Printed circuit board back drilling data statistical method, device, system and storage medium
By using statistical methods, based on the network number, signal start layer, and residual stake threshold of the printed circuit board, the back-drilling termination layer is calculated, the vias that need to be back-drilled are identified, the problem of missed vias on printed circuit boards is solved, and signal quality is improved.
Patent Information
- Application Number
- CN202310366416.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-04-07
- Publication Date
- 2025-11-28
- Estimated Expiration
- 2043-04-07
AI Technical Summary
In printed circuit board design, missed via drilling can cause signals to fail to meet communication protocol requirements, affecting the normal operation of high-speed printed circuit boards.
By using statistical methods, the back-drilling termination layer is calculated based on the via's network number, signal start layer, PCB thickness, and residual stake threshold. This accurately identifies vias that need back-drilling, generates a list of those to be back-drilled, and removes processed vias, thereby improving the accuracy of back-drilling hole settings.
Accurately count the vias that need back drilling to avoid missing drills and improve the signal quality of printed circuit boards.
Smart Images

Figure CN116347772B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of printed circuit board, and particularly relates to a printed circuit board back drilling data statistical method, device, system and storage medium. BACKGROUND
[0002] The printed circuit board back drilling is a process of removing the stubs generated after the signal line layer change, so as to eliminate the electromagnetic interference problem caused by the stubs. With the gradual increase of the high-speed signal rate, the length requirement of the stubs is also more and more strict. In the design process of the high-speed printed circuit board, a large number of via back drilling settings will be generated. For the multi-layer and multi-functional printed circuit board, the number of vias that need to be back drilled even reaches hundreds or thousands. In the back drilling process, once the drilling is missed, the corresponding signal will not meet the requirements of the communication protocol and will be distorted, so that the high-speed printed circuit board cannot work normally. SUMMARY
[0003] In order to solve the problem of via missing drilling on the printed circuit board in the prior art and improve the accuracy of the back drilling hole setting. In order to solve one or more technical problems, the technical scheme adopted by the present application is as follows:
[0004] In a first aspect, a printed circuit board back drilling data statistical method is provided, comprising:
[0005] acquiring an arbitrary via as a first via from the to-be-counted vias, wherein the to-be-counted vias are used for transmitting high-speed signals;
[0006] determining a stub threshold of the first via and a second via according to a bus type corresponding to a network number of the first via, wherein the second via corresponds to the same network number as the first via and is arranged at the other end opposite to the first via;
[0007] respectively acquiring a back drilling starting layer of the first via and the second via according to signal starting layers of the first via and the second via;
[0008] respectively calculating corresponding back drilling termination layers according to the back drilling starting layers of the first via and the second via, the thickness of the printed circuit board, the signal layer corresponding to the network number and the stub threshold, and recording in a to-be-back-drilled list.
[0009] Further, after being recorded in the to-be-back-drilled list, it further comprises:
[0010] eliminating the first via and the second via from the to-be-counted vias to update the to-be-counted vias, and repeatedly executing the printed circuit board back drilling data statistical method.
[0011] Further, respectively acquiring the back drilling starting layer of the first via and the second via according to the signal starting layers of the first via and the second via comprises:
[0012] in response to the signal starting layer being the top layer of the printed circuit board, the back drilling starting layer is the bottom layer of the printed circuit board;
[0013] in response to the signal starting layer being the bottom layer of the printed circuit board, the back drilling starting layer is the top layer of the printed circuit board.
[0014] Further, according to the back drilling starting layer of the first via and the second via, the thickness of the printed circuit board, the signal layer corresponding to the network number, and the stub threshold, the corresponding back drilling termination layer is calculated respectively, including:
[0015] in response to the back drilling starting layer of the via being the bottom layer of the printed circuit board, and the difference between the thickness of the printed circuit board and the depth of the signal layer from the top layer of the printed circuit board being greater than the stub threshold, the number of layers of the back drilling termination layer of the via is one more than the number of layers of the signal layer.
[0016] Further, in response to the back drilling starting layer of the via being the bottom layer of the printed circuit board, and the difference between the thickness of the printed circuit board and the depth of the signal layer from the top layer of the printed circuit board being less than the stub threshold, the via does not need to be back drilled and is not recorded in the back drilling list.
[0017] Further, according to the back drilling starting layer of the first via and the second via, the thickness of the printed circuit board, the signal layer corresponding to the network number, and the stub threshold, the corresponding back drilling termination layer is calculated respectively, including:
[0018] in response to the back drilling starting layer of the via being the top layer of the printed circuit board, and the difference between the depth of the signal layer from the top layer of the printed circuit board and the stub threshold being greater than zero, the number of layers of the back drilling termination layer of the via is one less than the number of layers of the signal layer.
[0019] Further, in response to the back drilling starting layer of the via being the top layer of the printed circuit board, and the difference between the depth of the signal layer from the top layer of the printed circuit board and the stub threshold being less than zero, the via does not need to be back drilled and is not recorded in the back drilling list.
[0020] In a second aspect, a printed circuit board back drilling data statistical device is provided, including:
[0021] a via acquisition module, configured to acquire any via as a first via from a to-be-processed via, wherein the to-be-processed via is used for transmitting a high-speed signal;
[0022] a threshold acquisition module, configured to determine a stub threshold of the first via and the second via according to a bus type corresponding to a network number of the first via, wherein the second via corresponds to the same network number as the first via and is arranged at the other end opposite to the first via;
[0023] a back drilling starting layer acquisition module, configured to acquire a back drilling starting layer of the first via and the second via respectively according to a signal starting layer of the first via and the second via;
[0024] The list generation module is configured to calculate the corresponding back-drilling end layer according to the first via hole, the second via hole, the corresponding signal layer, the back-drilling starting layer, the thickness of the printed circuit board, and the stub threshold, and record the corresponding back-drilling end layer in the back-drilling list.
[0025] In a third aspect, a computer device is provided, which includes a memory, a processor, and a computer program stored in the memory and executable on the processor, and the processor implements the printed circuit board back-drilling data statistical method according to the first aspect when executing the computer program.
[0026] In a fourth aspect, a computer readable storage medium is provided, which stores a computer program, and the computer program implements the printed circuit board back-drilling data statistical method according to the first aspect when executed by a processor.
[0027] The technical scheme provided by the embodiment of the present application has the following beneficial effects:
[0028] The via holes that need to be back-drilled are accurately counted, so that the signal quality of the printed circuit board is improved. BRIEF DESCRIPTION OF DRAWINGS
[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed in the embodiment description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.
[0030] Figure 1 is a printed circuit board back-drilling data statistical method provided by the embodiment of the present application;
[0031] Figure 2 is a printed circuit board back-drilling data statistical method provided by the embodiment of the present application;
[0032] Figure 3 is a computer device for implementing the printed circuit board back-drilling data statistical method provided by the embodiment of the present application. DETAILED DESCRIPTION
[0033] In order to make the purpose, technical scheme and advantages of the present application clearer, the technical scheme in the embodiments of the present application will be described clearly and completely in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some embodiments of the present application, not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.
[0034] Unless otherwise defined, technical terms or scientific terms used in the present disclosure shall have the ordinary meaning as understood by a person having ordinary skill in the art to which the present disclosure pertains. The terms "first", "second", and similar terms used in the present disclosure do not denote any order, quantity, or importance, but are used to distinguish different components. Similarly, the terms "one", "a", or "the" or similar terms do not denote a quantity of any number, but mean the existence of at least one. The numbers in the drawings of the specification only represent the distinction of the respective functional components or modules, and do not represent the logical relationship between the components or modules. The terms "include" or "contain" or similar terms mean that the elements or objects before the terms encompass the elements or objects listed after the terms and their equivalents, and do not exclude other elements or objects. The terms "connect" or "connected" or similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms "upper", "lower", "left", "right", and the like only represent relative positional relationships, which can change when the absolute positions of the described objects change.
[0035] In the following, various embodiments according to the present disclosure will be described in detail with reference to the accompanying drawings. It should be noted that in the drawings, the same reference signs are assigned to components having substantially the same or similar structure and function, and repeated descriptions thereof will be omitted.
[0036] For the problem of via hole missing drilling on a printed circuit board in the prior art, the accuracy of back drilling hole setting is improved.
[0037] In one embodiment, as shown in FIG. 1, a printed circuit board back drilling data statistical method includes: Figure 1
[0038] S100: obtaining any via hole as a first via hole from the via holes to be counted, wherein the via holes to be counted are used to transmit high-speed signals;
[0039] S200: determining the stub threshold of the first via hole and a second via hole according to the bus type corresponding to the network number of the first via hole, wherein the second via hole corresponds to the same network number as the first via hole and is arranged at the other end opposite to the first via hole;
[0040] S300: obtaining the back drilling starting layer of the first via hole and the second via hole, respectively, according to the signal starting layer of the first via hole and the second via hole;
[0041] S400: calculating the corresponding back drilling termination layer of the first via hole and the second via hole, respectively, according to the back drilling starting layer of the first via hole and the second via hole, the thickness of the printed circuit board, the signal layer corresponding to the network number, and the stub threshold, and recording in the back drilling list.
[0042] The record in the list to be back-drilled also includes:
[0043] S500: The first via and the second via are removed from the to-be-counted via to update the to-be-counted via, and the printed circuit board back drilling data counting method is repeatedly executed.
[0044] Preferably, according to the signal starting layer of the first via and the second via, the back drilling starting layer of the first via and the second via is respectively obtained, including:
[0045] S310: In response to the signal starting layer being the top layer of the printed circuit board, the back drilling starting layer is the bottom layer of the printed circuit board.
[0046] S320: In response to the signal starting layer being the bottom layer of the printed circuit board, the back drilling starting layer is the top layer of the printed circuit board.
[0047] Preferably, according to the back drilling starting layer of the first via and the second via, the thickness of the printed circuit board, the signal layer corresponding to the network number, and the stub threshold, the corresponding back drilling termination layer is respectively calculated, including:
[0048] S411: In response to the back drilling starting layer of the via being the bottom layer of the printed circuit board, and the difference between the thickness of the printed circuit board and the depth of the signal layer from the top layer of the printed circuit board being greater than the stub threshold, the number of layers of the back drilling termination layer of the via is the number of layers of the signal layer plus one.
[0049] S412: In response to the back drilling starting layer of the via being the bottom layer of the printed circuit board, and the difference between the thickness of the printed circuit board and the depth of the signal layer from the top layer of the printed circuit board being less than the stub threshold, the via does not need to be back drilled, and is not recorded in the list to be back drilled.
[0050] According to the back drilling starting layer of the first via and the second via, the thickness of the printed circuit board, the signal layer corresponding to the network number, and the stub threshold, the corresponding back drilling termination layer is respectively calculated, and further including:
[0051] S421: In response to the back drilling starting layer of the via being the top layer of the printed circuit board, and the difference between the depth of the signal layer from the top layer of the printed circuit board and the stub threshold being greater than zero, the number of layers of the back drilling termination layer of the via is the number of layers of the signal layer minus one.
[0052] S422: In response to the back drilling starting layer of the via being the top layer of the printed circuit board, and the difference between the depth of the signal layer from the top layer of the printed circuit board and the stub threshold being less than zero, the via does not need to be back drilled, and is not recorded in the list to be back drilled.
[0053] In the common server motherboard hardware block diagram architecture, there are only two cases involving the connection of high-speed signal lines at both ends: (1) chip and chip interconnection; (2) chip and connector interconnection. Through the two connection cases of high-speed signal lines, each high-speed signal interconnection end can be sorted out, for example: the board card contains two CPUs CPU0 and CPU1, and there is a network between CPU0 and CPU1: UPI_P0G3_P1G1_DN<0-15>, UPI_P0G0_P1G2_DN<0-15> and other networks. There is a P4E_CPU0_PE2_SLOTX16_RX_DN<0-15> network between CPU0 and PCIE2 connector. The above only lists the interconnection networks between hardware devices, which is not limited to all networks between hardware devices.
[0054] According to the interconnection of high-speed signal lines at both ends, all high-speed signal bus network names of the board card are summarized. According to the bus type, the stub threshold is set according to the requirements of the bus protocol. The corresponding table of stub threshold and bus protocol is shown in Table 1.
[0055] Table 1: Corresponding table of stub threshold and bus protocol
[0056] Bus type Mil PCIE_3.0 45 PCIE_4.0 35 PCIE_5.0 20 UPI 25 USB 40 SAS_3.0 35 SAS_4.0 20
[0057] For example: for network name P4E…, the mark is PCIE4.0 type bus, and the corresponding stub threshold is 35mil.
[0058] All network names are stored in a “.list” file, and the allegro consultation command is used to consult this.list file. The system will generate all the information related to the network signal in it, which can be placed in the cache. The 5 key data of each network in the cache are extracted using the vlookup function in excel or C language extraction command, which are: starting layer, via 1 coordinates, layer change, via 2 coordinates, and termination layer.
[0059] According to the thickness of each layer of material, the total thickness of the printed circuit board and the thickness distribution of each layer from the top layer to the bottom layer can be obtained.
[0060] According to the block diagram, all high-speed signal networks of the printed circuit board are found, and the related information is stored in the cache. The information in the cache is extracted using functions or program languages, and the corresponding stub threshold of the bus type is used to determine whether the via needs to be back drilled. If yes, the information related to back drilling of the via is extracted and recorded to form a back drilling file to avoid omission. Table 2 shows an entry in the back drilling file. If not, the next via is determined whether it needs to be back drilled. For the recorded via, it is removed from the to-be-counted via to improve the overall execution efficiency of the above method.
[0061] Table 2 back drilling file form
[0062] Network number Starting layer Via 1 coordinate Layer change Via 2 coordinate Ending layer P4E_CPU0_PE2_SLOTX16 TOP / TOP 10902.74,3812.98 9 2455.61,6385.24 TOP / TOP
[0063] In another embodiment, as shown in Figure 2 , the printed circuit board back drilling data statistics device comprises:
[0064] The via obtaining module is configured to obtain an arbitrary via as a first via from to-be-counted vias, wherein the to-be-counted vias are used to transmit high-speed signals.
[0065] The threshold obtaining module is configured to determine stub thresholds of the first via and a second via according to a bus type corresponding to a network number of the first via, wherein the second via corresponds to the same network number as the first via and is arranged at the other end opposite to the first via.
[0066] The back drilling starting layer obtaining module is configured to obtain a back drilling starting layer of the first via and a back drilling starting layer of the second via, respectively, according to signal starting layers of the first via and the second via.
[0067] The list generating module is configured to calculate corresponding back drilling termination layers according to the back drilling starting layer of the first via, the back drilling starting layer of the second via, the thickness of the printed circuit board, the signal layer corresponding to the network number and the stub threshold, and record the back drilling termination layers in a to-be-back-drilled list.
[0068] In another embodiment, as shown in Figure 3 , a computer device comprises a memory, a processor and a computer program stored on the memory and executable on the processor, and the processor implements the printed circuit board back drilling data statistics method of the first aspect when executing the computer program.
[0069] In another embodiment, a computer readable storage medium has a computer program stored thereon, and the computer program is executable on a processor to implement the printed circuit board back drilling data statistics method of the first aspect.
[0070] By implementing the printed circuit board back drilling data statistics method, device, system and storage medium disclosed in the embodiments of the present application, the vias that need to be back drilled can be accurately counted, and the signal quality of the printed circuit board is improved.
[0071] All the optional technical solutions described above can be combined to form optional embodiments of the present application, which will not be described one by one here.
[0072] Embodiment one
[0073] The printed circuit board back drilling data statistics method will be described below in combination with Figure 1 , which comprises:
[0074] S100: freely obtaining an arbitrary via hole as a first via hole from among to-be-counted via holes used for transmitting high-speed signals;
[0075] S200: determining a stub threshold of the first via hole and a second via hole according to a bus type corresponding to a network number of the first via hole, wherein the second via hole corresponds to the same network number as the first via hole and is arranged at the other end opposite to the first via hole;
[0076] S300: obtaining a back-drilling starting layer of the first via hole and a back-drilling starting layer of the second via hole respectively according to signal starting layers of the first via hole and the second via hole;
[0077] S400: calculating a back-drilling termination layer corresponding to the first via hole and a back-drilling termination layer corresponding to the second via hole respectively according to the back-drilling starting layer of the first via hole and the back-drilling starting layer of the second via hole, a thickness of a printed circuit board, a signal layer corresponding to the network number, and the stub threshold, and recording the back-drilling termination layers in a to-be-back-drilled list.
[0078] Embodiment Two
[0079] A better printed circuit board back-drilling data counting method comprises:
[0080] S100: freely obtaining an arbitrary via hole as a first via hole from among to-be-counted via holes used for transmitting high-speed signals;
[0081] S200: determining a stub threshold of the first via hole and a second via hole according to a bus type corresponding to a network number of the first via hole, wherein the second via hole corresponds to the same network number as the first via hole and is arranged at the other end opposite to the first via hole;
[0082] S300: obtaining a back-drilling starting layer of the first via hole and a back-drilling starting layer of the second via hole respectively according to signal starting layers of the first via hole and the second via hole;
[0083] S310: in response to the signal starting layer being a top layer of the printed circuit board, the back-drilling starting layer is a bottom layer of the printed circuit board;
[0084] S320: in response to the signal starting layer being a bottom layer of the printed circuit board, the back-drilling starting layer is a top layer of the printed circuit board.
[0085] S400: calculating a back-drilling termination layer corresponding to the first via hole and a back-drilling termination layer corresponding to the second via hole respectively according to the back-drilling starting layer of the first via hole and the back-drilling starting layer of the second via hole, a thickness of a printed circuit board, a signal layer corresponding to the network number, and the stub threshold, and recording the back-drilling termination layers in a to-be-back-drilled list.
[0086] S411: in response to the back drilling starting layer of the via being the bottom layer of the printed circuit board, and the difference between the thickness of the printed circuit board and the depth of the signal layer from the top layer of the printed circuit board being greater than the stub threshold, the number of layers of the back drilling ending layer of the via being the number of layers of the signal layer plus one.
[0087] S412: in response to the back drilling starting layer of the via being the bottom layer of the printed circuit board, and the difference between the thickness of the printed circuit board and the depth of the signal layer from the top layer of the printed circuit board being less than the stub threshold, the first via and / or the second via not needing back drilling, and not being recorded in the back drilling list.
[0088] S421: in response to the back drilling starting layer of the via being the top layer of the printed circuit board, and the difference between the depth of the signal layer from the top layer of the printed circuit board and the stub threshold being greater than zero, the number of layers of the back drilling ending layer of the via being the number of layers of the signal layer minus one.
[0089] S422: in response to the back drilling starting layer of the via being the top layer of the printed circuit board, and the difference between the depth of the signal layer from the top layer of the printed circuit board and the stub threshold being less than zero, the first via and / or the second via not needing back drilling, and not being recorded in the back drilling list.
[0090] S500: the first via and the second via are removed from the to-be-counted vias to update the to-be-counted vias, and the printed circuit board back drilling data counting method is repeatedly executed.
[0091] Embodiment three
[0092] The printed circuit board back drilling data counting device is described below Figure 2 , and includes:
[0093] The via acquisition module is configured to acquire any via as the first via from the to-be-counted vias, wherein the to-be-counted vias are used to transmit high-speed signals.
[0094] The threshold acquisition module is configured to determine the stub threshold of the first via and the second via according to the bus type corresponding to the network number of the first via, wherein the second via corresponds to the same network number as the first via and is arranged at the other end opposite to the first via.
[0095] The back drilling starting layer acquisition module is configured to acquire the back drilling starting layer of the first via and the second via, respectively, according to the signal starting layer of the first via and the second via.
[0096] The list generation module is configured to calculate the corresponding back drilling ending layer according to the back drilling starting layer of the first via and the second via, the thickness of the printed circuit board, the signal layer corresponding to the network number, and the stub threshold, and record in the back drilling list.
[0097] Embodiment four
[0098] A computer device, such asFigure 3 As shown, it comprises a memory, a processor, and a computer program stored on the memory and executable on the processor, and the processor implements the printed circuit board back drilling data statistical method of the first aspect when executing the computer program, and specifically comprises:
[0099] S100: freely select an arbitrary via as a first via from the to-be-counted vias, wherein the to-be-counted vias are used for transmitting high-speed signals;
[0100] S200: determine the stub threshold of the first via and a second via according to the bus type corresponding to the network number of the first via, wherein the second via corresponds to the same network number as the first via and is arranged at the other end opposite to the first via;
[0101] S300: obtain the back drilling starting layer of the first via and the second via respectively according to the signal starting layer of the first via and the second via;
[0102] S310: in response to the signal starting layer being the top layer of the printed circuit board, the back drilling starting layer is the bottom layer of the printed circuit board;
[0103] S320: in response to the signal starting layer being the bottom layer of the printed circuit board, the back drilling starting layer is the top layer of the printed circuit board.
[0104] S400: calculate the back drilling termination layer corresponding to the first via and the second via respectively according to the back drilling starting layer of the first via and the second via, the thickness of the printed circuit board, the signal layer corresponding to the network number, and the stub threshold, and record them in the to-be-drilled list.
[0105] S411: in response to the back drilling starting layer of the via being the bottom layer of the printed circuit board, and the difference between the thickness of the printed circuit board and the depth of the signal layer from the top layer of the printed circuit board being greater than the stub threshold, the number of layers of the back drilling termination layer of the via is one more than the number of layers of the signal layer.
[0106] S412: in response to the back drilling starting layer of the via being the bottom layer of the printed circuit board, and the difference between the thickness of the printed circuit board and the depth of the signal layer from the top layer of the printed circuit board being less than the stub threshold, the first via and / or the second via do not need to be back drilled, and are not recorded in the to-be-drilled list.
[0107] S421: in response to the back drilling starting layer of the via being the top layer of the printed circuit board, and the difference between the depth of the signal layer from the top layer of the printed circuit board and the stub threshold being greater than zero, the number of layers of the back drilling termination layer of the via is one less than the number of layers of the signal layer.
[0108] S422: in response to the back drilling starting layer of the via being the top layer of the printed circuit board, and the difference between the depth of the signal layer from the top layer of the printed circuit board and the stub threshold being less than zero, the first via and / or the second via do not need to be back drilled, and are not recorded in the to-be-drilled list.
[0109] S500: removing the first via hole and the second via hole from the to-be-counted via holes to update the to-be-counted via holes, and repeatedly performing the printed circuit board back drilling data counting method.
[0110] Embodiment five
[0111] A computer readable storage medium, having stored thereon a computer program, the computer program being executed by a processor to implement the printed circuit board back drilling data counting method of the first aspect, specifically comprising:
[0112] S100: obtaining an arbitrary via hole as the first via hole from the to-be-counted via holes, wherein the to-be-counted via holes are used for transmitting high-speed signals;
[0113] S200: determining the stub threshold of the first via hole and the second via hole according to the bus type corresponding to the network number of the first via hole, wherein the second via hole corresponds to the same network number as the first via hole and is arranged at the other end opposite to the first via hole;
[0114] S300: obtaining the back drilling starting layer of the first via hole and the second via hole respectively according to the signal starting layer of the first via hole and the second via hole;
[0115] S310: in response to the signal starting layer being the top layer of the printed circuit board, the back drilling starting layer is the bottom layer of the printed circuit board;
[0116] S320: in response to the signal starting layer being the bottom layer of the printed circuit board, the back drilling starting layer is the top layer of the printed circuit board.
[0117] S400: calculating the back drilling termination layer corresponding to the first via hole and the second via hole respectively according to the back drilling starting layer of the first via hole and the second via hole, the thickness of the printed circuit board, the signal layer corresponding to the network number, and the stub threshold, and recording in the to-be-back drilled list.
[0118] S411: in response to the back drilling starting layer of the via hole being the bottom layer of the printed circuit board, and the difference between the thickness of the printed circuit board and the depth of the signal layer from the top layer of the printed circuit board being greater than the stub threshold, the number of layers of the back drilling termination layer of the via hole is one more than the number of layers of the signal layer.
[0119] S412: in response to the back drilling starting layer of the via hole being the bottom layer of the printed circuit board, and the difference between the thickness of the printed circuit board and the depth of the signal layer from the top layer of the printed circuit board being less than the stub threshold, the first via hole and / or the second via hole does not need to be back drilled, and is not recorded in the to-be-back drilled list.
[0120] S421: in response to the back drilling starting layer of the via hole being the top layer of the printed circuit board, and the difference between the depth of the signal layer from the top layer of the printed circuit board and the stub threshold being greater than zero, the number of layers of the back drilling termination layer of the via hole is one less than the number of layers of the signal layer.
[0121] S422: In response to the back drilling start layer of the via being the top layer of the printed circuit board, and the difference between the depth of the signal layer from the top layer of the printed circuit board and the stub threshold being less than zero, the first via, and / or the second via not needing back drilling, not being recorded in the list to be back drilled.
[0122] S500: The first via, the second via are removed from the to-be-counted vias to update the to-be-counted vias, and the printed circuit board back drilling data counting method is repeatedly executed.
[0123] In particular, according to the embodiments of the present application, the processes described above with reference to the flowcharts can be implemented as a computer software program. For example, the embodiments of the present application include a computer program product comprising a computer program loaded on a computer readable medium, the computer program containing program code for executing the method shown in the flowchart. In such embodiments, the computer program can be downloaded and installed from a network through a communication device, or installed from a memory, or installed from a ROM. When the computer program is executed by an external processor, the above-mentioned functions defined in the method of the embodiments of the present application are executed.
[0124] It should be noted that the computer readable medium in the embodiments of the present application can be a computer readable signal medium or a computer readable storage medium or any combination of the two. The computer readable storage medium may, for example, but is not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, device or apparatus, or any combination of the above. More specific examples of the computer readable storage medium can include, but are not limited to, an electrical connection having one or more wires, a portable computer diskette, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In the embodiments of the present application, the computer readable storage medium can be any tangible medium containing or storing a program that can be used by or in conjunction with an instruction execution system, device or apparatus. In the embodiments of the present application, the computer readable signal medium can include a data signal carried in a baseband or as a part of a carrier wave, which carries computer readable program code. Such a propagated data signal can take many forms, including but not limited to an electromagnetic signal, an optical signal or any suitable combination of the above. The computer readable signal medium can also be any computer readable medium other than the computer readable storage medium, which can send, propagate or transmit a program for use by or in conjunction with an instruction execution system, device or apparatus. The program code contained in the computer readable medium can be transmitted by any suitable medium, including but not limited to a wire, an optical fiber, an RF (Radio Frequency) or the like, or any suitable combination of the above.
[0125] The computer readable medium described above can be contained in the server described above; or can exist separately and not be assembled into the server. The computer readable medium described above carries one or more programs, when the one or more programs are executed by the server, the server: in response to detecting that the peripheral mode of the terminal is not activated, acquires the frame rate of the application on the terminal; when the frame rate meets the off-screen condition, judges whether the user is acquiring the screen information of the terminal; in response to the judgment result that the user is not acquiring the screen information of the terminal, controls the screen to enter the immediate dim mode.
[0126] Computer program code for carrying out operations of embodiments of the present application can be written in any combination of one or more programming languages, including an object oriented programming language such as Java, Smalltalk, C++ or the like, and conventional procedural programming languages, such as the "C" programming language or similar programming languages. The program code can execute entirely on the user's computer, partly on the user's computer, as a stand-alone software package, partly on the user's computer and partly on a remote computer or entirely on the remote computer or server. In the latter scenario, the remote computer can be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or the connection can be made to an external computer (for example, through the Internet using an Internet Service Provider).
[0127] The various embodiments in the specification are described progressively, and the same or similar parts among the various embodiments can be mutually referred to. Each embodiment focuses on the difference from other embodiments. In particular, the system or system embodiments are described more simply because they are basically similar to the method embodiments, and the relevant parts can be referred to the part of the method embodiments. The above described system and system embodiments are merely illustrative, and the units described as separate components can or can not be physically separated, and the components shown as units can or can not be physical units, i.e., they can be located in one place or distributed on multiple network units. Some or all of the modules can be selected to achieve the purpose of the embodiments according to actual needs. Those skilled in the art can understand and implement without creative labor.
[0128] The above describes the technical solutions provided by the present application in detail, and the principles and implementation manners of the present application are described by applying specific examples. The above embodiment descriptions are only used to help understand the method and core idea of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, the specific implementation manner and application range can be changed. In summary, the content of the specification should not be understood as a limitation of the present application.
[0129] The above only describes the preferred embodiments of the present application, and is not used to limit the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims
1. A printed circuit board back drilling data statistics method, characterized by, The method comprises: acquiring an arbitrary via hole from the via holes to be counted as a first via hole, wherein the via holes to be counted are used to transmit high-speed signals; determining a stub threshold of the first via hole and a second via hole according to a bus type corresponding to a network number of the first via hole, wherein the second via hole corresponds to the same network number as the first via hole and is arranged at the other end opposite to the first via hole; acquiring a back-drilling starting layer of the first via hole and the second via hole respectively according to a signal starting layer of the first via hole and the second via hole; calculating a corresponding back-drilling termination layer of the first via hole and the second via hole respectively according to the back-drilling starting layer of the first via hole and the second via hole, the thickness of the printed circuit board, the signal layer corresponding to the network number, and the stub threshold, and recording in a back-drilling list to be counted; wherein the back-drilling termination layer is obtained by the following way: in response to the back-drilling starting layer of the via hole being the bottom layer of the printed circuit board and the difference between the thickness of the printed circuit board and the depth of the signal layer from the top layer of the printed circuit board being greater than the stub threshold, the number of layers of the back-drilling termination layer of the via hole is one more than the number of layers of the signal layer; in response to the back-drilling starting layer of the via hole being the top layer of the printed circuit board and the difference between the depth of the signal layer from the top layer of the printed circuit board and the stub threshold being greater than zero, the number of layers of the back-drilling termination layer of the via hole is one less than the number of layers of the signal layer, and the stub threshold is determined according to the bus type of the high-speed signal.
2. The printed circuit board back drilling data statistical method of claim 1, wherein, The recording in the back-drilling list to be counted further comprises: eliminating the first via hole and the second via hole from the via holes to be counted to update the via holes to be counted, and repeating the printed circuit board back-drilling data counting method.
3. The printed circuit board back drilling data statistical method of claim 1, wherein, The acquiring of the back-drilling starting layer of the first via hole and the second via hole respectively according to the signal starting layer of the first via hole and the second via hole comprises: in response to the signal starting layer being the top layer of the printed circuit board, the back-drilling starting layer is the bottom layer of the printed circuit board; in response to the signal starting layer being the bottom layer of the printed circuit board, the back-drilling starting layer is the top layer of the printed circuit board.
4. The printed circuit board back drilling data statistical method of claim 1, wherein, in response to the back-drilling starting layer of the via hole being the bottom layer of the printed circuit board and the difference between the thickness of the printed circuit board and the depth of the signal layer from the top layer of the printed circuit board being less than the stub threshold, the via hole does not need to be back-drilled and is not recorded in the back-drilling list to be counted.
5. The printed circuit board back drilling data statistical method of claim 1, wherein, in response to the back-drilling starting layer of the via hole being the top layer of the printed circuit board and the difference between the depth of the signal layer from the top layer of the printed circuit board and the stub threshold being less than zero, the via hole does not need to be back-drilled and is not recorded in the back-drilling list to be counted.
6. A printed circuit board back drilling data statistics apparatus, characterized by, The device comprises: a via hole acquisition module, configured to acquire an arbitrary via hole from the via holes to be counted as a first via hole, wherein the via holes to be counted are used to transmit high-speed signals; a threshold acquisition module, configured to determine a stub threshold of the first via hole and a second via hole according to a bus type corresponding to a network number of the first via hole, wherein the second via hole corresponds to the same network number as the first via hole and is arranged at the other end opposite to the first via hole; a back-drilling starting layer acquisition module, configured to acquire a back-drilling starting layer of the first via hole and the second via hole respectively according to a signal starting layer of the first via hole and the second via hole; a back-drilling start layer acquisition module configured to acquire a back-drilling start layer of the first via and the second via respectively according to the signal start layers of the first via and the second via; a list generation module configured to calculate a corresponding back-drilling end layer according to the back-drilling start layer of the first via and the second via respectively, the thickness of the printed circuit board, the signal layer corresponding to the network number, and the stub threshold, and record the back-drilling end layer in a to-be-back-drilled list; wherein the back-drilling end layer is obtained by the following way: in response to the back-drilling start layer of the via being the bottom layer of the printed circuit board and the difference between the thickness of the printed circuit board and the depth of the signal layer from the top layer of the printed circuit board being greater than the stub threshold, the number of layers of the back-drilling end layer of the via being the number of layers of the signal layer plus one; in response to the back-drilling start layer of the via being the top layer of the printed circuit board and the difference between the depth of the signal layer from the top layer of the printed circuit board and the stub threshold being greater than zero, the number of layers of the back-drilling end layer of the via being the number of layers of the signal layer minus one.
7. A computer device comprising a memory, a processor, and a computer program stored on the memory and executable on the processor, characterized in that, the processor executes the computer program to realize the printed circuit board back-drilling data statistical method of any one of claims 1 to 5.
8. A computer-readable storage medium having stored thereon a computer program, characterized in that, the computer program is executed by the processor to realize the printed circuit board back-drilling data statistical method of any one of claims 1 to 5.
Citation Information
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