91 results about "Laser bonding" patented technology

There is described a method of forming a through-silicon-via to form an interconnect between two stacked semiconductor components using pulsed laser energy. A hole is formed in each component, and each hole is filled with a plug formed of a first metal. One component is then stacked on another component such that the holes are in alignment, and a pulse of laser energy is applied to form a bond between the metal plugs.

A wire harness using a coaxial cable, in which a ground bar and the shield of the coaxial cable are connected at a connection section in an environmentally friendly process and in a manner providing the harness with good electric characteristics. The ground bar (10) is made of a material having a lower melting point than the shield (16). For example, the ground bar (10) is made of brass or aluminum having a lower melting point than copper that forms the shield (16). The ground bar (10) and the shield (16) are connected together by applying a laser beam to the ground bar (10) and laser bonding them together by spots (30). Since the shield (16) has a higher melting point than the ground bar (10), melting of the shield (16) is suppressed because of the use of the laser bonding and, further, thermal damage to an inner dielectric layer under the shield (16) is suppressed. The environment is less affected because solder is not used.

An intermediate member for laser bonding (3) to be sandwiched, in order to bond a first member (2) and a second member (4) using a laser welding method, between the first member (2) made of a material capable of transmitting laser beams and the second member (4) made of a material which is the same as or different from that of the first member (2) before irradiation with laser beams, the intermediate member for laser bonding (3) having tackiness. This intermediate member for laser bonding (3) can be used for bonding of various materials, and thus a high bonding strength can be attained.

Techniques for high speed handling of ultra-small chips (e.g., micro-chips) by selective laser bonding and/or debonding are provided. In one aspect, a method includes: providing a first wafer including chips bonded to a surface thereof; contacting the first wafer with a second wafer, the second wafer including a substrate bonded to a surface thereof, wherein the contacting aligns individual chips with bonding sites on the substrate; and debonding the individual chips from the first wafer using a debonding laser having a small spot size of about 0.5 μm to about 100 μm, and ranges therebetween. A system is also provided that has digital cameras, a motorized XYZ-axis stage, and a computer control system configured to i) control a spot size of the at least one laser source and ii) adjust a positioning of the sample to align individual chips with a target area of the laser.

The IR solid laser for semi-conductor laser pumping comprises: at one light path, a semi-conductor laser bonded with Tm:YAP and Cr:ZnSe crystal, a focus lens, an input lens, a laser medium, and an output lens, wherein the bonded crystal interface forms a Brewster angle with the laser resonant cavity. This invention uses simple structure to output higher power.

A laminate for laser bonding of the present invention contains a bonding sheet that is melted by irradiation of laser light and a first member laminated on one surface of the bonding sheet and formed of a thermoplastic foam. The difference between the melting point of the first member (Mfoam) and the melting point of the bonding sheet (Msheet) (Mfoam−Msheet) is −50° C. to 20° C. and the difference between the melt viscosity of the first member (Vfoam) and the melt viscosity of the bonding sheet (Vsheet) (Vfoam−Vsheet) is 3.0×10⁵ Pa·s to 8.0×10⁵ Pa·s. Preferably, the laminate for laser bonding contains a second member having transparency to laser light laminated on the other surface of the bonding sheet.

A bonding tool for use in a laser bonding apparatus comprises an elongated body portion and a foot portion coupled thereto. The foot portion extends substantially transversely from the body portion and has a laser aperture and a guide channel therethrough. The guide channel is disposed between the body portion and the laser aperture.

The present invention provides a square-wave laser seal pattern made by first directing a laser beam onto an shaft while the shaft is moving in a horizontal direction relative to a laser device so as to create a horizontal laser seal bond segment. Next, with the shaft rotating about a shaft longitudinal axis, the laser beam is directed onto the shaft so as to create a vertical laser seal bond segment. By alternately creating and coupling together a plurality of horizontal and vertical laser seal bond segments, a square-wave laser seal is formed around a circumference of the shaft. The shaft's movement in a horizontal direction relative to a laser beam may be either at a constant speed or a variable speed so as to control the amount of laser energy heat impacting the shaft material.

The invention relates to a photoelectric device encapsulation and laser bonding temperature collection and control system and method. The laser bonding encapsulation adopts K-type thermocouple to collect the temperature. Collected temperature signals are selected by a multipath channel selector switch before AD (analogue-digital) conversion; converted signals are led into a single chip MSP430F149 for processing; and processed data is transmitted to an upper computer for communication and control to automatically regulate the power of laser or the scanning speed of a laser head so as to stabilize the temperature in a laser bonding process of a glass material within a certain range. The control system is mainly applied to photoelectric devices such as organic light-emitting diode (OLED) displays and MEMS (micro-electro-mechanical systems) encapsulated by the glass material, taking the OLED devices as an example for exposition.

The invention discloses a method for preparing cobalt-substituted prealloying powder from regenerated metal. The method comprises the process steps: compounding raw materials, electrolyzing at a room temperature, crushing, screening, detecting and packaging; using the regenerated metal, such as recycled synthetic diamond waste powder accelerant, and the like, as a main raw material; supplementing a suitable amount of metal cobalt and metal iron to an anode basket together; and rinsing, purifying in vacuum after the room-temperature electrolysis step in the process steps and reducing hydrogen at 400 DEG C to 650 DEG C. More than 10 percent of particles in a final product have a sponge appearance, and an electrolyte used in the room-temperature electrolysis step in the process steps can be recycled. The invention has the advantages: 1, the production cost is lower than that of a chemical coprecipitation method by more than 50 percent, and the product quality is stable; 2, the powder appearances comprises the sponge appearance so as to have a large specific surface area; 3, the powder can be applied to laser bonding; 4, the strength is high, and the anti-abrasion performance is good; and 5, the sintering temperature is low, and the range is wide. The method is suitable for being adopted by industrial and mining plants producing the cobalt-substituted prealloying powder.

A process for the production of a reaction chamber assembly, wherein a flat substrate and bottomless reaction chambers are provided, the substrate is first loaded with a biological agent and then the bottomless reaction chambers are bonded glue-free to the substrate, in particular through laser bonding, and liquid-tight reaction chambers, for instance individual wells, individually connected wells, such as strips, or wells in the form of a microtiter plate, are obtained. The present invention further provides a kit comprising a substrate suitable for being loaded with at least one biological agent and at least one bottomless reaction chamber, wherein the kit is suitable for glue-free bonding of the bottomless reaction chamber to the substrate.

A laser bonding method comprises the steps as follows: a frit is arranged in the position of an upper glass substrate according to a preset laser bonding path, wherein a starting section and an ending section of the laser bonding path are arranged oppositely; the upper glass substrate and a lower glass substrate are aligned accurately; and laser encapsulation is conducted along the laser bonding path. With the adoption of the method, the starting section and the ending section of the frit are staggered and arranged oppositely, by the aid of the mobility of the frit in a fused state, the starting section is attached to the ending section, and the starting section and the ending section are attached in a 'line-line' manner instead of closed in a 'point-point' manner, so that the sealing performance of the upper and lower glass substrates can be improved.

The invention provides a sealing shell for a connector and an electrical connector, which can reliably prevent water from intruding from the joint part of the sealing shell due to capillarity. The sealing shell of a connector is inserted into the outer circumferential wall of an electrically-insulating connector housing provided with an electrical connector contact for electromagnetic shield. The sealing shell (1) for the connector is formed into a tubular shape in a way to bend a metal sheet material with a preset size and thickness in a tubular way so as to form inside a hollow hole (12) capable of making the connector housing inserted and make the two ends of the metal sheet material docked. Laser bonding is performed on the docked joint part (1b'). At least one end is made open.

The invention discloses a laser bonding temperature acquisition system for photoelectric device packaging, which comprises a temperature sensor and locating elements thereof, wherein the locatingelements comprise a fixed-position locating element and a variable-position locating element; the temperature sensor, which is used for fixed point temperature measurement, of the fixed-position locating element is fixed onto a corresponding position corresponding to a glass sealing strip, and is used for testing fixed point temperature of the glass sealing strip; a movable part of the variable-position locating element is fixedly connected with other temperature sensors, so that the temperature sensors are limited to move along the periphery of the glass sealing strip; and temperature testing on different points of the glass sealing strip is realized through controlling positions of test points of the temperature sensor. The invention discloses a method for photoelectric device packaging, and through carrying out real-time fixed point temperature acquisition and real-time non-fixed point temperature acquisition on temperature of the glass sealing strip, the output power, the laser beam movement speed and the direction of a laser are controlled. According to the invention, the temperatures at different positions of glass material bonding parts can be simply and conveniently measured in real time, the structure is simple, and the efficiency is high.

A multiple laser optical assembly comprises two laser subassemblies with two lasers bonded on two bases respectively, a polarization beam combiner (PBC), a lens, a mechanical housing and an optical fiber. The two subassemblies are configured to have orthogonal polarization directions from the two lasers and are assembled coaxially. The PBC combines the orthogonal polarized beams from the two lasers. The lens focuses the combined beam and couples into the optical fiber. With such a two laser optical assembly as a building block and a wavelength division multiplexing (WDM) filter to combine the beams from two of such type of two laser optical assembly, one can further build a four laser optical assembly and extend to even more channel multiple laser optical assembly by adding more WDM filters and more similar two laser optical assemblies.

A laser bonding device can rapidly and conveniently remove a cover layer on a lead with cover layer and perform the laser bonding on the lead and a terminal. The laser bonding device can perform laser bonding on the lead with cover layer (10) and the terminal (14). The laser bonding device (20) is provided with a laser device (22) for generating a laser (L), an illuminating position exchanging mechanism (30) for changing the illumination position of the laser (L), and a bonding control unit (40) for controlling the illuminating position exchanging mechanism (30) to illuminate the laser (L) from the laser device (22) to a bonding area surface of the lead with cover layer (10), so as to illuminate the bonding object points of the lead with cover layer (10) and the terminal (14) through the laser (L) from the laser device (22) after covering the bonding area surface and perform the laser bonding on the lead with cover layer (10) and the terminal (14).

The amorphous and/or partially crystalline glass solders are particularly suitable for high-temperature applications, e.g. in fuel cells or sensors in the exhaust gas stream of internal combustion engines. The glass solder is characterized by a linear coefficient of thermal expansion in the temperature range from 20° C. to 300° C. of 8.0×10⁻⁶ K⁻¹ to 11.0×10⁻⁶ K⁻¹ and a hemisphere temperature of 820° C. to 1100° C. and is suitable for laser bonding.

A method for laser bonding is provided in which interfacial strength between two thermoplastic resins or between a resin and a metal is heightened to render tenacious bonding possible, and bonding failures due to a remaining space can be significantly diminished. In order to solve the problem, the method includes, before bonding, a step in which the bonding surface of at least a first thermoplastic resin is subjected to a surface modification treatment to thereby form an oxidized layer that contains a larger number of oxygenic functional groups than in the bulk thermoplastic resin. A liquid intermediate material is interposed between the first thermoplastic resin and a second thermoplastic resin or a metal, and the stack in this state is pressed and bonded by laser irradiation.

A multi-beam laser bonding apparatus includes a laser beam irradiation unit for irradiating a unique laser beam and an optical instrument. The bonding apparatus is for bonding parts by a plurality of bonding media which are separated from each other at a predetermined distance. The optical instrument is positioned on a path of the unique laser beam for splitting the unique laser beam into a plurality of laser beams and focusing the plurality of laser beams onto the respective bonding media. The present invention also discloses a multi-beam laser bonding method with this bonding apparatus.