Containment system, cluster of electronic equipment racks and data center

Abstract

The present disclosure relates to containment systems, clusters of electronic equipment racks, and data centers. A containment system for an electronic equipment rack includes a top structure movably coupled on a top of the electronic equipment rack, a first side structure movably coupled to a first side of the electronic equipment rack, and a second side structure movably coupled to a second side of the electronic equipment rack opposite the first side, each of the top structure, the first side structure, and the second side structure arranged to move along an axis and at least partially beyond a front end or a rear end of the electronic equipment rack, thereby creating a containment zone at least partially enclosed by the top structure, the first side structure, and the second side structure.

Description

TECHNICAL FIELD

[0001] Embodiments of the present disclosure generally relate to a containment system for one or more electronic equipment racks that creates a containment zone for air cooling of the one or more electronic equipment racks. BACKGROUND

[0002] Recently, data centers have been deploying more clusters of high power density electronic equipment racks in which more high density chips are packed more closely together to provide more processing power. This is especially true due to the development of artificial intelligence (AI) and cloud-based services, which require high performance and high power density processors such as control processing units (CPUs) and graphics processing units (GPUs).

[0003] Thermal management of a data center that includes multiple active electronic equipment racks is critical to ensure proper performance of servers and other IT equipment (e.g., performing IT data processing services) that are running in the racks. However, without proper thermal management, the thermal environment (e.g., temperature) within the racks can exceed thermal operating thresholds, which can result in undesirable consequences (e.g., server malfunction, etc.). One way to manage the thermal environment is to liquid cool the IT equipment. For example, the equipment can include a cold plate on which a processor is mounted within the equipment. A cooling liquid is passed through the cold plate to transfer heat away from the active processor.

[0004] Another way to manage the thermal environment within a data center is to use cooling air to cool clusters of IT equipment. The cooling air is recirculated within the data center using traditional aisle containment systems with data center air conditioners. These systems include clusters of IT equipment positioned between cold aisles and hot aisles. The cold aisles include cool air that is drawn in by the IT equipment to extract heat generated by the active IT equipment. The hot air is exhausted into hot aisles that are separate from the cold aisles. The air conditioners draw in the hot air from the hot aisles, cool the hot air, and supply the cooled air back into the cold aisles.

[0005] However, traditional aisle containment systems have drawbacks. For example, these systems are integrated into the data center, which defines which aisles are cold and which aisles are hot. This means that the cooling capacity available to the IT equipment within the data center is predefined, although this can be sufficient for some electronic equipment racks, however, it does not provide adequate cooling for high power density electronic equipment racks. This is due to the fact that these high power racks generate more heat than lower density racks. Therefore, there is a need for a containment system that is reconfigurable to provide different cooling containment solutions based on the air cooling needs of the IT equipment housed within the data center. SUMMARY

[0006] According to one aspect of the disclosure, a containment system for a row of electronic equipment racks is provided. The containment system includes a top structure movably coupled to a top of the row of electronic equipment racks, a first side structure movably coupled to a first side of the row of electronic equipment racks, and a second side structure movably coupled to a second side of the row of electronic equipment racks opposite the first side, wherein each of the top structure, the first side structure, and the second side structure is arranged to move along an axis and at least partially beyond a front or a rear of the row of electronic equipment racks, thereby creating a containment zone at least partially enclosed by the top structure, the first side structure, and the second side structure.

[0007] According to another aspect of the disclosure, a cluster of electronic equipment racks arranged in a row is provided. The cluster of electronic equipment racks includes a top structure disposed on a top of the cluster of electronic equipment racks and movably coupled to at least one of the electronic equipment racks, a first side structure movably coupled to a side of a first electronic equipment rack positioned at one end of the row, and a second side structure movably coupled to a side of a second electronic equipment rack positioned at another end of the row opposite the one end, wherein each of the top structure, the first side structure, and the second side structure is arranged to move along an axis and at least partially beyond a front or a rear of the cluster of electronic equipment racks, thereby creating a containment zone at least partially enclosed by the top structure, the first side structure, and the second side structure.

[0008] According to yet another aspect of the present disclosure, a data center is provided. The data center includes a data center information technology room, a cluster of electronic equipment racks disposed within the data center information technology room and arranged in a row, and a containment system including a top structure disposed on top of the cluster of electronic equipment racks and movably coupled to at least one of the electronic equipment racks, a first side structure movably coupled to a side of a first electronic equipment rack positioned at one end of the row, a second side structure movably coupled to a side of a second electronic equipment rack positioned at another end of the row opposite the one end, wherein each of the top structure, the first side structure, and the second side structure are arranged to move along an axis and at least partially move beyond a front end or a back end of the cluster of electronic equipment racks, thereby creating a containment zone at least partially enclosed by the top structure, the first side structure, and the second side structure. BRIEF DESCRIPTION OF DRAWINGS

[0009] Embodiments are illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings in which like references indicate similar elements. It should be noted that references to "an" or "one" or "some" embodiment of the present disclosure are not necessarily references to the same embodiment, and such references mean at least one. Also, to the extent that the figures of the drawing show one or more embodiment(s), the figures can show only one or a common embodiment of the many embodiments that can be made, and these embodiments do not limit the present disclosure.

[0010] Figure 1 A front view of an electronic equipment rack with a containment system is shown according to one embodiment.

[0011] Figure 2 A plurality of stages of a side view of an electronic equipment rack with a containment system is shown according to one embodiment, where the structures are moved toward the back end of the electronic equipment rack.

[0012] Figure 3 A front view of a cluster of electronic equipment racks arranged in a row with a containment system is shown according to one embodiment.

[0013] Figure 4 A front view of a cluster of two electronic equipment racks arranged in adjacent rows with a containment system is shown according to one embodiment.

[0014] Figures 5a to 5c A perspective view of a data center including a cluster of multiple electronic equipment racks with a containment system for creating a containment zone is shown according to one embodiment.

[0015] Figure 6 is a cross-sectional top view of a data center showing containment zones between clusters of electronic equipment racks, according to one embodiment.

[0016] Figure 7 is a cross-sectional passage end view of two clusters of electronic equipment racks and their respective top structures with fans, according to one embodiment.

[0017] Figure 8 shows multiple stages of a cross-sectional view showing fans of the top structures rotating, according to one embodiment.

[0018] Figure 9 shows another cross-sectional view of two clusters of electronic equipment racks and their respective top structures, according to one embodiment.

[0019] Figure 10 shows a perspective view of a data center including clusters of electronic equipment racks and a data center coolant distribution system, according to one embodiment.

[0020] Figure 11 is an example of an electronic equipment rack, according to one embodiment. DETAILED DESCRIPTION

[0021] The various embodiments of the present disclosure will now be explained with reference to the drawings. Whenever a component is given a reference numeral a prime symbol (’), as in 110’, a primed reference numeral (110’) indicates that it is a different component from the unprimed version of the component (110). Whenever a component is given a reference numeral a double primed symbol (’’), as in 110”, a double primed reference numeral (110”) indicates that it is a different component from the unprimed version of the component (110) and the primed version of the component (110’). Whenever a component is given a reference numeral a triple primed symbol (’’’), as in 110”’, a triple primed reference numeral (110”’) indicates that it is a different component from the unprimed version of the component (110), the primed version of the component (110’), and the double primed version of the component (110”). Whenever a component is given a reference numeral a quadruple primed symbol (’’’’), as in 110””, a quadruple primed reference numeral (110””) indicates that it is a different component from the unprimed version of the component (110), the primed version of the component (110’), the double primed version of the component (110”), and the triple primed version of the component (110”’). Whenever a component is given a reference numeral a quintuple primed symbol (’’’’’), as in 110””’, a quintuple primed reference numeral (110””’) indicates that it is a different component from the unprimed version of the component (110), the primed version of the component (110’), the double primed version of the component (110”), the triple primed version of the component (110”’), and the quadruple primed version of the component (110””).

[0022] Reference in the specification to “one embodiment” or “an embodiment” means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the disclosure. The appearances of the phrase “in one embodiment” in various places in the specification are not necessarily all referring to the same embodiment.

[0023] The present disclosure solves the problem of providing scalable, efficient, and effective air containment solutions. Specifically, the present disclosure describes a containment system that can be integrated with clusters of existing electronic equipment racks that is capable of reconfiguring air containment layouts based on varying air containment needs. For example, some clusters of electronic equipment racks that are deployed adjacent to one another can require different thermal environments that can be dictated by the electronic equipment installed within the racks. Accordingly, the present disclosure allows air containment zones between clusters of racks to be reconfigured in order to adjust which clusters of adjacent racks share the same thermal environment. To this end, the present disclosure describes a containment system for one or more electronic equipment racks, such as a containment system for clusters of electronic equipment racks arranged in a row, that includes a top structure movably coupled on top of a cluster of electronic equipment racks, a first side structure movably coupled to one side of the cluster of electronic equipment racks (e.g., coupled to a side of an electronic equipment rack at one end of the cluster), and a second side structure movably coupled to another side of the cluster of electronic equipment racks (e.g., coupled to a side of an electronic equipment rack at an opposite side of the row of racks). Accordingly, the top structure is disposed on top of the cluster, while the two side structures are disposed on lateral sides of the cluster of racks. This configuration allows for containment zones to be created towards a front or back end of the cluster of electronic equipment racks. Specifically, each of the top structure, the first side structure, and the second side structure are arranged to move along an axis (e.g., extend along a lateral axis of the cluster of racks) and at least partially move beyond a front or back end of the rack, thereby creating a containment zone in front of or behind the cluster of racks when the structures are in contact with adjacent electronic equipment rack rows or adjacent structures coupled to adjacent rows.

[0024] According to one embodiment, a containment system for an electronic equipment rack includes a top structure movably coupled on top of the electronic equipment rack, a first side structure movably coupled to a first side of the electronic equipment rack, and a second side structure movably coupled to a second side of the electronic equipment rack opposite the first side, each of the top structure, the first side structure, and the second side structure arranged to move along an axis and at least partially move beyond a front or back end of the electronic equipment rack, thereby creating a containment zone at least partially enclosed by the top structure, the first side structure, and the second side structure.

[0025] In one embodiment, the containment system further includes: a first track set coupled to a top of the electronics rack and movably coupled to a top structure; a second track set coupled to a first side of the electronics rack and movably coupled to a first side structure; and a third track set coupled to a second side of the electronics rack and movably coupled to a second side structure, wherein each of the top structure, the first side structure, and the second side structure are arranged to move by sliding linearly along their respective track sets. In another embodiment, the top structure includes a panel that extends at least along a width of the electronics rack, and each of the first side structure and the second side structure includes a panel that extends along a height of the electronics rack.

[0026] In one embodiment, the top structure includes at least one fan arranged to push air into or out of the containment zone. In another embodiment, the axis is a first axis, wherein the at least one fan is arranged to rotate about a second axis that is perpendicular to the first axis to change a direction in which the at least one fan pushes air. In some embodiments, the top structure further includes at least one cooling unit arranged to generate cooled air from ambient air drawn by the at least one fan from outside of the containment zone, wherein the cooled air is pushed by the at least one fan into the containment zone.

[0027] According to another embodiment, a cluster of electronics racks arranged in a row, the cluster of electronics racks including: a top structure disposed on a top of the cluster of electronics racks and movably coupled on at least one of the electronics racks; a first side structure movably coupled to a side of a first electronics rack positioned at one end of the row; and a second side structure movably coupled to a side of a second electronics rack positioned at another end of the row opposite the one end, wherein each of the top structure, the first side structure, and the second side structure are arranged to move along an axis and at least partially move beyond a front or a back end of the cluster of electronics racks, thereby creating a containment zone at least partially enclosed by the top structure, the first side structure, and the second side structure.

[0028] In one embodiment, the cluster of electronic equipment racks further includes: a first set of tracks coupled to a top of at least one of the electronic equipment racks and movably coupled to a top structure; a second set of tracks coupled to a first side of the first electronic equipment rack and movably coupled to a first side structure; and a third set of tracks coupled to a first side of the second electronic equipment rack and movably coupled to a second side structure, wherein each of the top structure, the first side structure, and the second side structure are arranged to move by sliding linearly along their respective sets of tracks. In another embodiment, the top structure includes a panel that extends at least along a width of the row, wherein each of the first side structure and the second side structure includes a panel that extends along a height of the respective electronic equipment rack to which it is movably coupled.

[0029] In one embodiment, the top structure includes at least one fan arranged to push air into or out of the containment zone. In another embodiment, the axis is a first axis, wherein the at least one fan is arranged to rotate about a second axis that is perpendicular to the first axis to change a direction in which the at least one fan pushes air. In some embodiments, the top structure further includes at least one cooling unit arranged to generate cooled air from ambient air drawn by the at least one fan from outside of the containment zone, wherein the cooled air is pushed by the at least one fan into the containment zone.

[0030] According to another embodiment, a data center includes: a data center information technology (IT) room; a cluster of electronic equipment racks disposed within the data center IT room and arranged in a row; and a containment system similar to the containment system as previously described.

[0031] In one embodiment, the cluster of electronic equipment racks is a first cluster of electronic equipment racks, wherein the data center further includes a second cluster of electronic equipment racks disposed within the data center IT room and arranged in a second row that extends parallel and adjacent to the first cluster of electronic equipment racks, each of the top structure, the first side structure, and the second side structure are arranged to move along the axis and toward the second cluster of electronic equipment racks such that the containment zone is at least partially enclosed by the first cluster of electronic equipment racks and the second cluster of electronic equipment racks and each of the top structure, the first side structure, and the second side structure.

[0032] In another embodiment, the top structure is a first top structure, the containment system is a first containment system, and the data center further includes a second containment system comprising: a second top structure disposed on top of a second cluster of electronic device racks and movably coupled to at least one of the electronic device racks in the second cluster; a third side structure movably coupled to one side of a third electronic device rack located at one end of a second row; and a fourth side structure movably coupled to one side of a fourth electronic device rack located at the opposite end of the second row, wherein 1 1) The first top structure, the first side structure, and the second side structure are arranged to move along the axis toward the second cluster of the electronic equipment rack, and 2) the second top structure, the third side structure, and the fourth side structure are arranged to move along the axis toward the first cluster of the electronic equipment rack, such that the first top structure, the first side structure, and the second side structure contact the second top structure, the third side structure, and the fourth side structure, respectively, thereby creating a containment area surrounded by the first cluster of the electronic equipment rack, the second cluster of the electronic equipment rack, and all the structures in the first top structure, the first side structure, the second side structure, the second top structure, the third side structure, and the fourth side structure.

[0033] In one embodiment, as used herein, “connecting” one component (or element) to another component can mean “fluidly” connecting two components such that a fluid (or liquid) such as a cooling liquid or liquid coolant can flow between the two components. For example, connecting a first pipe to a second pipe can connect two pipes together such that liquid coolant can flow from the first pipe to the second pipe (and / or vice versa).

[0034] Figure 1 A front view of an electronics rack with a containment system according to one embodiment is shown. Specifically, this figure shows the front end (e.g., of the electronics rack 2 including electronics components 10 and containment system 1 (hereinafter referred to as the "system")) of the electronics rack 2. Figure 2front end 12) of the electronic device rack. In one embodiment, the electronic device component 10 can be housed (or contained) within an electronic device rack (e.g., a housing or frame of the electronic device rack). For example, the electronic device component can be mounted within the rack (e.g., coupled to one or more rack rails (or supports)). For example, the electronic rack can include one or more (server) slots that are each designed to accommodate (or house) one or more electronic device components. Additionally, as shown, the electronic device component includes an information technology (IT) component 11 (e.g., one or more processors such as central processing units (CPUs) and / or graphics processing units (GPUs), memory, and / or storage devices). In one embodiment, the electronic device component can include one or more IT components (e.g., mounted therein). In some embodiments, the IT component can perform data processing tasks, where the IT component can include software installed in storage devices, loaded into memory, and executed by one or more processors to perform data processing tasks. In one embodiment, the electronic device component can be any type of electronic device that can include one or more IT components (and can have one or more liquid cooling components for cooling the electronic device component). For example, the electronic device component can include an electronic device board (e.g., a server printed circuit board (PCB)) to which one or more IT components are mounted. In another embodiment, the electronic device component can include a cloud server configured to perform cloud-based data processing. In another aspect, the electronic device component can include a host server (referred to as a host node) coupled to one or more compute servers (also referred to as compute nodes such as CPU servers and GPU servers). The host server (with one or more CPUs) is typically connected through a network (e.g., the Internet) with clients to receive requests for specific services such as storage services (e.g., cloud-based storage services such as backup and / or recovery) to execute applications to perform certain operations (e.g., image processing, deep data learning algorithms or modeling, etc. as part of a software as a service or SaaS platform). In response to the request, the host server distributes the task to one or more of the performance compute nodes or compute servers (with one or more GPUs or different types of accelerators) managed by the host server. In another embodiment, when the electronic device rack includes two or more electronic device components, each component can perform similar (or different) operations to the other components housed in the electronic device rack. In one embodiment, when the IT component (e.g., processor) performs a computing task, the component can generate heat. In some embodiments, the electronic device component can be air cooled to transfer the generated heat away from the IT component and into the surrounding air passing through the IT component (e.g., electronic device component of the IT component).In another embodiment, the electronic equipment component (e.g., an IT component of the electronic equipment component) can include a liquid cooling component (e.g., having a cold plate coupled to the IT component, as shown in FIG. 99) for providing liquid cooling. Figure 11

[0035] Also shown are the various (e.g., external) dimensions of the electronic equipment rack 2 (e.g., a frame that makes up the electronic equipment rack). For example, the electronic equipment rack has a width W1 (along the Y-axis) and a height H1 (along the Z-axis). In one embodiment, these dimensions can be similar to those of any type of electronic equipment rack, such as a 42U rack. In the case where the rack 2 is a 42U rack, H1 can be approximately 80 inches, W1 can be approximately 19 or 21 inches, and the electronic equipment rack can have a depth D1 (e.g., along the X-axis) of approximately 40 inches (e.g., as shown in FIG. 99). In another embodiment, the electronic equipment rack can have different dimensions (e.g., so as to accommodate any size and / or number of electronic equipment components, such as blade servers, and / or so as to accommodate size requirements of a data center in which the rack can be housed). Figure 2

[0036] The containment system 1 is configured to create a containment zone (e.g., an area within an environment) around the electronic equipment rack so as to manage the flow (and / or circulation) of air through the electronic equipment rack (e.g., a data center in which the electronic equipment rack is housed). The system includes three structures: a top structure 3, a first (right) side structure 4, and a second (left) side structure 5, where each of these structures is disposed outside and around (e.g., on) the housing of the rack. Specifically, each of these structures is (e.g., movably) coupled to the electronic equipment rack. In particular, the top structure 3 is coupled to the top (side) 96 of the rack, the first side structure 4 is coupled to the first side 94 of the rack, and the second side structure 5 is coupled to the second side 95 of the rack. In one embodiment, the first and second sides can be opposite sides of the rack, such as the first side being the right side of the rack and the second side being the left side of the rack. As described herein, the containment zone is created when the structures (at least some of the structures) are moved beyond the front or back end of the electronic equipment rack, thereby creating a movable housing (or enclosure) that encloses a portion of the space adjacent to the rack. Thus, the containment system (at least partially) seals off (or partitions) the air from inside the zone from the rest of the environment, thereby allowing the system to manage the flow of air into and / or out of the electronic equipment rack. More information is described herein regarding how these structures are coupled to the electronic equipment rack and regarding the containment zone.

[0037] ​​Each of these structures of containment system 1 includes a (top) panel (or layer) 6 and a sealing layer 7. As shown, the sealing layer is disposed below and coupled to the bottom (surface) of panel 6. In one embodiment, two of these elements can be removably coupled to each other. In another embodiment, the top panel and the sealing layer can be one integral unit. In another embodiment, the sealing layer can be (e.g., removably) coupled to the electronic equipment rack (e.g., to the top surface of the electronic equipment rack). In some embodiments, the sealing layer can be fixed to (e.g., integrated with) the rack top surface. The panel can include any type of material such as aluminum, stainless steel, and / or one or more polymers (e.g., plastic, etc.). The sealing layer can include an insulating material such as rigid fiber or fiberboard. In another embodiment, the sealing layer can include any material such as any of the materials described herein with respect to the panel.

[0038] In one embodiment, sealing layer 7 is arranged to prevent air from flowing into (and / or out of) the containment zone created by the containment system, as described herein. To this end, the sealing layer is disposed between the panel and a side (e.g., the outer surface of the respective side) of the electronic equipment rack. For example, the sealing layer 7 of first side structure 4 is disposed between panel 6 of structure 4 and first side 94 (e.g., the outer surface of this side) of the electronic equipment rack. Thus, the sealing layer is adjacent to the outer surface of this side. In one embodiment, the sealing layer can be at least partially in contact with this surface in order to create (e.g., a better) seal of the containment zone. More information is described herein with respect to the containment zone. In another embodiment, the sealing layer can reduce the air flow between the containment zone and the surrounding environment (e.g., the environment outside of this zone, thus Figure 5a The sealing layer can not completely (or fully) seal off the containment zone from the surrounding environment. For example, the sealing layer can be arranged such that (e.g., between the respective structure and the rack) there is at least some open space such that (at least some) air can flow between the containment zone and the surrounding environment. In one embodiment, the created containment zone can be only partially sealed off in order to prevent the pressure from inside of this zone from exceeding (or falling below) a predefined threshold value due to air flowing into and out of the containment zone. Thus, the zone can be sealed such that the internal pressure of the zone remains below (or above) the threshold value.

[0039] In one embodiment, the structures can have at least some dimensions similar to their respective sides of the rack to which they are coupled. For example, the first side structure 4 and / or the second side structure 5 can have a height of (approximately) HI, and the top structure 3 can have a width of (approximately) Wl. Thus, the structures can have similar (or identical) dimensions to the sides to which they are coupled. In another embodiment, one or more of these dimensions can be different, such as the width of the top structure 3 being greater than Wl, as shown in FIG. 1B. Further information regarding the dimensions of the structures is described herein. Figure 2

[0040] The system 1 includes one or more rails arranged to couple one or more structures to the electronic equipment rack 2. The rails are disposed (at least partially) outside of the rack and are coupled to the rack. Specifically, the system includes three sets of one or more rails. For example, the system includes a first set of two top rails 9a and 9b coupled to (an outer surface of) the top 96, a second set of two side rails 8a and 8b coupled to the first side 94, and a third set of two side rails 8c and 8d coupled to the second side 95. Each rail set is positioned at both ends of their respective side. For example, the top rail 9a is at one end of the top 96 adjacent to the first side 94, and the top rail 9b is at the opposite end of the top 96 adjacent to the second side 95. The side rails are similarly positioned relative to their respective sides to which they are coupled. Specifically, the side rail 8b is at one end of the first side 94 adjacent to the top 96, and the side rail 8a is at the opposite end of the first side adjacent to the bottom of the rack. The side rail 8c and the side rail 8d are similarly positioned around the second side 95, as shown. In one embodiment, any of the sides and / or the top can have any number of rails in any configuration. As one example, the top can include more than two rails, or can not include any rails at all. In another embodiment, the rails can be positioned differently, such as rails coupled along the center of their respective structure (e.g., the rail 8a can be coupled to the first side at a mid-point along HI).

[0041] In one embodiment, any type of hardware (e.g., fasteners such as bolts) can be used to removably couple the rails to the electronic equipment rack (e.g., the frame of the electronic equipment rack). In some embodiments, the rails can be designed to be coupled to existing (standard) electronic equipment racks housed within a data center. Thus, the containment system can be added to (or removed from) an (e.g., standard) electronic equipment rack within an existing data center. In another embodiment, the rails can be part of (or integrated with) their respective sides.

[0042] ​Each of structures 3-5 is movably coupled to the electronics rack via its respective one or more rails. As shown, the plate of each of the structures is coupled to the associated rails of the structure. For example, the plate 6 of the first side structure 4 is coupled to the side rails 8a and 8b, which are coupled to the first side 94. In one embodiment, the thickness (along the Y axis) of the seal layer can be approximately equal to the thickness of the rails. Thus, due to the thickness of the rails, the seal layer can reduce (or eliminate) the empty space between the top surface of the sides of the rack and the bottom surface of the plate. In another embodiment, the rails can be disposed between their respective structure and the side to which the rails couple the structure. In this case, the rails can be coupled to the seal layer of their respective structure. As described herein, each of the structures can be arranged to move along an axis (e.g., the X axis) via its respective rails. More information is described herein regarding the movement of the structures along their respective rails.

[0043] The system also includes a plurality of movement mechanisms 90-92 configured to automatically (e.g., without user intervention) move their respective structures (e.g., along the rails of the structures). For example, each of the mechanisms can include one or more motors (or actuators) configured to move the structure along its respective rail. Specifically, the top movement mechanism 90 can be configured to move the top structure 3 along the top rails 9a and 9b, the first side movement mechanism 91 can be configured to move the first side structure 4 along the side rails 8a and 8b, and the second side movement mechanism 92 can be configured to move the second side structure 5 along the side rails 8c and 8d. In another embodiment, each of the mechanisms can include one or more pulley mechanisms configured to pull the structure along their respective rails. In another embodiment, the mechanisms can be any type of device designed to pull or push the structures along their respective rails. As shown, each of the mechanisms is within the electronics rack. In another embodiment, the mechanisms can be housed differently, such as as part of (and / or housed within) one or more of the rails. As another example, one or more of the mechanisms can be part of (coupled to) one or more of the structures (e.g., the top mechanism 90 is coupled to the top structure 3).

[0044] In one embodiment, each of the mobile mechanisms may be communicatively coupled (e.g., via wired and / or wireless connections) to one or more controllers configured to perform containment operations to generate containment zones using containment system 1. For example, the controllers may transmit one or more control signals to one or more of the mobile mechanisms, in response to which the mobile mechanisms may be actuated (e.g., one or more motors or actuators) to move (or slide) their respective structures along one or more tracks. In one embodiment, the controllers may transmit control signals in response to receiving user input (e.g., via a user input device communicatively coupled to the controllers). In one embodiment, the controllers may be housed (e.g., as electronic device component 10) within an electronic device rack 2. In another embodiment, the controllers may be configured to control one or more structures of multiple electronic device racks (e.g., a cluster of multiple electronic device racks) to generate one or more zones.

[0045] Figure 2 An example of a device having a containment system 1 according to one embodiment is shown (e.g., Figure 1 The figure shows multiple stages 80 and 81 of a side view of the electronic device rack 2, wherein the structure is moved toward the rear end 13 of the electronic device rack. Specifically, this figure will show a side view of the first side structure 4 and the top structure 3 (movably) attached to the electronic device rack 2. This view also shows the depth D1 of the electronic device rack extending from the front end 12 to the rear end 13 of the rack. As described herein, the structure may have dimensions similar to the rack. Specifically, this figure shows that the depth (e.g., length in the X direction) of the first side structure 4 and the top structure 3 is (e.g., approximately) D1. In one embodiment, although not shown, a second structure 5 may have similar dimensions. Thus, the three structures 3 to 5 may cover (or at least partially cover) the respective sides to which they are attached. In another embodiment, the depth of one or more of the structures may be different from (e.g., less than) D1. More information regarding the depth of the structures is described herein.

[0046] Side rails 8a and 8b that movably connect the first side structure 4 to the electronics equipment rack (first side 94) and top rail 9a that movably connects the top structure 3 to the rack (top 96) are also shown. Each of these rails extends along D1 of the electronics equipment rack. In one embodiment, the length of the rail (or at least some of the rails) in the X direction may be less than D1.

[0047] In one embodiment, each of the rails can include one or more components. For example, each of the side rails includes a fixed portion 97 and a mobile portion 98. In one embodiment, the fixed portion can be a rail or slide that is removably coupled to the electronic rack (e.g., a respective side of the electronic rack), while the mobile portion is movably coupled to the fixed portion so as to allow structures mounted on the mobile portion to move relative to the fixed portion (e.g., and the rack) (e.g., along the X-axis). For example, the fixed portion 97 of the side rail 8a can be fixed to (e.g., and abut the exterior surface of) the first side 94, while the mobile portion 98 of the rail 8a can be movably coupled to the fixed portion and (e.g., removably) coupled to the first side structure 4 (e.g., the back side of the first side structure).

[0048] In one embodiment, the rails can be any type of rail that at least allows the coupled structure to move in at least one direction relative to the electronic device rack. For example, the structures of the containment system 1 can be arranged to move by (the mobile portion of the structure) sliding linearly along its fixed portion. For example, one or more of the rails can be a linear bearing rail, where the mobile portion includes one or more ball bearings that slide (or roll) along the fixed portion (e.g., the rail of the fixed portion) to move in the X-direction (e.g., toward the back end 13 of the rack and / or toward the front end 12 of the rack). In another embodiment, the rails can be rolling rails, where the fixed portion includes one or more wheels along which the mobile portion moves. In addition to (or instead of) the fixed portion including one or more rails, the mobile portion can include one or more wheels arranged to roll along the fixed portion. In another embodiment, the rails can be any type of rail that enables the structure to move in at least one direction (relative to the electronic device rack).

[0049] The first stage 80 illustrates the containment system (e.g., the structures 3 and 4 of the sealing system) in a “storage” position, in which no portion of the structures of the system (or less than a threshold of the structures) extends beyond the electronic device rack (e.g., the front end 12 and / or the back end 13). As illustrated, the edges of the structures 3 and 4 (and the structure 5, not shown) are aligned with the corresponding edges of the rack. For example, the edges of the top structure 3 (e.g., the edges extending along the Y-axis) are aligned with the corresponding edges of the top 96. In another embodiment, the structures are in the storage position when they are disposed (e.g., completely) on their respective sides when the depth of the structures is less than D1. In another embodiment, when in this storage position, the structures will not be used to create a containment zone that is at least partially enclosed by the structures (and / or other structures and / or the electronic device rack).

[0050] The second stage 81 illustrates the structures of the containment system in their "extended" position in which at least some of the structures of the system will create a containment zone. Specifically, the first side structure 4 and the top structure 3 have moved to extend beyond the back end 13 of the electronic equipment rack to create a containment zone that is at least partially enclosed by the top structure 3 and the first side structure 4. In one embodiment, the second side structure 5 can also have extended outwardly so that all three structures create a zone that is enclosed by each of the structures (and the back end 13 of the electronic equipment rack). Thus, each of the structures is arranged to move along the X axis by sliding along their respective tracks to create a containment zone around the rack. In some embodiments, the structures can be arranged to extend beyond the edges of the electronic equipment rack by a length that is equal to or less than Dl of the structures.

[0051] In one embodiment, at least some of the structures can be arranged to move in any direction along the X axis. Specifically, the structures can move beyond the back end 13 of the rack and / or move beyond the front end 12 of the rack. This allows the containment system to create a containment zone at the front end 12 of the rack or at the back end 13 of the electronic equipment rack, as shown in this figure.

[0052] As described so far, each side 94-96 of the electronic equipment rack 2 includes one structure of the containment system 1. In another embodiment, one or more sides of the electronic equipment rack can include one or more structures. For example, the first side 94 can include two structures that are coupled to the side tracks 8a and 8b and arranged to move in one or more directions. Specifically, the first side 94 can have one side structure arranged to move toward the front end 12 of the rack and another side structure arranged to move toward the back end 13 of the rack. In some embodiments, each structure coupled to the side can share a track (or be coupled to a shared track) and / or can be movably coupled to the side via separate tracks.

[0053] As described so far, the containment system 1 can be arranged to create a containment zone around a single electronic equipment rack to which the structures of the system are coupled. In another embodiment, the containment system can create a containment zone for one or more electronic equipment racks, such as a cluster of electronic equipment racks arranged in a row. Figure 3 An example is shown in which the containment system 1 is coupled to a cluster of racks. Specifically, this figure shows a front view of a cluster 20 of containment electronic equipment racks arranged in a row having the containment system 1 according to one embodiment. As shown, the cluster 20 of racks includes six electronic equipment racks 2 arranged in a row, with at least one side of each rack adjacent to an opposite side of one or more other racks.

[0054] The containment system 1 structures 3-5 are arranged to create a containment zone that is enclosed by the structures and the row of electronic equipment racks (e.g., the front end 12 of each of the racks or the back end 13 of each of the racks). For example, the first side structure 4 is movably coupled to one side (e.g., the first side or right side) of the electronic equipment racks positioned at one end of the row of racks, while the second side structure 5 is movably coupled to one side (e.g., the second side or left side) of the electronic equipment racks positioned at the other end of the row of racks opposite the one end. Specifically, the first side structure is coupled to the right side of one electronic equipment rack, while the second side structure is coupled to the left side of another electronic equipment rack.

[0055] The top structure 3 is disposed on top of the cluster 20 of electronic equipment racks. In one embodiment, the top structure can be movably coupled to at least one of the six electronic equipment racks. For example, the top structure can be movably coupled to the top of each of the electronic equipment racks via one or more top rails (e.g., 9a and / or 9b). In another embodiment, the top structure can be coupled to only some of the electronic equipment racks. For example, the top structure 3 can be coupled to only two of the electronic equipment racks at the end of the row (e.g., the rack coupled to the first side structure 4 and the rack coupled to the second side structure 5). Thus, the top structure can be disposed over the four electronic equipment racks between the two end racks without being (directly) coupled to these middle racks. In another embodiment, the top structure can float over the middle racks (e.g., without being in contact with the middle racks).

[0056] As shown, the top structure 3 can extend beyond the width of the row of electronic equipment racks. For example, the row of racks can have a width of W2, which can be equal to or greater than 6 x Wl. On the other hand, the top structure 3 has a width of W3, which extends beyond W2. Specifically, W3 extends between the top surface of the first side structure 4 and the top surface of the second side structure 5. With the top structure and the two side structures suspended along the width of the row of racks, the containment system can create a better seal between the top structure and the two side structures 4 and 5. In another embodiment, W3 can be equal to W2.

[0057] Figure 4 A front view of a cluster of two electronic equipment racks with a containment system is shown, according to one embodiment. Specifically, this figure shows two clusters 21 and 22 of electronic equipment racks, each cluster of electronic equipment racks including three electronic equipment racks, where the two clusters are arranged in a row of six electronic equipment racks (e.g., two rows of three racks next to or adjacent to each other). The containment system includes multiple structures to create multiple (e.g., separate) containment zones around the cluster of racks. Specifically, the containment system can create a containment zone around each cluster of electronic equipment racks by Figure 3At least one or more additional side structures can be added between two adjacent electronic equipment racks of a cluster 20) to create multiple containment zones. For example, cluster 21 includes a first side structure 4a coupled to one rack disposed at one end of the cluster, a second side structure 5a coupled to another rack disposed at the opposite end of the cluster, and a top structure 3a disposed on top of the three racks in cluster 21. Cluster 22 includes a first side structure 4b coupled to one electronic equipment rack disposed at one end of the cluster, a second side structure 5b coupled to another electronic equipment rack disposed at the opposite end of the cluster, and a top structure 3b disposed on top of the three racks in cluster 22. Thus, one containment zone can be created for the first three racks of cluster 21, and a separate containment zone can be created for the second three racks of cluster 22. In one embodiment, the structures can be independently controlled such that containment zones can be created along the same side of the racks (e.g., two zones toward the front ends), or containment zones can be created at opposite ends (e.g., one zone created around the front ends of the racks of cluster 21 and another zone created around the back ends of the racks of cluster 22 at these opposite ends).

[0058] In one embodiment, the adjoining clusters 21 and 22 can share one or more structures. For example, the two clusters can share a top structure (e.g., the top structure shown in FIG. 1). Thus, one top structure can be disposed on top of all six electronic equipment racks of the two clusters. Figure 2

[0059] Figures 5a to 5c A perspective view of a data center 30 including multiple clusters 20a-20d of electronic equipment racks with containment systems for creating containment zones around clusters of racks is shown, according to one embodiment. Specifically, the figures will show a data center IT house 31 as part of (e.g., housed within) a data center 30 (e.g., a building) including multiple clusters 20a-20d of electronic equipment racks, where each of the clusters includes six electronic equipment racks 2 arranged in a row. In one embodiment, the racks within a cluster can be aligned with each other and / or can be aligned with the racks of other clusters. For example, as shown, each of the clusters of racks (e.g., along the Y axis) are aligned with each other. For example, each electronic equipment rack in each cluster is aligned with every other corresponding rack from the rest of the cluster (e.g., along at least the Y axis). Thus, the clusters of electronic equipment racks create six columns of electronic equipment racks arranged along the X axis. Additionally, each rack in each cluster is aligned with each other along the Y axis and / or Z axis, as shown. In one embodiment, one or more clusters of electronic equipment racks can not be aligned with other clusters of racks (e.g., along the Y axis).

[0060] ​Each pair of adjacent clusters of the rack is separated by at least one aisle. For example, cluster 20a and cluster 20b are separated by aisle 33a, cluster 20b and cluster 20c are separated by aisle 33b, and cluster 20c and cluster 20d are separated by aisle 33c. In one embodiment, one or more clusters of the electronic equipment rack can abut one another (e.g., not separated by an aisle). As shown, aisle 33a and 33b have a depth of D2 (e.g., the distance between cluster 20a and cluster 20b), while aisle 33c has a depth of D3. In one embodiment, D3 can be greater than D2 (e.g., twice the depth of D2). In another embodiment, all of the aisles can have the same depth (e.g., D2).

[0061] The clusters of the rack are positioned on an elevated (or raised) floor 32, thereby providing a network for distributing (circulating) cool air throughout the data center IT room 31. For example, the elevated floor can be coupled (via one or more air ducts) to one or more air conditioning units (e.g., computer room air conditioning (CRAC) units (not shown)) that push cool air into the room 31 through one or more openings (not shown) in the elevated floor. For example, the floor can include one or more slabs, each slab including one or more perforations. In one embodiment, the perforated slabs can be positioned throughout one or more of the aisles 33a-33c. In one embodiment, the data center IT room 31 can include one or more return ducts (not shown) coupled to the air conditioning units, which can be configured to draw in (generated by one or more electronic equipment racks) hot exhaust air through the one or more return ducts. The air conditioning units can be configured to cool the hot exhaust air to generate cool air, which is then redistributed (e.g., via the elevated floor) into the data center 30.

[0062] In conventional data centers, electronic equipment racks are air-cooled by either a data center cold aisle containment (CAC) system or a hot aisle containment (HAC) system. To implement either system, the layout of the aisles and rows of racks is reconfigured to provide proper aisle containment. For example, with respect to a CAC system, certain aisles are predefined and isolated from the rest of the data center to supply cool air (e.g., distributed by the elevated floor 32) to adjacent rows of racks, where the cool air is isolated from the rest of the data center IT room 31, including the rest of the hot exhaust air generated by the racks, as the cool air passes from the cold aisle through the racks and into the rest of the data center. Accordingly, the cluster arrangement deployed within these conventional data centers is dictated by the air cooling layout of the center, which is defined when the data center is built.

[0063] However, the present disclosure provides containment systems having multiple structures coupled to each cluster (e.g., each cluster has an independent system), such that the air-cooling containment layout within the data center IT house 31 can be customized to air cool the racks by using CAC system deployments and / or HAC system deployments. As shown, each cluster 20a-20d includes (a containment system having) a top structure 43 (which can be similar or identical to the top structure 3) disposed on top of the respective cluster and a first side structure 44 (which can be similar or identical to the first side structure 4) disposed on a side (e.g., right side) of an electronic equipment rack arranged at one end (e.g., in the positive Y direction) of each rack row. For example, the top structure 43a is disposed on top of the racks of the cluster 20a and the first side structure 44a is coupled to the right side of the electronic equipment rack disposed at one end of the row (in the positive Y direction). In one embodiment, each cluster of racks can also include a second side structure (not shown) that can be disposed on an opposite side (e.g., left side) of another electronic equipment rack arranged at the opposite end of each rack row. In Figure 6 More information about the second side structure is described in the background.

[0064] In one embodiment, one or more of the structures can have a similar depth as one or more of the channels. For example, as shown, each of the structures has a depth of Dl, which can be equal to D2. In another embodiment, the depth of the structure can be greater or less than the depth of the channel adjacent to the cluster of racks to which the structure is coupled. For example, Dl can be slightly greater than D2 (e.g., above a threshold distance). This depth difference can allow the structure to extend from the cluster of racks and contact the adjacent cluster of racks (and / or the structure coupled to the adjacent cluster). Additionally, each of the structures can include similar dimensions, as described herein. For example, the width of the top structure (e.g., W2) can extend along the total width of the rack row in the cluster of the top structure. In another embodiment, the width of the top structure can extend further outward, such as having a width of W3 so as to overhang (slightly) above the side structures coupled to the two ends of the associated cluster, as described herein.

[0065] In one embodiment, the structures of at least some of the clusters can be aligned with each other. For example, the top structures 43a and 43b of the cluster 20a and the cluster 20b, respectively, can be aligned with each other along one or more axes (e.g., along the Z axis and the Y axis). The structures can be aligned such that when one or both of the structures are moved (e.g., towards each other), they (at least partially) contact each other without (or with minimal amount of) space between the two abutting structures. More information about moving the structures is described herein.

[0066] In this figure, the structures are in their storage positions. Specifically, the first side structures 44a-d and the top structures 43a-d (and the second side structures, not shown) will not be used to create containment zones around their respective clusters.

[0067] Figure 5b and Figure 5c illustrates that multiple containment zones are created by the structures of at least some of the clusters 20a-d of racks. Specifically, Figure 5b shows that multiple top structures 43 (of at least some of the clusters) have been moved along the X-axis toward adjacent clusters, thereby creating containment zones. As shown, the top structure 43a of the cluster 20a has been moved toward the cluster 20b to be disposed above (or on) the aisle 33a to create a containment zone 34a that is enclosed by this top structure and the two clusters 20a and 20b. Additionally, the two top structures 43c and 43d of the cluster 20c and the cluster 20d, respectively, have been moved toward each other to create a containment zone 34b. Specifically, the top structure 43c has been moved toward the cluster 20d, while the top structure 43d has been moved toward the cluster 20c. Thus, the containment zone 34b is created by these top structures and their associated clusters. In one embodiment, the moved top structures can be in contact (or abut) with adjacent top structures. For example, the top structure 43a can be in contact with the structure 43b, and the structures 43c and 43d can be in contact with each other. In another embodiment, the moved structures can be at least partially in contact with an adjacent row of racks toward which the clusters have been moved. For example, the top structure 43a can be in contact with the cluster 20b (e.g., the top 96 of the cluster 20b). Being in contact with other structures (and / or racks) can prevent or reduce the amount of air that leaks out of (or in) the containment zone created by the structures. As illustrated, the created containment zones are partially exposed to the data center IT room 31 (via the openings along the aisles of the data center IT room) because the (at least) first side structures 44 of the clusters have remained in their storage positions. Thus, the containment system is in a partially extended position.

[0068] Figure 5c shows that some of the first side structures 44 have been moved along the X-axis toward adjacent clusters, thereby enclosing Figure 5bThe figure will show at least some of the structures of the containment system in their extended positions to create (e.g., complete) containment zones. As shown, first side structure 44a has moved toward (and is in contact with) structure 44b, closing off passage 33a, and first side structure 44c and first side structure 44d have moved toward each other (and are in contact with each other) to close off passage 33c. Thus, containment zones 34a and 34b can be closed off (or at least partially closed off) from the rest of data center IT room 31.

[0069] Figure 6 is a cross-sectional top view of data center 30 according to one embodiment, showing containment zones 34a and 34b between clusters 20a-d. In particular, the figure will show that Figure 5c is a cross-sectional view of data center 30 shown in FIG. 17. The figure shows that each cluster's (containment system) also includes second side structures 55 (which can be similar to or identical to second side structures 5), where at least some of the second side structures have moved in the same direction as first side structures 44, creating containment zones. In particular, second side structure 55a of cluster 20a has moved toward (and is in contact with) cluster 20b, and second side structures 55c and 55d of clusters 20c and 20d, respectively, have moved toward each other (and are in contact with each other). Thus, containment zone 34a is created and enclosed by first side structure 44a, second side structure 55a, top structure 43a, and clusters 20a and 20b (e.g., the front or back ends of clusters 20a and 20b), and containment zone 34b is created and enclosed by clusters 20c and 20d and all of their respective structures.

[0070] In one embodiment, the containment zones created by the structures can be cold aisles, hot aisles, or a combination of both. For example, containment zone 34a can be a cold aisle in which cool air is pushed into the zone (e.g., distributed from the portion of the raised floor that constitutes passage 33a) and then hot air generated by clusters 20a and 20b is exhausted into room 31. As another example, containment zone 34a can be a hot aisle in which cool air from IT room 31 is drawn into the containment zone and then hot exhaust air from the clusters of racks into the zone is pushed (e.g., via one or more ducts coupled to the zone) to a data center air conditioning unit (e.g., a CRAC unit).

[0071] As illustrated, containment zone 34b (e.g., the area of containment zone 34b) is larger than containment zone 34a. This is due to D3 of channel 33c being larger than D2 of channel 33a (e.g., twice the length of D2). In one embodiment, containment zone 34b can provide more air flow (e.g., when the zone is a cold aisle) than containment zone 34a. For example, when both zones are cold aisles, channel 33c (e.g., due to having more openings (or perforated panels) in raised floor 32) can allow more cold air into the zone (e.g., the air flow rate of the cold air flowing into containment zone 34b can be greater than the air flow rate of the cold air flowing into containment zone 34a) than channel 33a. This increased air flow can allow clusters 20c and 20d to house electronic devices that require more cooling (e.g., high power density electronic devices) than other electronic devices. Specifically, these high power density electronic devices can generate more heat than standard electronic devices. Therefore, more air flow can be needed in order to provide efficient and effective air cooling. Thus, the present disclosure provides a containment system that can accommodate different air flow management requirements as well as different power density electronic devices housed within clusters of a data center.

[0072] As described so far, containment zone 34a can be created by first side structure 44a moving (and coming into contact with) cluster 20b, top structure 43a, and second side structure 55a. In another embodiment, the structures of cluster 20b can be used to create the zone. In this case, structures 43b, 44b, and 55b can be extended towards cluster 20a. In another embodiment, the cooling containment layout can be different (e.g., containment zone created around channel 33b).

[0073] Figure 7 is a cross-sectional channel end view of two clusters of electronic equipment racks and their respective top structures with fans according to one embodiment. Specifically, this figure will show a cross-sectional view of two clusters 54 and 56 with a containment system that will create a containment zone between the two clusters. Specifically, top structure 53a of cluster 54 has been extended towards cluster 56, and top structure 53b of cluster 56 has been extended towards cluster 54, thereby creating containment zone 52 that is surrounded by (at least) the two top structures and their respective clusters of electronic equipment racks. In one embodiment, these clusters and structures can be similar (or the same) as the clusters and structures illustrated in Figures 5a to 5c

[0074] ​Both top structures 53a and 53b each include two fans 50 (which are side-by-side) arranged to push air into or out of containment zone 52. In one embodiment, a top structure can have one or more fans. In another embodiment, top structures can each have a different number of fans, such as top structure 53a having one fan and top structure 53b having two fans. Fans 50 are illustrated as actively drawing air from containment zone 52 (e.g., by spinning, which is shown by the fans being illustrated as dashed ovals), creating an air flow 51 in which air will flow from zone 52 through the top structure (e.g., one or more openings at the bottom of the top structure) and out of the top structure (e.g., one or more openings at the top of the top structure) (e.g., into data center IT room 31). In one embodiment, the air flow 51 created by the fans can draw air through clusters 54 and 56. For example, the air flow can draw (e.g., cold) air from outside of containment zone 52 through the clusters of racks (e.g., openings in the clusters of racks) into zone 52 and out through the top structures.

[0075] In one embodiment, clusters 54 and 56 can be similar to clusters 20c and 20d of FIG. 2, with a containment zone 52 created between the clusters. Also shown are top structures disposed on top of (and coupled to) the two clusters, with both top structures in their extended positions. Specifically, top structure 53a is movably coupled to cluster 54, and top structure 53b is movably coupled to cluster 56, with both clusters having been moved toward each other (and into contact with each other). Figure 5a

[0076] Figure 8 Stages 60-62 show a cross-sectional view according to one embodiment, showing fans of the top structures rotating. Each of the stages shows Figure 7 Clusters 54 and 56 of FIG. 3 and their respective top structures 53a and 53b, each of which includes two side-by-side fans 50. In one embodiment, the fans are arranged to rotate about an axis to change the direction in which the fans push air.

[0077] ​The first stage 60 illustrates the fans 50 of both top structures 53a and 53b creating an air flow 51 where air is being drawn out of the containment zone 52 and out of the top of the top structure (e.g., one or more openings of the top structure). The second stage 61 illustrates each pair of fans rotating (e.g., counter-clockwise). Specifically, the fans of both top structures are arranged to rotate about an axis 63, which is about the central axis of both pairs of fans. Specifically, the axis 63 is the Y-axis, while perpendicular to the X-axis, along which the structures are arranged to move. In another embodiment, the fans can rotate about any axis. To rotate the fans, the fans have been turned off, which is illustrated as the fans being ellipses with solid borders. In another embodiment, the fans can rotate while they continue to spin.

[0078] The third stage 62 illustrates the fans 50 of both top structures 53a and 53b having rotated 180° and are now pushing air into the containment zone 52. Specifically, the direction of the air flow 51 has switched from pointing out of the zone to now pointing into the zone 52. In one embodiment, the air being drawn into the zone can come from inside the data center IT room 31.

[0079] As described herein, the fans 50 can be configured to draw air out of the containment zone or push air into the containment zone. In one embodiment, the fans can draw / push air based on whether the containment zone is being used as a cold aisle or a hot aisle. For example, when the containment zone is a hot aisle, the fans can draw air out of the containment zone 52. Specifically, the air flow 51 can draw air from outside the data center IT room and through the cluster of electronic equipment racks 54 and the cluster of electronic equipment racks 56. The air being drawn in can be cool air inside the data center IT room 31 (e.g., being provided by a CRAC unit of the data center). Conversely, when the containment zone 52 is a cold aisle, the fans can push air into the containment zone 52. For example, the top structure can be coupled (e.g., via one or more ducts) to one or more CRAC units and can draw cool air being provided by the CRAC units into the containment zone. In this case, the cool air will be pushed through the cluster of electronic equipment racks, which will transfer heat to the cool air, creating hot air. The hot air is exhausted into the data center IT room 31.

[0080] In another embodiment, the fans can be adapted to accommodate different data center air flow supply and return designs. For example, the fan speed of one or more of the fans can be adjusted based on the current air flow rate within the data center, e.g., the fan speed can be increased to increase the air flow rate throughout the data center IT room.

[0081] Figure 9Another cross-sectional view of two clusters 54 and 56 of electronic equipment racks and their respective top structures 53a and 53b is shown, according to one embodiment. In particular, this figure shows that each top structure includes a cooling unit 70 arranged to produce cooled air. In one embodiment, the cooling unit can be any type of air cooling unit configured to provide cooled air, such as an indirect evaporative cooling (IDEC or IEC) unit, an air handler unit (AHU). In this example, the containment zone 52 can be a cold aisle. For example, the cooling unit can produce cooled air from ambient air (e.g., air within the data center IT room 31) that is drawn through the cooling unit 70 by a fan from outside the containment zone. This cooled air can then be pushed by the fan 50 into the containment zone and through the clusters 54 and 56 in order to cool the components contained in the containment zone. In one embodiment, when the containment zone does not receive cool air from a data center air conditioning unit (e.g., the aisles making up the zone are not arranged to receive cool air from a CRAC unit), the cooling unit can allow the cold aisle produced by the structure to receive cool air. Thus, the containment system can be used to produce a cold aisle with a containment zone 52 and one or more cooling units 70 (e.g., without having to draw cool air from a data center air conditioning source). In another embodiment, the cooling unit 70 can be configured to cool hot air from the containment zone (e.g., when the fan is directing air flow 51 out of the zone) in order to produce a hot aisle.

[0082] As described so far, each of the top structures 53a and 53b includes two fans arranged to draw / push air. In one embodiment, the fans can operate simultaneously. In another embodiment, one pair of fans can be redundant, such that one pair of fans can be used during operation, while the other pair of fans can be used only under certain conditions (e.g., when the other pair of fans is malfunctioning).

[0083] Figure 10A perspective view of a data center including a cluster of electronic equipment racks and a data center coolant distribution system according to one embodiment is shown. Specifically, this figure shows that the top structure 53a and the top structure 53b (e.g., the cooling units 70 of the top structure 53a and the top structure 53b) of the cluster 54 and the cluster 56 are each coupled to a data center coolant distribution system 85. In one embodiment, the system 85 can be any data center cooling liquid system that can be integrated into the data center 30. In this example, the cooling units 70 of the top structures can be air-to-liquid heat exchangers that are (fluidly) coupled to a supply manifold 86 and a return manifold 87 of the data center system 85, creating a primary heat exchange loop. For example, as a fan draws hot air from the data center IT room into the cooling units of the top structures, the heat in the air is transferred to the coolant received by the cooling units from the supply manifold. This heat transfer creates warmed coolant, which the cooling units then provide to the return manifold. In one embodiment, the system 85 can include a heat exchange source arranged to receive the warmed coolant and circulate cooled coolant through the supply manifold.

[0084] As described herein, the containment system 1 can include various components (e.g., structures) for creating one or more containment zones for a cluster of one or more electronic equipment racks. The system can also include components for controlling the flow of air through the created containment zones, such as fans. In one embodiment, some of the structures can include one or more components, such as the top structure 53 including one or more fans. In another embodiment, other structures described herein can include one or more of these same components. For example, the top structure 3 can include one or more fans. In yet another embodiment, one or more side structures can include components such as fans.

[0085] In one embodiment, the system can include one or more sensors arranged to control the fan speed of one or more fans. For example, the sensor can be a temperature sensor communicatively coupled with the fan (e.g., control electronics of the fan such as a processor, memory, etc.) and configured to control the speed of the fan based on a detected temperature. In one embodiment, the sensor can be arranged to detect the temperature of one or more electronic equipment components of one or more racks and configured to control the speed based on the temperature of the components. In another embodiment, the sensor can be arranged to detect the temperature within a containment zone.

[0086] As shown in this figure, the top structure is coupled to the data center coolant distribution system. In one embodiment, the structure can be coupled via connectors arranged to removably couple the structure to the system 85. In some embodiments, the connectors can be dripless quick disconnect connectors, allowing the structure to be added to or removed from the data center coolant distribution system.

[0087] Figure 11 is an example of an electronic equipment rack 500, according to one embodiment. In one embodiment, the electronic equipment rack 500 can include one or more of the same components as rack 2, as described herein. The electronic equipment rack 500 can include one or more server slots (e.g., arranged in a stack within a housing of the rack), each for housing one or more electronic equipment boards, such as electronic equipment components (or servers). In one embodiment, each server includes one or more IT components (e.g., processors, memory, storage, network interfaces) that can be used to provide data processing services, as described herein. According to one embodiment, the electronic equipment rack 500 includes, but is not limited to, a CDU 530, a rack management unit (RMU) 502 (optionally), a power supply unit (PSU) 550, and one or more electronic equipment components (or electronic equipment boards) 507a-c, which can be any type of IT equipment, such as a blade server (e.g., installed within the rack). As shown, each component includes a respective IT component 11. In one embodiment, each electronic equipment component can include one or more IT components. The components 507a-c can be inserted into the array of server slots from either the front end 503 or the rear end 504 of the electronic equipment rack 500, respectively. In one embodiment, the electronic equipment components can be arranged in a stack (e.g., with component 507a positioned above component 507b), as shown herein.

[0088] In one embodiment, the electronic equipment rack 500 can be part of a cluster of racks (e.g., cluster 20 of FIG. 1). In this case, the rack 500 can be arranged to have the containment system 1 (or a portion of the containment system). For example, one or more structures of the system can be coupled to one or more sides of the rack 500. Figure 3

[0089] ​It should be noted that although only four electronic equipment components 507a-c are shown here, more or fewer electronic equipment components can be maintained within the electronic equipment rack 500. Also, it should be noted that the specific locations of the CDU 530, RMU 502, PSU 550, and components 507a-c are shown for illustration purposes only; other arrangements or configurations of these components can also be implemented. It should be noted that the electronic equipment rack 500 can be open to the environment or partially contained by a rack enclosure, as long as the cooling fans can generate an air flow from the front end to the back end (or generate an air flow from the back end to the front end).

[0090] Additionally, a fan module can be associated with each of the electronic equipment components 507a-c and the PSU module. In this embodiment, fan modules 531a-e are collectively referred to as fan modules 531, and are respectively associated with the electronic equipment components 507a-c and the PSU. Each of the fan modules 531 includes one or more cooling fans. The fan modules 531 can be mounted on the back end of the components 507a-c to generate an air flow that flows from the front end 503, travels through the rack 500, and is present at the back end 504 of the electronic equipment rack 500. For example, with reference to Figure 5a When the rack is part of the cluster 20b and the back end of the rack is adjacent to the passageway 33b, the fans can generate an air flow in which air is drawn from the passageway 33a (or containment area 34a), and heat generated by the electronic equipment of the rack is transferred to the hot exhaust air created by the drawn cool air that is exhausted into the passageway 33b. In another embodiment, one or more of the fan modules can be positioned on the front end 503 of the rack 500. Such front end fans can be configured to push air into the installed equipment.

[0091] In one embodiment, the CDU 530 mainly comprises a heat exchanger 513, a liquid pump 514 and a pump controller (not shown), and some other components such as a liquid reservoir, a power supply, monitoring sensors, etc. The heat exchanger 513 can be a liquid-liquid heat exchanger. The heat exchanger 513 comprises a first circuit with an inlet port and an outlet port having a first pair of liquid connectors coupled to external liquid supply / return lines 532-533 to form a primary circuit. The connectors coupled to the external liquid supply / return lines 532-533 can be provided or mounted on the back end 504 of the electronics rack 500. The liquid supply / return lines 532-533 are coupled to a set of room manifolds that are coupled to an external heat removal system or an external cooling circuit. Additionally, the heat exchanger 513 further comprises a second circuit with two ports having a second pair of liquid connectors coupled to a liquid manifold 525 to form a secondary circuit that can include a supply manifold for supplying cooling liquid to one or more electronic equipment components and a return manifold for returning hotter liquid to the CDU 530. For example, the electronic equipment component 507b can be arranged to be liquid cooled using liquid that is circulated through the manifold 525. In particular, a cold plate 99 of the component is coupled to the IT component 11b and is arranged to provide liquid cooling, e.g., by transferring heat generated by the IT component 11b to liquid that is circulated through the plate. It is noted that the CDU 530 can be any kind of CDU that is commercially available or a custom made CDU. Therefore, details of the CDU 530 will not be described herein. In another aspect, at least some of the electronic equipment components can be liquid cooled while one or more other components can be air cooled, e.g., using air that is drawn into or out of the rack via one or more fans.

[0092] The electronics rack 500 further comprises an optional RMU 502 configured to provide and manage power supplied to the servers, the fan module 531 and the CDU 530. In some applications, the optimization module 521 and the RMC 505 can communicate with the controller. The RMU 502 can be coupled to the PSU 550 to manage power consumption of the PSU. The PSU 550 can include necessary circuitry (e.g., alternating current (AC) / direct current (DC) or DC / DC power converters, a backup battery, a transformer or regulator, etc.) to provide power to the rest of the components of the electronics rack 500.

[0093] In one embodiment, the electronic equipment rack 500 (e.g., the PSU 550 of the electronic equipment rack 500) can obtain power from an AC power source to power electronic equipment installed in the electronic equipment rack. In another embodiment, the rack can obtain power from one or more renewable power sources, such as a photovoltaic (PV) power generation system. In such a case, the electronic equipment rack can obtain power from one or more renewable energy sources (e.g., a PV system) and supply cooling capacity and / or perform leak detection operations to electronic equipment components 507a-c and / or other components of the electronic equipment rack, as described herein. In one embodiment, the PSU can be electrically coupled to any type of power source.

[0094] In one embodiment, the RMU 502 includes an optimization module 521 and a rack management controller (RMC) 505. The RMC 505 can include a monitor to monitor the operating state of various components within the electronic equipment rack 500 (e.g., components 507a-c, CDU 530, and fan module 531). In particular, the monitor receives operating data from various sensors indicative of the operating environment of the electronic equipment rack 500. For example, the monitor can receive operating data indicative of the temperature of the processing liquid and air flow, which can be captured and collected via various temperature sensors. The monitor can also receive data indicative of the fan power and pump power generated by the fan module 531 and liquid pump 514, which can be proportional to the respective speeds of the fan module and liquid pump. These operating data are referred to as real-time operating data. It is noted that the monitor can be implemented as a separate module within the RMU 502.

[0095] Based on the operating data, the optimization module 521 uses a predetermined optimization function or optimization model to perform optimization to derive a set of optimal fan speeds for the fan module 531 and an optimal pump speed for the liquid pump 514 such that the total power consumption of the liquid pump 514 and fan module 531 is minimized while the operating data associated with the cooling fans of the liquid pump 514 and fan module 531 are within their respective design specifications. Once the optimal pump speed and optimal fan speeds have been determined, the RMC 505 configures the cooling fans of the liquid pump 514 and fan module 531 based on the optimal pump speed and fan speeds.

[0096] As an example, based on the optimal pump speed, the RMC 505 communicates with the pump controller of the CDU 530 to control the speed of the liquid pump 514, which in turn controls the liquid flow rate of the cooling liquid supplied to the rack liquid manifold to be distributed to at least some of the components 507a-c. Thus, the operating conditions and corresponding cooling device performance are adjusted. Similarly, based on the optimal fan speed, the RMC 505 communicates with each of the fan modules 531 to control the speed of each cooling fan of the fan modules 531, which in turn controls the air flow rate of the fan modules 531. It should be noted that each of the fan modules 531 can be controlled individually with its specific optimal fan speed, and different fan modules and / or different cooling fans within the same fan module can have different optimal fan speeds.

[0097] It should be noted that some or all of the components 507a-c can utilize different cooling methods. For example, one server can utilize air cooling, while another server can utilize liquid cooling. Alternatively, one IT component of a server can utilize air cooling, while another IT component of the same server can utilize liquid cooling (e.g., via one or more cold plates fluidly coupled to the rack liquid manifold, as described herein).

[0098] As previously explained, embodiments of the present disclosure can be (or include) a non-transitory machine-readable medium (such as a microelectronic memory) having instructions stored thereon that program one or more data processing components (generally referred to herein as “processors”) to perform the operations of mitigation, as described herein. In other embodiments, some of those operations can be performed by specific hardware components containing hardwired logic. Those operations can alternatively be performed by any combination of programmed data processing components and fixed hardwired circuit components.

[0099] In the foregoing specification, embodiments of the present disclosure have been described with reference to specific exemplary embodiments thereof. It is evident that various modifications can be made to the disclosure without departing from the broader spirit and scope of the disclosure as set forth in the following claims. The Specification and drawings are, accordingly, to be regarded in an illustrative sense rather than a restrictive sense.

[0100] While certain embodiments have been described and shown herein, it is understood that embodiments are merely illustrative of the broad disclosure and that modifications can be made by those skilled in the art with the content of this disclosure. Accordingly, the specification and drawings are to be regarded in an illustrative manner and should be understood that the disclosure is not limited to the particular construction and arrangements described herein.

[0101] In some embodiments, the present disclosure can include language such as “at least one of [element A] and [element B].” This language can mean that one or more of either element A or element B can be used. For example, “at least one of A and B” can mean A, B, or A and B. In some embodiments, for example, the present disclosure can include language such as “[element A], [element B], and / or [element C].” This language can mean one or any combination of elements A, B, and / or C. For example, “A, B, and / or C” can mean A, B, C, A and B, A and C, B and C, or A, B, and C.

Claims

1. A containment system for a rack of electronic devices, the containment system comprising: a top structure movably coupled on a top of the rack of electronic devices; a first set of tracks coupled to the top of the rack of electronic devices and to the top structure; a first side structure movably coupled to a first side of the rack of electronic devices; a second set of tracks coupled to the first side of the rack of electronic devices and to the first side structure; a second side structure movably coupled to a second side of the rack of electronic devices opposite the first side; and a third set of tracks coupled to the second side of the rack of electronic devices and to the second side structure, wherein each of the top structure, the first side structure, and the second side structure are arranged to move along an axis and at least partially beyond a front or a back end of the rack of electronic devices, thereby creating a containment zone at least partially enclosed by the top structure, the first side structure, and the second side structure, wherein each of the top structure, the first side structure, and the second side structure are arranged to move by sliding linearly along its respective set of tracks, wherein for each of the top structure, the first side structure, and the second side structure, the structure comprises: a panel; and a sealing layer disposed between the panel and an outer surface of a side of the rack of electronic devices, wherein the panel and the sealing layer are removably coupled to each other, the sealing layer being removably coupled to the outer surface of the side of the rack of electronic devices by the respective set of tracks.

2. The containment system of claim 1, wherein the top structure comprising a panel extending at least along a width of the rack of electronic devices, wherein each of the first side structure and the second side structure comprises a panel extending along a height of the rack of electronic devices.

3. The containment system of claim 1, wherein, the top structure comprising at least one fan arranged to push air into or out of the containment zone.

4. The containment system of claim 3, wherein, the axis is a first axis, wherein the at least one fan is arranged to rotate about a second axis perpendicular to the first axis to change a direction in which the at least one fan pushes air.

5. The containment system of claim 3, wherein, the top structure further comprising a cooling unit arranged to generate cooled air from ambient air drawn into the containment zone from outside the containment zone by the at least one fan, wherein the cooled air is pushed into the containment zone by the at least one fan.

6. A cluster of racks of electronic devices arranged in a row, the cluster of racks of electronic devices comprising: a top structure disposed on a top of the cluster of racks of electronic devices and movably coupled on at least one of the racks of electronic devices; a first set of tracks coupled to a top of the at least one of the racks of electronic devices and to the top structure; a first side structure movably coupled to a side of a first electronics rack positioned at one end of the row; a second track set coupled to the side of the first electronics rack and to the first side structure; a second side structure movably coupled to a side of a second electronics rack positioned at another end of the row opposite the one end; and a third track set coupled to the side of the second electronics rack and to the second side structure, wherein each of the top structure, the first side structure, and the second side structure is arranged to move along an axis and at least partially beyond a front end or a back end of the cluster of electronics racks, thereby creating an enclosure zone at least partially enclosed by the top structure, the first side structure, and the second side structure, wherein each of the top structure, the first side structure, and the second side structure is arranged to move by sliding linearly along its respective track set, wherein for each of the top structure, the first side structure, and the second side structure, the structure includes a panel and a sealing layer disposed between the panel and an outer surface of a side of an electronics rack, wherein the panel and the sealing layer are removably coupled to each other, the sealing layer being removably coupled to the outer surface of the side of the electronics rack by a respective track set.

7. The cluster of electronics racks of claim 6, the top structure including a panel extending at least along a width of the row, wherein, wherein each of the first side structure and the second side structure includes a panel extending along a height of its respective electronics rack to which it is movably coupled. the top structure including at least one fan arranged to push air into or out of the enclosure zone.

8. The cluster of electronic device racks of claim 6, wherein, the axis being a first axis, wherein the at least one fan is arranged to rotate about a second axis perpendicular to the first axis to change a direction in which the at least one fan pushes air.

9. The cluster of electronic device racks of claim 8, wherein, the top structure further including at least one cooling unit arranged to generate cooled air from ambient air drawn into the enclosure zone by the at least one fan from outside the enclosure zone, wherein the cooled air is pushed into the enclosure zone by the at least one fan.

10. The cluster of electronic device racks of claim 8, wherein, 11. A data center comprising: a data center information technology room; a cluster of electronics racks disposed within the data center information technology room and arranged in a row; and an enclosure system comprising: a top structure disposed on top of the cluster of electronics racks and movably coupled on at least one of the electronics racks; a first track set coupled to a top of the at least one of the electronics racks and to the top structure; ​ ​ a first side structure movably coupled to a side of a first electronics rack positioned at one end of the row; a second rail set coupled to the side of the first electronics rack and to the first side structure; a second side structure movably coupled to a side of a second electronics rack positioned at another end of the row opposite the one end; and a third rail set coupled to the side of the second electronics rack and to the second side structure, wherein each of the top structure, the first side structure, and the second side structure is arranged to move along an axis and at least partially beyond a front end or a back end of the cluster of electronics racks, thereby creating an enclosure zone at least partially enclosed by the top structure, the first side structure, and the second side structure, wherein each of the top structure, the first side structure, and the second side structure is arranged to move by sliding linearly along its respective rail set, wherein for each of the top structure, the first side structure, and the second side structure, the structure includes a panel and a sealing layer disposed between the panel and an outer surface of a side of an electronics rack, wherein the panel and the sealing layer are removably coupled to each other, the sealing layer being removably coupled to the outer surface of the side of the electronics rack by a respective rail set.

12. The data center of claim 11, wherein the top structure including a panel extending at least along a width of the row, wherein each of the first side structure and the second side structure includes a panel extending along a height of its respective electronics rack to which it is movably coupled.

13. The data center of claim 11, wherein, the top structure including at least one fan arranged to push air into or out of the enclosure zone.

14. The data center of claim 13, wherein, the axis being a first axis, wherein the at least one fan is arranged to rotate about a second axis perpendicular to the first axis to change a direction in which the at least one fan pushes air.

15. The data center of claim 13, wherein, the top structure further including at least one cooling unit arranged to generate cooled air from ambient air drawn into the enclosure zone by the at least one fan from outside the enclosure zone, wherein the cooled air is pushed into the enclosure zone by the at least one fan.

16. The data center of claim 11, wherein, the cluster of electronics racks being a first cluster of electronics racks, wherein the data center further includes a second cluster of electronics racks, the electronics racks of the second cluster being disposed within the data center information technology room and arranged to extend in a second row parallel and adjacent to the first cluster of electronics racks, wherein each of the top structure, the first side structure, and the second side structure is arranged to move along the axis and toward the second cluster of electronic equipment racks such that the containment zone is at least partially enclosed by each of the top structure, the first side structure, and the second side structure and the first cluster of electronic equipment racks and the second cluster of electronic equipment racks.

17. The data center of claim 16, wherein, the top structure is a first top structure, wherein the containment system is a first containment system, wherein the data center further comprises a second containment system comprising: a second top structure disposed on top of the second cluster of electronic equipment racks and movably coupled to at least one of the electronic equipment racks of the second cluster; a third side structure movably coupled to a side of a third electronic equipment rack positioned at the one end of the second row; and a fourth side structure movably coupled to a side of a fourth electronic equipment rack positioned at another end of the second row opposite the one end, wherein 1) the first top structure, the first side structure, and the second side structure are arranged to move along the axis toward the second cluster of electronic equipment racks and 2) the second top structure, the third side structure, and the fourth side structure are arranged to move along the axis toward the first cluster of electronic equipment racks such that the first top structure, the first side structure, and the second side structure are in contact with the second top structure, the third side structure, and the fourth side structure, respectively, thereby creating the containment zone enclosed by the first cluster of electronic equipment racks and the second cluster of electronic equipment racks and all of the first top structure, the first side structure, the second side structure, the second top structure, the third side structure, and the fourth side structure.

Images