Display panel and display device

Abstract

Embodiments of the present application provide a display panel and a display device, and relate to the technical field of display, and are used to effectively improve the reliability of the display panel. The display panel comprises: a display module comprising a display layer, a glue layer and a heat conduction layer stacked, wherein the heat conduction layer is located on one side of the glue layer; a heat dissipation structure located on the backlight side of the display module; and at least one heat conduction connecting structure, one end of the heat conduction connecting structure being connected with the heat conduction layer, and the other end of the heat conduction connecting structure being bent from the side surface of the display module to the backlight side of the display module and connected with the heat dissipation structure.

Description

[0001] The present application relates to the technical field of display, in particular to a display panel and a display device.

[0002] Compared with a conventional display panel, the flexible display panel has greater freedom in design, which increases the portability of the display device and expands the use scenarios of the display device.

[0003] The module reliability of the flexible display panel greatly affects the user experience. For example, for a folding display panel, the display panel needs to be bent multiple times during use. If the module reliability is low, the bending failure is likely to occur, which affects the display effect.

[0004] Therefore, the embodiments of the present application provide a display panel and a display device to effectively improve the reliability of the display panel.

[0005] In one aspect, the embodiments of the present application provide a display panel, comprising:

[0006] A display module comprising a display layer, a glue layer and a heat conduction layer stacked, wherein the heat conduction layer is located on one side of the glue layer;

[0007] A heat dissipation structure located on the backlight side of the display module;

[0008] At least one heat conduction connecting structure, one end of the heat conduction connecting structure is connected with the heat conduction layer, and the other end of the heat conduction connecting structure is connected with the heat dissipation structure by being bent from the side of the display module to the backlight side of the display module.

[0009] In another aspect, the embodiments of the present application provide a display device comprising the above display panel.

[0010] One of the above technical solutions has the following beneficial effects:

[0011] In the embodiments of the present application, by adding a heat conduction layer on one side of the glue layer and connecting the heat conduction layer and the heat dissipation structure through the heat conduction connecting structure, the heat released by the whole machine can be conducted to the heat conduction layer and then uniformly conducted to the glue layer to warm up the glue layer. In this way, even when the display panel is applied in a low temperature environment, the glue layer can still maintain a small modulus to maintain good deformation ability, thereby effectively improving the bending and folding performance of the display panel in low temperature. Moreover, the heat for warming up the glue layer in the embodiments of the present application comes from the heat released by the whole machine, which realizes the recycling of the heat and does not need to apply additional heating voltage to the heat conduction layer, so as to avoid additional power consumption. ​​​

[0012] In addition, after the heat-conducting layer is added, if the heat emitted by the heat-dissipating structure is only conducted upward to the heat-conducting layer, the heat-conducting efficiency will be very low. Especially when the display layer is arranged between the heat-dissipating structure and the heat-conducting layer, the film layers in the display layer are mostly high-molecular materials, and the heat-conducting property is very poor. Therefore, when the heat emitted by the heat-dissipating structure is conducted upward through the display layer, the heat-conduction will be poor, and the heat finally conducted to the heat-conducting layer will be very small. The embodiment of the present application sets the heat-conducting connecting structure between the heat-conducting layer and the heat-dissipating structure, uses the heat-conducting structure as the heat transmission path, and effectively improves the heat-conducting efficiency. Moreover, when one end of the heat-conducting connecting structure is connected with the heat-conducting layer, the other end is connected with the heat-dissipating structure by being bent from the side surface of the display module to the backlight side of the display module. The heat-conducting connecting structure does not need to pass through each film layer in the display module, and therefore the heat loss in the heat-conduction process can be reduced, more heat can be received by the heat-conducting layer, and the high-efficiency and rapid heating of the adhesive layer can be realized. BRIEF DESCRIPTION OF DRAWINGS

[0013] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed in the embodiments will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative effort on the basis of these drawings.

[0014] Figure 1 A top view of the display panel provided by the embodiment of the present application;

[0015] Figure 2 A top view of the display panel provided by the embodiment of the present application; Figure 1 A sectional view along the A1-A2 direction;

[0016] Figure 3 A change curve of the modulus-temperature of the adhesive layer provided by the embodiment of the present application;

[0017] Figure 4 A change curve of the modulus-temperature of the flexible substrate provided by the embodiment of the present application;

[0018] Figure 5 Another top view of the display panel provided by the embodiment of the present application;

[0019] Figure 6 Another top view of the display panel provided by the embodiment of the present application;

[0020] Figure 7 A structural schematic view of the heat-conducting layer provided by the embodiment of the present application;

[0021] Figure 8 Another structural schematic view of the heat-conducting layer provided by the embodiment of the present application;

[0022] Figure 9 A schematic diagram of another structure of the heat-conducting layer provided in an embodiment of the present invention;

[0023] Figure 10 A schematic diagram of a cross-sectional structure of a display panel provided by an embodiment of the present invention;

[0024] Figure 11 A schematic diagram of another cross-sectional structure of a display panel provided by an embodiment of the present invention;

[0025] Figure 12 A schematic diagram of another cross-sectional structure of a display panel provided by an embodiment of the present invention;

[0026] Figure 13 A schematic diagram of another cross-sectional structure of a display panel provided by an embodiment of the present invention;

[0027] Figure 14 A schematic diagram of the connection between the heat-conducting layer and the heat-conducting connection structure provided by an embodiment of the present invention;

[0028] Figure 15 A schematic diagram of another cross-sectional structure of a display panel provided by an embodiment of the present invention;

[0029] Figure 16 A schematic diagram of another cross-sectional structure of a display panel provided by an embodiment of the present invention;

[0030] Figure 17 A schematic diagram of another cross-sectional structure of a display panel provided by an embodiment of the present invention;

[0031] Figure 18 Another top view of the display panel provided by the embodiment of the present invention;

[0032] Figure 19 for Figure 18 A cross-sectional view along B1-B2;

[0033] Figure 20 Another top view of the display panel provided by the embodiment of the present invention;

[0034] Figure 21 A schematic structural diagram of a display device provided by an embodiment of the present invention. [Specific implementation method]

[0035] In order to better understand the technical solution of the present invention, the embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0036] It should be noted that the embodiments described are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the present application.

[0037] The terms used in the embodiments of the present application are merely for the purpose of describing specific embodiments, and are not intended to limit the present application. The singular forms "a", "said" and "the" used in the embodiments of the present application and the appended claims are also intended to include the plural forms, unless the context clearly indicates otherwise.

[0038] It should be understood that the term "and / or" used herein is only to describe the association relationship of the associated objects, which means that there can be three relationships, for example, A and / or B, which can represent the three cases of A alone, A and B together, and B alone. In addition, the character " / " herein generally represents an "or" relationship between the front and rear associated objects.

[0039] The display panel usually has a glue layer to bond the upper and lower two-layer structures, and the inventors have found that the modulus of the glue layer used in the display panel changes with temperature during research.

[0040] Generally, the application temperature of the display panel is between -30℃ and 60℃, and the inventors have tested the modulus of the two glue layers in this temperature range. According to the change of the modulus of the two glue layers with temperature shown in Table 1, it can be seen that the modulus of the glue layer will increase significantly at low temperature. The increase of the modulus of the glue layer will cause the ability of the glue layer to reduce the decoupling stress to decrease and the rigidity to increase, thus affecting the reliability of the display panel module, and further causing the display panel to have insufficient reliability at low temperature, and easily causing bending and folding failure.

[0041] Table 1

[0042] Temperature (°C) / Modulus (MPa) -30 -25 -20 -15 -10 0 20 40 60 Adhesive layer 1 186 118 88 71 60 50 42 36 35 Adhesive layer 2 2208 717 375 258 177 121 104 97 90

[0043] To this end, the embodiments of the present application provide a display panel, as shown in Figure 1 and Figure 2 , Figure 1 is a top view of the display panel provided by the embodiments of the present application, Figure 2 is Figure 1 a sectional view along the A1-A2 direction, the display panel comprising a display module 1, a heat dissipation structure 2 and at least one heat-conducting connecting structure 3.

[0044] The display module 1 comprises a display layer 4, a glue layer 5 and a heat conduction layer 6 which are stacked. The display layer 4 can comprise a flexible substrate and a pixel circuit layer and a light emitting device layer carried on the flexible substrate; the glue layer 5 is located on one side of the display layer 4, for example, on the side of the display layer 4 facing the light emitting surface of the display panel or on the side of the display layer 4 away from the light emitting surface of the display panel; and the heat conduction layer 6 is located on one side of the glue layer 5. In the embodiment of the application, the heat conduction layer 6 can be in contact with the surface of the glue layer 5.

[0045] The heat dissipation structure 2 is located on the backlight side of the display module 1. The heat dissipation structure 2 is used to dissipate heat of the whole machine and uniformly distribute the heat to avoid overheating in local areas. The heat dissipation structure 2 can be a copper foil, a graphite film or the like.

[0046] One end of the heat conduction connecting structure 3 is connected with the heat conduction layer 6, and the other end of the heat conduction connecting structure 3 is bent from the side of the display module 1 to the backlight side of the display module 1 and connected with the heat dissipation structure 2.

[0047] In the embodiment of the application, by adding the heat conduction layer 6 on one side of the glue layer 5 and connecting the heat conduction layer 6 and the heat dissipation structure 2 by the heat conduction connecting structure 3, the heat released by the whole machine can be conducted to the heat conduction layer 6 and then uniformly conducted to the glue layer 5 to warm up the glue layer 5. Figure 3 As shown in the glue layer modulus-temperature change curve, if the glue layer 5 is not warmed up, the glue layer 5 will have a high modulus (the change curve of the modulus is indicated by a dashed line) in the application temperature range when the display panel is applied below 0℃. However, by warming up the glue layer 5 by the heat of the heat dissipation structure 2, the modulus of the glue layer 5 can be reduced (the change curve of the modulus is indicated by a solid line) in the application temperature range. In this way, even when the display panel is applied in a low temperature environment, the glue layer 5 can still have a small modulus to keep a good deformation ability of the glue layer 5, thereby effectively improving the bending and folding performance of the display panel in a low temperature. Moreover, the heat for warming up the glue layer 5 comes from the heat released by the whole machine, which realizes the recycling of the heat and does not need to apply an additional heating voltage to the heat conduction layer 6, thereby avoiding additional power consumption.

[0048] In addition, if the heat emitted by the heat dissipation structure 2 is only conducted to the heat conduction layer 6 by itself, the heat conduction efficiency will be low. Especially when the display layer 4 is arranged between the heat dissipation structure 2 and the heat conduction layer 6, the film layers in the display layer 4 are mostly high-molecular materials, and the heat conduction property is very poor. Therefore, when the heat emitted by the heat dissipation structure 2 is conducted to the heat conduction layer 6 through the display layer 4, the heat conduction is not smooth, and the heat finally conducted to the heat conduction layer 6 is very small. However, in the embodiment of the present application, the heat conduction connecting structure 3 is arranged between the heat conduction layer 6 and the heat dissipation structure 2, and the heat conduction connecting structure 3 is used as a heat transmission path, thereby effectively improving the heat conduction efficiency. In addition, when one end of the heat conduction connecting structure 3 is connected to the heat conduction layer 6, the other end is bent from the side surface of the display module 1 to the backlight side of the display module 1 and connected to the heat dissipation structure 2. The heat conduction connecting structure 3 does not need to pass through each film layer in the display module 1, thereby reducing the heat loss in the heat conduction process, allowing the heat conduction layer 6 to receive more heat, and thereby achieving efficient and rapid heating of the adhesive layer 5.

[0049] In addition, it should be further pointed out that, in combination with the above description, Figure 4 As can be seen from the flexible substrate modulus-temperature change curve shown in the figure, in the range of-50℃-150℃, the modulus of the flexible substrate is hardly affected by the temperature, and can be maintained constant. Therefore, even if the heat received by the heat conduction layer 6 increases the temperature near the flexible substrate, it will not affect the modulus of the flexible substrate, and thus will not affect the deformation ability of the flexible substrate.

[0050] In a feasible implementation manner, referring to Figure 1 The display panel includes a bending area 7 and a planar area 8 located on both sides of the bending area 7, and at least part of the heat conduction layer 6 is located in the bending area 7.

[0051] The display panel with the above structure can be a folding display panel. Since the bending area 7 needs to be repeatedly bent during use, the deformation ability of the adhesive layer 5 in the bending area 7 will more greatly affect the folding reliability of the display panel. Therefore, in the embodiment of the present application, at least part of the heat conduction layer 6 is arranged in the bending area 7, so that the adhesive layer 5 in the bending area 7 can be better heated, and the modulus of this part of the adhesive layer 5 is prevented from increasing and the rigidity from increasing at low temperature, thereby reducing the risk of bending failure of the folding display panel at low temperature.

[0052] In a feasible implementation manner, referring to Figure 1 The heat conduction connecting structure 3 is bent from the side surface of the display module 1 to the backlight side of the display module 1 in the planar area 8. In this way, when the display panel is bent, the heat conduction connecting structure 3 will not be bent along with the bending of the display panel, thereby reducing the risk of fracture of the heat conduction connecting structure 3 and improving the connection reliability between the heat conduction layer 6 and the heat dissipation structure 2.

[0053] Further, see again Figure 1 At least part of the heat-conducting connection structure 3 is bent from the side of the display module 1 to the backlight side of the display module 1 on the side of the flat area 8 close to the bending area 7, so as to more quickly conduct heat to the heat-conducting layer 6 near the bending area 7, thereby quickly heating the glue layer 5 in the bending area 7.

[0054] For example, in one configuration, see Figure 1 , the heat conducting layer 6 can cover the entire bending area 7 and the plane area 8. In this case, all the heat conducting connection structures 3 can be set to bend from the side of the display module 1 to the backlight side of the display module 1 on the side of the plane area 8 close to the bending area 7, or, as shown in FIG. Figure 5 As shown, Figure 5 Another top view of the display panel provided in an embodiment of the present invention may also be that part of the heat-conducting connection structure 3 is set to bend from the side of the display module 1 to the backlight side of the display module 1 on the side of the plane area 8 close to the bending area 7, and part of the heat-conducting structure is bent from the side of the display module 1 to the backlight side of the display module 1 on the side of the plane area 8 away from the bending area 7, so as to introduce heat to the heat-conducting layer 6 more evenly.

[0055] Or, in another setup, such as Figure 6 As shown, Figure 6 In another top view of the display panel provided in an embodiment of the present invention, the heat-conducting layer 6 may also only partially cover the bending area 7 and the area of ​​the flat area 8 close to the bending area 7. In this case, all the heat-conducting connection structures 3 may be set to bend from the side of the display module 1 to the backlight side of the display module 1 on the side of the flat area 8 close to the bending area 7.

[0056] In addition, the embodiment of the present invention does not impose any specific restrictions on the number of the provided heat-conducting connection structures 3, and the sizes of different heat-conducting connection structures 3 can be the same or different. Figure 1 , at least two heat-conducting connection structures 3 have different sizes.

[0057] In a possible embodiment, the thermal conductivity of the heat conducting layer 6 in the bending region 7 is higher than that in the flat region 8 .

[0058] It is understandable that when the display panel bends, the adhesive layer 5 in the bending region 7 experiences greater strain, while the adhesive layer 5 in the flat region 8 experiences less strain. Therefore, by designing the thermal conductivity of the heat-conducting layer 6 differently in different regions, more heat can be transferred to the adhesive layer 5 in the bending region 7, maintaining a lower modulus for the adhesive layer 5 in the bending region 7 and making it easier to bend.

[0059] In one possible implementation, Figure 7 As shown, Figure 7A structure diagram of the heat-conducting layer 6 provided by the embodiment of the present application is shown in FIG. 1. The heat-conducting layer 6 comprises a first substrate 9 and first heat-conducting particles 10 filled in the first substrate 9. The density of the first heat-conducting particles 10 in the bending area 7 is greater than the density of the first heat-conducting particles 10 in the planar area 8. In this way, the first heat-conducting particles 10 in the bending area 7 are arranged more closely, so that the heat-conducting layer 6 has better heat-conducting performance in the bending area 7.

[0060] In a feasible implementation, as shown in FIG. 2, Figure 8 Figure 8 A structure diagram of another heat-conducting layer 6 provided by the embodiment of the present application is shown in FIG. 3. The heat-conducting layer 6 comprises a first substrate 9 and first heat-conducting particles 10 filled in the first substrate 9. The thermal expansion coefficient of the first heat-conducting particles 10 in the bending area 7 is less than the thermal expansion coefficient of the first heat-conducting particles 10 in the planar area 8. In a setting mode, different first heat-conducting particles 10 can be filled in the bending area 7 and the planar area 8, so that the first heat-conducting particles 10 in the two areas have different thermal expansion coefficients.

[0061] For the heat-conducting particles with thermal expansion characteristics, the heat-conducting particles expand and separate from each other when heated, and the heat-conducting performance of the heat-conducting particles after separation is low. In the above setting mode, the first heat-conducting particles 10 in the bending area 7 have a smaller thermal expansion coefficient, so that the first heat-conducting particles 10 in this part expand and separate to a smaller extent at a certain temperature, and the arrangement of the first heat-conducting particles 10 after separation is not too dispersed, so that the heat-conducting performance of the heat-conducting layer 6 in the bending area 7 is better.

[0062] In addition, when the first heat-conducting particles 10 have thermal expansion characteristics, the heat-conducting layer 6 can also have the function of adjustable heat conduction. When the display panel is applied in a low-temperature environment, the first heat-conducting particles 10 do not expand, so that the first heat-conducting particles 10 are closely arranged, so that the heat-conducting layer 6 as a whole has good heat-conducting performance, and can better conduct heat to the adhesive layer 5 to effectively heat the adhesive layer 5. When the display panel is applied in a high-temperature environment, the first heat-conducting particles 10 expand and separate when heated, so that the heat-conducting performance of the heat-conducting layer 6 as a whole is reduced, so that the heat-conducting layer 6 does not conduct too much heat to the adhesive layer 5, avoiding overheating of the adhesive layer 5.

[0063] When the heat-conducting performance of the heat-conducting layer 6 in the bending area 7 is higher than the heat-conducting performance in the planar area 8, further, as shown in FIG. 4, Figure 9 Figure 9 ​​In another structure of the heat-conducting layer 6 provided by the embodiment of the present application, the planar region 8 comprises a first sub-region 11 and a second sub-region 12, the second sub-region 12 is located between the first sub-region 11 and the bending region 7, and the heat-conducting layer 6 has a higher heat-conducting performance in the second sub-region 12 than in the first sub-region 11. For example, in one arrangement, the density of the first heat-conducting particles 10 in the second sub-region 12 is greater than that in the first sub-region 11 and less than that in the bending region 7.

[0064] When the display panel is bent, the strain of the adhesive layer 5 decreases along the direction from the bending region 7 to the edge of the planar region 8. In this regard, by also decreasing the heat-conducting performance of the heat-conducting layer 6 in the planar region 8 along the direction from the bending region 7 to the edge of the planar region 8, the heat-conducting capacity of the heat-conducting layer 6 at different positions can be matched with the strain degree of the adhesive layer 5 at the positions. Specifically, in the bending region 7, the strain of the adhesive layer 5 is the largest when the display panel is bent, and thus the heat-conducting performance of the heat-conducting layer 6 in this region can be set to be the largest, so that more heat is conducted to the adhesive layer 5 in this region to rapidly heat the adhesive layer 5, thereby avoiding the increase of the rigidity of the adhesive layer 5 at low temperature to affect the bending. In the position close to the edge of the planar region 8, the strain of the adhesive layer 5 is smaller when the display panel is bent, and thus the heat-conducting performance of the heat-conducting layer 6 in this region can be set to be lower, so that less heat needs to be conducted to the adhesive layer 5 in this region.

[0065] In one possible implementation, as shown in FIG. 6, Figure 10 Figure 10 In one cross-sectional structure of the display panel provided by the embodiment of the present application, the heat-conducting connection structure 3 comprises a heat-conducting adjustment part 13, and the heat-conducting adjustment part 13 has a higher heat-conducting performance when the panel temperature of the display panel is less than a first temperature than when the panel temperature is greater than or equal to the first temperature.

[0066] In the embodiment of the present application, the first temperature can be 60℃. As can be known from Table 1, when the temperature is lower than 60℃, the modulus of the adhesive layer 5 will significantly increase, and thus the heat-conducting adjustment part 13 can have a better heat-conducting performance when the temperature is less than or equal to 60℃, so as to effectively heat the adhesive layer 5 and prevent the modulus of the adhesive layer 5 from increasing.

[0067] ​The embodiment of the present application sets the heat conduction adjusting part 13 with adjustable heat conduction performance in the heat conduction connecting structure 3. When the panel temperature is less than the first temperature, the heat conduction adjusting part 13 has higher heat conduction performance, so that more heat can be conducted to the heat conduction layer 6 to quickly and effectively heat the vicinity of the glue layer 5. When the panel temperature is greater than or equal to the first temperature, the temperature of the display panel is already high, and the glue layer 5 has a small modulus at this temperature, so that the heat conduction adjusting part 13 has lower heat conduction performance at this time, which can avoid conducting too much heat to the heat conduction layer 6, thereby avoiding overheating of the glue layer 5 and the display module 1 as a whole.

[0068] In a feasible implementation, referring to Figure 10 , the heat conduction adjusting part 13 includes a second base material 14 and heat expansion heat conduction particles 15 filled in the second base material 14. For the heat expansion heat conduction particles 15 with heat expansion heat lines, the heat conduction particles expand and separate from each other when heated, so that the heat conduction performance of the heat conduction adjusting part can be reduced when the panel temperature is greater than or equal to the first temperature, and the heat conduction adjusting part has different heat conduction capacities at different temperatures.

[0069] Further, in order to make the heat conduction adjusting part have good heat conduction adjustability, the heat expansion heat conduction particles 15 can include metal micro-nanoparticles, ceramic microparticles and / or graphene microspheres.

[0070] In a feasible implementation, the heat conduction adjusting part 13 can also include a pressure-sensitive heat conduction adhesive tape with heat expansion properties. The pressure-sensitive heat conduction adhesive tape is light and thin, so that the heat conduction adjustability can be achieved while reducing the weight of the whole machine.

[0071] In a feasible implementation, as shown in Figure 11 , Figure 11 Another cross-sectional structure diagram of the display panel provided by the embodiment of the present application is shown, the heat conduction connecting structure 3 further includes a phase change heat storage part 16 fixed with the heat conduction adjusting part 13, the phase change heat storage part 16 stores heat when the panel temperature is greater than a second temperature and releases heat when the panel temperature is less than a third temperature, and the third temperature is less than or equal to the second temperature.

[0072] In the embodiment of the present application, the second temperature can be 50℃, and the third temperature can be 15℃. By setting the phase change heat storage part 16, the phase change heat storage part 16 has faster heat absorption and heat storage capacity when the panel temperature is greater than 50℃, and starts to slowly release heat when the panel temperature is less than 15℃. The heat release time can last for 5-20h, which not only realizes the recycling of heat, but also further improves the heat conduction stability and continuity of the heat conduction connecting part.

[0073] Moreover, if the display panel is in standby mode at low temperatures and the display panel itself emits less heat, the phase change heat storage part 16 can release the previously stored heat, and then use the heat released by the phase change heat storage part 16 to heat the glue layer 5, further improving the module reliability of the display panel at low temperatures.

[0074] Furthermore, in order to make the phase change heat storage part 16 have good heat storage and heat release characteristics, the phase change heat storage part 16 can include a polymer or inorganic polymer composite phase change material. For example, the phase change heat storage part 16 includes expanded graphite, microcapsule phase change, polyethylene glycol or inorganic salt filling material.

[0075] In one possible embodiment, combining Figure 11 and Figure 12 , Figure 12 This is another cross-sectional structural diagram of the display panel provided in an embodiment of the present invention, in which one end of the thermal conductivity adjustment portion 13 is connected to the thermal conductive layer 6, and the other end of the thermal conductivity adjustment portion 13 is bent from the side of the display module 1 to the backlight side of the display module 1 and connected to the heat dissipation structure 2.

[0076] The thermal conductivity adjustment portion 13 includes a first surface 17 and a second surface 18 opposite to each other. The first surface 17 is close to the side of the display module 1 . The phase change heat storage portion 16 is located on the first surface 17 and / or the second surface 18 of the thermal conductivity adjustment portion 13 .

[0077] In this structure, the thermal conductivity adjustment portion 13 is connected between the thermal conductive layer 6 and the heat dissipation structure 2, serving as a connection portion between the thermal conductive layer 6 and the heat dissipation structure 2. When the phase change heat storage portion 16 is adhered to the first surface 17 and / or the second surface 18 of the thermal conductivity adjustment portion 13, the design size of the phase change heat storage portion 16 and the contact area with the thermal conductivity adjustment portion 13 can be increased. On the one hand, this allows the phase change heat storage portion 16 to store more heat, allowing it to release more heat at low temperatures. On the other hand, the larger contact area between the phase change heat storage portion 16 and the thermal conductivity adjustment portion 13 allows the heat released by the phase change heat storage portion 16 to be quickly transferred to the thermal conductivity adjustment portion 13, thereby improving the heat conduction rate.

[0078] Or, in another possible embodiment, as Figure 13 As shown, Figure 13 This is another schematic diagram of a cross-sectional structure of a display panel provided by an embodiment of the present invention. One end of the phase-change heat storage unit 16 is connected to the thermal conductive layer 6, and the other end of the phase-change heat storage unit 16 is bent from the side of the display module 1 to the backlight side of the display module 1. The thermal conductivity adjustment unit 13 is located on the backlight side of the display module 1. One end of the thermal conductivity adjustment unit 13 is connected to the phase-change heat storage unit 16, and the other end of the thermal conductivity adjustment unit 13 is connected to the heat dissipation structure 2.

[0079] In this structure, the phase change heat storage part 16 does not need to be attached to the heat conduction adjusting part 13, and the phase change heat storage part 16 can have a larger design size, thereby further increasing the heat that can be stored by the phase change heat storage part 16.

[0080] In a feasible embodiment, the heat conduction connecting structure 3 comprises a hot melt adhesive material.

[0081] For example, referring to Figure 10 to Figure 12 The heat conduction adjusting part 13 can comprise a hot melt adhesive material. When the heat conduction adjusting part 13 comprises the second base material 14, the second base material 14 can be formed of a material such as polyurethane, ethylene elastomer, rubber elastomer, etc. having hot melt adhesive properties, so that the heat conduction adjusting part 13 has adhesion at a temperature greater than 100℃ and is bonded to the heat conduction layer 6 and the heat dissipation structure 2, and has very low or no adhesion at a temperature less than or equal to 100℃.

[0082] Alternatively, referring to Figure 13 The phase change heat storage part 16 can also comprise a hot melt adhesive material. The phase change heat storage part 16 can be a heat conduction sheet having hot melt adhesive properties and phase change heat storage properties, so that the phase change heat storage part 16 has adhesion at a temperature greater than 80℃ and is bonded to the heat conduction layer 6 and the heat dissipation structure 2, and has very low or no adhesion at a temperature less than or equal to 80℃.

[0083] In the embodiment of the present application, the heat conduction connecting structure 3 is arranged to be bent at the side of the display module 1 and is mostly exposed outside the display module 1. If the heat conduction connecting structure 3 always has adhesion, it can easily be bonded to other components in the display module 1 or the display panel. Therefore, in the embodiment of the present application, the heat conduction connecting structure 3 can be formed of a hot melt adhesive material, so that a higher process temperature can be applied to it in the process of the display panel to bond and fix it to the heat conduction layer 6 and the heat dissipation structure 2, respectively. After the temperature decreases, the heat conduction connecting structure 3 will no longer have adhesion, thereby avoiding subsequent bonding of the heat conduction connecting structure 3 to other structures.

[0084] In a feasible embodiment, as Figure 14 shown, Figure 14 a connection diagram of the heat conduction layer 6 and the heat conduction connecting structure 3 provided in the embodiment of the present application, the heat conduction layer 6 comprises a main body part 19 and a connecting part 20, the film thickness of the main body part 19 is less than the film thickness of the connecting part 20, and the connecting part 20 is in a slope shape and the film thickness of the connecting part 20 decreases in the direction of the main body part 19 along the heat conduction connecting structure 3.

[0085] In the embodiment of the present application, the film thickness of the main portion 19 can be set smaller than that of the connecting portion 20, for example, the film thickness of the main portion 19 can be set to less than 5 μm, so as to reduce the influence of the heat conduction layer 6 on the thickness of the whole machine. Meanwhile, the connecting portion 20 is designed to be ramp-shaped, so as to make the adhesive layer 5 continuously contact the heat conduction connecting structure 3 and the heat conduction layer 6, improve the wetting ability of the adhesive layer 5 for adhesion, and further improve the adhesion strength of the adhesive layer 5.

[0086] In a feasible embodiment, as shown in Figure 15 , Figure 15 Fig. 6 is a schematic view of another cross-sectional structure of the display panel provided by the embodiment of the present application, the display panel further comprises a support plate 21, the support plate 21 is located between the display module 1 and the heat dissipation structure 2, the side of the support plate 21 facing the heat dissipation structure 2 has an inwardly recessed embedding entrance 22, and the part of the heat conduction connecting structure 3 located on the backlight side of the display module 1 is located in the embedding entrance 22. Moreover, the heat conduction connecting structure 3 can also be adhesively fixed with the embedding entrance 22 of the support plate 21.

[0087] In this way, when the heat conduction connecting structure 3 is bent to the backlight side of the display module 1, the part of the heat conduction connecting structure 3 located on the backlight side of the display module 1 is accommodated in the embedding entrance 22 of the support plate 21, at this time, the overall film layer surface of the heat dissipation structure 2 is flat, and there is no gap between the heat dissipation structure 2 and the support plate 21, so as to reduce the risk of fracture of the heat dissipation structure 2.

[0088] Of course, as shown in Figure 16 , Figure 16 Fig. 7 is another schematic view of the cross-sectional structure of the display panel provided by the embodiment of the present application, the surface of the side of the support plate 21 facing the heat dissipation structure 2 can also be a flat surface, and the part of the heat conduction connecting structure 3 located on the backlight side of the display module 1 is located between the support plate 21 and the heat dissipation structure 2.

[0089] In addition, it also needs to be explained that, referring again to Figure 16 , the film thickness d of the heat conduction connecting structure 3 can be set to be between 5-20 μm, so as to make the heat conduction adjusting portion 13 easy to bend, and avoid occupying more space on the side of the display module 1. In addition, the contact length L between the heat conduction connecting structure 3 and the heat dissipation structure 2 can be set to be between 5-20 mm, so as to improve the adhesion stability of the two.

[0090] In a feasible embodiment, referring again to Figure 2 , the display module 1 further comprises a cover plate 23, the cover plate 23 is located on the side of the display layer 4 facing the light-out surface of the display panel.

[0091] The adhesive layer 5 includes a first adhesive layer 2424 positioned between the display layer 4 and the cover plate 23. The thermally conductive layer 6 includes a first thermally conductive layer 25 positioned on one side of the first adhesive layer 24. The thermally conductive connection structure 3 includes a first thermally conductive connection structure 26. One end of the first thermally conductive connection structure 26 is connected to the first thermally conductive layer 25. The other end of the first thermally conductive connection structure 26 is bent from the side of the display module 1 to the backlight side of the display module 1 and connected to the heat dissipation structure 2.

[0092] Generally, when the display panel is bent, the first adhesive layer 24 between the display layer 4 and the cover plate 23 experiences significant strain, and thus the deformability of the first adhesive layer 24 significantly impacts the display panel's bending performance. In this embodiment of the present invention, by connecting the first film layer to the heat dissipation structure 2 using a first thermally conductive connection structure 26, the heat from the heat dissipation structure 2 can be used to raise the temperature of the first adhesive layer 24 at low temperatures, preventing an increase in the modulus of the first adhesive layer 24 and thereby ensuring that the first adhesive layer 24 has good deformability.

[0093] In one possible implementation, Figure 17 As shown, Figure 17 This is another schematic cross-sectional view of a display panel provided by an embodiment of the present invention. The display module 1 includes at least two adhesive layers 5. For example, an adhesive layer 5 is provided between the cover plate 23 and the display layer 4, and an adhesive layer 5 is also provided between the display layer 4 and the support plate 21. A heat-conducting layer 6 is provided on one side of each adhesive layer 5, and each heat-conducting layer 6 is connected to at least one heat-conducting connection structure 3. This arrangement allows the adhesive layers 5 at different locations on the display module 1 to be heated, ensuring that each adhesive layer 5 maintains a low modulus and excellent deformation capability, thereby significantly reducing the impact of the adhesive layers 5 on the bending performance of the display panel.

[0094] In a feasible embodiment, the thermal conductive layer 6 includes a light-transmitting thermal conductive material. For example, the thermal conductive layer 6 is formed of a light-transmitting metal material, or the thermal conductive layer 6 is formed of a light-transmitting semiconductor material such as graphene. Alternatively, when the thermal conductive layer 6 includes a second substrate 14 and thermally expandable thermal conductive particles 15 filled in the second substrate 14, the second substrate 14 is formed of a light-transmitting polymer material.

[0095] When the heat-conducting layer 6 includes a translucent heat-conducting material, even if the heat-conducting layer 6 is located on the light-emitting side of the display layer 4 facing the display panel, it will not affect the normal light emission of the display layer 4, thereby ensuring that the display panel has a high light emission efficiency.

[0096] In one possible implementation, Figure 18 and Figure 19 As shown, Figure 18 This is another top view of the display panel provided by the embodiment of the present invention. Figure 19 for Figure 18A sectional view along B1-B2 shows that the display panel has a sub-pixel opening area 27, which can be understood as a light-out area of the display layer 4. The heat-conducting layer 6 is located on the side of the display layer 4 facing the light-out surface of the display panel, and the heat-conducting layer 6 comprises a light-shielding heat-conducting material, for example, the heat-conducting layer 6 comprises a graphite material. The heat-conducting layer 6 comprises a hollow part 28, which overlaps the sub-pixel opening area 27 in the direction perpendicular to the plane in which the display panel is located, so as to expose the sub-pixel opening area 27 and avoid the heat-conducting layer 6 affecting the normal light-out of the display layer 4, thereby ensuring that the display panel has a high light-out efficiency.

[0097] In a possible implementation, as shown in Figure 20 , Figure 20 Another top view of the display panel provided by the embodiments of the present application is shown in the figure, which comprises a first display area 29 and an optical component setting area 30, and the optical component setting area 30 is used for setting optical components such as cameras and fingerprint identification sensors. In the direction perpendicular to the plane in which the display panel is located, the heat-conducting layer 6 does not overlap the optical component setting area 30, so as to avoid the heat-conducting layer 6 blocking the optical component setting area 30 and ensure that a sufficient amount of light can pass through the optical component setting area 30 and be emitted out of or into the display panel.

[0098] Based on the same inventive concept, the embodiments of the present application also provide a display device, as shown in Figure 21 , Figure 21 A structural schematic diagram of the display device provided by the embodiments of the present application is shown in the figure, which comprises the display panel 100 described above. The specific structure of the display panel 100 has been described in detail in the above embodiments, and will not be described here again. Of course, Figure 21 The display device shown in the figure is only for illustrative purposes, and the display device can be any electronic device with a display function, such as a mobile phone, a tablet computer, a notebook computer, an electronic paper or a television.

[0099] The above description is only for the preferred embodiments of the present application and is not intended to limit the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

[0100] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them. Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacements to some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A display panel, characterized by, The display module comprises a display layer, a glue layer and a heat conduction layer stacked together, wherein the heat conduction layer is located on one side of the glue layer. The heat dissipation structure is located on the backlight side of the display module. At least one heat conduction connecting structure, one end of the heat conduction connecting structure is connected with the heat conduction layer, and the other end of the heat conduction connecting structure is connected with the heat dissipation structure by being bent from the side of the display module to the backlight side of the display module. The heat conduction connecting structure comprises a heat conduction adjusting part, and the heat conduction performance of the heat conduction adjusting part is higher when the panel temperature of the display panel is less than the first temperature than when the panel temperature is greater than or equal to the first temperature. And / or, the display module further comprises a cover plate located on the side of the display layer facing the light-out surface of the display panel; the glue layer comprises a first glue layer located between the display layer and the cover plate; the heat conduction layer comprises a first heat conduction layer located on one side of the first glue layer; the heat conduction connecting structure comprises a first heat conduction connecting structure, one end of the first heat conduction connecting structure is connected with the first heat conduction layer, and the other end of the first heat conduction connecting structure is connected with the heat dissipation structure by being bent from the side of the display module to the backlight side of the display module. And / or, the display panel has a sub-pixel opening area; the heat conduction layer is located on the side of the display layer facing the light-out surface of the display panel, the heat conduction layer comprises a light-shielding heat conduction material, and the heat conduction layer comprises a hollow part, which overlaps with the sub-pixel opening area in the direction perpendicular to the plane where the display panel is located.

2. The display panel of claim 1, wherein: The display panel comprises a bending area and a planar area located on both sides of the bending area, and at least part of the heat conduction layer is located in the bending area.

3. The display panel of claim 2, wherein: The heat conduction connecting structure is bent from the side of the display module to the backlight side of the display module in the planar area.

4. The display panel of claim 3, wherein: At least part of the heat conduction connecting structure is bent from the side of the display module to the backlight side of the display module in the planar area close to the bending area.

5. The display panel of claim 2, wherein: The heat conduction performance of the heat conduction layer in the bending area is higher than that in the planar area.

6. The display panel of claim 2 or 5, wherein: The heat conduction layer comprises a first base material and first heat conduction particles filled in the first base material, and the density of the first heat conduction particles in the bending area is greater than that in the planar area.

7. The display panel of claim 2 or 5, wherein: The heat conduction layer comprises a first base material and first heat conduction particles filled in the first base material, and the thermal expansion coefficient of the first heat conduction particles in the bending area is less than that in the planar area.

8. The display panel of claim 5, wherein: ​ The planar region includes a first sub-region and a second sub-region, the second sub-region is located between the first sub-region and the bending region, and the thermal conductivity of the thermal conductive layer in the second sub-region is higher than that in the first sub-region.

9. The display panel of claim 1, wherein, The thermal conductive adjusting part includes a second base material and thermal expansion conductive particles filled in the second base material.

10. The display panel of claim 9, wherein, The thermal expansion conductive particles include metal micro-nanoparticles, ceramic microparticles and / or graphene microspheres.

11. The display panel of claim 1, wherein, The thermal conductive adjusting part includes a pressure-sensitive thermal conductive adhesive tape with thermal expansion properties.

12. The display panel of claim 1, wherein, The thermal conductive connecting structure further includes a phase change heat storage part fixed with the thermal conductive adjusting part, the phase change heat storage part stores heat when the panel temperature is greater than a second temperature and releases heat when the panel temperature is less than a third temperature, and the third temperature is less than or equal to the second temperature.

13. The display panel of claim 12, wherein, The phase change heat storage part includes expanded graphite, microcapsule phase change, polyethylene glycol or inorganic salt filler.

14. The display panel of claim 12, wherein, One end of the thermal conductive adjusting part is connected with the thermal conductive layer, and the other end of the thermal conductive adjusting part is bent from the side surface of the display module to the backlight side of the display module and connected with the heat dissipation structure. The thermal conductive adjusting part includes opposite first and second surfaces, the first surface is close to the side surface of the display module, and the phase change heat storage part is located on the first surface and / or the second surface of the thermal conductive adjusting part.

15. The display panel of claim 12, wherein, One end of the phase change heat storage part is connected with the thermal conductive layer, and the other end of the phase change heat storage part is bent from the side surface of the display module to the backlight side of the display module. The thermal conductive adjusting part is located on the backlight side of the display module, one end of the thermal conductive adjusting part is connected with the phase change heat storage part, and the other end of the thermal conductive adjusting part is connected with the heat dissipation structure.

16. The display panel of claim 1, wherein, The thermal conductive connecting structure includes a hot melt adhesive material.

17. The display panel of claim 1, wherein, The thermal conductive layer includes a main body part and a connecting part, the connecting part is connected with the thermal conductive connecting structure, the film thickness of the main body part is less than that of the connecting part, the connecting part is in a slope shape, points to the main body part along the thermal conductive connecting structure, and the film thickness of the connecting part decreases.

18. The display panel of claim 1, wherein, The display panel further includes a support plate, the support plate is located between the display module and the heat dissipation structure, one side of the support plate towards the heat dissipation structure has an inwardly recessed embedding entrance, and the part of the thermal conductive connecting structure located on the backlight side of the display module is located in the embedding entrance. 19.The display panel of claim 1, wherein, the display module comprises at least two of the adhesive layers, each of the adhesive layers is provided with the heat conduction layer on one side, and each of the heat conduction layers is connected with at least one of the heat conduction connection structures. 20.The display panel of claim 1, wherein, the heat conduction layer comprises a light-transmitting heat conduction material. 21.The display panel of claim 1, wherein, the display panel comprises a first display area and an optical component arrangement area, and in a direction perpendicular to a plane in which the display panel is located, the heat conduction layer does not overlap with the optical component arrangement area.

22. A display device comprising: a display panel as claimed in any one of claims 1 to 21.

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