A buffer plate, a display device including the same, and a method of manufacturing the same

Abstract

A buffer plate, a display apparatus including the same, and a method of manufacturing the same. A display apparatus includes a display panel displaying an image and a buffer plate disposed below the display panel. The buffer plate has an adhesive member and a porous member including a main portion region and a side portion region disposed along a side of the main portion region. A thickness of the side portion region is less than a thickness of the main portion region. A porosity of the side portion region is lower than a porosity of the main portion region.

Description

Technical Field

[0001] This disclosure relates to a buffer plate with increased stiffness and reduced thickness, a method for manufacturing the buffer plate, and a display device including the buffer plate. Background Technology

[0002] Display devices come in many forms, such as televisions, monitors, smartphones, tablet PCs, laptops, and wearable devices.

[0003] Typically, a display device includes a display area for displaying images and a non-display area formed along the outer edge of the display area.

[0004] In display devices, the non-display area is also known as the bezel area. When the bezel area is thick, the user's gaze is scattered. When the bezel area is thin, the user's gaze can be fixed on the display area. Therefore, it can improve the user's immersive experience.

[0005] In other words, as the bezel area becomes thinner, the overall size of the display device can be reduced while enhancing the user's immersive experience. Therefore, consumer demand for display devices with the smallest possible bezel area is increasing. Summary of the Invention

[0006] As user demand for portable display devices increases, so does the need to develop thinner display devices with greater rigidity.

[0007] There are several methods to test the stiffness of a display device.

[0008] For example, push stiffness can be an important factor when continuous pressure is applied to a display device during touch or gripping. Typical tests for push stiffness may include measuring continuous pressure, such as the force required to continuously press down on the display device.

[0009] Impact stiffness is an important factor when a display device is dropped from a height or subjected to a momentary impact. Momentary impact stiffness can be measured using a drop ball test, in which an iron ball is dropped freely from a predetermined height onto the display device.

[0010] Furthermore, impacts often concentrate on the side edges surrounding the internal area of ​​the display device. Therefore, the stiffness of the internal area of ​​the display device is important. Additionally, the stiffness of the side edges surrounding the internal area can be crucial.

[0011] Therefore, the inventors of this disclosure have invented a buffer plate with increased stiffness and reduced thickness not only in the internal region but also in the side edge portion, a method for manufacturing the buffer plate, and a display device including the buffer plate.

[0012] One objective of this disclosure is to provide a shock absorber with improved impact stiffness and a display device including the shock absorber.

[0013] One object of this disclosure is to provide a buffer plate and a display device including the buffer plate, said buffer plate having increased pressing stiffness in its internal region and side edge portions, while having reduced thickness.

[0014] One object of this disclosure is to provide a method for manufacturing a buffer plate having increased impact stiffness and compressive stiffness, and having reduced thickness.

[0015] The purpose of this disclosure is not limited to the objectives described above. Other objectives and advantages not mentioned in this disclosure may be understood based on the following description and may be more clearly understood based on aspects of this disclosure. Furthermore, it will be readily understood that the objectives and advantages of this disclosure can be achieved using the means and combinations thereof as shown in the claims.

[0016] To achieve these and other advantages and in accordance with the purposes of this disclosure, as embodied and broadly described herein, a display device includes: a display panel for displaying images; a buffer plate disposed below the display panel, the buffer plate having an adhesive member; and a porous member comprising a main body portion region and a side portion region disposed along the side of the main body portion region, wherein the thickness of the side portion region is less than the thickness of the main body portion region, and wherein the porosity of the side portion region is lower than the porosity of the main body portion region.

[0017] In another aspect of this disclosure, the buffer plate includes: an adhesive member; and a porous member disposed on the adhesive member, the porous member including a conductive metal and a plurality of holes disposed within the conductive metal, and having a main body region and a side region disposed along the side of the main body region, wherein the thickness of the side region is less than the thickness of the main body region, and wherein the porosity of the side region is lower than the porosity of the main body region.

[0018] In another aspect of this disclosure, a method for manufacturing a buffer plate is provided, the method comprising the steps of: forming a porous member including a conductive metal and a plurality of holes disposed within the conductive metal; subjecting the porous member to a first compression to form a first compressed porous member; and subjecting the first compressed porous member to a second compression while laminating the first compressed porous member to an adhesive member.

[0019] According to an exemplary embodiment of this disclosure, the porous member included in the buffer plate may include a conductive metal and a plurality of holes disposed within the conductive metal, thereby increasing the impact stiffness of each of the buffer plate and the display device including the buffer plate.

[0020] Furthermore, according to an exemplary embodiment of this disclosure, the thickness of the side region of the porous member included in the buffer plate can be less than the thickness of the main body region, and the porosity of the side region can be lower than the porosity of the main body region. Therefore, the buffer plate can have a reduced thickness and simultaneously improve the pressing stiffness not only in the internal region of the buffer plate but also in its side edge portions.

[0021] Furthermore, according to an exemplary embodiment of this disclosure, after the porous member is first compressed, the porosity of the first compressed porous member can be reduced by a second compression, while the first compressed porous member is laminated to the adhesive member. Therefore, a buffer plate with improved impact and compression stiffness and a thinner thickness can be manufactured.

[0022] The effects of this disclosure are not limited to those described above, and those skilled in the art will clearly understand from the following description other effects not mentioned.

[0023] It should be understood that the above overview and the following detailed description of this disclosure are merely illustrative and intended to provide further explanation of the claimed inventive concept. Attached Figure Description

[0024] The accompanying drawings are included to provide a further understanding of the present disclosure and are incorporated in and constitute a part of this application. The drawings illustrate embodiments of the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0025] Figure 1A and Figure 1C The front and back sides of a display device according to an exemplary embodiment of this disclosure are shown respectively. Figure 1B The back of the display device with its casing removed is shown.

[0026] Figure 2 A display device according to an exemplary embodiment of the present disclosure, such as Figure 1A The cross-sectional view along the I-I' direction is shown in the figure.

[0027] Figure 3 This is an enlarged cross-sectional view of a porous component according to an exemplary embodiment of the present disclosure.

[0028] Figure 4 This is a cross-sectional view of a buffer plate according to an exemplary embodiment of the present disclosure.

[0029] Figure 5 This is a cross-sectional view of a buffer plate according to another exemplary embodiment of the present disclosure.

[0030] Figure 6 This is a cross-sectional view of a buffer plate according to yet another exemplary embodiment of the present disclosure.

[0031] Figure 7 A display device according to an exemplary embodiment of the present disclosure, such as Figure 1A The cross-sectional view in the II-II' direction shown.

[0032] Figures 8A to 8D The manufacturing process of a buffer plate according to an exemplary embodiment of the present disclosure is shown.

[0033] Figures 9A to 9D These are micrographs showing the difference in thickness between the porous component before and after compression. Detailed Implementation

[0034] Reference will now be made in detail to some examples and embodiments of this disclosure as illustrated in the accompanying drawings. Where possible, the same reference numerals will be used throughout the drawings to refer to the same or similar parts.

[0035] The advantages and features of this disclosure, as well as methods for achieving these advantages and features, will become apparent from the exemplary embodiments described in detail herein and the accompanying drawings. This disclosure should not be construed as limited to the exemplary embodiments disclosed below, and may be implemented in various different forms. Therefore, these exemplary embodiments are set forth merely to make this disclosure sufficiently complete and to assist those skilled in the art in fully understanding the scope of this disclosure. The scope of protection of this disclosure is defined by the claims and their equivalents.

[0036] The shapes, dimensions, ratios, angles, quantities, etc., shown in the accompanying drawings to describe various exemplary embodiments of this disclosure are given by way of example only. Therefore, this disclosure is not limited to the illustrations in the drawings. Unless otherwise stated, identical or similar elements are represented by the same reference numerals throughout the specification. Furthermore, detailed descriptions of relevant known steps and elements may be omitted where such descriptions might unnecessarily obscure the essential points of this disclosure. Moreover, in the following detailed description of this disclosure, numerous specific details are set forth in order to provide a sufficiently thorough understanding of this disclosure. However, it is to be understood that this disclosure can be implemented without these specific details. In other instances, known methods, procedures, components, and circuits are not described in detail to avoid unnecessarily obscuring aspects of this disclosure.

[0037] The terminology used herein is descriptive of a particular aspect and is not intended to limit this disclosure. As used herein, the terms “a” and “an” used to describe elements in the singular form are intended to include multiple elements. Unless the context clearly indicates otherwise, elements described in the singular form are intended to include multiple elements, and vice versa.

[0038] In this specification, one or more additional elements may be added where terms such as “comprising,” “having,” or “including” are used, unless a term such as “only” is used. As used herein, the term “and / or” includes a single associated listed item and any and all combinations of two or more associated listed items. Expressions such as “at least one” may modify the entire list of elements when placed before an element in a list, but may not modify any individual element in the list. The term “at least one” should be understood to include any and all combinations of one or more associated listed items. For example, “at least one of the first, second, and third elements” means a combination of all three listed elements, a combination of any two of the three elements, and each individual element, the first element, the second element, and the third element.

[0039] When interpreting a component or value, it should be interpreted to include a range of errors or tolerances, even if no explicit description of such a range of errors or tolerances is provided.

[0040] Furthermore, it should be understood that when it is stated that a first element or layer exists "on" a second element or layer, the first element may be directly disposed on the second element or indirectly disposed on the second element, and a third element or layer may be disposed between the first element or layer and the second element or layer. It should be understood that when it is stated that an element or layer is "connected" or "linked" to another element or layer, the element or layer may be directly connected or linked to the other element or layer, or there may be one or more intermediate elements or layers. Furthermore, it will be further understood that when it is stated that an element or layer is "between" two elements or layers, there may be a single element or layer existing between the two elements or layers, or there may be one or more intermediate elements. In the description of various embodiments of this disclosure, when describing positional relationships, for example, the positional relationship between two components is described using terms such as "on," "above," "below," "over," "below," "beside," "near," etc., unless more restrictive terms such as "immediately," "directly," or "adjacent" are used, one or more other components may be located between two components.

[0041] Furthermore, as used herein, when a layer, membrane, region, plate, etc., can be disposed "above" or "on top" another layer, membrane, region, plate, etc., the layer, membrane, region, plate, etc., can directly contact the other layer, membrane, region, plate, etc., or other layers, membranes, regions, plates, etc., can be disposed between the layer, membrane, region, plate, etc. and the other layer, membrane, region, plate, etc. As used herein, when a layer, membrane, region, plate, etc., is directly disposed "above" or "on top" another layer, membrane, region, plate, etc., the layer, membrane, region, plate, etc., directly contacts the other layer, membrane, region, plate, etc., and no other layers, membranes, regions, plates, etc., are disposed between the layer, membrane, region, plate, etc. and the other layer, membrane, region, plate, etc. Furthermore, as used herein, when a layer, membrane, region, plate, etc., can be disposed "below" or "under" another layer, membrane, region, plate, etc., the layer, membrane, region, plate, etc., can directly contact the other layer, membrane, region, plate, etc., or other layers, membranes, regions, plates, etc., can be disposed between the layer, membrane, region, plate, etc. and the other layer, membrane, region, plate, etc. As used herein, when a layer, membrane, region, plate, etc., is directly disposed "below" or "under" another layer, membrane, region, plate, etc., the layer, membrane, region, plate, etc., directly contacts the other layer, membrane, region, plate, etc., and no other layers, membranes, regions, plates, etc., are disposed between the layer, membrane, region, plate, etc. and the other layer, membrane, region, plate, etc.

[0042] When describing temporal relationships, such as the temporal precedent relationship between two events, such as “after,” “following,” “before,” “next,” etc., unless the more restrictive terms “exactly,” “immediately,” or “directly” are indicated (“directly after,” “directly after,” “directly before”), another event may occur in between.

[0043] It should be understood that while the terms "first," "second," "third," etc., may be used herein to describe various elements, components, regions, layers, and / or portions, these elements, components, regions, layers, and / or portions should not be limited to these terms. These terms are used to distinguish one element, component, region, layer, or portion from other elements, components, regions, layers, or portions. Therefore, without departing from the spirit and scope of this disclosure, the first element, component, region, layer, or portion described below may be referred to as a second element, component, region, layer, or portion.

[0044] Features of the various embodiments of this disclosure can be combined with each other in part or in whole, and can interoperate with each other and be technically driven in various ways, as will be fully understood by those skilled in the art. Embodiments can be implemented independently of each other, or they can be implemented together in an interdependent relationship.

[0045] Unless otherwise defined, all terms, including technical and scientific terms used herein, shall have the same meaning as commonly understood by one of ordinary skill in the art to which the inventive concept pertains. It will be further understood that terms such as those defined in commonly used dictionaries shall be interpreted as having meanings consistent with their meanings in the context of the relevant field, and that unless expressly defined herein, these terms shall not be interpreted in an idealized or overly formal sense.

[0046] Hereinafter, exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. When adding reference numerals to the elements in each drawing, the same reference numerals may denote the same elements even if the same elements are shown in other drawings. Furthermore, for ease of description, the scale of each element shown in the drawings may differ from the actual scale. Therefore, the elements shown are not limited to the specific scale shown in the drawings.

[0047] The display device according to the exemplary embodiments of this disclosure can be applied to organic light-emitting display devices. This disclosure is not limited thereto. The display device according to the exemplary embodiments of this disclosure can be applied to various display devices, such as micro-LED display devices or quantum dot display devices.

[0048] In the following, a display device according to an exemplary embodiment of the present disclosure will be described in detail with reference to the accompanying drawings.

[0049] Figure 1A and Figure 1C The front and back sides of a display device according to an exemplary embodiment of this disclosure are shown respectively. Figure 1B The back of the display device with its casing removed is shown.

[0050] As used in this article, each of the forward and upward directions can be defined by the Z-axis direction, and each of the backward and downward directions can be defined by the -Z-axis direction.

[0051] An example embodiment of the display device 1 may include a cover member 20 and a display panel 100 attached to the bottom of the cover member 20. The direction of the cover member 20 from top to bottom may be defined by a downward direction (-Z-axis direction).

[0052] The cover member 20 can be configured to cover the entire surface of the display device 1 to protect the display device 1 from external impacts.

[0053] The edge portion of the cover member 20 may have a bent or curved portion that bends or curves toward the back of the display device 1.

[0054] Since the cover member 20 can be configured to cover the side of the display panel 100 of the display device 1, the cover member 20 can not only protect the display panel 100 from external impacts on the front of the display device 1, but also protect the display panel 100 from external impacts on the side of the display device 1.

[0055] The cover member 20 may overlap with the display area AA of the display panel displaying the image. For example, the cover member 20 may be made of a transparent plastic material that allows the image to pass through. Alternatively, the cover member 20 may be made of a cover glass material that is transparent. This disclosure is not limited thereto.

[0056] The housing 40 for supporting the cover member 20 can be disposed on the back of the display device 1.

[0057] The housing 40 can be used as a housing to protect the rear surface of the display device 1. The housing 40 can also be used as a housing constituting the outermost shell of the display device 1.

[0058] The housing 40 can be made of various materials such as plastic, metal or glass.

[0059] The intermediate frame 30 may be additionally disposed between the cover member 20 and the housing 40.

[0060] The intermediate frame 30 can accommodate the display panel 100. One side of the intermediate frame 30 can contact the cover member 20, such that the intermediate frame supports the cover member 20.

[0061] The intermediate frame 30 can be used as a housing to protect the rear surface of the display panel 100. See below for reference. Figure 7 Additional details about the middle frame 30 are provided.

[0062] The front part FP of the display panel 100 can be disposed on the bottom surface of the cover member 20.

[0063] The front panel (FP) may include a pixel array and signal lines. The pixel array includes multiple pixels having multiple light-emitting elements and driving transistors, and signal lines that send driving signals to the pixels so that an image can be displayed from the front panel (FP).

[0064] The front panel (FP) may include a display area AA (active area) for displaying the image and a non-display area NA (non-active area) excluding the display area AA. The non-display area NA may be formed as an edge area surrounding the display area AA.

[0065] The display area AA and the non-display area NA can also be applied to the cover component 20.

[0066] The area through which the image of the cover member 20 is transmitted can be the display area AA of the cover member 20.

[0067] The area of ​​the cover member 20 surrounding the display area AA and through which the image is not visible can be the non-display area NA of the cover member 20.

[0068] The non-display area NA can be defined as the border area.

[0069] The display panel 100 disposed below the cover member 20 may include a curved portion BND, as described below. Figure 2 Further description: The curved portion BND extends from one side of the front FP and curves downwards.

[0070] The curved portion BND may be located at the outermost edge of the display panel 100. Therefore, the curved portion BND may be exposed to external impacts. When an impact is applied to the curved portion BND, it may easily deform or break. Therefore, support members or reinforcing members can be added to protect the curved portion and absorb the impact.

[0071] The structure of a display device 1 according to an exemplary embodiment of the present disclosure will be described below.

[0072] Figure 2 A display device according to an exemplary embodiment of the present disclosure, such as Figure 1A The cross-sectional view along the I-I' direction is shown in the figure.

[0073] The display device 1 may include a cover member 20 as the topmost part and a display panel 100 disposed below the cover member 20.

[0074] The display device 1 may include a display panel 100, the display panel 100 having a front portion FP, a curved portion BND, a pad portion PAD that is bent and extended from the curved portion BND to be positioned on the back of the front portion FP, a buffer plate 300 disposed between the front portion FP and the pad portion PAD and disposed below the front portion FP, and a second connecting member 400 disposed between the buffer plate 300 and the pad portion PAD to fix the buffer plate 300 and the pad portion PAD to each other as a connecting member.

[0075] The first plate 210 can be disposed between the front FP and the buffer plate 300. The second plate 220 can be disposed between the second connecting member 400 and the pad portion PAD.

[0076] Therefore, the first plate 210, the buffer plate 300, the second connecting member 400, the second plate 220, and the pad portion PAD can be sequentially arranged below the front part FP of the display panel 100.

[0077] The first connecting member 150 may be disposed between the cover member 20 and the display panel 100.

[0078] The first connecting member 150 can connect or link the cover member 20 and the display panel 100 to each other.

[0079] For example, the first connecting member 150 can be used as a fixing member. This disclosure is not limited to the terminology used herein.

[0080] Since the first connecting member 150 can be configured to overlap with the display area AA along the thickness direction of the display device, the first connecting member 150 can be made of a material that can transmit images from the display panel 100.

[0081] For example, the first connecting member 150 may be made of or may include a material such as optically transparent adhesive (OCA), optically transparent resin (OCR), or pressure-sensitive adhesive (PSA). However, this disclosure is not limited thereto.

[0082] The display panel 100 disposed below the cover member 20 may include a front portion FP, a curved portion BND, and a pad portion PAD, all of which may include a display substrate 110.

[0083] The front portion FP of the display panel 100 may be disposed below the first connecting member 150. For example, the front portion FP may be the portion that displays an image. The front portion FP may include a display substrate 110, a pixel array 120, an encapsulation portion 130, and a polarizing plate 140 on the top surface of the encapsulation portion 130.

[0084] The curved portion BND of the display panel 100 can extend from one side of the front portion FP and bend downward (along the -Z axis direction) and then horizontally (along the Y axis direction). The curved portion BND may include the display substrate 110 and signal lines.

[0085] The pad portion PAD of the display panel 100 can extend from the curved portion BND and is positioned below the front FP.

[0086] The pad portion of the PAD may include a display substrate 110, signal lines, and pad electrodes connected to the signal lines. A driver circuit 160 or a flexible circuit board 500 for driving pixels may be mounted on the pad electrodes.

[0087] The display panel 100 may include a polarizing plate 140, which may form the top portion of the front FP. Additionally, a functional layer for improving the display performance of the display device may be further disposed between the first connecting member 150 and the polarizing plate 140.

[0088] The polarizing plate 140 can prevent or reduce the reflection of external light. The polarizing plate 140 can improve the outdoor visibility and contrast of the image displayed on the display panel 100.

[0089] The display panel 100 may include a display substrate 110, a pixel array 120 disposed on the display substrate 110, and an encapsulation portion 130 disposed to cover the pixel array 120.

[0090] A portion of the display substrate 110 may form the bottom of the display panel 100.

[0091] The display substrate 110 can be a part of each of the front portion FP, the curved portion BND, and the pad portion PAD.

[0092] The display substrate 110 can be made of a flexible plastic material. The display substrate 110 can be flexible.

[0093] The display substrate 110 may include polyimide. Alternatively, the display substrate 110 may be made of a flexible thin glass material.

[0094] The pixel array 120 can be disposed on the display substrate 110. The pixel array 120 can display images. The area where the pixel array 120 can be disposed can be the display area AA.

[0095] Therefore, the area of ​​the cover member 20 corresponding to the pixel array 120 can be the display area AA of the cover member 20. The area of ​​the cover member 20 other than the display area AA can be the non-display area NA of the cover member 20.

[0096] The pixel array 120 may include light-emitting elements, thin-film transistors for driving the light-emitting elements, and signal lines such as gate lines, data lines, and pixel driving power lines on the display substrate 110.

[0097] The pixel array 120 may include pixels that display an image based on signals provided to signal lines. Each pixel may include a light-emitting element and a thin-film transistor.

[0098] The light-emitting element may include an anode electrically connected to a thin-film transistor, a light-emitting layer formed on the anode, and a cathode for providing a common voltage.

[0099] A thin-film transistor may include a gate, a semiconductor layer, a source, and a drain. The semiconductor layer of a thin-film transistor may include silicon such as a-Si, poly-Si, or low-temperature poly-Si. Alternatively, the semiconductor layer of a thin-film transistor may include an oxide such as indium gallium zinc oxide (IGZO). This disclosure is not limited thereto.

[0100] The anode of the light-emitting element can be located in each pixel. The anode can be positioned in a manner corresponding to an opening area defined by the pattern shape of the pixel. The anode can be electrically connected to a thin-film transistor.

[0101] The light-emitting element may include a light-emitting layer formed between an anode and a cathode. The light-emitting element may be configured to emit light of the same color for each pixel, such as white light. Alternatively, the light-emitting element may be configured to emit light of a different color for each pixel, such as red, green, or blue.

[0102] The encapsulation portion 130 can be disposed on the display substrate 110 to cover the pixel array 120.

[0103] The encapsulation portion 130 can prevent or reduce the penetration of oxygen, moisture, or foreign materials into the light-emitting layer of the pixel array 120. For example, the encapsulation portion 130 can be formed as a multilayer structure in which organic material layers and inorganic material layers are alternately stacked. This disclosure is not limited thereto.

[0104] The front portion (FP) of the display panel 100 may include a display substrate 110, a pixel array 120, and a packaging portion 130. Except for the edge portion of the front portion (FP), the front portion (FP) may be formed in a flat manner.

[0105] The first plate 210 can be connected or attached to the rear surface of the front FP in order to keep the front FP flat.

[0106] The curved portion BND of the display panel 100 may be without the pixel array 120, the encapsulation portion 130, and the first plate 210. The curved portion BND may include the display substrate 110. The curved portion BND may be a portion that can be easily bent in a direction desired by the user.

[0107] The pad portion PAD of the display panel 100 may not have the pixel array 120 and the package portion 130.

[0108] The second board 220 can be connected to or attached to the back of the pad portion PAD, so that the pad portion PAD can be kept in a flat state.

[0109] Therefore, the front portion FP of the display panel 100 can be positioned in the area of ​​the display screen. The pad portion PAD can be bent and extended inward horizontally from the curved portion BND. The pad portion PAD can be positioned below the front portion FP, that is, on the back of the front portion FP.

[0110] The first plate 210, located below the front portion FP of the display panel 100, and the second plate 220, located above the pad portion PAD, can be positioned below the display substrate 110. The first plate 210 and the second plate 220 can keep the front portion FP flat while supplementing the rigidity of the display substrate 110.

[0111] Each of the first plate 210 and the second plate 220 may be formed to have a certain strength and thickness to supplement the rigidity of the display substrate 110. Each of the first plate 210 and the second plate 220 may not be formed in the curved region where the curved portion BND is located.

[0112] Based on the shape of the display panel 100 before bending, the first plate 210 and the second plate 220 can be disposed below the display substrate 110. The first plate 210 and the second plate 220 can be spaced apart from each other.

[0113] Based on the shape of the display panel 100 after bending, the first board 210 can be disposed below the front FP. The second board 220 can be disposed on the top surface of the pad portion PAD.

[0114] Each of the first plate 210 and the second plate 220 can be used as a back plate disposed on the back side of the display substrate 110.

[0115] Each of the first plate 210 and the second plate 220 may be made of a rigid plastic film.

[0116] For example, each of the first plate 210 and the second plate 220 may be made of polyethylene terephthalate (PET), polyimide (PI), polyethylene naphthalate (PEN), etc. However, this disclosure is not limited thereto.

[0117] The first plate 210 and the second plate 220 may be made of the same material. The first plate 210 and the second plate 220 may have the same thickness. However, this disclosure is not limited thereto.

[0118] Based on the shape of the bent display panel 100, the buffer plate 300 can be disposed between the first plate 210 and the second plate 220.

[0119] The buffer plate 300 can be positioned below the first plate 210.

[0120] The buffer plate 300 may include a first adhesive member 310 and a porous member 320. In an example embodiment, the porous member 320 may be a metal foam.

[0121] Since the porous component 320 can be used as a buffer layer for the buffer plate 300, the impact on various components that can come into contact with the buffer plate 3005 can be reduced.

[0122] The porous component 320 with impact reduction function can enhance the rigidity of the buffer plate 300. (See below for further details.) Figure 3 The porous component 320 is described in more detail.

[0123] The second connecting member 400 and the second plate 220 can be disposed below the buffer plate 300.

[0124] The second connecting member 400 can be disposed between the buffer plate 300 and the pad portion PAD.

[0125] In some embodiments where the pad portion PAD of the display panel 100 is bent from the bent portion BND to be positioned below the front portion FP of the display panel 100, the restoring force for restoring the display panel 100 to its state before bending can be relatively strong.

[0126] In the embodiment where a strong restoring force is applied, the pad portion PAD of the display panel 100, which may be bent, is...

[0127] The phenomenon of lifting that is not fixed and separate.

[0128] 5. The second connecting member 400 can be used as a fixing member for fixing the curved display panel 100, so that the display panel can maintain its curved shape.

[0129] The second connecting member 400 can be formed to have a constant thickness in the thickness direction, thereby maintaining a constant curvature of the curved portion BND.

[0130] In one embodiment, the second connecting member 400 may be a double-sided adhesive tape with adhesive strength, such that the second connecting member 400 can secure the second plate 220 and the porous member 320 to each other. This disclosure is not limited thereto.

[0131] In an alternative embodiment, the second connecting member 400 may be an adhesive foam strip or foam pad to further enhance the impact mitigation effect.

[0132] The second plate 220 can be located below the second connecting member 400.

[0133] When placing the second board 220, the second board 220 can first be attached to the back of the pad portion PAD, the bent portion BND can be bent, and the second board 220 can be attached and fixed to the bottom of the second connecting member 400.

[0134] With the second plate 220 fixed to the second connecting member 400, the second plate 220 can be disposed on the pad portion PAD.

[0135] For example, the second connecting member 400 and the second plate 220 can be disposed between the porous member 320 of the buffer plate 300 and the pad portion PAD.

[0136] With the second plate 220 fixed to the second connecting member 400, the outer surface of the top surface of the curved portion BND can be exposed to the outside. In some embodiments, the outer surface of the curved portion BND can face the reinforcing member 600. The bottom surface of the inner surface of the curved portion BND can face the buffer plate 300 and the second connecting member 400.

[0137] The reinforcing member 600 can be disposed on the outer surface of the curved portion BND of the display panel 100.

[0138] The reinforcing member 600 may cover the bent portion BND. The reinforcing member 600 may extend to cover at least a portion of each of the front FP and the pad portion PAD.

[0139] The reinforcing member 600 may include a resin. For example, the reinforcing member 600 may include a UV-cured acrylic resin. This disclosure is not limited thereto.

[0140] Since the reinforcing member 600 can cover the various signal lines disposed between the encapsulation portion 130 and the pad portion PAD of the display panel 100, the member 600 can prevent or reduce moisture penetration into the signal lines, while protecting the signal lines from external impacts.

[0141] To increase the flexibility of the display panel 100, the curved portion BND may be without any components other than the display substrate 110 and signal lines. Therefore, the reinforcing member 600 can supplement the rigidity of the curved portion BND where no other components are present.

[0142] In one example, the driver circuit 160 may be disposed on a surface opposite to one side of the pad portion PAD of the display panel 100 on which the second board 220 may be disposed.

[0143] The driver circuit 160 may be configured as a chip-on-plastic (COP) mounted on the display substrate 110. However, this disclosure is not limited thereto.

[0144] The driver circuit 160 can generate data signals and gating control signals based on image data and timing synchronization signals provided from an external host drive system.

[0145] The driver circuit 160 can provide data signals to the data lines of each pixel via display pads. The driver circuit 160 can also provide gating control signals to the gating driver circuit via display pads.

[0146] The driver circuit 160 can be mounted in the chip mounting area defined in the display substrate 110. The driver circuit 160 can be electrically connected to the display pads. The driver circuit 160 can be connected to the signal lines of the gating driver circuit and the pixel array 120 disposed on the display substrate 110.

[0147] The display pads can be located at the far end of the display substrate 110 on which the driver circuit 160 is mounted.

[0148] Display pads can be disposed on one side of the display substrate 110 and electrically connected to the flexible circuit board 500 on which the circuit board is mounted.

[0149] The flexible circuit board 500 can be electrically connected to the display pads disposed on the distal end of the display substrate 110 using a film adhesion process employing a conductive adhesive layer. The flexible circuit board 500 can be located on the back side of the display panel 100.

[0150] An example of the material for the conductive adhesive layer may include anisotropic conductive film (ACF).

[0151] The circuit board can provide image data and timing synchronization signals from the host drive system to the driver circuit 160. The circuit board can provide voltage to drive each of the pixel array 120, the gating driver circuit, and the driver circuit 160.

[0152] 0 Figure 3 This is an enlarged cross-sectional view of a porous component according to an exemplary embodiment of the present disclosure.

[0153] like Figure 3 As shown, the porous component 320 can be a porous metal structure including a conductive metal 321 and a plurality of holes 323 located inside the conductive metal 321.

[0154] Since the conductive metal 321 of the porous component 320 is made of a metal with high thermal conductivity, the porous component 320 itself can provide excellent heat dissipation. Because the porous component 320 has a metal structure in which a plurality of holes 323 are formed, the porous component 320 can provide excellent cushioning.

[0155] Furthermore, since the porous component 320 may include multiple holes 323 inside the conductive metal 321, and the total surface area of ​​the porous component 320 can be increased, the porous component 320 itself can provide excellent heat dissipation function.

[0156] As an example, the porous component 320 can be formed using the following manufacturing method. This disclosure is not limited thereto.

[0157] The porous component 320 can be formed by sintering a metal foam precursor 0 containing metal powder.

[0158] Metal foam precursors refer to structures that exist prior to processes such as sintering to form porous components 320.

[0159] For example, a slurry containing metal powder, dispersant, and binder can be used to form metal foam precursors.

[0160] The metal powder may be a metal powder comprising one or more metal powders selected from copper powder, nickel powder, iron powder, stainless steel (SUS) powder, molybdenum powder, silver powder, platinum powder, gold powder, aluminum powder, chromium powder, indium powder, tin powder, magnesium powder, phosphorus powder, zinc powder, and manganese powder. Alternatively, the metal powder may be or may comprise an alloy powder of one or more metals. This disclosure is not limited thereto.

[0161] The dispersant can be, for example, an alcohol, but is not limited to this.

[0162] In this case, the alcohol can be a monohydric alcohol having 1 to 20 carbon atoms, such as methanol, ethanol, propanol, pentanol, octanol, ethylene glycol, propylene glycol, pentanol, 2-methoxyethanol, 2-ethoxyethanol, 2-butoxyethanol, glycerol, terpineol, or terpineol. The alcohol can also be a dihydric alcohol having 1 to 20 carbon atoms, such as ethylene glycol, propylene glycol, hexanediol, octanediol, or pentanediol. The alcohol can be a polyhydric alcohol. This disclosure is not limited thereto.

[0163] There are no particular restrictions on the type of binder, and it can be selected based on the type of metal powder or dispersant used to prepare the slurry.

[0164] For example, the adhesive may be an alkyl cellulose having 1 to 8 carbon atoms (e.g., methyl cellulose or ethyl cellulose), a polyalkylene carbonate having 1 to 8 carbon atoms (e.g., polypropylene carbonate or polyethylene carbonate), or a polyvinyl alcohol-based adhesive (e.g., polyvinyl alcohol or polyvinyl acetate), but may not be limited to these.

[0165] After forming the slurry containing metal powder, dispersant and binder as described above, the slurry can be injected into a mold with a predetermined shape or coated onto a substrate to form a metal foam precursor.

[0166] The resulting metal foam precursor can be sintered into a porous component 320.

[0167] In this case, the conditions of the sintering process are not particularly limited, as long as the sintering process is carried out at a temperature and duration that can remove the solvent present in the slurry to the required level. For example, sintering can be carried out for a predetermined time in a temperature range of about 50°C to 250°C, but it is not limited to this.

[0168] The buffer plate 300 can be formed by forming a porous member 320 and then attaching a first adhesive member 310 to one side of the porous member 320.

[0169] Alternatively, the metal foam precursor may be formed on the first adhesive member 310 and may be sintered to form a buffer plate 300 including a porous member 320. There are no particular limitations on the manufacturing process of the buffer plate 300.

[0170] The first adhesive member 310 can be formed on one surface of the porous member 320, thereby having a certain thickness.

[0171] The first adhesive member 310 may include an adhesive component such that the porous member 320 can be fixed to the first plate 210 via the first adhesive member 310.

[0172] The first adhesive member 310 may be made of or may include a material such as optically transparent adhesive (OCA), optically transparent resin (OCR), or pressure-sensitive adhesive (PSA).

[0173] In the following text, refer to Figures 4 to 6 This section will describe various aspects of a buffer plate according to an exemplary embodiment of the present disclosure. Figure 4 This is a cross-sectional view of a buffer plate according to an exemplary embodiment of the present disclosure. Figure 5 This is a cross-sectional view of a buffer plate according to another exemplary embodiment of the present disclosure. Figure 6 This is a cross-sectional view of a buffer plate according to yet another exemplary embodiment of the present disclosure.

[0174] like Figure 4 As shown, the buffer plate 300 may include a first adhesive member 310 and a porous member 320. The porous member 320 includes a conductive metal 321 and a plurality of holes 323 located inside the conductive metal 321.

[0175] The porous member 320 may include a main portion region 320a and a side portion region 320b disposed along the side of the main portion region 320a. The main portion region 320a and the side portion region 320b are not physically separated from each other. The main portion region 320a and the side portion region 320b may be positionally separated from each other.

[0176] The thickness of the side region 320b of the porous component 320 can be less than the thickness of the main body region 320a.

[0177] For example, the side region 320b may have an inclined surface such that the thickness of the side region 320b decreases as the side region 320b extends from the side of the side region 320b closer to the main body region 320a toward the other side of the side region 320b.

[0178] Therefore, the thickness of the side region 320b can gradually decrease from the second thickness W2, which corresponds to the thickness of the main body region 320a, to the third thickness W3, which corresponds to the thickness of the end of the side region 320b furthest from the main body region 320a.

[0179] Furthermore, the porosity of the side region 320b can be lower than that of the main body region 320a.

[0180] In the porous member 320 according to an exemplary embodiment of the present disclosure, the side region 320b is compressed under a pressure greater than that of the main body region 320a. Therefore, the thickness of the side region 320b is less than the thickness of the main body region 320a. The porosity of the side region 320b is lower than that of the main body region 320a.

[0181] To reduce the porosity of the porous component 320, a predetermined pressure can be applied to the porous component 320 to reduce the porosity.

[0182] In one aspect of this disclosure, porosity can be reduced by applying pressure not only to the main body region 320a of the porous member 320 but also to the side region 320b, while simultaneously applying pressure to the side region 320b such that the thickness of the side region 320b is less than the thickness of the main body region 320a. The porosity of the side region 320b is lower than the porosity of the main body region 320a.

[0183] The buffer plate 300 according to the exemplary embodiment of the present disclosure as described above may have improved impact stiffness because the buffer plate may include a porous member 320 in which a plurality of holes 323 are formed.

[0184] Furthermore, in the buffer plate 300 according to an exemplary embodiment of this disclosure, the holes 323 can be compressed in the side region 320b and the main body region 320a of the porous member 320. Therefore, the buffer plate can have improved stiffness and compressive rigidity.

[0185] Furthermore, since the porosity of the side region 320b is lower than that of the main body region 320a, the buffer plate 300 according to the exemplary embodiment of this disclosure can have further improved hardness and pressing stiffness in the side region 320b.

[0186] Furthermore, in the exemplary embodiment of this disclosure, the buffer plate 300 is compressed such that the side region 320b, which has improved compressive stiffness, has an inclined surface. Therefore, the buffer plate 300 can reduce bending stress in a display device with curvature. The buffer plate 300 can reduce peeling phenomena to improve reliability.

[0187] At least a portion of the first adhesive member 310 can penetrate the hole 323 of the porous member 320. Therefore, the hole 323 of the porous member 320 adjacent to the first adhesive member 310 can become a filled hole 325 filled with adhesive material.

[0188] In order to bond the first adhesive member 310 and the porous member 320 together, a predetermined pressure can be applied to them so that the adhesive material of the first adhesive member 310 can fill the holes 323 of the porous member 320.

[0189] Thus, the buffer plate 300 according to the exemplary embodiment of this disclosure may include filling holes 325 filled with adhesive material of the first adhesive member 310. Therefore, the thickness of the buffer plate 300 can be reduced by reducing the thickness of the first adhesive member 310. Furthermore, with the reduction of porosity, a further increase in pushing stiffness can be obtained.

[0190] like Figure 5 As shown, the buffer plate 300 may include a first adhesive member 310 and a porous member 320. The porous member 320 includes a conductive metal 321 and a plurality of holes 323 located inside the conductive metal 321.

[0191] The porous member 320 may include a main portion region 320a and a side portion region 320b disposed along the side of the main portion region 320a. The main portion region 320a and the side portion region 320b may not be physically separated from each other. The main portion region 320a and the side portion region 320b may be conceptually and positionally separated from each other.

[0192] The thickness of the side region 320b of the porous component 320 can be less than the thickness of the main body region 320a.

[0193] The third thickness W3, which is the thickness of the side region 320b, can be less than the second thickness W2, which is the thickness of the main body region 320a.

[0194] In this case, the side region 320b, which has a thickness smaller than that of the main body region 320a, can have a constant thickness.

[0195] Therefore, the porous member may further include a stepped region 320c located directly below the side region 320b. The stepped region 320c may have a thickness corresponding to the difference in thickness between the main body region 320a and the side region 320b.

[0196] Furthermore, the porosity of the side region 320b can be lower than that of the main body region 320a.

[0197] In the porous member 320 according to an exemplary embodiment of the present disclosure, the side region 320b can be compressed under a pressure greater than that compressible to the main body region 320a, such that the thickness of the side region 320b can be less than the thickness of the main body region 320a. The porosity of the side region 320b can be lower than that of the main body region 320a.

[0198] To reduce the porosity of the porous component 320, a predetermined pressure can be applied to the porous component 320 to reduce the porosity.

[0199] In one aspect of this disclosure, porosity can be reduced by applying pressure not only to the main body region 320a of the porous member 320 but also to the side region 320b. Simultaneously, pressure can be applied to the side region 320b such that its thickness is less than that of the main body region 320a. The porosity of the side region 320b can be lower than that of the main body region 320a.

[0200] The buffer plate 300 according to the exemplary embodiment of the present disclosure as described above may have improved impact stiffness because the buffer plate may include a porous member 320 containing a plurality of holes 323.

[0201] Furthermore, in the buffer plate 300 according to an exemplary embodiment of this disclosure, the holes 323 can be compressed in the side region 320b and the main body region 320a of the porous member 320. Therefore, the buffer plate can have improved overall stiffness and compressive rigidity.

[0202] Furthermore, since the porosity of the side region 320b is lower than that of the main body region 320a, the buffer plate 300 according to the exemplary embodiment of this disclosure can have further improved hardness and pressing stiffness in the side region 320b.

[0203] At least a portion of the first adhesive member 310 can penetrate the hole 323 of the porous member 320. Therefore, the hole 323 of the porous member 320 adjacent to the first adhesive member 310 can become a filled hole 325 filled with adhesive material.

[0204] In order to bond the first adhesive member 310 and the porous member 320 together, a predetermined pressure can be applied to them so that the adhesive material of the first adhesive member 310 can fill the holes 323 of the porous member 320.

[0205] Thus, the buffer plate 300 according to the exemplary embodiment of this disclosure may include filling holes 325 filled with adhesive material of the first adhesive member 310. Therefore, the thickness of the buffer plate 300 can be reduced by reducing the thickness of the first adhesive member 310. Furthermore, with the reduction of porosity, a further increase in pushing stiffness can be obtained.

[0206] like Figure 6 As shown, according to Figure 5 The buffer plate 300 of the example embodiment may also include a conductive member 330 surrounding at least a portion of the first adhesive member 310 and the porous member 320.

[0207] In this case, the conductive member 330 can be formed as a side region 320b surrounding the first adhesive member 310 and the porous member 320.

[0208] The conductive component 330 may include a material with high thermal conductivity. The conductive component can improve the heat dissipation effect of the buffer plate 300.

[0209] For example, the conductive component 330 may include a metal with high thermal conductivity, such as copper (Cu), aluminum (Al), or graphite. This disclosure is not limited thereto.

[0210] Furthermore, the conductive component 330 may include stainless steel (SUS). In an embodiment, the conductive component 330 may be an SUS plate.

[0211] In one embodiment, compared to an embodiment where the conductive component is made of a metal different from SUS, the conductive component 330 including SUS can have higher thermal conductivity and strength, while having a smaller thickness.

[0212] Since the conductive member 330 is formed as a side region 320b surrounding the first adhesive member 310 and the porous member 320, the pressing stiffness of the buffer plate 300 including the side region 320b can be further improved.

[0213] Figure 7 A display device according to an exemplary embodiment of the present disclosure, such as Figure 1A The cross-sectional view in the II-II' direction shown.

[0214] The display device 1 according to the exemplary embodiments of the present disclosure may include a display panel 100 for displaying a screen and a buffer plate 300 disposed below the display panel 100, wherein the buffer plate 300 may include a first adhesive member 310 and a porous member 320.

[0215] The porous member 320 may include a main body region 320a and a side region 320b disposed along the side of the main body region 320a.

[0216] The thickness of the side region 320b of the porous component 320 can be less than the thickness of the main body region 320a. The porosity of the side region 320b can be lower than the porosity of the main body region 320a.

[0217] The buffer plate 300 may also include a conductive member 330 covering at least a portion of the first adhesive member 310 and the porous member 320.

[0218] In this case, the conductive member 330 can be formed as a side region 320b surrounding the first adhesive member 310 and the porous member 320.

[0219] The buffer plate 300, including the conductive member 330, can be fixed to one side of the display panel 100 via the second adhesive member 340.

[0220] The display device 1 may also include a cover member 20 disposed on the display panel 100 and an intermediate frame 30 disposed below the buffer plate 300.

[0221] The intermediate frame 30 may be additionally disposed between the cover member 20 and the housing 40.

[0222] The intermediate frame 30 can accommodate the display panel 100. One side of the intermediate frame 30 can contact the cover member 20, such that the intermediate frame supports the cover member 20.

[0223] The intermediate frame 30 can be used as a housing to protect the rear surface of the display panel 100.

[0224] The intermediate frame 30 may have a structure that houses the display panel 100 and additional components such as a battery disposed on the back of the display panel 100 to power the display device 1. There are no particular limitations on the structure of the intermediate frame 30.

[0225] For example, the intermediate frame 30 may have a structure in which the intermediate frame 30 covers the back of the display panel 100 such that the display panel 100 can be housed in a portion of the intermediate frame 30, and additional components such as batteries may be disposed below the intermediate frame 30.

[0226] Furthermore, the intermediate frame 30 can be formed to cover part of the back of the display panel 100. The display panel 100 can be housed in the intermediate frame 30, and additional components such as batteries are disposed below the intermediate frame 30, such that the display panel 100 and the additional components are in contact with each other.

[0227] One end of the intermediate frame 30 and the other end of the intermediate frame 30 can be fixed to the cover member 20 and the conductive member 330 respectively with glue.

[0228] Thus, the conductive member 330 according to the exemplary embodiment of this disclosure can be used as a fastening structure for the intermediate frame 30. Therefore, a separate fastening structure for the intermediate frame 30 in the display device 1 can be omitted.

[0229] Figures 8A to 8DThe manufacturing process of a buffer plate according to an exemplary embodiment of the present disclosure is shown.

[0230] A method for manufacturing a buffer plate 300 according to an exemplary embodiment of the present disclosure may include the following steps: forming a porous member 320 including a conductive metal 321 and a plurality of holes 323 located inside the conductive metal 321; performing a first compression on the porous member 320; and performing a second compression on the porous member 320 while laminating the first compressed porous member 320 onto a first adhesive member 310.

[0231] like Figure 8A As shown, a metal foam precursor comprising metal powder is sintered on stage 700 to form a porous component 320 comprising a conductive metal 321 and a plurality of pores 323 located inside the conductive metal 321.

[0232] In this case, the thickness of the porous member 320 can be a first thickness W1. The plurality of holes 323 included in the porous member 320 can be in the state before compression.

[0233] Next, as Figure 8B As shown, the porosity of the porous component 320 can be reduced by subjecting the porous component 320 to a first compression.

[0234] For example, a compression unit 800, such as a press, can be used to compress the porous component 320.

[0235] In this case, the compression unit 800 for compressing the porous member 320, which includes a main body region 320a and a side region 320b disposed along the side of the main body region 320a, may include a first pressing portion 800a corresponding to the main body region 320a of the porous member 320 and a second pressing portion 800b corresponding to the side region 320b.

[0236] Therefore, the second pressing portion 800b of the compression unit 800 can protrude downward beyond the first pressing portion 800a.

[0237] Since the second pressing portion 800b protrudes downward beyond the first pressing portion 800a, in the embodiment where the porous member 320 is first compressed using the compression unit 800, the pressure applied to the side region 320b can be greater than the pressure applied to the main body region 320a.

[0238] Therefore, the thickness of the side region 320b of the porous member 320 can be less than the thickness of the main body region 320a.

[0239] For example, the thickness of the main body region 320a can be reduced to a second thickness W2, which is less than the first thickness W1, where the first thickness W1 is the thickness of the main body region 320a before compression. The thickness of the side region 320b can be reduced to a third thickness W3, which can be significantly less than the first thickness W1, where the first thickness W1 is the thickness of the main body region 320a before compression.

[0240] In the example, the first thickness W1 is about 70 μm, the second thickness W2 can be about 50 μm, and the third thickness W3 can be about 45 μm.

[0241] Since the thickness of the side region 320b is less than the thickness of the main body region 320a, the porosity of the side region 320b can be lower than the porosity of the main body region 320a.

[0242] In the experimental example, when the porosity of the porous component 320 before compression is about 74%, the porosity of the main body region 320a after the first compression can be reduced to about 60%, and the porosity of the side region 320b can be reduced to about 54%.

[0243] As used herein, porosity can be defined as the ratio of the area occupied by pores (e.g., pore 323) to the total area occupied by pores and conductive metal 321.

[0244] Thus, the thickness of the side region 320b of the porous member 320 included in the buffer plate is less than the thickness of the main body region 320a. The porosity of the side region 320b is lower than that of the main body region 320a. Therefore, the resulting buffer plate 300 has improved pressing stiffness not only in the main body but also in the side edge portions, while having a reduced thickness.

[0245] Next, as Figure 8C As shown, while the first compressed porous component 320 is laminated onto the first adhesive component 310, the first compressed porous component 320 can be compressed a second time.

[0246] For example, in the second compression of the porous member 320, a predetermined pressure may be applied to the stack of the first adhesive member 310 and the porous member 320, such that the adhesive material of the first adhesive member 310 can fill the pores 323 of the porous member 320.

[0247] Therefore, the holes 323 of the porous member 320 adjacent to the first adhesive member 310 can be transformed into filled holes 325 filled with adhesive material.

[0248] Thus, in the method for manufacturing a buffer plate 300 according to an exemplary embodiment of this disclosure, a second compression is performed such that the adhesive material of the first adhesive member 310 fills a portion of the plurality of holes 323. Therefore, the thickness of the buffer plate 300 can be reduced by decreasing the thickness of the first adhesive member 310. Furthermore, with the reduction of porosity, a further increase in pushing stiffness can be obtained.

[0249] Next, as Figure 8D As shown, the conductive member 330 can be formed as a side region 320b surrounding the first adhesive member 310 and the porous member 320.

[0250] The conductive component 330 may include a material with high thermal conductivity, thereby improving the heat dissipation effect of the buffer plate 300.

[0251] Furthermore, since the conductive member 330 is formed as a side region 320b surrounding the first adhesive member 310 and the porous member 320, the pressing stiffness of the buffer plate 300 including the side region 320b can be further improved.

[0252] Thus, according to the exemplary embodiment of this disclosure, after the porous member 320 is first compressed, while the first compressed porous member 320 is laminated to the first adhesive member 310, the porosity of the porous member 320 can be further reduced by a second compression. Therefore, a buffer plate 300 with improved impact stiffness and pushing stiffness and a thinner thickness can be manufactured.

[0253] Figures 9A to 9D These are micrographs showing the difference in thickness between the porous component before and after compression.

[0254] For example, Figure 9A and Figure 9B These are micrographs of an experimental example prior to the compression of the porous component 320. Figure 9C and Figure 9D These are micrographs of an experimental example after the porous component 320 has been compressed.

[0255] like Figures 9A to 9D As shown, when comparing the state of the porous component 320 before and after compression, it can be observed that after compression, the number and size of the pores 323 in the porous component are greatly reduced, just like the thickness of the compression. Therefore, the conductive metal 321 becomes denser.

[0256] The exemplary embodiments of this disclosure can also be described as follows:

[0257] A display device according to an exemplary embodiment of this disclosure may include a display panel for displaying images and a buffer plate disposed below the display panel. The buffer plate may have an adhesive member and a porous member, the porous member having a main body region and side regions disposed along the sides of the main body region. The thickness of the side regions may be less than the thickness of the main body region. The porosity of the side regions may be lower than the porosity of the main body region.

[0258] In some example implementations, the porous component may include a conductive metal and a plurality of holes disposed within the conductive metal.

[0259] In some example implementations, at least a portion of the adhesive member may be present in at least a portion of the holes in a plurality of holes.

[0260] In some example implementations, porous components may include metal foam.

[0261] In some example implementations, the thickness of the side region can decrease from the inside of the side region to the outside of the side region.

[0262] In some example implementations, the side region may have a constant thickness from the inside of the side region to the outside of the side region.

[0263] In some example embodiments, the porous member may further include a stepped region located directly below the side region. The stepped region may have a thickness corresponding to the difference in thickness between the main body region and the side region.

[0264] In some example implementations, the buffer plate may also include a conductive member surrounding at least a portion of the porous member and the adhesive member.

[0265] In some example implementations, the conductive member may surround the adhesive member and the side region.

[0266] In some example embodiments, the display device may further include a cover member disposed on the top surface of the display panel and an intermediate frame disposed below the buffer plate. One end of the intermediate frame may be fixed to the cover member, and the other end of the intermediate frame may be fixed to a conductive member.

[0267] A buffer plate according to an exemplary embodiment of this disclosure may include an adhesive member and a porous member disposed on the adhesive member. The porous member may include a conductive metal and a plurality of holes disposed within the conductive metal. The porous member may include a main body region and side regions disposed along the sides of the main body region. The thickness of the side regions may be less than the thickness of the main body region. The porosity of the side regions is lower than the porosity of the main body region.

[0268] In some example implementations, at least a portion of the adhesive member may be present in at least a portion of the holes of the porous member.

[0269] In some example implementations, porous components may include metal foam.

[0270] In some example implementations, the thickness of the side region can decrease from the inside of the side region to the outside of the side region.

[0271] In some example implementations, the buffer plate may also include conductive members surrounding the adhesive member and the side regions.

[0272] A method for manufacturing a buffer plate according to an exemplary embodiment of the present disclosure may include the following steps: forming a porous member including a conductive metal and a plurality of holes disposed within the conductive metal; subjecting the porous member to a first compression to form a first compressed porous member; and subjecting the first compressed porous member to a second compression while laminating the first compressed porous member to an adhesive member.

[0273] In some example embodiments, the porous member may include a main body region and side regions disposed along the sides of the main body region. The step of first compressing the porous member may include compressing the porous member using a compression unit. The compression unit may include a first pressing portion corresponding to the main body region and a second pressing portion corresponding to the side regions. The second pressing portion may protrude vertically downward beyond the first pressing portion.

[0274] In some example implementations, a first compression step may be performed on the porous member such that the pressure applied to the side region is greater than the pressure applied to the main body region.

[0275] In some example implementations, a second compression step may be performed on the first compressed porous member such that at least a portion of the adhesive member can be compressed, while the first compressed porous member is laminated onto the adhesive member to fill at least a portion of the pores of the first compressed porous member.

[0276] In some example embodiments, the thickness of the side region of the first compressible porous member may be less than the thickness of the main body region of the first compressible porous member. The porosity of the side region of the first compressible porous member may be lower than the porosity of the main body region of the first compressible porous member.

[0277] While exemplary embodiments of the present disclosure have been described in more detail above with reference to the accompanying drawings, the present disclosure is not limited to the exemplary embodiments, and various modifications can be made without departing from the technical spirit or scope of the present disclosure. Therefore, the exemplary embodiments disclosed herein are illustrative and not restrictive of the technical concept of the present disclosure, and the scope of the technical concept of the present disclosure is not limited to the exemplary embodiments. Thus, it should be understood that the above exemplary embodiments are illustrative in all respects and not restrictive. The scope of protection of this disclosure should be interpreted based on the claims and their equivalents, and all technical concepts within the scope of their equivalents should be interpreted as included within the scope of this disclosure.

Claims

1. A display device, the display device comprising: Display panel, used to display images; as well as A buffer plate disposed below the display panel has the following characteristics: Adhesive components; as well as A porous component comprising a main body region and a side region disposed along the side of the main body region. The thickness of the side region is less than the thickness of the main body region. Wherein, the porosity of the side region is lower than that of the main body region, and The side region overlaps with the side of the display panel.

2. The display device according to claim 1, wherein, The porous component includes a conductive metal and a plurality of holes disposed inside the conductive metal.

3. The display device according to claim 1, wherein, At least a portion of the adhesive member exists in at least a portion of the pores of the porous member.

4. The display device according to claim 1, wherein, The porous component includes metal foam.

5. The display device according to claim 1, wherein, The thickness of the side region decreases from the inside of the side region to the outside of the side region.

6. The display device according to claim 1, wherein, The side region has a constant thickness from the inside of the side region to the outside of the side region.

7. The display device according to claim 1, wherein, The porous component further includes a stepped region located directly below the side region and having a thickness corresponding to the difference in thickness between the main body region and the side region.

8. The display device according to claim 1, wherein, The buffer plate also includes a conductive member surrounding at least a portion of the porous member and the adhesive member.

9. The display device according to claim 8, wherein, The conductive member surrounds the adhesive member and the side region.

10. The display device according to claim 8, wherein the display device further comprises: A cover member disposed on the top surface of the display panel; as well as An intermediate frame is positioned below the buffer plate. One end of the intermediate frame is fixed to the cover member, and The other end of the intermediate frame is fixed to the conductive component.

11. A buffer plate, the buffer plate comprising: Adhesive components; as well as A porous member disposed on the adhesive member, the porous member being: It includes a conductive metal and multiple holes disposed inside the conductive metal, and It has a main body region and a side region disposed along the side of the main body region. The thickness of the side region is less than the thickness of the main body region. Wherein, the porosity of the side region is lower than that of the main body region, and The buffer plate is configured to be attached to the display panel, and the side region is configured to overlap with the side of the display panel.

12. The buffer plate according to claim 11, wherein, At least a portion of the adhesive member exists in at least a portion of the pores of the porous member.

13. The buffer plate according to claim 11, wherein, The porous component includes metal foam.

14. The buffer plate according to claim 11, wherein, The thickness of the side region decreases from the inside of the side region to the outside of the side region.

15. The buffer plate according to claim 11, wherein, The buffer plate also includes conductive members surrounding the adhesive member and the side region.

16. A method for manufacturing a buffer plate, the method comprising the following steps: A porous component comprising a conductive metal and multiple pores disposed within the conductive metal is formed. The porous component is subjected to a first compression to form a first compressed porous component; and The first compressed porous component is subjected to a second compression, and simultaneously the first compressed porous component is laminated onto the adhesive component. The buffer plate is configured to be attached to the display panel, and the side region of the porous member is configured to overlap with the side of the display panel. Wherein, the thickness of the side region of the first compressible porous component is less than the thickness of the main body region of the first compressible porous component, and The porosity of the side region of the first compressible porous component is lower than that of the main body region of the first compressible porous component.

17. The method according to claim 16, in, The porous component includes a main body region and a side region disposed along the side of the main body region. The step of first compressing the porous component includes compressing the porous component using a compression unit. The compression unit includes a first pressing portion corresponding to the main body region and a second pressing portion corresponding to the side region. The second pressing portion protrudes vertically downward beyond the first pressing portion.

18. The method according to claim 17, wherein, Perform a first compression step on the porous member, such that the pressure applied to the side region is greater than the pressure applied to the main body region.

19. The method of claim 16, wherein, The step of performing a second compression on the first compressed porous member is performed, such that at least a portion of the adhesive member is compressed, while the first compressed porous member is laminated onto the adhesive member to fill at least a portion of the pores of the first compressed porous member.

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