45 results about "Laser bonding" patented technology

A method of laser bonding glass to metal foil includes contacting a first glass substrate with a first metal foil to create a first contact location; directing a laser beam on the first contact location to bond the first glass substrate to the first metal foil; contacting a second glass substrate with a second metal foil to create a second contact location; and directing the laser beam on the second contact location to bond the second glass substrate to the second metal foil, wherein the first metal foil and the second metal foil each have a thickness from 5 μm to 100 μm, and wherein the laser beam comprises a pulsed laser comprising: a pulse energy from 2.8 μJ to 1000 μJ; and a wavelength such that the first and second glass substrates are substantially transparent to the wavelength.

A method of bonding glass to a material includes contacting a first surface of a glass substrate with a first surface of a layer to form a contact location between the glass substrate and the layer; disposing an optical element optically upstream of the glass substrate; and performing a welding step by directing a laser beam onto the optical element such that the laser beam contacts the optical element, passes through the glass substrate at an oblique angle with respect to the glass substrate, and contacts the contact location to bond the glass substrate with the layer. Directing the laser beam onto the optical element imparts a wavefront aberration effect to the optical element. The laser beam is passed through the glass substrate to impart a wavefront aberration effect to the substrate. The wavefront aberration effect of the optical element counteracts the wavefront aberration effect of the substrate.

An implantable device (1) is provided comprising a housing (2), an electronic or electrical component (4) and at least one antenna (8), wherein the housing (2) is formed by at least two non-metallic substrates (10, 20, 22) which are bonded by means of a laser bonding process, wherein at least one of the non-metallic substrates (10, 20, 22) is a glass substrate (10) and has at least one electrical feed-through configured as a through glass via (30) comprising a conductive rod (32) electrically connecting the inside of the housing (2) to the outside through said glass substrate (10). The conductive rod (32) of the at least one through glass via (30), the at least one electronic or electrical component (4) and the at least one antenna (8) are configured and arranged such that the implantable device (1) has an interference volume I within which a relative change (I) of an MRI signal frequency (II) relative to the frequency of an undisturbed signal (III) caused by the presence of the implantable device (1) is more than 1 x 10-6, a ratio m of the interference volume I to a volume V of the implantable device I / V being less than 40.

A method for designing a laser weld between a base substrate (10) and a cover substrate (14) of an enclosure (1) is proposed, wherein the base substrate (10) has a functional area (20), and the cover substrate (14), which is in contact with the base substrate (10), covers the functional area (20), wherein the base substrate (10) and the cover substrate (14) are directly and hermetically bonded to each other via at least one laser bond line (2), so that the functional area (20) is hermetically enclosed inside the formed enclosure (1). It is provided that a minimum shear force F is required for the bond between the cover substrate (14) and the base substrate (10). min The minimum length L that the laser welding is supposed to withstand is specified by an empirically determined force per laser bond line length P. minfor the total length of all bond lines (2) is determined and a contact area width B is chosen such that a ratio A i / A w formed from a contact surface A i , where the base substrate (10) and the cover substrate (14) can touch, and a laser bonding area A swept over by the laser bonding lines (2) with a width w w in the range of 1 to 10. Further aspects of the invention relate to such an enclosure (1) and a sensor unit and / or medical implant comprising such an enclosure (1).

The invention provides a paying-off method and system for a semiconductor laser bonding wire, and belongs to the technical field of semiconductor laser bonding wire, and the method comprises the steps: winding a gold wire on a wire shaft, and fixing the gold wire on a paying-off motor; nitrogen is introduced to form airflow to blow up the gold wire to keep the gold wire in a suspended state; the sensor detects that the gold wire enters the detection area in real time; the PLC module controls the pay-off motor to rotate anticlockwise to pay off the gold wire with the specified length The airflow blows the gold wire away from the detection area of the sensor; when the inductor detects that no gold wire exists, the PLC is triggered to stop paying off, and the gold wire stably enters the welding device. According to the method, through precise cooperative control of the airflow and the inductor, it is ensured that the gold wire keeps a stable suspension track in the paying-off process, breakage, deviation and position deviation of the gold wire are effectively avoided, the wire welding precision, the production efficiency and the product yield are improved, and reliable guarantee is provided for high-quality wire welding operation of the semiconductor laser.

The invention relates to an enclosure for encapsulating a functional region from the surrounding area, wherein the enclosure comprises a base substrate and a cover substrate, and the base substrate together with the cover substrate forms at least one part of the enclosure or the enclosure. The invention additionally relates to the at least one functional region arranged in the enclosure and to a locking device for reducing permeation between the enclosure and the functional region. The enclosure can have at least one laser bonding line, and the substrates of the enclosure can be joined together in a hermetically sealed manner by means of the at least one laser bonding line. The laser bonding line has a height (HL) perpendicular to the connection plane thereof.

The present invention relates to an apparatus and a method for bonding different materials without damage to a lower base material by using laser irradiation heat and a filler (solder or brazing) for bonding different materials during the manufacture of battery packs. The apparatus for bonding different materials, according to an embodiment of the present invention, comprises: an upper base material arrangement unit for arranging an upper base material at a bonding position; a lower base material arrangement unit for arranging, in an overlapped manner, such that the bonding position of the lower base material faces the bonding position of the upper base material; a bonding material injection unit for injecting, between the upper base material and the lower base material, a bonding material to be melted by conduction heat generated when the upper base material is heated; and a laser irradiation unit for heating the upper base material by irradiating the upper surface of the upper base material with a laser.

The invention discloses an MEMS ionization vacuum sensor based on magnetic field assistance and a manufacturing method thereof, and belongs to the technical field of microelectronics. The sensor comprises a glass substrate, an emitter electrode, a lead electrode, an electron emitter, a first insulating spacer layer, a grid electrode, a second insulating spacer layer, top glass, an ion deflection electrode, an ion collector, an annular electrode and a magnetic field generation part, the manufacturing method comprises the steps of preparation of the substrate and the top glass, bonding of the electron emitter, processing of the insulating spacer layer and the grid electrode, anodic bonding, laser bonding, installation of the magnetic field component and scribing. An electric field-magnetic field composite field is used for remarkably expanding the electron motion trail, the problems that an existing sensor is weak in ion flow and poor in anti-interference capacity are solved by combining the physical isolation design of an ionization and collection area, and the sensor has the advantages of being small in size, high in precision, good in consistency and low in cost and is suitable for the fields of semiconductor manufacturing and aerospace.

The invention discloses a Cf / SiC composite material and metal laser connection method based on surface energy beam treatment, and belongs to the technical field of heterogeneous material connection. The method comprises the following steps: firstly, treating the surface of the Cf / SiC composite material by adopting laser or an electric arc, controlling laser power / electric arc current and scanning speed, ablating a SiC matrix and reserving C fibers to form a convex surface structure of the C fibers, and then preparing the composite material by taking Ti and Ta pure metal or a high-melting-point alloy consisting of the two metal elements as a filling material, and carrying out laser welding on the Cf / SiC composite material subjected to surface treatment and metal under an inert gas shielded welding condition. The surface energy beam treatment method is simple in process and good in flexibility, a'fiber pinning 'interface structure can be obtained, and the bonding strength of a connecting interface can be improved. Local heating of laser welding has little influence on the overall structure / performance of the metal base material, and high-temperature-resistant connection between the Cf / SiC composite material and the metal can be achieved conveniently; and laser welding is good in flexibility and high in efficiency, connection can be achieved in an open environment, and the size of a weldment is not limited.

In an embodiment, a laser bonding assembly includes a glass structure, a metal foil, and a first cover glass. The glass structure includes a first glass substrate defining a first major surface and a second glass substrate defining a second major surface opposite the first major surface. The glass structure further includes a peripheral edge extending about a periphery thereof between the first major surface and the second major surface. The laser bonding assembly further includes a metal foil configured to surround the peripheral edge. The metal foil is connected to the glass structure via a foil-glass laser bond. The laser bonding assembly further includes a first cover glass connected to the glass structure and / or the metal foil. The laser bonding assembly further includes a frame disposed adjacent to the first cover glass. The glass structure and the metal foil are at least partially surrounded by the frame and the first cover glass.

A base substrate of an enclosure has a functional region and a cover substrate covers the functional region. The base substrate and cover substrate are directly connected together in a hermetically tight manner via at least one laser bonding line so the functional region is hermetically enclosed in the enclosure. For the connection between the substrates a minimum shear force is specified that the laser weld connection is to withstand, a minimum length is determined, by an empirically determined force per laser bonding line length P, for the total length of all bonding lines, and a contact surface width B is selected such that a ratio Ai / Aw, formed from a contact surface Ai, at which the base substrate and the cover substrate can touch one another, and a laser bonding surface Aw covered by the laser bonding lines with a width w, is in the range from 1 to 10.

A laser control structure and a laser bonding method using the same are provided. The laser bonding method includes forming a bonding portion on a substrate; disposing a bonding object on the bonding portion; disposing a laser control structure on the bonding object or the substrate; irradiating the bonding object and the bonding portion with laser light; controlling an amount of the laser light absorbed by the laser control structure; heating the bonding portion and the bonding object to a bonding temperature using the controlled amount of the laser light; and bonding the bonding portion with the bonding object. The laser control structure includes a first substrate including a first region and a second region; a first thin film laminate on the first region; and a second thin film laminate on the second region. The first thin film laminate includes at least one first thin film layer and at least one second thin film layer; the second thin film laminate includes at least one third thin film layer and at least one fourth thin film layer; and the first thin film laminate and the second thin film laminate have different reflectivity or absorptivity.

The invention provides a laser bonding structure based on a nonmetal inorganic material and a de-bonding method, and relates to the technical field of semiconductors. The laser bonding structure comprises a first stacking piece, a second stacking piece and a de-bonding layer, wherein the de-bonding layer is arranged between the first stacking piece and the second stacking piece; the material characteristics of the first stacked sheet include allowing laser of a target wavelength to pass through; the material characteristic of the de-bonding layer comprises a non-metal inorganic material, and the de-bonding layer has an absorption peak on the laser at the target wavelength. According to the laser bonding structure, the stacking sheet is used as a temporary carrier, and the inorganic non-metal material is used as a de-bonding layer material, so that the fragment risk can be reduced, and the environmental protection problem of chemical corrosion can be solved.

To provide a bonding device capable of removing deposits attached to a biasing member located at the rear in the direction of movement of the workpiece heating section. [Solution] The laser bonding apparatus 1 comprises a workpiece heating unit 100, a forward biasing member 200F, a rear biasing member 200R, and a rear cleaning unit 300R for cleaning the rear biasing member. The rear biasing member 200R includes a biasing unit 210 capable of applying biasing force to workpieces W1 and W2, a support 220 connected to the biasing unit, and a rotating pressing body 230 supported by the support so as to be rotatable relative to the support, which presses the workpiece. The rear cleaning unit 300R removes any deposits adhering to the surface of the rotating pressing body 230.

The present disclosure provides a miniaturized all-solid-state laser and a laser detection system, which comprises: a shift signal generation module (1) for generating multiple shift square wave signals; a multiple pulse constant current driving module (2) for converting the multiple shift square wave signals into multiple constant pulse currents; a semiconductor laser array pumping module (3) for generating multiple pumping light signals according to the multiple constant pulse current driving mode; a laser bonding crystal (4) for converting the multiple pumping light signals into multiple laser pulse signals through a passive Q-switching mode; a micro detection array module (5) for monitoring the multiple laser pulse signals and generating multiple negative pulse electrical signals synchronized with the multiple laser pulse signals; an optical synchronization signal feedback module (6) for converting the multiple negative pulse electrical signals into negative pulse synchronization feedback signals and inputting the negative pulse synchronization feedback signals into the multiple pulse constant current driving module (2) to form a negative feedback network; and an optical distribution module (7) for changing the propagation direction of the multiple laser pulse signals.

The utility model provides a leveling device which comprises a jig, a bottom plate, a connecting block, a standard block and a heat insulation leveling mechanism, the standard block and the heat insulation leveling mechanism are arranged between the jig and the bottom plate, and the heat insulation leveling mechanism is used for adjusting the distance between the jig and the bottom plate; the connecting block is connected to the jig and the side wall of the heat insulation leveling mechanism so that the jig and the heat insulation leveling mechanism can be fixedly connected. The number of the standard blocks is at least three; the heat insulation leveling mechanism comprises a heat insulation assembly and an adjusting assembly, and the heat insulation assembly is located at the top of the adjusting assembly. According to the utility model, the problem that the flatness of the surface of a jig is damaged due to processing errors of a traditional heat insulation device in the application of a Micro laser bonding process jig is solved.

The invention discloses a preparation method of a micro-fluidic channel with gradient hydrophilicity and a micro-fluidic chip, the surface gradient hydrophilicity is realized through plasma gradient treatment on a PDMS (polydimethylsiloxane) micro-channel layer, and a powerful and unidirectional surface energy gradient pump is formed; self-driving and directional transportation of a liquid sample can be realized; even if the sample size is extremely low, to-be-detected liquid can be efficiently driven to reach a detection area; laser bonding is carried out through gold nanoparticles, the process conflict between functional surface treatment and sealing bonding is solved, the prefabricated gradient hydrophilic surface is perfectly reserved through the non-contact and local heating characteristics of gold nanoparticle LSPR bonding, meanwhile, thermal damage of laser to a channel is avoided, the process repeatability is good, and the yield is high.

The invention relates to a method for producing a wire, the method having at least the following steps: (i) providing a wire precursor; (ii) pressing recesses on the wire precursor and optionally reshaping the wire precursor in the process, and (iii) annealing the wire precursor provided with recesses to form the wire; wherein the wire has a copper content of at least 95 wt.-%, based on the total weight of the wire. The invention additionally relates to a wire obtainable according to the above-mentioned method, and to the use of a roll to produce the wire and / or to set the roughness at at least one location of the wire.

This invention provides a method for simulating the temperature field of laser bonding between composite materials and metals, belonging to the field of advanced laser manufacturing. For the laser bonding process of composite materials and metals, a finite element three-dimensional model of continuous fiber-reinforced resin matrix composite material and metal laser bonding is established. The composite material part is layered according to the actual sample, and the material physical properties are set to anisotropy based on the layup method and orientation of the fiber prepreg tape. This allows for accurate prediction of the temperature field distribution during the laser bonding process of the heterogeneous structure joint between composite materials and metals. This invention has high universality, accurately reflecting the influence of continuous fibers on the temperature field during the laser bonding process between composite materials and metals. By calculating the temperature field of the laser-bonded joint of continuous fiber-reinforced resin matrix composite material and metal, the laser bonding process window can be predicted, providing predictive and guiding functions for practical engineering and scientific research.

Provided are a laser bonding device, a laser bonding method, and an electronic device. According to an embodiment, the laser bonding apparatus comprises: a stage for supporting a first substrate; a pressing module for fixing a plurality of elements disposed on the first substrate, the elements being at least one of a light-emitting element, an integrated circuit, and a driving circuit; a laser emitter for emitting a laser beam to a conductive adhesive pattern disposed between the first substrate and the plurality of elements; and a mask disposed on the upper portion of the first substrate and having openings overlapping the plurality of elements. The laser emitter may emit a laser beam of first power for a first period of time and may emit a laser beam of second power higher than the first power for a second period of time.

The utility model relates to the technical field of film laser bonding, and discloses an automatic film laser bonding device which comprises an automatic film laser bonding device body, a laser welding head is arranged at the top end of the automatic film laser bonding device body, and a clamping mechanism is arranged on one side of the automatic film laser bonding device body. Through the arranged clamping mechanism, a user places a base plate on a limiting base, then a motor is started, the output end of the motor drives a lead screw to rotate, the lead screw drives movable supports at the two ends to move, and the two movable supports drive two push plates to be close to each other; the two push plates push the multiple compression springs to enable the clamping plates to be attached to the two ends of the base plate, and due to the fact that the compression springs have certain elasticity, the compression springs can provide proper buffering force and are matched with a rubber pad at the bottom, and unnecessary damage to the base plate in the clamping process is effectively prevented.

A package for encapsulating a functional area against an environment includes a base substrate and a cover substrate, the base substrate together with the cover substrate defining at least part of the package or defining the package, and furthermore including the at least one functional area provided in the package, and a blocking way for reducing permeation between the environment and the functional area. The package may include at least one laser bonding line, and the substrates of the package can be hermetically joined to one another by the at least one laser bonding line, and the laser bonding line has a height (HL) perpendicular to its bonding plane.

Provided is a method of manufacturing an image sensor package, the method including preparing a device wafer including a plurality of chip portions and a scribe lane, forming a redistribution insulating film on a lower surface of the device wafer to cover a redistribution pattern and a portion of the redistribution pattern and to cover a lower surface of the device wafer, forming a redistribution pattern on a lower surface of the device wafer and a redistribution insulating film to cover a portion of the redistribution pattern and to cover a lower surface of the device wafer, placing a preliminary transparent substrate on an upper surface of the device wafer on which the preliminary dam pattern is formed, performing a laser bonding process of radiating a laser beam to the preliminary dam pattern, and performing a singulation process forming individual image sensor packages.

Laser bonding apparatus, laser bonding tools, and related methods. In one example, a system can include a laser assisted bonding (LAB) tool including a stage block and a laser source facing the stage block. The stage block can be configured to support a first substrate and a first electronic component coupled with the first substrate, the first electronic component including a first interconnect. The laser source can be configured to emit a first laser toward the stage block to induce a first heat on the first interconnect to bond the first interconnect with the first substrate. Other examples and related methods are also disclosed herein.

A laser bonding device includes: a support unit configured to fix a substrate thereon; a pressurized head module configured to fix a light emitting element as a bonding object; a laser generating unit configured to irradiate a laser beam to a bonding member for bonding the light emitting element and the substrate; a temperature sensor configured to measure the temperature of the bonding member; and a control unit configured to control a power and time of a laser beam irradiated to the light emitting element based on data received from the temperature sensor.

The invention relates to a method for producing a cohesive laser bonding connection, in which a bonding element (2) is provided in a first method step, the bonding element (2) being made of a first material, and in a second method step, a contact element (3) is provided, the contact element (3) being made of a second material, and in a third method step, the bonding element (2) and the contact element (3) are joined together under the action of a laser (5), wherein a protective gas is supplied to the joining site (15) and the laser (5) is supplied away from the joining site (15).

The invention provides a tile-type phased-array antenna based on a glass substrate and a preparation method thereof, and relates to the technical field of communication. According to the invention, the first feed signal holes and the second feed signal holes are formed in the plurality of glass base layers, and the plurality of glass base layers are stacked in a laser bonding manner to form the integrated structure, that is, the plurality of glass base layers are firstly punched and then stacked, so that complex staggered holes can be formed; the technology that staggered holes of a traditional PCB multi-layer board are difficult to form, the number of times of pressing is large, the waste board rate is high due to the multiple staggered holes, and blind buried holes need back drilling, hole plugging and flat plating and the like is broken through, and the cost is reduced. Besides, due to the fact that only the glass substrate is used and liquid crystal materials are not used, instability caused by liquid crystals is avoided, and stability of the tile-type phased-array antenna is improved.

The invention discloses a method for judging lamination of a substrate and a carrier plate in Micro-LED mass bonding, which comprises the following steps of: calibrating a distance between a distance meter and a camera by using a calibration plate, establishing a position coordinate relationship between the distance meter and the camera, leveling the parallelism between a quartz glass plate and a jig plate, collecting the minimum Gap value of four corners of the substrate and the carrier plate as a lamination Gap value, and determining the lamination of the substrate and the carrier plate according to the lamination Gap value. The substrate and the carrier plate start to be attached by referring to the Gap value, the numerical value of the pressure sensor is read at the same time, laser bonding is started when the numerical value reaches a set threshold value and the press-fit Z axis stops pressing and is kept at the position, and the attaching force of the substrate and the carrier plate is adjusted in real time through movement of the movement shaft according to the read value of the pressure sensor after the substrate and the carrier plate are heated to expand in the laser bonding stage. And the pressure value is kept at a set threshold value, and fitting is completed. By means of the synergistic effect of optical ranging and pressure monitoring, uniform attachment of the substrate and the carrier plate is achieved, the pressure can be adjusted in real time in the bonding process, and the bonding yield of products is effectively guaranteed.

A thin film for semiconductor laser bonding includes a solder layer that contains 7.2-14.0 wt % Au, 0.1-4.4 wt % Ag, and 0.1-10.1 wt % Cu with the remainder except unavoidable impurities being Sn.

The present invention provides a package for thermally sealing functional regions, comprising: a bottom substrate; a cover substrate, wherein the bottom substrate and the cover substrate together form at least a portion of the package or form the package; at least one functional region, such as a cavity, hermetically sealed by the package, wherein the package includes at least one laser bonding line, and the substrates of the package are hermetically bonded to each other through the at least one laser bonding line; wherein the laser bonding line has a height HL perpendicular to its bonding surface; wherein heat can be generated in the functional region of the package; and wherein at least the bottom substrate and / or the cover substrate are in the form of thermal insulators.