An air dryer with a semiconductor cooling structure

Abstract

The present invention discloses an air dryer with a semiconductor cooling structure, which relates to the technical field of air dryers. The present invention includes a temperature control box, in which a connecting pipe is installed. The two ends of the connecting pipe are respectively connected with an air inlet pipe and an air outlet pipe, and a fan is installed in the connecting pipe. By turning on the fan in the present invention, the semiconductor is placed on the conveyor, and the conveyor transports the semiconductor into the cooling box. The hot air generated by the semiconductor is blown through the reflux area, the air inlet holes, and the fan to the desiccant storage box for drying. Then, the cooler cools the heat absorption rack through the heat absorption sheet, and then the air flows through the heat absorption rack in the connecting pipe for cooling, and then is dried again by the desiccant storage box. Then, the dried cold air is blown through the air outlet pipe and the air outlet holes to the hot air suction channel in the air inlet area. The dried cold air flows in the hot air suction channel to drive the heat of the semiconductor, and blows to the reflux area, thereby facilitating the circulation to cool the semiconductor. At the same time, the gas circulates, avoiding the problem of inhaling a large amount of external air and increasing the dust on the semiconductor.

Description

Technical Field

[0001] The present invention belongs to the field of air dryers, and more specifically, relates to an air dryer with a semiconductor cooling structure. Background Art

[0002] Semiconductors are used in fields such as integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, and high-power power conversion. For example, diodes are devices made of semiconductors. A semiconductor refers to a material whose electrical conductivity at room temperature is between that of a conductor and an insulator. A semiconductor is a material whose conductivity can be controlled within a range from an insulator to a conductor. An air dryer is a mechanical device that removes moisture in materials, generally referring to water or other volatile liquid components, to obtain solid materials with a specified moisture content. There are two main categories of air dryers: adsorption type and refrigeration type. Adsorption type compressed air dryers use the principle of pressure swing adsorption. When wet air passes through the adsorbent, moisture is adsorbed to obtain dry air. Refrigeration type compressed air dryers use the principle of cooling air and reducing air temperature to separate moisture in the wet air from the air through condensation to obtain dry air. When a semiconductor cools, it is easy to condense and produce water droplets, which can easily cause damage to the semiconductor.

[0003] In view of this, the present invention is specifically proposed. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to overcome the deficiencies of the prior art and provide an air dryer with a semiconductor cooling structure.

[0005] To solve the above technical problems, the basic concept of the technical solution adopted by the present invention is:

[0006] An air dryer with a semiconductor cooling structure includes a temperature control box. A connecting pipe is installed in the temperature control box. The two ends of the connecting pipe are respectively connected to an air inlet pipe and an air outlet pipe. A fan is installed in the connecting pipe. A heat absorption rack is slidably fitted in the connecting pipe. A desiccant storage box is installed on the heat absorption rack. A cooling mechanism for cooperating with the heat absorption rack is installed in the temperature control box.

[0007] A cooling box is installed on the temperature control box. A partition board is provided in the cooling box. The upper part of the cooling box is divided into an air inlet area and a return area by the partition board. A plurality of flow guiding heat absorption plates are provided in the middle of the cooling box. An air suction hot air duct is formed between adjacent two flow guiding heat absorption plates. The air suction hot air duct is communicated with the air inlet area and the return area. The air inlet pipe is communicated with the air inlet area, and the air outlet pipe is communicated with the return area.

[0008] Optionally, openings are provided on both opposite sides of the cooling box. Rubber door curtains are provided in the openings. A conveyor is provided on the temperature control box, and the middle part of the conveyor is located in the two openings. There is a spacing between the conveyor and the flow guiding heat absorption plates.

[0009] Optionally, a plurality of intake holes are arrayed along the height direction on the upper side of the intake pipe, a plurality of outlet holes are arrayed along the height direction on the upper side of the outlet pipe, two through holes are provided in the upper part of the cooling box, the intake area is communicated with the outlet holes through one through hole, and the reflux area is communicated with the outlet holes through the other through hole.

[0010] Optionally, the temperature reduction mechanism includes a connecting cylinder connected to the inner wall of the temperature control box, a refrigerator installed in the connecting cylinder, and a heat absorption fin installed in the temperature control box, and one end of the refrigerator is attached to the heat absorption fin.

[0011] Optionally, a notch is provided on the bottom surface of the connecting pipe, and the heat absorption fin extends into the notch and fits with the heat absorption frame.

[0012] Optionally, an installation frame is provided in the connecting cylinder, the middle part of the refrigerator is fixed in the installation frame, and there is a distance between the outer side of the refrigerator and the inner wall of the connecting cylinder.

[0013] Optionally, a through hole penetrating the connecting pipe is provided on one side of the temperature control box, and the heat absorption frame is slidably fitted in the through hole. A handle is provided on one side of the sealing plate, and the handle is located in the through hole.

[0014] Optionally, the heat absorption frame includes a plurality of heat conduction plates and sealing plates respectively fixed at both ends of the plurality of heat conduction plates. The desiccant storage box is placed on the plurality of heat conduction plates.

[0015] After adopting the above technical solutions, the present invention has the following beneficial effects compared with the prior art. Of course, any product implementing the present invention does not necessarily need to achieve all the advantages described below at the same time:

[0016] By turning on the fan, placing the semiconductor on the conveyor, the conveyor transports the semiconductor into the cooling box. The hot air generated by the semiconductor is blown to the desiccant storage box through the reflux area, intake holes, and fan for drying. Then, the refrigerator cools down the heat absorption frame through the heat absorption fin, and then the air flows through the heat absorption frame in the connecting pipe for cooling. After that, it is dried again by the desiccant storage box. Then, the dried cold air is blown through the outlet pipe and outlet holes to the hot air intake duct in the intake area. The dried cold air circulates in the hot air intake duct to drive the heat of the semiconductor, and is blown to the reflux area to facilitate the circulation for cooling the semiconductor. At the same time, the gas circulates, avoiding the problem of inhaling a large amount of external air and increasing the dust on the semiconductor. By setting a distance between the outer side of the refrigerator and the inner wall of the connecting cylinder, it is convenient to prevent the refrigerator from contacting the inner wall of the connecting cylinder. By setting the heat absorption frame to be slidably fitted in the through hole and providing a handle on one side of the sealing plate, it is convenient to pull out the heat absorption frame through the handle to replace the desiccant in the desiccant storage box.

[0017] The following further describes in detail the specific implementation manners of the present invention with reference to the accompanying drawings. Description of the Drawings

[0018] The accompanying drawings in the following description are only some embodiments. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts. In the drawings:

[0019] Figure 1 It is a schematic three-dimensional structure diagram of an embodiment of the present invention;

[0020] Figure 2 It is a cross-sectional view of an embodiment of the present invention;

[0021] Figure 3 It is a cross-sectional view of the connecting pipe of an embodiment of the present invention;

[0022] Figure 4 It is a cross-sectional view of the cooling box of an embodiment of the present invention;

[0023] In the drawings, the list of components represented by each reference numeral is as follows:

[0024] Temperature control box 1, connecting pipe 2, intake pipe 3, outlet pipe 4, heat absorption rack 5, heat conduction plate 501, sealing plate 502, desiccant storage box 6, intake hole 7, outlet hole 8, fan 9, connecting cylinder 10, refrigerator 11, heat absorption fin 12, notch 13, through hole 14, cooling box 15, partition plate 16, intake area 17, return area 18, diversion heat absorption plate 19, hot air suction duct 20, opening 21, rubber door curtain 22, installation frame 23, handle 24, conveyor 26.

[0025] It should be noted that these drawings and textual descriptions are not intended to limit the scope of the concept of the present invention in any way, but to illustrate the concept of the present invention to those skilled in the art by referring to specific embodiments. Detailed implementation manners

[0026] Now, the present invention will be further described in detail with reference to the accompanying drawings.

[0027] Please refer to Figures 1-4 As shown, in this embodiment, a ventilation device is provided, including a temperature control box 1. A connecting pipe 2 is installed in the temperature control box 1. The two ends of the connecting pipe 2 are respectively connected with an intake pipe 3 and an outlet pipe 4. A fan 9 is installed in the connecting pipe 2. A heat absorption rack 5 is slidably fitted in the connecting pipe 2. A desiccant storage box 6 is installed on the heat absorption rack 5. A temperature reduction mechanism cooperating with the heat absorption rack 5 is installed in the temperature control box 1;

[0028] A cooling box 15 is installed on the temperature control box 1. A partition plate 16 is arranged in the cooling box 15. The partition plate 16 divides the upper part of the cooling box 15 into an air inlet area 17 and a return air area 18. A plurality of diversion heat absorption plates 19 are arranged in the middle of the cooling box 15. An air suction hot air duct 20 is formed between two adjacent diversion heat absorption plates 19. The air suction hot air duct 20 is communicated with the air inlet area 17 and the return air area 18. The air inlet pipe 3 is communicated with the air inlet area 17, and the air outlet pipe 4 is communicated with the return air area 18.

[0029] By turning on the fan 9, the semiconductor is placed on the conveyor 26. The conveyor 26 conveys the semiconductor into the cooling box 15. The hot air generated by the semiconductor is blown to the desiccant storage box 6 through the return air area 18, the air inlet hole 7 and the fan 9 for drying. Then, the cooler 11 cools the heat absorption rack 5 through the heat absorption fin 12, and then circulates and cools in the heat absorption rack 5 in the connecting pipe 2. Then, after being dried again by the desiccant storage box 6, the dried cold air is blown into the air suction hot air duct 20 in the air inlet area 17 through the air outlet pipe 4 and the air outlet hole 8. The dried cold air circulates in the air suction hot air duct 20 to drive the heat of the semiconductor, and is blown to the return air area 18, thereby facilitating the circulation to cool the semiconductor. At the same time, the gas circulates to avoid the problem of inhaling a large amount of external air and increasing the dust on the semiconductor.

[0030] In this embodiment, openings 21 are arranged on both opposite sides of the cooling box 15. Rubber door curtains 22 are arranged in the openings 21. The rubber door curtains 22 are connected to the inner wall of the upper part of the openings 21, which is convenient for the rubber door curtains 22 to seal the openings 21 by their own flexible reset, so as to reduce the time of communication between the cooling box 15 and the outside. A conveyor 26 is arranged on the temperature control box 1, and the middle part of the conveyor 26 is located in the two openings 21. There is a distance between the conveyor 26 and the diversion heat absorption plates 19, which is convenient for conveying the semiconductor to be cooled into the cooling box 15 through the conveyor 26 for cooling.

[0031] In this embodiment, a plurality of air inlet holes 7 are arranged in an array along the height direction on the upper side of the air inlet pipe 3, and a plurality of air outlet holes 8 are arranged in an array along the height direction on the upper side of the air outlet pipe 4. Two through holes are arranged in the upper part of the cooling box 15. The air inlet area 17 is communicated with the air outlet hole 8 through one through hole, and the return air area 18 is communicated with the air outlet hole 8 through the other through hole, which is convenient for gas circulation and avoids the problem of inhaling a large amount of external air and increasing the dust on the semiconductor.

[0032] The temperature reduction mechanism of this embodiment includes a connecting cylinder 10 connected to the inner wall of the temperature control box 1, a refrigerator 11 installed in the connecting cylinder 10, and a heat absorption fin 12 installed in the temperature control box 1. One end of the refrigerator 11 is in contact with the heat absorption fin 12. There is a notch 13 on the bottom surface of the connecting pipe 2, and the heat absorption fin 12 extends into the notch 13 and is in contact with the heat absorption frame 5, which is convenient for the refrigerator 11 to cool the heat absorption frame 5 through the heat absorption fin 12, and then is convenient for cooling the air flowing in the heat absorption frame 5. There is an installation frame 23 in the connecting cylinder 10. The middle part of the refrigerator 11 is fixed in the installation frame 23. The middle part of the refrigerator 11 is fixed in the installation frame 23. There is a space between the outer side of the refrigerator 11 and the inner wall of the connecting cylinder 10, which is convenient for preventing the refrigerator 11 from contacting the inner wall of the connecting cylinder 10.

[0033] On one side of the temperature control box 1 of this embodiment, there is a through hole 14 penetrating through the connecting pipe 2, and the heat absorption frame 5 is slidably fitted in the through hole 14. There is a handle 24 on one side of the sealing plate 502, which is convenient for pulling the heat absorption frame 5 through the handle 24, and is convenient for pulling out the heat absorption frame 5 to replace the desiccant in the desiccant storage box 6. The handle 24 is located in the through hole 14. The heat absorption frame 5 includes a plurality of heat conduction plates 501 and sealing plates 502 respectively fixed at both ends of the plurality of heat conduction plates 501. The desiccant storage box 6 is placed on the plurality of heat conduction plates 501, which is convenient for pulling out or putting in the heat absorption frame 5 through the handle. The desiccant storage box 6 is placed on the plurality of heat conduction plates 501, which is convenient for the air blown by the fan 9 to dry the desiccant storage box 6. Then, the refrigerator 11 cools the heat absorption frame 5 through the heat absorption fin 12, and then circulates and cools in the heat absorption frame 5 in the connecting pipe 2, and then is dried again by the desiccant storage box 6.

[0034] Working principle: Turn on the fan 9, place the semiconductor on the conveyor 26, and the conveyor 26 conveys the semiconductor into the cooling box 15. The hot air generated by the semiconductor passes through the reflux area 18, the air inlet hole 7, and the fan 9 and blows to the desiccant storage box 6 for drying. Then, the refrigerator 11 cools the heat absorption frame 5 through the heat absorption fin 12, and then circulates and cools in the heat absorption frame 5 in the connecting pipe 2, and then is dried again by the desiccant storage box 6. Then, the dried cold air blows to the hot air suction channel 20 in the air inlet area 17 through the air outlet pipe 4 and the air outlet hole 8. The dried cold air circulates in the hot air suction channel 20 to drive the heat of the semiconductor, and blows to the reflux area 18, which is convenient for circulating to cool the semiconductor. At the same time, the gas circulates to avoid the problem of inhaling a large amount of external air and increasing the dust on the semiconductor. By setting a space between the outer side of the refrigerator 11 and the inner wall of the connecting cylinder 10, it is convenient for preventing the refrigerator 11 from contacting the inner wall of the connecting cylinder 10. By setting the heat absorption frame 5 to be slidably fitted in the through hole 14 and having a handle 24 on one side of the sealing plate 502, it is convenient for pulling the heat absorption frame 5 through the handle 24 and for pulling out the heat absorption frame 5 to replace the desiccant in the desiccant storage box 6.

[0035] The content not detailed in this specification belongs to the prior art well-known to those skilled in the art.

[0036] The present invention is not limited to the above embodiments. Anyone should know that structural changes made under the inspiration of the present invention, as long as they have the same or similar technical solutions as the present invention, fall within the protection scope of the present invention. The technologies, shapes, and structures not described in detail in the present invention are all well-known technologies.

Claims

1. An air dryer with a semiconductor cooling structure, characterized in that, Comprising: A temperature control box (1), inside which a connecting pipe (2) is installed. Both ends of the connecting pipe (2) are respectively connected to an air inlet pipe (3) and an air outlet pipe (4). A blower (9) is installed inside the connecting pipe (2). A heat absorption rack (5) is slidably fitted inside the connecting pipe (2). A desiccant storage box (6) is installed on the heat absorption rack (5). A temperature reduction mechanism for cooperating with the heat absorption rack (5) is installed inside the temperature control box (1). A cooling box (15) is installed on the temperature control box (1). A partition plate (16) is provided inside the cooling box (15). The partition plate (16) divides the upper part of the cooling box (15) into an air inlet area (17) and a return area (18). A plurality of flow guiding heat absorption plates (19) are provided in the middle of the cooling box (15). An air suction hot air duct (20) is formed between two adjacent flow guiding heat absorption plates (19). The air suction hot air duct (20) is communicated with the air inlet area (17) and the return area (18). The air inlet pipe (3) is communicated with the air inlet area (17), and the air outlet pipe (4) is communicated with the return area (18). Openings (21) are provided on both opposite sides of the cooling box (15). Rubber door curtains (22) are provided inside the openings (21). A conveyor (26) is provided on the temperature control box (1), and the middle part of the conveyor (26) is located inside the two openings (21). There is a spacing between the conveyor (26) and the flow guiding heat absorption plates (19). A plurality of air inlet holes (7) are arrayed along the height direction on the upper side part of the air inlet pipe (3). A plurality of air outlet holes (8) are arrayed along the height direction on the upper side part of the air outlet pipe (4). Two through holes are provided in the upper part of the cooling box (15). The air inlet area (17) is communicated with the air outlet holes (8) through one through hole, and the return area (18) is communicated with the air outlet holes (8) through the other through hole. The temperature reduction mechanism includes a connecting cylinder (10) connected to the inner wall of the temperature control box (1), a refrigerator (11) installed inside the connecting cylinder (10), and a heat absorption sheet (12) installed inside the temperature control box (1). One end of the refrigerator (11) is in contact with the heat absorption sheet (12).

2. The air dryer with a semiconductor cooling structure according to claim 1, wherein, A notch (13) is provided on the bottom surface of the connecting pipe (2), and the heat absorption sheet (12) extends into the notch (13) and is in contact with the heat absorption rack (5).

3. The air dryer with a semiconductor cooling structure according to claim 1, characterized in that, An installation frame (23) is provided inside the connecting cylinder (10), and the middle part of the refrigerator (11) is fixed inside the installation frame (23).

4. The air dryer with a semiconductor cooling structure according to claim 3, characterized in that, The middle part of the refrigerator (11) is fixed inside the installation frame (23), and there is a spacing between the outer side of the refrigerator (11) and the inner wall of the connecting cylinder (10).

5. The air dryer with a semiconductor cooling structure according to claim 1, characterized in that A through hole (14) penetrating the connecting pipe (2) is provided on one side of the temperature control box (1), and the heat absorption rack (5) is slidably fitted inside the through hole (14).

6. The air dryer with a semiconductor cooling structure according to claim 5, wherein A handle (24) is provided on one side of the sealing plate (502), and the handle (24) is located inside the through hole (14).

7. The air dryer with a semiconductor cooling structure according to claim 1, wherein, The heat absorption rack (5) includes a plurality of heat conducting plates (501) and sealing plates (502) respectively fixed at both ends of the plurality of heat conducting plates (501). The desiccant storage box (6) is placed on the plurality of heat conducting plates (501).

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