Carrier plate used in wafer cassette carrier device
By setting multiple guide slots and switching components on the carrier plate, the position of the air nozzle can be flexibly switched, which solves the compatibility problem of different models of wafer transfer boxes, improves operation efficiency and reduces equipment costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- BRILLIAN NETWORK & AUTOMATION INTEGRATED SYST
- Filing Date
- 2022-05-23
- Publication Date
- 2026-05-26
AI Technical Summary
In the current technology, there is a lack of unified standard specifications among various manufacturers and different models of wafer transfer boxes, which leads to the need to design a variety of carrier trays with different specifications, increasing operational inconvenience and equipment costs.
Design a carrier tray that, by setting multiple guide grooves and switching components on the carrier tray, can move and switch the position of the air nozzle to adapt to the air hole position of different types of wafer transfer boxes, so as to realize that one carrier tray is compatible with multiple wafer transfer boxes.
It improves operational efficiency, reduces equipment costs, decreases the space required to store multiple pallets, and increases ease of use.
Smart Images
Figure CN116364612B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to a carrier tray used in a wafer carrier device, and more particularly to a carrier tray that can switch the position of the air nozzle according to different wafer transfer box types. Background Technology
[0002] In recent years, the rapid advancements in wafer integration and circuit miniaturization have led to stricter environmental requirements. Exposure to air can cause moisture or oxygen to adhere to the wafer surface, potentially resulting in corrosion or oxidation. Therefore, it is essential to maintain a high level of cleanliness in the microenvironment surrounding the wafer to prevent particles or moisture from adhering to its surface. Currently, effective methods include creating an inert nitrogen atmosphere, a vacuum environment, or dry air around the wafer to prevent surface changes such as oxidation.
[0003] To properly maintain the microenvironment around the wafer, the wafer is placed inside a sealed wafer transport box and managed, which is filled with nitrogen or dry air.
[0004] In recent years, there has been no unified standard specification among various manufacturers and different models of wafer transfer boxes. The positions of the air inlet and outlet holes are different, and different models of wafer transfer boxes need to be matched with different specifications of carrier trays, which causes inconvenience in operation and increases costs.
[0005] Therefore, designing a carrier plate that is highly compatible and can be quickly switched to improve work efficiency and save equipment costs has become an important issue. Summary of the Invention
[0006] To address the shortcomings of existing technologies, the main objective of this invention is to provide a carrier tray for wafer cassette carrier devices. This new tray requires only one unit, and the position of the air nozzles on the tray can be adjusted to accommodate various wafer transfer cassette models. This reduces the cost of designing different carrier trays to accommodate different wafer transfer cassette models, and increases the ease of use for wafer fabs. It also solves the space problem associated with storing multiple carrier trays.
[0007] Another objective of this invention is to allow the air nozzles on the carrier plate to be moved and switched according to the distribution of the air holes at the bottom of the wafer transfer box, so that gas can be used to inflate or de-inflate the wafer transfer box through the switched air nozzle positions.
[0008] To achieve the aforementioned objective, this invention discloses a carrier tray for a wafer cassette carrier device, comprising: a body disposed on the wafer cassette carrier device; a first guide groove disposed on the lower side of the body, wherein a first switching element and a first air nozzle are disposed within the first guide groove, the first switching element driving the first air nozzle to move up and down to switch positions; a second guide groove disposed on the lower side of the body relative to the first guide groove, wherein a second switching element and a second air nozzle are disposed within the second guide groove, the second switching element driving the second air nozzle to move up and down to switch positions; a third guide groove disposed on the upper side of the body relative to the first guide groove, wherein a third switching element and a third air nozzle are disposed within the third guide groove, the third switching element driving the third air nozzle to move obliquely to switch positions; and a fourth guide groove disposed on the upper side of the body relative to the third guide groove, wherein a fourth switching element and a fourth air nozzle are disposed within the fourth guide groove, the fourth switching element driving the fourth air nozzle to move obliquely to switch positions, wherein, according to the positions of multiple air holes at the bottom of the wafer transfer box, the first air nozzle, the second air nozzle, the third air nozzle, and the fourth air nozzle move to the corresponding multiple air hole positions to inflate or de-vent the wafer transfer box.
[0009] In a preferred embodiment of the present invention, the carrier plate applied to the wafer cassette carrier device further includes a fifth air nozzle and a sixth air nozzle, which are respectively disposed on the upper side of the body, and the distance between the fifth air nozzle and the sixth air nozzle is less than the distance between the third air nozzle and the fourth air nozzle.
[0010] In a preferred embodiment of the present invention, when the first air nozzle is switched to the upper position of the first guide groove and the second air nozzle is switched to the upper position of the second guide groove, the third air nozzle is located at the outermost position of the third guide groove and the fourth air nozzle is located at the outermost position of the fourth guide groove. There is a first distance between the center of the first air nozzle hole of the first air nozzle and the center of the second air nozzle hole of the second air nozzle, and there is a second distance between the center of the third air nozzle hole of the third air nozzle and the center of the fourth air nozzle hole of the fourth air nozzle. The second distance is greater than the first distance.
[0011] In a preferred embodiment of the present invention, when the first air nozzle is switched to the upper position of the first guide groove and the second air nozzle is switched to the upper position of the second guide groove, the third air nozzle is located at the uppermost position of the third guide groove and the fourth air nozzle is located at the uppermost position of the fourth guide groove. There is a first distance between the center of the first air nozzle hole of the first air nozzle and the center of the second air nozzle hole of the second air nozzle, and there is a third distance between the center of the third air nozzle hole of the third air nozzle and the center of the fourth air nozzle hole of the fourth air nozzle. The third distance is less than the second distance and greater than the first distance.
[0012] In a preferred embodiment of the present invention, when the first air nozzle is switched to the lower position of the first guide groove and the second air nozzle is switched to the lower position of the second guide groove, the third air nozzle is located at the innermost position of the third guide groove and the fourth air nozzle is located at the innermost position of the fourth guide groove. There is a first distance between the center of the first air nozzle hole of the first air nozzle and the center of the second air nozzle hole of the second air nozzle, and there is a fourth distance between the center of the third air nozzle hole of the third air nozzle and the center of the fourth air nozzle hole of the fourth air nozzle. The fourth distance is less than the third distance and equal to the first distance.
[0013] In a preferred embodiment of the present invention, when the first air nozzle is switched to the lower position of the first guide groove and the second air nozzle is switched to the lower position of the second guide groove, there is a first distance between the center of the first air nozzle hole of the first air nozzle and the center of the second air nozzle hole of the second air nozzle, and there is a fifth distance between the center of the fifth air nozzle hole of the fifth air nozzle and the center of the sixth air nozzle hole of the sixth air nozzle, and the fifth distance is equal to the first distance. Attached Figure Description
[0014] Figure 1 This is a schematic diagram illustrating a first embodiment of a carrier disk applied to a wafer cassette carrier apparatus according to the technology disclosed in this invention.
[0015] Figure 2 This is a schematic diagram illustrating a second embodiment of a carrier disk applied to a wafer cassette carrier apparatus according to the technology disclosed in this invention.
[0016] Figure 3 This is a schematic diagram illustrating a third embodiment of a carrier disk applied to a wafer cassette carrier apparatus according to the technology disclosed in this invention.
[0017] Figure 4 This is a schematic diagram illustrating a fourth embodiment of a carrier disk applied to a wafer cassette carrier apparatus according to the technology disclosed in this invention.
[0018] Figure 5 This is a schematic diagram illustrating a fifth embodiment of a carrier disk applied to a wafer cassette carrier apparatus according to the technology disclosed in this invention.
[0019] Figure 6 This is a schematic diagram illustrating a sixth embodiment of a carrier disk applied to a wafer cassette carrier apparatus according to the technology disclosed in this invention. Detailed Implementation
[0020] To enable those skilled in the art to better understand the objectives, technical features, and advantages of this invention and to implement it, the technical features and embodiments of this invention are specifically illustrated in conjunction with the accompanying drawings, and preferred embodiments are further described. The drawings used in the following text are illustrative of the features of this invention and are not, and need not be, drawn in complete accordance with actual circumstances. Furthermore, technical content well-known to those skilled in the art is not described in the description of the embodiments of this invention.
[0021] Please refer to Figure 1 . Figure 1 This is a schematic diagram illustrating a first embodiment of a carrier disk applied to a wafer cassette carrier apparatus. Figure 1 In the figure, the carrier disk 1a has a body 10a and is disposed on the wafer carrier device (not shown in the figure). Additionally, in... Figure 1 In the Cartesian coordinate system, the upper and lower sides of the body 10a are represented by the Y direction, and the left and right sides of the body 10a are represented by the X direction. The body 10a of the bearing disk 1a has a first guide groove 12, a second guide groove 14, a third guide groove 16 and a fourth guide groove 18, the structure and positional relationship of which are detailed below.
[0022] The first guide groove 12 is disposed on the lower side of the main body 10a. A first switching element 122 and a first air nozzle 124 are disposed within the first guide groove 12. The first switching element 122 drives the first air nozzle 124 to move up and down within the first guide groove 12. The second guide groove 14 is disposed on the lower side of the main body 10a relative to the first guide groove 12. The second guide groove 14 is disposed within the second guide groove 14, and a second switching element 142 and a second air nozzle 144 are disposed within the second guide groove 14. The second switching element 142 drives the second air nozzle 144 to move up and down within the second guide groove 14 to switch positions. It should be noted that the first guide groove 12 and the second guide groove 14 are respectively disposed on the left and right sides of the lower side of the main body 10a. The angle between the direction of the up-and-down movement of the first air nozzle 124 and the X-direction is 90 degrees, and the angle between the direction of the up-and-down movement of the second air nozzle 144 and the X-direction is also 90 degrees. The third guide groove 16 is positioned above the body 10 relative to the first guide groove 12. The third guide groove 16 contains a third switching element 162 and a third air nozzle 164. The third switching element 162 drives the third air nozzle 164 to move obliquely to switch positions. The fourth guide groove 18 is positioned above the body 10 relative to the third guide groove 16. The fourth guide groove 18 contains a fourth switching element 182 and a fourth air nozzle 184. The fourth switching element 182 drives the fourth air nozzle 184 to move obliquely to switch positions. The angle between the oblique movement direction of the third air nozzle 164 and the X-direction is between 10 degrees and 35 degrees, and the angle between the oblique movement direction of the fourth air nozzle 184 and the X-direction is also between 10 degrees and 35 degrees. It should be further noted that the third guide groove 16 and the fourth guide groove 18 are respectively positioned above the first guide groove 12 and the second guide groove 14. In addition, at least three positioning points 20a, 20b, and 20c are defined on the outer sides of the third guide groove 16 and the fourth guide groove 18, respectively. Each positioning point 20a, 20b, and 20c corresponds to the position of the air hole at the bottom of a wafer transfer box (not shown in the figure) of a different type. Therefore, the third switching member 162 can drive the third air nozzle 164 to switch to one of the positioning points 20a, 20b, or 20c in the third guide groove 16; the fourth switching member 182 can drive the fourth air nozzle 184 to switch to one of the positioning points 20a, 20b, or 20c in the fourth guide groove 18. Based on the above, according to the multiple air vent positions (not shown in the figure) on the bottom (not shown in the figure) of the wafer transfer box (not shown in the figure), the first switching member 122 drives the first air nozzle 124, the second switching member 142 drives the second air nozzle 144, the third switching member 162 drives the third air nozzle 164, and the fourth switching member 182 drives the fourth air nozzle 184 to move and switch positions, so that the switched positions can correspond to the multiple air vent positions (not shown in the figure) of different types of wafer transfer boxes (not shown in the figure) and inflate or de-vent the wafer transfer box (not shown in the figure).In other words, the distribution of the bottom air holes in different types of wafer transfer boxes will also be different. The carrier tray of this embodiment can correspond to at least three wafer transfer boxes with different air hole distributions by switching the position of the air nozzle. Examples will be given below.
[0023] exist Figure 1 In the figure, when the carrier disk 1a carries the first wafer transfer box (not shown), in order to correspond to the distribution of the air holes at the bottom of the first wafer transfer box, the first air nozzle 124 of the carrier disk 1a is switched to the upper side of the first guide groove 12, the second air nozzle 144 is switched to the upper side of the second guide groove 14, the third air nozzle 164 is located at the outermost position of the third guide groove 16 (positioning point 20a), and the fourth air nozzle 184 is located at the outermost position of the fourth guide groove 18 (positioning point 20a). There is a first distance L1 between the center of the first air nozzle hole 1242 of the first air nozzle 124 and the center of the second air nozzle hole 1442 of the second air nozzle 14, and there is a second distance L2 between the center of the third air nozzle hole 1642 of the third air nozzle 164 and the center of the fourth air nozzle hole 1842 of the fourth air nozzle 184, and the second distance L2 is greater than the first distance L1.
[0024] Please refer to Figure 2 , Figure 2 This is a schematic diagram illustrating a second embodiment of a carrier disk applied to a wafer carrier device. Figure 2 The structure and position of the first guide groove 12, second guide groove 14, third guide groove 16, and fourth guide groove 18 of the body 10a of the carrier disk 1a are related to the aforementioned Figure 1 The same applies, so I won't elaborate further. For example... Figure 2 As shown, when the carrier disk 1a carries the second wafer transfer box (not shown in the figure), in order to correspond to the air hole position distribution at the bottom (not shown in the figure) of the second wafer transfer box, the first air nozzle 124 of the carrier disk 1a is switched to the upper position of the first guide groove 12, and the second air nozzle 144 is switched to the upper position of the second guide groove 14. At this time, the third air nozzle 164 is located at the uppermost position of the third guide groove 16 (positioning point 20b), and the fourth air nozzle 184 is located at the uppermost position of the fourth guide groove 18 (positioning point 20b). There is a third distance L3 between the center of the third air nozzle hole 1642 of the third air nozzle 164 and the center of the fourth air nozzle hole 1842 of the fourth air nozzle 184, and the third distance L3 is less than the second distance L2 (e.g., ...). Figure 1 (as shown) and greater than the first distance L1.
[0025] Please refer to Figure 3 , Figure 3 This is a schematic diagram illustrating a third embodiment of a carrier disk applied to a wafer cassette carrier apparatus. Similarly, Figure 3The structure and position of the first guide groove 12, second guide groove 14, third guide groove 16, and fourth guide groove 18 of the body 10a of the carrier disk 1a are related to the aforementioned Figure 1 The same applies, so I won't elaborate further. For example... Figure 3 As shown, when the carrier disk 1a carries the third wafer transfer box (not shown in the figure), in order to correspond to the air hole position distribution at the bottom (not shown in the figure) of the third wafer transfer box, the first air nozzle 124 of the carrier disk 1a is switched to the lower side of the first guide groove 12, and the second air nozzle 144 is switched to the lower side of the second guide groove 14. At this time, the third air nozzle 164 is located at the innermost position of the third guide groove 16 (positioning point 20c), and the fourth air nozzle 184 is located at the innermost position of the fourth guide groove 18 (positioning point 20c). There is a fourth distance L4 between the center of the third air nozzle hole 1642 of the third air nozzle 164 and the center of the fourth air nozzle hole 1842 of the fourth air nozzle 184, and the fourth distance L4 is less than the third distance L3 (e.g., ...). Figure 2 (as shown) and equal to the first distance L1.
[0026] Please refer to Figure 4 , Figure 4 This is a schematic diagram illustrating a fourth embodiment of a carrier disk applied to a wafer cassette carrier apparatus. Figure 4 In the figure, the carrier disk 1b has a body 10b and is disposed on the wafer carrier device (not shown). Additionally, in... Figure 4 In the Cartesian coordinate system, the Y direction represents the upper and lower sides of the body 10b, and the X direction represents the left and right sides of the body 10b. The body 10b of the bearing disk 1b has a first guide groove 12, a second guide groove 14, a third guide groove 30, and a fourth guide groove 32, the structure and positional relationship of which are detailed below.
[0027] The first guide groove 12 is located on the lower side of the body 10b. A first switching element 122 and a first air nozzle 124 are disposed within the first guide groove 12. The first switching element 122 drives the first air nozzle 124 to move up and down within the first guide groove 12. The second guide groove 14 is located on the lower side of the body 10b relative to the first guide groove 12. A second switching element 142 and a second air nozzle 144 are disposed within the second guide groove 14. The second switching element 142 drives the second air nozzle 144 to move up and down within the second guide groove 14 to switch positions. It should be noted that the first guide groove 12 and the second guide groove 14 are respectively located on the left and right sides of the lower side of the body 10b. The third guide groove 30 is located on the upper side of the body 10b relative to the first guide groove 12. A third switching element 302 and a third air nozzle 304 are disposed within the third guide groove 30. The third switching element 302 drives the third air nozzle 304 to move obliquely to switch positions. The fourth guide groove 32 is positioned on the upper side of the body 10b relative to the third guide groove 30. The fourth guide groove 32 contains a fourth switching element 322 and a fourth air nozzle 324. The fourth switching element 322 drives the fourth air nozzle 324 to move obliquely to switch positions. Additionally, at least two positioning points 22a and 22b are defined on the outer sides of the third guide groove 30 and the fourth guide groove 32. Each positioning point 22a and 22b corresponds to the air hole position at the bottom of a wafer transfer box (not shown in the figure) of a different type. Therefore, the third switching element 302 can drive the third air nozzle 304 to switch to one of the positioning points 22a or 22b within the third guide groove 30; the fourth switching element 322 can drive the fourth air nozzle 324 to switch to one of the positioning points 22a or 22b within the fourth guide groove 32. In this embodiment, the fifth air nozzle 40 and the sixth air nozzle 42 are respectively disposed on the upper side of the body 10b, and the distance L5 between the fifth air nozzle 40 and the sixth air nozzle 42 is less than the second distance L2 between the third air nozzle 304 and the fourth air nozzle 324, but equal to the first distance L1.
[0028] exist Figure 4In the process of carrying the first wafer transfer box (not shown in the figure), when the carrier tray 1b carries the first wafer transfer box, in order to correspond to the distribution of the air holes at the bottom of the first wafer transfer box, the first air nozzle 124 of the carrier tray 1b is switched to the upper position of the first guide groove 12, the second air nozzle 144 is switched to the upper position of the second guide groove 14, and when the third air nozzle 304 of the third guide groove 30 and the fourth air nozzle 324 of the fourth guide groove 32 are at the positioning point 22a, the third air nozzle 304 is located at the outermost position of the third guide groove 30 (positioning point 22a), and the fourth air nozzle 324 is located at the outermost position of the third guide groove 30. At the outermost position of the four guide grooves 30 (positioning point 22a), there is a first distance L1 between the center of the first air nozzle hole 1242 of the first air nozzle 124 and the center of the second air nozzle hole 1442 of the second air nozzle 14, and a fifth distance L5 between the fifth air nozzle 40 and the sixth air nozzle 42. The first distance L1 is equal to the fifth distance L5. There is a second distance L2 between the center of the third air nozzle hole 3042 of the third air nozzle 304 and the center of the fourth air nozzle hole 3242 of the fourth air nozzle 324. The second distance L2 is greater than the first distance L1 and greater than the fifth distance L5.
[0029] Based on the above, according to the multiple air hole positions (not shown in the figure) at the bottom (not shown in the figure) of the first wafer transfer box (not shown in the figure), the first switching member 122 drives the first air nozzle 124, the second switching member 142 drives the second air nozzle 144, the third switching member 302 drives the third air nozzle 304 to be located at the outermost position (positioning point 22a) of the third guide groove 30, and the fourth switching member 322 drives the fourth air nozzle 324 to move and switch to be located at the outermost position (positioning point 22a) of the fourth guide groove 18, so that the switched position can correspond to the multiple air hole positions (not shown in the figure) of the wafer transfer box (not shown in the figure) and inflate or de-vent the first wafer transfer box (not shown in the figure).
[0030] Please refer to the following: Figure 5 . Figure 5 This is a schematic diagram illustrating a fifth embodiment of a carrier disk applied to a wafer carrier device. Figure 5 The structure and position of the first guide groove 12, the second guide groove 14, the third guide groove 30, and the fourth guide groove 32 of the body 10b of the carrier disk 1b are related to the aforementioned Figure 4 The same applies, so I won't elaborate further. Figure 5In the process of carrying the second wafer transfer box (not shown in the figure), when the carrier tray 1b carries the second wafer transfer box, in order to correspond to the distribution of the air holes at the bottom of the second wafer transfer box, the first air nozzle 124 of the carrier tray 1b is switched to the upper side of the first guide groove 12, the second air nozzle 144 is switched to the upper side of the second guide groove 14, the third air nozzle 304 is located at the uppermost position of the third guide groove 30 (positioning point 22b), and the fourth air nozzle 32 is located at the uppermost position of the fourth guide groove 30 (positioning point 22b), wherein the first air nozzle hole 1242 of the first air nozzle 124 is... There is a first distance L1 between the center of the third nozzle 304 and the center of the second nozzle hole 1442 of the second nozzle 144; there is a fifth distance L5 between the center of the fifth nozzle hole 402 of the fifth nozzle 40 and the center of the sixth nozzle hole 422 of the sixth nozzle 42; the first distance L1 is equal to the fifth distance L5; there is a third distance L3 between the center of the third nozzle hole 3042 of the third nozzle 304 and the center of the fourth nozzle hole 3242 of the fourth nozzle 324; the third distance L3 is less than the second distance L2 but greater than the first distance L1 and greater than the fifth distance L5.
[0031] Please refer to the following: Figure 6 . Figure 6 This is a schematic diagram illustrating a sixth embodiment of a carrier tray applied to a wafer cassette carrier apparatus. Similarly, Figure 6 The structure and position of the first guide groove 12, second guide groove 14, third guide groove 16, and fourth guide groove 18 of the body 10b of the carrier disk 1b are related to the aforementioned Figure 4 The same applies, so I won't elaborate further. Figure 6 In the process of carrying the third wafer transfer box (not shown in the figure), when the carrier disk 1b carries the third wafer transfer box, in order to correspond to the distribution of the air holes at the bottom of the third wafer transfer box, the first air nozzle 124 of the carrier disk 1b is switched to the lower side of the first guide groove 12, the second air nozzle 144 is switched to the lower side of the second guide groove 14, the third air nozzle 304 can be located at any position within the third guide groove 30, such as the outermost position (positioning point 22a), and the fourth air nozzle 32 can be located at any position within the fourth guide groove 30, such as the outermost position (positioning point 22a). There is a first distance L1 between the center of the first air nozzle hole 1242 of the air nozzle 124 and the center of the second air nozzle hole 1442 of the second air nozzle 14. There is a fifth distance L5 between the center of the fifth air nozzle hole 402 of the fifth air nozzle 40 and the center of the sixth air nozzle hole 422 of the sixth air nozzle 42. The first distance L1 is equal to the fifth distance L5. There is a second distance L2 between the center of the third air nozzle hole 3042 of the third air nozzle 304 and the center of the fourth air nozzle hole 3242 of the fourth air nozzle 324. The second distance L2 is greater than the first distance L1 and greater than the fifth distance L5.
[0032] In the foregoing embodiments, the first air nozzle 124 and the second air nozzle 144 are typically used for inflating the wafer transfer box (not shown in the figures), while the third air nozzle 164, the fourth air nozzle 184, the fifth air nozzle 40, and the sixth air nozzle hole 422 are typically used for venting the wafer transfer box (not shown in the figures). However, in another embodiment, the third air nozzle 164 may be used for inflating the wafer transfer box (not shown in the figures), and the fourth air nozzle 184 may be used for venting the wafer transfer box (not shown in the figures). The invention does not limit the inflation or deflation function of each air nozzle, as long as the nozzle position can correspond to various types of wafer transfer boxes.
[0033] Based on the above, users only need to adjust the first air nozzle 124, second air nozzle 144, third air nozzle 164 and fourth air nozzle 184 of carrier tray 1a, and the first air nozzle 124, second air nozzle 144, third air nozzle 304 and fourth air nozzle 324 of carrier tray 1b according to the positions of multiple air holes on the bottom of the wafer transfer box (not shown in the figure). This increases the convenience of use and reduces the cost and space utilization of using different carrier trays for different positions of air holes on the bottom of different wafer transfer boxes (not shown in the figure).
[0034] The above description is merely a preferred embodiment of the present invention and is not intended to limit the scope of the present invention. Furthermore, the above description should be clear and implementable to those skilled in the art. Therefore, any equivalent changes or modifications made without departing from the spirit disclosed in the present invention should be included within the scope of the patent application.
Claims
1. A carrier tray used in a wafer cassette carrier device, characterized in that, Include: The main body is mounted on the wafer cassette carrier. A first guide groove is provided on the lower side of the main body. A first switching component and a first air nozzle are provided in the first guide groove. The first switching component drives the first air nozzle to move up and down to switch positions. The second guide groove is disposed on the lower side of the body relative to the first guide groove. The second guide groove is provided with a second switching component and a second air nozzle. The second switching component drives the second air nozzle to move up and down to switch positions. A third guide groove is disposed on the upper side of the body relative to the first guide groove. The third guide groove contains a third switching element and a third air nozzle. The third switching element drives the third air nozzle to move obliquely to a switching position. The fourth guide groove is disposed on the upper side of the body relative to the third guide groove. The fourth guide groove is provided with a fourth switching component and a fourth air nozzle. The fourth switching component drives the fourth air nozzle to move obliquely to switch positions. Specifically, based on the positions of multiple air holes on the bottom of the wafer transfer box, the first air nozzle, the second air nozzle, the third air nozzle, and the fourth air nozzle move to the corresponding air hole positions to inflate or de-air the wafer transfer box.
2. The carrier tray for the wafer cassette carrier device as described in claim 1 further includes a fifth air nozzle and a sixth air nozzle, respectively disposed on the upper side of the body, wherein the distance between the fifth air nozzle and the sixth air nozzle is less than the distance between the third air nozzle and the fourth air nozzle.
3. The carrier tray used in a wafer cassette carrier device as described in claim 1 or 2, characterized in that, When the first air nozzle is switched to the upper position of the first guide groove, and the second air nozzle is switched to the upper position of the second guide groove, the third air nozzle is located at the outermost position of the third guide groove, and the fourth air nozzle is located at the outermost position of the fourth guide groove. There is a first distance between the center of the first air nozzle hole of the first air nozzle and the center of the second air nozzle hole of the second air nozzle, and there is a second distance between the center of the third air nozzle hole of the third air nozzle and the center of the fourth air nozzle hole of the fourth air nozzle. The second distance is greater than the first distance.
4. The carrier tray used in a wafer cassette carrier device as described in claim 1 or 2, characterized in that, When the first air nozzle is switched to the upper position of the first guide groove, and the second air nozzle is switched to the upper position of the second guide groove, the third air nozzle is located at the uppermost position of the third guide groove, and the fourth air nozzle is located at the uppermost position of the fourth guide groove. There is a first distance between the center of the first air nozzle hole of the first air nozzle and the center of the second air nozzle hole of the second air nozzle, and there is a third distance between the center of the third air nozzle hole of the third air nozzle and the center of the fourth air nozzle hole of the fourth air nozzle. The third distance is greater than the first distance.
5. The carrier tray applied to the wafer cassette carrier device as described in claim 1, characterized in that, When the first air nozzle is switched to the lower position of the first guide groove, and the second air nozzle is switched to the lower position of the second guide groove, the third air nozzle is located at the innermost position of the third guide groove, and the fourth air nozzle is located at the innermost position of the fourth guide groove. There is a first distance between the center of the first air nozzle hole of the first air nozzle and the center of the second air nozzle hole of the second air nozzle, and there is a fourth distance between the center of the third air nozzle hole of the third air nozzle and the center of the fourth air nozzle hole of the fourth air nozzle. The fourth distance is equal to the first distance.
6. The carrier tray used in a wafer cassette carrier device as described in claim 2, characterized in that, When the first air nozzle is switched to the lower position of the first guide groove, and the second air nozzle is switched to the lower position of the second guide groove, there is a first distance between the center of the first air nozzle hole of the first air nozzle and the center of the second air nozzle hole of the second air nozzle, and there is a fifth distance between the center of the fifth air nozzle hole of the fifth air nozzle and the center of the sixth air nozzle hole of the sixth air nozzle, and the fifth distance is equal to the first distance.