Method and system for recycling image sensors

Abstract

A recycling method and system of an image sensor, the image sensor is obtained in a module level packaging manner, the image sensor comprises a support, a glass sheet, an adhesive layer and a die, the glass sheet is connected to the support, the die is connected to the support through the adhesive layer, the support has an opening, the opening is used for exposing a photosensitive surface of the die to the glass sheet, the recycling method comprises: heating the image sensor to soften the adhesive layer; after the adhesive layer is softened, the die is peeled off from the image sensor, so that the die is separated from the support; foreign matters adhered to the die are removed, and the die is recycled. The above scheme can improve the repair yield of the image sensor recycling, and improve the flexibility of the recycled die in subsequent production.

Description

Technical Field

[0001] This invention relates to the field of image sensor recycling, and more particularly to a method and system for recycling image sensors. Background Technology

[0002] Image sensors can be packaged using Chip-On-Module (COM) packaging. COM packaging involves attaching a die to a substrate, forming a module with the die, substrate, and glass substrate. Subsequent packaging is then performed based on this module. In the field of image sensor module-level packaging (COM packaging), the cleanliness requirements for the environment are very high. If particles fall onto the sensor surface during the packaging process, it will cause defects in the image sensor module, resulting in defective products. For defective products caused by dust particles during packaging, the glass substrate is usually removed, the image sensor surface is cleaned, and a new glass substrate is repackaged to achieve rework.

[0003] However, in actual operation, the above-mentioned methods of re-repairing image sensors are prone to causing secondary damage to the image sensors, and when re-sealing the glass sheet, the glass bonding surface cannot be thoroughly cleaned, resulting in a low re-repair yield. Summary of the Invention

[0004] One of the objectives of this invention is to provide a novel image sensor recycling method and system to improve the rework yield of image sensors.

[0005] To achieve the above objectives, embodiments of the present invention provide a method for recycling an image sensor. The image sensor is obtained using a module-level packaging method and includes: a support, a glass sheet, an adhesive layer, and a die. The glass sheet is connected to the support, and the die is connected to the support through the adhesive layer. The support has an opening for exposing the photosensitive surface of the die to the glass sheet. The recycling method includes: heating the image sensor to soften the adhesive layer; after the adhesive layer has softened, peeling the die from the image sensor to detach the die from the support; removing foreign matter adhering to the die; and recycling the die.

[0006] Optionally, the image sensor recycling method further includes removing the pins of the die before or after stripping the die from the image sensor.

[0007] Optionally, removing the pins of the die includes: acquiring an image of the die, recognizing the image of the die to obtain an image recognition result of the die; determining the position of each pin of the die based on the image recognition result of the die; controlling the pin removal device to move to the position of each pin, and controlling the pin removal device to remove each pin.

[0008] Optionally, the step of peeling the grain from the image sensor includes: vacuum adsorbing the back side of the grain and sucking the grain away from the glass sheet to peel the grain from the image sensor, wherein the back side of the grain refers to the side opposite to the photosensitive surface.

[0009] Optionally, before vacuum adsorption of the back side of the crystal, the method further includes: acquiring an image from the image sensor; performing image recognition on the image from the image sensor to obtain an image recognition result from the image sensor; determining the position of the back side of the crystal based on the image recognition result from the image sensor; determining a target adsorption region on the back side of the crystal based on the position of the back side of the crystal and a preset adsorption region; and performing vacuum adsorption on the crystal in the target adsorption region.

[0010] Optionally, after peeling the grains from the image sensor, the method further includes: arranging the grains on an adhesive film, wherein the photosensitive surface of the grains adheres to the adhesive film; and molding the grains arranged on the adhesive film to expose the photosensitive surface of the grains.

[0011] Optionally, before heating the image sensor to soften the adhesive layer, the method further includes: obtaining the type of the image sensor; determining the type of adhesive used in the adhesive layer based on the type of the image sensor; and determining the softening temperature of the adhesive based on the determined type of adhesive.

[0012] Optionally, heating the image sensor to soften the adhesive layer includes: heating the image sensor at the softening temperature for a preset time to soften the adhesive layer.

[0013] This invention also provides a recycling system for an image sensor. The image sensor is obtained using a module-level packaging method. The image sensor includes: a support, a glass sheet, an adhesive layer, and a die. The glass sheet is connected to the support, and the die is connected to the support through the adhesive layer. The support has an opening for exposing the photosensitive surface of the die to the glass sheet. The recycling system includes: a heating module, a peeling module, a cleaning module, and a control module. The control module is coupled to the heating module, the peeling module, and the cleaning module, and is used to control the working state of the heating module, the peeling module, and the cleaning module. The heating module is used to heat the image sensor to soften the adhesive layer. The peeling module is used to peel the die from the image sensor after the adhesive layer has softened, so that the die detaches from the support. The cleaning module is used to remove foreign matter adhering to the die and recycle the die.

[0014] Optionally, the image sensor recycling system further includes a pin removal device for removing the pins of the die.

[0015] Optionally, the stripping module includes a vacuum adsorption module, which is used to vacuum adsorb the back side of the grain and suck the grain away from the glass sheet to strip the grain from the image sensor. The back side of the grain refers to the side opposite to the photosensitive surface.

[0016] Optionally, the image sensor recovery system further includes an image recognition module coupled to the control module. The image recognition module is used to acquire an image of the image sensor before vacuum adsorption of the back side of the crystal, perform image recognition on the image sensor image to obtain the image recognition result of the image sensor; determine the position of the back side of the crystal based on the image recognition result of the image sensor; determine the target adsorption area of ​​the back side of the crystal based on the position of the back side of the crystal and a preset adsorption area, and output the target adsorption area to the control module; the control module controls the vacuum adsorption module to perform vacuum adsorption of the crystal in the target adsorption area.

[0017] Compared with the prior art, the technical solution of the embodiments of the present invention has the following beneficial effects:

[0018] By heating the image sensor, the adhesive layer connecting the chip and the support is softened. After softening, the chip easily detaches from the support, allowing for chip removal from the image sensor, removal of foreign matter adhering to the chip, and chip recycling. The image sensor recycling method provided in this invention involves chip peeling, cleaning, and recycling. Compared to existing technologies that recycle the entire image sensor module, chip recycling is less difficult and yields a higher chip yield. Since the chip is a crucial and costly component of the image sensor, improving the chip recycling yield improves the rework yield of the image sensor. Furthermore, because only the chip is recycled, it can be repackaged according to actual needs during subsequent production, increasing the flexibility of the recycled chip in subsequent production.

[0019] Furthermore, before or after removing the chip from the image sensor, the chip's pins are removed. This eliminates the need to consider the chip's pins during chip recycling, reducing the difficulty of chip removal, and also facilitates subsequent pin re-layout according to actual needs.

[0020] Furthermore, when peeling the grain from the image sensor, the back side of the grain is vacuum-adsorbed. This vacuum adsorption method ensures sufficient suction for easy grain removal. Additionally, since the operating area is on the back side of the grain during peeling, compared to the prior art where the operating area for disassembling the glass sheet is above the photosensitive area, this effectively reduces damage to the photosensitive area and improves the yield of recovered grains. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the structure of an image sensor;

[0022] Figure 2 This is a flowchart of an image sensor retrieval method according to an embodiment of the present invention;

[0023] Figure 3 This is a flowchart of another image sensor recovery method in an embodiment of the present invention;

[0024] Figure 4 This is a schematic diagram of the structure of an image sensor recovery system according to an embodiment of the present invention. Detailed Implementation

[0025] As mentioned above, in the prior art, for defective products caused by dust particles during the packaging process, the glass plate encapsulated on top of the chip is usually removed, the surface of the image sensor is cleaned, and then a new glass plate is re-encapsulated to achieve the repair of defective products.

[0026] However, in actual operation, the above-mentioned methods for reworking image sensors require working above the photosensitive surface of the image sensor to remove the glass plate, which can easily damage the photosensitive surface. In addition, it is necessary to ensure that the pins of the image sensor are not damaged during the recycling process, making disassembly quite difficult. Furthermore, when repackaging the glass plate, the glass bonding surface cannot be thoroughly cleaned, resulting in a low rework yield.

[0027] To address the aforementioned issues, in this embodiment of the invention, the adhesive layer connecting the chip and the support is softened by heating the image sensor. After softening, the chip easily detaches from the support, allowing for chip removal from the image sensor, removal of foreign matter adhering to the chip, and chip recycling. The image sensor recycling method provided in this embodiment of the invention involves chip peeling, cleaning, and recycling. Compared to prior art, which recycles the entire image sensor module, chip recycling is less difficult and yields a higher chip yield. Since the chip is a crucial and costly component of the image sensor, improving the rework yield of chip recycling improves the overall image sensor recycling yield. Furthermore, because only the chip is recycled, it facilitates repackaging according to actual needs during subsequent production, increasing the flexibility of the recycled chip in subsequent production.

[0028] To make the above-mentioned objectives, features and beneficial effects of the embodiments of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0029] This invention provides a method for recycling an image sensor, applicable to the recycling of image sensors obtained using a module-level packaging method. (Refer to...) Figure 1 A schematic diagram of an image sensor structure is provided. The image sensor may include a support 104, a glass sheet 106, an adhesive layer 103, and a die 101. The glass sheet 106 is connected to the support 104, and the die 101 is connected to the support 104 via the adhesive layer 103. The support 104 has an opening for exposing the photosensitive surface of the die 101 to the glass sheet 106. The glass sheet 106 can be bonded to the support 104 via a glass adhesive portion 105. The die 101 has a photosensitive surface 101A and a back surface 101B, with the back surface 101B positioned opposite to the photosensitive surface 101A. 107 illustrates a foreign object adhering to the die 101.

[0030] Reference Figure 2 This invention provides a method for recovering an image sensor, which may specifically include the following steps:

[0031] Step S21: Heat the image sensor to soften the adhesive layer.

[0032] Step S22: After the adhesive layer softens, peel the grain from the image sensor to detach the grain from the support.

[0033] Step S23: Remove foreign matter adhering to the grain and recycle the grain.

[0034] In a specific implementation, in step S21, the image sensor can be placed on a heating platform for heating to soften the adhesive layer. The temperature of the heating platform can be adjusted to reach the softening temperature of the adhesive layer. Alternatively, the image sensor can be placed in a heating cavity, and the temperature inside the heating cavity can be adjusted to a temperature that softens the adhesive layer. By heating the adhesive layer, the adhesive layer is softened.

[0035] In some embodiments, steps S31 to S33 may be included before step S21 is executed, as shown below. Figure 3 The present invention provides a flowchart of another image sensor retrieval method according to an embodiment of the invention, specifically:

[0036] Step S31: Obtain the type of the image sensor.

[0037] Step S32: Determine the type of adhesive used in the adhesive layer based on the type of image sensor.

[0038] Step S33: Determine the softening temperature of the adhesive based on the determined adhesive type.

[0039] In the specific implementation of step S31, the type of image sensor can be obtained in various ways. For example, by acquiring an image from the image sensor, performing image recognition on the image, and determining the type of image sensor based on the image recognition result. The image recognition result may include the image sensor's model number, appearance, and relevant identification information. The type of image sensor can also be input by the user.

[0040] After determining the type of image sensor, in step S32, when determining the type of adhesive used in the adhesive layer according to the type of image sensor, the correspondence between different types of image sensors and adhesives can be preset and stored, so that the type of adhesive used can be determined according to the type of image sensor.

[0041] In practice, the softening temperatures corresponding to different types of adhesives can be preset, and the correspondence between various types of adhesives and softening temperatures can be stored. In step S33, the softening temperature of the adhesive can be determined based on the determined type of adhesive.

[0042] Therefore, in step S21, the image sensor can be heated for a preset time based on the determined softening temperature of the adhesive to soften the adhesive layer. The specific value of the preset time can be preset according to the type of adhesive, so as to ensure that the adhesive layer is softened after heating for the preset time.

[0043] In specific implementation, combined with Figure 1 After the adhesive layer 103 is softened, in step S22, a suction cup can be used to hold the back side 101B of the die 101 and apply a force to the die 101 in a direction away from the support 104 (or away from the glass plate 106) to detach the die 101 from the support 104, thus completing the peeling of the die 101. Alternatively, step S22 can use vacuum adsorption to pick up the back side 101B of the die 101 and suck the die 101 away from the glass plate 106 to peel the die 101 from the image sensor. The back side 101B of the die 101 refers to the side opposite to the photosensitive surface 101A.

[0044] In a specific implementation, before vacuum adsorption of the back side of the crystal grain, an image sensor image can be acquired, and image recognition can be performed on the image sensor image to obtain the image recognition result. The position of the back side of the crystal grain is determined based on the image recognition result. Based on the position of the back side of the crystal grain and a preset adsorption area, a target adsorption area on the back side of the crystal grain is determined. Vacuum adsorption is then performed on the crystal grain in the target adsorption area.

[0045] In the process of vacuum adsorption of crystal grains, the adsorption force and adsorption position can be preset to ensure that the crystal grains are not damaged.

[0046] When peeling the die from the image sensor, the back side of the die is vacuum-adsorbed. This vacuum adsorption method ensures sufficient suction for easy peeling. Furthermore, since the operating area is on the back side of the die during peeling, compared to existing technologies where the operating area for disassembling the glass sheet is above the photosensitive area, this effectively reduces the probability of damage to the photosensitive area and improves the yield of recovered dies.

[0047] In a specific implementation, the pins of the chip can be removed before or after the chip is stripped from the image sensor, that is, before step S22 is executed.

[0048] In some embodiments, the pin for removing the die can be after step S21 and before step S22, or before step S21, or after step S22 and before step S23.

[0049] In practice, die leads can be removed manually, such as by using tweezers to break off the leads, or by heating and melting the leads.

[0050] In some embodiments, image recognition technology can be combined to remove die pins, thereby automating die pin removal. Specifically, an image of the die is acquired. The image of the die is then recognized to obtain an image recognition result. Based on the image recognition result, the position of each die pin is determined. The die image can be from an image sensor. Based on the image recognition result of the image sensor, image recognition results related to the die are determined, specifically images related to the die pins, to determine the position of the die pins.

[0051] Before or after removing the die from the image sensor, the die's pins are removed. This eliminates the need to worry about the die's pins during die recycling, reducing the difficulty of die removal and facilitating subsequent pin re-layout according to actual needs.

[0052] In practice, after the chip is peeled off from the image sensor, it can be arranged on an adhesive film. The film has a certain degree of adhesion and can adhere to objects. Specifically, the photosensitive side of the chip is adhered to the adhesive film. The chips arranged on the film are then flipped to expose the photosensitive side. Since the back side of the chip is adsorbed when peeling it off the image sensor, the adhesive film allows the chip to be flipped, avoiding contact with the photosensitive side during the flipping process. Afterward, the chips can be placed in a cleaning device to remove any foreign matter adhering to them. The flipping process refers to changing the adhesive side of the film to the back side of the chip.

[0053] In practice, after the chips are removed from the image sensor, they can be placed into a cleaning device for cleaning using automated mechanical equipment such as mechanical grippers.

[0054] In specific implementation, step S23 can be used to clean the crystal grains by water washing or by airflow cleaning. Other suitable methods, such as solvent cleaning, can also be used. After removing foreign matter adhering to the crystal grains, the grains can be recycled. The foreign matter can be dust particles, powder particles, or other similar substances.

[0055] As shown above, by heating the image sensor, the adhesive layer connecting the chip and the support is softened. After the adhesive layer softens, the chip easily detaches from the support, allowing for chip removal from the image sensor, removal of foreign matter adhering to the chip, and chip recycling. The image sensor recycling method provided in this invention involves chip peeling, cleaning, and recycling. Compared to existing technologies that recycle the entire image sensor module, chip recycling is less difficult and yields a higher chip yield. Since the chip is a crucial and costly component of the image sensor, improving the chip recycling yield improves the rework yield of the image sensor. Furthermore, since only the chip is recycled, it facilitates repackaging according to actual needs during subsequent production, increasing the flexibility of the recycled chip in subsequent production.

[0056] This invention also provides an image sensor recycling system, which can be used to recycle image sensors obtained using a module-level packaging method. Combined with... Figure 1 An image sensor encapsulated at the module level may include a bracket 104, a glass sheet 106, an adhesive layer 103, and a die 101. The glass sheet 106 is connected to the bracket 104, and the die 101 is connected to the bracket 104 via the adhesive layer 103. The bracket 104 has an opening that exposes the photosensitive surface of the die 101 to the glass sheet 106. The glass sheet 106 can be bonded to the bracket 104 via a glass adhesive portion 105. The die 101 has a photosensitive surface 101A and a back surface 101B, with the back surface 101B positioned opposite to the photosensitive surface 101A.

[0057] Reference Figure 4 The present invention provides a schematic diagram of the structure of an image sensor recycling system according to an embodiment of the present invention. The recycling system may include: a heating module 41, a stripping module 42, a cleaning module 43, and a control module 44.

[0058] The control module 44 is coupled to the heating module 41, the peeling module 42 and the cleaning module 43, and is used to control the working status of the heating module 41, the peeling module 42 and the cleaning module 43.

[0059] The heating module 41 is used to heat the image sensor to soften the adhesive layer;

[0060] The peeling module 42 is used to peel the grain from the image sensor after the adhesive layer has softened, so that the grain is detached from the support.

[0061] The cleaning module 43 is used to remove foreign matter adhering to the grains and to recycle the grains.

[0062] In specific implementations, the heating module 41 can be a heating platform, a temperature-adjustable chamber, or a temperature-controlled chamber, etc.

[0063] The heating duration and heating temperature of the heating module 41 can be controlled by the control module 44.

[0064] Furthermore, the control module 44 can determine the heating duration and temperature of the heating module based on user-inputted heating duration and temperature, respectively. Alternatively, it can determine the heating duration and temperature based on the type of image sensor.

[0065] Specifically, the control module 44 can acquire the type of the image sensor and determine the type of adhesive used in the adhesive layer based on the image sensor type. Based on the determined adhesive type, it determines the softening temperature of the adhesive. Furthermore, the control module 44 controls the temperature of the heating module 41 based on the determined softening temperature of the adhesive, and can also control the heating duration of the heating module 41.

[0066] When determining the type of adhesive used in the bonding layer based on the type of image sensor, the correspondence between different types of image sensors and adhesives can be preset and stored. Subsequently, the type of adhesive used can be determined based on the type of image sensor.

[0067] Furthermore, the recycling system may also include an image acquisition module 45 and an image recognition module 46. The image acquisition module 45 acquires images from an image sensor. The image recognition module 46 can perform image recognition on the images acquired by the image acquisition module 45. The control module 44 can determine the type of image sensor based on the image recognition result from the image recognition module 46. The control module 44 can control the operating state of the image acquisition module 45. The image acquisition module 45 may include devices with image acquisition functions, such as cameras or webcams.

[0068] In a specific implementation, the recycling system may also include a pin removal device 47, which is used to remove the pins of the die.

[0069] In a specific implementation, the control module 44 can control the pin removal device 47 to remove the pins of the chip before or after the chip is stripped from the image sensor.

[0070] Before or after removing the die from the image sensor, the die's pins are removed. This eliminates the need to worry about the die's pins during die recycling, reducing the difficulty of die removal and facilitating subsequent pin re-layout according to actual needs.

[0071] In a specific implementation, the stripping module 42 includes a vacuum adsorption module. This module vacuum adsorbs the back side of the crystal and pulls it away from the glass sheet, thus stripping the crystal from the image sensor. The back side of the crystal refers to the side opposite the photosensitive surface. When stripping the crystal from the image sensor, the vacuum adsorption module adsorbs the back side of the crystal, ensuring sufficient suction for easy stripping. Furthermore, since the operating area is on the back side of the crystal during stripping, compared to the prior art where the operating area for disassembling the glass sheet is above the photosensitive area, this effectively reduces the probability of damage to the photosensitive area and improves the yield of recycled crystals.

[0072] In a specific implementation, when the recycling system includes an image recognition module 46, the image recognition module 46 can also be used to acquire an image from an image sensor before vacuum adsorbing the back side of the crystal, perform image recognition on the image sensor image to obtain the image recognition result of the image sensor; determine the position of the back side of the crystal based on the image recognition result of the image sensor; determine the target adsorption area of ​​the back side of the crystal based on the position of the back side of the crystal and a preset adsorption area, and output the target adsorption area to the control module; the control module controls the vacuum adsorption module to perform vacuum adsorption on the crystal in the target adsorption area.

[0073] In specific implementation, the image recognition module 46 can be integrated into the control module 44, or it can be relatively independent of the control module 44 and coupled to the control module 44 to output the image recognition result to the control module 44.

[0074] The cleaning module 43 can clean the die by water washing or by airflow cleaning. Other suitable methods, such as solvent cleaning, can also be used to clean the die.

[0075] For more details on the working principle and method of the image sensor recovery system, please refer to the description of the image sensor recovery method provided in the above embodiments, which will not be repeated here.

[0076] Those skilled in the art will understand that all or part of the steps in the various methods of the above embodiments can be implemented by a program instructing related hardware. The program can be stored in any computer-readable storage medium, which may include ROM, RAM, disk, or optical disk, etc.

[0077] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A method of recycling an image sensor, the image sensor being obtained in a module-level package, the image sensor comprising: The package comprises a support, a glass slide, an adhesive layer, and a grain, wherein the glass slide is connected to the support, and the grain is connected to the support via the adhesive layer. The support has an opening for exposing the photosensitive surface of the grain to the glass slide. The recycling method includes: The image sensor is heated to soften the adhesive layer; After the adhesive layer softens, the grain is peeled off from the image sensor to detach the grain from the support. Remove foreign matter adhering to the grains and recycle the grains; It also includes: removing the pins of the die before or after stripping the die from the image sensor; The step of peeling the grain from the image sensor includes: vacuum adsorbing the back side of the grain and sucking the grain away from the glass sheet to peel the grain from the image sensor, wherein the back side of the grain refers to the side opposite to the photosensitive surface.

2. The image sensor recycling method as described in claim 1, characterized in that, The pin for removing the die includes: The image of the grain is acquired, and the image of the grain is identified to obtain the image recognition result of the grain; Based on the image recognition results of the die, the position of each pin of the die is determined; The control pin removal device moves to the position of each pin and removes each pin.

3. The image sensor recycling method as described in claim 1, characterized in that, Before vacuum adsorption of the back side of the grain, the process further includes: Acquire an image from the image sensor, perform image recognition on the image sensor, and obtain the image recognition result of the image sensor; The position of the back side of the grain is determined based on the image recognition results from the image sensor; The target adsorption region on the back side of the crystal is determined based on the position of the back side of the crystal and the preset adsorption region. The grains are subjected to vacuum adsorption in the target adsorption region.

4. The method for recycling the image sensor as described in claim 1, characterized in that, After stripping the grain from the image sensor, the process further includes: The grains are arranged on the adhesive film, wherein the photosensitive surface of the grains is adhered to the adhesive film; The grains arranged on the adhesive film are flipped to expose the photosensitive surface of the grains.

5. The method for recycling an image sensor as described in claim 1, characterized in that, Before heating the image sensor to soften the adhesive layer, the method further includes: Obtain the type of the image sensor; The type of adhesive used in the adhesive layer is determined based on the type of image sensor. The softening temperature of the adhesive is determined based on the type of adhesive.

6. The recycling method of an image sensor according to claim 5, wherein Heating the image sensor to soften the adhesive layer includes: The image sensor is heated at the softening temperature for a preset time to soften the adhesive layer.

7. A recycling system for image sensors that are provided in a module-level package, the image sensors comprising: The system comprises a support, a glass slide, an adhesive layer, and a crystal, wherein the glass slide is connected to the support, and the crystal is connected to the support via the adhesive layer. The support has an opening for exposing the photosensitive surface of the crystal to the glass slide. The recycling system includes a heating module, a stripping module, a cleaning module, and a control module, wherein: The control module is coupled to the heating module, the stripping module, and the cleaning module, and is used to control the working status of the heating module, the stripping module, and the cleaning module; The heating module is used to heat the image sensor to soften the adhesive layer; The peeling module is used to peel the grain from the image sensor after the adhesive layer has softened, so that the grain is detached from the support. The cleaning module is used to remove foreign matter adhering to the grains and to recycle the grains. It also includes: a pin removal device for removing the pins of the die before or after stripping the die from the image sensor; The stripping module includes a vacuum adsorption module, which is used to vacuum adsorb the back side of the grain and suck the grain away from the glass sheet to strip the grain from the image sensor. The back side of the grain refers to the side opposite to the photosensitive surface.

8. The recycling system of claim 7, wherein, It also includes an image recognition module, which is coupled to the control module. The image recognition module is used to acquire an image from the image sensor before vacuum adsorption of the back side of the crystal, perform image recognition on the image sensor image to obtain the image recognition result of the image sensor; determine the position of the back side of the crystal based on the image recognition result of the image sensor; determine the target adsorption area on the back side of the crystal based on the position of the back side of the crystal and a preset adsorption area, and output the target adsorption area to the control module. The control module controls the vacuum adsorption module to perform vacuum adsorption on the crystals in the target adsorption region.

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