and Figure 1BAs shown, the electronics equipment rack 110 includes one or more server chassis 108 that are inserted into server slots within the electronics equipment rack 110. The electronics equipment rack 110 includes cabling 109. In at least some embodiments, the cabling 109 includes electronics equipment rack fluid cabling, power cabling, or both power cabling and fluid cabling for connection to corresponding cabling 102. The cooling device 101 includes a collector 107 coupled to the cabling 102 and the cooler 112. Figure 1A and Figure 1B As shown, cooler 112 is positioned on top of collector 107. In at least some embodiments, collector 107 is used to collect and / or condense vapor generated by the liquid, which is returned to the liquid via server rack piping. Figure 1A and Figure 1B As shown, the device 101 includes a channel 106 for connecting an expansion chassis 104 to a main chassis 103. In at least some embodiments, the expansion chassis 104 includes the channel 106 for connecting to the main chassis 103. Figure 1A and Figure 1B As shown, the cooling device 101 includes one or more sliding channels 111 coupled to the channel 106. A connection port 105 is connected to multiple lines 101 via a flexible connector 141 (e.g., a hose or other flexible connector). In at least some embodiments, the connection port 105 is a fluid connection port, an electrical connection port, or both.

[0036] like Figure 1A and Figure 1B As shown, the cooling device 101 is integrated on the electronic device rack 110. In at least some embodiments, the enclosure (housing) of the cooling device 101 is a top unit (module) on the electronic device rack 110. Figure 1A The cooling device 101 is shown in its initial position. In the initial position, the cooling device 101 is aligned with the electronic equipment rack 110. Figure 1B A cooling unit 101 in an extended position is shown. In this extended position, a portion of the cooling unit on the extended chassis 104 extends beyond the electronics equipment rack 110. In at least some embodiments, the cooling unit 101 includes a liquid line (e.g., line 102) and a cooler (e.g., cooler 112). The liquid line 102 is used to connect one or more rack liquid lines 109 to an external cooling source (not shown). The liquid line 102 is connected to the external cooling source via a corresponding connection port 105. Figure 1C and Figure 1CAs shown, cooler 112 is located on top of collector 107. Collector 112 can provide multiple functions for various applications. In at least some embodiments, the collector collects liquid condensed from vapor. In at least some embodiments, the collector collects any leaked cooling fluid. In at least one embodiment, the collector acts as a protector providing isolation between the rack and the cooling recirculation device on top of the rack.

[0037] In at least some embodiments, the main unit chassis 103 is fixed to the top of the rack 110, and the liquid line 102 is fixed inside the main unit chassis 103. The extension chassis 104 is movable and extends to the outside of the electronics rack 110 at varying lengths. The extension chassis 104 is connected to the main unit chassis 103 via a channel 106, and a sliding channel 111 is provided between them. When the cooling device 101 extends to the outside of the rack 110, the cooler 112 and the collector 107 also extend to the outside of the rack 110.

[0038] In at least some embodiments, the connection between the rack (e.g., electronics rack 110) and the liquid line (e.g., line 102) is fixed during the prefabrication process. The only moving loop is the loop between the external port (e.g., connection port 105) and the liquid line. In embodiments, cooler 112 is connected to one external fluid source, and liquid line 102 is connected to another external fluid source. In at least some embodiments, multiple lines 102 are fluid lines and include single-phase fluid lines, two-phase fluid lines, or both single-phase and two-phase fluid lines to support different cooling systems for the electronics rack. In at least some embodiments, at least one of cooler 112 and collector 107 is located within an extension enclosure 104 to extend outside the electronics rack, thereby providing a housing area with another cooling device, as per [reference to...]. Figure 1C Further detailed description.

[0039] Figure 1C View 140 shows a cooling unit on an electronics rack in a data center according to one embodiment, the cooling unit providing housing area. In at least some embodiments, view 140 represents a front view of two rows of IT clusters, where cooling units 101 and 121 are extended and aligned. Figure 1C As shown, the cooling device 121 includes multiple pipelines 122, a main unit chassis 123, an expansion chassis 124, and multiple connection ports 125. In at least some embodiments, the multiple pipelines 122 include fluid pipelines, power pipelines, or both power pipelines and fluid pipelines, for connecting to corresponding pipelines in the electronic equipment rack 130. The main unit chassis 123 is coupled to the multiple pipelines 122. In at least some embodiments, the multiple pipelines are located within the main unit chassis 123, such as... Figure 1C As shown. Figure 1CAs shown, the main unit chassis 123 is located at a fixed position 133 on the electronic equipment rack 130. An expansion chassis 124 is coupled to the main unit chassis 123. The expansion chassis 124 is movable relative to the main unit chassis 123. Figure 1C As shown, multiple connection ports 125 are coupled to an expansion chassis 124. The connection ports 125 provide connectivity between the electronics rack 130 and one or more external sources (not shown). The multiple connection ports 125 are configured to move relative to multiple conduits 122 located at a fixed position 133 on the electronics rack 130.

[0040] like Figure 1C As shown, expansion chassis 104 moves relative to main chassis 103, causing connection port 105 to move relative to multiple cables 102 located at fixed position 113 on electronic equipment rack 110. Expansion chassis 124 moves relative to main chassis 123, causing connection port 125 to move relative to multiple cables 122 located at fixed position 133 on electronic equipment rack 130.

[0041] like Figure 1C As shown, the electronics equipment rack 130 includes one or more server chassis 128 that are inserted into server slots within the electronics equipment rack 130. The electronics equipment rack 130 includes cabling 129. In at least some embodiments, the cabling 129 includes electronics equipment rack liquid cabling, power cabling, or both power cabling and fluid cabling for connection to corresponding cabling 122. The cooling device 121 includes a collector 127 coupled to the cabling 122 and the cooler 132. Figure 1A As shown, the cooler 132 is placed on top of the collector 127. Figure 1B As shown, the device 121 includes a channel 126 for connecting an expansion chassis 124 to a main chassis 123. In at least some embodiments, the expansion chassis 124 includes the channel 126 for connecting to the main chassis 123. Figure 1C and Figure 1C As shown, the cooling device 121 includes one or more sliding channels 131 coupled to the channel 126. (As indicated...) Figure 2A As shown, connection port 125 is connected to multiple lines 121 via flexible connector 142 (e.g., hose or other flexible connector). In at least some embodiments, connection port 125 is a fluid connection port, a power connection port, or both. Cooling device 121 is integrated on electronic device rack 130. In at least some embodiments, the enclosure (housing) of cooling device 121 is a top unit (module) on electronic device rack 130.

[0042] Cooling devices 101 and 121 are located in their respective extended positions, such as Figure 2BAs shown. A portion of the cooling unit 101 on the expansion chassis 104 extends beyond the electronics equipment rack 110 by a distance d1. A portion of the cooling unit 121 on the expansion chassis 124 extends beyond the electronics equipment rack 110 by a distance d2. In at least some embodiments, each of distances d1 and d2 is approximately half the distance between racks 110 and 130, thereby forming a receiving area 140. The receiving area 140 includes opposing sidewalls that are extensions of the outer walls of the electronics equipment racks 110 and 130 and the housings of the cooling units 101 and 121.

[0043] That is, the two extended sides of cooling devices 101 and 121 form a receiving area 140. Cooling device 101 provides a connection to rack line 109 via line 102 to connection port 105. Cooling device 121 provides a connection to rack line 129 via line 122 to connection port 125. Cooling devices 101 and 121 also provide the receiving area 140. Connection ports 105 and 125 can be connected to different external sources. In this embodiment, each of coolers 112 and 132 serves as a liquid-to-air heat exchanger for cooling hot exhaust gases from the rear of the rack contained in the receiving area 140. Within the receiving area, the hot exhaust gases are directed only to coolers 112 and 132 and cooled before leaving the receiving area.

[0044] In at least some embodiments, the main chassis 103 has a first pair of liquid lines, such as two lines 102 mounted therein. When the main chassis 103 is located on top of an electronics equipment rack (such as electronics equipment rack 110), the first pair of liquid lines includes a liquid supply line for distributing a first coolant to the electronics equipment rack array and a liquid return line for receiving the first coolant from the electronics equipment rack. In at least some embodiments, an expansion chassis 104 is coupled to the main chassis 103. The expansion chassis 104 is configured to move relative to the main chassis 103. The expansion chassis includes a first pair of external ports, such as a pair of connection ports 105 respectively coupled to the first pair of liquid lines. The first pair of external ports can be coupled to a first external cooling source to receive and return coolant. The expansion chassis 104 is capable of horizontally expanding beyond the physical dimensions of the electronics equipment rack (such as electronics equipment rack 110) from within the main chassis 103, while the main chassis 103 and the pair of liquid lines 102 are fixedly mounted on top of the electronics equipment rack. In at least some embodiments, the main chassis 103 and the expansion chassis 104 are prefabricated as an integrated unit that can be mounted on top of rows of electronic equipment racks. In at least some embodiments, the expansion chassis includes a second pair of external ports coupled to a second cooling source to receive a second coolant. A cooler 112 is coupled to the second pair of external ports to provide cooling for the air space below the expansion chassis 104 using the second coolant as the expansion chassis 104 expands from the main chassis 103. In at least some embodiments, a collector 107 is used to collect some of the first coolant condensed from vapor by the cooler 112. In at least some embodiments, the cooler is an air-to-liquid heat exchanger. In at least some embodiments, a second pair of liquid lines is disposed within the main chassis 103. In at least some embodiments, the first pair of liquid lines is configured to dispense a single-phase coolant, and the second pair of liquid lines is configured to dispense a two-phase coolant. In at least some embodiments, the first pair of liquid lines is coupled to a rackmanifold of the electronic equipment rack via corresponding flexible hoses.

[0045] Figure 2A A top view 200 of a cooling device 201 on an electronic device rack 208 according to one embodiment is shown. View 200 illustrates the cooling device 201 in a non-extended state. Figure 2B A top view 210 of a cooling device 201 on an electronics equipment rack 208 according to one embodiment is shown. View 210 illustrates an extended state of the cooling device 201. View 210 differs from view 200 in that the extended chassis of the cooling device 201 moves relative to the main chassis that remains fixed to the rack 208. Figure 2A and Figure 2BAs shown, the cooling device 201 includes a cooler 204, a collector 203, fluid lines 212, 213, 214, 215, a main unit housing 205, and an expansion housing 202; a sliding channel 207 and a fluid connection port 206. Figure 2B and Figure 3A As shown, fluid lines 212, 213, 214, and 215 are coupled to collector 203 and main chassis 205. In at least some embodiments, fluid lines 212, 213, 214, and 215 are located within main chassis 205, which is fixed to rack 208. Expansion chassis 202 is movable relative to main chassis 205, which is fixed to rack 208. Fluid connection port 206 is located on expansion chassis 202. Connection port 206 provides connection between lines 212, 213, 214, and 215 and one or more external sources. Connection port 206 is connected to lines 212, 213, 214, and 215 via flexible connector 216 (e.g., hose or other flexible connector). Figure 3A As shown, the expansion chassis 202, which has a connection port 206, is moved to the outside of the rack 208, while the main chassis 205, which includes multiple fluid lines 212, 213, 214, and 215, remains fixed to the rack 208. In at least some embodiments, the cooling device 201 is a prefabricated module mounted on the electronics equipment rack. In at least some embodiments, lines 212 and 213 are single-phase fluid lines, while lines 214 and 215 are two-phase fluid lines. In at least some embodiments, each of lines 213 and 215 is a supply line, while each of lines 212 and 214 is a return line.

[0046] Figure 3B This is a block diagram illustrating a perspective view of at least a portion of a data center 310 including an IT cluster according to one embodiment. Figure 3B As shown, data center 310 includes rows of electronic equipment racks 311, 312, 313 and 314 of information technology (IT) components, such as computer servers or computing nodes separated by aisles.

[0047] Figure 3B This is a block diagram illustrating a perspective view of at least a portion of a data center 320 including an IT cluster according to one embodiment. Figure 3BAs shown, clusters of electronic equipment racks 321 and 322 are arranged in rows separated by aisles. A cooling device (assembly) 327 is placed on top of the electronic equipment rack 321. In at least one embodiment, the cooling device 327 includes multiple pipelines, a main chassis coupled to the multiple pipelines, and an expansion chassis coupled to the main chassis. In at least some embodiments, the multiple pipelines include fluid pipelines, power pipelines, or both power pipelines and fluid pipelines, for connecting to corresponding pipelines of the electronic equipment rack. The main chassis is configured to be fixed to the electronic equipment rack. The expansion chassis is configured to move relative to the main chassis. Multiple connection ports are coupled to the expansion chassis to provide connectivity between the electronic equipment rack and one or more external sources. As described above, the multiple connection ports are configured to move relative to the multiple pipelines located at fixed positions on the electronic equipment rack. Figure 3C As shown, the cooling device 327 extends to the top portion of the electronic equipment rack 321 to form a housing environment (housing area) 326 within the aisle. The housing area 326 is located within the opposite sidewalls of the electronic equipment racks 321 and 322, the extended portion of the cooling device 327, and the floor 330. The housing area 326 represents a unilateral extended environment.

[0048] like Figure 3C As shown, clusters of electronic equipment racks 323 and 324 are arranged in rows separated by aisles. Cooling devices 329 are placed on top of electronic equipment racks 323. Cooling devices (assemblies) 328 are placed on top of electronic equipment racks 324. Cooling devices 328 and 329 extend toward each other to form a receiving area 325 within the aisle. The receiving area 325 is located within the opposite sidewalls of electronic equipment racks 323 and 324, the extended portions of cooling devices 328 and 329, and the floor 330. The receiving area 325 represents a double-sided extended environment.

[0049] Figure 3C This is a block diagram illustrating a perspective view of at least a portion of a data center system 300 including an IT cluster according to one embodiment. Figure 4A As shown, electronic equipment racks 301 and 302 form clusters (e.g., rows) separated by aisles, as described above. Cooling devices 303 are positioned on top of electronic equipment rack 301, and cooling devices 304 are positioned on top of electronic equipment rack 302. In at least some embodiments, the enclosure (housing) of cooling device 303 is a top unit on the electronic equipment rack 301 cluster. In at least some embodiments, the enclosure (housing) of cooling device 304 is a top unit on the electronic equipment rack 302 cluster. Cooling devices 303 and 304 are connected to a data center coolant distribution system 306, as described above. Figure 4AAs shown. As described above, cooling devices 303 and 304 extend toward each other across passage 305 to form a cold containment area in passage 305.

[0050] Each of cooling devices 303 and 304 includes: a main chassis having a first pair of liquid lines installed therein, the first pair of liquid lines including a first liquid supply line for distributing first coolant to a corresponding electronic device rack and a first liquid return line for receiving first coolant from the corresponding electronic device rack; and an expansion chassis coupled to the main chassis, the expansion chassis being configured to move relative to the main chassis, the expansion chassis including a first pair of external ports respectively coupled to the first pair of liquid lines, wherein the first pair of external ports can be coupled to a first external cooling source to receive and return the first coolant, wherein the expansion chassis is capable of horizontally expanding from inside the main chassis toward the center of the aisle to form an enclosed aisle, and the main chassis and the first pair of liquid lines are fixedly mounted on top of the corresponding electronic device rack, as described above.

[0051] Figure 4A A top view of a cooling device 400 on an electronics device rack 413 according to one embodiment is shown. In at least some embodiments, the cooling device 400 represents one of the cooling devices described above. Figure 4A As shown, the cooling device 400 includes a main unit chassis 401, an expansion chassis 402, a power bus (including power lines 403 and 404), fluid lines 405, 409, 407, and 408, a cooler 411, a collector 406, and a connection port 412. Figure 4A As shown, fluid lines 405, 409, 407, and 408 are coupled to collector 406. In at least some embodiments, lines 405 and 409 are single-phase fluid lines, while lines 407 and 408 are two-phase fluid lines. In at least some embodiments, each of lines 405 and 407 is a supply line, while each of lines 408 and 409 is a return line.

[0052] like Figure 4B As shown, power lines 403, 404 and fluid lines 405, 409, 407, 408 are located within a main chassis 401 fixed to the top of rack 413. An expansion chassis 402 is movable relative to the main chassis 401 fixed to rack 413. A connection port 412 is located on the expansion chassis 402. In at least some embodiments, the connection port 412 is a power connection port coupled between power lines 403 and 404 and one or more external sources. In at least some embodiments, the connection port 412 is a fluid connection port coupled between fluid lines 405, 409, 407, 408 and one or more external fluid sources.

[0053] like Figure 4BAs shown, the power bus, including lines 403 and 404, is encapsulated within a mainframe chassis 401 fixed to a rack 413. A power connection port 412 connects to power lines 403 and 404 via a flexible connector (not shown). This flexible connector expands when the power connection port 412 on the expansion chassis 402 is moved outside the rack 413, while the mainframe chassis 401, including power lines 403 and 404 and fluid lines 405, 409, 407, and 408, remains fixed to the rack 413. In at least some embodiments, the cooling device 401 is a prefabricated module mounted on the electronics equipment rack.

[0054] Figure 4B A top view of a cooling device 410 on an electronics device rack 423 according to another embodiment is shown. In at least some embodiments, cooling device 410 refers to one of cooling devices 303 and 304, or other cooling devices described herein. Figure 4B As shown, the cooling device 410 includes a main chassis 414, an expansion chassis 417, a power bus (including power lines 415, 416), fluid lines 425, 429, 427, 428, a cooler 431, a collector 426, and a connection port 422. In at least some embodiments, the connection port 422 is a fluid connection port coupled between the fluid lines 425, 429, 427, 428 and one or more external fluid sources. Figure 4A As shown, fluid lines 425, 429, 427, and 428 are coupled to collector 426. In at least some embodiments, lines 425 and 429 are single-phase fluid lines, while lines 427 and 428 are two-phase fluid lines. In at least some embodiments, each of lines 425 and 427 is a supply line, while each of lines 428 and 429 is a return line, as described above.

[0055] Figure 4B The illustrated embodiments and Figure 4B The difference in the illustrated embodiment is that power lines 415 and 416 are located within expansion enclosure 417. As... Figure 5A As shown, fluid lines 425, 429, 427, and 428 are located within a main chassis 414 fixed to the top of rack 423. An expansion chassis 417, including power lines 415 and 416, is movable relative to the main chassis 414 fixed to rack 423. In at least some embodiments, power connection ports (not shown) coupled between power lines 403 and 404 and one or more external sources are located on expansion chassis 417. Figure 5B As shown, the power bus, including power lines 415 and 416, is encapsulated within a scalable chassis. In at least some embodiments, the cooling device 410 is a prefabricated module mounted on an electronic equipment rack.

[0056] Figure 5A A top view 500 of a device 501 on an electronic device rack 503 according to one embodiment is shown. Figure 5B A top view 510 of a device 501 on an electronics equipment rack 503 according to one embodiment is shown. View 510 differs from view 500 in that the expansion chassis 508 of the device 501 is movable relative to the main chassis 507, which is held fixed to the rack 503. In at least some embodiments, the device 501 represents one of cooling devices 303 and 304, or other cooling devices described herein. Figure 5A and Figure 5B As shown, device 501 includes a main chassis 507 and an expansion chassis 508. The main chassis includes conduits 504 and 505 fixed to an electronics equipment rack 503. The expansion chassis is located outside the rack 503. In at least some embodiments, conduits 504 and 505 are fluid conduits coupled to a collector and a cooler, as described above. In at least some other embodiments, conduits 504 and 505 are electrical conduits. In at least some other embodiments, conduits 504 and 505 represent both electrical and fluid conduits. Figure 2A and Figure 2B As shown, connection port 502 is located within expansion enclosure 508 to provide connectivity between conduits 504 and 505, which are fixedly located on electronics rack 503, and one or more external sources via flexible connector 506. Because only connection port 502 is movable outside rack 503, [the following is unclear and likely incomplete: "relative to about..."] Figure 6 and Figure 6 Compared to the described device 501, device 501 is more compact.

[0057] Figure 6 This is a front view 600 of a heterogeneous IT cluster according to one embodiment. The front view can be understood as a person standing in an aisle, facing the IT system. The heterogeneous IT cluster includes electronic equipment racks 602 and 603, and an immersion container 606 between racks 602 and 603. Figure 6 As shown, a cooling device 601 is positioned on at least a portion of electronic device racks 602 and 603 and an immersion container 606. In one embodiment, the cooling device 601 is positioned on top of the entire heterogeneous IT cluster. As described above, electronic device racks 602 and 603 include server chassis 604 containing IT components (e.g., electronic devices such as processors, memory, and / or storage devices). As described above, the immersion container 606 contains an immersion coolant 611. Electronic devices of (a plurality of) corresponding servers (not shown) are at least partially immersed in the immersion coolant 611. The immersion coolant 611 may be a dielectric cooling fluid that circulates between the immersion container 606 and the cooling device 601. Vapor flows upstream from the corresponding server chassis to the cooling device 601 via vapor lines.

[0058] like Figure 6 As shown, the extension frame 605 is located on the submerged vessel 606. The extension frame 605 is designed for steam management between the submerged vessel 606 and the cooling device 601. The extension frame 605 is used to guide the steam flow to the cooler 609 for condensation. Figure 7 As shown, one or more fans 610 are coupled to the extension frame 605 to direct steam flow to the cooler 609. In at least some embodiments, the height of the extension frame 605 is adjusted to match the difference between the height of the rack 602 and the height of the immersion vessel 606. For a non-limiting example, the height of the immersion vessel 606 is approximately 1.5 meters (m), the height of the rack 602 is approximately 2.0 meters (m), and the height of the extension frame is adjusted to approximately 0.5 meters (m). Figure 6 As shown, the cooling device includes a fluid distribution module 607. In at least some embodiments, the fluid distribution module 607 refers to a main unit housing 716 comprising multiple fluid lines, as described below. Figure 7 Further detailed description.

[0059] like Figure 7 As shown, cooling device 601 includes one or more lines 608 for receiving warm liquid / air from racks 602, 603 and / or immersion container 606. Cooling device 601 includes a cooler 609 for cooling the warm liquid / air and a collector 609 coupled to the cooler to condense vapor back into liquid, wherein the coolant is then supplied back to the server chassis via return line 606. In one embodiment, cooling device 601 represents at least a portion of a cooling device as described above. In one embodiment, cooling device 601 includes a mainframe chassis coupled to lines 606 and 608 and fixed to an electronics equipment rack, as described above. In one embodiment, cooling device 601 includes an expansion chassis coupled to and movable relative to the mainframe chassis and a plurality of connection ports coupled to the expansion chassis to provide connectivity between the electronics equipment rack and one or more external sources, as described above.

[0060] Figure 7A view 700 of a heterogeneous data center system according to one embodiment is shown. The heterogeneous system includes an electronics rack 701 and an electronics rack 703. The electronics rack 701 includes a server chassis 719 containing IT components, and the electronics rack 703 includes an immersion container 705 containing coolant to immerse the server chassis 702, as described above. A cooling device 706 is located above the electronics rack 701. As described above, the electronics rack 701 includes conduits 704, such as electronics rack liquid conduits, power conduits, or both power conduits and fluid conduits, for connecting to corresponding conduits of the cooling device 706. In at least some embodiments, a cooling device 707 represents one of the cooling devices described above.

[0061] like Figure 7 As shown, the cooling device 707 is placed on the extended frame 710 of the immersion container 705. Figure 7 As shown, the expansion frame 710 includes one or more fans 709 and an expansion section 708. The one or more fans 709 are used to direct steam flow to the cooling device 707, as described above. Figure 7 As shown, the extension frame 710 is built on top of the immersion container 705 and integrated with the fan 709. As... Figure 7 As shown, fan 709 is packaged with an expandable portion 708 extending outside the rack 703. In at least some embodiments, expansion frame 710 represents at least a portion of expansion frame 605.

[0062] like Figure 7 As shown, cooling device 707 includes a cooler 717 on a collector 717 and a mainframe 716 containing multiple lines of tubing fixed to an expansion frame 710. Expansion frame 720 is coupled to mainframe 716. Expansion frame 720 is configured to move relative to mainframe 716, as described above. One or more connection ports (such as Internet Data Center (IDC) cooling source ports 712, 713, 714, and 715) are coupled to the expansion frame of the electronics equipment rack to provide fluid connectivity between the electronics equipment rack and one or more external sources, as described above. In at least some embodiments, cooling device 707 represents one of the cooling devices described above.

[0063] like Figure 7 As shown, the cooler 718 and collector 717 are located within the expansion enclosure 720 and extend outside the electronics rack 703. (As...) Figure 8 As shown, the cooler and collector located within the expansion enclosure of the cooling device 706 extend to connect to the expansion enclosure 720 of the cooling device 706, thereby forming a receiving area (space) 721 in the aisle. Figure 8As shown, the expandable portion 708 extends outside the rack containing the immersion container 705 to facilitate vapor flow to the cooler 718 of the cooling device 707. In at least some embodiments, the connection ports of the cooling device 707 are movable relative to multiple lines within the main unit chassis 716 located at a fixed position on the electronics equipment rack 703. In at least some embodiments, the IDC system is simplified to only space 721 and cooling source ports, such as cooling source ports 712, 713, 714, and 715. Figure 8 The IDC system shown can be advantageously used to deploy different types of IT systems such as IT racks and immersion containers.

[0064] Figure 8 A view 800 of a heterogeneous data center (IDC) system according to one embodiment is shown. The heterogeneous system includes electronic equipment racks 801 and 802. Electronic equipment rack 801 includes server chassis containing IT components, and electronic equipment rack 802 includes an immersion container 815 containing coolant to immerse the server chassis, as described above. A cooling device 803 is located above the electronic equipment rack 801, which includes piping 813, as described above. Figure 8 As shown, the cooling device 804 is located on the extended frame 809 of the immersion container 815. Figure 8 As shown, the expansion frame 809 includes an expandable portion 805 that includes one or more fans for extending outside the rack 802 and directing a steam flow 808 to the cooling device 804. In at least some embodiments, the expansion frame 809 represents at least a portion of one of the aforementioned expansion frames.

[0065] like Figure 9 As shown, cooling device 804 is fixed to extension frame 809. In at least some embodiments, cooling device 804 represents cooling device 907. Figure 10 As shown, an extended enclosure, including the coolers and connectors of each of cooling devices 803 and 804, extends to connect with each other, thereby forming a housing area 806. Figure 10 As shown, the containment area 806 includes different types of airflows, such as airflow 807 moving from rack 801 toward collectors and coolers 811 of cooling device 803, and vapor flow 808 moving by fans of expandable section 805 toward coolers and collectors of cooling device 804 to condense into liquid 812. The system provides different types of gases in the containment area within the heterogeneous cluster. The coolers of the cooling device are advantageously used for cooling different types of airflows, vapors, or both. The design can be flexibly built and developed with variations in the cooling device to configure different types of heterogeneous clusters.

[0066] The embodiments of cooling systems and apparatus described herein provide various configurations for IT clusters and servers. The embodiments of cooling systems and apparatus described herein can be advantageously integrated with different fluid systems. The embodiments of cooling systems and apparatus described herein can be used to design different heterogeneous clusters, as described above. The embodiments of cooling systems and apparatus described herein provide hardware infrastructure capabilities, quality of service, and availability while reducing costs. In the long term, the robust system architecture, control, and operation described herein are beneficial to service providers in multiple ways. The embodiments of cooling systems and apparatus described herein provide highly resilient and flexible configurations to adapt to dynamic changes in software, application, and business needs, while simultaneously reducing costs.

[0067] ​ This is a block diagram illustrating an electronics rack 900 according to one embodiment. The electronics rack 900 can represent any electronics rack described throughout this disclosure. According to one embodiment, the electronics rack 900 includes, but is not limited to, a heat exchanger 911, a rack management unit (RMU) 902, and one or more server chassis 903A-903E (collectively referred to as server chassis 903). The server chassis 903 can be inserted into a server slot array (e.g., a standard rack) from either the front end 904 or the rear end 905 of the electronics rack 900. Note that although five server chassis 903A-903E are shown herein, more or fewer server chassis may be housed within the electronics rack 900. Also note that the specific locations of the heat exchanger 911, RMU 902, and / or server chassis 903 are shown for illustrative purposes only; other arrangements or configurations of the heat exchanger 911, RMU 902, and / or server chassis 903 may also be implemented. In one embodiment, the electronics rack 900 may be open to the environment or partially contained within a rack container, provided that the cooling fan can generate airflow from front to rear. In at least some embodiments, the cooling device described herein is designed to be integrated or directly encapsulated on top of the rack. In at least some embodiments, external liquid (fluid) supply / return lines 931-932 are connected to the cooling device.

[0068] Additionally, for at least some server chassis 903, optional fan modules (not shown) are associated with the server chassis. Each fan module includes one or more cooling fans. The fan modules may be mounted at the rear end of the server chassis 903 or on an electronics rack to generate airflow that exits from the front end 904, passes through the air space of the server chassis 903, and is exhausted at the rear end 905 of the electronics rack 900.

[0069] In at least some embodiments, a cooling device (not shown) is coupled to an electronics equipment rack 900, as described in further detail below. In one embodiment, a heat exchanger 911 may be a liquid-to-liquid heat exchanger. The heat exchanger 911 includes a first loop having an inlet and an outlet, the first loop having a first pair of liquid (fluid) connectors coupled to external liquid (fluid) supply / return lines 931-932 to form a primary loop. The connectors coupled to the external liquid supply / return lines 931-932 may be disposed on or mounted on the rear end 905 of the electronics equipment rack 900. The liquid supply / return lines 931-932, also referred to as room liquid supply / return lines, may be coupled to an external cooling system. In one embodiment, the heat exchanger 911 is used to cool air / vapor using a coolant received from an external source.

[0070] Additionally, heat exchanger 911 further includes a second loop with two ports, having a second pair of liquid connectors coupled to rack manifold 925 to form a secondary loop. The secondary loop may include a supply manifold (also referred to as a rack liquid supply line or rack supply manifold) for supplying coolant to server chassis 903 and a return manifold (also referred to as a rack liquid return line or rack return manifold) for returning warm liquid to heat exchanger 911. Note that heat exchanger 911 can be any kind of commercially available or custom-made heat exchanger. Therefore, details of heat exchanger 911 will not be described herein.

[0071] Each server chassis 903 may include one or more information technology (IT) components (e.g., electronic devices such as processors, memory, and / or storage devices). In one embodiment, in at least some of the server chassis 903, the electronic devices may be attached to a cold plate. The cold plate includes liquid distribution channels for receiving coolant from rack liquid supply lines of a rack manifold 925. The coolant exchanges heat with the electronic devices attached thereto. The coolant carrying the exchanged heat returns to the rack liquid return line of the rack manifold 925 and then to the heat exchanger 911.

[0072] In another embodiment, some of the server chassis 903 may include immersion tanks containing immersion coolant. The electronic equipment of (multiple) corresponding servers is at least partially immersed in the immersion coolant. The immersion coolant may be a dielectric cooling fluid that circulates between the immersion tank and heat exchanger 911. The coolant may be a single-phase coolant or a two-phase coolant (also known as a phase change coolant). When the temperature of the coolant exceeds a predetermined temperature threshold (e.g., the boiling point of the coolant), the two-phase coolant evaporates from a liquid form into a vapor form. The vapor flows upstream from the corresponding server chassis to the heat exchanger 911 via a vapor line. The heat exchanger 911 may include a condenser for condensing the vapor from its vapor form back into a liquid form, wherein the coolant is then supplied back to the server chassis.

[0073] Note that some server chassis 903 can be configured with single-phase liquid cooling, while others can be configured with two-phase liquid cooling. Even within a single server chassis, some IT components can be configured with single-phase liquid cooling, while others may be configured with two-phase liquid cooling. Rack manifold 925 may include a first rack manifold for single-phase cooling and a second rack manifold for two-phase cooling, for coupling to the same or different server chassis for different types of cooling. Some server chassis 903 can be configured with conventional liquid and gas cooling, while others can be configured with immersion cooling.

[0074] Some IT components can perform data processing tasks. These IT components may include software that is installed on a machine-readable medium such as a storage device, loaded into memory, and executed by one or more processors to perform the data processing tasks. Server chassis 903 may include a host server (referred to as a host node) coupled to one or more compute servers (also called compute nodes). The host server (having one or more central processing units or CPUs) typically interfaces with clients via a network (e.g., the Internet) to receive requests for specific services such as storage services (e.g., cloud-based storage services such as backup and / or recovery), and to execute applications to perform certain operations (e.g., image processing, deep data learning algorithms, or modeling as part of a software-as-a-service (SaaS) platform). In response to requests, the host server assigns tasks to one or more compute nodes or compute servers (having one or more graphics / general-purpose processing units or GPUs) managed by the host server. The compute servers perform the actual tasks, which can generate heat during operation.

[0075] In at least some embodiments, the electronics rack 900 further includes an RMU 902 configured to provide and manage power supplied to the server 903 and the heat exchanger 911. The RMU 902 may be coupled to a power supply unit (not shown) to manage the power consumption of the power supply unit. The power supply unit may include circuitry (e.g., an AC-to-DC or DC-to-DC power converter, battery, transformer, or regulator, etc.) for providing power to at least some of the remaining components of the electronics rack 900.

[0076] In one embodiment, the RMU 902 includes an optimization module 921 and a rack management controller (RMC) 922. The RMC 922 may include a monitor for monitoring the operational status of various components within the electronics rack 900, such as server chassis 903, heat exchanger 911, and computing nodes on fan modules. In at least some embodiments, the monitor receives operational data from various sensors representing the operating environment of the electronics rack 900. For example, the monitor may receive operational data representing processor, coolant, and airflow temperatures, which may be captured and collected via various temperature sensors. The monitor may also receive data representing fan power and pump power generated by one or more fan modules and liquid pumps, which may be proportional to their respective speeds. This operational data is referred to as real-time operational data. Note that the monitor may be implemented as a separate module within the RMU 902.

[0077] Based on the operational data, the optimization module 921 performs optimization using a predetermined optimization function or model to obtain a set of optimal fan speeds for the fan module and optimal pump speeds for the liquid pump, minimizing the total power consumption of the liquid pump and fan module while ensuring that the operational data associated with the cooling fans of the liquid pump and fan module are within their respective design specifications. Once the optimal pump speed and optimal fan speed are determined, the RMC 922 configures the cooling fans of the liquid pump and fan module based on these optimal speeds.

[0078] ​ This is a block diagram illustrating a top view of at least a portion of a data center system 1000 according to one embodiment. (See diagram for example.) ​ As shown, data center system 1000 includes one or more rows of electronic equipment racks 1001-1002 for information technology (IT) components, devices, or instruments, such as computer servers or computing nodes that provide data services to various clients via a network (e.g., the Internet). In at least some embodiments, cooling devices (not shown) are placed on one or more rows of electronic equipment racks 1001-1002, as described above. In at least some embodiments, data center system 1000 includes at least a portion of data center system 310.

[0079] In this embodiment, each row comprises an array of electronic equipment racks, such as electronic equipment racks 1010A-1010N. However, more or fewer rows of electronic equipment racks may be implemented. Typically, rows 1001-1002 are aligned in parallel, with their front ends facing each other and their rear ends facing away from each other, thus forming an aisle 1003 between them to allow personnel to walk through. However, other configurations or arrangements may also be applied. For example, two rows of electronic equipment racks may be back-to-back, facing away from each other, without forming an aisle between them, while their front ends face away from each other. The rear ends of the electronic equipment racks may be coupled to an interior coolant manifold.

[0080] In one embodiment, each electronics rack (e.g., electronics racks 1010A-1010N) includes a housing for accommodating multiple IT components arranged in a stacked manner that operate therein. The electronics rack may include a coolant manifold, multiple server slots (e.g., standard racks or chassis configured with the same or similar form factors), and multiple server enclosures (also referred to as server blades or server racks) capable of being inserted into and removed from the server slots. Each server enclosure represents a compute node having IT components (e.g., one or more processors, memory, and / or storage devices), wherein the compute node may include one or more servers running therein. Some IT components may be configured with conventional liquid / air cooling, while others may be configured with immersion cooling. Note that the cooling system 1020 may be coupled to multiple data center systems, such as data center system 1000.

[0081] In one embodiment, the cooling system 1020 includes an external liquid loop connected to a cooling tower or dry cooler outside the building / enclosure. The cooling system 1020 may include, but is not limited to, evaporative cooling, free air cooling, mass heat suppression, and waste heat recovery designs. The cooling system 1020 may include or be coupled to a coolant source that provides coolant.

[0082] In one embodiment, a coolant manifold located at the rear of each electronic device rack is coupled to a liquid supply line 932 (also referred to as an indoor supply manifold) to receive coolant from the cooling system 1020. Liquid supply / return lines 931-932, referred to as data center or indoor liquid supply / return lines (e.g., global liquid supply / return lines), supply coolant to all electronic device racks in rows 1001-1002. Liquid supply lines 932 and liquid return lines 931 are coupled to a heat exchanger within each electronic device rack, forming a primary loop. The secondary loop of the heat exchanger is coupled to each server chassis within the electronic device rack to deliver coolant to the cooling equipment for the IT components therein.

[0083] In one embodiment, the data center system 1000 further includes an airflow delivery system 1035 for generating airflow to pass through the air space of the server chassis of the electronic equipment racks to exchange heat generated by the computing nodes (e.g., servers) due to their operation, and to discharge the heat-exchanged airflow to the external environment or a cooling system (e.g., an air-to-liquid heat exchanger) to reduce the airflow temperature. For example, the air supply system 1035 generates a cool / cold airflow to circulate from aisle 1003 through electronic equipment racks 1010A-1010N, thereby removing the exchanged heat.

[0084] Cool air enters the electronic equipment rack through the front end, while warm / hot air exits from the rear end. The heat-exchanged warm / hot air is then exhausted from the room / building, or cooled using a separate cooling system such as an air-to-liquid heat exchanger. Therefore, the cooling system is a hybrid liquid-air cooling system, in which a portion of the heat generated by the processor is removed via a corresponding cold plate using a coolant, while the remaining heat generated by the processor (or other electronic equipment or processing equipment) is removed by airflow cooling.

[0085] In the foregoing description, embodiments of the present disclosure have been described with reference to specific exemplary embodiments. It will be apparent that various modifications may be made to the present disclosure without departing from the broader spirit and scope set forth in the appended claims. Therefore, the description and drawings should be considered illustrative rather than restrictive.

Claims

1. An apparatus for an electronic equipment rack in a data center, comprising: Multiple pipelines; A main unit chassis, the main unit chassis being coupled to the plurality of pipelines, the main unit chassis being configured to be fixed on the electronic equipment rack; An expansion chassis coupled to the main chassis, the expansion chassis being configured to move relative to the main chassis, wherein the expansion chassis includes: a cooler coupled to a second pair of external ports to provide cooling for the air space below the expansion chassis using a second coolant when the expansion chassis expands from the main chassis; and Multiple connection ports coupled to the expansion chassis to provide connectivity between the electronics rack and one or more external sources, wherein the multiple connection ports are configured to move relative to the multiple lines located at fixed positions on the electronics rack, wherein the multiple connection ports include a second pair of external ports coupled to a second cooling source to receive the second coolant.

2. The apparatus of claim 1, further comprising: A collector, coupled to the plurality of pipelines, The cooler is coupled to the collector.

3. The apparatus of claim 1, wherein, The multiple pipelines include fluid pipelines, power pipelines, or both fluid pipelines and power pipelines, used to connect to corresponding pipelines of the electronic equipment rack.

4. The apparatus of claim 1, further comprising: A first channel connects the expansion chassis to the main chassis; as well as One or more sliding channels, the one or more sliding channels being coupled to the first channel.

5. The apparatus of claim 1, wherein, The multiple connection ports are connected to the multiple pipelines via flexible connectors.

6. The apparatus of claim 1, wherein, The plurality of connection ports include both fluid connection ports and power connection ports.

7. The apparatus of claim 1, wherein, The electronic device rack is an immersion cooling container, and the device further includes: An extension frame, coupled to the immersion cooling vessel, is used to direct steam flow to the cooler; and One or more fans, the one or more fans being coupled to the extension frame.

8. The apparatus of claim 1, wherein, The multiple pipelines include single-phase fluid pipelines, two-phase fluid pipelines, or both single-phase fluid pipelines and two-phase fluid pipelines.

9. An electronic equipment rack for a data center, comprising: Server racks; A chassis coupled to the server rack, the chassis having a first pair of liquid lines therein, the first pair of liquid lines including: a first liquid supply line for distributing first coolant to the one or more electronic device racks when the chassis is positioned on top of the one or more electronic device racks, and a first liquid return line for receiving the first coolant from the one or more electronic device racks; and An expansion chassis coupled to the main chassis, the expansion chassis being configured to move relative to the main chassis, the expansion chassis including a first pair of external ports respectively coupled to the first pair of liquid lines, wherein the first pair of external ports are capable of being coupled to a first external cooling source to receive and return the first coolant, wherein the expansion chassis further includes: A second pair of external ports, coupled to a second cooling source to receive a second coolant; and A cooler, coupled to the second pair of external ports, to provide cooling for the air space beneath the expansion chassis using the second coolant when the expansion chassis expands from the main chassis. The expansion chassis is capable of horizontally expanding from the main chassis beyond the physical dimensions of the electronic equipment rack, while the main chassis and the first pair of liquid lines are fixedly mounted on top of the one or more electronic equipment racks or immersion containers.

10. The electronic device rack as claimed in claim 9, wherein, The main chassis and the expansion chassis are designed as integrated units that can be mounted on top of the one or more electronic device racks.

11. The electronic device rack as claimed in claim 9, wherein, The expansion chassis further includes: A collector for collecting a portion of the first coolant that has been condensed from the vapor by the cooler.

12. The electronic device rack of claim 9, further designed as: an immersion container, in, The data center further includes: An extension frame, coupled to the extension chassis, is used to direct the steam flow to the cooler; and One or more fans, the one or more fans being coupled to the extension frame.

13. The electronic device rack of claim 9, further comprising: A first channel is used to connect the expansion chassis to the main chassis; as well as One or more sliding channels coupled to the first channel to enable the expansion chassis to slide into and out of the main chassis.

14. The electronic device rack of claim 9, further comprising: The second pair of liquid lines is disposed within the main unit chassis, wherein the first pair of liquid lines is configured to dispense single-phase coolant, and the second pair of liquid lines is configured to dispense two-phase coolant.

15. The electronic device rack of claim 9, further comprising: Multiple power lines are coupled to at least one of the main unit chassis or the expansion chassis; as well as Multiple power connection ports are coupled to the multiple power lines.

16. A data center system, comprising: The first cluster of electronic equipment racks; A second cluster of electronic equipment racks, the second cluster of electronic equipment racks being positioned parallel to and spaced apart from the first cluster to form an aisle between the two; A first cooling device is disposed on top of the first cluster of the electronic equipment rack and across the first cluster of the electronic equipment rack; as well as A second cooling device is disposed on top of and across the second cluster of the electronic equipment rack, wherein each of the first and second cooling devices includes: A mainframe chassis having a first pair of liquid lines installed therein, the first pair of liquid lines including a first liquid supply line for distributing a first coolant to a corresponding electronic device rack and a first liquid return line for receiving the first coolant from the corresponding electronic device rack, and An expansion chassis coupled to the main chassis, the expansion chassis being configured to move relative to the main chassis, the expansion chassis including a first pair of external ports respectively coupled to the first pair of liquid lines, wherein the first pair of external ports are capable of being coupled to a first external cooling source to receive and return the first coolant, wherein the expansion chassis further includes: A second pair of external ports, the second pair of external ports being coupled to a second cooling source to receive a second coolant; and A cooler, coupled to the second pair of external ports, to provide cooling for the air space beneath the expansion chassis using the second coolant when the expansion chassis expands from the main chassis. The expansion chassis is capable of horizontally expanding from the main chassis toward the center of the aisle to form a housing area, while the main chassis and the first pair of liquid lines are fixedly mounted on top of the corresponding electronic equipment rack.

17. The data center system of claim 16, wherein, The main chassis and the expansion chassis are prefabricated as integrated units, which can be mounted on top of rows of electronic equipment racks.

18. The data center system of claim 16, wherein, The expansion chassis further includes: A collector for collecting a portion of the first coolant that has been condensed from the vapor by the cooler.

19. The data center system of claim 16, wherein, At least one of the electronic equipment racks is an immersion cooling container, and the data center system further includes: An extension frame, coupled to the immersion cooling vessel, is used to direct the vapor flow to the cooler; and One or more fans, the one or more fans being coupled to the extension frame.

20. The data center system of claim 16, wherein, Each of the first cooling device and the second cooling device includes: A first channel, the first channel being used to connect the expansion chassis to the main chassis; and One or more sliding channels coupled to the first channel to enable the expansion chassis to slide into and out of the main chassis.

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