Camera module with optical image stabilization function and preparation method thereof

Abstract

A camera module with an optical image stabilization function and a preparation method thereof. The camera module includes a housing and an optical assembly disposed within the housing. The camera module also includes a circuit board disposed within the housing, the circuit board including a first board and a second board disposed on the first board. The first board is a flexible circuit board. Along the extension direction of the first board, the first board includes a first part, a second part, and a third part connected in sequence. The second part is provided with a slot. The second board is disposed on the third part, and the optical assembly is mounted on the second board. The first part includes a fixed end connected to the second part and a free end opposite to the fixed end. A through hole is provided on the housing. The first part passes through the slot to form a bent portion. The first part further extends out of the through hole so that the free end is located outside the housing.

Description

Technical Field

[0001] The present application relates to a camera module, and in particular to a camera module with an optical image stabilization function and a method for preparing the camera module. Background Art

[0002] Electronic devices such as tablets, mobile phones, or smart watches are generally equipped with camera modules. When users use these electronic devices to take pictures, shaking hands may cause shaking, making the pictures blurry. Camera modules with optical image stabilization (OIS) can solve the problem of blurry pictures caused by shaking during shooting to a certain extent. OIS detects tiny movements through the gyroscope in the camera module, and then transmits the signal to the microprocessor, which calculates the displacement to be compensated, and then compensates the position of the lens based on the displacement to be compensated and the direction of the lens shake.

[0003] However, during the optical image stabilization process, the flexible circuit board that electrically connects the camera module to the mainboard also moves with the lens, increasing the resistance to the camera module's movement. Furthermore, the continuous stretching of the flexible circuit board can lead to breakage or poor contact, compromising product reliability. Summary of the Invention

[0004] In order to solve the above deficiencies of the prior art, it is necessary to provide a camera module with an optical image stabilization function.

[0005] In addition, it is also necessary to provide a method for preparing the above-mentioned camera module.

[0006] The present application provides a method for preparing a camera module, comprising the following steps: providing a circuit board, the circuit board comprising a first board and a second board arranged on the first board, the first board being a flexible circuit board, and along the extension direction of the first board, the first board comprising a first part, a second part and a third part connected in sequence, the second part being provided with a slot, the second board being provided on the third part, the first part comprising a fixed end connected to the second part and a free end opposite to the fixed end; installing an optical component on the second board to obtain an intermediate; providing a shell, the shell being provided with a through hole; passing the first part of the intermediate through the slot to form a bent portion, and placing the intermediate with the bent portion in the shell; further extending the first part passing through the slot through the through hole so that the free end is located outside the shell, thereby obtaining a camera module.

[0007] In some possible implementations, after the first portion extends out of the through hole, the preparation method further includes: providing adhesive between the through hole and the free end.

[0008] In some possible implementations, the housing includes a bottom wall, a top wall, and at least two side walls connected between the bottom and top walls, with a through hole defined in one side wall. The housing further includes a partition located between the at least two side walls, the partition dividing the interior of the housing into a first receiving space and a second receiving space. The first receiving space communicates with the through hole, the curved portion is located in the first receiving space, and the optical assembly, the second plate, and the third portion of the first plate are all located in the second receiving space.

[0009] In some possible implementations, a method for preparing a circuit board includes the following steps: providing a circuit substrate, the circuit substrate including a first board and an adhesive layer stacked on the first board and a second board, the second board being arranged on the first part, the second part and the third part, and the adhesive layer being provided with openings corresponding to the first part and the second part; removing the areas of the second board corresponding to the first part and the second part, thereby obtaining a circuit board.

[0010] The present application also provides a camera module, comprising a housing and an optical assembly disposed within the housing. The camera module also includes a circuit board disposed within the housing, the circuit board including a first board and a second board disposed on the first board. The first board is a flexible circuit board. Along the extension direction of the first board, the first board includes a first portion, a second portion, and a third portion connected in sequence. The second portion is provided with a slot. The second board is disposed on the third portion. The optical assembly is mounted on the second board. The first portion includes a fixed end connected to the second portion and a free end opposite the fixed end. A through hole is provided in the housing. The first portion passes through the slot to form a curved portion. The first portion further extends out of the through hole so that the free end is located outside the housing.

[0011] In some possible implementations, the bent portion is formed by bending the first portion at least twice.

[0012] In some possible implementations, glue is provided between the through hole and the first portion.

[0013] In some possible implementations, the housing includes a bottom wall, a top wall, and at least two side walls connected between the bottom and top walls, with a through hole defined in one side wall. The housing further includes a partition located between the at least two side walls, the partition dividing the interior of the housing into a first receiving space and a second receiving space. The first receiving space communicates with the through hole, the curved portion is located in the first receiving space, and the optical assembly, the second plate, and the third portion of the first plate are all located in the second receiving space.

[0014] In some possible implementations, along the width direction of the first plate, the width of the first portion is smaller than the width of the second portion, and the width of the second portion is equal to the width of the third portion.

[0015] In the present application, since the flexible circuit board is provided with a curved portion, the curved portion can be stretched to a certain extent when the camera module performs optical image stabilization, thereby reducing the resistance to the movement of the camera module and reducing the risk of the first board breaking or poor contact with the main board caused by the stretching process. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A cross-sectional view of a circuit substrate provided in one embodiment of the present application.

[0017] Figure 2A For Figure 1 The circuit substrate shown is a cross-sectional view after the cover is opened.

[0018] Figure 2B for Figure 2A A top view of the circuit substrate is shown.

[0019] Figure 3A For Figure 2A The cross-sectional view of the circuit board obtained after grooves are opened in the circuit substrate is shown.

[0020] Figure 3B for Figure 3A A top view of the circuit board is shown.

[0021] Figure 4A For Figure 3A A cross-sectional view of the intermediate body obtained after the optical component is mounted on the circuit board is shown.

[0022] Figure 4B for Figure 4A A top view of the intermediate is shown.

[0023] Figure 5 For the general Figure 4A The intermediate body shown is a cross-sectional view after being placed in the housing and the free end of the circuit board passes through the through hole of the housing.

[0024] Figure 6 For the general Figure 5 A cross-sectional view of the camera module obtained after the free end is fixed to the through hole of the shell.

[0025] Figure 7 for Figure 6 The camera module shown is a cross-sectional view in another state.

[0026] Description of main component symbols

[0027] Camera module 1

[0028] Intermediate 2

[0029] Circuit substrate 10

[0030] First board 11

[0031] Second board 12

[0032] Second adhesive layer 13

[0033] Optical components 20

[0034] Photosensitive chip 21

[0035] Bracket 22

[0036] Filter 23

[0037] Lens unit 24

[0038] Coil 25

[0039] Magnetic parts 26

[0040] Housing 30

[0041] Bottom wall 31

[0042] Top wall 32

[0043] Side wall 33

[0044] Partition 34

[0045] Viscose 40

[0046] Circuit board 100

[0047] Part 111

[0048] Part 2112

[0049] Part 3 113

[0050] Electrical connection portion 114

[0051] Opening 130

[0052] Mirror mount 241

[0053] Shot 242

[0054] First containment space 301

[0055] Second storage space 302

[0056] Light hole 320

[0057] Through hole 330

[0058] Grassroots 1101

[0059] First circuit layer 1102

[0060] First adhesive layer 1103

[0061] First covering layer 1104

[0062] Bend 1110

[0063] Slotted 1120

[0064] Second circuit layer 1201

[0065] Second covering layer 1202

[0066] Fixed end A

[0067] Free end B

[0068] Route E

[0069] Length direction D1

[0070] Width direction D2

[0071] Thickness direction D3

[0072] Diameter R

[0073] Thickness H

[0074] Width W1, W2, W3, W4

[0075] The following specific implementation methods will further illustrate this application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0076] In order to more clearly understand the above-mentioned purposes, features and advantages of the embodiments of the present application, the present application is described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the case of no conflict, the features in the embodiments of the present application can be combined with each other. In the following description, many specific details are set forth in order to fully understand the embodiments of the present application. The described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments.

[0077] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the art of the present application. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit the embodiments of this application.

[0078] One embodiment of the present application provides a method for preparing a camera module. The order of the steps of the preparation method can be changed according to different requirements, and some steps can be omitted or combined. The preparation method includes the following steps:

[0079] Step S1, see Figure 1, providing a circuit substrate 10. The circuit substrate 10 includes a first board 11 and a second board 12 disposed on the first board 11. The first board 11 is a flexible circuit board. Along the extension direction of the first board 11 (i.e., the length direction D1), the first board 11 includes a first portion 111, a second portion 112, and a third portion 113 connected in sequence. The second board 12 can be disposed on the first portion 111, the second portion 112, and the third portion 113 at the same time.

[0080] In some embodiments, the second board 12 is a rigid circuit board, and the second boards 12 are disposed on two opposite surfaces of the first board 11. In other embodiments, the second board 12 may also be a flexible circuit board.

[0081] Furthermore, the first board 11 includes a base layer 1101, and also includes a first circuit layer 1102, a first adhesive layer 1103, and a first cover layer 1104 sequentially disposed on one surface of the base layer 1101. Each second board 12 is bonded to the first cover layer 1104 via a second adhesive layer 13. Each second board 12 includes a second circuit layer 1201 and a second cover layer 1202, with the second circuit layer 1201 disposed between the second cover layer 1202 and the second adhesive layer 13. In other words, the circuit substrate 10 includes four circuit layers. However, it will be appreciated that in other embodiments, the number of circuit layers provided on the circuit substrate 10 may be increased or decreased as desired, and this application does not impose any limitation thereto.

[0082] The second adhesive layer 13 is provided with an opening 130 penetrating the second adhesive layer 13 . The opening 130 corresponds to the first portion 111 and the second portion 112 .

[0083] Step S2, see Figure 2A and Figure 2B , remove the area of ​​the second plate 12 corresponding to the first portion 111 and the second portion 112 (ie, open the cover), so that the first portion 111 and the second portion 112 are exposed on the second plate 12.

[0084] The first portion 111 includes a fixed end A connected to the second portion 112 and a free end B opposite to the fixed end A.

[0085] like Figure 2B As shown, in some embodiments, along the width direction D2 of the first plate 11, the width W1 of the first portion 111 is less than the width W2 of the second portion 112, and the width W2 of the second portion 112 is equal to the width W3 of the third portion 113. The first portion 111 is formed by extending outward from a position substantially in the center area of ​​the side of the second portion 112 away from the third portion 113.

[0086] Step S3, see Figure 3A and Figure 3BA through slot 1120 is formed in the second portion 112, thereby obtaining the circuit board 100. When the second board 12 is a rigid circuit board, the circuit board 100 obtained at this time is a rigid-flexible board.

[0087] like Figure 3B As shown, in some embodiments, along the width direction D2 of the first plate 11, the width W4 of the slot 1120 is greater than the width W1 of the first portion 111, so that a gap (not shown) is provided between the slot 1120 and the free end B. This facilitates the subsequent passage of the first portion 111 through the slot 1120, thereby reducing the friction of the free end B when passing through the slot 1120. The width of the gap can be set to approximately 1 mm.

[0088] It can be understood that the trace E of the first circuit layer 1102 of the first board 11 bypasses the slot 1120 , thereby avoiding damage to the circuit pattern after the slot 1120 is formed.

[0089] Step S4, see Figure 4A and Figure 4B , an optical component 20 is mounted on the second plate 12 to obtain an intermediate 2.

[0090] In some embodiments, the optical assembly 20 includes a photosensitive chip 21, a bracket 22, a filter 23, and a lens unit 24. The photosensitive chip 21 and the bracket 22 are both mounted on the second plate 12, and the photosensitive chip 21 is accommodated in the bracket 22. The lens unit 24 is mounted on the bracket 22, and the bracket 22 is disposed between the lens unit 24 and the second plate 12. The filter 23 is disposed in the bracket 22. The lens unit 24 includes a lens holder 241 and a lens 242 disposed in the lens holder 241. The lens holder 241 is disposed on the bracket 22, and the lens holder 241 can be integrally formed or assembled with the lens 242. The filter 23 is disposed between the photosensitive chip 21 and the lens 242, and the filter 23, the photosensitive chip 21, and the lens 242 correspond to each other.

[0091] In some embodiments, an electrical connection portion 114 may be installed at the free end B of the first portion 111. The electrical connection portion 114 is used to electrically connect the circuit board 100 to an external mainboard (not shown). The electrical connection portion 114 may be a connector or a gold finger.

[0092] Step S5, see Figure 5A housing 30 is provided. The housing 30 includes a bottom wall 31, a top wall 32, and four side walls 33 connected between the bottom wall 31 and the top wall 32. One side wall 33 is provided with a through hole 330. The first portion 111 of the intermediate body 2 is passed through the slot 1120 to form a bent portion 1110. The intermediate body 2 with the bent portion 1110 is placed in the housing 30. The first portion 111 that has passed through the slot 1120 is further extended out of the through hole 330 of the side wall 33, so that the free end B is located outside the housing 30.

[0093] Since the free end B is located outside the housing 30 , the circuit board 100 can be electrically connected to an external mainboard via the electrical connection portion 114 provided at the free end B.

[0094] In some embodiments, the top wall 32 is provided with a light hole 320 corresponding to the lens 242 of the lens unit 24, so that external light can pass through the light hole 320, the lens 242, the filter 23 in sequence, and finally form an image on the photosensitive chip 21.

[0095] In some embodiments, as Figure 5 As shown, the curved portion 1110 is formed by bending the first portion 111 once. The curved portion 1110 has a diameter R, which is defined as the dimension of the curved portion 1110 in the direction from the bottom wall 31 to the top wall 32 (i.e., the thickness direction D3 of the first plate 11). It will be understood that the diameter R of the curved portion 1110 is less than the thickness H of the housing 30 (i.e., the distance between the top wall 32 and the bottom wall 31), thereby avoiding an increase in the thickness of the camera module 1 due to the provision of the curved portion 1110. Of course, in another embodiment, the curved portion 1110 can also be formed by bending the first portion 111 at least twice. Taking the example of the curved portion 1110 being formed by bending the first portion 111 twice, during preparation, the free end B of the first portion 111 can be passed through the slot 1120 twice in succession to obtain the curved portion 1110. In actual application, the number of turns of the curved portion 1110 and the diameter of the curved portion 1110 can be changed as needed.

[0096] In some embodiments, the housing 30 further includes a partition 34 positioned between the two sidewalls 33. The partition 34 divides the interior of the housing 30 into a first receiving space 301 and a second receiving space 302. The first receiving space 301 communicates with the through-hole 330. The curved portion 1110 is disposed in the first receiving space 301. The optical assembly 20, the second board 12 of the circuit board 100, and the third portion 113 of the first board 11 are all disposed in the second receiving space 302. The second portion 112 of the first board 11 may be partially disposed in the first receiving space 301 and partially disposed in the second receiving space 302.

[0097] In some embodiments, the optical assembly 20 further includes a coil 25 and a magnetic member 26. The coil 25 is disposed on the other side wall 33 that is not provided with the through hole 330 and is away from the bent portion 1110, and the coil 25 is electrically connected to the circuit board 100. Correspondingly, the magnetic member 26 can be disposed on the side wall of the bracket 22. The circuit board 100 is used to energize the coil 25 when the optical assembly 20 shakes. When the coil 25 is energized, a mutual attraction is generated between the magnetic member 26 and the coil 25, driving the optical assembly 20 toward the coil 25. At the same time, since the external main board is connected to the first part 111, a pulling force is generated between the first part 111 and the optical assembly 20 to drive the optical assembly 20 toward the first part 111. The attraction between the magnetic member 26 and the coil 25 and the pulling force of the first part 111 work together to compensate for the shaking of the optical assembly 20.

[0098] Step S6, see Figure 6 , an adhesive 40 is provided between the through hole 330 and the first portion 111, so that the first portion 111 is fixed in the through hole 330. At this point, the camera module 1 is obtained.

[0099] Specifically, if Figure 7 As shown, if the optical component 20 shakes a certain angle in the clockwise direction, the coil 25 is energized, so that the magnetic part 26 corresponding to the coil 25 drives the optical component 20 to move to the left, and at the same time the first part 111 pulls the optical component 20 to move to the right, so that the optical component 20 rotates in the counterclockwise direction, thereby compensating for the shaking of the optical component 20 in the clockwise direction. Therefore, the optical axis of the lens 242 can always be directed toward the light hole 320. In some embodiments, the camera module 1 also includes a gyroscope (not shown) and a control chip (not shown). The gyroscope can be provided on the second plate 12 or the optical component 20 to sense whether the optical component 20 is tilted. The control chip controls the circuit board 100 to start or stop energizing the coil 25 according to the sensing result of the gyroscope.

[0100] In the present application, since the flexible circuit board 100 is provided with a bent portion 1110, when the camera module 1 performs optical image stabilization, the bent portion 1110 can be stretched to a certain extent, thereby reducing the resistance to the movement of the camera module 1 and reducing the risk of the first board 11 breaking or poor contact with the main board caused by the stretching process.

[0101] See also Figure 6 One embodiment of the present application further provides a camera module 1 , comprising a housing 30 , a circuit board 100 and an optical component 20 .

[0102] The housing 30 includes a bottom wall 31 , a top wall 32 , and four side walls 33 connected between the bottom wall 31 and the top wall 32 , wherein a through hole 330 is defined in one side wall 33 .

[0103] Circuit board 100 includes a first board 11 and a second board 12 disposed on first board 11. First board 11 is a flexible circuit board 100. Along its length D1, first board 11 comprises a first portion 111, a second portion 112, and a third portion 113, which are sequentially connected. Second board 12 is disposed on third portion 113, with first portion 111 and second portion 112 exposed from second board 12. Optical assembly 20 is mounted on second board 12. Second portion 112 has a slot 1120 extending therethrough.

[0104] The first portion 111 includes a fixed end A connected to the second portion 112 and a free end B opposite the fixed end A. The first portion 111 passes through the slot 1120 to form a curved portion 1110. The optical assembly 20 and the circuit board 100 are housed within the housing 30. The first portion 111, which passes through the slot 1120, further extends out of the through hole 330 of the side wall 33, with the free end B positioned outside the housing 30.

[0105] In some embodiments, along the width direction D2 of the first plate 11, the width W1 of the first portion 111 is less than the width W2 of the second portion 112, and the width W2 of the second portion 112 is equal to the width W3 of the third portion 113. The first portion 111 is formed by extending outward from a position substantially central to a side of the second portion 112 away from the third portion 113.

[0106] Along the width direction D2 of the first plate 11 , the width W4 of the slot 1120 is greater than the width W1 of the first portion 111 , so that a gap is provided between the slot 1120 and the free end B. The width of the gap can be set to be approximately 1 mm.

[0107] In some embodiments, the curved portion 1110 is formed by bending the first portion 111 once. The curved portion 1110 has a diameter R, which is defined as the dimension of the curved portion 1110 along the thickness direction D3 of the first plate 11. It will be understood that the diameter R of the curved portion 1110 is less than the thickness H of the camera module 1 (i.e., the thickness of the housing 30), thereby avoiding an increase in the thickness of the camera module 1 due to the provision of the curved portion 1110. Of course, in another embodiment, the curved portion 1110 can also be formed by bending the first portion 111 at least twice.

[0108] In some embodiments, the housing 30 further includes a partition 34 positioned between the two sidewalls 33. The partition 34 divides the interior of the housing 30 into a first receiving space 301 and a second receiving space 302. The first receiving space 301 communicates with the through-hole 330. The curved portion 1110 is disposed in the first receiving space 301. The optical assembly 20, the second board 12 of the circuit board 100, and the third portion 113 of the first board 11 are all disposed in the second receiving space 302. The second portion 112 of the first board 11 may be partially disposed in the first receiving space 301 and partially disposed in the second receiving space 302.

[0109] In some embodiments, the optical assembly 20 further includes a coil 25 and a magnetic member 26. The plurality of coils 2 are respectively disposed on the other side wall 33 that is not provided with the through-hole 330 and is away from the bent portion 1110, and the coil 25 is electrically connected to the circuit board 100. Correspondingly, the magnetic member 26 can be disposed on the side wall of the bracket 22. The circuit board 100 is used to energize the coil 25 when the optical assembly 20 shakes. When the coil 25 is energized, a mutual attraction is generated between the magnetic member 26 and the coil 25, driving the optical assembly 20 toward the coil 25. At the same time, since the external main board is connected to the first portion 111, a pulling force is generated between the first portion 111 and the optical assembly 20 to drive the optical assembly 20 toward the first portion 111. The attraction between the magnetic member 26 and the coil 25 and the pulling force of the first portion 111 work together to compensate for the shaking of the optical assembly 20.

[0110] In some embodiments, an adhesive 40 is disposed between the through hole 330 and the first portion 111 , and the adhesive 40 is used to fix the first portion 111 in the through hole 330 .

[0111] In some embodiments, the free end B is provided with an electrical connection portion 114. The electrical connection portion 114 is used to electrically connect the circuit board 100 to an external mainboard. The electrical connection portion 114 may be a connector or a gold finger.

[0112] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application and are not intended to limit the present application. Although the present application has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present application may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. A method for preparing a camera module, characterized in that: The steps include: A circuit board is provided, the circuit board comprising a first board and a second board disposed on the first board, the first board being a flexible circuit board, the first board comprising a first portion, a second portion, and a third portion connected in sequence along an extension direction of the first board, the second portion being provided with a slot, the second board being disposed on the third portion, the first portion comprising a fixed end connected to the second portion and a free end opposite the fixed end; Installing an optical component on the second plate to obtain an intermediate; Providing a housing, wherein the housing is provided with a through hole; Passing the first portion of the intermediate body through the slot to form a curved portion, and placing the intermediate body with the curved portion in the housing; The first portion passing through the slot is further extended out of the through hole so that the free end is located outside the shell, thereby obtaining the camera module.

2. The method for preparing a camera module according to claim 1, wherein: After extending the first portion out of the through hole, the preparation method further includes: Adhesive is provided between the through hole and the first portion.

3. The method for preparing a camera module according to claim 1, wherein: The housing comprises a bottom wall, a top wall and at least two side walls connected between the bottom wall and the top wall, and one of the side walls is provided with the through hole; The shell is also provided with a partition located between at least two of the side walls, and the partition divides the interior of the shell into a first receiving space and a second receiving space. The first receiving space is connected to the through hole, and the curved portion is arranged in the first receiving space. The optical component, the second plate and the third part of the first plate are all arranged in the second receiving space.

4. The method for preparing a camera module according to claim 1, wherein: The method for preparing the circuit board comprises the following steps: Providing a circuit substrate, the circuit substrate comprising a first plate, an adhesive layer stacked on the first plate, and a second plate, the second plate being disposed on the first portion, the second portion, and the third portion, the adhesive layer having openings corresponding to the first portion and the second portion; The regions of the second board corresponding to the first portion and the second portion are removed to obtain the circuit board.

5. A camera module comprising a housing and an optical component disposed in the housing, wherein: The camera module further includes a circuit board disposed in the housing, the circuit board including a first board and a second board disposed on the first board, the first board being a flexible circuit board, and including a first portion, a second portion, and a third portion connected in sequence along an extension direction of the first board, the second portion being provided with a slot, the second board being disposed on the third portion, and the optical assembly being mounted on the second board; The first part includes a fixed end connected to the second part and a free end opposite to the fixed end. A through hole is provided on the shell. The first part passes through the slot to form a bent portion. The first part further extends out of the through hole so that the free end is located outside the shell.

6. The camera module according to claim 5, wherein: The bent portion is formed by bending the first portion at least twice.

7. The camera module according to claim 5, wherein: Along the thickness direction of the first plate, a diameter of the bent portion is smaller than a thickness of the housing.

8. The camera module according to claim 5, wherein: Adhesive is provided between the through hole and the first portion.

9. The camera module according to claim 5, wherein: The housing comprises a bottom wall, a top wall and at least two side walls connected between the bottom wall and the top wall, and one of the side walls is provided with the through hole; The shell is also provided with a partition located between at least two of the side walls, and the partition divides the interior of the shell into a first receiving space and a second receiving space. The first receiving space is connected to the through hole, and the curved portion is arranged in the first receiving space. The optical component, the second plate and the third part of the first plate are all arranged in the second receiving space.

10. The camera module according to claim 5, wherein: Along the width direction of the first plate, the width of the first portion is smaller than the width of the second portion, and the width of the second portion is equal to the width of the third portion.

Images