Method for controlling edge waviness of thin gauge high strength pickled sheet

Abstract

The application relates to the rolling technology field of metal, in particular to a method for controlling the edge wavy shape of a thin-gauge high-strength pickling plate, which comprises the following steps: controlling the first average cooling speed Cr1=90-140 DEG C / s of the pickling plate in a first water cooling section, weakly cooling a preset area of the edge of the pickling plate, so that the pickling plate reaches a first target temperature T M =640-680 DEG C; controlling the air cooling time t a =4-10 s of the pickling plate in a first air cooling section, so that the pickling plate obtains a cooling amount T a ; controlling the second average cooling speed Cr2=60-110 DEG C / s of the pickling plate in a second water cooling section, so that the pickling plate reaches a second target temperature T C =480-580 DEG C; controlling the air cooling time of the pickling plate in a second air cooling section, so that the center temperature of the pickling plate reaches a third target temperature T S =30-60 DEG C; and straightening the pickling plate, and controlling the elongation rate delta of the pickling plate to be 0.4%-1.0%, so that the wavy shape defect of the pickling plate is quantitatively controlled and eliminated, and the finished product quality of the pickling plate is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the rolling technology field of metal, in particular to a method for controlling edge waviness of thin-gauge high-strength pickled plate. BACKGROUND

[0002] The pickled plate is an intermediate product between the cold-rolled product and the hot-rolled product, has a surface quality close to that of the cold-rolled product, and at the same time maintains the mechanical properties of the hot-rolled product, and has a very wide range of applications, and is a typical "green" product. The thin-gauge high-strength pickled plate has high strength, but the strengthening mode is complex. After rolling, the thin-gauge high-strength pickled plate produces obvious double-edge waviness defects, and the shape problem is a key problem that limits the product quality and the yield, and reduces the user experience.

[0003] Since the current plate shape control method covers multiple processing procedures such as the heating furnace, rough rolling, finishing rolling, cooling, and finishing, etc. However, for products of different strength levels and purposes, due to the obvious difference in the processing technology process, the root causes of the plate shape problem are also different, the existing technology is not suitable for thin-gauge high-strength pickled plate, and cannot give a quantitative control method from the qualitative point of view. SUMMARY

[0004] In order to eliminate the edge waviness defects of the thin-gauge high-strength pickled plate, and solve the problem that the waviness defects cannot be quantitatively controlled,

[0005] In a first aspect, the present application provides a method for controlling the edge waviness of a thin-gauge high-strength pickled plate, comprising being applied to a water cooling section and an air cooling section, and the method comprises,

[0006] controlling the first average cooling rate Cr1 of the pickled plate in the first water cooling section to be 90-140℃ / s, weakly cooling the edge preset area of the pickled plate, and making the pickled plate reach a first target temperature T M =640-680℃;

[0007] controlling the air cooling time t a of the pickled plate in the first air cooling section to be 4-10s, so that the pickled plate obtains a temperature drop T a ;

[0008] controlling the second average cooling rate Cr2 of the pickled plate in the second water cooling section to be 60-110℃ / s, so that the pickled plate reaches a second target temperature T C =480-580℃;

[0009] controlling the air cooling time of the pickled plate in the second air cooling section, so that the center temperature of the pickled plate reaches a third target temperature T S =30-60℃;

[0010] The pickling plate is straightened, and the elongation δ of the pickling plate is controlled to be 0.4%-1.0% to eliminate the wavy defects of the pickling plate.

[0011] Further, the controlling the first average cooling rate Cr1 of the pickling plate in the first water cooling section comprises,

[0012] obtaining the inlet temperature T F of the first water cooling section,

[0013] obtaining the first average cooling rate Cr1 by the formula Cr1=(T F -T M ) / t1.

[0014] Further, the weak cooling of the preset area of the edge portion of the pickling plate comprises

[0015] obtaining the temperature distribution curve of the front width direction of the pickling plate;

[0016] based on the temperature distribution curve, obtaining the edge area corresponding to the maximum temperature change rate of the pickling plate to determine the preset area of the edge portion and the starting position of the weak cooling.

[0017] Further, the controlling the air cooling time t a of the pickling plate in the first air cooling section comprises,

[0018] obtaining the distance L a between the outlet position of the first water cooling section and the inlet position of the second water cooling section, and obtaining the conveying speed Vs of the pickling plate;

[0019] obtaining the air cooling time t a by the formula t a =L s / V a .

[0020] Further, the controlling the second average cooling rate Cr2 of the pickling plate in the second water cooling section comprises,

[0021] obtaining the second water cooling time t2 of the second water cooling section,

[0022] obtaining the second average cooling rate Cr2 by the formula Cr2=(T M -T a -T C ) / t2.

[0023] Further, the method further comprises, before the straightening of the pickling plate, checking the temperature of the pickling plate to improve the straightening precision.

[0024] Further, the control of the elongation of the pickling plate comprises,

[0025] When the tension of the tension leveling is 0, the wave height H and the wave distance L of the pickling plate are obtained;

[0026] Based on the wave height H and the wave distance L, the lowest elongation A W for eliminating the wave shape is calculated by formula A 2 = π 2 H 2 / 4L W ;

[0027] The elastic recovery elongation compensation A R and the tension leveling unit compensation elongation A C are obtained;

[0028] The tension leveling elongation A is calculated by formula A = A R + A C + A W .

[0029] In a second aspect, the application provides a device for controlling the edge wave shape of a thin-gauge high-strength pickling plate, comprising,

[0030] A first water cooling module controls the first average cooling rate Cr1 = 90-140℃ / s of the pickling plate in the first water cooling section, weakly cools the preset area of the edge of the pickling plate, and makes the pickling plate reach the first target temperature T M = 640-680℃.

[0031] A first air cooling module controls the air cooling time t a = 4-10s of the pickling plate in the first air cooling section, and makes the pickling plate obtain the temperature drop T a .

[0032] A second water cooling module controls the second average cooling rate Cr2 = 60-110℃ / s of the pickling plate in the second water cooling section, and makes the pickling plate reach the second target temperature T C = 480-580℃.

[0033] A second air cooling module controls the air cooling time of the pickling plate in the second air cooling section, and makes the center temperature of the pickling plate reach the third target temperature T S = 30-60℃.

[0034] A tension leveling module tension levels the pickling plate, controls the elongation δ = 0.4%-1.0% of the pickling plate, and eliminates the wave shape defect of the pickling plate.

[0035] In a third aspect, the present application provides an electronic device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the program to implement the method steps of any one of the first aspect.

[0036] In a fourth aspect, the present application provides a computer readable storage medium, which stores a computer program, wherein the program is executed by a processor to implement the method steps of any one of the first aspect.

[0037] Advantages

[0038] The present application controls the first average cooling rate Cr1 of the pickling plate in the first water cooling section to be 90-140℃ / s, weakly cools the preset area of the edge of the pickling plate, and makes the pickling plate reach the first target temperature T M =640-680, so as to weakly cool the preset area of the edge of the pickling plate at high temperature, make the hardness of the edge area of the pickling plate higher than the hardness of the middle area, and reduce the occurrence rate of the edge waviness; the present application controls the air cooling time t a of the pickling plate in the first air cooling section to be 4-10s, so as to make the pickling plate obtain the cooling amount T a ; the present application controls the second average cooling rate Cr2 of the pickling plate in the second water cooling section to be 60-110℃ / s, so as to make the pickling plate reach the second target temperature T C =480-580℃; the present application controls the air cooling time of the pickling plate in the second air cooling section, so as to make the center temperature of the pickling plate reach the third target temperature T S =30-60℃; the present application alternately controls the water cooling and the air cooling, controls the cooling area, the cooling temperature and the cooling time of the pickling plate in the process of water cooling and air cooling, eliminates the internal stress of the pickling plate caused by the martensite phase transition due to heating, thereby improving the toughness of the pickling plate material and further reducing the occurrence rate of the edge waviness; finally, the present application controls the elongation δ of the pickling plate to be 0.4%-1.0% by straightening the pickling plate, so as to realize the quantitative elimination of the waviness defects of the pickling plate and improve the product quality. BRIEF DESCRIPTION OF DRAWINGS

[0039] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0040] Figure 1 is a method flowchart provided by the embodiment 1 of the present application;

[0041] Figure 2is a temperature distribution curve of the front part of the acid pickling plate in the width direction in Embodiment 1 of the present application;

[0042] Figure 3 is a temperature distribution curve of the front part of the acid pickling plate in the width direction in Embodiment 2 of the present application;

[0043] Figure 4 is a schematic diagram of the device structure provided in Embodiment 3 of the present application;

[0044] Figure 5 is a schematic diagram of the electronic structure device in Embodiment 4 of the present application. DETAILED DESCRIPTION

[0045] The technical solutions in the embodiments of the present application will be described clearly and completely below in combination with the drawings in the embodiments of the present application.

[0046] Embodiment 1

[0047] Embodiment 1 provides a method for controlling the edge waviness of a thin-gauge high-strength acid pickling plate, and the accompanying drawings are used to Figure 1 , which comprises the following steps:

[0048] S101, controlling the first average cooling rate Cr1 of the acid pickling plate in the first water cooling section to be 90-140℃ / s, weakly cooling the edge pre-set region of the acid pickling plate, and making the acid pickling plate reach the first target temperature T M =640-680℃;

[0049] S102, controlling the air cooling time t a =4-10s of the acid pickling plate in the first air cooling section, and making the acid pickling plate obtain the temperature drop T a ;

[0050] S103, controlling the second average cooling rate Cr2 of the acid pickling plate in the second water cooling section to be 60-110℃ / s, and making the acid pickling plate reach the second target temperature T C =480-580℃;

[0051] S104, controlling the air cooling time of the acid pickling plate in the second air cooling section, and making the center temperature of the acid pickling plate reach the third target temperature T S =30-60℃;

[0052] S105, stretching and straightening the acid pickling plate, controlling the elongation δ of the acid pickling plate to be 0.4%-1.0%, and eliminating the waviness defect of the acid pickling plate.

[0053] Embodiment 1 selects a high-strength acid pickling plate with a thickness of 4mm and a strength level of 600MPa. In combination with the production process, T F is set to 860℃, T M is set to 650℃, and TC The transmission speed V of the pickling plate is set to 500℃ s 6.3m / s.

[0054] S101 is performed to control the first average cooling rate Cr1 of the pickling plate in the first water cooling section to be 90-140℃ / s, to weakly cool the preset area of the edge of the pickling plate, and to make the pickling plate reach the first target temperature T M =640-680℃;

[0055] The first stage water cooling length L1 is calculated by the post-rolling cooling control system to be 12.54m, and the first stage water cooling time t1=L1 / V s =2s. The first stage average cooling rate is calculated by the formula Cr1=(T F -T M ) / t1 to be 105℃ / s, and the first stage average cooling rate of the first water cooling section is set to 105℃ / s;

[0056] The preset area of the edge of the pickling plate is weakly cooled, and the transverse temperature of the pickling plate at the finishing rolling outlet is shown in the attached Figure 2 The data fitting is performed on the curve, and it is determined that the temperature change rate of the pickling plate is the largest when the distance from the edge of the pickling plate is about 140mm, and the weak cooling width of the edge is determined to be 140mm. The edge weak cooling includes but is not limited to the edge shielding, edge header blockage, edge header water jet diameter adjustment and the like, and the edge shielding is adopted in the first water cooling section.

[0057] S102 is performed to control the air cooling time t a =4-10s of the pickling plate in the first air cooling section, so that the pickling plate obtains the temperature drop T a ;

[0058] The duration length L a of the first air cooling section is 50.5m, and the air cooling time is calculated by the formula t a =L a / V s to be 8s. The air cooling temperature drop T a is calculated by the Stefan-Boltzmann radiation formula to be 26℃.

[0059] S103 is performed to control the second average cooling rate Cr2 of the pickling plate in the second water cooling section to be 60-110℃ / s, so that the pickling plate reaches the second target temperature T C =480-580℃;

[0060] The length L3 of the second water cooling section is calculated by the post-rolling cooling control system to be 9.12m, and the second water cooling time t2=L3 / V s =1.45s. The second average cooling rate Cr2 is calculated by the formula Cr2=(TM -Ta-T C The second average cooling rate Cr2 is 85.5 °C / s, so the second average cooling rate Cr2 of the second water cooling section is set to 85.5 °C / s;

[0061] In S104, the air cooling time of the pickling plate in the second air cooling section is controlled to make the center temperature of the pickling plate reach the third target temperature T S = 30-60 °C; after the pickling plate is cooled for 120-144 hours, the center temperature of the whole pickling plate is reduced to the third target temperature T S = 30-60 °C;

[0062] The temperature of the steel coil at different positions is checked by measuring the temperature at the uncoiling position of the tension leveler.

[0063] In S105, the pickling plate is tension leveled, and the elongation δ of the pickling plate is controlled to be 0.4%-1.0% to eliminate the wave defects of the pickling plate.

[0064] The tension leveling starts uncoiling, and the temperature of the pickling plate in the longitudinal direction is detected in real time at the position of the uncoiler to ensure that the core temperature of the steel coil is cooled to below 70 °C.

[0065] After the tension leveling uncoils, the wave height and wave distance of the pickling plate are measured. Assuming that the average wave height H is 10 mm and the wave distance L is 400 mm, the minimum elongation A W = π 2 ·H 2 / 4L 2 = 0.15%. Here, according to experience, the A R of the 600 MPa grade is taken as 0.2%, and the A C is taken as 0.15%. The elongation A of the tension leveling is A R +A C +A W = 0.5%.

[0066] The present application pre-cools the edge region of the pickling plate at high temperature to make the hardness of the edge region of the pickling plate higher than that of the middle region, thereby reducing the occurrence rate of edge waves. The water cooling and air cooling are alternately performed to control the cooling region, cooling temperature and cooling time of the pickling plate during water cooling and air cooling, thereby eliminating the internal stress of the pickling plate caused by the martensite phase transition due to heating, improving the toughness of the pickling plate material, and further reducing the occurrence rate of edge waves. Finally, the pickling plate is tension leveled, and the elongation δ of the pickling plate is controlled to be 0.4%-1.0% to quantitatively eliminate the wave defects of the pickling plate, thereby improving the product quality.

[0067] Example 2

[0068] Based on the same inventive concept, the high-strength pickled plate with a thickness of 2.5 mm and a strength grade of 700 MPa is selected in Embodiment 2. In combination with the production process, the temperature T F is set to 880℃, the temperature T M is set to 660℃, the temperature T C is set to 500℃, and the conveying speed V s of the pickled plate is 7.6 m / s.

[0069] Through the calculation of the post-rolling cooling control system, the length L1 of the first water cooling section is 12.54 m, and the first water cooling time t1 = L1 / V s = 1.65 s. The first average cooling rate is calculated by the formula Cr1 = (T F -T M ) / t1 to be 133℃ / s.

[0070] The transverse temperature of the pickled plate at the exit of the finishing rolling is shown in the attached Figure 3 graph. Through data fitting of the curve, it is found that the temperature change rate of the pickled plate is the largest at about 200 mm from the edge of the pickled plate, and the edge weak cooling width is determined to be 200 mm. The edge weak cooling is performed in the form of edge shielding in the first water cooling section.

[0071] The duration length L a of the first air cooling section is 49.4 m, and the first air cooling time is calculated by the formula t a = L a / V s to be 6.5 s. Through the Stefan-Boltzmann radiation formula, the air cooling temperature drop is 32℃.

[0072] The length L3 of the second water cooling section is 10.26 m, and the second water cooling time t2 = L3 / V s = 1.35 s. The second average cooling rate is calculated by the formula Cr2 = (T M -Ta-T C ) / t2 to be 94.8℃ / s.

[0073] After the pickled plate is cooled for 120-144 hours, the uncoiling starts, and the temperature in the longitudinal direction of the pickled plate is detected in real time at the position of the uncoiler to ensure that the temperature of the core of the steel coil is cooled to below 70℃.

[0074] After the uncoiling of the pickled plate, the wave height and wave distance of the edge of the pickled plate are measured. Assuming that the average wave height H is 15 mm and the wave distance L is 400 mm, the lowest elongation A W = π 2 ·H 2 / 4L 2 = 0.35%. Here, according to experience, the A R of the 700 MPa grade is taken as 0.25%, and the A CTake 0.1%. The tensile elongation A is A R +A C +A W =0.7%.

[0075] By adopting the method provided in Example 1, it is possible to eliminate the edge wave shape of thin-gauge high-strength pickled plate by only cooling after rolling and straightening with a small elongation without changing the plate and strip processing conditions before finishing rolling, while ensuring that the performance of the pickled plate meets the process requirements.

[0076] Example 3

[0077] Based on the same inventive concept, Example 3 of the present application provides a device for controlling the edge wave shape of a thin high-strength pickled plate, Figure 4 ,include

[0078] The first water cooling module 100 controls the first average cooling rate Cr1 of the pickling plate in the first water cooling section to be 90-140°C / s, and performs weak cooling on the preset edge area of ​​the pickling plate to make the pickling plate reach the first target temperature T M =640-680℃;

[0079] The first air cooling module 200 controls the air cooling time t of the pickling plate in the first air cooling section a = 4-10s, so that the pickling plate can obtain a temperature drop of T a ;

[0080] The second water cooling module 300 controls the second average cooling rate Cr2 of the pickling plate in the second water cooling section to be 60-110°C / s, so that the pickling plate reaches the second target temperature T C =480-580℃;

[0081] The second air cooling module 400 controls the air cooling time of the pickling plate in the second air cooling section so that the center temperature of the pickling plate reaches the third target temperature T S =30-60℃;

[0082] The straightening module 500 straightens the pickled plate and controls the elongation of the pickled plate to be δ=0.4%-1.0% to eliminate the wave shape defect of the pickled plate.

[0083] Example 4

[0084] Based on the same inventive concept, embodiment 4 of the present application provides an electronic device, as shown in the attached Figure 5 As shown, it includes a memory 304, a processor 302 and a computer program stored in the memory 304 and capable of running on the processor 302. When the processor 302 executes the program, the steps of the above-mentioned method for controlling the edge wave shape of a thin-gauge high-strength pickled plate are implemented.

[0085] wherein, in Figure 5 The bus architecture, represented by the bus 300, can include any number of interconnected buses and bridges, the bus 300 linking various circuitry including the processor(s) 302 represented by the processor(s) 302 and the memory represented by the memory 304. The bus 300 can also link various other circuitry, such as peripheral devices, voltage stabilizers and power management circuitry, all of which are well known in the art and thus, not further described herein. The bus interface 306 provides an interface between the bus 300 and the receiver 301 and the transmitter 303. The receiver 301 and the transmitter 303 can be the same element, i.e., a transceiver, providing a means for communicating with various other apparatus over a transmission medium. The processor 302 is responsible for managing the bus 300 and general processing, while the memory 304 can be used for storing data used by the processor 302 in executing operational processes.

[0086] Embodiment 5

[0087] Based on the same inventive concept, the embodiment 5 of the present application provides a computer readable storage medium, having stored thereon a computer program, which, when executed by a processor, implements the steps of the above-mentioned method for controlling edge waviness of a thin-gauge high-strength pickling plate.

[0088] The algorithms and displays presented herein are not inherently related to any particular computer, virtual system, or other apparatus. Various general purpose systems can be used with programs in accordance with the teachings herein, or it can prove convenient to construct more specialized apparatus to perform the required method steps. The required structure for a variety of these systems will be apparent from the description above. In addition, the present application is not intended to be limited to any particular programming language. It will be appreciated that there are many programming languages that can be used to implement the teachings herein, and any such programming language can be used in connection with the various aspects of the present application.

[0089] In the description provided herein, numerous specific details are set forth. However, it is understood that embodiments of the application can be practiced without these specific details. In some instances, well-known methods, structures and techniques have not been described in detail in order to avoid obscuring the understanding of this description.

[0090] Similarly, it should be understood that in order to streamline the present disclosure and aid in understanding one or more of the various inventive aspects, in the above description of exemplary embodiments of the invention, various features of the invention are sometimes grouped together into a single embodiment, figure, or description thereof. However, this disclosed method should not be interpreted as reflecting an intention that the claimed invention requires more features than are expressly recited in each claim. Rather, as reflected in the claims below, inventive aspects lie in less than all the features of the individual embodiments disclosed above. Accordingly, the claims following the detailed description are hereby expressly incorporated into this detailed description, with each claim standing on its own as a separate embodiment of the invention.

[0091] Those skilled in the art will appreciate that the modules in the devices in the embodiments may be adaptively changed and arranged in one or more devices different from the embodiments. The modules or units or components in the embodiments may be combined into one module or unit or component, and in addition may be divided into multiple submodules or subunits or subcomponents. All features disclosed in this specification (including the accompanying claims, abstracts and drawings) and all processes or units of any method or device disclosed herein may be combined in any combination, except that at least some of such features and / or processes or units are mutually exclusive. Unless expressly stated otherwise, each feature disclosed in this specification (including the accompanying claims, abstracts and drawings) may be replaced by an alternative feature providing the same, equivalent or similar purpose.

[0092] Furthermore, those skilled in the art will appreciate that although some embodiments herein include certain features included in other embodiments but not other features, combinations of features from different embodiments are intended to be within the scope of the present invention and to form different embodiments. For example, in the claims below, any of the claimed embodiments may be used in any combination.

[0093] The various component embodiments of the present invention can be implemented in hardware, or in software modules running on one or more processors, or in a combination thereof. It will be appreciated by those skilled in the art that a microprocessor or digital signal processor (DSP) can be used in practice to implement some or all of the functions of some or all of the components according to an embodiment of the present invention. The present invention can also be implemented as a device or apparatus program (e.g., a computer program and a computer program product) for executing a part or all of the methods described herein. Such a program implementing the present invention can be stored on a computer-readable medium, or can have the form of one or more signals. Such a signal can be downloaded from an Internet website, or provided on a carrier signal, or provided in any other form.

[0094] The above is only an embodiment of the present application, and the common knowledge of the specific structure and characteristics in the scheme is not described in detail, and the ordinary skilled person in the art knows all the ordinary technical knowledge in the field of the application before the application date or the priority date, can know all the prior art in the field, and has the ability to apply the conventional experimental means before that date, and the ordinary skilled person in the art can perfect and implement the present scheme under the guidance of the present application, combined with their own ability, some typical known structures or known methods should not be an obstacle for the ordinary skilled person in the art to implement the present application. It should be pointed out that for those skilled in the art, without departing from the structure of the present application, a number of modifications and improvements can be made, which should also be considered as the protection scope of the present application, which will not affect the effect and practicality of the patent. The protection scope of the present application should be subject to the content of its claims, and the specific implementation mode and the like in the specification can be used to explain the content of the claims.

Claims

1. A method for controlling the edge waviness of a thin gauge high strength pickled sheet, comprising application to the water cooling section and the air cooling section, characterized in that, The method comprises, controlling the first average cooling rate Cr1 of the pickling plate in the first water cooling section to be 90-140 ℃ / s, weakly cooling a preset area of the edge portion of the pickling plate, and making the pickling plate reach a first target temperature T M = 640-680 ℃; controlling the air cooling time t of the pickled sheet in the first air cooling section a = 4-10 s, so that the pickled sheet obtains a cooling amount T a ; controlling a second average cooling rate Cr2 of the pickled plate in the second water cooling section to be 60-110 °C / s, so that the pickled plate reaches a second target temperature T C = 480-580 °C; controlling the air cooling time of the pickled sheet in the second air cooling section so that the center temperature of the pickled sheet reaches a third target temperature T S = 30-60 °C; The method comprises, 2. The method of claim 1, wherein the thin gauge high strength pickled sheet edge waviness is controlled by: The method comprises, obtaining an inlet temperature T of the first water cooling section F , and a first water cooling time t1, The first average cooling rate Cr1 is calculated by the formula Cr1 = (T F -T M ) / t1.

3. The method of claim 1, wherein the method is characterized by: The method comprises, The method comprises The method comprises 4. The method of claim 1, wherein the method is characterized by: The control of the pickling plate in the first air cooling section air cooling time t a comprises, acquiring a distance L between an outlet position of the first water cooling section and an inlet position of the second water cooling section a , acquiring a conveying speed Vs of the pickling plate The air cooling time t a is calculated by the formula a s a .​​ 5. The method of claim 1, wherein the method is characterized by: The method comprises The method comprises The second average cooling rate Cr2 is calculated by the formula Cr2 = (T M -T a -T C ) / t2.

6. The method of claim 1, wherein the method is characterized by: The method comprises 7. The method of claim 1, wherein the method is characterized by: The method comprises The method comprises Based on the wave height H and the wave distance L, the lowest extension rate A W eliminating wave shape is calculated by formula A 2 ·H 2 / 4L 2 , wherein W ; Obtaining compensation for elastic recovery elongation A R Compensation for elongation A with a stretch leveler C ; The draw reduction A is calculated by the formula A = A R + A C + A W .

8. A device for controlling edge waviness of a thin gauge high strength pickled sheet, characterized by, The method comprises The first water cooling module controls the first average cooling rate Cr1 of the pickling plate in the first water cooling section to be 90-140 ℃ / s, weakly cools the preset area of the edge of the pickling plate, and makes the pickling plate reach the first target temperature T M =640-680 ℃. The first air cooling module controls the air cooling time t of the pickling plate in the first air cooling section a = 4-10 s, so that the pickling plate obtains the cooling amount T a ; a second water cooling module, controlling a second average cooling rate Cr2=60-110℃ / s of the pickling plate in a second water cooling section, so that the pickling plate reaches a second target temperature T C =480-580℃; The second air cooling module controls the air cooling time of the pickling plate in the second air cooling section, so that the center temperature of the pickling plate reaches the third target temperature T S = 30-60℃; The method comprises 9. An electronic device comprising a memory, a processor, and a computer program stored on the memory and executable on the processor, characterized in that, The method comprises 10. 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