A large-current low-inductance high-overlapping chopper inductor

Abstract

The application discloses a large-current low-inductance high-overlapping chopping inductor, which comprises a copper bar composed of a busbar one and a busbar two, wherein the busbar one is arranged on the inner side of the busbar two, and a spacing is formed between the busbar one and the busbar two; a magnetic core assembly is sleeved on both ends and a middle position of the copper bar; a base is arranged at the bottom of the copper bar, and the magnetic core assembly at the middle position of the copper bar is arranged on the inner side of the base, wherein the magnetic core assembly comprises a nickel-zinc magnetic core sleeved on the middle part of the busbar two, and further comprises iron-silicon magnetic cores sleeved on both ends of the busbar one and the busbar two; through the design, the application can realize the application of various inductances to different harmonic currents; under high-frequency conditions, the large-current low-inductance can achieve high-overlapping performance; the product magnetic core assembly is suitable for working in various frequency bands; the structural arrangement optimizes the electrical performance of the product, improves the manufacturing efficiency of the device itself and the assembly efficiency in the terminal.

Description

Technical Field

[0001] This invention belongs to the field of electronic and electrical technology, and specifically relates to a high-current, low-inductance, high-superposition chopper inductor. Background Technology

[0002] An inductor is a component that can convert electrical energy into magnetic energy and store it. An inductor has a certain inductance, which only impedes changes in current.

[0003] The existing inductors have problems such as messy wiring connections during installation, which is not conducive to subsequent automated production positioning. They are also not suitable for installation in small spaces, and cannot meet the requirements of future small size integration. Under high current, the inductors are prone to saturation, causing inductive devices to fail and failing to achieve the filtering effect of the circuit.

[0004] Therefore, this invention provides an inductor structure for electrical connections in high-current (100A~500A) electrical connection locations where connection space is limited and multi-band filtering of the circuit is required to achieve clean power and in situations with automated production requirements, especially in current vehicle-mounted and new energy charging pile electrical connection applications. Summary of the Invention

[0005] The purpose of this invention is to provide a high-current, low-inductance, high-superposition chopper inductor to solve the problems of messy connections and large installation space occupied by inductors mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a high-current, low-inductance, high-superposition chopper inductor, comprising:

[0007] The copper busbar consists of busbar 1 and busbar 2, with busbar 1 located inside busbar 2 and a gap between them.

[0008] The magnetic core assembly is fitted onto both ends and the middle of the copper busbar;

[0009] A base is located at the bottom of the copper busbar, and the magnetic core assembly located in the middle of the copper busbar is installed on the inner side of the base.

[0010] As a preferred technical solution of the present invention, the magnetic core assembly includes a nickel-zinc magnetic core sleeved in the middle of busbar 2, and an iron-silicon magnetic core sleeved at both ends of busbar 1 and busbar 2.

[0011] As a preferred technical solution of the present invention, both the nickel-zinc magnetic core and the iron-silicon magnetic core are composed of symmetrical magnetic blocks, and spacers are provided between the magnetic blocks constituting the nickel-zinc magnetic core and the iron-silicon magnetic core.

[0012] As a preferred technical solution of the present invention, the base is hollow inside, and partition plates are equidistantly arranged inside the hollow. A placement cavity is formed between every two partition plates. The nickel-zinc magnetic core is placed inside the placement cavity. The base has slots through both ends, which are also formed on the partition plates. The busbar is inserted into the partition plate.

[0013] As a preferred technical solution of the present invention, the bottom of both ends of the base is formed with an integral mounting platform, and a second placement cavity is opened inside the mounting platform, and the iron-silicon magnetic core is inserted into the second placement cavity.

[0014] As a preferred technical solution of the present invention, the top two sides of the placement cavity are provided with limiting grooves, and the two ends of the busbar one and busbar two are connected through the limiting grooves.

[0015] As a preferred technical solution of the present invention, the first busbar is located on the outside of the base, and the first busbar is in contact with the outer side of the base.

[0016] As a preferred technical solution of the present invention, both the first busbar and the second busbar are provided with connection holes at their ends.

[0017] Compared with the prior art, the beneficial effects of the present invention are:

[0018] 1. Multiple inductance values ​​are suitable for different harmonic currents;

[0019] 2. Under high frequency conditions, high current and low inductance can achieve high superposition performance;

[0020] 3. The product's magnetic core assembly is suitable for operation in multiple frequency bands simultaneously;

[0021] 4. The structural layout optimizes the electrical performance of the product while improving the manufacturing efficiency of the components themselves and the efficiency of final assembly. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of the present invention;

[0023] Figure 2 This is a schematic diagram showing the connection between the copper busbar and the base of the present invention;

[0024] Figure 3 This is a schematic diagram showing the connection between the copper busbar and the iron-silicon magnetic core of the present invention;

[0025] Figure 4 This is a schematic diagram of the structure of the base of the present invention.

[0026] In the diagram: 100, copper busbar; 101, busbar one; 102, busbar two; 200, nickel-zinc magnetic core; 201, iron-silicon magnetic core; 300, base; 300a, placement cavity one; 300b, slot; 300c, placement cavity two; 300d, partition plate. Detailed Implementation

[0027] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0028] Please see Figures 1 to 4 This invention provides a technical solution: a high-current, low-inductance, high-superposition chopper inductor, comprising:

[0029] The copper busbar 100 is composed of busbar 101 and busbar 2 102. Busbar 101 is located inside busbar 2 102. The stacked busbar structure can reduce the influence of stray inductance on surrounding devices during application. There is a gap between the two. Busbar 101 and busbar 2 102 are coated with an insulating layer so that the insulation layer can work without breakdown at a high voltage of 2KV.

[0030] The magnetic core assembly is fitted onto both ends and the middle of the copper busbar 100;

[0031] The base 300 is located at the bottom of the copper busbar 100, and the magnetic core assembly located in the middle of the copper busbar 100 is installed on the inner side of the base 300.

[0032] In this embodiment, the magnetic core assembly includes a nickel-zinc magnetic core 200 sleeved in the middle of busbar 2 102, and an iron-silicon magnetic core 201 sleeved at both ends of busbar 1 101 and busbar 2 102. The nickel-zinc magnetic core 200 is bonded to busbar 1 101, the iron-silicon magnetic core 201 is bonded to busbar 1 101 and busbar 2 102 with RTV adhesive. This allows for the positioning of the magnetic cores. Due to the softness of the RTV adhesive, it can absorb the vibration stress generated after the copper busbar is energized, thus preventing the magnetic cores from breaking. At the same time, since the nickel-zinc magnetic core 200 and the iron-silicon magnetic core 201 are made of different materials, the combination of different magnetic core materials enables the product to achieve high superposition performance at a low inductance nH level under high frequency of 100KHz. The superposition value of large current can reach L(200A) / L(0A)≥85%. The magnetic core combination is suitable for operation in multiple frequency bands, with iron-silicon up to 300KHz and nickel-zinc up to 2MHz.

[0033] In this embodiment, both the nickel-zinc magnetic core 200 and the iron-silicon magnetic core 201 are composed of symmetrical magnetic blocks, which can be easily installed on the copper busbar 100. Spacers are also provided between the magnetic blocks that make up the nickel-zinc magnetic core 200 and the iron-silicon magnetic core 201 to increase the magnetic core's anti-saturation capability. Furthermore, the joints between the magnetic blocks of the nickel-zinc magnetic core 200 and the iron-silicon magnetic core 201 are bonded with epoxy adhesive that can withstand temperatures up to 150 degrees Celsius.

[0034] In this embodiment, the interior of the base 300 is hollow, and partition plates 300d are equidistantly arranged inside the hollow. A placement cavity 300a is formed between every two partition plates 300d. The nickel-zinc magnetic core 200 is placed inside the placement cavity 300a. The base 300 has slots 300b extending through both ends. The slots 300b are also formed on the partition plates 300d. The busbar 102 is inserted into the partition plate 300d to complete the installation limit.

[0035] In this embodiment, an integral mounting platform is formed at the bottom of both ends of the base 300, and a placement cavity 300c is opened inside the mounting platform, into which the iron-silicon magnetic core 201 is inserted.

[0036] In this embodiment, limiting grooves 300e are provided on both sides of the top of the placement cavity 2 300c, and the two ends of busbar 1 101 and busbar 2 102 are connected through the limiting grooves 300e.

[0037] In this embodiment, busbar 101 is located on the outside of base 300, and busbar 101 is in contact with the outer side of base 300.

[0038] In this embodiment, both busbar 101 and busbar 202 have connection holes at their ends. The connection holes are treated with a low-tin nickel plating process to prevent the copper busbars from oxidizing when exposed to air. Busbar 101 has an iron-silicon magnetic core 201 connected to it, thus forming one type of inductance. Busbar 202 has a nickel-zinc magnetic core 200 and an iron-silicon magnetic core 201, thus forming another type of inductance. This allows for the diversification of the product's inductance to accommodate various harmonic currents.

[0039] Although embodiments of the invention have been shown and described (see the detailed description above), it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high-current, low-inductance, high-superposition chopper inductor, characterized in that: include: The copper busbar (100) is composed of busbar one (101) and busbar two (102), wherein busbar one (101) is located inside busbar two (102) and there is a gap between the two. The magnetic core assembly is fitted onto both ends and the middle of the copper busbar (100); A base (300) is disposed at the bottom of the copper busbar (100), and a magnetic core assembly located in the middle of the copper busbar (100) is mounted on the inner side of the base (300); The magnetic core assembly includes a nickel-zinc magnetic core (200) sleeved in the middle of busbar two (102), and also includes an iron-silicon magnetic core (201) sleeved at both ends of busbar one (101) and busbar two (102). Both the nickel-zinc magnetic core (200) and the iron-silicon magnetic core (201) are composed of symmetrical magnetic blocks, and spacers are provided between the magnetic blocks that constitute the nickel-zinc magnetic core (200) and the iron-silicon magnetic core (201). The base (300) is hollow inside, and partition plates (300d) are equidistantly arranged inside the hollow. A placement cavity (300a) is formed between every two partition plates (300d). The nickel-zinc magnetic core (200) is placed inside the placement cavity (300a). The base (300) has slots (300b) through both ends, which are also opened on the partition plates (300d). The busbar (102) is inserted into the partition plate (300d). The base (300) has an integral mounting platform at both ends of its bottom. A placement cavity (300c) is provided inside the mounting platform, and the iron-silicon magnetic core (201) is inserted into the placement cavity (300c). Limiting grooves (300e) are provided on both sides of the top of the second placement cavity (300c), and the two ends of the first busbar (101) and the second busbar (102) are connected to the limiting grooves (300e). The first busbar (101) is located outside the base (300), and the first busbar (101) is in contact with the outer side of the base (300); Both the first busbar (101) and the second busbar (102) have connection holes at their ends.

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