An intelligent reader reading system and reading method

Abstract

The application discloses an intelligent reading instrument reading system and a reading method, and relates to the technical field of intelligent reading instruments.The reading system comprises a collection measurement unit, a conversion display unit, a man-machine interaction unit, a power supply unit and a main control unit; the reading method comprises the following steps: S1, starting the collection measurement unit by the MCU chip module; S2, judging whether the vibrating string sensor is normally connected or not by the vibrating string frequency measurement module; S3, transmitting the temperature signal acquired by sampling to the MCU chip module by the temperature measurement module; and S4, transmitting the processed voltage signal to the MCU chip module by the analog quantity measurement module.The system supports the connection of diversified sensors, has the function of directly displaying monitoring parameters, meets the data storage and export under various conditions, supports the management of multiple projects and multiple points, realizes the diversified chart / table display of historical measurement data, and is convenient for on-site inspection personnel to more intuitively, quickly and clearly acquire more measurement parameter information.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of vibrating string sensor, in particular to an intelligent reading instrument reading system and reading method. BACKGROUND

[0002] In the field of bridge, high-rise building, dam, tunnel and other engineering, it is necessary to monitor the related data such as pressure, stress, tension, seepage pressure, displacement, settlement, crack and other related data related to system safety, and the measurement of these parameters requires that the sensor has high stability, accuracy and meets the long distance transmission of output signal. Therefore, the sensor in the field of engineering safety monitoring often uses vibrating string frequency signal, 4-20mA current signal and RS485 digital bus for data transmission.

[0003] In the prior art, the field inspection personnel need a reading instrument supporting the measurement of the above-mentioned multiple signals, which can cope with multipoint detection in diverse and uncertain working conditions. However, the measured values of vibrating string frequency signal, 4-20mA current signal and RS485 digital bus correspond to frequency value, current value and byte value respectively, and since these values do not have direct monitoring physical quantity meaning, the field inspection personnel cannot intuitively and quickly determine from the reading instrument whether the parameter data of the monitored object is within the normal range, nor can they clearly and clearly distinguish from the reading instrument whether the parameter change of the monitored object conforms to the historical data waveform trend. SUMMARY

[0004] The technical problem to be solved by the present application is to provide an intelligent reading instrument reading system and reading method which can more intuitively and quickly, clearly and clearly obtain more parameter information for field inspection personnel.

[0005] In order to solve the above technical problem, the present application adopts the following technical scheme: an intelligent reading instrument reading system related to a sensor used in the field of engineering safety monitoring, comprising:

[0006] A collection and measurement unit is used for sampling and acquiring and transmitting various parameter signals, including a vibrating string frequency measurement module, a temperature measurement module, an analog quantity measurement module and an RS485 bus module which are independent of each other;

[0007] A conversion and display unit is used for calculating and processing various parameter data and performing diversified display, including a formula operation module and a number and graph display module, and the collection and measurement unit is connected to the conversion and display unit;

[0008] A man-machine interaction unit is used for providing a direct approach for user control and management of equipment and data, including a touch screen and a key;

[0009] A power supply unit, used to provide the required power for the system load, including a USB port, a battery module, a power management module and a charging protocol module. The conversion display unit and the power supply unit are both connected to the human-computer interaction unit;

[0010] The main control unit is used to receive and process various parameter signals, including an MCU chip module. The acquisition and measurement unit, the conversion and display unit, the human-computer interaction unit and the power supply unit are respectively connected to the main control unit.

[0011] Furthermore, the vibrating string frequency measurement module is connected to the main control unit and is used to connect and sample the vibrating string frequency signal of the vibrating string sensor, including an access detection circuit group, an excitation oscillation circuit group, a vibration signal processing circuit group and a vibration signal acquisition circuit group;

[0012] The access detection circuit group is connected to the resistor between the two ends of the vibrating string sensor interface, and is used to determine whether the vibrating string sensor is normally connected;

[0013] The excitation and oscillation circuit group includes a pump pressure controller and a sweep frequency generator respectively connected to the MCU chip module, the pump pressure controller is used to apply high-voltage pulse excitation to both ends of the vibrating string sensor, forcing the vibrating string sensor to vibrate and generate a vibration signal, and the sweep frequency generator is used to apply low-voltage sweep frequency excitation to both ends of the vibrating string sensor, forcing the vibrating string sensor to vibrate and generate a vibration signal;

[0014] The vibration signal processing circuit group is connected to the excitation oscillation circuit group, and is used to receive and process the vibration signal, including a pre-amplifier circuit for amplifying the vibration signal, a bandpass filter circuit for filtering signals outside the sampling frequency range, a full-scale amplifier circuit for amplifying the amplitude, and a waveform shaping circuit for filtering out weak signals with too low amplitude by comparing the amplitude with the expected amplitude voltage through a voltage comparator;

[0015] The vibration signal acquisition circuit group is connected between the vibration signal processing circuit group and the MCU chip module, and is used to calculate the current vibration frequency of the vibrating string sensor in real time and transmit the vibration frequency signal.

[0016] Furthermore, the temperature measurement module is connected to the main control unit, and is used to connect and sample the temperature signals of the ambient temperature sensor and the battery temperature sensor, and includes a channel selection circuit for automatically identifying the type of temperature sensor and collecting temperature signals.

[0017] Furthermore, the analog measurement module is connected to the main control unit, and is used to connect and sample the current signal of the current sensor, including a sampling circuit for converting the current signal into a voltage signal, a pre-amplifier circuit for amplifying the voltage signal, and a second-order low-pass filter circuit for filtering the voltage signal outside the sampling range, and inputting the filtered voltage signal into the MCU chip module for voltage / current value conversion.

[0018] Furthermore, the RS485 bus module is connected to the main control unit and is used to connect and sample digital signals of RS485 interface digital sensors.

[0019] Furthermore, the formula operation module and the digital graph display module are respectively connected to the MCU chip module, the formula operation module is used to receive various parameter signals sent by the MCU chip module, and can configure calculation expressions to perform data operations, and can indicate the error position of illegal expressions. The digital graph display module is used to receive various parameter signals sent by the MCU chip module and various calculation data sent by the formula operation module, and can display numerical values / waveforms / change curves / trend graphs in real time, and can retrieve and view historical data.

[0020] Furthermore, the touch screen and the button are respectively connected to the MCU chip module, the touch screen is used to provide a direct way for the user to control and manage the device and view the transmitted data, and the button is used to control the touch screen to turn on or off.

[0021] Furthermore, the USB port is connected to an external charger and the battery module for charging the battery module;

[0022] The battery module is connected to the main control unit and the peripheral unit circuit to provide the required power for the system load;

[0023] The power management module is connected to the battery module and the main control unit, and is used to automatically start and switch the power supply switch;

[0024] The charging protocol module is connected to the external charger and the battery module, and is used to protect the battery module and prevent the battery from overheating during charging. The charging protocol module uses the standard USB PD protocol.

[0025] Furthermore, it also includes a wireless communication unit, which is connected to the main control unit and includes an NFC module for reading the NFC tags of each monitoring point, a Bluetooth module for sharing historical measurement data with other Bluetooth devices, and a mobile network communication module for establishing a data channel with a cloud server.

[0026] A method for reading with an intelligent reader, using an intelligent reader reading system, the method comprising the following steps:

[0027] S1: The MCU chip module receives an external measurement request and starts the acquisition and measurement unit;

[0028] S2: The vibrating string frequency measurement module first determines whether the vibrating string sensor is normally connected. If it is normally connected, it sequentially performs the steps of excitation and oscillation, vibration signal processing, and vibration signal acquisition. Finally, it transmits the sampled vibrating string frequency signal to the MCU chip module for analog / digital conversion. If it is abnormally connected, it reconnects until it is successful.

[0029] S3: The temperature measurement module first selects an acquisition channel based on the automatic identification of different temperature sensor types by the MCU chip module, and finally transmits the sampled temperature signal to the MCU chip module for analog / digital conversion by the MCU chip module;

[0030] S4: The analog measurement module is first connected to the current sensor, and then performs current signal-to-voltage signal conversion and sampling, voltage signal amplification and filtering, and finally transmits the processed voltage signal to the MCU chip module for the MCU chip module to perform voltage-current value conversion;

[0031] S5: The RS485 bus module is connected to the RS485 interface digital sensor, and the MCU chip module obtains a digital signal byte stream from the RS485 interface digital sensor based on the Modbus RTU and Modbus ASCII protocols, and finally parses the byte stream into 16-bit signed integers, 16-bit unsigned integers, 32-bit signed integers, 32-bit unsigned integers, 32-bit single-precision floating-point numbers, and 64-bit double-precision floating-point numbers according to the configuration;

[0032] S6: The conversion display unit receives various parameter signals or parameter data sent by the MCU chip module, configures calculation expressions to perform data operations, and displays the values / waveforms / change curves / trend graphs in real time.

[0033] The beneficial effects of the present invention are embodied in:

[0034] This system comprehensively utilizes Internet of Things technology and 4G / 5G communication technology. On the one hand, it supports the connection of various sensors and has the function of directly displaying monitoring parameters through local calculation and analysis. Such measurement values ​​can be stored locally, exported through USB interface or Bluetooth, or uploaded to cloud servers through 4G / 5G mobile networks, that is, data storage and export under various conditions are met; on the other hand, it supports multi-project and multi-point management, facilitates measurement data archiving, and realizes diversified numerical / graph / table display of historical measurement data, so that on-site inspection personnel can obtain more measurement parameter information more intuitively, quickly, clearly and clearly, thereby improving monitoring work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 It is an overall block diagram of an embodiment of the present invention.

[0036] Figure 2 Schematic diagram of a power supply path according to an embodiment of the present invention.

[0037] Figure 3 4 is a flowchart of the power supply unit according to an embodiment of the present invention.

[0038] Figure 4 This is a flowchart of the vibrating string frequency measurement module according to an embodiment of the present invention.

[0039] Figure 5 1 is a flowchart of the temperature measurement module according to an embodiment of the present invention.

[0040] Figure 6 This is a workflow diagram of the analog quantity measurement module according to an embodiment of the present invention. DETAILED DESCRIPTION

[0041] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments. In the absence of conflict, the embodiments in this application and the features in the embodiments can be combined with each other. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention. It should be noted that the various electrical components and components involved in this application are standard parts that can be purchased in the prior art.

[0042] See also Figure 1 The present invention provides an intelligent reading instrument reading system, which relates to sensors used in the field of engineering safety monitoring, including:

[0043] The acquisition and measurement unit is used to sample, obtain and transmit various parameter signals, including independent vibrating string frequency measurement module, temperature measurement module, analog measurement module and RS485 bus module;

[0044] A conversion and display unit, used for calculating and processing various parameter data and performing diversified display, including a formula operation module and a digital graph display module, and the acquisition and measurement unit is connected to the conversion and display unit;

[0045] Human-computer interaction unit, used to provide a direct way for users to control and manage equipment and data, including touch screen and buttons;

[0046] A power supply unit, used to provide the required power for the system load, including a USB port, a battery module, a power management module and a charging protocol module. The conversion display unit and the power supply unit are both connected to the human-computer interaction unit;

[0047] The main control unit is used to receive and process various parameter signals, including an MCU chip module. The acquisition and measurement unit, the conversion and display unit, the human-computer interaction unit and the power supply unit are respectively connected to the main control unit.

[0048] This system comprehensively utilizes Internet of Things technology and 4G / 5G communication technology. On the one hand, it supports the connection of various sensors and has the function of directly displaying monitoring parameters through local calculation and analysis. Such measurement values ​​can be stored locally, exported through USB interface or Bluetooth, or uploaded to cloud servers through 4G / 5G mobile networks, that is, data storage and export under various conditions are met; on the other hand, it supports multi-project and multi-point management, facilitates measurement data archiving, and realizes diversified numerical / graph / table display of historical measurement data, so that on-site inspection personnel can obtain more measurement parameter information more intuitively, quickly, clearly and clearly, thereby improving monitoring work efficiency.

[0049] See also Figure 4 In one embodiment, the vibrating string frequency measurement module is connected to the main control unit and is used to connect to and sample the vibrating string frequency signal of the vibrating string sensor, including an access detection circuit group, an excitation oscillation circuit group, a vibration signal processing circuit group, and a vibration signal acquisition circuit group;

[0050] The access detection circuit group is connected to the resistor between the two ends of the vibrating string sensor interface, and is used to determine whether the vibrating string sensor is normally connected;

[0051] The excitation and oscillation circuit group includes a pump pressure controller and a sweep frequency generator respectively connected to the MCU chip module, the pump pressure controller is used to apply high-voltage pulse excitation to both ends of the vibrating string sensor, forcing the vibrating string sensor to vibrate and generate a vibration signal, and the sweep frequency generator is used to apply low-voltage sweep frequency excitation to both ends of the vibrating string sensor, forcing the vibrating string sensor to vibrate and generate a vibration signal;

[0052] The vibration signal processing circuit group is connected to the excitation oscillation circuit group, and is used to receive and process the vibration signal, including a pre-amplifier circuit for amplifying the vibration signal, a bandpass filter circuit for filtering signals outside the sampling frequency range, a full-scale amplifier circuit for amplifying the amplitude, and a waveform shaping circuit for filtering out weak signals with too low amplitude by comparing the amplitude with the expected amplitude voltage through a voltage comparator;

[0053] The vibration signal acquisition circuit group is connected between the vibration signal processing circuit group and the MCU chip module, and is used to calculate the current vibration frequency of the vibrating string sensor in real time and transmit the vibration frequency signal.

[0054] The excitation mode of the excitation oscillation circuit group supports high-voltage pulses and low-voltage frequency sweeps. When high-voltage pulse excitation is performed, the MCU chip module controls the pump pressure controller to output high voltage for a specified duration and applies it to both ends of the vibrating string sensor, forcing the vibrating string sensor to oscillate. To prevent the high voltage from damaging the vibrating string sensor, the excitation voltage is limited based on the resistance value of the vibrating string sensor measured by the access detection circuit group: if the resistance value of the vibrating string sensor is less than 120Ω, the current generated by the maximum excitation voltage does not exceed 1A. For example, if the resistance value of the vibrating string sensor is 100Ω, the maximum excitation voltage is 100V. If the resistance value of the vibrating string sensor exceeds 120Ω, the maximum excitation voltage does not exceed 180V. When low-voltage frequency sweep excitation is performed, during the first excitation, the MCU chip module controls the frequency sweep controller to start frequency sweeping from the lowest value of the acquisition frequency range. Subsequent measurements start from the frequency band of the last acquisition result. If the signal quality does not meet expectations, the frequency sweep is repeated.

[0055] After the vibrating string sensor vibrates, it generates a vibration signal, which is received and processed by the vibration signal processing circuit. After being amplified by the pre-stage, the signal outside the sampling frequency range is filtered out, and then after being fully amplified, it is compared with the expected amplitude voltage to filter out weak signals with too low amplitude.

[0056] The vibration signal acquisition circuit group can calculate the current vibration frequency of the vibrating string sensor by counting the number of pulses of the vibration signal within a specified time.

[0057] See also Figure 5 In one embodiment, the temperature measurement module is connected to the main control unit, and is used to connect and sample the temperature signals of the ambient temperature sensor and the battery temperature sensor, and includes a channel selection circuit for automatically identifying the type of temperature sensor and collecting temperature signals.

[0058] With this design, the temperature measurement module can connect to both the NTC temperature sensor and the DS18B20 digital temperature sensor with the same physical interface, and the MCU chip module automatically identifies the temperature sensor type based on whether there is a reset response signal.

[0059] The MCU chip module preferentially selects channel 1, pulls high after channel 1 sends a low level for more than a specified time (such as 1000 microseconds, configurable), and waits for a specified time (such as 60 microseconds, configurable). If channel 1 generates a response signal, it is determined that the currently connected temperature sensor type is a DS18B20 digital temperature sensor, and temperature data is obtained according to its single-wire protocol. If channel 1 does not generate a response signal, it is determined that the currently connected temperature sensor type is an NTC temperature sensor, and the MCU chip module switches to channel 2, obtains the resistance value of the NTC temperature sensor through the resistance measurement circuit, and then uses the formula R t =R n ·e B·(1 / T-1 / Tn) Calculate the temperature value, where R t is the current resistance value of the NTC temperature sensor, R n The NTC temperature sensor is n The nominal resistance at room temperature, B is the temperature coefficient of the NTC temperature sensor.

[0060] See also Figure 6 In one embodiment, the analog measurement module is connected to the main control unit, and is used to connect and sample the current signal of the current sensor, including a sampling circuit for converting the current signal into a voltage signal, a pre-amplifier circuit for amplifying the voltage signal, and a second-order low-pass filter circuit for filtering the voltage signal outside the sampling range, and inputting the filtered voltage signal into the MCU chip module for voltage / current value conversion.

[0061] With this design, the analog measurement module can measure 4-20mA current signals, including 4-20mA current signals superimposed with HART FSK signals. The current signal is converted into a voltage signal after passing through the precision resistor in the sampling circuit. After amplification and filtering, it is input into the ADC in the MCU chip module for voltage sampling. The MCU chip module converts the measured voltage value into a current value to complete the 4-20mA current analog measurement;

[0062] Among them, the second-order low-pass filter circuit analog filter circuit bandwidth is 25Hz, and the roll-off is -40dB / decade. It can attenuate the HART FSK signal to a level of more than -60dB below the 4-20mA full scale, ensuring that the 4-20mA analog input disturbance of HART FSK communication does not exceed 0.1%.

[0063] In one embodiment, the RS485 bus module is connected to the main control unit and is used to connect to and sample digital signals of RS485 interface digital sensors.

[0064] With this design, the RS485 bus module can mount multiple RS485 interface digital sensors. The MCU chip module obtains the measurement signal byte stream from the sensor based on the Modbus RTU and Modbus ASCII protocols, and then parses the byte stream into 16-bit signed integers, 16-bit unsigned integers, 32-bit signed integers, 32-bit unsigned integers, 32-bit single-precision floating-point numbers, and 64-bit double-precision floating-point numbers according to the configuration.

[0065] In one embodiment, the formula operation module and the digital graph display module are respectively connected to the MCU chip module, the formula operation module is used to receive various parameter signals sent by the MCU chip module, and can configure calculation expressions to perform data operations, and can indicate the error position of illegal expressions. The digital graph display module is used to receive various parameter signals sent by the MCU chip module and various calculation data sent by the formula operation module, and can display numerical values / waveforms / change curves / trend graphs in real time, and can retrieve and view historical data.

[0066] With this design, the formula operation module can name newly created measurement items using uppercase and lowercase letters, numbers, and underscores, such as fre, temp, and m_1. Calculation items can be created based on measurement items, following the same naming rules. Calculation expressions can then be configured, such as "m_2 = 2*sin(m_1*pi / 180)." The calculation expressions of calculation items can reference measurement items and other calculation items, and can indicate the error location of illegal expressions.

[0067] The digital graph display module supports real-time display of numerical values, waveforms, historical data viewing, etc. for measurement items or calculation items, and has diversified display methods;

[0068] The operators supported by the formula operation module and the digital graph display module include +, -, *, / , ^, %, etc., the supported functions include abs, acos, asin, atan, atan2, ceil, cos, cosh, exp, floor, ln, log, pow, sin, sinh, sqrt, tan, tanh, etc., and the supported constants include pi, e, etc.

[0069] In an embodiment, the touch screen and the button are respectively connected to the MCU chip module, the touch screen is used to provide a direct approach for user operation management equipment and viewing of transmitted data, and the button is used to control screen-off or screen-on of the touch screen. In this way, the design of the man-machine interaction unit greatly improves the operation convenience of the on-site inspection personnel, and reduces the work burden. The on-site inspection personnel can not only log in to the cloud server, manage projects and points, set and control measurement items, view real-time measurement data, view, upload and share historical data through the touch screen, but also can control screen-off or screen-on through the button. If the touch screen is not operated within a specified time, the screen is automatically turned off. After the screen is turned off, the measurement task still normally runs. If there is no measurement task, the system enters a low-power consumption mode to maximize the delay of the endurance time. In the system, the automatic screen-off time of the touch screen without interaction can be configured by itself.

[0070] Referring to Figure 2-3 In an embodiment, the USB port is connected to an external charger and the battery module, and is used to charge the battery module.

[0071] The battery module is connected to the main control unit and the peripheral unit circuit, and is used to provide required power for system load.

[0072] The power management module is connected to the battery module and the main control unit, and is used to automatically start and switch the power supply switch.

[0073] The charging protocol module is connected to the external charger and the battery module, and is used to protect the battery module and avoid battery overheating during charging. The charging protocol module selects a standard USB PD protocol.

[0074] In this way, when the USB port is connected to the external charger, the power management module provides the required power for the system load of the MCU chip module and its peripheral modules, and charges the battery module at the same time. The power of the input power supply is preferentially provided to the system load, and the remaining power is provided to the battery module for charging. When the input power from the external charger is disconnected, the power management module automatically starts the switch between the battery module and the system load, and provides power for the system load through the battery module.

[0075] When the USB port is connected to the external charger and the battery module is in a charging state, the MCU chip module obtains a battery temperature value from the battery temperature sensor, obtains a charging current through the battery module from the power management module, and negotiates a charging power with the external charger through the charging protocol module to prevent battery overheating during charging. It should be noted that the temperature threshold values of different levels in the battery charging management strategy and the corresponding charging power can be configured by themselves, and the charging protocol module supports a standard USB PD protocol.

[0076] In one embodiment, a wireless communication unit is further included, which is connected to the main control unit and includes an NFC module for reading the NFC tags of each monitoring point, a Bluetooth module for sharing historical measurement data with other Bluetooth devices, and a mobile network communication module for establishing a data channel with a cloud server.

[0077] With this design, the system reads the NFC tags of each monitoring point through the NFC module, which makes it convenient for on-site inspection personnel to enter point information when creating measurement points, reducing the workload of manual input. The system uses the Bluetooth module or the mobile network communication module to share and transmit data, and synchronizes project information, point information, and measurement history data to the account bound to the device.

[0078] In one embodiment, a data / file storage unit is further included, which is connected to the main control unit and the USB port and is used to import, export or save management project configuration files, historical measurement data files and upgrade firmware files.

[0079] Designed in this way, the system can save project configuration files, historical measurement data files, and upgrade firmware files, support the connection of diverse sensors, and directly display monitoring parameters through local calculation and analysis. Such measurement values ​​can be stored locally, exported via a USB interface or Bluetooth, or uploaded to a cloud server via a 4G / 5G mobile network, thus meeting data storage and export requirements under various conditions.

[0080] On the other hand, this embodiment also discloses a smart reader reading method, which uses a smart reader reading system, and the method includes the following steps:

[0081] S1: The MCU chip module receives an external measurement request and starts the acquisition and measurement unit;

[0082] S2: The vibrating string frequency measurement module first determines whether the vibrating string sensor is normally connected. If it is normally connected, it sequentially performs the steps of excitation and oscillation, vibration signal processing, and vibration signal acquisition. Finally, it transmits the sampled vibrating string frequency signal to the MCU chip module for analog / digital conversion. If it is abnormally connected, it reconnects until it is successful.

[0083] S3: The temperature measurement module first selects an acquisition channel based on the automatic identification of different temperature sensor types by the MCU chip module, and finally transmits the sampled temperature signal to the MCU chip module for analog / digital conversion by the MCU chip module;

[0084] S4: The analog measurement module is first connected to the current sensor, and then performs current signal-to-voltage signal conversion and sampling, voltage signal amplification and filtering, and finally transmits the processed voltage signal to the MCU chip module for the MCU chip module to perform voltage-current value conversion;

[0085] S5: The RS485 bus module is connected to the RS485 interface digital sensor, and the MCU chip module obtains a digital signal byte stream from the RS485 interface digital sensor based on the Modbus RTU and Modbus ASCII protocols, and finally parses the byte stream into 16-bit signed integers, 16-bit unsigned integers, 32-bit signed integers, 32-bit unsigned integers, 32-bit single-precision floating-point numbers, and 64-bit double-precision floating-point numbers according to the configuration;

[0086] S6: The conversion display unit receives various parameter signals or parameter data sent by the MCU chip module, configures calculation expressions to perform data operations, and displays the values / waveforms / change curves / trend graphs in real time.

[0087] This system comprehensively utilizes Internet of Things technology and 4G / 5G communication technology, supports multi-project and multi-point management, facilitates measurement data archiving, and realizes diversified numerical / graph / table display of historical measurement data, making it easier for on-site inspection personnel to obtain more measurement parameter information more intuitively, quickly, clearly and clearly, thereby improving monitoring work efficiency.

[0088] It should be understood that the examples and implementation methods described herein are for illustrative purposes only and are not intended to limit the present invention. Those skilled in the art may make various modifications or changes based on them. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. An intelligent reading instrument reading system, involving sensors used in the field of engineering safety monitoring, characterized in that: include: The acquisition and measurement unit is used to sample, obtain and transmit various parameter signals, including independent vibrating string frequency measurement module, temperature measurement module, analog measurement module and RS485 bus module; A conversion and display unit, used for calculating and processing various parameter data and performing diversified display, including a formula operation module and a digital graph display module, and the acquisition and measurement unit is connected to the conversion and display unit; Human-computer interaction unit, used to provide a direct way for users to control and manage equipment and data, including touch screen and buttons; A power supply unit, used to provide the required power for the system load, including a USB port, a battery module, a power management module and a charging protocol module. The conversion display unit and the power supply unit are both connected to the human-computer interaction unit; A main control unit, used to receive and process various parameter signals, including an MCU chip module, to which the acquisition and measurement unit, the conversion and display unit, the human-computer interaction unit, and the power supply unit are respectively connected; The vibrating string frequency measurement module is connected to the main control unit and is used to connect and sample the vibrating string frequency signal of the vibrating string sensor, including an access detection circuit group, an excitation oscillation circuit group, a vibration signal processing circuit group and a vibration signal acquisition circuit group; The access detection circuit group is connected to the resistor between the two ends of the vibrating string sensor interface, and is used to determine whether the vibrating string sensor is normally connected; The excitation and oscillation circuit group includes a pump pressure controller and a sweep frequency generator respectively connected to the MCU chip module, the pump pressure controller is used to apply high-voltage pulse excitation to both ends of the vibrating string sensor, forcing the vibrating string sensor to vibrate and generate a vibration signal, and the sweep frequency generator is used to apply low-voltage sweep frequency excitation to both ends of the vibrating string sensor, forcing the vibrating string sensor to vibrate and generate a vibration signal; The vibration signal processing circuit group is connected to the excitation oscillation circuit group, and is used to receive and process the vibration signal, including a pre-amplifier circuit for amplifying the vibration signal, a bandpass filter circuit for filtering signals outside the sampling frequency range, a full-scale amplifier circuit for amplifying the amplitude, and a waveform shaping circuit for filtering out weak signals with too low amplitude by comparing the amplitude with the expected amplitude voltage through a voltage comparator; The vibration signal acquisition circuit group is connected between the vibration signal processing circuit group and the MCU chip module, and is used to calculate the current vibration frequency of the vibrating string sensor in real time and transmit the vibration frequency signal; The formula operation module and the digital graph display module are respectively connected to the MCU chip module. The formula operation module is used to receive various parameter signals sent by the MCU chip module, and can configure calculation expressions to perform data operations, and can indicate the error position of illegal expressions. The digital graph display module is used to receive various parameter signals sent by the MCU chip module and various calculation data sent by the formula operation module, and can display numerical values, waveforms, change curves and trend graphs in real time, and can retrieve and view historical data.

2. The intelligent reader reading system according to claim 1, characterized in that: The temperature measurement module is connected to the main control unit and is used to connect and sample the temperature signals of the ambient temperature sensor and the battery temperature sensor. It includes a channel selection circuit for automatically identifying the type of temperature sensor and collecting temperature signals.

3. The intelligent reader reading system according to claim 1, characterized in that: The analog measurement module is connected to the main control unit and is used to connect and sample the current signal of the current sensor, including a sampling circuit for converting the current signal into a voltage signal, a pre-amplifier circuit for amplifying the voltage signal, and a second-order low-pass filter circuit for filtering the voltage signal outside the sampling range and inputting the filtered voltage signal into the MCU chip module for voltage / current value conversion.

4. The intelligent reader reading system according to claim 1, characterized in that: The RS485 bus module is connected to the main control unit and is used to connect and sample the digital signal of the RS485 interface digital sensor.

5. The intelligent reader reading system according to claim 1, characterized in that: The touch screen and the button are respectively connected to the MCU chip module. The touch screen is used to provide a direct way for users to control and manage the device and view the transmitted data. The button is used to control the touch screen to turn on or off.

6. The intelligent reader reading system according to claim 1, characterized in that: The USB port is connected to an external charger and the battery module for charging the battery module; The battery module is connected to the main control unit and the peripheral unit circuit to provide the required power for the system load; The power management module is connected to the battery module and the main control unit, and is used to automatically start and switch the power supply switch; The charging protocol module is connected to the external charger and the battery module, and is used to protect the battery module and prevent the battery from overheating during charging. The charging protocol module uses the standard USB PD protocol.

7. The intelligent reader reading system according to claim 1, characterized in that: It also includes a wireless communication unit, which is connected to the main control unit and includes an NFC module for reading the NFC tags of each monitoring point, a Bluetooth module for sharing historical measurement data with other Bluetooth devices, and a mobile network communication module for establishing a data channel with a cloud server.

8. A method for reading with an intelligent reader, characterized in that: Using the intelligent reader reading system according to any one of claims 1 to 7, the method comprises the following steps: S1: The MCU chip module receives an external measurement request and starts the acquisition and measurement unit; S2: The vibrating string frequency measurement module first determines whether the vibrating string sensor is normally connected. If it is normally connected, it sequentially performs the steps of excitation and oscillation, vibration signal processing, and vibration signal acquisition. Finally, it transmits the sampled vibrating string frequency signal to the MCU chip module for analog / digital conversion. If it is abnormally connected, it reconnects until it is successful. S3: The temperature measurement module first selects an acquisition channel based on the automatic identification of different temperature sensor types by the MCU chip module, and finally transmits the sampled temperature signal to the MCU chip module for analog / digital conversion by the MCU chip module; S4: The analog measurement module is first connected to the current sensor, and then performs current signal-to-voltage signal conversion and sampling, voltage signal amplification and filtering, and finally transmits the processed voltage signal to the MCU chip module for the MCU chip module to perform voltage-current value conversion; S5: The RS485 bus module is connected to the RS485 interface digital sensor, and the MCU chip module obtains a digital signal byte stream from the RS485 interface digital sensor based on the Modbus RTU and Modbus ASCII protocols, and finally parses the byte stream into 16-bit signed integers, 16-bit unsigned integers, 32-bit signed integers, 32-bit unsigned integers, 32-bit single-precision floating point numbers, and 64-bit double-precision floating point numbers according to the configuration; S6: The conversion display unit receives various parameter signals or parameter data sent by the MCU chip module, configures calculation expressions to perform data operations, and displays numerical values, waveforms, change curves and trend graphs in real time.

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