Laser processing method and system, computer device and medium

Abstract

An embodiment of the present invention discloses a laser processing method, system, computer device, and medium. The method includes: obtaining the positions of a first calibration mark corresponding to a first camera and a second calibration mark corresponding to a second camera in a unified coordinate system; obtaining an initial correction value for the laser processing area; synchronously translating the second substrate and the second camera so that a second alignment mark on the second substrate is located at a preset position in the field of view of the first camera, recording the positioning position of the second substrate, and calculating the theoretical position of a first alignment mark on a first substrate based on the position of the second alignment mark and the positions of the first and second calibration marks; placing the first alignment mark in the field of view of the second camera, and making the first alignment mark approach the theoretical position from an initial position by rotating and / or translating the first substrate so that the first substrate is located at the positioning position; placing the second substrate at the positioning position; adjusting the initial correction value according to the deviation value between the initial and theoretical positions of the first alignment mark, and performing laser processing.

Description

Technical Field

[0001] The present invention relates to the field of display technology. More specifically, it relates to a laser processing method and system, a computer device, and a medium. Background Art

[0002] With the continuous development of display technology, Light Emitting Diode (LED) display technology, as a new type of display technology, has become a research hotspot. LED display devices have many advantages such as high efficiency, high brightness, high reliability, energy saving, and fast response speed. Compared with Liquid Crystal Display (LCD) and Organic Light Emitting Diode (OLED) display devices, they have obvious advantages in image quality, refresh rate, power consumption, and brightness. Among them, Micro Light Emitting Diode (Micro LED) and Mini Light Emitting Diode (Mini LED) with smaller sizes are increasingly used in large-size backlights due to their small size and thin backlight thickness. Micro-LED and Mini-LED technologies respectively miniaturize the size of existing LEDs to below 100um and between 100μm and 300μm.

[0003] The preparation processes of Micro-LED and Mini-LED have many difficulties and complex technologies, especially their key technology: mass transfer technology. Since the development of mass transfer technology, many technical branches have emerged, such as precise grasping technology (electrostatic force, van der Waals force, magnetic force), self-assembly technology (fluid self-assembly), selective release (patterned laser) technology, etc. For the existing mass transfer technologies, the requirements for the alignment accuracy of the upper and lower substrates and the laser processing (laser lift-off, LLO) accuracy are very high. The inventor found that the existing technologies are difficult to meet the accuracy requirements, especially for the case where the sizes of the upper and lower substrates are different. Summary of the Invention

[0004] An object of the present invention is to provide a laser processing method and system, a computer device, and a medium to solve at least one of the problems existing in the prior art.

[0005] To achieve the above object, the present invention adopts the following technical solutions:

[0006] The first aspect of the present invention provides a laser processing method, including:

[0007] Obtain the positions of the first calibration mark corresponding to the first camera on the first substrate side and the second calibration mark corresponding to the second camera on the second substrate side in a unified coordinate system;

[0008] Obtain the initial correction value of the laser processing area;

[0009] Control the second carrying mechanism to drive the second substrate and the second camera to translate synchronously so that the second alignment mark on the second substrate is located at a preset position in the field of view of the first camera, record the position of the second substrate when the second alignment mark is located at the preset position in the field of view of the first camera as the positioning position of the second substrate, and calculate the theoretical position of the first alignment mark on the first substrate based on the position of the second alignment mark when the second alignment mark is located at the preset position in the field of view of the first camera and the positions of the first calibration mark and the second calibration mark in the unified coordinate system;

[0010] Control the second carrying mechanism to drive the second substrate and the second camera to translate synchronously so that the first alignment mark is located in the field of view of the second camera, and control the first carrying mechanism to drive the first substrate to rotate and / or translate so that the first alignment mark approaches the theoretical position of the first alignment mark from the initial position, thereby making the first substrate located at the positioning position;

[0011] Control the second carrying mechanism to drive the second substrate and the second camera to translate synchronously so that the second substrate is located at the positioning position;

[0012] Adjust the initial correction value of the laser processing area according to the deviation value between the initial position and the theoretical position of the first alignment mark to obtain the current correction value of the laser processing area, and control the laser processing device to perform laser processing according to the current correction value of the laser processing area.

[0013] Optionally, the calculating the theoretical position of the first alignment mark on the first substrate based on the position of the second alignment mark when the second alignment mark is located at the preset position in the field of view of the first camera and the positions of the first calibration mark and the second calibration mark in the unified coordinate system includes: obtaining the theoretical position of the first alignment mark corresponding to the position of the second alignment mark when the second alignment mark is located at the preset position in the field of view of the first camera according to the actual position relationship between the first calibration mark and the second calibration mark, the actual position relationship between the first alignment mark and the second alignment mark, and the positions of the first calibration mark and the second calibration mark in the unified coordinate system.

[0014] Optionally, the obtaining the positions of the first calibration mark corresponding to the first camera on the first substrate side and the second calibration mark corresponding to the second camera on the second substrate side in the unified coordinate system includes:

[0015] Control the first camera to collect an image of a first calibration mark of a first calibration plate loaded on a second carrier mechanism, and control the second camera to collect an image of a second calibration mark of the first calibration plate loaded on the second carrier mechanism, where the first calibration plate includes a first calibration mark within the field of view of the first camera and a second calibration mark within the field of view of the second camera;

[0016] Identify the position of the first calibration mark in the field of view of the first camera and the position of the second calibration mark in the field of view of the second camera. Based on the actual positional relationship between the first calibration mark and the second calibration mark, the position of the first calibration mark in the field of view of the first camera, and the position of the second calibration mark in the field of view of the second camera, obtain the positions of the first calibration mark and the second calibration mark in a unified coordinate system.

[0017] Optionally, the obtaining of the initial correction value of the laser processing area includes:

[0018] Use a laser processing device to process a preset shape on a second calibration plate loaded on a first carrier mechanism;

[0019] Control the second camera to collect preset calibration points in the preset shape of the second calibration plate loaded on the first carrier mechanism, and identify the positions of the preset calibration points in the field of view of the second camera, where the designed positions of the preset calibration points on the second calibration plate are the same as the positions of the second calibration marks on the first calibration plate;

[0020] Based on the positions of the preset calibration points in the field of view of the second camera and the positions of the second calibration marks in the unified coordinate system, calculate the position deviation values between the preset calibration points and the second calibration marks in the unified coordinate system. Based on the position deviation values between the preset calibration points and the second calibration marks in the unified coordinate system, calculate the initial correction value of the laser processing area, and the initial correction value includes the angular offset and translational offset of the laser processing.

[0021] Optionally, there are multiple first cameras and multiple second cameras.

[0022] Optionally, the size of the first substrate is different from the size of the second substrate.

[0023] Optionally, the first substrate includes multiple light-emitting diodes, the second substrate includes multiple drive circuit pins, and the laser processing is to perform laser lift-off on the light-emitting diodes on the first substrate so that the laser-stripped light-emitting diodes are transferred to the second substrate.

[0024] Optionally, the size of the first substrate is smaller than that of the second substrate, and the pitch between adjacent light-emitting diodes among the plurality of light-emitting diodes on the first substrate is smaller than the pitch between adjacent driving circuit pins among the plurality of driving circuit pins on the second substrate.

[0025] Optionally, the controlling of the laser processor to perform laser processing according to the current correction value of the laser processing area includes:

[0026] Performing multiple laser strippings on the light-emitting diodes on the first substrate according to the current correction value of the laser processing area, wherein, for each laser stripping, offset compensation is performed according to the pitch between adjacent light-emitting diodes among the plurality of light-emitting diodes on the first substrate.

[0027] A second aspect of the present invention provides a laser processing system, including a controller, a laser processor, a first carrying mechanism, a second carrying mechanism, at least one first camera disposed on the first carrying mechanism, and at least one second camera disposed on the second carrying mechanism;

[0028] The controller is configured to: acquire the positions of a first calibration mark corresponding to the first camera and a second calibration mark corresponding to the second camera in a unified coordinate system; acquire an initial correction value of the laser processing area; control the second carrying mechanism to drive the second substrate to translate synchronously with the second camera so that a second alignment mark on the second substrate is located at a preset position in the field of view of the first camera, record the position of the second substrate when the second alignment mark is located at the preset position in the field of view of the first camera as the positioning position of the second substrate, and calculate the theoretical position of a first alignment mark on the first substrate according to the position of the second alignment mark when the second alignment mark is located at the preset position in the field of view of the first camera and the positions of the first calibration mark and the second calibration mark in the unified coordinate system; control the second carrying mechanism to drive the second substrate to translate synchronously with the second camera so that the first alignment mark is located in the field of view of the second camera, control the first carrying mechanism to drive the first substrate to rotate and / or translate so that the first alignment mark approaches the theoretical position of the first alignment mark from the initial position, thereby making the first substrate located at the positioning position; control the second carrying mechanism to drive the second substrate to translate synchronously with the second camera so that the second substrate is located at the positioning position; adjust the initial correction value of the laser processing area according to the deviation value between the initial position and the theoretical position of the first alignment mark, obtain the current correction value of the laser processing area, and control the laser processor to perform laser processing according to the current correction value of the laser processing area.

[0029] A third aspect of the present invention provides a computer device, including a memory, a processor, and a computer program stored on the memory and executable on the processor, where the processor, when executing the program, implements the laser processing method provided in the first aspect of the present invention.

[0030] The fourth aspect of the present invention provides a computer-readable storage medium, on which a computer program is stored, and when the program is executed by a processor, it implements the laser processing method provided by the first aspect of the present invention.

[0031] The beneficial effects of the present invention are as follows:

[0032] In the technical solution of the present invention, a substrate alignment process based on a calibration mark (calibration Mark) is designed in the laser processing process, enabling the alignment of the first substrate and the second substrate without simultaneously observing the alignment marks (alignment Marks) of the first substrate and the second substrate, reducing the measurement reference and simplifying the measurement steps, which can effectively improve the alignment accuracy, and is particularly suitable for the alignment of the first substrate and the second substrate of different sizes. Moreover, a laser beam calibration process is designed in the laser processing process, ensuring the laser processing accuracy on the basis of ensuring the alignment accuracy. Description of the Drawings

[0033] The following further describes in detail the specific embodiments of the present invention with reference to the drawings.

[0034] Figure 1 A flowchart showing the laser processing method provided by the embodiment of the present invention.

[0035] Figure 2 A schematic diagram showing the positional relationship between the first calibration plate, the first camera, and the second camera in step S110.

[0036] Figure 3 A schematic diagram showing the initial loading positions of the first substrate and the second substrate in step S130.

[0037] Figure 4 A schematic diagram showing the identification of the second alignment mark in step S130.

[0038] Figure 5 Another schematic diagram showing the identification of the second alignment mark in step S130.

[0039] Figure 6 A schematic diagram showing the identification of the first alignment mark in step S130.

[0040] Figure 7 Another schematic diagram showing the identification of the first alignment mark in step S130.

[0041] Figure 8 A schematic diagram showing the state after the alignment of the first substrate and the second substrate in step S130 is completed.

[0042] Figure 9 Another schematic diagram showing the state after the alignment of the first substrate and the second substrate in step S130 is completed.

[0043] Figure 10 The schematic diagram of the processing trajectory of a single laser processing in step S140 is shown.

[0044] Figure 11 The schematic diagram of the structure of the computer system of the controller in the laser processing system provided by the embodiment of the present invention is shown. Detailed implementation manners

[0045] To describe the present invention more clearly, the present invention will be further described below in conjunction with embodiments and drawings. Similar components in the drawings are denoted by the same reference numerals. Those skilled in the art should understand that the content described specifically below is illustrative rather than restrictive, and should not be used to limit the protection scope of the present invention.

[0046] For the mass transfer technology of display devices such as Micro-LED and Mini-LED, the requirements for the alignment accuracy of the upper and lower substrates and the laser processing (laser lift-off) accuracy are very high. The inventors found that the existing technologies are difficult to meet the accuracy requirements. Especially for the case where the sizes of the upper and lower substrates are different, it is impossible to observe the upper and lower substrates simultaneously in this case, and it is even more difficult to meet the alignment accuracy requirements. For example, the upper substrate (also called the upper Wafer) includes a plurality of light-emitting diodes (LEDs), and the lower substrate (also called the BP substrate) includes a plurality of drive circuit pins (Pitch). During mass transfer, laser lift-off (LLO) is performed on the light-emitting diodes on the upper substrate so that the laser-lifted light-emitting diodes are transferred to the lower substrate, and the light-emitting diode pins of the light-emitting diodes transferred to the lower substrate need to face correctly and be electrically connected to the drive circuit pins on the lower substrate. In addition, for the case where the sizes of the upper and lower substrates are different, for example, the common situation is that the spacing between the light-emitting diodes on the upper substrate is small, and when transferring, it is necessary to reasonably and evenly distribute the spacing of the light-emitting diodes transferred to the lower substrate.

[0047] In view of this, an embodiment of the present invention provides a laser processing method, which is implemented based on a constructed laser processing system.

[0048] Among them, the laser processing system includes a controller, a laser processor, a first carrying mechanism (such as an upper carrying mechanism), a second carrying mechanism (such as a lower carrying mechanism), at least one first camera (upper camera) provided on the first carrying mechanism (upper carrying mechanism), and at least one second camera (lower camera) provided on the second carrying mechanism (lower carrying mechanism).

[0049] As Figure 1 shown, the laser processing method provided by the embodiment of the present invention includes the following steps:

[0050] S110. Perform camera calibration.

[0051] In a possible implementation, step S110 includes: obtaining the positions of the first calibration mark corresponding to the first camera on the first substrate side and the second calibration mark corresponding to the second camera on the second substrate side in a unified coordinate system.

[0052] Wherein, the first carrier mechanism (upper carrier mechanism) is used to carry the first substrate (upper substrate), the first camera (upper camera) is disposed on the first carrier mechanism (upper carrier mechanism), the second carrier mechanism (lower carrier mechanism) is used to carry the second substrate (lower substrate), and the second camera (lower camera) is disposed on the second carrier mechanism (lower carrier mechanism).

[0053] In a possible implementation, there are multiple first cameras and multiple second cameras. Thus, the alignment accuracy requirements for the first substrate (upper substrate) and the second substrate (lower substrate) in the XY plane perpendicular to the Z direction in the subsequent steps of this embodiment can be met. The Z direction is the direction in which the lower substrate points to the upper substrate during laser processing after the upper and lower substrates are aligned. For example, two first cameras (upper cameras) are disposed on the first carrier mechanism (upper carrier mechanism), and two second cameras (lower cameras) are disposed on the second carrier mechanism (lower carrier mechanism). The subsequent descriptions are all based on this number of cameras.

[0054] In this embodiment, the focal planes of the first camera (upper camera) and the second camera (lower camera) are respectively parallel to the XY plane.

[0055] In a possible implementation, the size of the first substrate (upper substrate) is different from the size of the second substrate (lower substrate). For example, the size of the first substrate (upper substrate) is smaller than the size of the second substrate (lower substrate). The subsequent descriptions are all based on the design where the size of the first substrate (upper substrate) is smaller than the size of the second substrate (lower substrate).

[0056] Furthermore, the first substrate (upper substrate) includes multiple light-emitting diodes, and the second substrate (lower substrate) includes multiple driving circuit pins. The laser processing in this embodiment is to perform laser lift-off on the light-emitting diodes on the first substrate (upper substrate) so that the laser-lifted light-emitting diodes are transferred to the second substrate (lower substrate).

[0057] In a possible implementation, the obtaining of the positions of the first calibration mark corresponding to the first camera (upper camera) on the first substrate (upper substrate) side and the second calibration mark corresponding to the second camera (lower camera) on the second substrate (lower substrate) side in step S110 includes:

[0058] When the first calibration plate is loaded on the second bearing mechanism (lower bearing mechanism), control the first camera (upper camera) to collect an image including the first calibration mark on the first calibration plate, and control the second camera (lower camera) to collect an image including the second calibration mark on the first calibration plate. Here, the first calibration plate includes a first calibration mark within the field of view of the first camera (upper camera) and a second calibration mark within the field of view of the second camera (lower camera). For example Figure 2 as shown Figure 2 in the figure, the first calibration plate 202 loaded on the second bearing mechanism (lower bearing mechanism) 201 includes a first calibration mark 2021, a first calibration mark 2022, a second calibration mark 2023, and a second calibration mark 2024. The first calibration mark 2021 is within the field of view of the first camera (upper camera) 2031, the first calibration mark 2022 is within the field of view of the first camera (upper camera) 2032, the second calibration mark 2023 is within the field of view of the second camera (lower camera) 2033, and the second calibration mark 2024 is within the field of view of the second camera (lower camera) 2034. Among them, the actual positional relationship between the first calibration mark 2021, the first calibration mark 2022, the second calibration mark 2023, and the second calibration mark 2024 in the first calibration plate 202 is measured in advance. The shapes of the first calibration mark 2021, the first calibration mark 2022, the second calibration mark 2023, and the second calibration mark 2024 can be the same or different. The shape of the calibration mark can be any shape convenient for identification and positioning, such as a cross, a rectangle, a circle, etc. For example, the shapes of the first calibration mark 2021, the first calibration mark 2022, the second calibration mark 2023, and the second calibration mark 2024 are the same, all being crosses;

[0059] Identify the positions of the first calibration mark in the field of view of the first camera (upper camera) and the second calibration mark in the field of view of the second camera (lower camera). According to the actual positional relationship between the first calibration mark and the second calibration mark, the position of the first calibration mark in the field of view of the first camera (upper camera), and the position of the second calibration mark in the field of view of the second camera (lower camera), obtain the positions of the first calibration mark and the second calibration mark in a unified coordinate system. For example: By performing graphic recognition on the image collected by the first camera (upper camera) 2031, the position of the first calibration mark 2021 in the field of view of the first camera (upper camera) 2031 can be obtained, etc.; Then, combined with the actual positional relationship between the first calibration mark 2021, the first calibration mark 2022, the second calibration mark 2023, and the second calibration mark 2024 in the first calibration plate 202 measured in advance, the positions of the first calibration mark 2021, the first calibration mark 2022, the second calibration mark 2023, and the second calibration mark 2024 in the unified coordinate system can be obtained. For example, the unified coordinate system is a rectangular coordinate system in the XY plane.

[0060] S120. Perform initial laser calibration.

[0061] In a possible implementation, step S120 includes: obtaining an initial correction value for the laser processing area, where the initial correction value includes the angular offset and translational offset of the laser processing.

[0062] In a possible implementation, obtaining the initial correction value for the laser processing area includes:

[0063] Using a laser processor to process a preset shape on a second calibration plate loaded on a first carrier mechanism (upper carrier mechanism);

[0064] It should be noted that the laser processor for processing the preset shape on the second calibration plate is the subsequent laser processing, that is, the laser processor for laser lift-off of the light-emitting diodes on the first substrate (upper substrate); for example, the laser processor is fixed on the first carrier mechanism (upper carrier mechanism) and its position remains unchanged (the position of the laser processor is fixed, and when the first carrier mechanism drives the first substrate to move later, it does not drive the laser processor to move). The laser processor includes, for example, a laser generator, a scanning galvanometer, and a field lens. Among them: the laser generator is used to generate laser light. According to the implementation requirements, the specific type of the laser generator can be selected from gas lasers, solid-state lasers, semiconductor lasers, dye lasers, etc.; the scanning galvanometer is a vector scanning device that can deflect the laser light in different predetermined dimensions to achieve different processing operations; the field lens is used to focus the laser light and control the action area of the laser beam to achieve processing; continuing the previous example, the second calibration plate is a glass plate with a coating of a substance (such as glue or other materials) that can react to laser irradiation. The laser processor irradiates the glass plate loaded on the first carrier mechanism (upper carrier mechanism) along a preset trajectory, and a preset shape can be formed due to the reaction of the coating. For example, the preset shape is a straight line, and the length of the straight line is the same as the width of the light-emitting diode area on the first substrate (upper substrate);

[0065] Control the second camera (lower camera) to collect the preset calibration points in the preset shape of the second calibration plate loaded on the first carrier mechanism (lower carrier mechanism), and identify the positions of the preset calibration points in the field of view of the second camera (lower camera). Among them, the designed positions of the preset calibration points in the second calibration plate are the same as the positions of the second calibration marks in the first calibration plate. Continuing the previous example, the preset calibration points are the two endpoints of a straight line formed on the glass plate. When the second carrier mechanism (such as the lower carrier mechanism) drives the two second cameras (lower cameras) to translate to the preset working position, the two endpoints of the straight line formed on the glass plate appear in the fields of view of the two second cameras (lower cameras) respectively. By performing pattern recognition on the images collected by the two second cameras (lower cameras), the positions of the two endpoints of the straight line formed on the glass plate in the fields of view of the two second cameras (lower cameras) can be obtained. Among them, the designed positions of the two endpoints of the straight line formed on the glass plate in the glass plate are the same as the positions of the two second calibration marks in the first calibration plate.

[0066] According to the positions of the preset calibration points in the field of view of the second camera (lower camera) and the positions of the second calibration marks in the unified coordinate system, for example, calculate the position deviation value between the preset calibration points and the second calibration marks in the unified coordinate system through the existing geometric transformation algorithm. Calculate the initial correction value of the laser processing area according to the position deviation value between the preset calibration points and the second calibration marks in the unified coordinate system. The initial correction value includes the rotation offset and translation offset of the laser processing. It can be understood that since the designed positions of the preset calibration points in the second calibration plate are the same as the positions of the second calibration marks in the first calibration plate, the position deviation value between the preset calibration points and the second calibration marks in the unified coordinate system can represent the initial deviation value of the laser processing area. Here, it is called the initial deviation value because the alignment between the first substrate (upper substrate) and the second substrate (lower substrate) has not been performed yet. After alignment, there will be an offset between the position of the first substrate (upper substrate) loaded on the first carrier mechanism (such as the upper carrier mechanism) and the position of the second calibration plate loaded on the first carrier mechanism (such as the upper carrier mechanism) in step S120. During subsequent laser processing (laser peeling), the deviation value of the laser processing area needs to be adjusted or compensated according to the movement amount of the first substrate (upper substrate).

[0067] S130. Align the first substrate (upper substrate) with the second substrate (lower substrate).

[0068] In a possible implementation manner, step S130 includes:

[0069] The first substrate (upper substrate) is loaded on the first carrier mechanism (upper carrier mechanism), and the second substrate (lower substrate) is loaded on the second carrier mechanism (lower carrier mechanism). Among them, the first substrate (upper substrate) is provided with first alignment marks (upper alignment marks) corresponding to the second camera (lower camera), and the second substrate (lower substrate) is provided with second alignment marks (lower alignment marks) corresponding to the first camera (upper camera). Continuing the previous example: The second alignment marks are, for example, two alignment marks in a shape such as a cross formed on the second substrate (lower substrate), or two drive circuit pins selected from multiple drive circuit pins included in the second substrate (lower substrate), such as two drive circuit pins at the two side edge positions; The first alignment marks are, for example, two alignment marks in a shape such as a cross formed on the first substrate (upper substrate), or two light-emitting diodes selected from multiple light-emitting diodes included in the first substrate (upper substrate), such as two light-emitting diodes at the two side edge positions; Continuing the previous example, when the first substrate (upper substrate) and the second substrate (lower substrate) are loaded, the positions of the first alignment mark 3011 of the first substrate (upper substrate) in the field of view 2033` of the second camera (lower camera), the position of the first alignment mark 3012 of the first substrate (upper substrate) in the field of view 2034` of the second camera (lower camera), the position of the second alignment mark 3021 of the second substrate (lower substrate) in the field of view 2031` of the first camera (upper camera), and the position of the second alignment mark 3022 of the second substrate (lower substrate) in the field of view 2032` of the first camera (upper camera) are, for example Figure 3 As shown, it can be seen that there is an intersection between the first connection line between the first alignment mark 3011 and the first alignment mark 3012 and the second connection line between the second alignment mark 3021 and the second alignment mark 3022, and there is an alignment deviation between the first substrate (upper substrate) 301 and the second substrate (lower substrate) in the XY plane;

[0070] Due to the loading accuracy problem, the second carrier mechanism (lower carrier mechanism) is controlled to drive the second substrate (lower substrate) to translate synchronously with the second camera (lower camera) so that the second alignment marks on the second substrate (lower substrate) are located at a preset position in the field of view of the first camera (upper camera). Continuing the previous example: Making the second alignment marks on the second substrate (lower substrate) be located at a preset position in the field of view of the first camera (upper camera), for example, making the second alignment marks on the second substrate (lower substrate) be located at the center position in the field of view of the first camera (upper camera), for example Figure 4 and Figure 5As shown, the second carrier mechanism (lower carrier mechanism) 201 drives the second substrate (lower substrate) 302 to translate synchronously with the second cameras (lower cameras) 2033 and 2034, so that the two second alignment marks 3021 and 3022 on the second substrate (lower substrate) 302 are respectively located at the central positions in the fields of view of the first cameras (upper cameras) 2031 and 2032. Among them, Figure 4 only the second carrier mechanism (lower carrier mechanism) 201, the second substrate (lower substrate) 302 loaded on the second carrier mechanism (lower carrier mechanism) 201, the first carrier mechanism (upper carrier mechanism) 204, the first substrate (upper substrate) 301 loaded on the first carrier mechanism (upper carrier mechanism) 204, and the first cameras (upper cameras) 2031 and 2032 provided on the first carrier mechanism (upper carrier mechanism) are shown. The second carrier mechanism (lower carrier mechanism) 201 drives the second substrate (lower substrate) 302 to translate synchronously with the second cameras (lower cameras), so that the second cameras (lower cameras) are translated to Figure 4 the range shown outside;

[0071] Record the position of the second substrate (lower substrate) when the second alignment mark is at the preset position in the field of view of the first camera (upper camera) as the positioning position of the second substrate (lower substrate);

[0072] Calculate the theoretical position of the first alignment mark on the first substrate (upper substrate) according to the position of the second alignment mark when the second alignment mark is at the preset position in the field of view of the first camera (upper camera) and the positions of the first calibration mark and the second calibration mark in the unified coordinate system;

[0073] Control the second carrier mechanism (lower carrier mechanism) to drive the second substrate (lower substrate) to translate synchronously with the second cameras (lower cameras) so that the first alignment mark is located in the field of view of the second cameras (lower cameras), and control the first carrier mechanism (upper carrier mechanism) to drive the first substrate (upper substrate) to rotate and / or translate so that the first alignment mark approaches the theoretical position of the first alignment mark from the initial position, so that the first substrate (upper substrate) is located at the positioning position; for example, the PID control algorithm can be used to control the first carrier mechanism (upper carrier mechanism) to drive the first substrate (upper substrate) to rotate and / or translate to correct the position of the first substrate (upper substrate) under the condition of visual full closed loop; Continuing the previous example: for example Figure 6 and Figure 7 As shown, the second carrier mechanism (lower carrier mechanism) 201 drives the second substrate (lower substrate) 302 to translate synchronously with the second cameras (lower cameras) 2033 and 2034, so that the two first alignment marks 3011 and 3012 on the first substrate (upper substrate) 301 are respectively located in the fields of view of the second cameras (lower cameras) 2033 and 2033. Among them, Figure 6Only the second carrier mechanism (lower carrier mechanism) 201, the second cameras (lower cameras) 2033 and 2034 disposed on the second carrier mechanism (lower carrier mechanism) 201, the first carrier mechanism (upper carrier mechanism) 204, and the first substrate (upper substrate) 301 loaded on the first carrier mechanism (upper carrier mechanism) 204 are shown. The second carrier mechanism (lower carrier mechanism) 201 drives the second substrate (lower substrate) to translate synchronously with the second cameras (lower cameras) 2033 and 2034 so that the second substrate (lower substrate) is translated to Figure 6 outside the shown range;

[0074] Control the second carrier mechanism (lower carrier mechanism) to drive the second substrate (lower substrate) to translate synchronously with the second cameras (lower cameras) so that the second substrate (lower substrate) is located at the positioning position, and complete the alignment of the first substrate (upper substrate) and the second substrate (lower substrate). Continuing with the foregoing example, after the alignment is completed, the position of the first alignment mark 3011 of the first substrate (upper substrate) 301 in the field of view 2033` of the second camera (lower camera), the position of the first alignment mark 3012 of the first substrate (upper substrate) 301 in the field of view 2034` of the second camera (lower camera), the position of the second alignment mark 3021 of the second substrate (lower substrate) 302 in the field of view 2031` of the first camera (upper camera), and the position of the second alignment mark 3022 of the second substrate (lower substrate) 302 in the field of view 2032` of the first camera (upper camera) are, for example Figure 8 as shown. It can be seen that the second line connecting the second alignment mark 3021 and the second alignment mark 3022 includes the first line connecting the first alignment mark 3011 and the first alignment mark 3012 (the second line is parallel to the first line and the positive projection of the second line in the Z direction covers the first line). There is no alignment deviation between the first substrate (upper substrate) 301 and the second substrate (lower substrate) in the XY plane. After the alignment is completed, the positional relationship between the first substrate (upper substrate) 301 and the second substrate (lower substrate) is as Figure 9 shown.

[0075] In this embodiment, the second carrier mechanism (lower carrier mechanism) can drive the second substrate (lower substrate) and the second camera (lower camera) to synchronously translate in the XY plane to sequentially realize that the second substrate (lower substrate) is located at the positioning position, the second camera (lower camera) is located at the image acquisition station corresponding to the positioning position of the second substrate (lower substrate), and the second substrate (lower substrate) returns to the positioning position. The first carrier mechanism (upper carrier mechanism) can drive the first substrate (upper substrate) to rotate / translate in the XY plane when the second camera (lower camera) is located at the image acquisition station to realize that the first substrate (upper substrate) is located at the positioning position. Continuing with the previous example, first determine the positioning position of the smaller second substrate (lower substrate) including multiple light-emitting diodes, then determine the process of the larger first substrate (upper substrate) including multiple drive circuit pins, and the design method in which the second substrate (lower substrate) can only be driven to translate while the first substrate (upper substrate) can be driven to rotate and translate is more conducive to accurately and efficiently realizing the positioning of the first substrate (upper substrate) and the second substrate (lower substrate).

[0076] In a possible implementation manner, calculating the theoretical position of the first alignment mark on the first substrate (upper substrate) based on the position of the second alignment mark when the second alignment mark is located at a preset position in the field of view of the first camera (upper camera) and the positions of the first calibration mark and the second calibration mark in a unified coordinate system includes: based on the actual positional relationship between the first calibration mark and the second calibration mark, the actual positional relationship between the first alignment mark and the second alignment mark, and the positions of the first calibration mark and the second calibration mark in a unified coordinate system, for example, obtaining the theoretical position of the first alignment mark corresponding to the position of the second alignment mark when the second alignment mark is located at a preset position in the field of view of the first camera (upper camera) through an existing geometric transformation algorithm.

[0077] Continuing with the previous example, it can be designed that the first calibration plate in step S110 has the same shape as the second substrate (lower substrate), the position of the first calibration mark in the first calibration plate is the same as the position of the second alignment mark in the second substrate (lower substrate), and the position of the second calibration mark in the first calibration plate is the same as the position corresponding to the orthographic projection of the first alignment mark on the lower substrate. In this way, it is more convenient to calculate the theoretical position of the first alignment mark. Directly based on the actual positional relationship between the first calibration mark and the second calibration mark and the positions of the first calibration mark and the second calibration mark in a unified coordinate system, the theoretical position of the first alignment mark corresponding to the position of the second alignment mark when the second alignment mark is located at a preset position in the field of view of the first camera (upper camera) can be obtained.

[0078] S140. Perform laser processing.

[0079] In a possible implementation, step S140 includes: adjusting an initial correction value of the laser processing area according to a deviation value between an initial position and a theoretical position of a first alignment mark to obtain a current correction value of the laser processing area, and controlling a laser processing device to perform laser processing according to the current correction value of the laser processing area.

[0080] Among them, what is specifically controlled according to the current correction value of the laser processing area is a scanning galvanometer in the laser processing device.

[0081] For example, the initial correction value of the laser processing area can be adjusted according to the deviation value between the initial position and the theoretical position of the first alignment mark through a PID control algorithm to obtain the current correction value of the laser processing area.

[0082] In a possible implementation, the size of the first substrate (upper substrate) is smaller than that of the second substrate (lower substrate), and the distance between adjacent light-emitting diodes among multiple light-emitting diodes on the first substrate (upper substrate) is smaller than the distance between adjacent driving circuit pins among multiple driving circuit pins on the second substrate (lower substrate).

[0083] In a possible implementation, controlling the laser processing device to perform laser processing according to the current correction value of the laser processing area includes:

[0084] Performing multiple laser strippings on the light-emitting diodes on the first substrate (upper substrate) according to the current correction value of the laser processing area, wherein each laser stripping compensates for the offset according to the distance between adjacent light-emitting diodes among multiple light-emitting diodes on the first substrate (upper substrate).

[0085] Continuing with the foregoing example, for the case where the distance between adjacent light-emitting diodes among multiple light-emitting diodes on the first substrate (upper substrate) is smaller than the distance between adjacent driving circuit pins among multiple driving circuit pins on the second substrate (lower substrate), light-emitting diode transfer can be performed through multiple laser strippings. Since the position of each laser stripping has an offset, an additional offset needs to be added when controlling the laser processing device for compensation. For example, in the XY plane, the offset in the X direction is the X-direction distance between adjacent light-emitting diodes among multiple light-emitting diodes on the first substrate (upper substrate), and the offset in the Y direction is the Y-direction distance between adjacent light-emitting diodes among multiple light-emitting diodes on the first substrate (upper substrate). For example, the processing trajectory of a single laser processing is, for example Figure 10 1001 shown in the figure.

[0086] Another embodiment of the present invention provides a laser processing system, including a controller, a laser processing device, a first carrying mechanism, a second carrying mechanism, at least one first camera disposed on the first carrying mechanism, and at least one second camera disposed on the second carrying mechanism;

[0087] The controller is configured to: obtain the positions of a first calibration mark corresponding to a first camera and a second calibration mark corresponding to a second camera in a unified coordinate system; obtain an initial correction value of the laser processing area; control a second carrying mechanism to drive a second substrate and the second camera to translate synchronously so that a second alignment mark on the second substrate is located at a preset position in the field of view of the first camera, record the position of the second substrate when the second alignment mark is located at the preset position in the field of view of the first camera as the positioning position of the second substrate, and calculate the theoretical position of a first alignment mark on a first substrate based on the position of the second alignment mark when the second alignment mark is located at the preset position in the field of view of the first camera and the positions of the first calibration mark and the second calibration mark in the unified coordinate system; control the second carrying mechanism to drive the second substrate and the second camera to translate synchronously so that the first alignment mark is located in the field of view of the second camera, and control a first carrying mechanism to drive the first substrate to rotate and / or translate so that the first alignment mark approaches the theoretical position of the first alignment mark from an initial position, thereby positioning the first substrate at the positioning position; control the second carrying mechanism to drive the second substrate and the second camera to translate synchronously so that the second substrate is located at the positioning position; adjust the initial correction value of the laser processing area according to the deviation value between the initial position and the theoretical position of the first alignment mark to obtain a current correction value of the laser processing area, and control a laser processor to perform laser processing according to the current correction value of the laser processing area.

[0088] It should be noted that the principle and working process of the laser processing system provided in this embodiment are similar to those of the above laser processing method, and the related parts can refer to the above description and will not be elaborated here.

[0089] As Figure 11 shown, a computer system suitable for implementing the controller in the laser processing system provided in the above embodiment includes a central processing module (CPU), which can perform various appropriate actions and processes according to a program stored in a read-only memory (ROM) or a program loaded from a storage part into a random access memory (RAM). In the RAM, various programs and data required for the operation of the computer system are also stored. The CPU, ROM, and RAM are connected to each other through a bus. An input / output (I / O) interface is also connected to the bus.

[0090] The following components are connected to the I / O interface: an input section including a keyboard, a mouse, etc.; an output section including a liquid crystal display (LCD), etc. and a speaker, etc.; a storage section including a hard disk, etc.; and a communication section including a network interface card such as a LAN card, a modem, etc. The communication section performs communication processing via a network such as the Internet. A drive is also connected to the I / O interface as needed. A removable medium such as a magnetic disk, an optical disk, a magneto-optical disk, a semiconductor memory, etc. is installed on the drive as needed so that a computer program read therefrom is installed into the storage section as needed.

[0091] Specifically, according to this embodiment, the process described in the above flowchart can be implemented as a computer software program. For example, this embodiment includes a computer program product that includes a computer program tangibly embodied on a computer-readable medium, and the above computer program includes program code for performing the method shown in the flowchart. In such an embodiment, the computer program can be downloaded and installed from a network through the communication section, and / or installed from a removable medium.

[0092] The flowcharts and schematic diagrams in the accompanying drawings illustrate the possible architectures, functions, and operations of the system, method, and computer program product of this embodiment. In this regard, each block in the flowchart or schematic diagram can represent a module, a program segment, or a part of code that includes one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions marked in the blocks may occur in a different order than that marked in the accompanying drawings. For example, two consecutive blocks shown may actually be executed substantially in parallel, and they may sometimes be executed in the reverse order, depending on the functions involved. It should also be noted that each block in the schematic diagram and / or flowchart, and the combinations of blocks in the schematic and / or flowchart, can be implemented by a dedicated hardware-based system that performs the specified functions or operations, or can be implemented by a combination of dedicated hardware and computer instructions.

[0093] As another aspect, the present embodiment further provides a non-volatile computer storage medium. The non-volatile computer storage medium may be the non-volatile computer storage medium included in the above-mentioned device in the above-mentioned embodiment, or may exist independently and be a non-volatile computer storage medium not assembled into the terminal. The above non-volatile computer storage medium stores one or more programs. When the above one or more programs are executed by a device, the device is caused to: obtain the positions of a first calibration mark corresponding to a first camera on the first substrate side and a second calibration mark corresponding to a second camera on the second substrate side in a unified coordinate system; obtain an initial correction value of the laser processing area; control the second carrying mechanism to drive the second substrate and the second camera to translate synchronously so that a second alignment mark on the second substrate is located at a preset position in the field of view of the first camera, record the position of the second substrate when the second alignment mark is located at the preset position in the field of view of the first camera as the positioning position of the second substrate, and calculate the theoretical position of a first alignment mark on the first substrate according to the position of the second alignment mark when the second alignment mark is located at the preset position in the field of view of the first camera and the positions of the first calibration mark and the second calibration mark in the unified coordinate system; control the second carrying mechanism to drive the second substrate and the second camera to translate synchronously so that the first alignment mark is located in the field of view of the second camera, and control the first carrying mechanism to drive the first substrate to rotate and / or translate so that the first alignment mark approaches the theoretical position of the first alignment mark from the initial position, thereby causing the first substrate to be located at the positioning position; control the second carrying mechanism to drive the second substrate and the second camera to translate synchronously so that the second substrate is located at the positioning position; adjust the initial correction value of the laser processing area according to the deviation value between the initial position and the theoretical position of the first alignment mark to obtain the current correction value of the laser processing area, and control the laser processing device to perform laser processing according to the current correction value of the laser processing area.

[0094] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by terms such as "upper", "lower", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present invention. Unless otherwise clearly specified and defined, the terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected, or indirectly connected through an intermediate medium, and it may be the internal communication of two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0095] It should also be noted that, in the description of the present invention, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a series of elements not only includes those elements but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising an..." does not exclude the presence of additional identical elements in the process, method, article or device comprising the said element.

[0096] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, rather than limitations on the implementation manners of the present invention. For those of ordinary skill in the art, based on the above description, other different forms of changes or modifications can be made. It is impossible to enumerate all the implementation manners here. Any obvious changes or modifications derived from the technical solutions of the present invention still fall within the protection scope of the present invention.

Claims

1. A laser processing method, characterized in that, Including: Obtaining the positions of a first calibration mark corresponding to a first camera on a first substrate side and a second calibration mark corresponding to a second camera on a second substrate side in a unified coordinate system; Obtaining an initial correction value of a laser processing area, where the initial correction value includes a rotation offset and a translation offset of laser processing; Controlling a second carrying mechanism to drive the second substrate and the second camera to translate synchronously so that a second alignment mark on the second substrate is located at a preset position in the field of view of the first camera, recording the position of the second substrate when the second alignment mark is located at the preset position in the field of view of the first camera as the positioning position of the second substrate, and calculating the theoretical position of a first alignment mark on the first substrate based on the position of the second alignment mark when the second alignment mark is located at the preset position in the field of view of the first camera and the positions of the first calibration mark and the second calibration mark in the unified coordinate system; Controlling the second carrying mechanism to drive the second substrate and the second camera to translate synchronously so that the first alignment mark is located in the field of view of the second camera, and controlling the first carrying mechanism to drive the first substrate to rotate and / or translate so that the first alignment mark approaches the theoretical position of the first alignment mark from the initial position, thereby making the first substrate located at the positioning position; Controlling the second carrying mechanism to drive the second substrate and the second camera to translate synchronously so that the second substrate is located at the positioning position; Adjusting the initial correction value of the laser processing area according to the deviation value between the initial position and the theoretical position of the first alignment mark to obtain the current correction value of the laser processing area, and controlling a laser processing device to perform laser processing according to the current correction value of the laser processing area.

2. The method according to claim 1, characterized in that, The calculating the theoretical position of the first alignment mark on the first substrate based on the position of the second alignment mark when the second alignment mark is located at the preset position in the field of view of the first camera and the positions of the first calibration mark and the second calibration mark in the unified coordinate system includes: obtaining the theoretical position of the first alignment mark corresponding to the position of the second alignment mark when the second alignment mark is located at the preset position in the field of view of the first camera according to the actual position relationship between the first calibration mark and the second calibration mark, the actual position relationship between the first alignment mark and the second alignment mark, and the positions of the first calibration mark and the second calibration mark in the unified coordinate system.

3. The method according to claim 1, wherein The obtaining the positions of the first calibration mark corresponding to the first camera on the first substrate side and the second calibration mark corresponding to the second camera on the second substrate side in the unified coordinate system includes: Controlling the first camera to collect an image including the first calibration mark of a first calibration plate loaded on the second carrying mechanism, and controlling the second camera to collect an image including the second calibration mark of the first calibration plate loaded on the second carrying mechanism, where the first calibration plate includes the first calibration mark within the field of view of the first camera and the second calibration mark within the field of view of the second camera; The positions of the first calibration mark in the field of view of the first camera and the second calibration mark in the field of view of the second camera are recognized. Based on the actual positional relationship between the first calibration mark and the second calibration mark, the position of the first calibration mark in the field of view of the first camera, and the position of the second calibration mark in the field of view of the second camera, the positions of the first calibration mark and the second calibration mark in a unified coordinate system are obtained.

4. The method according to claim 3, wherein The obtaining of the initial correction value of the laser processing area includes: Using a laser processing device to process a preset shape on a second calibration plate loaded on a first carrying mechanism; Controlling the second camera to collect preset calibration points in the preset shape of the second calibration plate loaded on the first carrying mechanism, and recognizing the positions of the preset calibration points in the field of view of the second camera, wherein the designed positions of the preset calibration points in the second calibration plate are the same as the positions of the second calibration marks in the first calibration plate; Based on the positions of the preset calibration points in the field of view of the second camera and the positions of the second calibration marks in the unified coordinate system, the position deviation values of the preset calibration points and the second calibration marks in the unified coordinate system are calculated. Based on the position deviation values of the preset calibration points and the second calibration marks in the unified coordinate system, the initial correction value of the laser processing area is calculated, and the initial correction value includes the angular offset and translational offset of the laser processing.

5. The method according to claim 1, wherein There are multiple first cameras and multiple second cameras.

6. The method according to any one of claims 1-5, characterized in that, The size of the first substrate is different from the size of the second substrate.

7. The method according to claim 6, wherein The first substrate includes multiple light-emitting diodes, and the second substrate includes multiple drive circuit pins. The laser processing is to perform laser lift-off on the light-emitting diodes on the first substrate so that the laser-lifted light-emitting diodes are transferred to the second substrate.

8. The method according to claim 7, wherein The size of the first substrate is smaller than that of the second substrate, and the distance between adjacent light-emitting diodes among the multiple light-emitting diodes on the first substrate is smaller than the distance between adjacent drive circuit pins among the multiple drive circuit pins on the second substrate.

9. The method according to claim 8, wherein The controlling of the laser processing device to perform laser processing according to the current correction value of the laser processing area includes: Performing multiple laser lift-offs on the light-emitting diodes on the first substrate according to the current correction value of the laser processing area, wherein each laser lift-off compensates for the offset according to the distance between adjacent light-emitting diodes among the multiple light-emitting diodes on the first substrate.

10. A laser processing system, characterized in that, It includes a controller, a laser processing device, a first carrying mechanism, a second carrying mechanism, at least one first camera disposed on the first carrying mechanism, and at least one second camera disposed on the second carrying mechanism; The controller is configured to: obtain the positions of a first calibration mark corresponding to a first camera and a second calibration mark corresponding to a second camera in a unified coordinate system; obtain an initial correction value of a laser processing area; control a second carrier mechanism to drive a second substrate and the second camera to translate synchronously so that a second alignment mark on the second substrate is located at a preset position in the field of view of the first camera, record the position of the second substrate when the second alignment mark is located at the preset position in the field of view of the first camera as the positioning position of the second substrate, and calculate the theoretical position of a first alignment mark on a first substrate based on the position of the second alignment mark when the second alignment mark is located at the preset position in the field of view of the first camera and the positions of the first calibration mark and the second calibration mark in the unified coordinate system; control the second carrier mechanism to drive the second substrate and the second camera to translate synchronously so that the first alignment mark is located in the field of view of the second camera, and control a first carrier mechanism to drive the first substrate to rotate and / or translate so that the first alignment mark approaches the theoretical position of the first alignment mark from an initial position, thereby positioning the first substrate at the positioning position; control the second carrier mechanism to drive the second substrate and the second camera to translate synchronously so that the second substrate is located at the positioning position; adjust the initial correction value of the laser processing area according to the deviation value between the initial position and the theoretical position of the first alignment mark to obtain the current correction value of the laser processing area, and control a laser processing device to perform laser processing according to the current correction value of the laser processing area.

11. A computer device, comprising a memory, a processor, and a computer program stored on the memory and executable on the processor, characterized in that, When the processor executes the program, the method according to any one of claims 1-9 is implemented.

12. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the program is executed by a processor, the method according to any one of claims 1-9 is implemented.

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