Sound emitting device, electronic musical instrument, and method for manufacturing sound emitting device

Abstract

To ensure the interval between the sound outlet of the sound emitting part and the covering member and to apply tension on the covering member, thereby providing a sound emitting device capable of preventing or inhibiting the occurrence of resonance and a manufacturing method of the sound emitting device. The sound emitting device comprises: a speaker (10); a first cover (50) arranged in a form of at least overlapping with the sound outlet (10a) of the speaker (10), having an opening area (53) composed of a plurality of opening portions at the overlapping part with the speaker (10); a second cover (60) arranged in a form of overlapping with the front side of the first cover (50) to surround the opening area (53) of the first cover (50); and a voile net (70) covering the front side of the first cover (50) and the second cover (60) and being bonded to the second cover (60); between the second cover (60) and the voile net (70), the area (A1) in the second cover (60) except the surrounding of the opening area (53) of the first cover (50) is bonded with a first adhesive (B1), and the area (A2) in the second cover (60) surrounding the opening area (53) of the first cover (50) is bonded with a second adhesive (B2) having a higher adhesive strength than the first adhesive (B1).

Description

Technical Field

[0001] This invention relates to a sound reproduction device, an electronic musical instrument, and a method for manufacturing a sound reproduction device. Background Technology

[0002] Previously, covering components such as Saran Nets have been proposed, which cover the sound outlet of a sound-emitting device, such as a speaker in an electronic musical instrument, on the sound-emitting side. For example, Patent Document 1 discloses a sound-emitting structure in which a sound-transmitting covering component is fixed to a sound-emitting body. In this sound-emitting structure, a groove is provided on the sound-emitting body for pushing a fixing component in. When the sound-emitting body is covered by the covering component, the covering component is firmly fixed relative to the sound-emitting body by clamping a portion of the covering component between the groove and the fixing component and pushing the fixing component into the groove.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2009-68146 Summary of the Invention

[0006] In structures where the sound-emitting side of a sound-emitting device such as an electronic musical instrument is covered by a cover member, resonance between the sound outlet and the cover member becomes a problem. Such resonance occurs when the sound outlet and the cover member are in a close or abutting state, or when tension is not applied to the cover member located at the position overlapping the sound outlet, making it prone to vibration. In the sound-emitting structure of Patent Document 1, tension is applied to the cover member by firmly fixing it in place; however, insufficient spacing is not ensured between the sound outlet and the cover member, potentially leading to resonance.

[0007] The object of the present invention is to provide a sound-producing device that can prevent or suppress the generation of resonance by ensuring the gap between the sound outlet of the sound-producing part of an electronic musical instrument and a cover member and applying tension to the cover member, a method for manufacturing the sound-producing device, and an electronic musical instrument having a sound-producing device that can prevent or suppress the generation of resonance.

[0008] A sound playback device according to one embodiment of the present invention includes: a sound playback section; a first component disposed in a manner that overlaps at least with the sound playback port of the sound playback section, having an opening region composed of a plurality of openings at the portion overlapping with the sound playback port; a second component disposed in a manner that overlaps with the side of the first component opposite to the sound playback section side, surrounding the opening region of the first component; and a covering component covering the sides of the first component and the second component opposite to the sound playback section side, and being adhered to the second component; wherein, between the second component and the covering component, the area of ​​the second component other than the area around the opening region of the first component is adhered with a first adhesive, and the area of ​​the second component surrounding the opening region of the first component is adhered with a second adhesive having a higher adhesive strength than the first adhesive.

[0009] Furthermore, one embodiment of the present invention provides an electronic musical instrument that includes the aforementioned sound playback device.

[0010] Furthermore, a method for manufacturing a sound playback device according to a technical solution of the present invention includes: a first configuration step, in which a first component having an opening region composed of a plurality of openings is configured such that the opening region overlaps with the sound outlet of the sound playback section; a second configuration step, in which a second component is configured to surround the opening region of the first component in a manner that overlaps with the side of the first component opposite to the side of the sound playback section; and a bonding step, in which a covering component is bonded to the second component in a manner that covers the side of the first component and the side of the second component opposite to the side of the sound playback section; in the bonding step, the area between the second component and the covering component, excluding the area around the opening region of the first component, is bonded with a first adhesive, and the area between the second component and the covering component, excluding the area around the opening region of the first component, is bonded with a second adhesive with a bonding strength higher than that of the first adhesive.

[0011] Invention Effects

[0012] According to the present invention, a sound-producing device, a method for manufacturing the sound-producing device, and an electronic musical instrument having a sound-producing device capable of preventing or suppressing the generation of resonance by ensuring the interval between the sound-producing port of the sound-producing section and the cover member and applying tension to the cover member are provided. Attached Figure Description

[0013] Figure 1 This is a perspective view showing the appearance of an electronic musical instrument according to an embodiment of the present invention.

[0014] Figure 2 This is an overall perspective view showing the main parts of the loudspeaker device according to the first embodiment.

[0015] Figure 3 This is a magnified front view of the area near the speaker in the first embodiment.

[0016] Figure 4 This is a perspective view of the first cover in the speaker device of the first embodiment after the styrofoam mesh, the second cover, and the padding component have been removed, viewed from the front side.

[0017] Figure 5 yes Figure 3 The cross-sectional view of section IV-IV in the figure is a cross-sectional view of the loudspeaker.

[0018] Figure 6A and Figure 6B This diagram illustrates the bonding configuration between each support component and the yarn mesh in the first embodiment. Figure 6A It is a front view. Figure 6B This is the rear view.

[0019] Figure 7 This is a magnified front view of the speaker of the first embodiment, and a front view showing the configuration of the pad members in the opening area.

[0020] Figure 8 This is a magnified front view of the speaker in the second embodiment, and a front view showing the configuration of the pad member in the opening area.

[0021] Label Explanation

[0022] 1. Loudspeaker assembly 10a. Sound outlet 14. Coil section 18. Vibrating plate 19. Frame section 24. Power switch 50. First cover 52a. Outer edge 52c. Second beam 53. Opening area 54. Frame-shaped section 60. Second cover 70. Sheer mesh 100. Electronic keyboard instrument 113. Adjustment knob 130. Keyboard 80a. Curved beam-shaped section 180a. Straight beam-shaped section A1, A2, A3. Area B1. First adhesive B2. Second adhesive C. Sound center D1. Spacing 10. Loudspeaker 12. Magnet section 16. Cap section 18a. Edge section 20. Top panel 30. Terminal panel 52. Mesh-shaped section 52b. First beam 53a. Opening section 56. Plate-shaped section 60a. Sound outlet opening section 80. Pad component 111. Upper surface 119. Instrument shell 131. Operation section 180. Pad component Detailed Implementation

[0023] The following describes embodiments of the present invention based on the accompanying drawings. Figure 1 The sound device shown, namely the electronic keyboard musical instrument 100 (electronic musical instrument), has a 61-key keyboard 130 and an instrument housing 119. The upper surface 111 of the electronic keyboard musical instrument 100 is provided with an operating section 131 having adjustment knobs 113. Furthermore, the back of the instrument housing 119... Figure 2 As shown, it is configured as a sound-emitting device having multiple loudspeakers 10.

[0024] Next, regarding the implementation of this sound playback device, please refer to the following. Figures 2-7 The first embodiment of the sound playback device of the present invention will be described. Figure 2 This is an overall perspective view showing the main parts of the loudspeaker device (sound output device) 1 according to this embodiment. Figure 2 As shown, the speaker device 1 has a side facing approximately the front (the sound-emitting side is oriented towards the front side). Figure 2 The four speakers (sound output units) 10 are arranged near the front side as shown. Hereinafter, Figure 2 and Figure 3 The upper side is designated as the upper side of speaker device 1, and the opposite side is designated as the lower side. Figure 2 and Figure 3 The right side is designated as the right side of speaker device 1, and the opposite side is designated as the left side. Figure 2 and Figure 3 The side closest to the front (the sound output side of each speaker 10) is designated as the front side (front side), and the opposite side is designated as the rear side (back side).

[0025] The speaker assembly 1 has a first cover (first component) 50 on its front side, a second cover (second component) 60 disposed in front of the first cover 50, and a nylon mesh 70 covering the front sides of the four speakers 10, the first cover 50, and the second cover 60 (see reference). Figure 2 and Figure 5 The loudspeaker unit 1 has a horizontally elongated rectangular shape, and the portion except for the front side is constructed as a cabinet formed by the instrument shell 119 of the electronic keyboard instrument 100 (electronic musical instrument). Inside the cabinet, a control circuit board (not shown) for controlling the loudspeaker unit 1 is disposed. Furthermore, in Figure 2 The diagram only shows a portion of the enclosure (upper panel 20) that constitutes the appearance of the loudspeaker device 1. The other parts of the enclosure of the loudspeaker device 1 are constructed as instrument housings 119, such as the rear, left and right sides and the bottom panel components that constitute the rear, left and right sides and the bottom of the loudspeaker device 1.

[0026] On the upper side of the speaker unit 1, there is a horizontally elongated rectangular plate-shaped upper panel 20, which is part of the enclosure. The sound outlets 10a of the four speakers 10 are each horizontally elongated elliptical in shape when viewed from the front side, with two arranged on each of the left and right sides of the speaker unit 1. On the front side of the speaker unit 1, on the upper right side of the two speakers on the left, there is a power switch 24 for turning the power on / off for these two speakers 10, and on the upper left side of the two speakers on the right, there is a power switch 24 for turning the power on / off for these two speakers 10. In addition, on the lower side of the approximately central portion of the front side of the speaker unit 1, there is a terminal panel 30 for inserting various terminals.

[0027] Assume that the four loudspeakers 10 in loudspeaker assembly 1 have the same structure. For example... Figure 5 As shown, each loudspeaker 10 is a conventional cone-shaped loudspeaker, positioned on the front portion of the loudspeaker assembly 1 with the sound outlet 10a facing forward. Each loudspeaker 10 includes a magnet portion 12 located at the rear, a coil portion 14 located at the inner center of the magnet portion 12, a cap portion 16 located at the front of the central portion, a generally frustum-shaped diaphragm 18 with its diameter expanding towards the front, and a frame portion 19 supporting the outer side of the diaphragm 18. The outer periphery of the diaphragm 18 is formed into an edge portion 18a. The sound emission center C of each loudspeaker 10 is located at the upper part of its cap portion 16.

[0028] like Figure 4 As shown, the first cover 50 is a horizontally elongated rectangular plate-shaped component made of synthetic resin, which is arranged on the right and left sides of the speaker device 1 to cover the front sides of two adjacent speakers 10. That is, the speaker device 1 has two first covers 50. The first cover 50 has two mesh-like portions 52 that overlap with the sound outlets 10a of the two speakers 10, a frame-like portion 54 that surrounds each mesh-like portion 52 in a frame-like manner, and a horizontally elongated plate-like portion 56 provided outside the frame-like portion 54.

[0029] The plate-shaped portion 56 is mounted to the control circuit board inside the upper panel 20 and the speaker device 1 by means of screws or the like, with its two plate surfaces facing the front-back direction. The frame-shaped portion 54 protrudes forward from the front surface of the plate-shaped portion 56 in a stepped manner, and is arranged in a horizontally elongated, approximately regular octagonal shape to surround each mesh-shaped portion 52 in a frame-like manner.

[0030] Each mesh-like portion 52 is provided to protrude slightly from the entire surface of the frame-like portion 54 towards the front, and its outer edge 52a is a generally elliptical shape with the same horizontal length as the sound outlet 10a of each speaker 10. The first cover 50 is arranged such that the outer edge 52a of the mesh-like portion 52 surrounds the edge 18a of the diaphragm 18 of the speaker 10. Each mesh-like portion 52 is an opening region 53 containing multiple openings formed by a first beam 52b and a second beam 52c. The first beam 52b is provided with a so-called honeycomb structure with a generally hexagonal mesh shape from the outer edge 52a, and the second beam 52c is provided in both longitudinal and transverse directions from the outer edge 52a. Figure 3 As shown, the opening region 53 includes an opening 53a located at a position overlapping with the sound emission center C of the speaker 10.

[0031] Here, as Figure 3 and Figure 7 As shown, a relatively thin, roughly rectangular pad member (buffer member) 80, extending longitudinally along the shape of the first beam 52b and the second beam 52c, is disposed on the front surface of the approximately central portion of the opening region 53 (between the first cover 50 and the salacious mesh 70 described later). That is, the pad member 80 is disposed along the non-opening portion of the opening region 53, and further has a curved beam-like portion (beam-like portion) 80a at its central portion that bends into a roughly U-shape along the non-opening portion of the sound emission center C of the speaker 10. Therefore, the pad member 80 is disposed at a position overlapping with the sound emission center C of the speaker 10. The pad member 80 is formed of polyurethane foam, elastomer, silicone, etc., and has a thickness of, for example, 1 mm. The pad member 80 is adhered to the first beam 52b and the second beam 52c by an adhesive or the like. Therefore, by including the aforementioned curved beam-shaped portion 80a, the pad component 80 can improve its in-plane strength in a plan view, and can improve the workability of attaching the pad component 80 to the first cover 50.

[0032] like Figure 2 and Figure 7 As shown, the second cover 60 is made of synthetic resin and is a horizontally elongated rectangular plate with a flat front surface. It is configured to cover the front side of the speaker assembly 1, except for the power switches 24, terminal panels 30, and the sound outlets 10a of each speaker 10. Furthermore, the second cover 60 has a sound outlet opening 60a facing the sound outlet at a position overlapping with the sound outlets 10a of each speaker 10. In other words, the second cover 60 is configured to overlap with the side of the first cover 50 opposite to the speaker 10 side, thereby surrounding the opening areas 53 of the first cover 50. Therefore, the sound emitted from each speaker 10 is not blocked by the second cover 60.

[0033] like Figure 5Specifically, as shown, the second cover 60 is arranged such that it abuts against the front surfaces of the plate-shaped portion 56 and the frame-shaped portion 54 of the first cover 50, and its sound outlet opening 60a is close to the outer edge 52a of the mesh-shaped portion 52 of the first cover 50. When the second cover 60 is positioned on the front surface side of the first cover, the front surface of the second cover 60 is further forward than the mesh-shaped portion 52 of the first cover 50. Figure 5 (The upper side of the middle).

[0034] The shale mesh 70, for example, is made of chemical fibers such as polyester, and is a component with minimal sound transmission loss (a component with excellent sound transmission) from each speaker 10. It is generally a horizontally elongated rectangle, slightly larger than the second cover 60. The shale mesh 70, for example... Figure 6A and Figure 6B As shown, the second cover 60 is respectively bonded to the front surface, side surface, and a portion of the rear surface of the second cover 60, which is made into a flat surface. This covers the front and side surfaces of the second cover 60, as well as the mesh portion 52 of the first cover 50 (the sound outlet 10a of the speaker 10). The mesh 70 is separated from the mesh portion 52 of the first cover 50 (the area where the mesh 70 overlaps with the first cover 50), with a spacing D1 of, for example, 2 mm. Furthermore, the mesh 70 is close to the pad member 80, with a spacing of, for example, 1 mm. As described above, the mesh 70 is supported by both the first cover 50 and the second cover 60 on the side of the speaker 10's sound outlet 10a.

[0035] Next, refer to Figure 6A and Figure 6B The bonding method of the styrene mesh 70 to the second cover 60 is described in detail. The area A1 of the front surface of the second cover 60, excluding the area around the sound outlet opening 60a (the portion overlapping with the opening region 53 of the first cover 50), is bonded to the styrene mesh 70 with a first adhesive B1. The first adhesive B1 is, for example, a low-tack styrene-butadiene rubber (SBR) solvent-based adhesive. On the other hand, the area A2 of the front surface of the second cover 60, around the sound outlet opening 60a (the portion overlapping with the opening region 53 of the first cover 50), is bonded to the styrene mesh 70 with a second adhesive B2, which has a higher bonding strength than the first adhesive B1. The second adhesive B2 is, for example, a high-tack neoprene rubber solvent-based adhesive. Furthermore, the high bonding strength described here refers to the difficulty in peeling off after curing following bonding. Furthermore, the states of the first adhesive B1 and the second adhesive B2 include the state before the adhesives are cured and the state after the adhesives have been cured.

[0036] Thus, by bonding the area A2 surrounding the sound outlet opening 60a on the front surface of the second cover 60 to the velour mesh 70 with a second adhesive B2 that has excellent bonding strength, the portion of the velour mesh 70 that overlaps with the sound outlet opening 60a, i.e., the area A3 surrounded by the part bonded by the second adhesive B2, becomes a state under tension. The state under tension on the velour mesh 70 described here refers to a state where wrinkles or looseness are almost invisible on the velour mesh 70, and where the rebound force (elastic recovery force) when pushed is large.

[0037] Next, the manufacturing method of the loudspeaker device 1 according to this embodiment will be described. The assembly process of the upper panel 20 and the assembly process of the control circuit board within the loudspeaker device 1 are omitted from the description since well-known loudspeaker device manufacturing methods can be applied. In this manufacturing method, firstly, the first cover 50 is assembled by placing it on the front side of each loudspeaker 10 in a manner where the opening region 53 of the first cover 50 overlaps with the sound outlet 10a of the loudspeaker 10 (first arrangement step). Next, the second cover 60 is arranged in an overlapping manner on the front side of the first cover 50, surrounding the opening region 53 of the first cover 50 (second arrangement step). That is, the second cover 60 is arranged and assembled in a manner where the sound outlet opening 60a of the second cover 60 overlaps with the opening region 53 of the first cover 50.

[0038] Next, the first adhesive B1 is applied to areas A1 and A2 (see Figure 6) by spraying or the like. Next, the second adhesive B2, which has a higher bonding strength than the first adhesive B1, is applied to area A2 (see Figure 6) around the sound outlet opening 60a on the front surface of the second cover 60 by brushing or the like. Next, the nylon mesh 70 is bonded to area A1 where the first adhesive B1 was applied and to area A2 where both the first adhesive B1 and the second adhesive B2 were applied, and the front sides of the first cover 50 and the second cover 60 are covered with the nylon mesh 70 (bonding process).

[0039] At this time, while tension is applied to the portion of the slub mesh 70 that overlaps with the sound outlet opening 60a, i.e., the area A3 (see Figure 6) surrounded by the portion bonded by the second adhesive B2, the slub mesh 70 is bonded to the second cover 60. The tension applied to the slub mesh 70 can be achieved, for example, by stretching the slub mesh 70 by applying an equal force around the area A2 where the second adhesive B2 is applied.

[0040] Here, when only the second adhesive B2 with high bonding strength is used, the workability of bonding the slub mesh 70 deteriorates. Currently, the bonding process for the slub mesh 70 is not a process of applying tension to the entire surface all at once; it is done manually, applying tension only little by little. When the slub mesh 70 outside the desired bonding area comes into contact with the adhesive, the high-strength second adhesive B2 results in an undesirable, excessively strong bond. On the other hand, when only the low-strength first adhesive B1 is used, the slub mesh 70 requires high tension to prevent resonance; however, this high tension cannot be ensured with the low-strength first adhesive B1. Therefore, by using two adhesive materials, the workability of bonding the slub mesh 70 can be ensured, and a high tension can be applied to the slub mesh 70.

[0041] As explained above, in the speaker device 1 according to this embodiment, a first cover 50 is provided in a manner where the opening region 53 overlaps with the sound outlet 10a of the speaker 10. A second cover 60 is provided on the side of the first cover 50 opposite to the speaker 10 (front side) in a manner where the sound outlet opening 60a overlaps with the opening region 53. A nylon mesh 70 is provided to cover and adhere the side opposite to the speaker 10 (front side) of both the first cover 50 and the second cover 60 to the second cover 60. Thus, the nylon mesh 70 is supported on the side of the sound outlet 10a of the speaker 10 by the two components, the first cover 50 and the second cover 60. By making the structure like this, sufficient spacing is ensured between the sound outlet 10a of the speaker 10 and the opening region 53 of the first cover 50 and the nylon mesh 70 at the position where it overlaps with the sound outlet 10a of the speaker 10.

[0042] Furthermore, in the loudspeaker device 1 of this embodiment, in region A1, the second cover 60 and the nylon mesh 70 are bonded together by the first adhesive B1, and in region A2 surrounding the sound outlet opening 60a on the front surface of the second cover 60, the second cover 60 and the nylon mesh 70 are bonded together by the second adhesive B2, which has a higher bonding strength than the first adhesive B1. By making the structure such that the region A3 surrounded by the portion bonded with the second adhesive B2 experiences a greater tension than the region A1 bonded with the first adhesive B1. As described above, in the loudspeaker device 1 of this embodiment, the spacing between the sound outlet 10a of the loudspeaker 10 and the nylon mesh 70 is ensured, and the greater tension applied to the nylon mesh 70 prevents or suppresses resonance.

[0043] Furthermore, in the loudspeaker assembly 1, the suede mesh 70 is bonded to the second cover 60 in a state where tension is applied at least in the region A3 surrounded by the portion bonded with the second adhesive B2. This allows for a greater tension to be applied to the suede mesh 70 in region A3, enabling more effective prevention or suppression of resonance in the loudspeaker assembly 1.

[0044] Furthermore, in the speaker assembly 1, the areas of the styrofoam mesh 70 that overlap with the opening area 53 of the first cover 50 are separated. This allows for a specific structure that ensures sufficient spacing between the opening area 53 of the first cover 50 and the styrofoam mesh 70.

[0045] Furthermore, in the loudspeaker assembly 1, the opening region 53 of the first component includes an opening 53a located at a position overlapping with the sound emission center C of the loudspeaker 10. Thus, the sound emitted from the sound emission center C, where the sound is strongest, passes through the opening 53a, thereby preventing the sound emitted from the loudspeaker 10 from being damaged by the first cover 50.

[0046] Furthermore, the loudspeaker assembly 1 includes a pad member 80 disposed between the first cover 50 and the styrofoam mesh 70 and adhered to the first cover 50. Therefore, the pad member 80 can suppress the vibration of the first cover 50 caused by the sound emitted from the loudspeaker 10, and can effectively prevent or suppress the occurrence of resonance.

[0047] Furthermore, in the speaker assembly 1, the pad member 80 is bonded to the first cover 50 in the form of a non-opening portion along the opening region 53 of the first cover 50. Therefore, the vibration of the first cover 50 caused by the sound emitted from the speaker 10 can be further suppressed by the pad member 80, and the occurrence of resonance can be prevented or suppressed more effectively.

[0048] Furthermore, in the speaker assembly 1, the opening region 53 of the first cover 50 is provided by the first beam 52b and the second beam 52c, and the pad member 80 is bonded to the first cover 50 in a manner that runs along the first beam 52b and the second beam 52c of the first cover 50. Thus, a specific structure for arranging the pad member 80 in a manner that runs along the non-opening portion of the opening region 53 can be provided.

[0049] Furthermore, in the speaker assembly 1, the pad member 80 has a curved beam-shaped portion 80a provided along the non-opening portion at the sound emission center C of the speaker 10. Thus, in the pad member 80, the curved beam-shaped portion 80a functions as a beam, thereby improving the in-plane strength of the pad member 80 in a plan view, and further improving the workability when attaching the pad member 80 to the first cover 50.

[0050] Furthermore, in the loudspeaker assembly 1, the pad member 80 is close to the styrofoam mesh 70. As a result, when the styrofoam mesh 70 vibrates, the styrofoam mesh 70 interferes with the pad member 80, and its vibration is absorbed by the pad member 80, so the occurrence of resonance can be more effectively prevented or suppressed.

[0051] Furthermore, the electronic keyboard instrument 100 equipped with the speaker device 1 can more effectively prevent or suppress resonance during playback, resulting in high-quality sound reproduction.

[0052] Furthermore, the method for manufacturing the loudspeaker device 1 includes: a first configuration step, in which a first cover 50 having an opening region 53 composed of a plurality of openings is configured such that the opening region 53 overlaps with the sound outlet 10a of the loudspeaker 10; a second configuration step, in which a second cover 60 is configured to surround the opening region 53 of the first cover 50 in a manner that overlaps with the side of the first cover 50 opposite to the side of the loudspeaker 10; and a bonding step, in which a nylon mesh 70 is bonded to the second cover 60 in a manner that covers the sides of the first cover 50 and the second cover opposite to the side of the loudspeaker 10; in the bonding step, between the second cover 60 and the nylon mesh 70, a region A1 is bonded with a first adhesive B1, and a region A2 around the opening region 53 of the first cover 50 is bonded with a second adhesive B2 which has a higher bonding strength than the first adhesive B1.

[0053] According to the manufacturing method described above, through the first and second configuration steps, the first cover, the second cover, and the nylon mesh 70 can be assembled at a position overlapping with the sound outlet 10a of the loudspeaker 10, ensuring a sufficient gap between the sound outlet 10a of the loudspeaker 10, the opening area 53 of the first cover 50, and the nylon mesh 70. Furthermore, through the bonding step, in the area A3 surrounded by the portion bonded with the second adhesive B2, the nylon mesh 70 can be bonded to the second cover 60 with a greater tension than the area A1 bonded with the first adhesive B1. Thus, the gap between the sound outlet 10a of the loudspeaker 10 and the nylon mesh 70 is ensured, and a greater tension is applied to the nylon mesh 70, enabling the manufacture of a loudspeaker device 1 capable of preventing or suppressing resonance.

[0054] Furthermore, in the manufacturing method of the loudspeaker device 1, during the bonding process, the spunbond mesh 70 is bonded to the second cover 60 while under tension in region A3, which is at least surrounded by the portion bonded with the second adhesive B2. Therefore, during the bonding process, a greater tension can be applied to the spunbond mesh 70 in region A3, enabling the manufacture of a loudspeaker device 1 that can more effectively prevent or suppress resonance.

[0055] Next, refer to Figure 8A second embodiment of the loudspeaker device (sound emission device) 1 will be described. In the second embodiment, the shape of the pad member 180 differs from that of the pad member 80 in the first embodiment. Other structures are the same as in the first embodiment, so descriptions are omitted. Figure 8 As shown, in the pad member 180 of the second embodiment, the portion surrounding the opening 53a in the opening region 53, which overlaps with the sound emission center C of the speaker 10, is not shaped like the second beam 52c, but rather becomes a straight beam-shaped portion (beam-shaped portion) 180a in the left-right direction. Even with this shape, the pad member 180 of the second embodiment can achieve the same effect as the pad member 80 of the first embodiment. Furthermore, by including the aforementioned straight beam-shaped portion 180a, the pad member 180 of the second embodiment can improve its in-plane strength in a plan view, and can improve the workability when attaching the pad member 80 to the first cover 50.

[0056] Furthermore, the embodiments described above are merely illustrative examples and are not intended to limit the scope of the invention. These new embodiments can be implemented in a wide variety of other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their variations are included within the scope and spirit of the invention, and are also included within the scope of the invention as described in the claims and its equivalents. For example, in the embodiments described above, a structure in which a pad member is arranged in the opening area is illustrated, but the speaker device may also have a structure without a pad member. Even with such a structure, the speaker device can ensure the spacing between the speaker's sound outlet and the rayon mesh and exert a large tension on the rayon mesh, preventing or suppressing resonance and resulting in an electronic musical instrument with good sound quality.

Claims

1. A sound playback device, characterized in that, have: Sound output section; The first component is provided in a manner that overlaps at least with the sound outlet of the sound-emitting part, and has an opening area composed of multiple openings in the part that overlaps with the sound outlet. The second component is arranged to overlap with the side of the first component opposite to the sound-emitting section side, and surrounds the opening area of ​​the first component. as well as A covering component covers the side of the first component and the second component opposite to the sound-emitting section side, and is adhered to the second component. Between the second component and the cover component, the area of ​​the second component other than the area around the opening area of ​​the first component is bonded with a first adhesive, and the area around the opening area of ​​the first component in the second component is bonded with a second adhesive with a higher bonding strength than the first adhesive. Around the aforementioned opening area, there is a frame-shaped portion surrounded by a frame, and a horizontally elongated plate-shaped portion disposed on the outside of the aforementioned frame-shaped portion. The frame-shaped portion protrudes forward in a stepped manner from the front surface of the plate-shaped portion.

2. The sound playback device as described in claim 1, characterized in that, The aforementioned covering component is bonded to the aforementioned second component in a state where it is under tension, at least in the area surrounded by the portion bonded with the aforementioned second adhesive.

3. The sound playback device as described in claim 1, characterized in that, The first component described above has: Multiple mesh-like sections are respectively arranged to overlap with the sound outlets of the aforementioned sound-emitting sections; and Multiple frame-shaped portions are provided to surround the multiple mesh-shaped portions in a frame-like manner.

4. The sound playback device as described in claim 3, characterized in that, The aforementioned mesh-like portion has: Outer edge; The first beam, starting from the aforementioned outer edge, is configured with a roughly hexagonal, mesh-like honeycomb structure; and The second beam is installed in both longitudinal and transverse directions, starting from the aforementioned outer edge.

5. The sound playback device as described in claim 1 or 2, characterized in that, The portion of the covering component that overlaps with the opening area of ​​the first component is separated from the first component.

6. The sound playback device as described in claim 1, characterized in that, The opening area of ​​the first component includes an opening located at a position overlapping with the sound emission center of the sound emission unit.

7. The sound playback device as described in claim 1, characterized in that, It has a buffer member disposed between the first component and the cover component and adhered to the first component.

8. The sound playback device as described in claim 7, characterized in that, The aforementioned buffer component is bonded to the aforementioned first component in the form of a non-opening portion along the aforementioned opening region of the first component.

9. The sound playback device as described in claim 8, characterized in that, The opening area of ​​the first component is provided by a beam; The aforementioned buffer component is bonded to the aforementioned first component in the form of a beam along the aforementioned first component.

10. The sound playback device as described in claim 8, characterized in that, The aforementioned buffer member has a beam-shaped portion disposed along the non-opening portion at the sound emission center of the aforementioned sound emission portion.

11. The sound playback device as described in claim 7, characterized in that, The aforementioned buffer component is close to the aforementioned cover component.

12. An electronic musical instrument, characterized in that, The sound playback device is equipped with any one of claims 1 to 11.

13. A method for manufacturing a sound playback device, characterized in that, have: The first configuration step involves configuring a first component having an opening region consisting of multiple openings in such a way that the opening region overlaps with the sound outlet of the sound outlet section. In the second configuration step, the second component is configured to surround the opening area of ​​the first component in a manner that overlaps with the side of the first component opposite to the sound-emitting section side. as well as In the bonding process, the covering component is bonded to the second component in such a way that the side opposite to the sound-emitting part side of the first component and the second component are covered. In the above bonding process, the area between the second component and the covering component, and the area of ​​the second component other than the area around the opening area of ​​the first component, are bonded with the first adhesive. The area between the second component and the covering component, and the area around the opening area of ​​the first component, is bonded with the second adhesive, which has a higher bonding strength than the first adhesive. Around the aforementioned opening area, there is a frame-shaped portion surrounded by a frame, and a horizontally elongated plate-shaped portion disposed on the outside of the aforementioned frame-shaped portion. The frame-shaped portion protrudes forward in a stepped manner from the front surface of the plate-shaped portion.

14. The method for manufacturing the sound playback device as described in claim 13, characterized in that, In the above bonding process, the cover member is bonded to the second member while under tension in the area surrounded by at least the portion bonded by the second adhesive.

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