Foreign matter removal device and foreign matter removal method

Abstract

The present invention provides a foreign matter removal device and a foreign matter removal method, which can improve the foreign matter removal performance regardless of the structure of the structure formed on the surface of the object. In the foreign matter removal device that removes foreign matter attached to the object by using gas blown from a nozzle with a blow-out, the opening ratio of the two ends of the blow-out is smaller than the opening ratio of the central part of the blow-out.

Description

Technical Field

[0001] This invention relates to a foreign matter removal device and a foreign matter removal method. Background Technology

[0002] Patent Document 1 discloses a foreign matter removal apparatus for removing foreign matter from the surface of semiconductor substrates and insulating substrates on which transistors and wiring structures (hereinafter also referred to as structures) are formed, chips formed from the aforementioned substrates, or electronic components. The apparatus removes foreign matter adhering to the surface of a semiconductor wafer by blowing gas from above through a slit-shaped outlet of equal width. In this foreign matter removal apparatus, the foreign matter removal performance is determined by the flow rate or velocity of the gas blown from the outlet.

[0003] However, the gas blown out of the outlet and onto the surface of the semiconductor wafer by the foreign matter removal device expands radially along the surface from its blowing point in any direction with approximately the same flow rate or velocity.

[0004] Therefore, when there is a weak structure near the blowing area, the flow rate or velocity of the gas in contact with the structure needs to be reduced to a level that will not cause damage to the structure. Consequently, it has historically been necessary to reduce the flow rate or velocity of the gas blown out of the outlet in accordance with the strength of the structure, which has become a bottleneck, making it difficult to improve foreign matter removal performance.

[0005] Prior art literature

[0006] Patent Document 1: Japanese Patent Publication No. 2016-201457 Summary of the Invention

[0007] The main objective of this invention is to provide a foreign matter removal device that improves foreign matter removal performance regardless of the structure of the structure formed on the surface of the object.

[0008] The foreign matter removal device of the present invention removes foreign matter adhering to an object by using gas blown from a nozzle having a blowout. The device is characterized in that the opening ratio at both ends of the blowout is smaller than the opening ratio at the center of the blowout. Here, the opening ratio in the present invention refers to the proportion of the opening area per unit length in the direction connecting the two ends of the blowout (hereinafter also referred to as the two-end direction), with the central portion being the largest. For example, if the unit length is L, the maximum width of the blowout (the length in the direction perpendicular to the two-end direction) is W, and the opening area per unit length is S, the opening ratio can be expressed as a percentage calculated as (S / (L·W))×100.

[0009] With this structure, since the opening ratio at both ends of the nozzle is smaller than that at the center, the flow rate of gas blown from both ends is smaller compared to the center of the nozzle. Thus, compared to the flow rate or velocity of gas flowing in a direction perpendicular to the nozzle ends (hereinafter also referred to as the vertical direction) after being blown from the nozzle and onto the surface of the object, the flow rate or velocity of gas flowing in other directions (directions different from the vertical direction) can be reduced. Therefore, for example, if the structure formed on the surface of the object is particularly susceptible to damage from forces applied from a specified direction, by making the vertical direction of the nozzle different from the specified direction, even with the same blowing flow rate, the flow rate or velocity of gas contacting the structure from the specified direction can be reduced compared to existing foreign matter removal devices, making the structure less prone to damage. In other words, compared to existing foreign matter removal devices, since the flow rate or velocity of gas contacting the structure from the nozzle can be increased while maintaining a flow rate or velocity that does not cause damage to the structure, foreign matter removal performance can be improved.

[0010] Alternatively, the opening ratio may decrease continuously or stepwise from the center of the blow-out port towards both ends.

[0011] With this structure, the opening ratio of the blow-out port gradually decreases from the center to both ends, thus the flow rate of the gas blown out from the blow-out port also gradually decreases from the center to both ends. In this way, the components of the gas blown from the blow-out port onto the surface of the object cancel each other out due to the interaction of the gases flowing nearby in directions different from the perpendicular direction of the blow-out port. As a result, since the flow rate or velocity of the gas flowing in directions different from the perpendicular direction of the blow-out port after reaching the surface of the object can be minimized as much as possible, the foreign matter removal performance is further improved.

[0012] Alternatively, the nozzle may include: a nozzle body having a flow channel through which the gas flows, and a cover member having the blow-out outlet formed by partially blocking the front end of the flow channel.

[0013] With this structure, the shape of the blowhole can be determined by the cover component, making it easy to manufacture.

[0014] Furthermore, as a specific embodiment of the present invention, the blow-out port can be described as being composed of multiple opening elements divided by a baffle.

[0015] Furthermore, as a specific embodiment of the present invention, the cover component may include: a plurality of first baffles extending in a direction perpendicular to both ends of the blow-out port and arranged at equal intervals in the direction of both ends; and second baffles extending in the direction of both ends and arranged between adjacent first baffles, wherein the number of second baffles increases as the adjacent first baffles are closer to both ends of the blow-out port.

[0016] Alternatively, the object may be a semiconductor wafer with multiple structures arranged in a longitudinal and transverse pattern, wherein the structure is designed to withstand a force applied from a predetermined direction with a lower strength than the force applied from a direction other than the predetermined direction, and the nozzle is configured such that the direction perpendicular to both ends of the blow-out outlet is inconsistent with the predetermined direction.

[0017] With this structure, because the vertical direction of the blow-out outlet is not the same as the designated direction, the gas flowing in the vertical direction from the blow-out outlet to the surface of the semiconductor wafer will not flow in the designated direction after being blown out from the blow-out outlet. In this way, even with the same blowing flow rate, compared with existing foreign matter removal devices, the flow rate or velocity of the gas blowing out from the blow-out outlet can be increased while maintaining the flow rate or velocity of the gas contacting the structure from the designated direction to a level that will not cause damage to the structure, thus improving the foreign matter removal performance.

[0018] Furthermore, as a specific embodiment of the present invention, it can be cited that the structure is a structure in which the strength of a force applied from an inclined direction relative to its arrangement direction is lower than the strength of a force applied from a direction different from the inclined direction, and the nozzle is arranged in such a way that the direction perpendicular to both ends of the blow-out outlet is inconsistent with the inclined direction.

[0019] In addition, it may also include a moving mechanism that moves the object relative to the nozzle.

[0020] With this structure, since the object can move relative to the nozzle, the nozzle outlet can be positioned above the object regardless of its location on the object's surface, making it easy to remove foreign objects.

[0021] Furthermore, the foreign matter removal method of the present invention utilizes gas blown from a nozzle having a blowout outlet to remove foreign matter adhering to the surface of an object on which multiple structures are arranged in a longitudinal and transverse pattern. The foreign matter removal method is characterized in that the structure is a structure for which the strength of a force applied from a predetermined direction is lower than the strength of a force applied from a direction other than the predetermined direction, the opening ratio at both ends of the blowout outlet is smaller than the opening ratio at the center of the blowout outlet, and the nozzle is configured such that the direction perpendicular to both ends of the blowout outlet is inconsistent with the predetermined direction.

[0022] With this structure, since the directions at both ends of the blowout outlet, where the opening ratio at both ends is smaller than that at the center, are not aligned with the designated direction, the flow rate or velocity of the gas flowing in the designated direction can be reduced compared to the gas flowing perpendicular to the blowout outlet after being blown onto the surface of the object. Therefore, even with the same blowing flow rate, compared to existing foreign matter removal devices, the flow rate or velocity of the gas contacting the structure from the designated direction can be reduced, making the structure less prone to damage. In other words, compared to existing foreign matter removal devices, the flow rate or velocity of the gas blowing out of the blowout outlet can be increased while maintaining the flow rate or velocity of the gas contacting the structure from the designated direction to a level that will not cause damage to the structure, thus improving foreign matter removal performance.

[0023] Foreign object removal devices with this structure can improve foreign object removal performance regardless of the structure formed on the surface of the object. Attached Figure Description

[0024] Figure 1 This is a schematic diagram showing the overall structure of the foreign matter inspection and removal device according to the first embodiment.

[0025] Figure 2 This is a schematic diagram illustrating the foreign object inspection device according to the first embodiment.

[0026] Figure 3 This is a schematic diagram illustrating the foreign matter removal device according to the first embodiment.

[0027] Figure 4 This is a schematic diagram illustrating the foreign matter removal device according to the first embodiment.

[0028] Figure 5 This is a schematic diagram showing the enlarged blow-out port of the nozzle in the first embodiment.

[0029] Figure 6 This is a functional block diagram showing the control unit of the first embodiment.

[0030] Figure 7 This is a schematic diagram showing an enlarged view of the nozzle outlet of another embodiment.

[0031] Explanation of reference numerals in the attached figures

[0032] 100 Foreign Object Inspection and Removal Device

[0033] W substrate (object)

[0034] W1 surface

[0035] T-structure

[0036] D. Inclination direction (specified direction)

[0037] M1 Foreign Object Inspection Device

[0038] M2 Foreign Object Removal Device

[0039] N nozzle

[0040] 30 Nozzle Body

[0041] 34 blowout

[0042] 34h opening element

[0043] 34x Central Department

[0044] 34y at both ends

[0045] α directions at both ends

[0046] 40-cover component

[0047] 41 First baffle

[0048] 42 Second baffle Detailed Implementation

[0049] The foreign matter removal apparatus of the present invention will now be described with reference to the accompanying drawings.

[0050] The foreign matter removal apparatus of the present invention is used, for example, as a component of a foreign matter inspection and removal apparatus. This foreign matter inspection and removal apparatus, for example, inspects and removes foreign matter adhering to the surface W1 of a semiconductor substrate W (e.g., a Si wafer, a SiC wafer, etc.) formed by arranging multiple structures (e.g., transistors, wiring, etc.) in a longitudinal and transverse manner. Furthermore, the foreign matter inspection and removal apparatus is not limited to semiconductor substrates; it can also be used for components with structures on their surfaces that are easily damaged by forces applied from a predetermined direction. For example, it can also be used for insulating substrates (e.g., sapphire substrates), chips (e.g., MEMS, sensor elements, SAW devices, etc.) cut from the aforementioned substrates, or electronic components (e.g., HDD elements, etc.). Additionally, the foreign matter removal apparatus can also be used independently.

[0051] (First Embodiment) The foreign matter inspection and removal apparatus 100 of this embodiment is used to remove foreign matter attached to the surface W1 of the substrate W, which is the object to be inspected and removed, such as... Figure 1 As shown, the device includes a foreign object inspection device M1, a foreign object removal device M2, and a control unit C. The foreign object inspection device M1 and the foreign object removal device M2 are arranged side by side, and the substrate W can be transferred using a conveying mechanism (not shown).

[0052] The following, such as Figure 4As shown, the case where the substrate W is disk-shaped and has an oriented plane F (hereinafter also referred to as the oriented plane F) formed by cutting off a portion of its outer periphery in a straight line will be described. Furthermore, on the surface W1 of the substrate W, a plurality of structures T are arranged in a transverse and longitudinal configuration, with the direction of extension of the oriented plane F as the transverse direction and the direction perpendicular to this extension direction as the longitudinal direction. The structures T have a structure such that the intensity of a force applied from an inclined direction D along the direction of the surface W1 of the substrate W and relative to its arrangement direction is lower than the intensity of a force applied from other directions (directions different from the inclined direction D). Therefore, this inclined direction D corresponds to a predetermined direction.

[0053] The foreign object inspection device M1 is a light scattering device used to obtain information about the presence, size, and location of foreign objects attached to the surface W1 of the substrate W. Specifically, the foreign object inspection device M1 is as follows: Figure 2 As shown, it includes: an inspection stage 10 for carrying a substrate W; a light irradiation unit 11 for irradiating and scanning the surface W1 of the substrate W carried on the inspection stage 10 with inspection light; and a light detection unit 12 for detecting reflected and scattered light from the surface W1 of the substrate W irradiated with inspection light.

[0054] The foreign matter removal device M2 blows away foreign matter adhering to the surface W1 of the substrate W with gas, and removes it by attracting the blown-away foreign matter. Specifically, the foreign matter removal device M2 is as follows: Figure 3 and Figure 4 As shown, the device includes a removal stage 20 for carrying the substrate W, and a nozzle N disposed opposite to the substrate W carried on the removal stage 20. The gas used is, for example, air, an inert gas, or a gas mixed with droplets.

[0055] The removal moving stage 20 can move in the X, Y, and Z directions, causing the substrate W to move relative to the nozzle N. Therefore, the removal moving stage 20 is equivalent to a moving mechanism.

[0056] On the removal moving stage 20, the substrate W is positioned and supported in a manner that the arrangement direction of the plurality of structures T is inclined relative to the X and Y directions. That is, on the removal moving stage 20, the substrate W is positioned and supported in a manner that the extension direction of the orientation plane F is inclined relative to the X and Y directions. Thus, on the removal moving stage 20, the substrate W is supported in a manner that the structurally weaker direction of the structure T, i.e., the tilting direction D, is parallel to the moving direction (specifically the Y direction) of the removal moving stage 20.

[0057] The nozzle N has a nozzle body 30 and a cover component 40.

[0058] The nozzle body 30 has an outflow channel 31 through which gas blown outwards flows, and a pair of inflow channels 32 through which gas drawn inwards flows. In addition, the nozzle body 30 has an outlet 34 formed at the front end of the outflow channel 31 and an inlet 35 formed at the front end of the inflow channel 32 on the surface 33 opposite to the surface W1 of the substrate W carried on the removal moving stage 20.

[0059] A blower 50, located outside the foreign object removal device M2, is connected via a pipe P to the other end of the blow-out channel 31 opposite to the front end where the blow-out port 34 is formed. Furthermore, a suction machine 60, located outside the foreign object removal device M2, is connected via a pipe P to the other end of the suction channel 32 opposite to the front end where the suction port 35 is formed.

[0060] like Figure 5 As shown, the blow-out port 34 is elongated rectangular. Specifically, the blow-out port 34 is formed by partially blocking the front end of the blow-out channel 31 by the cover member 40, and is composed of multiple opening elements 34h. Moreover, the opening ratio of the blow-out port 34 is smaller at both ends 34y than at the center 34x. Specifically, the opening ratio of the blow-out port 34 decreases in a stepwise manner from the center 34x to both ends. In addition, the nozzle N is arranged in a direction perpendicular to the direction connecting the two ends of the blow-out port 34 (hereinafter, the direction of the two ends α) that is not consistent with the structurally weaker direction, i.e., the tilting direction D, of the structure T formed on the substrate W removed from the moving stage 20 (see reference). Figure 4 In this embodiment, the nozzle N is configured such that the two ends of the blow outlet 34 are aligned with the tilting direction D.

[0061] The multiple opening elements 34h provided on the central portion 34x all have the same opening area and are arranged at equal intervals along the two ends of the blow-out port 34 in the direction α. ​​Therefore, the opening ratio of the central portion 34x of the blow-out port 34 is the same along the two ends of the blow-out port 34 in the direction α.

[0062] Among the plurality of opening elements 34h provided on the two ends 34y, the number of opening elements 34h with the same opening area arranged in the direction perpendicular to the two ends α of the blow-out port 34 increases towards the two ends of the blow-out port 34. Furthermore, the opening area of ​​the opening element 34h decreases closer to the two ends of the blow-out port 34. Moreover, the total opening area of ​​the plurality of opening elements 34h arranged in the direction perpendicular to the two ends α of the blow-out port 34 decreases towards the two ends. Specifically, this total decreases at the same rate of change towards both ends. Therefore, the opening ratio of the two ends 34y of the blow-out port 34 decreases at the same rate of change from the central portion 34x side of the blow-out port 34 towards both ends.

[0063] Furthermore, the plurality of opening elements 34h are arranged symmetrically with respect to the central direction α of the two ends of the blowhole 34, and also symmetrically with respect to the direction perpendicular to the central direction α of the two ends of the blowhole 34. Therefore, the lengths of the central direction α of the two ends 34y of the blowhole 34 are the same. In addition, the lengths of the central direction α of the two ends 34y of the blowhole 34 are both shorter than the lengths of the central portion 34x in the central direction.

[0064] The two intake ports 35 are arranged such that their long sides align with the directions α at both ends of the outlet 34, and are formed on both sides of the outlet 34. Furthermore, both intake ports 35 are formed at positions that are separated from the outlet 34 by only the same distance.

[0065] The cover member 40 has a plurality of baffles 41, 42, which partially block the original air outlet 36, which is a slit of the same width formed at the front end of the air outlet channel 31, to form an air outlet 34. Specifically, the cover member 40 includes: a first baffle 41, which, when positioned at the front end of the air outlet channel 31, is spaced apart from each other at both ends of the air outlet 34 and extends in a direction perpendicular to the two ends (the width direction of the air outlet 34); and a second baffle 42, which is disposed between adjacent first baffles 41 and extends in the two ends. Furthermore, the first baffles 41 are equally spaced at both ends of the air outlet 34. Moreover, the number of second baffles 42 increases as they approach the two ends of the air outlet 34. In addition, the cover member 40 has a plurality of opening elements 34h formed by dividing the original air outlet 36 by the baffles 41, 42 to constitute the air outlet 34.

[0066] The control unit C is a so-called computer that controls the foreign object inspection device M1 and the foreign object removal device M2 by connecting to them. Specifically, the control unit C includes a CPU, internal memory, external memory, input / output interface, AD converter, etc., and operates the CPU and its peripheral devices according to programs stored in designated areas of the internal or external memory, such as... Figure 6 As shown, it functions as a foreign object inspection control unit C1, a foreign object information calculation unit C2, and a foreign object removal control unit C3.

[0067] The foreign object inspection control unit C1 outputs control signals to the inspection moving stage 10 and the light irradiation unit 11, controlling the inspection moving stage 10 to move in a specified direction at a certain speed during inspection, and coordinating this movement to control the scanning of inspection light performed by the light irradiation unit 11.

[0068] The foreign object information calculation unit C2 receives control signals output to the inspection moving stage 10 and the light irradiation unit 11 from the foreign object inspection control unit C1, and calculates irradiation position data representing the light irradiation position on the surface W1 of the substrate W based on the control signals. Furthermore, the foreign object information calculation unit C2 receives light intensity signals of reflected and scattered light when inspection light is irradiated to the light irradiation position indicated by the irradiation position data from the light detection unit 12, and calculates foreign object information on the surface W1 of the substrate W based on the irradiation position data and the light intensity signal. The foreign object information includes the presence or absence of foreign objects on the surface W1 of the substrate W, the size of the foreign object, and its location.

[0069] The foreign object removal control unit C3 receives foreign object information data representing foreign object information from the foreign object information calculation unit C2, and controls the fan 50, the suction machine 60, and the removal moving stage 20 based on the foreign object information data. Specifically, the foreign object removal control unit C3 determines whether the foreign object attached to the surface W1 of the substrate W is equivalent to the object to be removed based on the foreign object information data. If it is determined to be equivalent to the object to be removed, it controls the removal moving stage 20 to move the blow-out port 34 relative to the substrate W, controls the fan 50 to blow the gas blown out from the blow-out port 34 towards the substrate W to blow away the attached foreign object, and controls the suction machine 60 to suck away the blown-away foreign object from the suction port 45.

[0070] Next, the operation of the foreign matter inspection and removal device 100 of this embodiment will be explained.

[0071] First, the substrate W is placed on the inspection stage 10 of the foreign object inspection device M1.

[0072] Next, the foreign object inspection control unit C1 controls the inspection moving stage 10 and the light irradiation unit 11 to irradiate the entire surface W1 of the substrate W with inspection light and perform scanning. Furthermore, during this scanning, the foreign object information calculation unit C2 receives the control signal from the foreign object inspection control unit C1 and the light intensity signal detected by the light detection unit 12, and calculates the foreign object information on the surface W1 of the substrate W.

[0073] Next, the substrate W carried on the inspection moving stage 10 is transferred to the removal moving stage 20 by the transfer mechanism. In addition, the substrate W transferred to the removal moving stage 20 by the transfer mechanism is positioned on the removal moving stage 20 in a manner that the arrangement direction of the structure T is tilted relative to the movement direction of the removal moving stage 20, that is, in the X and Y directions.

[0074] Next, the foreign object removal control unit C3 receives foreign object information data from the foreign object information calculation unit C2, determines whether the foreign object is a target for removal, and if it is, removes it by controlling the blower 50, the suction machine 60, and the removal moving stage 20 to blow gas onto the surface W1 of the substrate W. Specifically, the foreign object removal control unit C3 removes the foreign object by moving the blowout 34 relative to the substrate W in a zigzag pattern. More specifically, the foreign object removal control unit C3 alternately repeats the actions of moving the blowout 34 relative to the substrate W in the X direction while blowing gas from the blowout 34 onto the substrate W to remove the foreign object, and the actions of moving the blowout 34 relative to the substrate W in the Y direction, thereby removing foreign objects from the entire surface W1 of the substrate W. In this way, the nozzle N moves relative to the substrate W while keeping the two ends of the blowout 34 parallel to the weaker structural direction of the structure T, i.e., the tilt direction D.

[0075] Subsequently, the substrate W, carried on the removal moving stage 20, is again moved by the transfer mechanism to the inspection moving stage 10, where the foreign matter inspection device M1 checks whether the foreign matter attached to the surface W1 of the substrate W has been removed. Furthermore, by repeating this series of inspection and removal operations multiple times, the reliability of foreign matter removal can be improved.

[0076] With this structure, since the opening ratio of the slit-shaped blow-out port 34 gradually decreases from the central portion 34x towards both ends, the flow rate of the gas blown out from the opening element 34h of the blow-out port 34 gradually decreases from the central portion 34x towards both ends. Thus, compared to the flow rate or velocity of the gas flowing in directions perpendicular to the two ends of the blow-out port 34 after being blown from the blow-out port 34 onto the surface W1 of the substrate W, the flow rate or velocity of the gas flowing in other directions can be minimized. Therefore, as long as the direction of the nozzle N perpendicular to the two ends of the blow-out port 34 is not aligned with the structurally weaker direction of the structure T, i.e., the inclined direction D, even with the same blow-out flow rate, compared to existing foreign matter removal devices, the flow rate or velocity of the gas contacting the structure T from a predetermined direction can be reduced, making the structure less prone to damage. In other words, compared to existing foreign matter removal devices, since the flow rate or velocity of the gas contacting the structure T from the inclined direction D can be increased while maintaining a level that does not cause damage to the structure T, foreign matter removal performance can be improved.

[0077] (Other embodiments) The blow-out port may be composed of multiple opening elements or a single opening element. Furthermore, the opening element of the blow-out port may be formed by a cover member, or it may be formed by the front end of the blow-out channel. That is, it may also be formed on the nozzle body itself.

[0078] Furthermore, the nozzle can also be a non-elongated shape, such as a square or a circle. Moreover, in an elongated nozzle, the opening ratio at both ends in the width direction can be smaller than the opening ratio at the center.

[0079] In addition, such as Figure 7 As shown, the blow-out port 34 may also have an opening element 34h, which tapers towards both ends. In this way, the opening ratio continuously decreases from the central portion 34x of the blow-out port 34 towards both ends.

[0080] Furthermore, the opening element of the blow-out outlet can also be asymmetrical in either or both of the directions of the center of the outlet relative to the two ends or the center of the outlet perpendicular to the two ends.

[0081] Furthermore, the outlet can also have both ends having the same length in the direction of their ends as or longer than the length of the central end having its ends in the direction of their ends. Moreover, the lengths of the two ends in the direction of their ends can be different from each other.

[0082] In addition, the nozzle may not have an intake port.

[0083] Furthermore, the foreign object removal device may move with a nozzle instead of a removal platform, or it may move with both a removal platform and a nozzle.

[0084] Furthermore, the foreign object inspection device can also be a transmission type. In this case, it is sufficient to place either the light irradiation unit or the light detection unit on the surface side of the substrate and the other on the back side of the substrate, and use the light detection unit to detect the light that is irradiated from the light irradiation unit onto the surface of the substrate and passes through the substrate.

[0085] Furthermore, when it is determined from the foreign object information data that the foreign object attached to the surface of the substrate is equivalent to the object to be removed, the foreign object removal control unit moves the blow-out port directly above the location where the foreign object on the substrate is detected, and then blows the gas blown from the blow-out port onto the substrate to remove the foreign object.

[0086] Furthermore, the present invention is not limited to the embodiments described herein, and various modifications can be implemented without departing from its inventive concept.

[0087] Industrial applicability

[0088] According to the present invention, a foreign matter removal device is provided that has sufficient foreign matter removal performance regardless of the structure of the structure formed on the surface of the object.

Claims

1. A foreign matter removal device that removes foreign matter adhering to an object by means of gas blown from a nozzle having a blowout outlet, characterized in that, The blow-out port is composed of a plurality of opening elements spaced apart along both ends of the blow-out port. The opening area of ​​the opening element located at both ends of the blow-out outlet is smaller than the opening area of ​​the opening element located at the center of the blow-out outlet. The opening ratio at both ends of the blow-out outlet is smaller than the opening ratio at the center of the blow-out outlet.

2. The foreign matter removal device according to claim 1, characterized in that, The opening ratio decreases continuously or stepwise from the center of the blow-out port towards both ends.

3. The foreign matter removal device according to claim 1 or 2, characterized in that, The nozzle comprises: a nozzle body having a flow channel through which the gas flows, and a cover member having the blow-out outlet formed by partially blocking the front end of the flow channel.

4. The foreign matter removal device according to claim 3, characterized in that, The blow-out port is composed of multiple opening elements divided by baffles.

5. The foreign matter removal device according to claim 4, characterized in that, The cover component includes: a plurality of first baffles extending in a direction perpendicular to both ends of the blow-out port and evenly spaced in the direction of both ends; and second baffles extending in the direction of both ends and disposed between adjacent first baffles. The number of second baffles increases between adjacent first baffles that are closer to both ends of the outlet.

6. The foreign matter removal device according to claim 1 or 2, characterized in that, The object in question is a semiconductor wafer with multiple structures arranged in a vertical and horizontal pattern. The structure is one in which the strength of a force applied from a specified direction is lower than the strength of a force applied from a direction other than the specified direction. The nozzle is configured such that the direction perpendicular to both ends of the blow outlet is inconsistent with the specified direction.

7. The foreign matter removal device according to claim 6, characterized in that, The structure is one in which the strength of a force applied from an inclined direction relative to its orientation is lower than the strength of a force applied from a direction other than the inclined direction. The nozzle is configured such that the direction perpendicular to both ends of the blow outlet is not the same as the tilt direction.

8. The foreign matter removal device according to claim 1 or 2, characterized in that, It also includes a moving mechanism that allows the object to move relative to the nozzle.

9. A foreign matter removal device that removes foreign matter adhering to an object by means of gas blown from a nozzle having a blowout outlet, characterized in that, The opening ratio at both ends of the blow-out outlet is smaller than the opening ratio at the center of the blow-out outlet. The nozzle comprises: a nozzle body having a flow channel through which the gas flows, and a cover member having the blow-out outlet formed by partially blocking the front end of the flow channel. The blow-out port is composed of multiple opening elements divided by baffles. The cover component includes: a plurality of first baffles extending in a direction perpendicular to both ends of the blow-out port and evenly spaced in the direction of both ends; and second baffles extending in the direction of both ends and disposed between adjacent first baffles. The number of second baffles increases between adjacent first baffles that are closer to both ends of the outlet.

10. A foreign matter removal device that removes foreign matter adhering to an object by means of gas blown from a nozzle having a blowout outlet, characterized in that, The opening ratio at both ends of the blow-out outlet is smaller than the opening ratio at the center of the blow-out outlet. The object in question is a semiconductor wafer with multiple structures arranged in a vertical and horizontal pattern. The structure is one in which the strength of a force applied from a specified direction is lower than the strength of a force applied from a direction other than the specified direction. The nozzle is configured such that the direction perpendicular to both ends of the blow outlet is inconsistent with the specified direction.

11. A method for removing foreign matter, comprising using gas blown from a nozzle having an outlet to remove foreign matter adhering to the surface of an object in a longitudinally and transversely arranged plurality of structures, characterized in that, The structure is one in which the strength of a force applied from a specified direction is lower than the strength of a force applied from a direction other than the specified direction. The blow-out port is composed of a plurality of opening elements spaced apart along both ends of the blow-out port. The opening area of ​​the opening element located at both ends of the blow-out outlet is smaller than the opening area of ​​the opening element located at the center of the blow-out outlet. The opening ratio at both ends of the blow-out outlet is smaller than the opening ratio at the center of the blow-out outlet. The nozzle is configured such that the direction perpendicular to both ends of the blow outlet is inconsistent with the specified direction.

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