Aging-resistant and impact-resistant AMB silicon nitride ceramic copper clad plate and preparation method thereof

Abstract

The application discloses an anti-aging and anti-impact AMB silicon nitride ceramic copper-clad plate and a preparation method thereof. The AMB silicon nitride ceramic copper-clad plate is prepared from a ceramic substrate, a first metal foil, a second metal foil, a nano metal layer and a copper-clad plate. The first metal foil is a copper foil or a first alloy foil, and the second metal foil is a titanium foil or a second alloy foil. The inner surface of the copper-clad plate is coated with a nano metal organic solution, and the nano metal layer is formed after drying. The first metal foil, the second metal foil and the two surfaces of the ceramic substrate are sequentially pasted from outside to inside, and the anti-aging and anti-impact AMB silicon nitride ceramic copper-clad plate is obtained by welding. The AMB ceramic copper-clad plate prepared by the method has higher bonding strength, anti-aging performance and anti-impact performance than a conventional silver-copper-titanium solder paste product, has advanced overall performance, and is simple in process, low in cost and suitable for industrial promotion.

Description

TECHNICAL FIELD

[0001] The application relates to an anti-aging and anti-impact AMB silicon nitride ceramic copper clad plate and a preparation method thereof, and belongs to the technical field of ceramic metal composite material preparation. BACKGROUND

[0002] There are mainly two production processes for ceramic surface metallization. One is direct copper clad ceramic substrate (DCB), which directly applies copper to the ceramic by using the oxygen-containing eutectic solution of copper; and the other is active metal brazing copper clad ceramic substrate (AMB, Active Metal Bonding), which generates a reaction layer that can be wetted by liquid solder through chemical reaction between a small amount of active elements contained in the solder and the ceramic at high temperature, so as to realize high bonding strength between the ceramic and the metal. The AMB active brazing copper process is a further development of the DBC process technology, and the active metal brazing copper ceramic substrate has higher comprehensive performance.

[0003] With the development of power conversion fields such as electric vehicles, solar and wind power plants, the requirements for ceramic copper clad plates used in high-power, high-heat-dissipation and high-reliability packaging modules are becoming higher and higher. The AMB ceramic copper clad plate made of traditional silver-copper-titanium solder paste is prone to problems such as unstable porosity rate and poor yield in batch production. Although other commonly used AMB ceramic copper clad plates have improved porosity rate, they still have problems such as poor bonding strength and poor cold-heat impact resistance.

[0004] Japanese patent application JP2022056203A discloses a kind of bonding substrate and bonding substrate method, which uses titanium material with a thickness of 1 μm or more as an intermediate layer, and finally obtains a bonding layer, which improves the bonding strength, but the impact resistance and other data measured by the applicant's experiment are not ideal.

[0005] Chinese patent application CN115626835A - a kind of ceramic base copper clad plate manufacturing method and its product, which adopts multi-arc ion plating method to first plate a layer of titanium active metal layer on the surface of ceramic substrate, the thickness of titanium active metal layer is 1 micrometer, then multi-arc ion plating forms a layer of copper layer protective film to prevent titanium from being oxidized, the thickness of copper layer protective film is 1 micrometer, a dense metallized intermediate layer is formed on the surface of ceramic substrate, which has low porosity and good peel strength, but the whole process is relatively complex, the cost is high, and the actual simulation test shows that the bonding strength is relatively low.

[0006] With the development of science and technology, the performance requirements of AMB ceramic copper clad plate are getting higher and higher, especially the bonding strength, aging resistance and cold and hot impact resistance have become important indicators. However, the existing technology usually only focuses on improving a certain performance of the ceramic copper clad plate, because it is not easy to improve a certain performance, and it is more difficult to balance the porosity, bonding strength, aging resistance and cold and hot impact resistance. SUMMARY

[0007] In order to solve the above problems, an aging-resistant and impact-resistant AMB silicon nitride ceramic copper clad plate and a preparation method thereof are provided. The bonding strength, aging resistance and cold and hot impact resistance of the AMB ceramic copper clad plate prepared by the method exceed the level of the AMB ceramic copper clad plate product prepared by the traditional silver-copper-titanium solder paste, and the overall performance is advanced. The process is simple, the cost is low, and it is suitable for industrialization.

[0008] According to one aspect of the present application, an aging-resistant and impact-resistant AMB silicon nitride ceramic copper clad plate is provided, which is prepared from a ceramic substrate, a first metal foil, a second metal foil, a nano-metal layer and a copper clad plate.

[0009] The first metal foil is a copper foil or a first alloy foil, and the second metal foil is a titanium foil or a second alloy foil. The inner surface of the copper clad plate is coated with the nano-metal organic solution, and after drying, a nano-metal layer is formed. The first metal foil, the second metal foil and the two faces of the ceramic substrate are sequentially adhered from the outside to the inside, and the aging-resistant and impact-resistant AMB silicon nitride ceramic copper clad plate is obtained by welding.

[0010] Optionally, the thickness of the first metal foil is 5-20 μm, the thickness of the second metal foil is 3-15 μm, and the total thickness of the first metal foil and the second metal foil is less than 25 μm.

[0011] Preferably, the thickness of the first metal foil is 5-10 μm, and the thickness of the second metal foil is 3-5 μm.

[0012] Optionally, the first alloy foil is a silver-copper alloy foil, and the silver content is not less than 70%; the thickness of the first alloy foil is less than 8 μm.

[0013] Preferably, the first metal foil is a silver-copper alloy foil, and the second metal foil is a titanium foil.

[0014] Optionally, the second alloy foil is a titanium-boron alloy foil or a titanium-tin alloy foil, and the titanium content is greater than 65%; the thickness of the second alloy foil is 3-5 μm.

[0015] Optionally, the nano-metallic solution comprises 50-80% of nano-metallic particles by mass percentage, and the rest is organic solvent.

[0016] Optionally, the nano-metallic particles are one or more of silver, titanium, indium and bismuth; the organic solvent is one of terpineol, turpentine, diethylene glycol ethyl ether, diethylene glycol, alcohol ester twelve, diethylene glycol ethyl ether acetate and diethylene glycol butyl ether acetate; and the nano-metallic particles have a particle size of 30-80 nm.

[0017] Preferably, the nano-metallic particles have a particle size of 30-50 nm.

[0018] Optionally, the nano-metallic particles are silver, titanium and indium, and the weight ratio of the added titanium to the other metal particles is 7:2:1; the titanium has a particle size 10 nm larger than that of the other metal particles.

[0019] Optionally, the nano-metallic layer has a thickness of 3-8 μm, the ceramic substrate is a silicon nitride ceramic substrate, and the copper-clad sheet is an oxygen-free copper sheet.

[0020] According to another aspect of the present application, a preparation method of the above-mentioned anti-aging and anti-impact AMB silicon nitride ceramic copper-clad sheet is also disclosed, comprising the following steps:

[0021] (1) cleaning the ceramic substrate and the copper-clad sheet with an organic solvent, smearing the inner surface of the copper-clad sheet with a nano-metallic solution, and drying at low temperature to form a nano-metallic layer;

[0022] (2) taking the copper-clad sheet as the outermost layer, sequentially bonding the first metal foil, the second metal foil and the two surfaces of the ceramic substrate from outside to inside, fixing with a clamp, placing in a vacuum brazing furnace for brazing, and finally naturally cooling in the furnace to obtain the anti-aging and anti-impact AMB silicon nitride ceramic copper-clad sheet.

[0023] Optionally, the organic solvent in step (1) is ethanol or acetone, and the drying temperature is 80-100°C; and the brazing process in step (2) is to control the vacuum degree to be less than 5×10 -3 Pa, to heat to 430-450°C, to keep the temperature for 0.5-2 h, to further heat to 870-910°C, to keep the temperature for 0.5-2 h, and to control the clamp pressure to be no less than 0.1 MPa.

[0024] The beneficial effects of the present application include but are not limited to:

[0025] 1. The anti-aging and anti-impact AMB silicon nitride ceramic copper clad sheet according to the present application, by simultaneously limiting the type and bonding sequence of the metal foil, the titanium foil or the titanium-based metal foil is close to the ceramic substrate, the copper foil or the silver-copper alloy foil is close to the copper clad sheet, and the nano metal particles are between the copper clad sheet and the first metal foil, finally the titanium foil and the ceramic substrate produce titanium nitride to form a bonding layer, the silver-copper alloy foil can effectively form a silver-copper-titanium overlayer on one side of the titanium foil under high temperature conditions, and the other side is strengthened by the nano metal particles and the copper clad sheet, the bonding strength is high, and the anti-aging and anti-impact performance is strong.

[0026] 2. The anti-aging and anti-impact AMB silicon nitride ceramic copper clad sheet according to the present application, by limiting the nano metal organic solution on the copper clad sheet, and low-temperature drying to obtain a nano metal layer, the titanium element is dissolved into the silicon nitride ceramic to occur wetting, reacts with the silicon nitride to form TiN, improves the bonding strength with the ceramic, and the nano metal particle layer can also quickly compensate for the burning loss of active metal elements during the welding process, and reduces the void rate.

[0027] 3. The anti-aging and anti-impact AMB silicon nitride ceramic copper clad sheet according to the present application, by using and limiting the type, addition ratio and particle size of the nano metal particles in the nano metal organic solution, the titanium particle size is slightly larger to compensate for the part of its oxidation burning loss, and at the same time can promote the reaction with the silicon nitride, further improve the wettability, and is conducive to improving the bonding strength, and further cooperates with silver and indium to reduce the formation of intermetallic compounds, ensure the bonding strength of the copper sheet and the ceramic substrate, and significantly improve the anti-aging and anti-impact performance.

[0028] 4. The preparation method of the anti-aging and anti-impact AMB silicon nitride ceramic copper clad sheet according to the present application, the method is simple in operation and low in equipment requirement, by limiting the clamp pressure and holding time, the prepared product has high bonding strength of the copper clad sheet and the ceramic substrate, few bubble defects after brazing, excellent anti-impact performance, and meets the current large-scale industrial production demand. BRIEF DESCRIPTION OF DRAWINGS

[0029] The drawings described herein are used to provide further understanding of the present application, constitute a part of the present application, the schematic embodiments of the present application and the description thereof are used to explain the present application, and do not constitute improper limitation on the present application. In the drawings:

[0030] Figure 1 The AMB silicon nitride ceramic copper clad sheet prepared in example 1 of the present application is a cross-sectional SEM image. DETAILED DESCRIPTION

[0031] The present application will be described in detail below in combination with examples, but the present application is not limited to these examples.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The reagents or materials used in the present application can be purchased by conventional route, and are used according to the conventional way or according to the product instruction unless otherwise specified. In addition, any method and material similar or equivalent to those described can be applied in the method of the present application. The preferred implementation methods and materials described in the patent are only for demonstration.

[0033] The vacuum brazing furnace used in the experiment is model KJ-M1200-12G from Zhengzhou Kekai Electric Furnace Co., Ltd.

[0034] Example 1

[0035] The anti-aging and impact-resistant AMB silicon nitride ceramic copper-clad plate is prepared from a ceramic substrate, a first metal foil, a second metal foil, a nano-metal layer, and a copper-clad plate. The first metal foil is a copper foil, and the second metal foil is a titanium foil. The inner surface of the copper-clad plate is coated with a nano-metal organic solution and low-temperature dried to obtain a nano-metal layer. The first metal foil, the second metal foil, and the two faces of the ceramic substrate are sequentially attached from the outside to the inside, and are welded to obtain the anti-aging and impact-resistant AMB silicon nitride ceramic copper-clad plate.

[0036] The thickness of the first metal foil is 8 μm, and the thickness of the second metal foil is 5 μm. The nano-metal organic solution includes 60% nano-metal particles and the rest is organic solvent in terms of mass percentage. The organic solvent is diethylene glycol ethyl ether. The particle size of the nano-metal particles is 50 nm, and the nano-metal particles are silver, titanium, and indium with an added weight ratio of 7:2:1. The particle size of titanium is 10 nm larger than that of other metal particles. The ceramic substrate is a silicon nitride ceramic substrate, and the copper-clad plate is an oxygen-free copper plate.

[0037] The preparation method includes the following steps:

[0038] (1) The ceramic substrate and the copper-clad plate are cleaned with an organic solvent. The inner surface of the copper-clad plate is coated with a nano-metal organic solution and low-temperature dried to obtain a nano-metal layer.

[0039] (2) The copper-clad plate is the outermost layer. The first metal foil, the second metal foil, and the two faces of the ceramic substrate are sequentially attached from the outside to the inside, fixed with a clamp, placed in a vacuum brazing furnace for welding, and finally naturally cooled in the furnace to obtain the anti-aging and impact-resistant AMB silicon nitride ceramic copper-clad plate.

[0040] In step (1), the organic solvent is ethanol, and the drying temperature is 90°C. In step (2), the welding process is to control the vacuum degree below 5×10 -3 Pa, heat to 440°C, keep for 1 h, then heat to 900°C and keep for 1 h. The clamp pressure is 0.1 MPa.

[0041] It can be seen from the above that the AMB silicon nitride ceramic copper-clad plate prepared in the embodiment has good interlayer effect and high density. Figure 1

[0042] The anti-aging and anti-impact AMB silicon nitride ceramic copper-clad plate is prepared from a ceramic substrate, a first metal foil, a second metal foil, a nano metal layer and a copper-clad plate.

[0043] The first metal foil is a copper foil, and the second metal foil is a second alloy foil. The thickness of the first metal foil is 8 μm, and the thickness of the second metal foil is 4 μm. The second alloy foil is a titanium boron alloy foil, and the titanium content is 70%. The inner surface of the copper-clad plate is coated with a nano metal organic solution and dried at low temperature to obtain a nano metal layer. The first metal foil, the second metal foil and the two surfaces of the ceramic substrate are sequentially attached from the outside to the inside, and are welded to obtain the anti-aging and anti-impact AMB silicon nitride ceramic copper-clad plate.

[0044] The nano metal organic solution includes 50% of nano metal particles and the rest is organic solvent in terms of mass percentage. The organic solvent is diethylene glycol ethyl ether acetate. The particle size of the nano metal particles is 70 nm. The nano metal particles are silver, titanium and indium, and the addition weight ratio is 7:2:1. The particle size of titanium is 10 nm larger than that of other metal particles. The ceramic substrate is a silicon nitride ceramic substrate, and the copper-clad plate is an oxygen-free copper plate.

[0045] The preparation method includes the following steps:

[0046] (1) The ceramic substrate and the copper-clad plate are cleaned with an organic solvent. The inner surface of the copper-clad plate is coated with a nano metal organic solution, and a nano metal layer is formed after low-temperature drying;

[0047] (2) The copper-clad plate is the outermost layer. The first metal foil, the second metal foil and the two surfaces of the ceramic substrate are sequentially attached from the outside to the inside, fixed with a clamp, placed in a vacuum brazing furnace for welding, and finally naturally cooled in the furnace to obtain the anti-aging and anti-impact AMB silicon nitride ceramic copper-clad plate.

[0048] (2) The copper-clad plate is the outermost layer. The first metal foil, the second metal foil and the two surfaces of the ceramic substrate are sequentially attached from the outside to the inside, fixed with a clamp, placed in a vacuum brazing furnace for welding, and finally naturally cooled in the furnace to obtain the anti-aging and anti-impact AMB silicon nitride ceramic copper-clad plate.

[0049] In step (1), the organic solvent is acetone, and the drying temperature is 80℃. In step (2), the welding process is to control the vacuum degree below 5×10 -3 Pa, heat to 430℃, keep for 0.5h, then heat to 910℃ and keep for 0.5h; the clamp pressure is 0.1MPa.

[0050] Example 3

[0051] ​The anti-aging and anti-impact AMB silicon nitride ceramic copper clad sheet is prepared from a ceramic substrate, a first metal foil, a second metal foil, a nano metal layer and a copper clad sheet. The first metal foil is a first alloy foil, and the second metal foil is a titanium foil. The inner surface of the copper clad sheet is coated with a nano metal layer formed by coating a nano metal organic solution and drying at low temperature. The first metal foil, the second metal foil and the two surfaces of the ceramic substrate are sequentially attached from outside to inside, and are welded to obtain the anti-aging and anti-impact AMB silicon nitride ceramic copper clad sheet.

[0052] The thickness of the first metal foil is 6 μm, and the thickness of the second metal foil is 3 μm. The first alloy foil is a silver-copper alloy foil, and the silver content is 70%. The nano metal organic solution comprises 80% of nano metal particles and the rest is organic solvent in terms of mass percentage. The organic solvent is terpineol, and the particle size of the nano metal particles is 30 nm. The nano metal particles are silver, titanium and indium, and the addition weight ratio is 7:2:1. The particle size of titanium is 10 nm larger than that of other metal particles. The ceramic substrate is a silicon nitride ceramic substrate, and the copper clad sheet is an oxygen-free copper clad sheet.

[0053] The preparation method comprises the following steps:

[0054] (1) The ceramic substrate and the copper clad sheet are cleaned with an organic solvent, the inner surface of the copper clad sheet is coated with a nano metal layer formed by coating a nano metal organic solution and drying at low temperature;

[0055] (2) The copper clad sheet is the outermost layer, the first metal foil, the second metal foil and the two surfaces of the ceramic substrate are sequentially attached from outside to inside, are fixed by a clamp, are welded in a vacuum brazing furnace, and are naturally cooled in the furnace to obtain the anti-aging and anti-impact AMB silicon nitride ceramic copper clad sheet.

[0056] The organic solvent in step (1) is acetone, and the drying temperature is 100℃. The welding process in step (2) is to control the vacuum degree to be less than 5×10 -3 Pa, to heat to 450℃, to keep the temperature for 2 h, to heat to 870℃ again and to keep the temperature for 2 h. The clamp pressure is 0.1 MPa.

[0057] Example 4

[0058] The anti-aging and anti-impact AMB silicon nitride ceramic copper clad sheet is prepared from a ceramic substrate, a first metal foil, a second metal foil, a nano metal layer and a copper clad sheet. The first metal foil is a first alloy foil, and the second metal foil is a second alloy foil. The inner surface of the copper clad sheet is coated with a nano metal particle layer formed by coating a nano metal organic solution and drying at low temperature. The first metal foil, the second metal foil and the two surfaces of the ceramic substrate are sequentially attached from outside to inside, and are welded to obtain the anti-aging and anti-impact AMB silicon nitride ceramic copper clad sheet.

[0059] The thickness of the first metal foil is 6 μm, and the thickness of the second metal foil is 5 μm. The first alloy foil is a silver-copper alloy foil, and the silver content is 70%. The second alloy foil is a titanium-tin alloy foil, and the titanium content is 70%. The nano-metal organic solution comprises 60% nano-metal particles and the rest is organic solvent. The organic solvent is diethylene glycol butyl ether acetate. The particle size of the nano-metal particles is 40 nm. The nano-metal particles are silver, titanium, and indium, and the weight ratio of the added metals is 7:2:1. The particle size of titanium is 10 nm larger than that of the other metal particles. The ceramic substrate is a silicon nitride ceramic substrate, and the copper-clad plate is an oxygen-free copper plate.

[0060] The preparation method comprises the following steps:

[0061] (1) cleaning the ceramic substrate and the copper-clad plate with an organic solvent, smearing the inner surface of the copper-clad plate with a nano-metal organic solution, and drying at low temperature to form a nano-metal layer;

[0062] (2) the copper-clad plate is the outermost layer, and the first metal foil, the second metal foil, and the two surfaces of the ceramic substrate are sequentially attached from the outside to the inside, fixed with a clamp, placed in a vacuum brazing furnace for welding, and finally naturally cooled in the furnace to obtain the anti-aging and impact-resistant AMB silicon nitride ceramic copper-clad plate.

[0063] In step (1), the organic solvent is acetone, and the drying temperature is 90°C. In step (2), the welding process is to control the vacuum degree to be below 5×10 -3 Pa, heat to 440°C, keep for 1 h, then heat to 900°C and keep for 1 h, and the clamp pressure is 0.15 MPa.

[0064] Comparative Example 1

[0065] The difference between Comparative Example 1 and Example 1 is that the nano-metal organic solution is not used to smear the nano-metal particle layer of the copper-clad plate after low-temperature drying in Comparative Example 1.

[0066] Comparative Example 2

[0067] The difference between Comparative Example 2 and Example 1 is that only a copper-titanium alloy foil is used to weld with the copper-clad plate and the ceramic substrate in Comparative Example 2. The copper content of the copper-titanium alloy foil is 60%, and the titanium content is 40%.

[0068] Comparative Example 3

[0069] The difference between Comparative Example 3 and Example 1 is that only a single titanium foil is used to weld with the copper-clad plate and the ceramic substrate in Comparative Example 3.

[0070] Comparative Example 4

[0071] The difference between Comparative Example 4 and Example 1 is that the order of the copper foil and the titanium foil is interchanged in Comparative Example 4.

[0072] Comparative Example 5

[0073] Comparative Example 5 differs from Example 1 in that the nano metal organic particles in Comparative Example 5 are titanium and indium, and the addition weight ratio is 4:1.

[0074] Comparative Example 6

[0075] Comparative Example 6 differs from Example 1 in that the nano metal organic particles in Comparative Example 6 are titanium and other metal particles with the same particle size of 50 nm.

[0076] Experimental Example

[0077] 1. The AMB silicon nitride ceramic copper clad sheets prepared in Examples 1-4 and Comparative Examples 1-6 were respectively subjected to peel strength, void rate, aging resistance test and cold-heat shock resistance performance test, and the test results are shown in Table 1.

[0078] (1) Peel strength test method: referring to the peel strength test criteria of the IPC-TM-650 test method manual for metal-clad sheet, a plurality of 3 mm wide copper foils were etched on the surface of four groups of samples, and the copper foil layer was vertically peeled off at a speed of 50 mm / min on a universal testing machine for testing, and the average value of three copper foils measured on the same sample was the result.

[0079] (2) Void rate test method: an ultrasonic scanning microscope (model SAM301) was used to scan and detect the void rate of the sample, the scanning range was 320*320 mm, the test probe was 50 MHz, and f=10 mm.

[0080] (3) Cold-heat shock resistance performance test (GJB / 360B-2009): -50°C for 15 min, 5 min to 150°C, 150°C for 15 min, 5 min to -50°C, after 2000 cycles, whether the sample is broken or not was observed, and the experiment was stopped if the deviation was more than 10%.

[0081] (4) Aging resistance test (“double 85” test): under the condition of environmental setting of temperature 85°C and humidity 85%, the test body was subjected to aging reliability test, the test time was 1000 h, and the experiment was ended when the peel strength of the sample was less than half of the initial peel strength.

[0082] Table 1: Performance test results

[0083]

[0084] From the above data, it can be seen that the anti-aging impact-resistant AMB silicon nitride ceramic copper-clad sheet prepared by the parameters defined in the application has high bonding strength, strong anti-peeling ability, and the void rate can be controlled below 0.5%, the cold and hot impact cycle times are all above 1450 times, the cold and hot impact resistance is excellent, the aging resistance time is all greater than 1000h, and the aging resistance is excellent.

[0085] The comparative example 1 does not use the nano metal organic solution to smear the copper-clad sheet, and the final result shows that the bonding strength is general, the void rate is high, the cold and hot impact resistance is general, and the aging resistance is poor; the comparative example 2 only uses the copper-titanium alloy foil to weld with the copper-clad sheet and the ceramic substrate, and the final result shows that the bonding strength is general, the void rate is slightly high, and the cold and hot impact resistance is poor; the comparative example 3 only uses a single titanium foil to weld with the copper-clad sheet and the ceramic substrate, and the final result shows that the bonding strength is low, the void rate is high, the cold and hot impact resistance is poor, and the aging resistance is poor; the comparative example 4 exchanges the order of the copper foil and the titanium foil, and the final result shows that the bonding strength is poor, the void rate is high, the cold and hot impact resistance is poor, and the aging resistance is poor; the comparative example 5 does not use silver for the nano metal particles, and the final result shows that the bonding strength is poor, the void rate is slightly high, the cold and hot impact resistance is general, and the aging resistance is poor, and the analysis reason is that the interlayer bonding ability is poor; the comparative example 6 has the same particle size of titanium particles as other elements, and the final result shows that the bonding strength is general, the void rate is slightly high, the cold and hot impact resistance is general, and the aging resistance is general, and the analysis reason is that the titanium element is oxidized and burned during the welding process, and the wettability is poor.

[0086] The above is only an embodiment of the application, and the protection scope of the application is not limited by these specific embodiments, but is determined by the claims of the application. Various modifications and changes can be made to the application by those skilled in the art. Any modification, equivalent replacement, improvement, etc. within the technical idea and principle of the application shall be included in the protection scope of the application.

Claims

1. An aging-resistant and impact-resistant AMB silicon nitride ceramic copper-clad sheet, characterized in that, It is made of a ceramic substrate, a first metal foil, a second metal foil, a nano-metal layer, and a copper-clad sheet; The first metal foil is a copper foil or a first alloy foil, and the second metal foil is a titanium foil or a second alloy foil; the inner surface of the copper-clad sheet is coated with a nano-metal organic solution, and after drying, a nano-metal layer is formed; The copper-clad sheet is the outermost layer. From the outside to the inside, the first metal foil, the second metal foil, and the two sides of the ceramic substrate are bonded together and welded to obtain the aging-resistant and impact-resistant AMB silicon nitride ceramic copper-clad sheet. The first alloy foil is a silver-copper alloy foil with a silver content of not less than 70%; The second alloy foil is a titanium-boron alloy foil or a titanium-tin alloy foil, with a titanium content greater than 65%; The nano-metal organic solution comprises 50-80% nano-metal particles by weight percentage, with the remainder being organic solvent; the nano-metal particles are silver, titanium, and indium, added in a weight ratio of 7:2:1; the particle size of the nano-metal particles is 30-80 nm, with titanium having a particle size 10 nm larger than the other metal particles.

2. The aging-resistant and impact-resistant AMB silicon nitride ceramic copper-clad sheet according to claim 1, characterized in that, The thickness of the first metal foil is 5-20 μm, the thickness of the second metal foil is 3-15 μm, and the total thickness of the first metal foil and the second metal foil is less than 25 μm.

3. The aging-resistant and impact-resistant AMB silicon nitride ceramic copper-clad sheet according to claim 2, characterized in that, The thickness of the first alloy foil is less than 8 μm.

4. The aging-resistant and impact-resistant AMB silicon nitride ceramic copper-clad sheet according to claim 2, characterized in that, The thickness of the second alloy foil is 3-5 μm.

5. The aging-resistant and impact-resistant AMB silicon nitride ceramic copper-clad sheet according to claim 1, characterized in that, The organic solvent is one of terpineol, turpentine, diethylene glycol ethyl ether, diethylene glycol, dodecyl alcohol ester, diethylene glycol ethyl ether acetate, and diethylene glycol butyl ether acetate.

6. The aging-resistant and impact-resistant AMB silicon nitride ceramic copper-clad sheet according to claim 1, characterized in that, The thickness of the nano-metal layer is 3-8 μm, the ceramic substrate is a silicon nitride ceramic substrate, and the copper clad sheet is an oxygen-free copper sheet.

7. A method for preparing an aging-resistant and impact-resistant AMB silicon nitride ceramic copper-clad sheet as described in any one of claims 1-6, characterized in that, Includes the following steps: (1) Clean the ceramic substrate and copper-clad sheet with organic solvent, coat the inner surface of the copper-clad sheet with nano-metal organic solution, and dry at low temperature to form a nano-metal layer; (2) The copper-clad sheet is the outermost layer. The first metal foil, the second metal foil and the two sides of the ceramic substrate are bonded together from the outside to the inside, fixed with a clamp, and placed in a vacuum brazing furnace for welding. Finally, the AMB silicon nitride ceramic copper-clad sheet with aging resistance and impact resistance is obtained by natural cooling with the furnace.

8. The preparation method according to claim 7, characterized in that, The organic solvent in step (1) is ethanol or acetone, and the drying temperature is 80-100℃; The welding process in step (2) involves controlling the vacuum level at 5×10. -3 Below Pa, heat to 430-450℃, hold for 0.5-2h, then heat to 870-910℃ and hold for 0.5-2h; the clamp pressure shall not be less than 0.1MPa.

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