Communication equipment

Abstract

This application provides a communication device. The communication device includes a circuit board assembly and a shielding and heat dissipation assembly. The circuit board assembly includes multiple board groups arranged sequentially along a vertical direction. The multiple board groups are electrically connected to each other. The shielding and heat dissipation housing includes a first shielding cavity, a second shielding cavity, and a first heat sink. Along the vertical direction, the circuit board assembly is located between the first shielding cavity and the second shielding cavity. The first heat sink is disposed on the side of the first shielding cavity facing away from the circuit board assembly. A first receiving space is provided within the first shielding cavity. A portion of the circuit board assembly is located within the first receiving space. A second receiving space is provided within the second shielding cavity. A portion of the circuit board assembly is located within the second receiving space. Multiple thermally conductive bumps are provided on the opposing surfaces of the first and second shielding cavities. The thermally conductive bumps are in contact with the circuit board assembly. The communication device of this application can solve the problem of large size caused by heat dissipation and radiation shielding treatment in existing communication devices.

Description

Technical Field

[0001] This application relates to the field of communication equipment technology, and specifically to a communication device. Background Technology

[0002] With the development of wireless communication technology, communication bandwidth is increasing, and consequently, operating frequencies are also rising. To improve the coverage of communication signals, the transmission power of communication equipment must also be increased. Since the efficiency of high-frequency power amplifiers is limited, higher transmission power means higher heat dissipation requirements.

[0003] In addition, communication equipment contains various functional modules for receiving and transmitting signals. These modules can generate heat and radiation during operation. Communication equipment typically undergoes radiated emission (RE) testing before being released to the market. Therefore, communication equipment must not only meet heat dissipation requirements but also provide good radiation shielding.

[0004] However, in order to improve the heat dissipation effect of communication equipment, the heat dissipation structure of communication equipment in related technologies is usually set to be large. At the same time, each functional module is equipped with a radiation shielding shell, which easily leads to a large overall size of communication equipment, making it difficult to adapt to the design requirements of compact indoor communication equipment products. Summary of the Invention

[0005] This application provides a communication device that can solve the problem of large size caused by heat dissipation and radiation shielding treatment of existing communication devices.

[0006] This application provides a communication device, which includes:

[0007] A circuit board assembly includes multiple board groups arranged sequentially along a vertical direction, with the multiple board groups electrically connected to each other;

[0008] A shielded heat dissipation assembly includes a first shielding cavity, a second shielding cavity, and a first heat sink. Vertically, a circuit board assembly is located between the first and second shielding cavities. The first heat sink is disposed on the side of the first shielding cavity facing away from the circuit board assembly. The first shielding cavity has a first receiving space, within which a portion of the circuit board assembly is located. The second shielding cavity has a second receiving space, within which a portion of the circuit board assembly is located. Multiple thermally conductive bumps are provided on the opposing surfaces of both the second and first shielding cavities, and these bumps contact the circuit board assembly.

[0009] The communication device provided in this application allows for the provision of radiation-generating modules on both sides of the circuit board assembly along the vertical direction. Therefore, a first shielding cavity and a second shielding cavity can be respectively provided on both sides of the circuit board assembly. The first shielding cavity and the second shielding cavity can be arranged opposite to each other. The radiation-generating modules on the circuit board assembly can be located within the first and second accommodating spaces to shield the radiation-generating modules on the circuit board assembly.

[0010] Thermally conductive bumps can be provided on the opposing surfaces of the first and second shielding cavities. These bumps can contact modules on the circuit board assembly that generate heat. Therefore, heat-generating modules on the side of the circuit board assembly facing the first shielding cavity can transfer heat to the surface of the first shielding cavity facing away from the circuit board assembly via the thermally conductive bumps. The surface of the first shielding cavity facing away from the circuit board has a large surface area, thus allowing the first shielding cavity to also dissipate heat from the circuit board assembly.

[0011] It is understandable that the heat-generating module on the side of the circuit board assembly facing the second shielding cavity can transfer heat to the surface of the second shielding cavity facing away from the circuit board assembly through the heat-conducting bumps on the second shielding cavity. The surface of the second shielding cavity facing away from the circuit board has a large surface area, thus the second shielding cavity can also dissipate heat from the circuit board assembly.

[0012] Furthermore, the circuit board assembly of this application may include multiple board groups. These multiple board groups can be arranged along the vertical X direction, which helps to reduce the space occupied by the communication device along the first or second direction. In summary, the communication device of this application can achieve both effective shielding and heat dissipation while also being compact in size.

[0013] According to one embodiment of this application, the first heat sink includes a first body and a plurality of first heat dissipation teeth. The first body is disposed on the surface of the first shielding cavity facing away from the circuit board assembly, and the plurality of first heat dissipation teeth are disposed on the surface of the first body facing away from the circuit board assembly. The first heat dissipation teeth extend along a first direction, and the plurality of first heat dissipation teeth are spaced apart along a second direction.

[0014] According to one embodiment of this application, a plurality of first ribs are provided on the surface of the first shielding cavity facing the circuit board assembly. The first ribs are connected to the circuit board assembly. The first shielding cavity has at least one first recess. The plurality of first ribs surround to form a plurality of first recesses. The at least one first recess is recessed in the direction away from the circuit board assembly. The inner wall of the at least one first recess is provided with a heat-conducting bump.

[0015] According to one embodiment of this application, a plurality of second ribs are provided on the surface of the second shielding cavity facing the circuit board assembly. The second ribs are connected to the circuit board assembly. The second shielding cavity has at least one second recess. The plurality of second ribs surround to form a plurality of second recesses. At least one second recess is recessed in the direction away from the circuit board assembly. A heat-conducting bump is provided on the inner wall of at least one second recess.

[0016] According to one embodiment of this application, the shielding heat dissipation assembly further includes a second heat sink, which is disposed on the side of the second shielding cavity facing away from the circuit board assembly. The second heat sink includes a second body and a plurality of second heat dissipation teeth, which are disposed on the surface of the second body facing away from the circuit board assembly. The second heat dissipation teeth extend along a first direction and are spaced apart along a second direction.

[0017] According to one embodiment of this application, the communication device further includes an air-cooling component, which is disposed corresponding to a first heat sink along a first direction, and is also disposed corresponding to a second heat sink.

[0018] According to one embodiment of this application, a first air guide channel is provided on the surface of the first shielding cavity facing away from the circuit board assembly. Along a first direction, the first air guide channel has two interconnected first ventilation openings, and the air-cooled assembly and the first heat sink are respectively provided corresponding to the two first ventilation openings; and / or...

[0019] The second shielding cavity has a second air guide channel on the surface facing away from the circuit board assembly. Along the first direction, the second air guide channel has two interconnected second vents. The air-cooled assembly and the second heat sink are respectively provided with the two second vents.

[0020] According to one embodiment of this application, the communication device includes a protective housing. In the vertical direction, the protective housing includes two opposing first housings and second housings. The first housing is disposed on the side of the first heat sink facing away from the circuit board assembly, and the second housing is disposed on the side of the second heat sink facing away from the circuit board assembly.

[0021] According to one embodiment of this application, the shielding heat dissipation assembly further includes a third heat sink, which is disposed on the side of the second shielding cavity facing away from the circuit board assembly. The third heat sink includes a third body, third heat dissipation teeth, and a third shielding cavity. In the vertical direction, the third heat dissipation teeth and the third shielding cavity are respectively disposed on both sides of the third body. The third shielding cavity is disposed on the surface of the third body facing the circuit board assembly. The third shielding cavity has a third receiving space, and the surface of the third shielding cavity facing the circuit board assembly has a plurality of heat-conducting bumps that are in contact with the circuit board assembly.

[0022] According to one embodiment of this application, a plurality of third ribs are provided on the surface of the third shielding cavity facing the circuit board assembly. The third ribs are connected to the circuit board assembly. The third shielding cavity has at least one third recess. The plurality of third ribs surround to form a plurality of third recesses. The inner wall of at least one third recess is provided with a heat-conducting bump. Attached Figure Description

[0023] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0024] Figure 1 This is a schematic diagram of the structure of a communication device according to an embodiment of this application;

[0025] Figure 2 This is a partial cross-sectional view of a communication device according to an embodiment of this application;

[0026] Figure 3 This is a schematic diagram of the integrated structure of the first shielding cavity and the first heat sink according to an embodiment of this application;

[0027] Figure 4 This is a partial structural diagram of a communication device according to an embodiment of this application;

[0028] Figure 5 This is a schematic diagram of the mechanism of the second shielding cavity according to an embodiment of this application;

[0029] Figure 6 This is a partial structural diagram of a communication device according to another embodiment of this application.

[0030] Explanation of reference numerals in the attached figures:

[0031] 100 - Communication equipment;

[0032] 110 - Circuit board assembly;

[0033] 111 - First plate group; 112 - Second plate group; 113 - Third plate group;

[0034] 120 - Shielded heat dissipation assembly;

[0035] 121 - First shielding cavity;

[0036] 1211-First recess;

[0037] 1212 - First Rib;

[0038] 122-Second shielding cavity; 122a-Second air guide channel; 122b-Second ventilation opening;

[0039] 1221-Second recess;

[0040] 1222 - Second rib;

[0041] 123 - First radiator;

[0042] 1231 - First body; 1232 - First heat dissipation tooth;

[0043] 124 - Third radiator;

[0044] 1241 - Third body; 1242 - Second heat dissipation tooth; 1243 - Third shielding cavity; 1244 - Third rib;

[0045] 130 - Air-cooled assembly;

[0046] 140 - Protective housing;

[0047] 141 - First outer shell; 142 - Second outer shell;

[0048] 200- Thermally conductive bump;

[0049] X - Vertical direction; Y - First direction; Z - Second direction.

[0050] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0051] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0052] Communication equipment contains circuit board assemblies. These assemblies can include circuit boards with multiple functions. With the development of wireless communication technology, communication bandwidth is increasing, and the operating frequency of circuit board assemblies is also increasing.

[0053] To improve the coverage of communication signals, the transmission power of communication equipment has to be increased. Since the efficiency of high-frequency power amplifiers is limited, higher transmission power means higher heat dissipation requirements.

[0054] Furthermore, the various functional modules mounted on the circuit board assembly can receive and transmit signals during operation. These modules can generate heat and radiation during operation. Communication equipment typically requires radiated emission (RE) testing before being released to the market. Therefore, communication equipment should not only meet heat dissipation requirements but also possess good radiation shielding capabilities.

[0055] In related technologies, multiple circuit boards within a circuit board assembly can be arranged in a flat layout, and a heat dissipation structure can be provided on one side surface of the circuit board assembly to achieve heat dissipation. Furthermore, a radiation-shielding shell can be provided on the exterior of each circuit board to achieve radiation shielding for the circuit board assembly.

[0056] However, the applicant found that arranging multiple circuit boards in a flat layout has limited heat dissipation for the circuit board assembly and is also detrimental to the miniaturization and portability of the overall communication equipment. Furthermore, encasing each circuit board in a radiation-shielding shell would complicate the overall structure of the communication equipment, leading to an increase in overall cost.

[0057] Based on the above problems, the embodiments of this application provide the following technical concept:

[0058] First, the applicant divides the circuit board assembly into two board groups. Each board group can contain at least one circuit board. The two board groups can be electrically connected. The two board groups can be arranged opposite each other, and a heat dissipation structure can be placed between the two board groups. The heat dissipation structure can absorb heat from both board groups and concentrate the heat between the two board groups.

[0059] The heat dissipation structure may include multiple heat dissipation fins extending in the same direction. If a fan-cooling component is provided at one end of one of the heat dissipation fins, the heat concentrated between the two boards can be blown to the outside of the communication equipment to meet the heat dissipation requirements of the circuit board assembly.

[0060] Based on the above solution, the applicant further optimized it by dividing the circuit board assembly into four board groups. The heat dissipation structure can be a cuboid structure. The four board groups can be set on the four sequentially connected outer side walls of the cuboid heat dissipation structure. The interior of the heat dissipation structure can be provided with multiple heat dissipation fins. Each of the four outer side walls can absorb the heat from the four board groups onto the heat dissipation fins inside the heat dissipation structure, thereby increasing the contact area between the circuit board assembly and the heat dissipation structure within a limited space, which is beneficial to improving heat dissipation efficiency.

[0061] Similarly, along the extension direction of the heat dissipation fins, one end of the heat dissipation fins can also be equipped with a cooling component. The cooling component can blow the heat from the heat dissipation fins to the outside of the communication device.

[0062] The applicant compared the two solutions and found that the latter had a better heat dissipation effect than the former. Therefore, while keeping the volume of the heat dissipation structure unchanged, the contact area between the circuit board assembly and the heat dissipation structure can be increased as much as possible to improve the heat dissipation effect of the circuit board assembly.

[0063] Furthermore, the circuit boards in the circuit board assembly include modules that generate radiation. In related technologies, the radiation-generating modules are usually encased in radiation-shielding shells, which can easily complicate the overall structure of the communication equipment.

[0064] Based on the aforementioned optimization of the overall size and heat dissipation of the communication equipment, the applicant has also optimized the radiation shielding structure of the communication equipment. The applicant's research found that some modules on the circuit board are prone to generating radiation during operation, and some modules are prone to generating significant heat.

[0065] Taking a circuit board assembly as an example, the circuit board has radiation-generating modules and heat-generating modules on both sides along the vertical direction. Therefore, a radiation-shielding shell can be installed on both sides of the circuit board to achieve radiation shielding. Simultaneously, heat sinks can be configured for the modules that generate significant heat. The heat sinks can make full contact with the heat-generating modules to achieve better heat dissipation for the entire communication device.

[0066] In summary, in the communication device of this application, both sides of the circuit board assembly can be provided with radiation-shielding shells along the vertical direction to shield the radiation-generating modules within the circuit board assembly. Thermally conductive bumps can be provided on the opposing surfaces of the two radiation-shielding shells. These bumps can contact the heat-generating modules on the circuit board assembly, thereby guiding the heat generated by the heat-generating modules to the opposing surfaces of the two radiation-shielding shells for heat dissipation. A heat sink can be provided on the side of one of the radiation-shielding shells facing away from the circuit board assembly. Modules in the circuit board assembly that generate significant heat can be positioned on the side with the heat sink, thereby achieving heat dissipation for the circuit board assembly.

[0067] Furthermore, the circuit board assembly of this application may include multiple board groups. These multiple board groups can be arranged vertically, which can help reduce the space occupied by the communication device along the first direction Y or the second direction Z.

[0068] The communication device 100 provided in this application will be further described below with reference to specific embodiments.

[0069] See Figures 1 to 6 As shown, the communication device 100 in this embodiment of the application includes a circuit board assembly 110 and a shielding heat dissipation assembly 120.

[0070] The circuit board assembly 110 may include multiple board groups. These multiple board groups can be arranged sequentially along the vertical direction X. The multiple board groups can be electrically connected to each other.

[0071] The shielded heat dissipation assembly 120 includes a first shielding cavity 121, a second shielding cavity 122, and a first heat sink 123. Along the vertical direction X, the circuit board assembly 110 is located between the first shielding cavity 121 and the second shielding cavity 122. The first heat sink 123 is disposed on the side of the first shielding cavity 121 facing away from the circuit board assembly 110. The first shielding cavity 121 has a first receiving space. A portion of the circuit board assembly 110 is located within the first receiving space. The second shielding cavity 122 has a second receiving space. A portion of the circuit board assembly 110 is located within the second receiving space. Multiple thermally conductive bumps 200 are provided on the opposing surfaces of the first and second shielding cavities 121 and 122. The thermally conductive bumps 200 are in contact with the circuit board assembly 110.

[0072] Along the vertical direction X, radiation-generating modules can be provided on both sides of the circuit board assembly 110 in this embodiment. Therefore, a first shielding cavity 121 and a second shielding cavity 122 can be respectively provided on both sides of the circuit board assembly 110. The first shielding cavity 121 and the second shielding cavity 122 can be arranged opposite to each other. The radiation-generating modules on the circuit board assembly 110 can be located within the first and second accommodating spaces to shield the radiation-generating modules on the circuit board assembly 110.

[0073] Thermally conductive bumps 200 can be provided on the opposing surfaces of the first shielding cavity 121 and the second shielding cavity 122. The thermally conductive bumps 200 can contact the modules on the circuit board assembly 110 that generate heat. Therefore, the heat-generating modules on the side of the circuit board assembly 110 facing the first shielding cavity 121 can transfer heat to the surface of the first shielding cavity 121 facing away from the circuit board assembly 110 through the thermally conductive bumps 200 on the first shielding cavity 121. The surface of the first shielding cavity 121 facing away from the circuit board assembly 110 has a large surface area, thus the first shielding cavity 121 can also dissipate heat from the circuit board assembly 110.

[0074] It is understood that the heat-generating module on the side of the circuit board assembly 110 facing the second shielding cavity 122 can transfer heat to the surface of the second shielding cavity 122 facing away from the circuit board assembly 110 through the heat-conducting bumps 200 on the second shielding cavity 122. The surface of the second shielding cavity 122 facing away from the circuit board assembly 110 has a large surface area, so the second shielding cavity 122 can also perform heat dissipation treatment for the circuit board assembly 110.

[0075] Furthermore, the circuit board assembly 110 of this application may include multiple board groups. These multiple board groups can be arranged along the vertical direction X, which helps to reduce the space occupied by the communication device 100 along the first direction Y or the second direction Z. In summary, the communication device 100 of this application can achieve both effective shielding and heat dissipation while also being compact in size.

[0076] The circuit board assembly 110 may include multiple circuit boards. The multiple circuit boards can be electrically connected to each other via an adapter plate.

[0077] The circuit board assembly 110 may include multiple board groups. This application describes an example where the multiple board groups can be a first board group 111, a second board group 112, and a third board group 113. Along the vertical direction X, the first board group 111 and the second board group 112 may be disposed between the first shielding cavity 121 and the second shielding cavity 122. The second board group 112 is disposed on the side of the first board group 111 facing the second shielding cavity 122. The third board group 113 is disposed on the side of the second shielding cavity 122 facing away from the circuit board assembly 110.

[0078] See also some of the possible implementation methods. Figure 2 and Figure 3 As shown, the first heat sink 123 in this embodiment includes a first body 1231 and a plurality of first heat dissipation teeth 1232. The first body 1231 is disposed on the surface of the first shielding cavity 121 facing away from the circuit board assembly 110, and the plurality of first heat dissipation teeth 1232 are disposed on the surface of the first body 1231 facing away from the circuit board assembly 110. The first heat dissipation teeth 1232 extend along a first direction Y. The plurality of first heat dissipation teeth 1232 are spaced apart along a second direction Z.

[0079] The first body 1231 can be disposed on the surface of the first shielding cavity 121 facing away from the second shielding cavity 122. The heat-generating module of the first board assembly 111 located in the first shielding cavity 121 can transfer heat to the first shielding cavity 121 through the heat-conducting bumps 200, and then to the first heat dissipation teeth 1232 through the first body 1231. The first heat dissipation teeth 1232 can increase the heat dissipation area, thereby improving the heat dissipation effect of the entire circuit board assembly 110.

[0080] In some examples, the first heat sink 123 and the first shielding cavity 121 can be an integral structure, which helps to save the space occupied by the connection between the first heat sink 123 and the first shielding cavity 121 through the connector, and can also improve the assembly efficiency of the communication device 100.

[0081] See also some of the possible implementation methods. Figure 2 and Figure 3As shown, in this embodiment of the application, the surface of the first shielding cavity 121 facing the circuit board assembly 110 is provided with a plurality of first ribs 1212. The first ribs 1212 are connected to the circuit board assembly 110. The first shielding cavity 121 has at least one first recess 1211. The plurality of first ribs 1212 may surround to form a plurality of first recesses 1211. At least one first recess 1211 is recessed in a direction away from the circuit board assembly 110. A heat-conducting bump 200 may be provided on the inner wall of at least one first recess 1211.

[0082] In some examples, the modules of the first board assembly 111 facing the first shielding cavity 121 can be distributed within multiple first recesses 1211. First ribs 1212 can be connected to the surface of the first board assembly 111 facing the first shielding cavity 121, so that the radiating modules on the first board assembly 111 can be enclosed within the first recesses 1211, thereby achieving radiation shielding for the first board assembly 111. The first ribs 1212 can also be used to support the first board assembly 111, improving the connection stability between the circuit board assembly 110 and the first shielding cavity 121. Furthermore, thermally conductive bumps 200 can be provided in the areas within the first recesses 1211 corresponding to the heat-generating modules on the first board assembly 111. The heat-generating modules contact the thermally conductive bumps 200, thereby dissipating heat from the heat-generating modules of the first board assembly 111 facing the first shielding cavity 121.

[0083] It is understandable that the dimensions of the multiple heat-conducting bumps 200 on the first shielding cavity 121 may not be exactly equal along the vertical direction X. The dimensions of the heat-conducting bumps 200 on the first shielding cavity 121 along the vertical direction X can be set according to the dimensions of the heating module of the first plate group 111 facing the first shielding cavity 121.

[0084] See also some of the possible implementation methods. Figures 2 to 5 As shown, the surface of the second shielding cavity 122 facing the circuit board assembly 110 is provided with a plurality of second ribs 1222. The second ribs 1222 are connected to the circuit board assembly 110. The second shielding cavity 122 has at least one second recess 1221. The plurality of second ribs 1222 can surround to form a plurality of second recesses 1221. At least one second recess 1221 is recessed toward the third heat sink 124. A heat-conducting bump 200 can be provided on the inner wall of at least one second recess 1221.

[0085] In some examples, the modules of the first plate group 111 and the second plate group 112 facing the second shielding cavity 122 can be distributed within multiple second recesses 1221. Second ribs 1222 can be connected to the surfaces of the first plate group 111 and the second plate group 112 facing the second shielding cavity 122, so that the radiating modules on the first plate group 111 and the second plate group 112 can be enclosed within the first recesses 1211, thereby achieving radiation shielding for some modules of the first plate group 111 and the second plate group 112. Furthermore, thermally conductive bumps 200 can be provided in the areas within the second recesses 1221 corresponding to the heat-generating modules on the first plate group 111 and the second plate group 112. The modules contact the thermally conductive bumps 200, thereby enabling heat dissipation for the heat-generating modules of the first plate group 111 and the second plate group 112 facing the second shielding cavity 122.

[0086] It is understandable that the dimensions of the multiple heat-conducting bumps 200 on the second shielding cavity 122 may not be exactly equal along the vertical direction X. The dimensions of the heat-conducting bumps 200 on the second shielding cavity 122 along the vertical direction X can be set according to the dimensions of the modules of the first plate group 111 and the second plate group 112 facing the second shielding cavity 122.

[0087] In some examples, the second shielding cavity 122, the second rib 1222, and the thermally conductive bump 200 can be an integral structure.

[0088] In some possible implementations, the shielding and heat dissipation assembly 120 of this application embodiment may further include a second heat sink (not shown in the figure). The second heat sink may be disposed on the side of the second shielding cavity 122 facing away from the circuit board assembly 110. The second heat sink includes a second body and a plurality of second heat dissipation teeth. The plurality of second heat dissipation teeth may be disposed on the surface of the second body facing away from the circuit board assembly 110. The second heat dissipation teeth extend along a first direction Y. The plurality of second heat dissipation teeth are spaced apart along a second direction Z.

[0089] The second body can be disposed on the surface of the second shielding cavity 122 facing away from the first shielding cavity 121. This increases the heat dissipation area of ​​the second shielding cavity 122, thereby improving the heat dissipation effect on the circuit board assembly 110.

[0090] In some examples, the first heat dissipation tooth 1232 and the second heat dissipation tooth can be made of metal. For example, the first heat dissipation tooth 1232 and the second heat dissipation tooth can be made of cast aluminum.

[0091] In some examples, the size of the second heat dissipation tooth can be smaller than the size of the first heat dissipation tooth 1232 along the vertical direction X.

[0092] It is understandable that the second heat sink and the second shielding cavity 122 can be an integral structure.

[0093] See also some of the possible implementation methods. Figure 2 and Figure 6 As shown, the communication device 100 in this embodiment of the application further includes an air-cooling component 130. Along the first direction Y, the air-cooling component 130 is correspondingly disposed with the first heat sink 123. The air-cooling component 130 is also correspondingly disposed with the second heat sink.

[0094] The air-cooling assembly 130 uses air as a medium to cool the circuit board assembly 110. The air-cooling assembly 130 can accelerate the flow of cold air through the first heat dissipation tooth 1232 and the second heat dissipation tooth to carry the heat from the first heat dissipation tooth 1232 and the second heat dissipation tooth to the outside of the communication device 100.

[0095] In some examples, the air-cooling assembly 130 may include at least one fan. Along the first direction Y, the fan may be positioned on one side of the first shielding cavity 121. The air-cooling assembly 130 may be configured corresponding to the first heat dissipation fin 1232 and the second heat dissipation fin.

[0096] When the air-cooled assembly 130 is in operation, cool air can be blown along the first direction Y towards the first heat dissipation fins 1232 and the second heat dissipation fins. The cool air can flow through the gaps between the multiple first heat dissipation fins 1232 to carry away the heat from the first heat dissipation fins 1232, thereby achieving heat dissipation for the circuit board assembly 110. It can be understood that the cool air can also flow through the gaps between the multiple second heat dissipation fins to carry away the heat from the second heat dissipation fins, thereby achieving heat dissipation for the circuit board assembly 110.

[0097] In some possible implementations, the surface of the first shielding cavity 121 facing away from the circuit board assembly 110 in this embodiment of the application is provided with a first air guide channel. Along the first direction Y, the first air guide channel has two interconnected first vents. The air-cooling assembly 130 and the first heat sink 123 are respectively provided corresponding to the two first vents.

[0098] The first air guide channel in this embodiment can gather the cold air released by the air-cooling component 130 so that the cold air can be transmitted to the first heat dissipation tooth 1232 through the first air guide channel. This can reduce the possibility that the cold air released by the air-cooling component 130 will disperse, causing the cold air transmitted to the first heat dissipation tooth 1232 to be lost and affecting the heat dissipation effect.

[0099] When the air-cooled component 130 is in operation, cold air can enter the first air guide channel from one of the first vents. The cold air can be gathered through the first air guide channel and blown towards the first heat dissipation tooth 1232 through another first vent, so as to carry the heat of the first heat dissipation tooth 1232 to the outside of the communication device 100.

[0100] Similarly, a second air guide channel 122a is provided on the surface of the second shielding cavity 122 facing away from the circuit board assembly 110. Along the first direction Y, the second air guide channel 122a has two interconnected second vents 122b. The air-cooling assembly 130 and the second heat sink can be respectively provided corresponding to the two second vents 122b.

[0101] The second air guide channel 122a of this application embodiment can gather the cold air released by the air-cooling component 130, so that the cold air can be transferred to the second heat dissipation tooth through the second air guide channel 122a, thereby reducing the possibility of the cold air released by the air-cooling component 130 being dispersed, resulting in the loss of cold air transferred to the second heat dissipation tooth and affecting the heat dissipation effect.

[0102] When the air-cooled component 130 is in operation, cold air can enter from a second vent 122b into a second air duct 122a. The cold air can be gathered through the second air duct 122a and blown towards the second heat dissipation fins through another second vent 122b, so as to carry the heat of the second heat dissipation fins to the outside of the communication device 100.

[0103] In some examples, the surface of the second shielding cavity 122 facing away from the first shielding cavity 121 may be recessed toward the first shielding cavity 121 to form a second air guide channel 122a. The surface of the first shielding cavity 121 facing away from the second shielding cavity 122 may be recessed toward the second shielding cavity 122 to form a first air guide channel.

[0104] See also some of the possible implementation methods. Figure 2 As shown, the communication device 100 of this application embodiment further includes a protective housing 140. Along the vertical direction X, the protective housing 140 includes two opposing first outer shells 141 and second outer shells 142. The first outer shell 141 is disposed on the side of the first heat sink 123 facing away from the circuit board assembly 110. The second outer shell 142 is disposed on the side of the second heat sink facing away from the circuit board assembly 110.

[0105] The protective housing 140 of this embodiment can be fitted over the outside of the shielded heat dissipation assembly 120. The protective housing 140 can protect the shielded heat dissipation assembly 120 and also reduce the possibility of dust accumulation on the shielded heat dissipation assembly 120.

[0106] In some examples, the second air duct 122a may have an opening in the vertical direction X facing away from the first radiator 123. The second housing 142 may close the opening. The second air duct 122a is provided with only two second vents 122b for the flow of cold air released from the air-cooled assembly 130, so that the cold air can be delivered to the second radiator more effectively.

[0107] Furthermore, multiple second heat dissipation fins can be spaced apart along the second direction Z, forming multiple heat dissipation grooves between adjacent second heat dissipation fins. The second outer casing 142 can also close the openings of the heat dissipation grooves, so that most of the cold air discharged from the second air guide channel 122a can converge in the heat dissipation grooves and dissipate the heat from the heat dissipation grooves. This helps to improve the heat dissipation efficiency of the second heat dissipation fins and reduces the possibility that the cold air discharged from the second air guide channel 122a will disperse and lose, resulting in poor heat dissipation effect.

[0108] See also some of the possible implementation methods. Figure 2 and Figure 6 As shown, the shielding heat dissipation assembly 120 may further include a third heat sink 124. The third heat sink 124 is disposed on the side of the second shielding cavity 122 facing away from the circuit board assembly 110. The third heat sink 124 includes a third body 1241, third heat dissipation teeth 1242, and a third shielding cavity 1243. In the vertical direction, the third heat dissipation teeth 1242 and the third shielding cavity 1243 are respectively disposed on both sides of the third body 1241. The third shielding cavity 1243 is disposed on the surface of the third body 1241 facing the circuit board assembly 110. The third shielding cavity 1243 has a third receiving space. A plurality of thermally conductive bumps 200 are disposed on the surface of the third shielding cavity 1243 facing the circuit board assembly 110. The thermally conductive bumps 200 are in contact with the circuit board assembly.

[0109] In some examples, when the circuit board assembly 110 includes multiple modules that generate significant heat, most of these heat-generating modules can be located inside the first shielding cavity 121 for heat dissipation via the first heat sink 123. To simplify the structure of the communication device 100, other heat-generating modules can be individually cooled. For example, the third board assembly 113 can house multiple heat-generating modules. The third heat sink 124 can be correspondingly positioned to the third board assembly 113 to dissipate heat generated by the heat-generating modules within the third board assembly 113, thereby more effectively improving the heat dissipation efficiency of the circuit board assembly 110.

[0110] In some examples, at least a portion of the heat-generating modules of the third board assembly 113 may be located inside the third shielding cavity 1243 of the third heat sink 124. Heat generated by the heat-generating modules on the third board assembly 113 can be transferred to the third shielding cavity 1243 via thermally conductive bumps 200 in contact with them, and then transferred to the third heat dissipation fins 1242 via the third body 1241. The third heat dissipation fins 1242 can increase the heat dissipation area, thereby improving the overall heat dissipation efficiency of the circuit board assembly 110.

[0111] Understandably, see Figure 6As shown, the air-cooling component 130 and the third heat sink 124 can be configured accordingly. The second air guide channel 122a can transfer the cold air generated by the air-cooling component 130 to the third heat sink 124 to achieve heat dissipation of the third plate group 113.

[0112] In some examples, the second and third heat sinks 124 can be spaced apart in the horizontal direction.

[0113] See also some of the possible implementation methods. Figure 2 As shown, the surface of the third shielding cavity 1243 facing the circuit board assembly 110 is provided with a plurality of third ribs 1244. The third ribs 1244 are connected to the circuit board assembly 110. The third shielding cavity 1243 has at least one third recess. The plurality of third ribs 1244 are arranged to form a plurality of third recesses. A heat-conducting bump is provided on the bottom wall of at least one third recess.

[0114] Along the vertical direction X, the third plate group 113 can be disposed between the third shielding cavity 1243 and the second shielding cavity 122. Therefore, the second shielding cavity 122 and the third shielding cavity 1243 can provide shielding and heat dissipation for the third plate group 113. The second shielding cavity 122 and the first shielding cavity 121 can provide shielding and heat dissipation for the first plate group 111 and the second plate group 112. The first plate group 111, the second plate group 112, and the third plate group 113 can be arranged along the vertical direction X, thereby reducing the possibility that the communication device 100 will be large due to the first plate group 111, the second plate group 112, and the third plate group 113 being laid flat along the first or second direction.

[0115] See also some of the possible implementation methods. Figure 2 As shown, the surface of the third shielding cavity 1243 facing the circuit board assembly 110 is provided with a plurality of third ribs 1244. The third ribs 1244 are connected to the circuit board assembly 110. The third shielding cavity 1243 has at least one third recess. The plurality of third ribs 1244 are arranged to form a plurality of third recesses. A thermally conductive bump 200 is provided in at least one third recess.

[0116] The third rib 1244 can enclose the radiation-generating modules on the third plate group 113 within the third recess to achieve radiation shielding of the third plate group 113. At the same time, the third rib 1244 can also be used to support the third plate group 113 to improve the connection stability between the second shielding cavity 122, the third plate group 113 and the third heat sink 124.

[0117] In some examples, the third body 1241, the third heat dissipation tooth 1242, the third shielding cavity 1243, the third rib 1244, and the heat-conducting bump 200 can be an integral structure.

[0118] Understandable, Figure 2 , Figure 4 and Figure 5 The structure of several thermally conductive bumps 200 is schematically illustrated. The cross-sectional shapes of the multiple thermally conductive bumps 200 on the first shielding cavity 121 may not be exactly the same. The cross-sectional shapes of the multiple thermally conductive bumps 200 on the second shielding cavity 122 may not be exactly the same. The cross-sectional shapes of the thermally conductive bumps 200 on the third shielding cavity 1243 may also not be exactly the same. The cross-sectional shape of the thermally conductive bumps 200 can match the shape of the module on the circuit board assembly 110. The cross-section is perpendicular to the vertical direction.

[0119] Along the vertical direction, the heights of the multiple thermally conductive bumps 200 on the first shielding cavity 121 may not be exactly the same. The heights of the multiple thermally conductive bumps 200 on the second shielding cavity 122 may not be exactly the same. The heights of the thermally conductive bumps 200 on the third shielding cavity 1243 may also not be exactly the same. The height of the thermally conductive bumps 200 can be set according to the modules on the circuit board assembly 110 so that the thermally conductive bumps 200 can contact the modules on the circuit board assembly 110.

[0120] In some examples, the circuit board in this application embodiment may be a WIFI circuit board, a 4G circuit board, a 5G circuit board, etc., and is not limited in this application.

[0121] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0122] The devices or elements referred to in the embodiments of this application or implied herein must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting the embodiments of this application. In the description of the embodiments of this application, "a plurality of" means two or more, unless otherwise precisely specified.

[0123] The terms "first," "second," "third," "fourth," etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented, for example, in orders other than those illustrated or described herein.

[0124] Furthermore, the terms “comprising” and “having”, and any variations thereof, are intended to cover non-exclusive inclusion, such that a process, method, system, product, or apparatus that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or apparatus.

[0125] The term "multiple" in this article refers to two or more. The term "and / or" in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone. Furthermore, the character " / " in this article generally indicates an "or" relationship between the preceding and following related objects; in formulas, the character " / " indicates a "division" relationship between the preceding and following related objects.

[0126] It is understood that the various numerical designations used in the embodiments of this application are merely for descriptive convenience and are not intended to limit the scope of the embodiments of this application.

[0127] It is understood that, in the embodiments of this application, the order of the above-mentioned process numbers does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

Claims

1. A communication device, characterized by The application relates to a shielding and radiating assembly. The shielding and radiating assembly comprises a circuit board assembly and a shielding and radiating assembly. The circuit board assembly comprises a plurality of board groups, which comprise a first board group, a second board group and a third board group. The first board group, the second board group and the third board group are arranged in sequence along a vertical direction.

2. The communication device of claim 1, wherein, The first board group and the second board group are located between the first shielding cavity and the second shielding cavity along the vertical direction.

3. The communication device of claim 1, wherein, The third board group is located on the side of the second shielding cavity which is away from the first shielding cavity.

4. The communication device of claim 1, wherein, The first shielding cavity is provided with a first accommodating space.

5. The communication device of claim 4, wherein, The first board group is partially located in the first accommodating space. The second shielding cavity is provided with a second accommodating space. The first board group and the second board group are partially located in the second accommodating space. The first shielding cavity and the second shielding cavity are provided with a plurality of heat-conducting protrusions on the surfaces opposite to each other. The first shielding cavity is provided with a plurality of first ribs on the surface facing the circuit board assembly. The first shielding cavity is provided with at least one first recess. The first recess is recessed in the direction away from the circuit board assembly. The second shielding cavity is provided with a plurality of second ribs on the surface facing the circuit board assembly. The second shielding cavity is provided with at least one second recess. The second recess is recessed in the direction away from the circuit board assembly. The shielding and radiating assembly further comprises a second radiator. The second radiator is provided on the side of the second shielding cavity which is away from the circuit board assembly. The second radiator comprises a second body and a plurality of second radiating teeth. The second radiating teeth extend along the first direction. The second radiating teeth are arranged in the second direction. The shielding and radiating assembly comprises an air-cooling assembly. The air-cooling assembly is arranged corresponding to the first radiator along the first direction. The air-cooling assembly is arranged corresponding to the second radiator along the first direction.

6. The communication device of claim 5, wherein, The surface of the first shielding cavity away from the circuit board assembly is provided with a first air guide channel, along the first direction, the first air guide channel has two first air vents in communication with each other, and the air cooling assembly and the first radiator are respectively arranged corresponding to the two first air vents; and / or, The surface of the second shielding cavity away from the circuit board assembly is provided with a second air guide channel, along the first direction, the second air guide channel has two second air vents in communication with each other, and the air cooling assembly and the second radiator are respectively arranged corresponding to the two second air vents.

7. The communication device of claim 5, wherein, The protection shell comprises two oppositely arranged first and second shells along the vertical direction, the first shell is arranged on the side of the first radiator away from the circuit board assembly, and the second shell is arranged on the side of the second radiator away from the circuit board assembly.

8. The communication device of claim 1, wherein, The shielding heat dissipation assembly further comprises a third radiator, the third radiator is arranged on the side of the second shielding cavity away from the circuit board assembly, the third radiator comprises a third body, third heat dissipation teeth and a third shielding cavity, along the vertical direction, the third heat dissipation teeth and the third shielding cavity are arranged on two sides of the third body respectively, the third shielding cavity is arranged on the surface of the third body facing the circuit board assembly, the third shielding cavity is provided with a third containing space, and the surface of the third shielding cavity facing the circuit board assembly is provided with a plurality of heat conduction bumps.

9. The communication device of claim 8, wherein, The surface of the third shielding cavity facing the circuit board assembly is provided with a plurality of third ribs, the third ribs are connected with the circuit board assembly, the third shielding cavity has at least one third recess, a plurality of third ribs are arranged to form a plurality of third recesses, and the inner wall of at least one third recess is provided with the heat conduction bump.

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