Mechanical performance diagnosis method, device, terminal, medium and wafer robot of wafer robot

Abstract

The present invention provides a mechanical performance diagnosis method, device, terminal, medium and wafer robot for a wafer robot. By acquiring the vibration data collected by the vibration collection devices corresponding to the internal screening settings of each moving mechanical mechanism of the wafer robot when the moving mechanical mechanism is operating independently during normal handling work, the mechanical performance diagnosis and analysis of each moving mechanical mechanism is performed respectively. The present invention installs the required vibration collection device inside each moving mechanical mechanism. The sensor itself is small in size and light in weight, and will not affect the original size and moment of inertia of the mechanical mechanism. The vibration data collected by the vibration collection device is of great significance for the fault diagnosis and remaining life prediction of each moving mechanical mechanism. With the development of industrial control technology, advanced algorithms are used to perform fault diagnosis and equipment health status monitoring to ensure the operational reliability and accuracy of the wafer robot.

Description

Technical Field

[0001] The present invention relates to the field of wafer handling robots, and in particular to a mechanical performance diagnosis method, device, terminal, medium and wafer robot of a wafer robot. Background Art

[0002] The wafer handling robot is a high-precision device, and its transmission system consists of a servo motor, a reducer, a synchronous pulley, etc. The rolling bearing of the transmission component is the "joint" of the transmission system and plays a key role in the slewing bearing. However, due to the long-term operation of the bearing under high speed, heavy load, and uneven force conditions, wear, pitting, and even cage breakage often occur. At present, wafer robots are basically diagnosed after a fault occurs, that is, they are only checked when there is a problem with the equipment operation or a significant deviation in the product yield. At this time, the losses caused are relatively serious, and there is a problem of difficulty in troubleshooting. Summary of the invention

[0003] In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a method, device, terminal, medium and wafer robot for diagnosing the mechanical properties of a wafer robot, so as to solve the above-mentioned problems of the prior art.

[0004] To achieve the above-mentioned purpose and other related purposes, the present invention provides a method for diagnosing the mechanical properties of a wafer robot, the method comprising: obtaining vibration data collected by vibration collection devices arranged at corresponding screening positions inside each moving mechanical mechanism of the wafer robot when the moving mechanical mechanisms of the wafer robot operate independently during normal handling work; based on the vibration data respectively collected by each vibration collection device, performing mechanical performance diagnosis and analysis on each moving mechanical mechanism respectively, so as to obtain mechanical performance diagnosis and analysis results of each moving mechanical mechanism in the wafer robot.

[0005] In one embodiment of the present invention, multiple different alternative positions in each motion mechanical mechanism are respectively provided with the same vibration collection device; and the screening position setting method of the vibration collection device of each motion mechanical mechanism includes: obtaining normal vibration data and abnormal vibration data respectively collected by the vibration collection devices arranged at each alternative position when each motion mechanical mechanism uses normal performance transmission components and abnormal transmission components to operate separately; from the alternative positions where the vibration collection devices in each motion mechanical mechanism are located, the alternative position where the difference between normal vibration data and abnormal vibration data is the largest is selected as the screening position of the vibration collection device finally set in the corresponding motion mechanical mechanism.

[0006] In one embodiment of the present invention, each motion mechanical mechanism in the wafer robot includes: a lifting mechanism, a first mechanical arm mechanism, a second mechanical arm mechanism, a first end effector mechanism and a second end effector mechanism, each of which is provided with a vibration collection device at an internal screening position; wherein the lifting mechanism includes: a lifting motor, which is used to drive the first mechanical arm mechanism, the second mechanical arm mechanism, the first end effector mechanism and the second end effector mechanism to move up and down along the lifting axis in combination with a lead screw; the first mechanical arm mechanism includes: a first rotating shaft motor, which is used to drive the second mechanical arm mechanism, the first end effector mechanism and the second end effector mechanism in combination with a synchronous pulley The structure and the second end actuator mechanism rotate around the first rotation axis; the second robot arm mechanism includes: a second shaft motor, which is used to drive the first end actuator mechanism and the second end actuator mechanism to rotate around the second rotation axis in combination with the synchronous belt pulley; the first end actuator mechanism includes: a third shaft motor, which is used to drive the first end actuator to rotate around the third rotation axis in combination with the synchronous belt pulley; the second end actuator mechanism includes: a fourth shaft motor, which is used to drive the second end actuator to rotate around the third rotation axis in combination with the synchronous belt pulley; and wherein the lifting axis is parallel to the first rotation axis, the second rotation axis and the third rotation axis.

[0007] In one embodiment of the present invention, the alternative positions of the lifting mechanism, the first end effector mechanism and the second end effector mechanism are respectively arranged at different positions in the lifting mechanism, the first end effector mechanism and the second end effector mechanism; the alternative positions of the first robotic arm mechanism are respectively arranged in the first robotic arm mechanism and are located at different positions between the first rotating axis and the second rotating axis; the alternative positions of the second robotic arm mechanism are respectively arranged in the second robotic arm mechanism and are located at different positions between the second rotating axis and the third rotating axis; the normal performance transmission components and the abnormal transmission components of the lifting mechanism adopt normal lead screws and abnormal lead screws respectively; the normal performance transmission components and the abnormal transmission components of the first robotic arm mechanism, the second robotic arm mechanism, the first end effector mechanism and the second end effector mechanism adopt normal synchronous pulleys and abnormal synchronous pulleys respectively.

[0008] In one embodiment of the present invention, the mechanical performance diagnosis and analysis of each moving mechanical mechanism is performed based on the vibration data respectively collected by each vibration collection device to obtain the mechanical performance diagnosis and analysis results of each moving mechanical mechanism in the wafer robot, including: judging whether the data volume of the vibration data respectively collected by each vibration collection device exceeds the standard data volume; performing data processing operations on the vibration data exceeding the standard data volume to obtain the corresponding mechanical performance diagnosis and analysis results.

[0009] In one embodiment of the present invention, data processing operations are performed on vibration data that exceeds the standard data volume to obtain corresponding mechanical performance diagnostic analysis results, including: based on a trained machine learning model, data processing operations are performed according to the input vibration data that exceeds the standard data volume, and corresponding mechanical performance diagnostic analysis results are output.

[0010] In one embodiment of the present invention, the data processing operation includes: calculating the corresponding absolute mean, root mean square value, standard deviation and kurtosis of the amplitude and acceleration data of the X, Y and Z axes in each vibration data exceeding the standard data volume; based on the fault diagnosis conditions, judging the mechanical performance diagnosis and analysis results of the corresponding moving mechanical mechanism according to the absolute mean, root mean square value, standard deviation and kurtosis of each axis in each vibration data.

[0011] In one embodiment of the present invention, the data processing operation includes: performing Fourier transform on the X, Y and Z axis data in each vibration data exceeding the standard data volume, and then performing time-frequency conversion to obtain a spectrum diagram of the corresponding vibration acquisition device; extracting the frequency and amplitude of each spectrum diagram to determine whether the corresponding spectrum diagram has a fault frequency characteristic, so as to obtain the mechanical performance diagnosis and analysis results of the corresponding moving mechanical mechanism.

[0012] To achieve the above-mentioned purpose and other related purposes, the present invention provides a mechanical performance diagnostic device for a wafer robot, the device comprising: a data acquisition module, used to obtain vibration data collected by vibration collection devices arranged at corresponding screening positions inside each moving mechanical mechanism of the wafer robot when the moving mechanical mechanisms of the wafer robot operate independently during normal handling work; a mechanical performance diagnostic module, connected to the data acquisition module, used to perform mechanical performance diagnostic analysis on each moving mechanical mechanism based on the vibration data collected by each vibration collection device, so as to obtain mechanical performance diagnostic analysis results of each moving mechanical mechanism in the wafer robot.

[0013] To achieve the above-mentioned objectives and other related objectives, the present invention provides a mechanical performance diagnostic terminal for a wafer robot, comprising: one or more memories and one or more processors; the one or more memories are used to store computer programs; the one or more processors are connected to the memories and are used to run the computer programs to execute the mechanical performance diagnostic method of the wafer robot.

[0014] To achieve the above-mentioned purpose and other related purposes, the present invention provides a computer-readable storage medium storing a computer program, which executes the mechanical performance diagnosis method of the wafer robot when executed by one or more processors.

[0015] To achieve the above-mentioned purpose and other related purposes, the present invention provides a wafer robot, comprising: a lifting mechanism, a first robotic arm mechanism, a second robotic arm mechanism, a first end effector mechanism and a second end effector mechanism, each of which has a vibration collection device arranged at a screening position; wherein the vibration collection devices in the lifting mechanism, the first robotic arm mechanism, the second robotic arm mechanism, the first end effector mechanism and the second end effector mechanism are respectively communicated with the mechanical performance diagnosis device of the wafer robot, so as to perform mechanical performance diagnosis and analysis on the lifting mechanism, the first robotic arm mechanism, the second robotic arm mechanism, the first end effector mechanism and the second end effector mechanism of the wafer robot.

[0016] As described above, the present invention is a mechanical performance diagnosis method, device, terminal, medium and wafer robot of a wafer robot, which has the following beneficial effects: the present invention performs mechanical performance diagnosis and analysis on each moving mechanical mechanism by acquiring vibration data collected by the corresponding internal vibration collection devices of each moving mechanical mechanism of the wafer robot when the moving mechanical mechanism is operating independently during normal handling work. The present invention installs the required vibration collection device inside each moving mechanical mechanism, and the sensor itself is small in size and light in weight, and will not affect the original size and moment of inertia of the mechanical mechanism. Moreover, the vibration data collected by the vibration collection device is of great significance for the fault diagnosis and remaining life prediction of each moving mechanical mechanism. With the development of industrial control technology, advanced algorithms are used to perform fault diagnosis and equipment health status monitoring to ensure the operational reliability and accuracy of the wafer robot. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 Shown is a flow chart of a method for diagnosing mechanical properties of a wafer robot in one embodiment of the present invention.

[0018] Figure 2 Shown is a schematic structural diagram of a wafer robot in one embodiment of the present invention.

[0019] Figure 3 Shown is a flow chart of a method for diagnosing mechanical properties of a CA124 intelligent semiconductor robot in one embodiment of the present invention.

[0020] Figure 4 Shown is a schematic structural diagram of a mechanical property diagnostic device for a wafer robot in one embodiment of the present invention.

[0021] Figure 5 Shown is a schematic diagram of the structure of a mechanical performance diagnosis terminal of a wafer robot in one embodiment of the present invention.

[0022] Figure 6 Shown is a schematic diagram of communication between a vibration collection device and a mechanical performance diagnosis device in one embodiment of the present invention. DETAILED DESCRIPTION

[0023] The following describes the embodiments of the present invention by specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the following embodiments and features in the embodiments can be combined with each other without conflict.

[0024] It should be noted that in the following description, reference is made to the accompanying drawings, which describe several embodiments of the present invention. It should be understood that other embodiments may also be used, and that mechanical composition, structural, electrical and operational changes may be made without departing from the spirit and scope of the present invention. The following detailed description should not be considered restrictive, and the scope of the embodiments of the present invention is limited only by the claims of the published patents. The terms used herein are only for describing specific embodiments and are not intended to limit the present invention. Spatially related terms, such as "upper", "lower", "left", "right", "below", "below", "lower", "above", "upper", etc., may be used in the text to facilitate the description of the relationship between an element or feature shown in the figure and another element or feature.

[0025] Throughout the specification, when a part is said to be "connected" to another part, this includes not only the case of "direct connection" but also the case of "indirect connection" by placing other elements therebetween. In addition, when a part is said to "include" a certain constituent element, unless otherwise stated, it does not exclude other constituent elements, but means that other constituent elements may be included.

[0026] The terms first, second and third mentioned herein are used to describe various parts, components, regions, layers and / or segments, but are not limited thereto. These terms are only used to distinguish a certain part, component, region, layer or segment from other parts, components, regions, layers or segments. Therefore, the first part, component, region, layer or segment described below may refer to the second part, component, region, layer or segment within the scope of the present invention.

[0027] Furthermore, as used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless there is an indication to the contrary in the context. It should be further understood that the terms "comprise", "include" indicate the presence of the described features, operations, elements, components, items, kinds, and / or groups, but do not exclude the presence, occurrence or addition of one or more other features, operations, elements, components, items, kinds, and / or groups. The terms "or" and "and / or" used herein are interpreted as inclusive, or mean any one or any combination. Therefore, "A, B or C" or "A, B and / or C" means "any of the following: A; B; C; A and B; A and C; B and C; A, B and C". Exceptions to this definition will only occur when the combination of elements, functions or operations is inherently mutually exclusive in some way.

[0028] The fault diagnosis of rolling bearings in the mechanical industry has gone through three stages. Initially, the fault diagnosis was based on the experience of experts. Later, it relied on the emergence of sensors, and the diagnostic method based on analytical model driving gradually emerged. Now, the most widely used method is data-driven, including multivariate analysis, signal processing, machine learning, deep learning, etc. Fault diagnosis based on signal processing mainly includes temperature signals, sound signals, oil signals and vibration signals, among which vibration signals are the most widely used. Vibration signals are analyzed in time domain, frequency domain or time-frequency domain to diagnose mechanical performance and predict life.

[0029] When a transmission component of a moving mechanical mechanism fails, its vibration signal will change regularly. The vibration data collected by the vibration acquisition device can usually contain fault characteristics. Therefore, the vibration signal is used for fault diagnosis, mainly by extracting the fault characteristics in the signal to identify the fault type. At the same time, because the vibration signal contains characteristic information that can reflect the degradation trend of the transmission component, the use of the vibration signal can realize the prediction of the remaining life of the transmission component.

[0030] Therefore, the mechanical performance diagnosis method of a wafer robot of the present invention performs mechanical performance diagnosis and analysis on each moving mechanical mechanism by acquiring vibration data collected by the corresponding internal vibration collection devices of each moving mechanical mechanism of the wafer robot when the moving mechanical mechanisms of the wafer robot are operating independently during normal handling work. The present invention installs the required vibration collection device inside each moving mechanical mechanism. The sensor itself is small in size and light in weight, and will not affect the original size and moment of inertia of the mechanical mechanism. Moreover, the vibration data collected by the vibration collection device is of great significance for the fault diagnosis and remaining life prediction of each moving mechanical mechanism. With the development of industrial control technology, advanced algorithms are used to perform fault diagnosis and equipment health status monitoring to ensure the operational reliability and accuracy of the wafer robot.

[0031] The following is a detailed description of the embodiments of the present invention with reference to the accompanying drawings so that those skilled in the art can easily implement the present invention. The present invention can be embodied in many different forms and is not limited to the embodiments described herein.

[0032] like Figure 1 A schematic flow chart showing a method for diagnosing mechanical properties of a wafer robot in an embodiment of the present invention.

[0033] The wafer robot is provided with a plurality of motion mechanical mechanisms, each of which has a motor. The internal motor and transmission component are combined to drive the mechanical arm to move, so that the wafer robot can perform wafer handling work with multiple degrees of freedom.

[0034] The method comprises:

[0035] Step S101: Acquire vibration data collected by vibration collection devices disposed at corresponding screening positions inside each motion mechanical mechanism of the wafer robot when the motion mechanical mechanism operates independently during normal handling work.

[0036] In detail, each corresponding screening position inside each motion mechanical mechanism in the wafer robot is respectively provided with a screening vibration collection device; the vibration collection device can be any device that can collect vibration data, such as a vibration sensor or an inertial measurement unit.

[0037] When the wafer robot performs normal wafer handling work, the vibration collection device of each motion mechanical mechanism collects current vibration data when each motion mechanical mechanism operates independently, and acquires the vibration data collected by each motion mechanism over a period of time.

[0038] In one embodiment, the vibration data collected by each vibration collection device includes: the amplitude and acceleration data of the X, Y, and Z axes established with the installation position of the current collection device as the origin; and each vibration collection device can set corresponding collection parameters, such as the data set time for each collection is 2s, the frequency of data collection is 50Hz, and the amount of data collected each time is 100. After each collection, at least 1 hour interval is required for collection again.

[0039] In one embodiment, the same vibration collection device is respectively provided at a plurality of different candidate positions in each motion mechanical mechanism; and the screening position setting method of the vibration collection device of each motion mechanical mechanism includes:

[0040] The normal vibration data and abnormal vibration data collected by the vibration collection devices arranged at each alternative position when each motion mechanical mechanism respectively adopts the transmission components with normal performance and the abnormal transmission components to operate independently are obtained; specifically, a plurality of vibration collection devices of the same model are arranged at different screening positions in each motion mechanical mechanism; and when the corresponding motion mechanical mechanism adopts the transmission components with normal performance and the motor in the mechanism operates independently, and the motors of other mechanical mechanisms stop running, all the vibration collection devices at each alternative position of the corresponding motion mechanical mechanism respectively collect and save the corresponding normal vibration data, and add a time stamp to facilitate comparison of each position; after the collection, the transmission components of the corresponding motion mechanical mechanism are replaced with abnormal transmission components, and then the corresponding single machine is controlled to operate independently, and the motors of other mechanical mechanisms stop running. At this time, all the vibration collection devices of the motion mechanical mechanism respectively collect the corresponding abnormal vibration data.

[0041] The candidate positions where the vibration collection devices in each motion mechanical mechanism have the largest difference between normal vibration data and abnormal vibration data are selected from the candidate positions where the vibration collection devices in each motion mechanical mechanism are located as the selection positions of the vibration collection devices finally set in the corresponding motion mechanical mechanism. Specifically, the normal vibration data collected by each vibration collection device in each candidate position is compared with the abnormal vibration data, and the candidate position where the vibration collection device where the difference between normal vibration data and abnormal vibration data collected by each motion mechanical mechanism is the largest is selected as the selection position of the vibration collection device finally set in the corresponding motion mechanical mechanism.

[0042] In one embodiment, if Figure 3 As shown, each motion mechanical mechanism in the wafer robot includes: a lifting mechanism 1, a first mechanical arm mechanism 2, a second mechanical arm mechanism 3, a first end effector mechanism 4 and a second end effector mechanism 5;

[0043] The lifting mechanism 1, the first mechanical arm mechanism 2, the second mechanical arm mechanism 3, the first end effector mechanism 4 and the second end effector mechanism 5 are respectively provided with a vibration collection device at the internal screening position.

[0044] Among them, the lifting mechanism 1 includes: a lifting motor 11, which is used to drive the first robotic arm mechanism 2, the second robotic arm mechanism 3, the first end effector mechanism 4 and the second end effector mechanism 5 to move up and down along the lifting axis J1 in combination with the lead screw 12; specifically, the lifting mechanism 1 can control the first robotic arm in the first robotic arm mechanism 2, the second robotic arm in the second robotic arm mechanism 3, the first end effector in the first end effector mechanism 4, and the second end effector of the second end effector mechanism 5 to move up and down along the lifting axis J1.

[0045] The first robotic arm mechanism 2 includes: a first shaft motor 21, which is used to drive the second robotic arm mechanism 3, the first end effector mechanism 4 and the second end effector 5 to rotate around the first rotation axis J2 in combination with a synchronous pulley (not shown in the figure); specifically, the first robotic arm mechanism 2 can control the first robotic arm to rotate around the first rotation axis J2, and drive the second robotic arm in the second robotic arm mechanism 3, the first end effector in the first end effector mechanism 4, and the second end effector of the second end effector mechanism 5 to rotate around the first rotation axis J2.

[0046] The second robotic arm mechanism 3 includes: a second shaft motor 31, which is used to drive the first end effector mechanism and the second end effector mechanism to rotate around the second rotation axis J3 in combination with the synchronous pulley 32; specifically, the second robotic arm mechanism 3 can control the second robotic arm to rotate around the second rotation axis J3, and drive the first end effector in the first end effector mechanism 4 and the second end effector of the second end effector mechanism 5 to rotate around the second rotation axis J3.

[0047] The first end effector mechanism 4 includes: a third shaft motor 41, which is used to drive the first end effector to rotate around the third rotation axis J4 in conjunction with the synchronous pulley 42; specifically, the first end effector mechanism 4 can control the first end effector to rotate around the third rotation axis J4.

[0048] The second end effector mechanism 5 includes: a fourth shaft motor 41, which is used to drive the second end effector to rotate around the third rotation axis J4 in conjunction with the synchronous pulley 42; specifically, the second end effector mechanism 5 can control the second end effector to rotate around the third rotation axis J4, forming an angle with the first end effector to clamp the wafer to be taken.

[0049] And wherein, the lifting axis J1 is parallel to the first rotation axis J2, the second rotation axis J3 and the third rotation axis J4.

[0050] In this embodiment, step S101 includes:

[0051] Obtain vibration data collected by vibration collection devices set at corresponding screening positions of the wafer robot's lifting mechanism 1, first robotic arm mechanism 2, second robotic arm mechanism 3, first end effector mechanism 4 and second end effector mechanism 5 when they operate separately during normal handling work.

[0052] In one embodiment, if Figure 2 As shown, the setting method of the screening position of the vibration collection device based on the lifting mechanism 1, the first mechanical arm mechanism 2, the second mechanical arm mechanism 3, the first end effector mechanism 4 and the second end effector mechanism 5 of the above-mentioned wafer robot is as follows:

[0053] The method for setting the screening position of the vibration collection device of the lifting mechanism 1 includes: selecting multiple positions in the lifting mechanism 1 as alternative positions, and placing the same type of vibration collection device at each alternative position. Then let the lifting motor 11 of the lifting mechanism 1 using a normal lead screw move, and the motors in other mechanisms are stopped. At this time, the vibration data are collected and saved by using the vibration collection devices of the lifting structure, and timestamps are added for comparison of each position. At this time, the normal vibration data of the lifting mechanism 1 when the wafer robot is operating normally is obtained. Then replace the lead screw on the lifting axis J1 with an abnormal lead screw, repeat the above test again, and compare the obtained abnormal vibration data together; use the alternative position with the largest difference in vibration data between the normal lead screw and the abnormal lead screw as the screening position for installing the vibration sensor, for example Figure 2 The middle vibration sensor 10 is a vibration sensor 10 provided at the screening position of the lifting mechanism 1 .

[0054] The method for setting the screening position of the vibration collection device of the first robot arm mechanism 2 includes: selecting multiple positions in the first robot arm mechanism 2 and between the first rotating axis J2 and the second rotating axis J3 as alternative positions, and placing the same type of vibration collection device at each alternative position. Then, the first shaft motor 21 of the first robot arm mechanism 2 using a normal synchronous pulley is moved, and the motors in other mechanisms are stopped. At this time, the vibration data is collected and saved using the vibration collection devices of the first robot arm mechanism 2, and a timestamp is added for comparison of each position. At this time, the normal vibration data of the first robot arm mechanism 2 when the wafer robot is operating normally is obtained. Then, the synchronous pulley on the first rotating axis J2 is replaced with an abnormal synchronous pulley, and the above test is repeated again, and the obtained abnormal vibration data are compared together; the alternative position with the largest difference in vibration data between the normal synchronous pulley and the abnormal synchronous pulley is used as the screening position for installing the vibration sensor, for example Figure 2 The middle vibration sensor 20 is a vibration sensor 20 set at the screening position of the first robot arm mechanism 2.

[0055] The setting method for the screening position of the vibration collection device of the second robot arm mechanism 3 includes: selecting multiple positions in the second robot arm mechanism 3 and between the second rotating axis J3 and the third rotating axis J4 as alternative positions, and placing the same type of vibration collection device at each alternative position. Then, the second shaft motor 31 of the second robot arm mechanism 3 using a normal synchronous pulley is moved, and the motors in other mechanisms are stopped. At this time, the vibration data is collected and saved by each vibration collection device of the second robot arm mechanism 3, and a timestamp is added for comparison of each position. At this time, the normal vibration data of the second robot arm mechanism 3 when the wafer robot is operating normally is obtained. Then, the synchronous pulley on the second rotating axis J3 is replaced with an abnormal synchronous pulley, and the above test is repeated again, and the obtained abnormal vibration data are compared together; the alternative position with the largest difference in vibration data between the normal synchronous pulley and the abnormal synchronous pulley in the vibration data is used as the screening position for the installation of the vibration sensor, for example Figure 2 The middle vibration sensor 30 is a vibration sensor 30 provided at the screening position of the second robot arm mechanism 3 .

[0056] The method for setting the screening position of the vibration collection device of the first end effector mechanism 4 includes: selecting multiple positions in the first end effector mechanism 4 as candidate positions, and placing the same type of vibration collection device at each candidate position. Then, the third shaft motor 41 of the first end effector mechanism 4 using a normal synchronous pulley is moved, and the motors in other mechanisms are stopped. At this time, the vibration data is collected and saved using the vibration collection devices of the first end effector mechanism 4, and a timestamp is added for comparison of each position. At this time, the normal vibration data of the first end effector mechanism 4 when the wafer robot is operating normally is obtained. Then, the synchronous pulley on the third rotating axis J4 is replaced with an abnormal synchronous pulley, and the above test is repeated again, and the obtained abnormal vibration data are compared together; the candidate position with the largest difference in vibration data between the normal synchronous pulley and the abnormal synchronous pulley is used as the screening position for installing the vibration sensor, for example Figure 2 The middle vibration sensor 40 is a vibration sensor 40 provided at the screening position of the first end effector mechanism 4 .

[0057] The method for setting the screening position of the vibration collection device of the second end effector mechanism 5 includes: selecting multiple positions in the first end effector mechanism 4 as alternative positions, and placing the same type of vibration collection device at each alternative position. Then, the fourth shaft motor 51 of the second end effector mechanism 5 using a normal synchronous pulley is moved, and the motors in other mechanisms are stopped. At this time, the vibration data is collected and saved using the vibration collection devices of the second end effector mechanism 5, and a timestamp is added for comparison of each position. At this time, the normal vibration data of the second end effector mechanism 5 when the wafer robot is operating normally is obtained. Then, the synchronous pulley on the third rotating axis J4 is replaced with an abnormal synchronous pulley, and the above test is repeated again, and the obtained abnormal vibration data are compared together; the alternative position with the largest difference in vibration data between the normal synchronous pulley and the abnormal synchronous pulley is used as the screening position for installing the vibration sensor, for example Figure 2 The middle vibration sensor 50 is a vibration sensor 50 provided at the screening position of the second end effector mechanism 5 .

[0058] It should be noted that the abnormal lead screw and abnormal synchronous pulley may be worn lead screws and synchronous pulleys, and the degree of wear may be set according to demand, so long as the movements of various mechanisms can be performed.

[0059] Step S102: Based on the vibration data collected by each vibration collection device, respectively, a mechanical performance diagnosis and analysis is performed on each motion mechanical mechanism to obtain a mechanical performance diagnosis and analysis result of each motion mechanical mechanism in the wafer robot.

[0060] In one embodiment, step S102 includes:

[0061] Determine whether the amount of vibration data collected by each vibration collection device exceeds the standard amount of data; specifically, since the judgment analysis mainly requires a long period of accumulation and analysis comparison to make an accurate diagnosis and prediction of the performance of the robot arm, first determine whether the vibration data collected by each vibration collection device exceeds the preset standard amount of data, if it exceeds, perform subsequent judgment and analysis steps, otherwise re-collect the vibration data of the corresponding motion mechanical mechanism. For example, whether the amount of data exceeds 50.

[0062] Data processing operations are performed on vibration data exceeding the standard data volume to obtain corresponding mechanical performance diagnosis and analysis results. Specifically, data processing operations are performed on vibration data exceeding the standard data volume to obtain mechanical performance diagnosis and analysis results of corresponding motion mechanical mechanisms.

[0063] In one embodiment, the data processing operation includes two modes, wherein the first mode is:

[0064] For the amplitude and acceleration data of the X, Y and Z axes in each vibration data exceeding the standard data volume, the corresponding absolute mean, root mean square value, standard deviation and kurtosis are calculated respectively;

[0065] Specifically, the data of the three axes XYZ are processed, and the data processing methods include but are not limited to taking the absolute mean, root mean square value, standard deviation and kurtosis;

[0066] Where x is the data point and N is the number of data points. The absolute mean, root mean square value, standard deviation and kurtosis are calculated according to the following formulas:

[0067] The absolute mean is calculated as:

[0068]

[0069] The formula for calculating the RMS value is:

[0070]

[0071] The formula for calculating the standard deviation is:

[0072]

[0073] The calculation formula of kurtosis is:

[0074]

[0075] Based on the fault diagnosis conditions, the mechanical performance diagnosis analysis results of the corresponding motion mechanical mechanism are judged according to the absolute mean, root mean square value, standard deviation and kurtosis of each axis in each vibration data.

[0076] Specifically, the mechanical performance diagnostic analysis result of the corresponding motion mechanical mechanism can be determined by setting one or more numerical thresholds. Specifically, the thresholds of one or more of the absolute mean, root mean square value, standard deviation and kurtosis can be set, and the thresholds of one or more of the absolute mean, root mean square value, standard deviation and kurtosis in one or more axes of the X-axis, Y-axis and Z-axis can also be set. Thresholds corresponding to multiple fault types can also be set.

[0077] It should be noted that the data threshold of each type can be determined first by experience and then modified based on the data during use.

[0078] In one embodiment, another method includes:

[0079] Perform Fourier transformation on the X, Y and Z axis data of each vibration data exceeding the standard data volume, and then perform time-frequency conversion to obtain a spectrum diagram of the corresponding vibration collection device;

[0080] The frequency and amplitude of each spectrum graph are extracted to determine whether the corresponding spectrum graph has fault frequency characteristics, so as to obtain the mechanical performance diagnosis and analysis results of the corresponding motion mechanical mechanism. For example, when the robot is just running, the frequencies on the spectrum graph are all characteristics of normal operation. After running for a period of time, some new frequencies begin to appear, but the amplitude is not large. As time goes by, the amplitude of the new frequencies also gradually increases, indicating that the wear is also beginning to become serious. Frequency analysis mainly requires a long period of accumulation and analysis and comparison to diagnose and predict the performance of the robot arm.

[0081] In one embodiment, performing data processing operations on vibration data exceeding a standard data volume to obtain corresponding mechanical performance diagnostic analysis results includes:

[0082] Based on the trained machine learning model, data processing operations are performed according to the input vibration data that exceeds the standard data volume, and the corresponding mechanical performance diagnosis and analysis results are output.

[0083] In this embodiment, if the first method is adopted, the first vibration data sample set marked based on the corresponding threshold data of each fault type is used to train and obtain the machine learning model. The first vibration data sample set includes: multiple vibration data samples with data characteristics of a fault type related to each fault type; the machine learning model obtained by training can output the mechanical performance diagnosis analysis result corresponding to the fault type when the vibration data exceeding the standard data volume is input.

[0084] If the second method is adopted, the machine learning model is trained using the second vibration data sample set marked based on the corresponding fault frequency characteristics of each fault type. The second vibration data sample set includes: multiple vibration data samples with a fault frequency characteristic of a fault type related to each fault type; the machine learning model obtained by training can output the mechanical performance diagnosis analysis result corresponding to the fault type when the vibration data exceeding the standard data volume is input.

[0085] By using advanced deep learning models and algorithms, a large amount of wafer robot operation data is fed into the model for training. The diagnostic model will become more and more accurate, and the efficiency and stability of the wafer robot will be better improved.

[0086] In order to better illustrate the mechanical property diagnosis method of the above-mentioned wafer robot, the present invention provides the following specific embodiments.

[0087] Example 1: A method for diagnosing mechanical properties of a CA124 intelligent semiconductor robot. Figure 3 Schematic diagram of the flow chart of the mechanical property diagnosis method of CA124 intelligent semiconductor robot.

[0088] The CA124 intelligent semiconductor robot includes: a lifting mechanism, a first mechanical arm mechanism, a second mechanical arm mechanism, a first end effector mechanism, and a second end effector mechanism. Vibration sensors can be installed in all of the above mechanisms.

[0089] This embodiment takes the installation of a vibration sensor in the first mechanical arm mechanism as an example to illustrate the screening process. 2 to 3 positions (one near the J2 axis, one near the J3 axis, and one in the middle) are selected in the first mechanical arm mechanism as spaces for placing vibration sensors, and vibration sensors of the same model are placed in the three positions, and then the J2 axis motor in the first mechanical arm is moved, while the motors of other axes are stopped. The vibration data of the vibration sensor is collected and saved, and a timestamp is added to make comparisons of each position. At this time, the normal vibration data of the first mechanical arm mechanism when the wafer robot is operating normally is obtained. Then the synchronous pulley of J2 is replaced with a synchronous pulley with severe bearing wear, and the above test is repeated again, and the vibration data are put together for comparison. The position where there is a more obvious gap between the new synchronous pulley and the pulley with severe bearing wear in the vibration data is used as the position where the vibration sensor is installed. This method is used to screen the installation positions of the vibration sensor in the lifting mechanism, the second mechanical arm mechanism, the first end effector mechanism, and the second end effector mechanism. The present invention uses this method to screen out the corresponding installation positions of the 5 mechanisms.

[0090] The method includes: after installing the required vibration sensor, the wafer robot performs normal wafer handling work, and the collection time is when the 5 motors on the robot are running separately. For example, when the robot is running only on the z-axis, the data of the vibration sensor near the z-axis motor is collected, and the amplitude and acceleration of the X-axis, the amplitude and acceleration of the Y-axis, and the amplitude and acceleration information of the Z-axis of the vibration sensor are collected. The data set time for each collection is 2s, the frequency of collecting data is 50Hz, and the amount of data collected each time is 100. After each collection, at least 1 hour interval is set to collect again. After collection, upload to the control center, the control center saves the data, and processes the data of the three axes of XYZ. The data processing method includes but is not limited to taking the absolute mean, root mean square value, standard deviation and kurtosis. The processed data can be used to perform fault diagnosis and analysis on each mechanical arm inside the robot. If one of the above four data exceeds the threshold, it is judged that there is a risk of wear. The data threshold of each type can be determined by experience first, and then corrected according to the data during use. Time domain analysis can diagnose and predict the performance of the mechanical arm in real time.

[0091] Furthermore, the above collected data can also be converted to time-frequency through Fourier transform and analyzed in the frequency domain. After obtaining the spectrum diagram, the various frequencies and amplitudes of the vibration can be intuitively displayed. Continuously record the spectrum information for comparison. When the robot is just running, the frequencies on the spectrum diagram are all characteristics of normal operation. After running for a period of time, some new frequencies begin to appear, but the amplitude is not large. As time goes by, the amplitude of the newly added frequencies also slowly increases, indicating that the wear and tear is also beginning to become serious. Frequency analysis mainly requires a long period of accumulation and analysis and comparison to diagnose and predict the performance of the robot arm.

[0092] Similar to the principle of the above embodiment, the present invention provides a mechanical performance diagnosis device for a wafer robot.

[0093] The following provides specific embodiments in conjunction with the accompanying drawings:

[0094] like Figure 4 A schematic structural diagram of a mechanical property diagnostic device for a wafer robot in an embodiment of the present invention is shown.

[0095] The device comprises: a data acquisition module 41 for acquiring vibration data collected by vibration acquisition devices arranged at corresponding screening positions inside each movement mechanical mechanism of the wafer robot when the movement mechanical mechanism of the wafer robot operates independently during normal handling work;

[0096] The mechanical performance diagnosis module 42 is connected to the data acquisition module 41 and is used to perform mechanical performance diagnosis and analysis on each moving mechanical mechanism based on the vibration data collected by each vibration collection device, so as to obtain the mechanical performance diagnosis and analysis results of each moving mechanical mechanism in the wafer robot.

[0097] Since the implementation principle of the mechanical property diagnosis device of the wafer robot has been described in the above-mentioned embodiment, it will not be repeated here.

[0098] In one embodiment, multiple different alternative positions in each motion mechanical mechanism are respectively provided with the same vibration collection device; and the screening position setting method of the vibration collection device of each motion mechanical mechanism includes: obtaining normal vibration data and abnormal vibration data respectively collected by the vibration collection devices arranged at each alternative position when each motion mechanical mechanism uses normal performance transmission components and abnormal transmission components to operate separately; from the alternative positions where the vibration collection devices in each motion mechanical mechanism are located, the alternative position where the difference between normal vibration data and abnormal vibration data is the largest is selected as the screening position of the vibration collection device finally set in the corresponding motion mechanical mechanism.

[0099] In one embodiment, each motion mechanical mechanism in the wafer robot includes: a lifting mechanism, a first mechanical arm mechanism, a second mechanical arm mechanism, a first end effector mechanism and a second end effector mechanism, each of which is provided with a vibration collection device at an internal screening position; wherein the lifting mechanism includes: a lifting motor, which is used to drive the first mechanical arm mechanism, the second mechanical arm mechanism, the first end effector mechanism and the second end effector mechanism to move up and down along the lifting axis in combination with a lead screw; the first mechanical arm mechanism includes: a first rotating shaft motor, which is used to drive the second mechanical arm mechanism, the first end effector mechanism and the second end effector mechanism to rotate around a first rotating axis in combination with a synchronous pulley; the second mechanical arm mechanism includes: a second rotating shaft motor, which is used to drive the first end effector mechanism and the second end effector mechanism to rotate around a second rotating axis in combination with a synchronous pulley; the first end effector mechanism includes: a third rotating shaft motor, which is used to drive the first end effector mechanism to rotate around a third rotating axis in combination with a synchronous pulley; the second end effector mechanism includes: a fourth rotating shaft motor, which is used to drive the second end effector mechanism to rotate around a third rotating axis in combination with a synchronous pulley; and wherein the lifting axis is parallel to the first rotating axis, the second rotating axis and the third rotating axis.

[0100] In one embodiment, the alternative positions of the lifting mechanism, the first end effector mechanism and the second end effector mechanism are respectively arranged at different positions in the lifting mechanism, the first end effector mechanism and the second end effector mechanism; the alternative positions of the first robotic arm mechanism are respectively arranged in the first robotic arm mechanism and are located at different positions between the first rotation axis and the second rotation axis; the alternative positions of the second robotic arm mechanism are respectively arranged in the second robotic arm mechanism and are located at different positions between the second rotation axis and the third rotation axis; the normal performance transmission component and the abnormal transmission component of the lifting mechanism adopt a normal lead screw and an abnormal lead screw respectively; the normal performance transmission component and the abnormal transmission component of the first robotic arm mechanism, the second robotic arm mechanism, the first end effector mechanism and the second end effector mechanism adopt a normal synchronous pulley and an abnormal synchronous pulley respectively.

[0101] In one embodiment, the mechanical performance diagnosis module 42 is used to determine whether the amount of vibration data collected by each vibration collection device exceeds the standard data amount; and perform data processing operations on the vibration data exceeding the standard data amount to obtain corresponding mechanical performance diagnosis analysis results.

[0102] In one embodiment, the mechanical performance diagnostic module 42 is used to perform data processing operations based on the trained machine learning model according to the input vibration data exceeding the standard data volume, and output the corresponding mechanical performance diagnostic analysis results.

[0103] In one embodiment, the data processing operation of the mechanical performance diagnosis module 42 includes: calculating the corresponding absolute mean, root mean square value, standard deviation and kurtosis of the amplitude and acceleration data of the X, Y and Z axes in each vibration data that exceeds the standard data volume; based on the fault diagnosis conditions, judging the mechanical performance diagnosis analysis results of the corresponding moving mechanical mechanism according to the absolute mean, root mean square value, standard deviation and kurtosis of each axis in each vibration data.

[0104] In one embodiment, the data processing operation of the mechanical performance diagnosis module 42 includes: performing Fourier transform on the X, Y and Z axis data in each vibration data exceeding the standard data volume, and then performing time-frequency conversion to obtain a spectrum diagram of the corresponding vibration acquisition device; extracting the frequency and amplitude of each spectrum diagram to determine whether the corresponding spectrum diagram has a fault frequency characteristic, so as to obtain the mechanical performance diagnosis analysis results of the corresponding moving mechanical mechanism.

[0105] like Figure 5 A schematic structural diagram of a mechanical performance diagnosis terminal 50 of a wafer robot in an embodiment of the present invention is shown.

[0106] The mechanical performance diagnosis terminal 50 of the wafer robot includes: a memory 51 and a processor 52. The memory 51 is used to store computer programs; the processor 52 runs the computer programs to implement the following Figure 1 The mechanical performance diagnosis method of the wafer robot.

[0107] Optionally, the number of the memory 51 can be one or more, the number of the processor 52 can be one or more, and Figure 5 Take one as an example.

[0108] Optionally, the processor 52 in the mechanical performance diagnosis terminal 50 of the wafer robot will Figure 1 In the above steps, one or more instructions corresponding to the process of the application are loaded into the memory 51, and the processor 52 runs the application stored in the first memory 51, thereby achieving the following Figure 1 Various functions in the mechanical performance diagnosis method of the wafer robot.

[0109] Optionally, the memory 51 may include but is not limited to high-speed random access memory and non-volatile memory. For example, one or more disk storage devices, flash memory devices or other non-volatile solid-state storage devices; the processor 52 may include but is not limited to a central processing unit (CPU), a network processor (NP), etc.; it may also be a digital signal processor (DSP), an application specific integrated circuit (ASIC), a field programmable gate array (FPGA) or other programmable logic devices, discrete gates or transistor logic devices, discrete hardware components.

[0110] Optionally, the processor 52 can be a general-purpose processor, including a central processing unit (CPU), a network processor (NP), etc.; it can also be a digital signal processor (DSP), an application specific integrated circuit (ASIC), a field programmable gate array (FPGA) or other programmable logic devices, discrete gates or transistor logic devices, discrete hardware components.

[0111] The present invention also provides a computer-readable storage medium storing a computer program, wherein the computer program is executed as follows: Figure 1 The mechanical performance diagnosis method of the wafer robot shown. The computer-readable storage medium may include, but is not limited to, a floppy disk, an optical disk, a CD-ROM (read-only disk memory), a magneto-optical disk, a ROM (read-only memory), a RAM (random access memory), an EPROM (erasable programmable read-only memory), an EEPROM (electrically erasable programmable read-only memory), a magnetic card or an optical card, a flash memory, or other types of media / machine-readable media suitable for storing machine-executable instructions. The computer-readable storage medium may be a product that is not connected to a computer device, or a component that is connected to a computer device for use.

[0112] The present invention provides a wafer robot, such as Figure 2 As shown, the wafer robot comprises:

[0113] A lifting mechanism 1, a first robotic arm mechanism 2, a second robotic arm mechanism 3, a first end effector mechanism 4 and a second end effector mechanism 5, and a vibration collection device 10, a vibration collection device 20, a vibration collection device 30, a vibration collection device 40 and a vibration collection device 50 are respectively provided at the screening positions inside each of them.

[0114] Among them, Figure 3 As shown, the vibration collection devices 10 to 50 in the lifting mechanism 1, the first robotic arm mechanism 2, the second robotic arm mechanism 3, the first end effector mechanism 4 and the second end effector mechanism 5 are respectively communicated with the mechanical performance diagnosis device 00 of the wafer robot to perform mechanical performance diagnosis and analysis on the lifting mechanism 1, the first robotic arm mechanism 2, the second robotic arm mechanism 3, the first end effector mechanism 4 and the second end effector mechanism 5 of the wafer robot.

[0115] In this embodiment, if Figure 2 As shown, the lifting mechanism 1 includes: a lifting motor 11, which is used to drive the first mechanical arm mechanism 2, the second mechanical arm mechanism 3, the first end effector mechanism 4 and the second end effector mechanism 5 to move up and down along the lifting axis J1 in combination with the lead screw 12;

[0116] The first robotic arm mechanism 2 includes: a first shaft motor 21, which is used to drive the second robotic arm mechanism 3, the first end effector mechanism 4 and the second end effector 5 to rotate around the first rotation axis J2 in combination with a synchronous pulley (not shown in the figure); specifically, the first robotic arm mechanism 2 can control the first robotic arm to rotate around the first rotation axis J2, and drive the second robotic arm in the second robotic arm mechanism 3, the first end effector in the first end effector mechanism 4, and the second end effector of the second end effector mechanism 5 to rotate around the first rotation axis J2.

[0117] The second robotic arm mechanism 3 includes: a second shaft motor 31, which is used to drive the first end effector mechanism and the second end effector mechanism to rotate around the second rotation axis J3 in combination with the synchronous pulley 32; specifically, the second robotic arm mechanism 3 can control the second robotic arm to rotate around the second rotation axis J3, and drive the first end effector in the first end effector mechanism 4 and the second end effector of the second end effector mechanism 5 to rotate around the second rotation axis J3.

[0118] The first end effector mechanism 4 includes: a third shaft motor 41, which is used to drive the first end effector to rotate around the third rotation axis J4 in conjunction with the synchronous pulley 42; specifically, the first end effector mechanism 4 can control the first end effector to rotate around the third rotation axis J4.

[0119] The second end effector mechanism 5 includes: a fourth shaft motor 41, which is used to drive the second end effector to rotate around the third rotation axis J4 in conjunction with the synchronous pulley 42; specifically, the second end effector mechanism 5 can control the second end effector to rotate around the third rotation axis J4, forming an angle with the first end effector to clamp the wafer to be taken.

[0120] And wherein, the lifting axis J1 is parallel to the first rotation axis J2, the second rotation axis J3 and the third rotation axis J4.

[0121] In summary, the mechanical performance diagnosis method, device, terminal, medium and wafer robot of the wafer robot of the present invention perform mechanical performance diagnosis and analysis on each moving mechanical mechanism by acquiring the vibration data collected by the vibration collection device corresponding to the internal screening setting when each moving mechanical mechanism of the wafer robot is operating independently during normal handling work. The present invention installs the required vibration collection device inside each moving mechanical mechanism. The sensor itself is small in size and light in weight, and will not affect the original size and moment of inertia of the mechanical mechanism. And the vibration data collected by the vibration collection device is of great significance for the fault diagnosis and remaining life prediction of each moving mechanical mechanism. With the development of industrial control technology, advanced algorithms are used for fault diagnosis and equipment health status monitoring to ensure the operational reliability and accuracy of the wafer robot. Therefore, the present invention effectively overcomes the various shortcomings in the prior art and has a high industrial utilization value.

[0122] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the technology may modify or change the above embodiments without violating the spirit and scope of the present invention. Therefore, all equivalent modifications or changes made by a person of ordinary skill in the art without departing from the spirit and technical ideas disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. A method for diagnosing mechanical properties of a wafer robot, characterized in that: include: Acquire vibration data collected by vibration collection devices provided at corresponding screening positions of each movement mechanical mechanism of the wafer robot when the movement mechanical mechanism of the wafer robot operates independently during normal handling work; Based on the vibration data collected by each vibration collection device, respectively, a mechanical performance diagnosis and analysis is performed on each motion mechanical mechanism to obtain a mechanical performance diagnosis and analysis result of each motion mechanical mechanism in the wafer robot; Multiple different candidate positions in each motion mechanical mechanism are respectively provided with the same vibration collection device; The screening position setting method of the vibration collection device of each motion mechanical mechanism includes: obtaining normal vibration data and abnormal vibration data respectively collected by the vibration collection devices arranged at each candidate position when each motion mechanical mechanism respectively uses a normal performance transmission component and an abnormal transmission component to operate separately; selecting the candidate position where the vibration collection device with the largest difference between normal vibration data and abnormal vibration data is located from the candidate positions where the vibration collection devices in each motion mechanical mechanism are located as the screening position of the vibration collection device finally set in the corresponding motion mechanical mechanism; Each motion mechanical mechanism in the wafer robot includes: a lifting mechanism, a first mechanical arm mechanism, a second mechanical arm mechanism, a first end effector mechanism and a second end effector mechanism, each of which is provided with a vibration collection device at the internal screening position; wherein the lifting mechanism includes: a lifting motor, which is used to drive the first mechanical arm mechanism, the second mechanical arm mechanism, the first end effector mechanism and the second end effector mechanism to move up and down along the lifting axis in combination with the lead screw; the first mechanical arm mechanism includes: a first rotating shaft motor, which is used to drive the second mechanical arm mechanism, the first end effector mechanism and the second end effector mechanism to rotate around the first rotating axis in combination with the synchronous pulley; the second mechanical arm mechanism includes: a second rotating shaft motor, which is used to drive the first end effector mechanism and the second end effector mechanism to rotate around the second rotating axis in combination with the synchronous pulley; the first end effector mechanism includes: a third rotating shaft motor, which is used to drive the first end effector mechanism to rotate around the third rotating axis in combination with the synchronous pulley; the second end effector mechanism includes: a fourth rotating shaft motor, which is used to drive the second end effector mechanism to rotate around the third rotating axis in combination with the synchronous pulley; and wherein the lifting axis is parallel to the first rotating axis, the second rotating axis and the third rotating axis; The alternative positions of the lifting mechanism, the first end effector mechanism and the second end effector mechanism are respectively arranged at different positions in the lifting mechanism, the first end effector mechanism and the second end effector mechanism; the alternative positions of the first robotic arm mechanism are respectively arranged in the first robotic arm mechanism and are located at different positions between the first rotating axis and the second rotating axis; the alternative positions of the second robotic arm mechanism are respectively arranged in the second robotic arm mechanism and are located at different positions between the second rotating axis and the third rotating axis; the normal performance transmission component and the abnormal transmission component of the lifting mechanism adopt a normal lead screw and an abnormal lead screw respectively; the normal performance transmission component and the abnormal transmission component of the first robotic arm mechanism, the second robotic arm mechanism, the first end effector mechanism and the second end effector mechanism adopt a normal synchronous pulley and an abnormal synchronous pulley respectively; The mechanical performance diagnosis and analysis of each moving mechanical mechanism is performed based on the vibration data collected by each vibration collection device to obtain the mechanical performance diagnosis and analysis results of each moving mechanical mechanism in the wafer robot, including: judging whether the data volume of the vibration data collected by each vibration collection device exceeds the standard data volume; performing data processing operations on the vibration data exceeding the standard data volume to obtain the corresponding mechanical performance diagnosis and analysis results; The data processing operation includes: calculating the corresponding absolute mean, root mean square value, standard deviation and kurtosis of the amplitude and acceleration data of the X, Y and Z axes in each vibration data exceeding the standard data volume; judging the mechanical performance diagnosis and analysis results of the corresponding motion mechanical mechanism according to the absolute mean, root mean square value, standard deviation and kurtosis of each axis in each vibration data based on the fault diagnosis condition; Alternatively, the data processing operation includes: performing Fourier transform on the X, Y and Z axis data in each vibration data exceeding the standard data volume, and then performing time-frequency conversion to obtain a spectrum diagram of the corresponding vibration acquisition device; extracting the frequency and amplitude of each spectrum diagram to determine whether the corresponding spectrum diagram has a fault frequency characteristic, so as to obtain the mechanical performance diagnosis and analysis results of the corresponding moving mechanical mechanism.

2. The mechanical performance diagnosis method of the wafer robot according to claim 1, characterized in that: Data processing operations are performed on vibration data exceeding the standard data volume to obtain corresponding mechanical performance diagnostic analysis results including: Based on the trained machine learning model, data processing operations are performed according to the input vibration data that exceeds the standard data volume, and the corresponding mechanical performance diagnosis and analysis results are output.

3. A mechanical performance diagnostic device for a wafer robot, characterized in that: The device comprises: The data acquisition module is used to obtain vibration data collected by the vibration collection devices set at the corresponding screening positions of each motion mechanical mechanism of the wafer robot when the motion mechanical mechanism of the wafer robot operates independently during normal handling work; based on the vibration data collected by each vibration collection device, respectively, the mechanical performance diagnosis and analysis of each motion mechanical mechanism is performed to obtain the mechanical performance diagnosis and analysis results of each motion mechanical mechanism in the wafer robot; the same vibration collection devices are respectively set at multiple different alternative positions in each motion mechanical mechanism; and the screening position setting method of the vibration collection device of each motion mechanical mechanism includes: obtaining the vibration data of each motion mechanical mechanism when the normal performance transmission component and the abnormal transmission component are used to operate independently by the vibration collection devices set at each alternative position The vibration collection devices respectively correspond to the normal vibration data and the abnormal vibration data collected; the candidate positions of the vibration collection devices with the largest difference between the normal vibration data and the abnormal vibration data are respectively selected from the candidate positions of the vibration collection devices in each motion mechanical mechanism as the screening positions of the vibration collection devices finally set in the corresponding motion mechanical mechanism; each motion mechanical mechanism in the wafer robot comprises: a lifting mechanism, a first mechanical arm mechanism, a second mechanical arm mechanism, a first end effector mechanism and a second end effector mechanism of a vibration collection device are respectively arranged at the internal screening positions; wherein the lifting mechanism comprises: a lifting motor, which is used to drive the first mechanical arm mechanism, the second mechanical arm mechanism, the first end effector mechanism in combination with the lead screw The actuator mechanism and the second end actuator mechanism move up and down along the lifting shaft; the first robot arm mechanism includes: a first shaft motor, which is used to drive the second robot arm mechanism, the first end actuator mechanism and the second end actuator mechanism to rotate around the first rotation axis in combination with the synchronous belt pulley; the second robot arm mechanism includes: a second shaft motor, which is used to drive the first end actuator mechanism and the second end actuator mechanism to rotate around the second rotation axis in combination with the synchronous belt pulley; the first end actuator mechanism includes: a third shaft motor, which is used to drive the first end actuator to rotate around the third rotation axis in combination with the synchronous belt pulley; the second end actuator mechanism includes: a fourth shaft motor, which is used to drive the second end actuator to rotate around the third rotation axis in combination with the synchronous belt pulley; And wherein, the lifting axis is parallel to the first rotation axis, the second rotation axis and the third rotation axis; the alternative positions of the lifting mechanism, the first end effector mechanism and the second end effector mechanism are respectively arranged at different positions in the lifting mechanism, the first end effector mechanism and the second end effector mechanism; the alternative positions of the first robotic arm mechanism are respectively arranged in the first robotic arm mechanism and located at different positions between the first rotation axis and the second rotation axis; the alternative positions of the second robotic arm mechanism are respectively arranged in the second robotic arm mechanism and located at different positions between the second rotation axis and the third rotation axis; the normal performance transmission component and the abnormal transmission component of the lifting mechanism respectively adopt a normal lead screw and an abnormal lead screw;The normal performance transmission components and abnormal performance transmission components of the first robot arm mechanism, the second robot arm mechanism, the first end effector mechanism and the second end effector mechanism respectively adopt normal synchronous pulleys and abnormal synchronous pulleys; A mechanical performance diagnosis module is connected to the data acquisition module and is used to perform mechanical performance diagnosis and analysis on each moving mechanical mechanism based on the vibration data collected by each vibration collection device, so as to obtain the mechanical performance diagnosis and analysis results of each moving mechanical mechanism in the wafer robot; including: judging whether the data volume of the vibration data collected by each vibration collection device exceeds the standard data volume; performing data processing operations on the vibration data exceeding the standard data volume to obtain the corresponding mechanical performance diagnosis and analysis results; the data processing operations include: processing the amplitude and acceleration of the X, Y and Z axes in each vibration data exceeding the standard data volume The corresponding absolute mean, root mean square value, standard deviation and kurtosis of the data are calculated respectively; based on the fault diagnosis conditions, the mechanical performance diagnosis and analysis results of the corresponding moving mechanical mechanism are judged according to the absolute mean, root mean square value, standard deviation and kurtosis of each axis in each vibration data; or, the data processing operation includes: performing Fourier transform on the data of the X, Y and Z axes in each vibration data exceeding the standard data volume, and then performing time-frequency conversion to obtain the spectrum diagram of the corresponding vibration acquisition device; extracting the frequency and amplitude of each spectrum diagram to determine whether the corresponding spectrum diagram has a fault frequency feature, so as to obtain the mechanical performance diagnosis and analysis results of the corresponding moving mechanical mechanism.

4. A mechanical performance diagnostic terminal for a wafer robot, characterized in that: include: one or more memories and one or more processors; The one or more memories are used to store computer programs; The one or more processors, connected to the memory, are configured to run the computer program to perform the method according to any one of claims 1 to 2.

5. A computer-readable storage medium, characterized in that: A computer program is stored, and when the computer program is executed by one or more processors, the method according to any one of claims 1 to 2 is performed.

6. A wafer robot, characterized in that: include: A lifting mechanism of the vibration collection device, a first mechanical arm mechanism, a second mechanical arm mechanism, a first end effector mechanism and a second end effector mechanism are respectively arranged at the screening position inside; Among them, the vibration collection devices in the lifting mechanism, the first robotic arm mechanism, the second robotic arm mechanism, the first end effector mechanism and the second end effector mechanism are respectively communicated with the mechanical performance diagnosis device of the wafer robot as described in claim 3, so as to perform mechanical performance diagnosis and analysis on the lifting mechanism, the first robotic arm mechanism, the second robotic arm mechanism, the first end effector mechanism and the second end effector mechanism of the wafer robot.

Images