A high-voltage chip power supply activation communication system and its working method

By combining the design of low-voltage CPU units, isolated communication units and power supply units, the problem of large heat generation, large current and high cost of analog chips is solved, and an efficient communication system design is achieved, extending the system life and reducing conductive radiation.

CN116319123BActive Publication Date: 2025-08-29SHENZHEN KELIE TECH
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Patent Information

Application Number
CN202310280441.0
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-03-21
Publication Date
2025-08-29
Estimated Expiration
2043-03-21

AI Technical Summary

Technical Problem

In the prior art, analog chip design has problems such as large heat generation, large working current, high chip price, high conduction radiation and high ambient temperature requirements, resulting in high system cost and short life.

Method used

The combination of low-voltage CPU unit, isolated communication unit, pre-power supply unit, power supply unit, power supply conversion unit and self-power supply unit is adopted to reduce system communication costs, reduce input current, reduce heat generation, and improve system life through SPI isolation communication.

Benefits of technology

It has achieved the reduction of system communication costs, reduce heat generation, extend system life, reduce system conduction radiation, reduce system current to less than 10mA, and improve system efficiency.

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Abstract

The present invention discloses a high-voltage chip power supply activation communication system and its working method, which includes a low-voltage CPU unit U1, an isolated communication unit U2, a first communication power supply unit, a second communication power supply unit, an isolated pre-power supply unit U3, a power supply unit U5, a power conversion unit U6, a self-power supply unit, a linear voltage regulator unit U7, an acquisition control unit U4, and a battery system. The present invention establishes an initial pre-power supply activation high-voltage acquisition chip, reduces system communication costs through SPI isolated communication, and through a power supply combination, satisfies the power supply requirements of the analog front-end acquisition and the timing and amplitude of the power supply voltage of the analog front-end chip, while also providing power to the SPI isolation chip and reducing the system's input current to the same level as the input current of typical analog chips on the market (10mA), reducing system heat generation and improving system life.
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Description

Technical Field

[0001] The present invention relates to the technical field of new energy BMS management systems, and in particular to a high-voltage chip power supply activation communication system and a working method thereof. Background Art

[0002] With the rapid development of the electric vehicle industry, there are more and more methods for collecting battery cell status in new energy vehicles, from the early discrete solutions to the popular analog front-end sampling solutions. Some analog front-end sampling chips have high power consumption, and activation and communication require independent SPI to daisy chain communication solutions. For example, Figure 1 The figure shows the existing technology, which uses ST's 9963E analog chip. However, the analog chip adopts a linear voltage regulation solution, which has the problems of high heat generation and large operating current (40mA). It also causes great temperature stress in the practical process of the product, puts forward higher temperature adaptability requirements for the peripheral devices of the circuit, and requires a dedicated wake-up chip to wake up the chip.

[0003] At the same time, the existing technology also has problems such as using a dedicated communication chip U8 for communication, which is expensive; using T1 for communication isolation, which is expensive and has high conduction radiation; U4 power supply uses a linear voltage regulation solution, the BAT voltage range is up to 65V, the chip current peak is 40mA, Q3 needs to be a large package device (the power dissipation needs to be greater than 2W), and a large amount of heat is emitted in a confined space, which will greatly increase the ambient temperature and increase the life requirements of other devices in the environment.

[0004] To solve this problem, we designed a high-voltage chip power supply to activate the communication system, thus solving this problem. Summary of the Invention

[0005] In response to the above-mentioned technical problems in the prior art, the present invention provides a high-voltage chip power supply activation communication system and a working method thereof, establishes an initial pre-power supply activation high-voltage acquisition chip, reduces the system communication cost through SPI isolated communication, and uses a power supply combination to meet the power supply requirements of the analog front-end acquisition and the timing and amplitude requirements of the analog front-end chip for the power supply voltage. At the same time, it powers the SPI isolation chip and reduces the input current of the system, which is on par with the input current of typical analog chips on the market (10mA), thereby reducing system heat generation and improving system life.

[0006] To achieve the above objectives, the present invention provides the following technical solutions:

[0007] A high-voltage chip power supply activation communication system includes a low-voltage CPU unit U1, an isolated communication unit U2, a first communication power supply unit, a second communication power supply unit, an isolated pre-power supply unit U3, a power supply unit U5, a power supply conversion unit U6, a self-power supply unit, a linear voltage regulator unit U7, an acquisition control unit U4 and a battery system; wherein,

[0008] The low-voltage CPU unit U1 is powered by a low-voltage power supply and synchronously supplies power to one side of the isolated communication unit U2, responsible for the management and control of the entire system;

[0009] The isolated communication unit U2 is an SPI communication isolator. When the acquisition control unit U4 is not officially working, it is activated through the SPI communication isolator. After activation, communication is performed through the SPI communication isolator.

[0010] The isolated pre-power supply unit U3 has an internal power supply current of I1. Before the acquisition control unit U4 is powered on for the first time, the subsequent power supply unit U5 is activated to control the internal linear power supply output of U5 and then pass through the power conversion unit U6 to supply power through the second communication power supply unit of the isolated communication unit U2;

[0011] The acquisition control unit U4 is a high-voltage analog front-end AFE. On the one hand, it is responsible for linear voltage regulation from the battery system to supply internal logic. On the other hand, after receiving the activation signal from the isolated communication unit U2, it controls the power supply unit U5 to output power, which is transmitted to U4 internally through the linear voltage regulator unit U7 for conversion and used for temperature acquisition and communication power supply. The total internal power supply current is I4.

[0012] The power supply unit U5 draws power from the battery system. The total internal power supply current is I2. On the one hand, it receives the activation signal from the isolated pre-power supply unit U3, and on the other hand, it receives the enable signal from the acquisition control unit U4. After operation, it converts the battery voltage into 8V to power the linear voltage regulator unit U7;

[0013] The power conversion unit U6 receives the 8V voltage transmitted from the power supply unit U5 and converts it into a 6.2V voltage to power the acquisition control unit U4, and on the other hand, it powers the second communication power supply and subsequently powers the isolated communication unit U2;

[0014] The self-powered unit connects the 8V voltage of the power supply unit U5 to the internal VCC signal to improve the conversion efficiency of the power supply unit U5.

[0015] As a further elaboration of the above technical solution:

[0016] In the above technical solution, the acquisition control unit U4, the power supply unit U5, the linear voltage stabilization unit U7 and the self-power supply unit form a first replica unit of the high-voltage chip.

[0017] In the above technical solution, a second high-voltage chip replication unit and a third high-voltage chip replication unit are also included, and the first high-voltage chip replication unit, the second high-voltage chip replication unit and the third high-voltage chip replication unit are activated through ISOSPI.

[0018] In the above technical solution, the second replication unit of the high-voltage chip includes an acquisition control unit U14, a power supply unit U15, the linear voltage regulator unit U17 and a self-power supply unit, and the third replication unit of the high-voltage chip includes an acquisition control unit U24, a power supply unit U25, the linear voltage regulator unit U27 and a self-power supply unit.

[0019] Based on the above-mentioned working method of a high-voltage chip power supply activation communication system, it is characterized in that it includes the following steps: (1) the low-voltage CPU unit U1 is powered on, the isolated pre-power supply unit U3 is closed, a current I1 is generated, and a 6V signal is output to activate the power supply unit U5; (2) the power supply unit U5 outputs a VCC signal of 7.3V through its own linear voltage regulation to generate a current I2; (3) the VCC signal is output to the second communication power supply unit through the power supply conversion unit; (4) the second communication power supply unit is converted internally to a voltage below 5V to power the isolated communication unit U2; (5) the low-voltage CPU unit U1 is activated through the output of the isolated communication unit U2 signal, activates the acquisition control unit U4, and generates current I4; (6) the acquisition control unit U4 outputs an enable signal to power the power supply unit U5; (7) the main power supply of the power supply unit U5 starts to work and outputs 8V power, and feeds back the internal linear voltage regulator VCC to generate current I2; (8) the linear voltage regulator unit U7 starts to work synchronously and outputs 6.5V; (9) the low-voltage CPU unit U1 disconnects the communication pre-power supply unit U3, and I1 becomes 0V; (10) the acquisition control unit U4 supplies power to the isolated communication unit U2; (11) the power conversion unit U6 enters the stop working state; (12) the high-voltage chip power supply activates the communication system to complete the power-on and perform normal communication.

[0020] In the above technical solution, in step (5), the acquisition control unit U4 activates the acquisition control unit U14 through ISOSPI, and the acquisition control unit U14 outputs an enable signal to activate the power supply unit U15. The power supply unit U15 outputs a VCC signal 7.3V through its own linear voltage regulation to the linear voltage regulation unit U17, and provides it to the acquisition control unit U14 after voltage reduction. After 3ms, the main power supply of the power supply unit U15 starts to work, outputs 8V self-powered to VCC, and the internal linear voltage regulation stops, and the acquisition control unit U14 starts to enter the working mode.

[0021] In the above technical solution, in step (5), the acquisition control unit U14 activates the acquisition control unit U24 through ISOSPI, and the acquisition control unit U24 outputs an enable signal to activate the power supply unit U25. The power supply unit U25 outputs a VCC signal 7.3V through its own linear voltage regulation to the linear voltage regulation unit U27, and provides it to the acquisition control unit U24 after voltage reduction. After 3ms, the main power supply of the power supply unit U25 starts working, outputs 8V self-powered to VCC, and the internal linear voltage regulation stops, and the acquisition control unit U24 starts to enter the working mode.

[0022] Beneficial effects of the present invention:

[0023] The present invention is reasonably designed and discloses a high-voltage chip power supply activation communication system, which has the following advantages: establishing an initial pre-power supply to activate the high-voltage acquisition chip, reducing the system communication cost through SPI isolation communication, and through a power supply combination method, meeting the power supply of the analog front-end acquisition and the timing and amplitude requirements of the analog front-end chip for the power supply voltage, while supplying power to the SPI isolation chip and reducing the input current of the system to the same level as the input current of a typical analog chip on the market (10mA), reducing the heat generation of the system and improving the system life; the present invention also discloses a working method of the high-voltage chip power supply activation communication system, which eliminates the need for isolation IC and isolation The transformer is replaced with an isolated SPI to reduce costs; the high-power MOS of the original linear voltage regulator unit is replaced with a signal MOS to reduce costs, shorten PCB space, and reduce system heat generation; an independent power supply unit is added and self-looped to improve efficiency, reducing the system current from 40mA to below 10mA; the activation signal of the acquisition and control unit for the power supply unit is cleverly used to avoid the independent isolated activation enable signal; the linear voltage regulator and main power supply of the power supply unit U5 are reasonably used to meet the power supply timing requirements of the acquisition and control unit U4 and the requirements of self-power supply to improve efficiency; there is no additional EMI, reducing the magnitude of system conducted radiation. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of a working circuit in the prior art;

[0025] Figure 2 Schematic diagram of the working circuit of the present invention;

[0026] Figure 3 This is a schematic diagram of the working circuit of multiple acquisition control units. DETAILED DESCRIPTION

[0027] The present invention is described in detail below with reference to specific embodiments and accompanying drawings.

[0028] This embodiment provides a high-voltage chip power supply activation communication system, such as Figure 1-3 As shown, it includes a low-voltage CPU unit U1, an isolated communication unit U2, a first communication power supply unit, a second communication power supply unit, an isolated pre-power supply unit U3, a power supply unit U5, a power conversion unit U6, a self-power supply unit, a linear voltage regulator unit U7, an acquisition control unit U4 and a battery system; wherein,

[0029] The low-voltage CPU unit U1 is powered by a low-voltage power supply and synchronously supplies power to one side of the isolated communication unit U2, responsible for the management and control of the entire system;

[0030] The isolated communication unit U2 is an SPI communication isolator. When the acquisition control unit U4 is not officially working, it is activated through the SPI communication isolator. After activation, communication is performed through the SPI communication isolator.

[0031] The isolated pre-power supply unit U3 has an internal power supply current of I1. Before the acquisition control unit U4 is powered on for the first time, the subsequent power supply unit U5 is activated to control the internal linear power supply output of U5 and then pass through the power conversion unit U6 to supply power through the second communication power supply unit of the isolated communication unit U2;

[0032] The acquisition control unit U4 is a high-voltage analog front-end AFE. On the one hand, it is responsible for linear voltage regulation from the battery system to supply internal logic. On the other hand, after receiving the activation signal from the isolated communication unit U2, it controls the power supply unit U5 to output power, which is transmitted to the internal U4 through the linear voltage regulator unit U7 for conversion and used for temperature acquisition and communication power supply. The total internal power supply current is 14;

[0033] The power supply unit U5 draws power from the battery system. The total internal supply current is 12V. On the one hand, it receives the activation signal from the isolated pre-power supply unit U3, and on the other hand, it receives the enable signal from the acquisition control unit U4. After working, it converts the battery voltage into 8V to power the linear voltage regulator unit U7.

[0034] The power conversion unit U6 receives the 8V voltage transmitted from the power supply unit U5 and converts it into a 6.2V voltage to power the acquisition control unit U4, and on the other hand, it powers the second communication power supply and subsequently powers the isolated communication unit U2;

[0035] The self-powered unit connects the 8V voltage of the power supply unit U5 to the internal VCC signal to improve the conversion efficiency of the power supply unit U5.

[0036] In this embodiment, the low-voltage CPU unit U1 activates the power supply unit U5 through the isolated pre-power supply unit U3 (power is taken from the battery system). The power supply unit U5 performs linear power supply and main power supply and performs loopback. The power supply conversion unit U6 provides isolated communication power supply and advance power supply timing for the acquisition control unit U4. The power supply unit U5 supplies power to the acquisition control unit U4 through the linear voltage regulator unit U7. The acquisition control unit U4 acts on the power supply U5 by driving the signal of the linear voltage regulator unit as an enable signal. The acquisition and control unit adopts L9963E / ST.

[0037] As a further improvement of the present invention, the acquisition control unit U4, the power supply unit U5, the linear voltage stabilization unit U7 and the self-power supply unit form a first replication unit of the high-voltage chip.

[0038] As a further improvement of the present invention, it also includes a high-voltage chip second copy unit and a high-voltage chip third copy unit, and the high-voltage chip first copy unit, the high-voltage chip second copy unit and the high-voltage chip third copy unit are activated through ISOSPI.

[0039] As a further improvement of the present invention, the second replication unit of the high-voltage chip includes an acquisition control unit U14, a power supply unit U15, the linear voltage regulator unit U17 and a self-power supply unit, and the third replication unit of the high-voltage chip includes an acquisition control unit U24, a power supply unit U25, the linear voltage regulator unit U27 and a self-power supply unit.

[0040] Based on the above-mentioned working method of a high-voltage chip power supply activation communication system, it includes the following steps: (1) the low-voltage CPU unit U1 is powered on, the isolated pre-power supply unit U3 is closed, a current I1 is generated, and a 6V signal is output to activate the power supply unit U5; (2) the power supply unit U5 outputs a VCC signal 7.3V through its own linear voltage regulation to generate a current I2; (3) the VCC signal is output to the second communication power supply unit through the power supply conversion unit; (4) the second communication power supply unit is converted internally to a voltage below 5V to power the isolated communication unit U2; (5) the low-voltage CPU unit U1 outputs an activation signal through the isolated communication unit U2, Activate the acquisition control unit U4 to generate current I4; (6) the acquisition control unit U4 outputs an enable signal to power the power supply unit U5; (7) the main power supply of the power supply unit U5 starts to work and outputs 8V power, and feeds back the internal linear voltage regulator VCC to generate current I2; (8) the linear voltage regulator unit U7 starts to work synchronously and outputs 6.5V; (9) the low-voltage CPU unit U1 disconnects the communication pre-power supply unit U3, and I1 becomes 0V; (10) the acquisition control unit U4 supplies power to the isolated communication unit U2; (11) the power conversion unit U6 enters the stop working state; (12) the high-voltage chip power supply activates the communication system to complete power-on and perform normal communication.

[0041] As a further improvement of the present invention, in step (5), the acquisition control unit U4 activates the acquisition control unit U14 through ISOSPI, and the acquisition control unit U14 outputs an enable signal to activate the power supply unit U15. The power supply unit U15 outputs a VCC signal 7.3V through its own linear voltage regulation to the linear voltage regulation unit U17, and provides it to the acquisition control unit U14 after voltage reduction. After 3ms, the main power supply of the power supply unit U15 starts to work, outputs 8V self-powered to VCC, the internal linear voltage regulation stops, and the acquisition control unit U14 starts to enter the working mode.

[0042] As a further improvement of the present invention, in step (5), the acquisition control unit U14 activates the acquisition control unit U24 through ISOSPI, and the acquisition control unit U24 outputs an enable signal to activate the power supply unit U25. The power supply unit U25 outputs a VCC signal 7.3V through its own linear voltage regulation to the linear voltage regulation unit U27, and provides it to the acquisition control unit U24 after voltage reduction. After 3ms, the main power supply of the power supply unit U25 starts to work, outputs 8V self-powered to VCC, the internal linear voltage regulation stops, and the acquisition control unit U24 starts to enter the working mode.

[0043] In the description of the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," "connected," and "fixed" should be understood in a broad sense. For example, they may refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention in specific circumstances.

[0044] The standard parts used in the present invention can all be purchased from the market, and special-shaped parts can be customized according to the description in the specification and the drawings. The specific connection methods of each part adopt conventional means such as mature bolts, rivets, welding, etc. in the existing technology. The machinery, parts and equipment all adopt conventional models in the existing technology, and the circuit connection adopts the conventional connection method in the existing technology, which will not be described in detail here.

[0045] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

[0046] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the scope of protection of the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the essence and scope of the technical solutions of the present invention.

Claims

1. A high-voltage chip powered activation communication system, characterized in that: It includes a low-voltage CPU unit U1, an isolated communication unit U2, a first communication power supply unit, a second communication power supply unit, an isolated pre-power supply unit U3, a power supply unit U5, a power conversion unit U6, a self-power supply unit, a linear voltage regulator unit U7, an acquisition control unit U4 and a battery system; wherein, The low-voltage CPU unit U1 is powered by a low-voltage power supply and synchronously supplies power to one side of the isolated communication unit U2, responsible for the management and control of the entire system; The isolated communication unit U2 is an SPI communication isolator. When the acquisition control unit U4 is not officially working, it is activated through the SPI communication isolator. After activation, communication is performed through the SPI communication isolator. The isolated pre-power supply unit U3 has an internal power supply current of I1. Before the acquisition control unit U4 is powered on for the first time, the subsequent power supply unit U5 is activated to control the internal linear power supply output of U5 and then pass through the power conversion unit U6 to supply power through the second communication power supply unit of the isolated communication unit U2; The acquisition control unit U4 is a high-voltage analog front-end AFE. On the one hand, it is responsible for linear voltage regulation from the battery system to supply internal logic. On the other hand, after receiving the activation signal from the isolated communication unit U2, it controls the power supply unit U5 to output power, which is transmitted to U4 internally through the linear voltage regulator unit U7 for conversion and used for temperature acquisition and communication power supply. The total internal power supply current is I4. The power supply unit U5 draws power from the battery system. The total internal power supply current is I2. On the one hand, it receives the activation signal from the isolated pre-power supply unit U3, and on the other hand, it receives the enable signal from the acquisition control unit U4. After operation, it converts the battery voltage into 8V to power the linear voltage regulator unit U7; The power conversion unit U6 receives the 8V voltage transmitted from the power supply unit U5 and converts it into a 6.2V voltage to power the acquisition control unit U4, the second communication unit U4, and the isolation communication unit U2. The self-powered unit connects the 8V voltage of the power supply unit U5 to the internal VCC signal to improve the conversion efficiency of the power supply unit U5.

2. A high-voltage chip powered activation communication system according to claim 1, characterized in that: The acquisition control unit U4, the power supply unit U5, the linear voltage stabilization unit U7 and the self-power supply unit form a first replication unit of the high-voltage chip.

3. A high-voltage chip powered communication system according to claim 2, characterized in that: It also includes a second high-voltage chip replication unit and a third high-voltage chip replication unit, and the first high-voltage chip replication unit, the second high-voltage chip replication unit and the third high-voltage chip replication unit are activated through ISOSPI.

4. The high-voltage chip powered activation communication system according to claim 2, characterized in that: The second replication unit of the high-voltage chip includes an acquisition control unit U14, a power supply unit U15, the linear voltage regulator unit U17 and a self-power supply unit, and the third replication unit of the high-voltage chip includes an acquisition control unit U24, a power supply unit U25, the linear voltage regulator unit U27 and a self-power supply unit.

5. A method for activating a communication system by powering a high-voltage chip, characterized in that: The high-voltage chip power supply activation communication system according to any one of claims 1 to 4 comprises the following steps: (1) the low-voltage CPU unit U1 is powered on, the isolated pre-power supply unit U3 is closed, a current I1 is generated, and a 6V signal is output to activate the power supply unit U5; (2) the power supply unit U5 outputs a VCC signal of 7.3V through its own linear voltage regulation to generate a current I2; (3) the VCC signal is output to the second communication power supply unit through the power supply conversion unit; (4) the second communication power supply unit is converted internally to a voltage below 5V to supply power to the isolated communication unit U2; (5) the low-voltage CPU unit U1 outputs an activation signal through the isolated communication unit U2 , activate the acquisition control unit U4, generate current 14; (6) the acquisition control unit U4 outputs an enable signal to power the power supply unit U5; (7) the main power supply of the power supply unit U5 starts to work and outputs 8V, and feeds back the internal linear voltage regulator VCC to generate current I2; (8) the linear voltage regulator unit U7 starts to work synchronously and outputs 6.5V; (9) the low-voltage CPU unit U1 disconnects the communication pre-power supply unit U3, and I1 becomes 0V; (10) the acquisition control unit U4 supplies power to the isolated communication unit U2; (11) the power conversion unit U6 enters the stop working state; (12) the high-voltage chip power supply activates the communication system to complete the power-on and perform normal communication.

6. The method for activating a communication system using a high-voltage chip as claimed in claim 5, characterized in that: In step (5), the acquisition control unit U4 activates the acquisition control unit U14 through ISOSPI, and the acquisition control unit U14 outputs an enable signal to activate the power supply unit U15. The power supply unit U15 outputs a VCC signal 7.3V through its own linear voltage regulation to the linear voltage regulation unit U17, and provides it to the acquisition control unit U14 after voltage reduction. After 3ms, the main power supply of the power supply unit U15 starts working, outputs 8V self-powered to VCC, and the internal linear voltage regulation stops. The acquisition control unit U14 starts to enter the working mode.

7. The method for activating a communication system using a high-voltage chip as claimed in claim 6, characterized in that: In step (5), the acquisition control unit U14 activates the acquisition control unit U24 through ISOSPI, and the acquisition control unit U24 outputs an enable signal to activate the power supply unit U25. The power supply unit U25 outputs a VCC signal 7.3V through its own linear voltage regulation to the linear voltage regulation unit U27, and provides it to the acquisition control unit U24 after voltage reduction. After 3ms, the main power supply of the power supply unit U25 starts working, outputs 8V self-powered to VCC, and the internal linear voltage regulation stops. The acquisition control unit U24 starts to enter the working mode.

Citation Information

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