Radar assembly and millimeter wave radar

Abstract

The application discloses a radar assembly and a millimeter wave radar, and relates to the technical field of radar assemblies, and specifically discloses a radar assembly and a millimeter wave radar, which can solve the problem of low flexibility of the existing radar assembly.

Description

Technical Field

[0001] This invention relates to the field of antenna transmission technology, and in particular to a radar component and a millimeter-wave radar. Background Technology

[0002] Millimeter-wave radar is increasingly used and rapidly developing in industries such as ADAS, smart homes, and healthcare. In the field of autonomous driving, millimeter-wave radar is a crucial sensor and an essential device. Currently, dedicated millimeter-wave radar can be implemented on a very small PCB. The radar board typically integrates the antenna and other chips onto the same PCB, forming a single-board radar system. The advantage is high integration, but the disadvantages are also obvious. For example, if antennas with different performance specifications are required, the entire PCB board must be redesigned, even though other parts do not need to be changed. Furthermore, to ensure performance, the antenna section usually needs to be fabricated using a high-frequency material substrate, while the rest can use ordinary FR4. A single-board radar system must use PCB fabrication technology with two different substrates, making the manufacturing process more difficult. Summary of the Invention

[0003] The main objective of this invention is to propose a radar assembly that addresses the problem of low flexibility in existing radar assemblies.

[0004] To achieve the above objectives, the radar component proposed in this invention includes:

[0005] A radar substrate has a first surface and a second surface disposed opposite to each other. A radar chip is disposed on the first surface of the radar substrate, and a conductive layer and an insulating film disposed on the conductive layer are disposed on the second surface of the radar substrate.

[0006] A high-frequency substrate has a first surface and a second surface disposed opposite to each other. An antenna element is disposed on the first surface of the high-frequency substrate, and a conductive layer and an insulating film disposed on the conductive layer are disposed on the second surface of the high-frequency substrate. A signal transmission line is also disposed on the high-frequency substrate, and the second surface of the high-frequency substrate is attached to the second surface of the radar substrate.

[0007] A conductive element, wherein a first end of the conductive element extends from a first surface of the radar substrate and is electrically connected to the radar chip, and a second end of the conductive element is electrically connected to the antenna element via the signal transmission line; wherein...

[0008] The conductive layers on the second surface of the radar substrate and the high-frequency substrate are all spaced apart from the peripheral side of the conductive element, forming an annular groove.

[0009] In the radar substrate and the high-frequency substrate, at least one substrate has an isolation groove on its second surface. The annular groove and the isolation groove are used to achieve coupling connection between the conductive layer of the radar substrate and the conductive layer of the high-frequency substrate.

[0010] Optionally, the high-frequency substrate is provided with a fixing groove corresponding to the position of the conductive element, and the second end of the conductive element can be inserted and fixed in the fixing groove of the high-frequency substrate.

[0011] The signal transmission line is a substrate-integrated waveguide, which is used to couple the signal output by the radar chip through the conductive element to the antenna element, and to decouple the signal from the antenna element and output it to the radar chip through the conductive element.

[0012] Optionally, the substrate integrated waveguide is rectangular, and the orthographic projection of the conductive element is located within the edge of the substrate integrated waveguide.

[0013] Optionally, the distance between the conductive element and the signal receiving end of the substrate integrated waveguide is one-quarter wavelength of the radio frequency signal transmitted by the substrate integrated waveguide.

[0014] Optionally, the signal transmission line is disposed on the first surface of the high-frequency substrate;

[0015] The second end of the conductive element extends from the first surface of the high-frequency substrate and is electrically connected to the signal transmission line.

[0016] Optionally, the radar chip has multiple signal transmission terminals;

[0017] The number of conductive components and signal transmission lines is multiple. The first end of each conductive component extends from the first surface of the radar substrate and is electrically connected to the signal transmission end of the radar chip. The second end of each conductive component is connected to the antenna element through a signal transmission line.

[0018] Optionally, the isolation groove is a concave groove, and the conductive layer between the concave groove and the annular groove forms a strip of predetermined length, so that the conductive layers of the two substrates are coupled and connected through the strip of strip.

[0019] Optionally, the preset length is one-quarter of the wavelength of the radio frequency signal transmitted by the signal transmission line.

[0020] Optionally, the number of isolation grooves is multiple, and the multiple isolation grooves are disposed on the second surface of the radar substrate or the high-frequency substrate; or, the multiple isolation grooves are disposed on the second surface of the radar substrate and the high-frequency substrate respectively.

[0021] The present invention also proposes a millimeter-wave radar, which includes the radar components described above.

[0022] In this invention, the antenna element and radar chip are separated and placed on two different substrates. When a user needs an antenna with different performance specifications, only the corresponding high-frequency substrate needs to be replaced, without replacing the entire assembly. This allows the radar assembly to flexibly switch between antennas with different performance specifications, improving its flexibility and applicability. Furthermore, the high-frequency substrate containing the antenna element needs to be made of high-frequency materials, while the radar substrate containing the radar chip can be made of ordinary FR4 material, simplifying the manufacturing process. Separating the antenna element and radar chip onto two different substrates saves on the amount of high-frequency material used, avoids the complex process of manufacturing composite boards, reduces the manufacturing difficulty and production cost of the radar assembly, and solves the problem of low flexibility in existing radar assemblies. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0024] Figure 1 This is a top view of an embodiment of the radar component of the present invention.

[0025] Figure 2 This is a side view cross-sectional structural diagram of an embodiment of the radar component of the present invention;

[0026] Figure 3 This is a schematic diagram of a substrate-integrated waveguide structure;

[0027] Figure 4 This is a schematic diagram of the structure of an embodiment of the radar component of the present invention;

[0028] Figure 5 This is a schematic diagram of another embodiment of the radar component of the present invention;

[0029] Figure 6 This is a top cross-sectional view of an embodiment of the radar component of the present invention;

[0030] Figure 7 This is a top cross-sectional view of another embodiment of the radar component of the present invention;

[0031] Figure 8 This is a top cross-sectional view of another embodiment of the radar component of the present invention;

[0032] Figure 9 This is a top-view cross-sectional structural diagram of another embodiment of the radar component of the present invention.

[0033] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0034] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0035] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0036] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0037] This invention proposes a radar component.

[0038] Currently, radar boards typically integrate the antenna and other chips onto the same PCB, forming a single-board radar system. The advantage is high integration, but the disadvantages are also obvious. For example, if antennas with different performance specifications are required, the entire PCB must be redesigned, even though other parts besides the antenna do not need to be changed. Furthermore, to ensure performance, the antenna section usually needs to be fabricated using a high-frequency material substrate, while the rest can use ordinary FR4. A single-board radar system must use PCB fabrication technology with two different substrates, making manufacturing more difficult.

[0039] To solve the above problems, refer to Figures 1 to 9 In one embodiment, the radar component includes:

[0040] A radar substrate has a first surface and a second surface disposed opposite to each other. A radar chip is disposed on the first surface of the radar substrate, and a conductive layer and an insulating film disposed on the conductive layer are disposed on the second surface of the radar substrate.

[0041] A high-frequency substrate has a first surface and a second surface disposed opposite to each other. An antenna element is disposed on the first surface of the high-frequency substrate, and a conductive layer and an insulating film disposed on the conductive layer are disposed on the second surface of the high-frequency substrate. A signal transmission line is also disposed on the high-frequency substrate, and the second surface of the high-frequency substrate is attached to the second surface of the radar substrate.

[0042] A conductive element, wherein a first end of the conductive element extends from a first surface of the radar substrate and is electrically connected to the radar chip, and a second end of the conductive element is electrically connected to the antenna element via the signal transmission line; wherein...

[0043] The conductive layers on the second surface of the radar substrate and the high-frequency substrate are all spaced apart from the peripheral side of the conductive element, forming an annular groove.

[0044] In the radar substrate and the high-frequency substrate, at least one substrate has an isolation groove on its second surface. The annular groove and the isolation groove are used to achieve coupling connection between the conductive layer of the radar substrate and the conductive layer of the high-frequency substrate.

[0045] In this embodiment, the radar assembly consists of a radar substrate and a high-frequency substrate. To ensure the transmission performance of the antenna, the high-frequency substrate is made of a high-frequency material, while the radar substrate can be made of ordinary FR4 material. Each substrate has a first surface and a second surface arranged opposite to each other. The first surface of the radar substrate is used to mount the radar chip and other components, while the first surface of the high-frequency substrate is used to mount the antenna elements. Both the radar substrate and the high-frequency substrate have a conductive layer, which serves as a ground plane. The conductive layer can be implemented using a conductive medium such as copper plating.

[0046] To ensure a reliable connection between the inner and outer conductors, the radar assembly also includes conductive components, which can be implemented using probes or other conductive elements. The first end of the conductive component extends beyond the first surface of the radar substrate and is electrically connected to the radar chip. The second end of the conductive component is connected to the antenna element via a signal transmission line. It is understood that the conductive component can be configured according to the type of signal transmission line. For example, when the signal transmission line is a microstrip line or a coplanar waveguide, the second end of the conductive component can extend beyond the first surface of the high-frequency substrate and be connected to the signal transmission line by means of soldering, thereby achieving signal transmission between the radar chip and the antenna / element. When the signal transmission line is a substrate-integrated waveguide, the second end of the conductive component does not need to extend beyond the high-frequency substrate; that is, it can be disposed within the dielectric layer of the high-frequency substrate, allowing the conductive component to be coupled to the substrate-integrated waveguide, achieving signal transmission between the radar chip and the antenna / element without soldering. In addition, the conductive layer and the conductive component can be spaced apart by etching and other processing methods, so that an insulating annular groove is formed between the conductive layer and the conductive component to avoid direct connection between the conductive component and the conductive medium of the conductive layer. The annular groove can be circular, elliptical, polygonal or other shapes, and the size and shape of the annular groove on the two substrates can be different.

[0047] This invention eliminates the connectors that interconnect the two ground planes and tightly attaches the ground planes of the radar substrate and the high-frequency substrate together, reducing both cost and the overall size of the radar assembly. However, an insulating film is still provided on the ground planes of the two substrates. This insulating film can be a solder resist film or an insulating film formed by other insulating media. Thus, when the ground planes of the two substrates are attached together, the insulating film between the two ground planes forms an insulating layer. Therefore, to ensure a reliable connection between the inner and outer conductors, the key to solving the problem is to achieve an electrical connection between the two ground planes.

[0048] A radio frequency (RF) transmission line is a distributed parameter transmission line, meaning its transmission characteristics vary with location. In transmission line theory, when a transmission line with a characteristic impedance of Z0 is terminated by a load with an impedance of ZL, the input impedance Zin looking towards this transmission line will no longer be Z0. The following is the transmission line impedance equation:

[0049]

[0050] Among them, Z in Z is the input impedance, Z0 is the characteristic impedance, and Z L Let β be the terminating impedance, β = 2π / λ, λ be the wavelength of the signal propagating on the transmission line, and l be the length of the transmission line.

[0051] From the transmission line impedance equation, we know that when the transmission line length l is 1 / 4λ, tanβl=tan(π / 2) is infinite. According to the concept of limits, Z0 and Z in the numerator and denominator are... LNegligible, therefore, the impedance transformation formula is obtained when the transmission line length l is 1 / 4λ:

[0052]

[0053] From the above equation, it can be seen that when the transmission line length l is 1 / 4λ, if the termination is open-circuited, then Z L Infinity, at this time Z in Approximately equal to 0; conversely, if short-circuited, then Z... L When Z equals 0, Z is equal to 0. in The value is infinite, and this is the quarter-wavelength transmission rule of transmission lines. That is, when one end of a transmission line is open, after 1 / 4 wavelength, its characteristic is that of a "short circuit." In other words, radio frequency signals can be transmitted at the "short-circuited" end of the transmission line, achieving coupling with adjacent conductors. Based on this, this invention utilizes this characteristic of transmission lines to achieve a non-contact common ground between two substrates. A non-contact common ground between the two substrates can be achieved by setting an isolation groove on the grounding surface of either the radar substrate or the high-frequency substrate. The following explanation uses setting an isolation groove on the grounding surface of the radar substrate as an example. (Refer to...) Figure 6 , Figure 6 This is a schematic diagram of a radar component embodiment. An isolation groove is formed on the grounding surface of the radar substrate near the annular groove. This isolation groove is concave, isolating the conductive medium between the isolation groove and the annular groove from the conductive medium outside the isolation groove. The conductive medium between the isolation groove and the annular groove forms a strip. The length of this strip is a preset length, which can be set according to the frequency of the signal transmitted by the substrate during use and the dielectric constant of the insulating film. The preset length is approximately 1 / 4 wavelength of the signal transmitted by the signal transmission line. In this case, the strip forms a 1 / 4 wavelength transmission line. Since both ends of the strip are open, according to the aforementioned 1 / 4 wavelength transmission rule, the radio frequency signal is actually "short-circuited" at the open point. In other words, the radio frequency signal can electrically pass through the insulating film and connect at both ends of the strip. That is, the ground planes of the upper and lower substrates can be electrically connected through the strip, thus solving the electrical connection problem between the ground planes of the two substrates. In addition, the isolation groove can also be a strip groove. Similar to the strip transmission belt, the length of the strip groove is also 1 / 4 wavelength of the signal transmitted by the signal transmission line. The ground planes of the upper and lower substrates can also be coupled and connected through the strip groove.

[0054] In this invention, by separating the antenna element and the radar chip onto two different substrates, when a user needs an antenna with different performance specifications, only the corresponding high-frequency substrate needs to be replaced, without replacing the entire assembly. This allows the radar assembly to flexibly switch between antennas with different performance specifications, improving its flexibility and applicability. Furthermore, the high-frequency substrate containing the antenna element requires high-frequency materials, while the radar substrate containing the radar chip can be made of ordinary FR4 material, simplifying the manufacturing process. Separating the antenna element and radar chip onto two different substrates saves on the amount of high-frequency materials used, avoids the complex process of manufacturing composite boards, and reduces the manufacturing difficulty and production cost of the radar assembly. Simultaneously, designing the substrates for the antenna element and radar chip separately allows for a more rational design of the substrate layout, thereby reducing the overall area of ​​the radar assembly and lowering its manufacturing cost. This invention, by incorporating conductive elements, enables signal transmission between the antenna element and the radar chip, thereby achieving electrical connection of the radar assembly's internal conductors. Simultaneously, by placing conductive elements within the substrate and extending them beyond the first surface of the radar substrate to electrically connect with the radar chip, the length of the signal transmission line is effectively reduced, thus minimizing transmission loss and improving signal accuracy. Furthermore, by incorporating annular grooves and isolation grooves, this invention allows for electrical connection between the ground planes of two substrates simply by bringing their ground planes into close contact. This satisfies the need for electrical connection of the radar assembly's external conductors while simplifying assembly by eliminating connectors and other components. This not only reduces the overall cost but also decreases the overall size of the radar assembly, making it more compact and suitable for applications with high cost requirements and limited installation space, thus improving the practicality and reliability of the radar assembly.

[0055] Reference Figures 1 to 9 In one embodiment, the high-frequency substrate is provided with a fixing groove corresponding to the position of the conductive element, and the second end of the conductive element can be inserted and fixed in the fixing groove of the high-frequency substrate.

[0056] The signal transmission line is a substrate-integrated waveguide, which is used to couple the signal output by the radar chip through the conductive element to the antenna element, and to decouple the signal from the antenna element and output it to the radar chip through the conductive element.

[0057] In this embodiment, the high-frequency substrate is further provided with a fixing groove for pluggable fixation of a conductive component. Thus, when the high-frequency substrate and the radar substrate are bonded together, one end of the conductive component can extend into the fixing groove, i.e., be inserted into the fixing groove, thereby allowing the conductive component to be pluggable and fixed within the fixing groove. This allows the high-frequency substrate and the radar substrate to be pluggable and fixed together through the conductive component and the fixing groove. When the high-frequency substrate has a fixing groove, the corresponding signal transmission line on the high-frequency substrate is a substrate integrated waveguide, also known as a substrate integrated waveguide or dielectric integrated waveguide. The substrate integrated waveguide utilizes metal vias on the dielectric substrate to achieve waveguide field propagation. In other words, as... Figure 3 As shown, Figure 3 This is a schematic diagram of a substrate-integrated waveguide embodiment. The substrate-integrated waveguide is formed by using PCB, LTCC or thin film technology to form two rows of metal vias on the substrate, so that electromagnetic waves are confined within a rectangular cavity formed by the two rows of metal vias and the upper and lower metal boundaries, thereby forming a microwave transmission line such as the substrate-integrated waveguide.

[0058] Optionally, the substrate integrated waveguide is rectangular, and the orthographic projection of the conductive element is located within the edge of the substrate integrated waveguide.

[0059] In this embodiment, the fixing slot of the high-frequency substrate is set within the rectangle enclosed by the substrate integrated waveguide, so that when the conductive component is plugged in and fixed in the fixing slot, the orthographic projection of the conductive component is located within the edge of the substrate integrated waveguide, thereby enabling the conductive component to be coupled to the substrate integrated waveguide in a coupled excitation manner, thereby realizing signal transmission between the radar chip and the antenna and components.

[0060] Optionally, the distance between the conductive element and the signal receiving end of the substrate integrated waveguide is one-quarter wavelength of the radio frequency signal transmitted by the substrate integrated waveguide.

[0061] Reference Figure 4 , Figure 4 This is a schematic diagram of a radar component embodiment. The conductive element is disposed within a rectangle enclosed by a substrate integrated waveguide. According to the aforementioned 1 / 4 wavelength transmission rule, the distance between the conductive element and one end of the substrate integrated waveguide is set to approximately one-quarter wavelength of the radio frequency signal transmitted by the substrate integrated waveguide. In this way, the conductive element can be coupled to one end of the substrate integrated waveguide in a coupled excitation manner, thereby realizing signal transmission between the radar chip and the antenna and components.

[0062] In this invention, a fixing slot is created at a corresponding position on the high-frequency substrate, allowing the high-frequency substrate and the radar substrate to be fixed together via a pluggable conductive component. This eliminates the need for soldering, enabling electrical connection between the conductive component and the integrated waveguide on the substrate, thus facilitating signal transmission between the radar chip and the antenna / component. This design makes the assembly and disassembly of the radar assembly more convenient. When different antenna performance specifications are required, users only need to directly replace the corresponding high-frequency substrate with the radar substrate for assembly, without replacing the entire assembly, thus improving the applicability and practicality of the radar assembly.

[0063] Reference Figures 1 to 9 In one embodiment, the signal transmission line is disposed on a first surface of the high-frequency substrate;

[0064] The second end of the conductive element extends from the first surface of the high-frequency substrate and is electrically connected to the signal transmission line.

[0065] In this embodiment, the signal transmission line can be a microstrip line, coplanar waveguide, or other similar signal transmission line. The signal transmission line is disposed on the first surface of the high-frequency substrate. Thus, the second end of the conductive element can extend from the first surface of the high-frequency substrate and be fixedly connected to the signal transmission line by means of welding or other methods, thereby electrically connecting the conductive element and the signal transmission line, and realizing signal transmission between the radar chip and the antenna / component. (Refer to...) Figure 5 , Figure 5 This is a schematic diagram of a radar assembly embodiment. The signal transmission line in the diagram is a microstrip line. The second end of a conductive element extends from the first surface of the high-frequency substrate and is soldered to the microstrip line, thereby realizing signal transmission between the radar chip and the patch antenna. This configuration allows the conductive element to be directly electrically connected to the signal transmission line, reducing signal transmission loss and improving signal transmission stability. It is suitable for applications with high signal transmission requirements, thus improving the stability and practicality of the radar assembly.

[0066] Reference Figures 1 to 9 In one embodiment, the radar chip has multiple signal transmission terminals;

[0067] The number of conductive components and signal transmission lines is multiple. The first end of each conductive component extends from the first surface of the radar substrate and is electrically connected to the signal transmission end of the radar chip. The second end of each conductive component is connected to the antenna element through a signal transmission line.

[0068] Understandably, radar chips are becoming increasingly functional with technological advancements, resulting in a greater number of functional pins, or signal transmission terminals. Therefore, in this embodiment, multiple conductive components and signal transmission lines are used, each corresponding to a different signal transmission terminal of the radar chip. By connecting the radar chip to the antenna element using these multiple conductive components and signal transmission lines, the radar chip can send different control signals to the antenna element through different signal transmission terminals and conductive components, thus achieving multi-dimensional control of the antenna element by the radar chip. The multiple conductive components and signal transmission lines can be configured according to actual practical needs. For example, all signal transmission lines can be substrate-integrated waveguides or microstrip lines, or a combination of substrate-integrated waveguides and microstrip lines. The conductive components are configured to correspond to the type of signal transmission line, thereby meeting the different transmission requirements of the antenna element and improving the applicability and practicality of the radar assembly.

[0069] Reference Figures 1 to 9 In one embodiment, the isolation groove is a concave groove, and the conductive layer between the concave groove and the annular groove forms a strip of predetermined length, so that the conductive layers of the two substrates are coupled and connected through the strip of predetermined length.

[0070] Reference Figure 6 , Figure 6 This is a schematic diagram of a radar assembly embodiment. In one embodiment, the isolation groove is configured as a concave groove. With this configuration, the conductive medium between the concave groove and the annular groove forms a strip, and the length of this strip is set to a preset length. The preset length can be set according to the frequency of the signal transmitted by the substrate during use and the dielectric constant of the insulating film. It is understood that the linewidth of the transmission line affects its transmission characteristics, such as characteristic impedance, capacitance, and inductance. When other physical parameters of the transmission line are constant, a larger linewidth results in more dispersed current, lower inductance and characteristic impedance, and a larger unit capacitance. Therefore, the width of the strip transmission band can be set according to actual usage requirements to ensure a stable electrical connection between the ground planes of the two substrates, thereby improving the stability and applicability of the radar assembly.

[0071] Optionally, the preset length is one-quarter of the wavelength of the radio frequency signal transmitted by the signal transmission line.

[0072] In one embodiment, the length of the strip transmission band is one-quarter of the wavelength of the radio frequency signal transmitted by the signal transmission line. Since both ends of the strip transmission band are open, according to the 1 / 4 wavelength transmission rule of transmission lines, the radio frequency signal is actually "short-circuited" at the open point. In other words, the radio frequency signal is electrically connected at both ends of the strip transmission band. That is, the ground planes of the upper and lower substrates can be electrically connected through the strip transmission band, i.e., the ground planes of the upper and lower substrates can be coupled and connected through the strip transmission band, thereby solving the problem of electrical connection between the ground planes of the two substrates. This invention utilizes the 1 / 4 wavelength transmission rule of transmission lines, setting the length of the strip transmission band to one-quarter of the wavelength of the radio frequency signal transmitted by the signal transmission line, to achieve electrical connection between the ground planes of the two substrates, eliminating the need for connectors and other parts. This not only reduces the overall cost of the radar assembly but also reduces the overall size of the radar assembly, improving its practicality and applicability.

[0073] Furthermore, it is understandable that, according to the quarter-wavelength transmission rule of transmission lines, setting the length of the strip transmission band to one-quarter of the wavelength of the radio frequency signal transmitted by the signal transmission line can achieve an electrical connection between the ground planes of the two substrates. Therefore, the shape of the strip transmission band can be set according to the actual usage requirements of the radar component. For example, the sidewalls of the strip transmission band can be curved, meaning the transmission path of the strip transmission band can be curved. In this way, the shape of the strip transmission band can be set according to the actual usage requirements of the radar component, meeting various application scenarios and improving the practicality and applicability of the radar component.

[0074] Alternatively, the width of the strip conveyor belt can be set to zero; in other words, the isolation groove is rectangular, such as... Figure 7 As shown, Figure 7 This is a schematic diagram of a radar assembly embodiment. The isolation groove in the figure is a strip-shaped groove, which is equivalent to a transmission groove line. The length of the strip-shaped groove can be set according to the frequency of the signal transmitted by the substrate during use and the dielectric constant of the insulating film. In addition, setting the isolation groove as a strip-shaped groove can reduce the molding difficulty of the isolation groove, thereby reducing the production cost of the radar assembly and facilitating the mass production of the radar assembly.

[0075] Optionally, the length of the slot is one-quarter of the wavelength of the radio frequency signal transmitted by the radio frequency signal transmission line.

[0076] Understandably, similar to the strip transmission band mentioned above, according to the 1 / 4 wavelength transmission rule of transmission lines, the length of the strip groove is set to one-quarter wavelength of the radio frequency signal transmitted by the signal transmission line. The transmission groove formed by the strip groove can also make the ground planes of the upper and lower substrates electrically connected through the transmission groove. That is, the ground plane of the radar substrate and the ground plane of the high frequency substrate can be coupled and connected through the transmission groove, thereby solving the problem of electrical connection between the ground planes of the two substrates.

[0077] Reference Figures 1 to 9 In one embodiment, the number of isolation grooves is multiple, and the multiple isolation grooves are disposed on the second surface of the radar substrate or the high-frequency substrate; or, the multiple isolation grooves are disposed on the second surface of the radar substrate and the high-frequency substrate respectively.

[0078] It is understandable that by setting an isolation groove, i.e., forming a strip-shaped transmission belt, an electrical connection can be achieved between the ground plane of the radar substrate and the ground plane of the high-frequency substrate. Similarly, setting multiple isolation grooves, forming multiple strip-shaped transmission belts or multiple transmission groove lines, can also achieve an electrical connection between the ground plane of the radar substrate and the ground plane of the high-frequency substrate, and can improve the stability of the electrical connection between the two substrates. In one embodiment, referring to... Figure 9 , Figure 9 This is a schematic diagram of a radar assembly embodiment. Multiple isolation slots are arranged around the periphery of an annular groove. It is understood that the multiple isolation slots can be all located on the radar substrate, or some can be located on the high-frequency substrate and others on the radar substrate, depending on actual usage requirements. When multiple isolation slots are located on the same substrate, the production process of the radar assembly can be reduced, thereby lowering the production cost and facilitating large-scale production. When multiple isolation slots are located on the second surfaces of the radar substrate and the high-frequency substrate, the stability of the ground electrical connection between the two substrates can be further improved, thus enhancing the stability and practicality of the radar assembly. Furthermore, the multiple isolation slots can be different; for example, they can have different shapes, such as forming strips or transmission lines with different shapes. The connection between the multiple isolation slots and the annular groove can also vary. The shape and connection status of the multiple isolation slots can be configured according to actual usage requirements, allowing the radar assembly to be applied to various scenarios and improving its applicability.

[0079] The present invention also proposes a millimeter-wave radar, which includes the radar component described above. The specific structure of the radar component is as described in the above embodiments. Since the millimeter-wave radar adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0080] The above description is merely a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention's specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A radar assembly, characterized by The radar assembly comprises: a radar substrate having first and second surfaces arranged oppositely, the first surface of the radar substrate being provided with a radar chip, and the second surface of the radar substrate being provided with a conductive layer and an insulating film arranged on the conductive layer; a high-frequency substrate having first and second surfaces arranged oppositely, the first surface of the high-frequency substrate being provided with an antenna element, and the second surface of the high-frequency substrate being provided with a conductive layer and an insulating film arranged on the conductive layer, and the high-frequency substrate being further provided with a signal transmission line, and the second surface of the high-frequency substrate being arranged in abutment with the second surface of the radar substrate; a conductive member, a first end of the conductive member extending from the first surface of the radar substrate and being electrically connected with the radar chip, and a second end of the conductive member being electrically connected with the antenna element through the signal transmission line; wherein the conductive layers on the second surfaces of the radar substrate and the high-frequency substrate are arranged in spaced relation with the periphery of the conductive member, forming an annular groove; in the radar substrate and the high-frequency substrate, at least one substrate is provided with an isolation groove on the second surface, and the annular groove and the isolation groove are used to achieve coupling connection between the conductive layer of the radar substrate and the conductive layer of the high-frequency substrate.

2. The radar assembly of claim 1, wherein, the high-frequency substrate is provided with a fixing groove at a position corresponding to the conductive member, and the second end of the conductive member is pluggably fixed in the fixing groove of the high-frequency substrate; the signal transmission line is a substrate integrated waveguide, which is used to couple signals output by the radar chip through the conductive member to the antenna element, and to decouple signals from the antenna element and output the signals to the radar chip through the conductive member.

3. The radar assembly of claim 2, wherein, the substrate integrated waveguide is arranged in a rectangular shape, and the orthographic projection of the conductive member is located within the edge of the substrate integrated waveguide.

4. The radar assembly of claim 3, wherein, the distance between the conductive member and the signal receiving end of the substrate integrated waveguide is one-quarter of the wavelength of the radio frequency signals transmitted by the substrate integrated waveguide.

5. The radar assembly of claim 1, wherein, the signal transmission line is arranged on the first surface of the high-frequency substrate; the second end of the conductive member extends from the first surface of the high-frequency substrate and is electrically connected with the signal transmission line.

6. The radar assembly of claim 1, wherein, the radar chip has a plurality of signal transmission ends; the number of the conductive members and the signal transmission lines is plural, a first end of each of the conductive members extends from the first surface of the radar substrate and is electrically connected with a signal transmission end of the radar chip, and a second end of each of the conductive members is connected with the antenna element through a signal transmission line.

7. The radar assembly of claim 1, wherein, the isolation groove is a concave groove, and the conductive layer between the concave groove and the annular groove forms a strip-shaped transmission band of a preset length, so that the conductive layers of the two substrates are coupled and connected through the strip-shaped transmission band.

8. The radar assembly of claim 7, wherein, the preset length is one-quarter of the wavelength of the radio frequency signals transmitted by the signal transmission line.

9. The radar assembly of claim 1, wherein, the number of the isolation grooves is plural, and the plural isolation grooves are arranged on the second surface of the radar substrate or the high-frequency substrate, or the plural isolation grooves are arranged on the second surfaces of the radar substrate and the high-frequency substrate.

10. A millimeter wave radar, characterized by, The radar assembly comprises any one of claims 1-9.

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