6 results about "Laser bonding" patented technology

The invention relates to an enclosure for encapsulating a functional region from the surrounding area, wherein the enclosure comprises a base substrate and a cover substrate, and the base substrate together with the cover substrate forms at least one part of the enclosure or the enclosure. The invention additionally relates to the at least one functional region arranged in the enclosure and to a locking device for reducing permeation between the enclosure and the functional region. The enclosure can have at least one laser bonding line, and the substrates of the enclosure can be joined together in a hermetically sealed manner by means of the at least one laser bonding line. The laser bonding line has a height (HL) perpendicular to the connection plane thereof.

A laser control structure and a laser bonding method using the same are provided. The laser bonding method includes forming a bonding portion on a substrate; disposing a bonding object on the bonding portion; disposing a laser control structure on the bonding object or the substrate; irradiating the bonding object and the bonding portion with laser light; controlling an amount of the laser light absorbed by the laser control structure; heating the bonding portion and the bonding object to a bonding temperature using the controlled amount of the laser light; and bonding the bonding portion with the bonding object. The laser control structure includes a first substrate including a first region and a second region; a first thin film laminate on the first region; and a second thin film laminate on the second region. The first thin film laminate includes at least one first thin film layer and at least one second thin film layer; the second thin film laminate includes at least one third thin film layer and at least one fourth thin film layer; and the first thin film laminate and the second thin film laminate have different reflectivity or absorptivity.

The invention relates to a method for producing a wire, the method having at least the following steps: (i) providing a wire precursor; (ii) pressing recesses on the wire precursor and optionally reshaping the wire precursor in the process, and (iii) annealing the wire precursor provided with recesses to form the wire; wherein the wire has a copper content of at least 95 wt.-%, based on the total weight of the wire. The invention additionally relates to a wire obtainable according to the above-mentioned method, and to the use of a roll to produce the wire and / or to set the roughness at at least one location of the wire.

Laser bonding apparatus, laser bonding tools, and related methods. In one example, a system can include a laser assisted bonding (LAB) tool including a stage block and a laser source facing the stage block. The stage block can be configured to support a first substrate and a first electronic component coupled with the first substrate, the first electronic component including a first interconnect. The laser source can be configured to emit a first laser toward the stage block to induce a first heat on the first interconnect to bond the first interconnect with the first substrate. Other examples and related methods are also disclosed herein.

1. The name of the design product: servo laser pressure welding gun. 2. The use of the design product: for laser safety protection and pressure welding. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: perspective view 1.

The invention relates to a gastight closed housing comprising a base substrate and a cover substrate forming at least one part of the housing, at least one functional area enclosed by the housing, wherein at least the cover substrate preferably comprises a vitreous material, wherein the base substrate and the cover substrate are joined in a gastight manner with at least one laser bond, wherein the laser bond has a height HL perpendicular to its connection plane, wherein at least the cover substrate has a hardening layer, preferably a chemical hardening layer, on its surface at least on the side opposite to the laser bond, wherein the hardening layer preferably exerts compressive stress onto the cover substrate.