Backlight unit having light emitting chip and display apparatus having the same

Abstract

Disclosed are a backlight unit having light emitting chips and a display apparatus having the backlight unit. The backlight unit includes a driving voltage line on a substrate and a ground voltage line spaced apart from the driving voltage line. The light emitting chips are on a lower insulating layer covering the driving voltage line and the ground voltage line. A driving chip electrically connected to the ground voltage line can be on the substrate. Each of the light emitting chips can be electrically connected between the driving voltage line and the driving chip through a light emitting connection line. A driving dummy pattern and / or a ground dummy pattern are between the light emitting chips and the light emitting connection line. The driving dummy pattern is electrically connected to the driving voltage line, and the ground dummy pattern is electrically connected to the ground voltage line. Accordingly, a brightness difference of the light emitting chips can be prevented or at least reduced.

Description

TECHNICAL FIELD

[0001] The disclosure relates to a backlight unit and a display apparatus including the same, and more particularly to a backlight unit in which a light source module includes light emitting chips disposed side by side on a light source substrate, and a display apparatus including the same. BACKGROUND

[0002] Generally, a display apparatus provides an image to a user. For example, the display apparatus can include a liquid crystal panel on a backlight unit. The backlight unit can provide light to the liquid crystal panel. For example, the backlight unit can have a stacked structure of a light source module and an optical sheet.

[0003] The light source module can include light emitting chips. Each of the light emitting chips can emit light. For example, the light emitting chips can be disposed side by side on a light source substrate. A driving voltage line, a ground voltage line, and a driving chip can be disposed on the light source substrate. The driving chip can be electrically connected to the ground voltage line. Each of the light emitting chips can be electrically connected between the driving voltage line and the driving chip through a light emitting connection line. SUMMARY

[0004] The inventors of the disclosure have recognized that in a backlight unit and a display apparatus including the same, a driving voltage applied to each of the light emitting chips or a ground voltage applied to the driving chip can be changed by a resistance of the driving voltage line and / or a resistance of the ground voltage line. Accordingly, in the backlight unit and the display apparatus including the same, a luminance difference of each of the light emitting chips can occur.

[0005] Accordingly, the disclosure relates to a backlight unit and a display apparatus including the same that substantially obviates one or more problems due to limitations and disadvantages of the related art.

[0006] An object of the disclosure is to provide a backlight unit and a display apparatus including the same that can prevent or at least reduce a luminance difference of each of the light emitting chips.

[0007] Another object of the disclosure is to provide a backlight unit and a display apparatus including the same that can reduce a resistance of a driving voltage line and / or a resistance of a ground voltage line without reducing process efficiency.

[0008] Additional advantages, objects, and features of the disclosure will be set forth in part in the description which follows and will be apparent to those skilled in the art upon examination of the following or can be learned from practice of the disclosure. The advantages and objects of the disclosure can be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.

[0009] To achieve these objectives and other advantages and in accordance with the purposes of this disclosure, as implemented and broadly described herein, a backlight unit is provided, comprising: a ground voltage line located on a light source substrate; a lower insulating layer located on the light source substrate and situated on the ground voltage line; a plurality of light-emitting chips located on the lower insulating layer and spaced apart from the ground voltage line; a plurality of light-emitting connecting lines located on the lower insulating layer and electrically connecting the plurality of light-emitting chips together; and a grounding dummy pattern located between the plurality of light-emitting chips and the plurality of light-emitting connecting lines, the grounding dummy pattern overlapping with and electrically connected to the ground voltage line.

[0010] In one embodiment, a display device includes: a backlight unit including a light source module configured to emit light and an optical sheet located on the light source module; and a liquid crystal panel located on the optical sheet of the backlight unit, wherein the light source module includes: a driving voltage line located on a light source substrate; a lower insulating layer located on the driving voltage line; a plurality of light-emitting chips located on the lower insulating layer; a driving chip spaced apart from the plurality of light-emitting chips; a plurality of light-emitting connecting lines electrically connecting each of the plurality of light-emitting chips to the driving voltage line and the driving chip; and a driving dummy pattern located between the plurality of light-emitting chips and the plurality of light-emitting connecting lines, wherein the plurality of light-emitting chips do not overlap with the driving voltage line, and the driving voltage line is electrically connected to the driving dummy pattern.

[0011] In one embodiment, a backlight unit includes: a substrate; a voltage line located on a first portion of the substrate; a ground voltage line located on a second portion of the substrate, the second portion being different from the first portion of the substrate; a first insulating layer located on the voltage line and the ground voltage line; a light-emitting chip configured to emit light, the light-emitting chip being located between the voltage line and the ground voltage line and electrically connected to the voltage line and the ground voltage line; and a first conductive pattern located on the first insulating layer, the first conductive pattern overlapping with the ground voltage line and passing through the first insulating layer and electrically connected to the ground voltage line. Attached Figure Description

[0012] The accompanying drawings are included to provide a further understanding of this disclosure and are incorporated in and constitute a part of this application. The drawings illustrate embodiments of the disclosure and, together with the description, serve to explain the principles of the disclosure. In the drawings:

[0013] Figure 1 This is a schematic diagram illustrating a display device according to an embodiment of the present disclosure;

[0014] Figure 2 This is a diagram showing a portion of a light source module in a display device according to an embodiment of the present disclosure;

[0015] Figure 3 It is according to the embodiments of this disclosure along Figure 2 The image captured by I-I';

[0016] Figures 4 to 8 This is a diagram schematically illustrating a method of forming a backlight unit in a display device according to an embodiment of the present disclosure; and

[0017] Figure 9 and Figure 10 This is a diagram illustrating a display device according to other embodiments of the present disclosure. Detailed Implementation

[0018] In the following detailed description, with reference to the accompanying drawings illustrating some embodiments of the present disclosure, the details relating to the above-described objectives, technical configurations, and operational effects of the embodiments of the present disclosure will become clear. Embodiments of the present disclosure are provided here to satisfy those skilled in the art, and therefore the present disclosure can be implemented in other forms and is not limited to the embodiments described below.

[0019] Furthermore, throughout the specification, identical or very similar elements may be represented by the same reference numerals, and in the drawings, for convenience, the length and thickness of layers and regions may be exaggerated. It should be understood that when a first element is referred to as being "on" a second element, although the first element may be disposed on the second element to contact it, a third element may be inserted between the first and second elements. When a first element is described as being disposed on a second element, this can be used to indicate that the first element is disposed on or above the second element, for example, in a layer above the second element, in direct contact with the second element, or with another element between them. As used herein, a first element disposed on or above a second element can be used to indicate that in a cross-sectional view, the first element is on or above the second element in a vertical direction, i.e., the first element is closer to the front (display) surface of the display unit or closer to the front surface of the backlight unit from which it emits light.

[0020] Here, the terms "first" and "second" may be used to distinguish one element from another. However, without departing from the technical spirit of this disclosure, the first and second elements may be named arbitrarily according to the convenience of those skilled in the art.

[0021] The terminology used in this disclosure is for the purpose of describing particular embodiments only and is not intended to limit the scope of this disclosure. For example, unless the context clearly indicates otherwise, elements described in the singular are intended to include multiple elements. Furthermore, it will be understood in this disclosure that the terms “comprising” and “including” specify the presence of the stated features, integers, steps, operations, elements, components, and / or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or combinations thereof.

[0022] Unless otherwise specified, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which the exemplary embodiments pertain. It should also be understood that terms such as those defined in common dictionaries shall be interpreted as having meanings consistent with their meanings in the context of the relevant art and shall not be interpreted as having idealized or overly formal meanings unless expressly defined herein.

[0023] (Implementation Method)

[0024] Figure 1 This is a diagram schematically illustrating a display device according to an embodiment of the present disclosure. Figure 2 This is a diagram showing a portion of a light source module in a display device according to an embodiment of the present disclosure. Figure 3 It is according to the embodiments of this disclosure along Figure 2 The image captured by I-I'.

[0025] Reference Figures 1 to 3 The display device according to embodiments of the present disclosure may include a backlight unit BL and a liquid crystal panel LP. The liquid crystal panel LP may use light provided from the backlight unit BL to generate an image to be displayed to a user. For example, the liquid crystal panel LP may include a first substrate in which a plurality of pixel electrodes are formed, a second substrate in which a common electrode is formed, and a liquid crystal layer located between the first substrate and the second substrate.

[0026] The backlight unit BL can provide light to the entire area of ​​the liquid crystal panel LP. For example, the backlight unit BL can have a stacked structure of a light source module 100 and an optical sheet 200.

[0027] The light source module 100 can generate light to be supplied to the liquid crystal panel LP. For example, the light source module 100 may include light-emitting chips 150 located on a light source substrate 110. The light source substrate 110 may support the light-emitting chips 150. The light source substrate 110 may include an insulating material. For example, the light source substrate 110 may include glass or plastic. Each light-emitting chip in the light-emitting chips 150 can emit light. For example, each light-emitting chip in the light-emitting chips 150 may include a light-emitting diode (LED). The light-emitting chips 150 may be arranged side by side on the light source substrate 110. For example, the backlight unit of the display device according to embodiments of the present disclosure may be a direct light type.

[0028] A ground voltage line 120 for transmitting ground voltage, a drive voltage line 130 for providing drive voltage to the light-emitting chip 150, and a drive chip 140 for controlling the on / off state of the light-emitting chip 150 can be disposed on the light source substrate 110. Therefore, the light-emitting chip 150 is electrically connected to the drive voltage line 130 and the ground voltage line 120. Figure 3 As shown, the driving voltage line 130 can be on the first part of the light source substrate 110, and the ground voltage line 120 can be on the second part of the light source substrate 110, which is different from the first part.

[0029] The grounding voltage line 120 may include a conductive material. The grounding voltage line 120 may include a material with relatively low resistance. For example, the grounding voltage line 120 may include metals such as copper (Cu), nickel (Ni), silver (Ag), gold (Au), platinum (Pt), and aluminum (Al). The grounding voltage line 120 may extend in one direction.

[0030] The driving voltage line 130 may include a conductive material. The driving voltage line 130 may include a material with relatively low resistance. For example, the driving voltage line 130 may include metals such as copper (Cu), nickel (Ni), silver (Ag), gold (Au), platinum (Pt), and aluminum (Al). The driving voltage line 130 may include the same material as the ground voltage line 120. The driving voltage line 130 may be formed in the same process as the ground voltage line 120. For example, the driving voltage line 130 may be formed simultaneously with the ground voltage line 120. The driving voltage line 130 may be disposed on the same layer as the ground voltage line 120. The driving voltage line 130 may be spaced apart from the ground voltage line 120. For example, the driving voltage line 130 may extend parallel to the ground voltage line 120.

[0031] The driver chip 140 may include a first input terminal I1 to which an address signal is input, a second input terminal I2 to which a ground voltage is input, and a first output terminal O1 from which a control signal for controlling the operation of the light-emitting chip 150 is output. For example, the second input terminal I2 of the driver chip 140 may be electrically connected to the ground voltage line 120. Each light-emitting chip 150 may be electrically connected between the driving voltage line 130 and the first output terminal O1 of the driver chip 140. For example, each light-emitting chip in the light-emitting chip 150 may include a first chip pad 150a to which a driving voltage is applied by the driving voltage line 130, and a second chip pad 150b to which a control signal is applied by the driver chip 140.

[0032] The driving chip 140 and the light-emitting chip 150 can be disposed on different layers from the ground voltage line 120 and the driving voltage line 130. For example, a lower insulating layer 111 covering the ground voltage line 120 and the driving voltage line 130 can be disposed on the light source substrate 110, and the driving chip 140 and the light-emitting chip 150 can be disposed on the lower insulating layer 111. The lower insulating layer 111 may include an insulating material. For example, the lower insulating layer 111 may be an inorganic layer made of an inorganic insulating material such as silicon oxide (SiOx) and silicon nitride (SiNx). The lower insulating layer 111 may have a multilayer structure. For example, the lower insulating layer 111 may have a stacked structure of an inorganic layer made of silicon oxide (SiOx) and an inorganic layer made of silicon nitride (SiNx). Therefore, in the display device according to the embodiments of the present disclosure, diffusion and / or movement of the metal constituting the ground voltage line 120 and the metal constituting the driving voltage line 130 through adjacent components can be prevented or at least reduced. In other words, in the display device according to the embodiments of the present disclosure, migration of the metal constituting the ground voltage line 120 and the metal constituting the drive voltage line 130 can be prevented or at least reduced.

[0033] The light-emitting chip 150 can be disposed outside the ground voltage line 120 and the driving voltage line 130. That is, the light-emitting chip 150 does not overlap with either the ground voltage line 120 or the driving voltage line 130. For example, the ground voltage line 120 and the driving voltage line 130 can extend in one direction between the light-emitting chips 150. The light-emitting chip 150 can be spaced apart from the ground voltage line 120 and the driving voltage line 130. For example, as... Figure 3As shown, the light-emitting chip 150 is located horizontally between the ground voltage line 120 and the driving voltage line 130. In other words, a plurality of light-emitting chips 150 can be spaced apart from the ground voltage line 120 and the driving voltage line 130 in a direction parallel to the front (display) surface of the display device (i.e., in a direction parallel to the front surface of the backlight unit from which it emits light). Therefore, in the display device according to the embodiments of the present disclosure, failures of the light-emitting chip 150 due to parasitic capacitances formed between the ground voltage line 120 and the light-emitting chip 150 and / or between the driving voltage line 130 and the light-emitting chip 150 can be prevented or at least reduced.

[0034] Each light-emitting chip in the light-emitting chip 150 can be controlled differently from its neighboring light-emitting chips 150. For example, in the backlight unit BL of a display device according to an embodiment of the present disclosure, the light source substrate 110 can be divided into multiple light-emitting blocks LB, and the light-emitting chips 150 in each light-emitting block LB can be simultaneously controlled by a driving chip 140. Therefore, in the display device according to an embodiment of the present disclosure, local dimming can be implemented in which light with different brightness for each area is provided to the liquid crystal panel LP through the backlight unit BL. The driving chip 140 of each light-emitting block LB can send an address signal to the driving chips 140 of adjacent light-emitting blocks LB. For example, the driving chip 140 of each light-emitting block LB may include a second output terminal O2 for sending the address signal, and a first input terminal I1 of one driving chip 140 can be electrically connected to the second output terminal O2 of an adjacent driving chip 140 via an address connection line 162. The address connection line 162 may include a conductive material. The address connection line 162 may include a material with relatively low resistance. For example, address connection 162 may include metals such as copper (Cu), nickel (Ni), silver (Ag), gold (Au), platinum (Pt), and aluminum (Al). Address connection 162 may be disposed on the lower insulating layer 111.

[0035] The light-emitting chips 150 can be interconnected with each other via light-emitting interconnects 161. For example, the light-emitting chips 150 in each light-emitting block LB can be connected in series between the driving voltage line 130 and the driving chip 140 via light-emitting interconnects 161. The light-emitting interconnects 161 may include a conductive material. The light-emitting interconnects 161 may include a material with relatively low resistance. For example, the light-emitting interconnects 161 may include metals such as copper (Cu), nickel (Ni), silver (Ag), gold (Au), platinum (Pt), and aluminum (Al). The light-emitting interconnects 161 may be disposed on the lower insulating layer 111. For example, each light-emitting interconnect in the light-emitting interconnects 161 between the light-emitting chips 150 may include a first end 161a contacting a first chip pad 150a of one of the light-emitting chips 150, and a second end 161b contacting a second chip pad 150b of one of the light-emitting chips 150. The light-emitting interconnects 161 may include the same material as the address interconnects 162. The light-emitting interconnects 161 may be formed in the same process as the address interconnects 162. For example, the light-emitting connection line 161 can be formed simultaneously with the address connection line 162. The light-emitting connection line 161 and the address connection line 162 can be disposed on the same layer.

[0036] The grounding dummy pattern 171 and the driving dummy pattern 172 can be disposed between the light-emitting chips 150, between the light-emitting connecting lines 161, and / or between the light-emitting chips 150 and the light-emitting connecting lines 161. The grounding dummy pattern 171 and the driving dummy pattern 172 can include conductive materials. The grounding dummy pattern 171 and the driving dummy pattern 172 can include materials with relatively low resistance. For example, the grounding dummy pattern 171 and the driving dummy pattern 172 can include metals such as copper (Cu), nickel (Ni), silver (Ag), gold (Au), platinum (Pt), and aluminum (Al).

[0037] The grounding dummy pattern 171 can be electrically connected to the grounding voltage line 120. The grounding dummy pattern 171 can be connected to the grounding...

[0038] Voltage lines 120 overlap. For example, the lower insulation layer 111 may include at least one set of five grounding contact holes that partially expose the grounding voltage lines 120. The grounding dummy pattern 171 can directly contact the grounding voltage lines 120 through the grounding contact holes.

[0039] Therefore, in the display device according to the embodiments of this disclosure, the resistance of the grounding voltage line 120 can be reduced. As used herein, references to the first element overlapping the second element can be used to indicate that the first element and the second element overlap perpendicularly in a cross-sectional view, that is, the first element and the second element are perpendicular to the rear surface of the display device.

[0040] Alignment is achieved between the front (display) surfaces or between the rear surface of the backlight unit and the front surface of the backlight unit from which it emits light along the 0-direction.

[0041] The grounding dummy pattern 171 may include the same material as the light-emitting connection line 161. The grounding dummy pattern 171 may be formed in the same process as the light-emitting connection line 161. For example, the grounding dummy pattern 171 may be formed simultaneously with the light-emitting connection line 161. The grounding dummy pattern 171 may be disposed on the same layer as the light-emitting connection line 161. Therefore,

[0042] In the display device according to the embodiments of the present disclosure, the resistance of the grounding voltage line 120 can be reduced without reducing process efficiency.

[0043] The drive dummy pattern 172 can be electrically connected to the drive voltage line 130. The drive dummy pattern 172 can overlap with the drive voltage line 130. For example, the lower insulating layer 111 may include at least one drive contact hole that partially exposes the drive voltage line 130. The drive dummy pattern 172 can directly contact the drive voltage line 130 through the drive contact hole.

[0044] Therefore, in the display device according to the embodiments of the present disclosure, the resistance of the drive voltage line 130 can be reduced. The drive dummy pattern 172 may include the same material as the ground dummy pattern 171. For example, the drive dummy pattern 172 may be formed simultaneously with the ground dummy pattern 171. The drive dummy pattern 172 may be disposed on the same layer as the ground dummy pattern 171. Therefore, in the display device according to the embodiments of the present disclosure, the resistance of the drive voltage line 130 can be reduced without reducing process efficiency.

[0045] The upper insulating layer 112 can be disposed on the light-emitting connection line 161, the address connection line 162, the grounding dummy pattern 1715, and the driving dummy pattern 172. The upper insulating layer 112 may include an insulating material. For example, the upper insulating layer 112 may be an inorganic layer made of an inorganic insulating material such as silicon oxide (SiOx) and silicon nitride (SiNx). The upper insulating layer 112 may have a multilayer structure. For example, the upper insulating layer 112 may have a stacked structure of an inorganic layer made of silicon oxide (SiOx) and an inorganic layer made of silicon nitride (SiNx).

[0046] Therefore, in the display device according to the embodiments of the present disclosure, diffusion and / or movement of the metal constituting the light-emitting connection line 161, the metal constituting the address connection line 162, the metal constituting the ground dummy pattern 171, and the metal constituting the drive dummy pattern 172 through adjacent components can be prevented or at least reduced. That is, in the display device according to the embodiments of the present disclosure, migration of the metal constituting the light-emitting connection line 161, the metal constituting the address connection line 162, the metal constituting the ground dummy pattern 171, and the metal constituting the drive dummy pattern 172 can be prevented or at least reduced. The upper insulating layer 112 may surround the light-emitting chip 150. For example, the first end 161a and the second end 161b of each light-emitting connection line 161 may be disposed outside the upper insulating layer 112. The ground dummy pattern 171 and the drive dummy pattern 172 may be covered by the upper insulating layer 112. Therefore, in the display device according to the embodiments of the present disclosure, electrical connections between the light-emitting connection line 161 and the grounding dummy pattern 171 and / or between the light-emitting connection line 161 and the driving dummy pattern 172 can be prevented or at least reduced.

[0047] The optical sheet 200 can uniformly provide light emitted from the light source module 100 to the entire area of ​​the liquid crystal panel LP. For example, the optical sheet 200 may include a reflector 210, a diffuser 220, a phosphor 230, and a prism sheet 240. The liquid crystal panel LP may be disposed on the optical sheet 200 of the backlight unit BL.

[0048] The reflector 210 can reflect light reflected by the diffuser 220, phosphor 230, and prism sheet 240 along the direction of the liquid crystal panel LP. For example, the reflector 210 may include a reflective pattern 211 (e.g., a reflective layer). The reflective pattern 211 may include a material with high reflectivity. For example, the reflective pattern 211 may include metals such as aluminum (Al) and silver (Ag).

[0049] The reflector 210 can reflect light emitted through the side of each light-emitting chip 150 along the direction of the liquid crystal panel LP. For example, the reflective pattern 211 can contact the upper insulating layer 112 of the light source module 100, and the reflector 210 can include a scattering layer 212 covering the reflective pattern 211. The scattering layer 212 can surround the side of each light-emitting chip 150. For example, the reflector 210 can include a through-hole 210h into which the light-emitting chip 150 is inserted. Therefore, in the display device according to the embodiments of the present disclosure, light emitted through the side of each light-emitting chip 150 can be scattered by the scattering layer 212, and the light scattered by the scattering layer 212 can be reflected by the reflective pattern 211 along the direction of the liquid crystal panel LP. That is, in the display device according to the embodiments of the present disclosure, the efficiency of the light source module 100 can be improved. The scattering layer 212 can include an insulating material. Therefore, in the display device according to the embodiments of the present disclosure, electrical connections between the light-emitting chips 150 caused by the reflector 210 can be prevented or at least reduced.

[0050] The diffuser plate 220 can diffuse the light emitted by each light-emitting chip 150. The phosphor 230 can use the light emitted by the light-emitting chip 150 to achieve various colors. For example, the light provided to the liquid crystal panel LP through the phosphor 230 can be white light. The prism sheet 240 can improve the brightness of the light provided to the liquid crystal panel LP by focusing the light.

[0051] Figures 4 to 8 This is a diagram schematically illustrating a method of forming a backlight unit in a display device according to an embodiment of the present disclosure.

[0052] Reference Figures 3 to 8 A method for forming a backlight unit in a display device according to an embodiment of the present disclosure is described. First, the method for forming a backlight unit in a display device according to an embodiment of the present disclosure may include the step of forming a ground voltage line 120 and a driving voltage line 130 on a light source substrate 110, such as... Figure 4 As shown.

[0053] The ground voltage line 120 and the driving voltage line 130 can be formed of a conductive material. The ground voltage line 120 and the driving voltage line 130 can be formed of a material with relatively low resistance. For example, the ground voltage line 120 and the driving voltage line 130 can be formed of metals such as copper (Cu), nickel (Ni), silver (Ag), gold (Au), platinum (Pt), and aluminum (Al). The driving voltage line 130 can be formed of the same material as the ground voltage line 120. The driving voltage line 130 can be formed using the same process as the ground voltage line 120. The driving voltage line 130 can be formed simultaneously with the ground voltage line 120. For example, the steps of forming the ground voltage line 120 and the driving voltage line 130 may include forming a metal layer on the light source substrate 110 and patterning the metal layer. The ground voltage line 120 and the driving voltage line 130 can be formed on the same layer.

[0054] A method for forming a backlight unit in a display device according to an embodiment of the present disclosure may include the steps of forming a lower insulating layer 111 on a light source substrate 110 on which a ground voltage line 120 and a driving voltage line 130 are formed, and forming a ground contact hole h1 that partially exposes the ground voltage line 120 and a driving contact hole h2 that partially exposes the driving voltage line 130 in the lower insulating layer 111, such as... Figure 5 As shown.

[0055] The lower insulating layer 111 can be formed of an insulating material. For example, the lower insulating layer 111 can be formed of an inorganic insulating material such as silicon oxide (SiOx) and silicon nitride (SiNx). The grounding voltage line 120 and the drive voltage line 130 can be covered by the lower insulating layer 111.

[0056] A method for forming a backlight unit in a display device according to an embodiment of the present disclosure may include the steps of forming a light-emitting connection line 161, a grounding dummy pattern 171, and a driving dummy pattern 172 on a lower insulating layer 111, such as... Figure 6 As shown.

[0057] The light-emitting connection line 161, the grounding dummy pattern 171, and the driving dummy pattern 172 can be formed of a conductive material. The light-emitting connection line 161, the grounding dummy pattern 171, and the driving dummy pattern 172 can be formed of a material with relatively low resistance. For example, the light-emitting connection line 161, the grounding dummy pattern 171, and the driving dummy pattern 172 can be formed of metals such as copper (Cu), nickel (Ni), silver (Ag), gold (Au), platinum (Pt), and aluminum (Al). The light-emitting connection line 161, the grounding dummy pattern 171, and the driving dummy pattern 172 can be formed of the same material. The light-emitting connection line 161, the grounding dummy pattern 171, and the driving dummy pattern 172 can be formed using the same process. The light-emitting connection line 161, the grounding dummy pattern 171, and the driving dummy pattern 172 can be formed simultaneously. For example, the steps of forming the light-emitting connection line 161, the grounding dummy pattern 171, and the driving dummy pattern 172 may include the steps of forming a metal layer on the lower insulating layer 111 and patterning the metal layer. The light-emitting connection line 161, the grounding dummy pattern 171, and the driving dummy pattern 172 may be formed on the same layer.

[0058] A light-emitting connection line 161 can be formed between the ground voltage line 120 and the driving voltage line 130. For example, the light-emitting connection line 161 can be spaced apart from the ground voltage line 120 and the driving voltage line 130. A grounding dummy pattern 171 can be formed on the ground voltage line 120. For example, the grounding dummy pattern 171 can be electrically connected to the ground voltage line 120 through a grounding contact hole. The grounding dummy pattern 171 can overlap with the ground voltage line 120. A driving dummy pattern 172 can be formed on the driving voltage line 130. For example, the driving dummy pattern 172 can be electrically connected to the driving voltage line 130. The driving dummy pattern 172 can overlap with the driving voltage line 130.

[0059] A method for forming a backlight unit in a display device according to an embodiment of the present disclosure may include the step of forming an upper insulating layer 112 on a light source substrate 110 on which light-emitting connection lines 161, a grounding dummy pattern 171, and a driving dummy pattern 172 are formed, such as... Figure 7 As shown.

[0060] The upper insulating layer 112 can be formed of an insulating material. For example, the upper insulating layer 112 can be formed of an inorganic insulating material such as silicon oxide (SiOx) and silicon nitride (SiNx). The ground dummy pattern 171 and the drive dummy pattern 172 can be covered by the upper insulating layer 112. The upper insulating layer 112 can expose both ends 161a and 161b of each light-emitting interconnect. For example, the upper insulating layer 112 can surround the area where the light-emitting chip 150 is arranged in subsequent processes.

[0061] A method for forming a backlight unit in a display device according to an embodiment of the present disclosure may include the step of bonding a light-emitting chip 150 onto a light source substrate 110 having an upper insulating layer 112, such as... Figure 8 As shown.

[0062] Each light-emitting chip in the light-emitting chip 150 may include a first chip pad 150a and a second chip pad 150b. For example, the first chip pad 150a of each light-emitting chip 150 may be connected to a first end 161a of a light-emitting connection line in the light-emitting connection lines 161, and the second chip pad 150b of each light-emitting chip 150 may be connected to a second end 161b of a light-emitting connection line in the light-emitting connection lines 161. Therefore, in the method of forming a backlight unit in a display device according to an embodiment of the present disclosure, the light-emitting chips 150 can be connected to each other via the light-emitting connection lines 161.

[0063] like Figure 3 As shown, a method for forming a backlight unit in a display device according to an embodiment of the present disclosure may include the step of arranging a reflector 210 on an upper insulating layer 112, the reflector 210 including a through-hole 210h corresponding to a light-emitting chip 150. The through-hole 210h is an opening in which the corresponding light-emitting chip 150 is disposed.

[0064] Therefore, in the display device according to the embodiments of the present disclosure, the light source module 100 of the backlight unit BL may include a lower insulating layer 111 covering a ground voltage line 120 and a driving voltage line 130, a light-emitting chip 150 disposed on the lower insulating layer 111, a light-emitting connecting line 161 connecting the light-emitting chips 150, a grounding dummy pattern 171 overlapping the ground voltage line 120, and a driving dummy pattern 172 overlapping the driving voltage line 130. The grounding dummy pattern 171 and the driving dummy pattern 172 may be disposed between the light-emitting chip 150 and the light-emitting connecting line 161. The grounding dummy pattern 171 can be electrically connected to the ground voltage line 120 by penetrating the lower insulating layer 111, and the driving dummy pattern 172 can be electrically connected to the driving voltage line 130 by penetrating the lower insulating layer 111. Therefore, in the display device according to the embodiments of the present disclosure, the resistance of the ground voltage line 120 and the resistance of the driving voltage line 130 can be reduced. Furthermore, in the display device according to the embodiments of the present disclosure, the grounding dummy pattern 171 and the driving dummy pattern 172 can be formed using the same process as the light-emitting connection line 161. For example, in the display device according to the embodiments of the present disclosure, the grounding dummy pattern 171 and the driving dummy pattern 172 can be formed simultaneously with the light-emitting connection line 161. Therefore, in the display device according to the embodiments of the present disclosure, the brightness difference of the light-emitting chip 150 can be prevented or at least reduced without reducing process efficiency.

[0065] Furthermore, in the display device according to the embodiments of the present disclosure, the grounding dummy pattern 171 and the driving dummy pattern 172 can be formed between the light-emitting chips 150, between the light-emitting connecting lines 161, and / or between the light-emitting chips 150 and the light-emitting connecting lines 161. Therefore, in the display device according to the embodiments of the present disclosure, the resistance of the grounding voltage line 120 and the resistance of the driving voltage line 130 can be reduced without increasing the non-light-emitting area where no light-emitting chips 150 are provided. That is, in the display device according to the embodiments of the present disclosure, the size of the light-emitting area where the light-emitting chips 150 emit light is maintained, and the brightness difference of the light-emitting chips 150 can be prevented or at least reduced. Therefore, in the display device according to the embodiments of the present disclosure, the quality of the image provided to the user can be effectively improved.

[0066] The display device according to an embodiment of the present disclosure is described such that the second output terminal O2 of each driver chip 140 is connected to the first input terminal I1 of an adjacent driver chip 140 along a first direction via an address connection line 162. That is, in the display device according to an embodiment of the present disclosure, the address line through which an address signal is applied from the outside via a pad portion can be connected to the first input terminal I1 of the outermost driver chip 140 among the driver chips 140 arranged side-by-side along the first direction. However, in another embodiment of the display device according to the present disclosure, the first input terminal I1 of each driver chip 140 can be individually connected to an address line. For example, in another embodiment of the display device according to the present disclosure, the first input terminal I1 of each driver chip 140 can be connected to a different address line than the first input terminal I1 of an adjacent driver chip 140 along the first direction. In another embodiment of the display device according to the present disclosure, the address connection line 162 and the second output terminal O2 of each driver chip 140 can be omitted. Therefore, in another embodiment of the display device according to the present disclosure, the on / off state and brightness of each light-emitting block LB can be controlled independently. Therefore, local dimming can be effectively achieved in a display device according to another embodiment of the present disclosure.

[0067] The display device according to embodiments of the present disclosure is described such that the signal applied by the driving voltage line 130 electrically connected to the light-emitting chip 150 is different from the signal applied to the ground voltage line 120 electrically connected to the driving chip 140. However, in a display device according to another embodiment of the present disclosure, the driving voltage line 130 may be electrically connected to the ground voltage line 120. For example, in a display device according to another embodiment of the present disclosure, the driving voltage corresponding to the brightness of each light-emitting chip 150 may be generated / applied by the driving chip 140.

[0068] The display device according to an embodiment of the present disclosure is described such that a ground dummy pattern 171 and a drive dummy pattern 172 are disposed on a lower insulating layer 111. However, in a display device according to another embodiment of the present disclosure, only one of the ground dummy pattern 171 and the drive dummy pattern 172 may be formed. Therefore, in the display device according to another embodiment of the present disclosure, the degree of freedom in the configuration of the light source module 100 can be increased.

[0069] The display device according to embodiments of the present disclosure is described such that the lower insulating layer 111 is made of an inorganic insulating material such as silicon oxide (SiOx) and silicon nitride (SiNx). However, in a display device according to another embodiment of the present disclosure, the lower insulating layer 111 may have a multilayer structure consisting of an inorganic layer made of an inorganic insulating material and an organic layer made of an organic insulating material, such as... Figure 9 As shown. For example, in a display device according to another embodiment of the present disclosure, the lower insulating layer 111 may have a stacked structure of a first lower layer 111a, a second lower layer 111b, and a third lower layer 111c, as shown. Figure 9 As shown. The second lower layer 111b may include a material different from the first lower layer 111a and the third lower layer 111c. For example, the first lower layer 111a and the third lower layer 111c may be inorganic layers made of inorganic insulating materials such as silicon oxide (SiOx) and silicon nitride (SiNx), the first lower layer 111a is the lowest layer of the lower insulating layer 111 closest to the ground voltage line 120 and the drive voltage line 130, the third lower layer 111c is the uppermost layer of the lower insulating layer 111 close to the ground dummy pattern 171 and the drive dummy pattern 172, and the second lower layer 111b disposed between the first lower layer 111a and the third lower layer 111c may be an organic layer made of organic insulating material. Therefore, in a display device according to another embodiment of the present disclosure, diffusion of the metal constituting the ground voltage line 120, the metal constituting the drive voltage line 130, the metal constituting the ground dummy pattern 171, and the metal constituting the drive dummy pattern 172 through the second lower layer 111b, which is an organic layer, can be prevented or at least reduced.

[0070] In a display device according to another embodiment of the present disclosure, the reflective pattern 211 may include a conductive material. For example, in a display device according to another embodiment of the present disclosure, the reflective pattern 211 may be electrically connected to the grounding dummy pattern 171 and the driving dummy pattern 172 through the upper insulating layer 112, such as... Figure 10 As shown. Therefore, in a display device according to another embodiment of the present disclosure, the resistance of the ground voltage line 120 and the resistance of the drive voltage line 130 can be greatly reduced. Therefore, in a display device according to an embodiment of the present disclosure, the brightness difference of the light-emitting chip 150 can be effectively prevented or at least reduced.

[0071] As a result, the backlight unit and display device according to embodiments of this disclosure may include a lower insulating layer covering the driving voltage line and the ground voltage line, light-emitting chips disposed on the lower insulating layer, and light-emitting connecting lines connecting the light-emitting chips, wherein driving dummy patterns electrically connected to the driving voltage lines and / or grounding dummy patterns electrically connected to the ground voltage lines may be disposed between the light-emitting chips and the light-emitting connecting lines. Therefore, in the backlight unit and display device according to embodiments of this disclosure, the resistance of the ground voltage line and the resistance of the driving voltage line can be reduced.

[0072] Therefore, in the backlight unit and display device according to the embodiments of the present disclosure, the brightness difference of the light-emitting chip can be effectively prevented or at least reduced.

[0073] Cross-reference to related applications

[0074] This application claims the benefits of Korean Patent Application No. 10-2022-0000003 filed on January 1, 2022, Korean Patent Application No. 10-2022-0000004 filed on January 1, 2022, and Korean Patent Application No. 10-2022-0080655 filed on June 30, 2022, each of which is incorporated herein by reference in its entirety.

Claims

1. A backlight unit, the backlight unit comprising: A grounding voltage line, which is located on the light source substrate; A lower insulating layer is located on the light source substrate and on the ground voltage line; Multiple light-emitting chips are located on the lower insulating layer and are spaced apart from the grounding voltage line; Multiple light-emitting connecting lines are located on the lower insulating layer, and the multiple light-emitting connecting lines electrically connect the multiple light-emitting chips together; A grounding dummy pattern is located between the plurality of light-emitting chips and the plurality of light-emitting connecting lines. The grounding dummy pattern overlaps with the grounding voltage line and is electrically connected to the grounding voltage line. An upper insulating layer is located on the plurality of light-emitting connecting lines and the grounding dummy pattern, and the upper insulating layer surrounds the plurality of light-emitting chips; as well as A reflector is located on the upper insulating layer, and the reflector includes a through hole into which a plurality of light-emitting chips are inserted.

2. The backlight unit according to claim 1, wherein, The grounding dummy pattern comprises the same material as the plurality of light-emitting connecting lines.

3. The backlight unit according to claim 1, further comprising: A driving voltage line is located between the light source substrate and the lower insulating layer, and the driving voltage line is spaced apart from the ground voltage line; as well as The driver chip is spaced apart from the plurality of light-emitting chips, the plurality of light-emitting connection lines, and the grounding dummy pattern, and the driver chip is electrically connected to the grounding voltage line. Each of the plurality of light-emitting chips is electrically connected to the driving voltage line and the driving chip.

4. The backlight unit according to claim 3, wherein, The multiple light-emitting chips are connected in series through the multiple light-emitting connection lines.

5. The backlight unit according to claim 3, wherein the backlight unit further comprises: A driving dummy pattern is located between the plurality of light-emitting chips and the plurality of light-emitting connection lines. The driving dummy pattern overlaps with the driving voltage line and is electrically connected to the driving voltage line.

6. The backlight unit according to claim 5, wherein, The driving dummy pattern comprises the same material as the grounding dummy pattern.

7. The backlight unit according to claim 1, wherein, The lower insulating layer comprises an inorganic layer made of at least one inorganic insulating material and an organic layer made of an organic insulating material.

8. The backlight unit according to claim 7, wherein, The bottommost layer of the lower insulation layer closest to the ground voltage line and the topmost layer of the lower insulation layer closest to the ground dummy pattern are the inorganic layer.

9. A display device, the display device comprising: A backlight unit, the backlight unit including a light source module configured to emit light and an optical sheet located on the light source module; as well as A liquid crystal panel, the liquid crystal panel being located on the optical sheet of the backlight unit. The light source module includes: A driving voltage line, wherein the driving voltage line is located on the light source substrate; A lower insulating layer, the lower insulating layer being located on the driving voltage line; Multiple light-emitting chips are located on the lower insulating layer; A driver chip, which is spaced apart from the plurality of light-emitting chips; Multiple light-emitting connection lines electrically connect each of the multiple light-emitting chips to the driving voltage line and the driving chip; A driving dummy pattern is provided, wherein the driving dummy pattern is located between the plurality of light-emitting chips and the plurality of light-emitting connection lines; and An upper insulating layer is located on the plurality of light-emitting connection lines and the driving dummy pattern, and the upper insulating layer surrounds the plurality of light-emitting chips. The plurality of light-emitting chips do not overlap with the driving voltage line, and the driving voltage line is electrically connected to the driving dummy pattern. The optical sheet includes a reflector located on the upper insulating layer, the reflector having a through hole, and the plurality of light-emitting chips inserted into the through hole.

10. The display device according to claim 9, wherein, The driving dummy pattern comprises the same material as the plurality of light-emitting connecting lines.

11. The display device according to claim 9, wherein, The reflector includes a reflective pattern and a scattering layer. The reflective pattern has a conductive material and is electrically connected to the driving dummy pattern. The scattering layer covers the reflective pattern.

12. The display device according to claim 11, wherein, The reflective pattern comprises metal, and the scattering layer comprises an insulating material.

13. The display device according to claim 11, wherein, The light source module also includes: A grounding voltage line is located between the light source substrate and the lower insulating layer, such that the grounding voltage line is spaced apart from the plurality of light-emitting chips; and A grounding dummy pattern is located between the lower insulating layer and the upper insulating layer, and the grounding dummy pattern is electrically connected to the grounding voltage line and the reflection pattern.

14. The display device according to claim 13, wherein, The grounding voltage line is made of the same material as the driving voltage line.

15. The display device according to claim 13, wherein, The grounding voltage line and the driving voltage line are located on the same layer, and the grounding dummy pattern, the driving dummy pattern, and the multiple light-emitting connection lines are located on the same layer.

16. A backlight unit, the backlight unit comprising: substrate; Voltage lines, the voltage lines being located on a first portion of the substrate; A grounding voltage line, the grounding voltage line being located on a second portion of the substrate, the second portion being different from the first portion of the substrate; A first insulating layer is located on the voltage line and the ground voltage line; A light-emitting chip configured to emit light, the light-emitting chip being located between the voltage line and the ground voltage line, and electrically connected to the voltage line and the ground voltage line; A first conductive pattern is located on the first insulating layer, and the first conductive pattern overlaps with the ground voltage line and passes through the first insulating layer to be electrically connected to the ground voltage line. A second conductive pattern is located on the first insulating layer, and the second conductive pattern overlaps with the voltage line and passes through the first insulating layer to be electrically connected to the voltage line. A second insulating layer is located on the first conductive pattern and the second conductive pattern, and the second insulating layer does not overlap with the light-emitting chip. as well as A reflective layer, located on the second insulating layer, is configured to reflect the light emitted by the light-emitting chip. The reflective layer overlaps with the first conductive pattern and the second conductive pattern, but not with the light-emitting chip, such that the reflective layer includes an opening in which the light-emitting chip is disposed.

17. The backlight unit according to claim 16, wherein, The reflective layer is electrically connected to the first conductive pattern and the second conductive pattern.

18. The backlight unit according to claim 16, wherein, The first conductive pattern comprises the same material as the second conductive pattern.

19. The backlight unit according to claim 16, further comprising a light-emitting connecting line, the light-emitting connecting line being located on the first insulating layer. in, The light-emitting connecting line includes a portion that is exposed through the second insulating layer and connected to the light-emitting chip.

20. The backlight unit according to claim 16, further comprising: A scattering layer, located on the reflective layer, is configured to scatter the light emitted by the light-emitting chip. The scattered light is reflected by the reflective layer.

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