Angle adjustment device and wafer stage

Abstract

The application provides an angle adjusting device and a wafer carrier, and relates to the technical field of a probe station. The angle adjusting device comprises a bearing disc, a rotating disc and a driving mechanism. The rotating disc is movably connected above the bearing disc and has axial and circumferential degrees of freedom relative to the bearing disc. A cavity for passing positive pressure or negative pressure is formed between the bearing disc and the rotating disc. The driving mechanism is in transmission connection with the rotating disc. The driving mechanism is used for driving the rotating disc to rotate circumferentially. The angle adjusting device has the advantages of large stress area and bearing capacity, improved Z-direction precision of large load testing of the probe station, and difficulty in changing the rotation angle.

Description

Technical Field

[0001] This invention relates to the field of probe station technology, and in particular to an angle adjustment device and a wafer stage. Background Technology

[0002] Wafer processing and testing equipment are equipped with wafer stages. The function of the stage is to use vacuum to hold the wafer on its surface and to adjust the wafer angle. Some electrical performance tests for wafer products require the stage to have high voltage resistance and low leakage current characteristics. In existing wafer stages, the vacuum chuck is usually fixed on a rotating disk, and the wafer angle is adjusted by installing a bearing between the rotating disk and the fixed base. The above method has the following shortcomings: 1. The force surface between the rotating disk and the fixed base is concentrated on the bearing, which has limited load-bearing capacity. Under heavy load, the bearing is prone to deformation in the Z-direction, and Z-direction accuracy cannot be guaranteed; 2. After the rotation is completed, the angle of the vacuum chuck needs to be maintained by the motor. The motor is prone to angular changes, causing the chuck angle to deviate. Summary of the Invention

[0003] The purpose of this invention is to provide an angle adjustment device and a wafer stage, which have the advantages of large force-bearing area and load-bearing capacity, improved Z-axis accuracy of probe stage under heavy load testing, and less tendency for the rotation angle to change.

[0004] To achieve the above objectives, the present invention provides the following technical solution:

[0005] In a first aspect, the present invention provides an angle adjustment device, including a support plate, a rotating plate, and a drive mechanism. The rotating plate is movably connected above the support plate and has axial and circumferential degrees of freedom relative to the support plate. A cavity for passing positive or negative pressure is formed between the support plate and the rotating plate. The drive mechanism is drivenly connected to the rotating plate and is used to drive the rotating plate to rotate circumferentially.

[0006] Furthermore, a first air passage is recessed on the side of the bearing disk facing the rotating disk, and an air inlet and outlet hole communicating with the first air passage is opened on the outer peripheral wall of the bearing disk, forming the cavity between the first air passage and the surface of the rotating disk facing the bearing disk.

[0007] Furthermore, the carrier disk is provided with a guide groove, which is arc-shaped and extends around the axis of the carrier disk. The rotating disk has a guide protrusion extending into the guide groove on the side facing the carrier disk, and the guide protrusion slides in cooperation with the guide groove.

[0008] Furthermore, the drive mechanism includes a power component, a connecting rod, a linear bearing, and a rocker arm. The power component has a power output end that moves linearly in a direction parallel to the horizontal plane. The two ends of the connecting rod are rotatably connected to the power output end and the linear bearing, respectively. The linear bearing is fixed to the rotating disk via the rocker arm.

[0009] Furthermore, the power assembly includes a base, a rotary motor, a lead screw, and a sliding seat;

[0010] The rotary motor is mounted on the base, which has a slide rail that extends in a direction parallel to the horizontal plane;

[0011] The lead screw is connected to the rotary motor;

[0012] The sliding seat is the power output end of the power assembly. The sliding seat is threadedly connected to the lead screw and slides in cooperation with the slide rail.

[0013] Secondly, the present invention also provides a wafer stage, including the angle adjustment device described in the above-mentioned solution.

[0014] Furthermore, the wafer stage also includes a heating insulation assembly mounted above the rotating disk and a suction cup mounted above the heating insulation assembly.

[0015] Furthermore, the heating insulation assembly includes a first ceramic plate, a heating structure, a second ceramic plate, and a fixing plate arranged sequentially from top to bottom.

[0016] Furthermore, the suction cup has multiple annular adsorption zones distributed from the inside out, and each annular adsorption zone has a second air passage. The outer circumferential surface of the suction cup has multiple third air passages that correspond one-to-one with the multiple annular adsorption zones, so as to independently control the negative pressure state of the second air passage in each annular adsorption zone.

[0017] Furthermore, the second airway includes multiple axial airways and multiple annular airways;

[0018] Each of the axial air passages is opened on the top surface of the suction cup, and the bottom end of each of the axial air passages is connected to the annular air passage.

[0019] Each of the annular airways is coaxial and distributed sequentially from the inside to the outside, and the third airway is connected to each of the annular airways.

[0020] The angle adjustment device and wafer stage provided by this invention can produce the following beneficial effects:

[0021] When the rotating disk needs to be rotated, positive pressure is applied to the cavity, causing the rotating disk to move axially and become suspended, reducing the rotational resistance of the rotating disk and the friction between it and the support disk. The drive mechanism drives the rotating disk to rotate and adjust the angle. After the angle adjustment is completed, the positive pressure and the drive mechanism are turned off, and negative pressure is applied to the cavity, causing the rotating disk to adhere to the support disk and restricting the position of the rotating disk relative to the support disk.

[0022] Compared with the prior art, the angle adjustment device provided by the first aspect of the present invention allows the weight of the rotating disk and the structure above it to be directly applied to the support platform after the angle adjustment is completed. The force-bearing area is large and the force-bearing surface is stable, resulting in strong load-bearing capacity. Under the same load, the Z-direction deformation is small, which can improve the Z-direction accuracy of the probe station under large load testing. In addition, the friction between the rotating disk and the support platform is increased by negative pressure, thereby limiting the rotation of the rotating disk relative to the support platform. There is no need to rely on a motor to maintain the angle of the rotating disk, and the angle is not easily changed.

[0023] Compared with the prior art, the wafer stage provided by the second aspect of the present invention has the angle adjustment device provided by the first aspect of the present invention, thereby having all the beneficial effects of the angle adjustment device provided by the first aspect of the present invention. Attached Figure Description

[0024] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0025] Figure 1 This is a three-dimensional structural schematic diagram of an angle adjustment device provided in an embodiment of the present invention;

[0026] Figure 2 This is an exploded structural diagram of the support disk and the rotating disk provided in an embodiment of the present invention;

[0027] Figure 3 A three-dimensional structural schematic diagram of the guide protrusion provided in an embodiment of the present invention;

[0028] Figure 4 A three-dimensional structural schematic diagram of a wafer carrier provided in an embodiment of the present invention;

[0029] Figure 5 This is a schematic diagram of a three-dimensional structure of a suction cup mounted on a heating insulation assembly after being cut, according to an embodiment of the present invention.

[0030] Figure 6 A three-dimensional structural diagram of a suction cup provided in an embodiment of the present invention;

[0031] Figure 7 A perspective structural diagram of a suction cup provided in an embodiment of the present invention;

[0032] Figure 8 This is a three-dimensional structural diagram of a suction cup after being cut by a first cutting surface, provided as an embodiment of the present invention;

[0033] Figure 9 for Figure 7 A-A cross-sectional view;

[0034] Figure 10 for Figure 7 B-B cross-sectional view;

[0035] Figure 11 for Figure 7 C-C section view;

[0036] Figure 12 for Figure 7 D-D cross-sectional view.

[0037] Icons: 1 - Carrier plate; 11 - First air passage; 111 - Inner air passage; 112 - Connecting air passage; 113 - Outer air passage; 12 - Inlet / outlet air hole; 13 - Guide groove; 2 - Rotating plate; 21 - Guide protrusion; 3 - Drive mechanism; 31 - Power component; 311 - Base; 3111 - Slide rail; 312 - Rotating motor; 313 - Lead screw; 314 - Sliding seat; 32 - Connecting rod; 33 - Linear bearing; 34 - Rocker arm; 4 - Heating insulation component; 41 - First ceramic plate; 42 - Heating structure; 421 - Heating plate; 422 - Heating element; 423 - Coating; 43 - Second ceramic plate; 44 - Fixed plate; 5 - Suction cup; 51 - Annular adsorption area; 511 - Second air passage; 5111 - Axial air passage; 5112 - Annular air passage; 52 - Third air passage. Detailed Implementation

[0038] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0039] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0040] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0041] The specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.

[0042] A first aspect of the present invention provides an angle adjustment device, such as... Figure 1 As shown, it includes a support plate 1, a rotating plate 2, and a drive mechanism 3. The rotating plate 2 is movably connected above the support plate 1 and has axial and circumferential degrees of freedom relative to the support plate 1. A cavity for passing positive or negative pressure is formed between the support plate 1 and the rotating plate 2. The drive mechanism 3 is connected to the rotating plate 2 for transmission and is used to drive the rotating plate 2 to rotate circumferentially.

[0043] The angle adjustment device provided in the above embodiment breaks away from the traditional method of rotating the disc relative to the fixed seat through bearings. Instead, it uses positive pressure to reduce the friction between the disc 2 and the support plate 1 by applying positive pressure to the cavity between the support plate 1 and the disc 2. Then, the drive mechanism drives the disc 2 to rotate circumferentially to adjust the angle of the disc 2. After adjustment, negative pressure is applied to the cavity, and the disc 2 is adsorbed onto the support plate 1, limiting the position of the disc 2. As long as the load is within the range of static friction generated by adsorption, the angle of the disc 2 will not change.

[0044] In some embodiments, such as Figure 2As shown, a first air passage 11 is recessed on the side of the bearing plate 1 facing the rotating plate 2. A cavity is formed between the first air passage 11 and the surface of the rotating plate 2 facing the bearing plate 1. An air inlet and outlet hole 12 communicating with the first air passage 11 is opened on the outer peripheral wall of the bearing plate 1. Air can be introduced into the cavity through the air inlet and outlet hole 12 to form positive pressure, or air can be drawn from the cavity to form negative pressure.

[0045] The aforementioned air inlet and outlet ports 12 can be configured as one, or as two, three, or more.

[0046] In at least one embodiment, two air inlets and outlets 12 are configured to improve air intake and exhaust efficiency.

[0047] It should be noted that, in order to ensure that the area of ​​air pressure acting on the rotating disk 2 is large enough when the cavity is under positive pressure and that the bearing disk 1 can stably adsorb the rotating disk 2 when the cavity is under negative pressure, the first air passage 11 is distributed as evenly as possible on the bearing disk 1 and has a large area.

[0048] Specifically, such as Figure 2 As shown, the first airway 11 may include an inner airway 111, a connecting airway 112, and a plurality of outer airways 113. The inner airway 111 is located close to the center of the support plate 1, and each outer airway 113 is located away from the center of the support plate 1. Each outer airway 113 can be directly connected to the inner airway 111 or can be connected to the inner airway 111 through the connecting airway 112.

[0049] The aforementioned first air passage can increase the contact area with the rotating disk 2 through a double-layer structure, thereby ensuring that the rotating disk 2 can achieve the expected state regardless of whether it is in a positive pressure state or a negative pressure state.

[0050] The inner airway 111 can extend in an arc around the axis of the support plate 1, and at least one outer airway 113 extends in an arc around the axis of the support plate 1.

[0051] Of course, the first air passage 11 may not be recessed on the bearing plate 1, or may not be recessed on the bearing plate 1. The first air passage 11 may be recessed on the bottom surface of the rotating plate 2, and the rotating plate 2 may be provided with an inlet and outlet hole communicating with the first air passage 11; or the first air passage 11 may be recessed on the top surface of the bearing plate 1 and the bottom surface of the rotating plate 2, and the bearing plate 1 and / or the rotating plate 2 may be provided with an inlet and outlet hole communicating with the first air passage 11.

[0052] In some embodiments, such as Figure 2 and Figure 3 As shown, the carrier disk 1 is provided with a guide groove 13, which is arc-shaped and extends around the axis of the carrier disk 1. The bottom end of the rotating disk 2 has a guide protrusion 21 that extends into the guide groove 13. The guide protrusion and the guide groove 13 are slidably engaged so that the rotating disk 2 has axial and circumferential degrees of freedom relative to the carrier disk 1.

[0053] The guide groove 13 can guide the guide protrusion 21. When the cavity is subjected to positive pressure, the guide protrusion 21 will move axially relative to the guide groove 13 to reduce the friction between the rotating disk 2 and the bearing disk 1. Then the drive mechanism 3 will move, and the guide protrusion 21 will move along the extension direction of the guide groove 13 to adjust the angle of the rotating disk 2.

[0054] The guide groove 13 and the guide protrusion 21 can be configured as one, or as two, three, four, or more.

[0055] When the guide protrusion 21 is configured as one, the part of the guide protrusion 21 that extends into the guide groove 13 needs to have a certain length along the extension direction of the guide groove 13, so as to prevent the rotating disk 2 from rotating relative to the bearing disk 1 with the guide protrusion 21 as the axis.

[0056] In at least one embodiment, there are three guide grooves 13 and three guide protrusions. The three guide grooves 13 are evenly spaced around the axis of the bearing disk 1, and the three guide protrusions extend into the three guide grooves 13 in a corresponding manner.

[0057] The guide protrusion 21 may include a connecting rod and a cylindrical protrusion connected to the connecting rod. The connecting rod may be threaded to the rotating disk 2 and locked by a nut thereon. Of course, the guide protrusion 21 may also have other structural forms, as long as it can extend into the guide groove 13 and move along the extension direction of the guide groove 13 and along the axial direction of the bearing disk 1 under the guidance of the guide groove 13.

[0058] In some embodiments, such as Figure 1 As shown, the drive mechanism 3 includes a power component 31, a connecting rod 32, a linear bearing 33, and a rocker arm 34. The power component 31 has a power output end that moves linearly in a direction parallel to the horizontal plane. The two ends of the connecting rod 32 are rotatably connected to the power output end and the linear bearing 33, respectively, so as to transmit the power of the power component 31 to the linear bearing 33. The linear bearing 33 is fixed to the rotating disk 2 through the rocker arm 34.

[0059] The linear bearing 33 described above allows the rotating disk 2 to have a certain amount of axial displacement, so as to adapt to the change in the height of the rotating disk 2 under positive pressure in the cavity.

[0060] Specifically, the rocker arm 34 can be in the shape of a "Z". The bottom end of the rocker arm 34 can be fixed to the rotating disk 2 by screws or other connecting parts, and the outer sleeve of the linear bearing 33 can be fixed to the top end of the rocker arm 34 by screws or other connecting parts.

[0061] The rotatable connection between the linear bearing 33 and the connecting rod 32 can be achieved by a rotary bearing, and the rotatable connection between the connecting rod 32 and the power output end can also be achieved by a rotary bearing.

[0062] The aforementioned power assembly 31 may include a power source that directly performs linear motion, such as a pneumatic cylinder or a hydraulic cylinder, or it may include a rotary motor and a transmission assembly, wherein the transmission assembly can convert the rotational motion of the rotary motor into linear motion.

[0063] In some embodiments, such as Figure 1 As shown, the power assembly 31 includes a base 311, a rotary motor 312, a lead screw 313, and a sliding seat 314, wherein:

[0064] The rotating motor 312 can be fixedly installed on the base 311 by a support frame. The base 311 has a slide rail 3111, which extends in a direction parallel to the horizontal plane.

[0065] The lead screw 313 is connected to the power output shaft of the rotary motor 312 via a coupling, so that the rotary motor 312 can drive the lead screw 313 to rotate.

[0066] The sliding seat 314 is the power output end of the power assembly 31. The sliding seat 314 is threadedly connected to the lead screw 313 and slides in cooperation with the slide rail 3111.

[0067] When the rotating motor 312 is activated, it drives the lead screw 313 to rotate. Since the sliding seat 314 is threadedly connected to the lead screw 313 and slides in cooperation with the slide rail 3111, the sliding seat 314 slides along the slide rail 3111 under the drive of the lead screw 313, and at the same time drives the connecting rod 32 to move. Since the other end of the connecting rod 32 is rotatably connected to the linear bearing 33, the connecting rod 32 will pull the linear bearing 33 and drive the rotating disk 2 to rotate through the rocker arm 34. At the same time, the connecting rod 32 will rotate relative to the sliding seat 314 to adapt to the change in position of the linear bearing 33 in the direction perpendicular to the sliding seat 314.

[0068] In some embodiments, the angle adjustment device may further include a support base, on which the base 311 is mounted.

[0069] A second aspect of the present invention provides a wafer stage, which includes the aforementioned angle adjustment device.

[0070] The wafer stage provided in the second aspect of the present invention has the angle adjustment device provided in the embodiment of the first aspect of the present invention, thereby having all the beneficial effects of the angle adjustment device provided in the embodiment of the first aspect of the present invention.

[0071] In some embodiments, such as Figure 4 As shown, the wafer stage also includes a heating insulation component 4 mounted above the rotating disk 2 and a suction cup 5 mounted above the heating insulation component 4. The heating insulation component 4 can play a role in heating insulation, so that the wafer stage meets the characteristics of high voltage resistance and low leakage current.

[0072] Specifically, such as Figure 5 As shown, the heating insulation assembly 4 includes a first ceramic plate 41, a heating structure 42, a second ceramic plate 43 and a fixing plate 44 arranged sequentially from top to bottom. The ceramic has good insulation properties, can provide high resistance to reduce leakage, and can ensure excellent flatness.

[0073] The materials of the first ceramic plate 41 and the second ceramic plate 43 are preferably Al2O3 ceramic.

[0074] In addition, the heating structure 42 may include a heating plate 421, a heating element 422 and a plating layer 423. The bottom end of the heating plate 421 is recessed with a groove, the heating element 422 and the plating layer 423 are installed in the groove, and the heating element 422 is located above the plating layer 423.

[0075] The heating plate 421 can be made of aluminum, and the coating can be made of nickel.

[0076] In some embodiments, such as Figure 6 and Figure 7 As shown, the suction cup 5 has multiple annular adsorption zones 51 distributed from the inside out. Each annular adsorption zone 51 has a second air passage 511. The outer circumferential surface of the suction cup 5 has multiple third air passages 52 that correspond to and communicate with the multiple annular adsorption zones 51. The third air passages 52 can independently draw air from the second air passages 511 they communicate with, and can independently control the negative pressure state of the second air passages 511 in each annular adsorption zone 51.

[0077] When adsorbing the wafer, each annular adsorption region 51 can be subjected to negative pressure from the inside out, which makes it easier to adsorb the wafer when there is warping at the edge of the wafer, ensuring that the wafer is flat after adsorption.

[0078] The number of the aforementioned annular adsorption regions 51 can be two, three, four, five, or six.

[0079] In at least one embodiment, such as Figure 7 As shown, there are four annular adsorption regions 51.

[0080] The second airway 511 can take various structural forms, such as a ring-shaped airway, a radial airway, etc.

[0081] In some embodiments, such as Figure 7 and Figure 8 As shown, the second airway 511 includes multiple axial airways 5111 and multiple annular airways 5112; each axial airway 5111 is opened on the top surface of the suction cup 5, and the bottom end of each axial airway 5111 is connected to the annular airway 5112; each annular airway 5112 is coaxial and distributed sequentially from the inside to the outside, and the third airway 52 is connected to each annular airway 5112.

[0082] When in use, the third air passage 52 is connected to the air extraction device. Air is extracted from each annular air passage 5112 through the third air passage 52, and then air is extracted from each axial air passage 5111 through the annular air passage 5112, thereby making the second air passage 511 and the third air passage 52 under negative pressure.

[0083] In each second airway 511, the number of annular airways 5112 can be two, three, four, five or six, and each annular airway 5112 is connected to a dozen or even dozens of axial airways 5111.

[0084] In any second airway 511, the number of axial airways 5111 connected to each annular airway 5112 is the same. To ensure better adsorption effect of the suction cup 5, in any two adjacent second airways 511:

[0085] In the second airway 511 located in the inner ring, each annular airway 5112 is connected to an axial airway 5111 of number n1. In the second airway 511 located in the outer ring, each annular airway 5112 is connected to an axial airway 5111 of number n2, where n1 is greater than n2.

[0086] See Figures 9 to 12 The second airway 511 and the third airway 52 described above will be explained in detail. Figure 9 This is a cross-sectional view of the connection between the second air passage 511, which is closest to the center of the suction cup 5, and the third air passage 52. The third air passage 52 extends radially along the suction cup 5 and connects to the top of the four annular air passages 5112 in the second air passage 511. Figure 10 This is a cross-sectional view of the connection between the second air passage 511, which is the second closest to the center of the suction cup 5, and the third air passage 52. The third air passage 52 extends radially along the suction cup 5 and connects with the top of the four annular air passages 5112 in the second air passage 511. Figure 11 This is a cross-sectional view of the connection between the second air passage 511 and the third air passage 52, which is the third closest to the center of the suction cup 5. The third air passage 52 extends radially along the suction cup 5 and connects with the top of the five annular air passages 5112 in the second air passage 511. Figure 12 This is a cross-sectional view of the connection between the second air passage 511, which is furthest from the center of the suction cup 5, and the third air passage 52. The third air passage 52 extends radially along the suction cup 5 and connects with the top of the five annular air passages 5112 in the second air passage 511.

[0087] Finally, it should be noted that the aforementioned wafer stage can adsorb Takio wafers. Taiko wafers are a type of wafer that is thinned in the middle and retains a thicker ring around the perimeter to improve wafer strength and reduce deformation. Of course, it can also adsorb other types of wafers.

[0088] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An angle adjustment device, characterized in that, It includes a support plate (1), a rotating plate (2) and a drive mechanism (3). The rotating plate (2) is movably connected above the support plate (1) and has axial and circumferential degrees of freedom relative to the support plate (1). A cavity for passing positive or negative pressure is formed between the support plate (1) and the rotating plate (2). The drive mechanism (3) is connected to the rotating plate (2) and is used to drive the rotating plate (2) to rotate circumferentially. The first air passage (11) is recessed on the top surface of the bearing plate (1) and / or the bottom surface of the rotating plate (2). The bearing plate (1) and / or the rotating plate (2) are provided with inlet and outlet air holes (12) communicating with the first air passage (11). The cavity is formed between the first air passage (11) and the surface of the rotating plate (2) facing the bearing plate (1), and / or the cavity is formed between the first air passage (11) and the surface of the bearing plate (1) facing the rotating plate (2). The first airway (11) includes an inner airway (111), a connecting airway (112), and a plurality of outer airways (113). The inner airway (111) is located close to the center of the support plate (1), and each of the outer airways (113) is located away from the center of the support plate (1). Each of the outer airways (113) is connected to the inner airway (111) through the connecting airway (112). The inner airway (111) extends in an arc around the axis of the bearing plate (1), and at least one of the outer airways (113) extends in an arc around the axis of the bearing plate (1).

2. The angle adjustment device according to claim 1, characterized in that, The carrier disk (1) is provided with a guide groove (13), which is arc-shaped and extends around the axis of the carrier disk (1). The rotating disk (2) has a guide protrusion (21) on the side facing the carrier disk (1) that extends into the guide groove (13). The guide protrusion (21) slides with the guide groove (13).

3. The angle adjustment device according to claim 1, characterized in that, The drive mechanism (3) includes a power assembly (31), a connecting rod (32), a linear bearing (33), and a rocker arm (34). The power assembly (31) has a power output end that moves linearly in a direction parallel to the horizontal plane. The two ends of the connecting rod (32) are rotatably connected to the power output end and the linear bearing (33), respectively. The linear bearing (33) is fixed to the rotating disk (2) through the rocker arm (34).

4. The angle adjustment device according to claim 3, characterized in that, The power assembly (31) includes a base (311), a rotary motor (312), a lead screw (313), and a sliding seat (314). The rotating motor (312) is mounted on the base (311), which has a slide rail (3111) that extends in a direction parallel to the horizontal plane; The lead screw (313) is connected to the rotary motor (312); The sliding seat (314) is the power output end of the power assembly (31). The sliding seat (314) is threadedly connected to the lead screw (313) and slides in cooperation with the slide rail (3111).

5. A wafer carrier, characterized in that, Includes the angle adjustment device as described in any one of claims 1-4.

6. The wafer stage according to claim 5, characterized in that, The wafer stage also includes a heating insulation component (4) mounted above the rotating disk (2) and a suction cup (5) mounted above the heating insulation component (4).

7. The wafer stage according to claim 6, characterized in that, The heating insulation assembly (4) includes a first ceramic plate (41), a heating structure (42), a second ceramic plate (43), and a fixing plate (44) arranged sequentially from top to bottom.

8. The wafer stage according to claim 6, characterized in that, The suction cup (5) has multiple annular adsorption zones (51) distributed from the inside to the outside. Each annular adsorption zone (51) has a second air passage (511). The outer peripheral surface of the suction cup (5) has multiple third air passages (52) that correspond one-to-one with the multiple annular adsorption zones (51) to independently control the negative pressure state of the second air passages (511) in each annular adsorption zone (51).

9. The wafer stage according to claim 8, characterized in that, The second airway (511) includes multiple axial airways (5111) and multiple annular airways (5112). Each of the axial air passages (5111) is opened on the top surface of the suction cup (5), and the bottom end of each of the axial air passages (5111) is connected to the annular air passage (5112). Each of the annular airways (5112) is coaxial and distributed sequentially from the inside to the outside, and the third airway (52) is connected to each of the annular airways (5112).

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