Precision processing equipment for ultra-thin electronic devices

Abstract

The present invention discloses a precision processing device for ultra-thin electronic devices, comprising: a machine table, a rotating seat mounted on one end of the upper surface of the machine table, and a processing spindle arranged above the machine table, one end of a base plate being mounted on the driving shaft of the rotating seat, a carrier plate being detachably mounted on the upper surface of the base plate and directly below a cutter head mounted on the processing spindle, the first limit block and the third limit block fixedly mounted on the carrier plate each being in contact with the outer surface of a wall panel of a thin-walled shell, the third limit block in contact with the wall panel to be processed of the thin-walled shell having interconnected air grooves on its surface facing the thin-walled shell, and a vacuum generator being connected to the air grooves via a pipeline. The present invention can avoid jitter, blade vibration, and the like when the cutter head performs multi-angle processing on the wall panel of a rotating thin-walled shell, thereby affecting the processing accuracy and generating knife marks, thereby improving the processing quality.

Description

Technical Field

[0001] The invention relates to a precision processing device for ultra-thin electronic equipment, belonging to the technical field of electronic products. Background Art

[0002] High-precision, ultra-thin aluminum alloy housings hold broad application prospects in the lightweighting of smart devices. Due to their complex structure and thin walls, these housings present significant challenges in deformation control, wall thickness optimization, and machining accuracy. The primary difference between thin-walled and thick-walled parts lies in deformation instability, making it difficult to apply the same process parameters used for thick-walled parts to thin-walled parts. Consequently, machining thin-walled parts remains a challenge in the machining industry. Summary of the Invention

[0003] The purpose of the present invention is to provide a precision processing device for ultra-thin electronic devices, which can avoid jitter, vibration, etc. when the cutter head performs multi-angle processing on the wall panel of a rotating thin-walled shell, thereby affecting the processing accuracy and generating knife marks, thereby improving the processing quality.

[0004] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is: a precision processing device for ultra-thin electronic devices, comprising: a machine table, a rotating base mounted on one end of the upper surface of the machine table and a processing spindle arranged above the machine table, one end of a base plate is mounted on the driving shaft of the rotating base, the other end of the base plate extends toward the other end of the machine table, a carrier plate is detachably mounted on the upper surface of the base plate and is located directly below the cutter head mounted on the processing spindle, a first limit block and a second limit block are arranged on the upper surface of the carrier plate, and a third limit block and a fourth limit block are arranged between the first limit block and the second limit block, respectively perpendicular to the first limit block, so that a clamping area for embedding a thin-walled shell is enclosed between the first limit block, the second limit block, the third limit block and the fourth limit block;

[0005] The first limit block and the third limit block fixedly mounted on the carrier plate are respectively in contact with the outer surface of one wall plate of the thin-walled shell, and the second limit block and the fourth limit block are slidably mounted on the carrier plate through a movable seat, and each of the movable seats is connected to the carrier plate by an elastic member. When the movable seat drives the second limit block and the fourth limit block to move toward the thin-walled shell under the action of an external force until they are in contact with the outer surface of the wall plate of the thin-walled shell, the elastic member is in a compressed state, and the movable seat and the carrier plate are connected with bolts through mutually matching strip-shaped mounting holes;

[0006] The third limiting block, which is in contact with the wall panel to be processed of the thin-walled shell, is provided with interconnected air grooves on its surface facing the thin-walled shell, and a vacuum generator is connected to the air grooves through a pipeline.

[0007] The further improved scheme in the above technical scheme is as follows:

[0008] 1. In the above solution, the vacuum generator is arranged under the machine, and an air hole connecting the pipeline and the vacuum generator is opened on the machine.

[0009] 2. In the above solution, the first limit block and the third limit block are each fixedly mounted on the carrier plate via a mounting base.

[0010] 3. In the above solution, the pipeline is opened on the carrier plate, the mounting base with the third limit block installed, and the third limit block.

[0011] 4. In the above solution, a sealing groove is provided on the edge of the third limit block facing the surface of the thin-walled shell and outside the air groove.

[0012] 5. In the above solution, each end of the carrier plate has an outward extension, and a cylinder is provided on the lower surface of the base plate and directly below the two extensions. The upper end of the cylinder piston rod passes through the mounting notches on the base plate and the extension in turn, and is equipped with a pressure block that can press against the upper surface of the extension.

[0013] 6. In the above solution, the base plate includes a vertical portion connected to the rotating base and a horizontal portion for mounting the carrier plate.

[0014] 7. In the above solution, the processing spindle mounted on a three-axis drive mechanism can move in the horizontal and vertical directions.

[0015] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art:

[0016] 1. The present invention is a precision processing device for ultra-thin electronic devices, which can not only accurately position the thin-walled shell to be processed, but also ensure the surface fit between each wall panel of the thin-walled shell and the limit block. It also ensures that the entire surface of the wall panel to be processed, which is easy to deform due to its large area and thin thickness, and the limit block are tightly fitted through vacuum adsorption, thereby avoiding jitter, vibration, etc. when the cutter head performs multi-angle processing on the wall panel of the rotating thin-walled shell, which affects the processing accuracy and produces knife marks, thereby improving the processing quality.

[0017] 2. The present invention is a precision processing device for ultra-thin electronic devices, which provides initial positioning for the thin-walled shell by two mutually perpendicular limit blocks, and then pushes the other two mutually perpendicular limit blocks to make the four wall panels of the thin-walled shell correspond to each other and fit tightly with the four limit blocks. While facilitating the loading of the thin-walled shell to be processed and unloading the processed thin-walled shell, it can achieve tight clamping of the thin-walled shell without deviation, ensuring the accuracy of the multi-angle processing of the wall panels of the rotating thin-walled shell by the cutter head, and can also make the two movable limit blocks maintain the initial state of being opened outward to facilitate the loading and unloading of the thin-walled shell, and can buffer the thrust applied to the movable seat to avoid damage to the thin-walled shell caused by excessive instantaneous force, thereby ensuring the quality of processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Attachment Figure 1 Schematic diagram of the structure of the precision processing device for ultra-thin electronic devices of the present invention;

[0019] Attachment Figure 2 A schematic diagram of a partial structure of a precision processing device for ultra-thin electronic devices according to the present invention;

[0020] Attachment Figure 3 A schematic diagram of the partial structure decomposition of the precision processing device for ultra-thin electronic devices of the present invention;

[0021] Attachment Figure 4 A cross-sectional view of a local structure of the precision machining device of the present invention from one viewing angle;

[0022] Attachment Figure 5 A cross-sectional view of the local structure of the precision machining device of the present invention from another perspective;

[0023] Attachment Figure 6 This is a partial structural cross-sectional view of the precision machining device of the present invention from a third viewing angle.

[0024] In the above drawings: 1. carrier plate; 101. extension portion; 102. mounting notch; 2. first limit block; 3. second limit block; 4. third limit block; 5. fourth limit block; 6. thin-walled shell; 7. clamping area; 8. mounting seat; 9. movable seat; 10. strip mounting hole; 11. bolt; 12. raised portion; 13. air groove; 14. pipeline; 15. sealing groove; 16. elastic member; 17. machine table; 18. rotating seat; 19. machining spindle; 20. base plate; 201. vertical portion; 202. horizontal portion; 21. cutter head; 22. cylinder; 23. pressing block. DETAILED DESCRIPTION

[0025] In the description of this patent, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," "outer," and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended only to facilitate the description of the present invention and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation, and therefore should not be construed as limiting the present invention. The terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. In addition, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense, for example, to mean a fixed connection, a detachable connection, or an integral connection; a mechanical connection or an electrical connection; a direct connection, an indirect connection through an intermediate medium, or internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this patent in specific circumstances.

[0026] Embodiment 1: A precision processing device for ultra-thin electronic devices, comprising: a machine table 17, a rotating base 18 mounted on one end of the upper surface of the machine table 17, and a processing spindle 19 arranged above the machine table 17, one end of a base plate 20 is mounted on the driving shaft of the rotating base 18, the other end of the base plate 20 extends toward the other end of the machine table 17, the upper surface of the base plate 20 is directly below the cutter head 21 mounted on the processing spindle 19, and a carrier plate 1 is detachably mounted thereon, a first limit block 2 and a second limit block 3 are arranged on the upper surface of the carrier plate 1, and a third limit block 4 and a fourth limit block 5 are arranged between the first limit block 2 and the second limit block 3, each of which is perpendicular to the first limit block 2, so that a clamping area 7 for embedding a thin-walled shell 6 is enclosed between the first limit block 2, the second limit block 3, the third limit block 4, and the fourth limit block 5;

[0027] The first limit block 2 and the third limit block 4 fixedly mounted on the carrier plate 1 are each in contact with the outer surface of one wall plate of the thin-walled shell 6. The second limit block 3 and the fourth limit block 5 are slidably mounted on the carrier plate 1 through a movable seat 9. Each of the movable seats 9 and the carrier plate 1 is connected by an elastic member 16. When the movable seat 9 drives the second limit block 3 and the fourth limit block 5 to move toward the thin-walled shell 6 under the action of an external force until they are in contact with the outer surface of the wall plate of the thin-walled shell 6, the elastic member 16 is in a compressed state. The movable seat 9 and the carrier plate 1 are connected by bolts 11 through mutually matching strip-shaped mounting holes 10;

[0028] The third limit block 4 , which is in contact with the wall panel to be processed of the thin-walled shell 6 , is provided with interconnected air grooves 13 on its surface facing the thin-walled shell 6 , and a vacuum generator is connected to the air grooves 13 through a pipeline 14 .

[0029] The vacuum generator is arranged below the machine platform 17, and an air hole is provided on the machine platform 17 to connect the pipeline 14 with the vacuum generator; the first limit block 2 and the third limit block 4 are each fixedly mounted on the carrier plate 1 via a mounting seat 8;

[0030] The above-mentioned pipeline 14 is opened on the carrier plate 1, the mounting seat 8 on which the third limit block 4 is installed, and the third limit block 4; the above-mentioned carrier plate 1 and located in the clamping area 7 have an upward protrusion 12, and the upper surface of the above-mentioned protrusion 12 is provided with a groove matching the bottom of the thin-walled shell 6; the movable seat 9 on which the above-mentioned fourth limit block 5 is installed is installed at the upper part and a spring plunger is installed between the lower part of the movable seat 9 and the protrusion 12.

[0031] Embodiment 2: A precision processing device for ultra-thin electronic devices, comprising: a machine table 17, a rotating base 18 mounted on one end of the upper surface of the machine table 17, and a processing spindle 19 arranged above the machine table 17, one end of a base plate 20 is mounted on the driving shaft of the rotating base 18, the other end of the base plate 20 extends toward the other end of the machine table 17, the upper surface of the base plate 20 is directly below the cutter head 21 mounted on the processing spindle 19, and a carrier plate 1 is detachably mounted thereon, a first limit block 2 and a second limit block 3 are arranged on the upper surface of the carrier plate 1, and a third limit block 4 and a fourth limit block 5 are arranged between the first limit block 2 and the second limit block 3, each of which is perpendicular to the first limit block 2, so that a clamping area 7 for embedding a thin-walled shell 6 is enclosed between the first limit block 2, the second limit block 3, the third limit block 4, and the fourth limit block 5;

[0032] The first limit block 2 and the third limit block 4 fixedly mounted on the carrier plate 1 are each in contact with the outer surface of one wall plate of the thin-walled shell 6. The second limit block 3 and the fourth limit block 5 are slidably mounted on the carrier plate 1 through a movable seat 9. Each of the movable seats 9 and the carrier plate 1 is connected by an elastic member 16. When the movable seat 9 drives the second limit block 3 and the fourth limit block 5 to move toward the thin-walled shell 6 under the action of an external force until they are in contact with the outer surface of the wall plate of the thin-walled shell 6, the elastic member 16 is in a compressed state. The movable seat 9 and the carrier plate 1 are connected by bolts 11 through mutually matching strip-shaped mounting holes 10;

[0033] The third limit block 4 , which is in contact with the wall panel to be processed of the thin-walled shell 6 , is provided with interconnected air grooves 13 on its surface facing the thin-walled shell 6 , and a vacuum generator is connected to the air grooves 13 through a pipeline 14 .

[0034] The third stopper 4 has a sealing groove 15 formed on the edge of the surface of the thin-walled shell 6 and outside the air groove 13; each end of the carrier plate 1 has an outward extension 101, and a cylinder 22 is provided on the lower surface of the base plate 20 and directly below the two extensions 101. The upper end of the piston rod of the cylinder 22 passes through the mounting notches 102 on the base plate 20 and the extension 101 in turn, and is equipped with a pressure block 23 that can press against the upper surface of the extension 101;

[0035] The base plate 20 includes a vertical portion 201 connected to the rotating base 18 and a horizontal portion 202 for mounting the carrier 1. The machining spindle 19 mounted on a three-axis driving mechanism can move in the horizontal and vertical directions.

[0036] When the above-mentioned precision processing device for ultra-thin electronic devices is used, it can not only accurately position the thin-walled shell to be processed, but also ensure that the surface of each wall panel of the thin-walled shell and the limit block are in close contact with each other, and through vacuum adsorption, it is ensured that the entire surface of the wall panel to be processed, which is easy to deform due to its large area and thin thickness, and the limit block are in close contact with each other, thereby avoiding jitter, vibration, etc. when the cutter head performs multi-angle processing on the wall panel of the rotating thin-walled shell, which affects the processing accuracy and produces knife marks, thereby improving the processing quality;

[0037] In addition, two mutually perpendicular limit blocks are used to provide initial positioning for the thin-walled shell, and then the other two mutually perpendicular limit blocks are pushed to make the four wall panels of the thin-walled shell correspond to each other and fit tightly with the four limit blocks. While facilitating the loading of the thin-walled shell to be processed and unloading the processed thin-walled shell, the thin-walled shell can be tightly clamped without offset, ensuring the accuracy of the multi-angle processing of the wall panels of the rotating thin-walled shell by the cutter head, and the two movable limit blocks can be kept in the initial state of being opened outward to facilitate the loading and unloading of the thin-walled shell, and the thrust applied to the movable seat can be buffered to avoid damage to the thin-walled shell caused by excessive instantaneous force, thereby ensuring the quality of processing.

[0038] The above embodiments are intended only to illustrate the technical concepts and features of the present invention. Their purpose is to enable those skilled in the art to understand the contents of the present invention and implement them accordingly. They are not intended to limit the scope of protection of the present invention. Any equivalent changes or modifications made in accordance with the spirit of the present invention are intended to be covered by the scope of protection of the present invention.

Claims

1. A precision processing device for ultra-thin electronic devices, comprising: A machine (17), a rotating seat (18) mounted on one end of the upper surface of the machine (17) and a processing spindle (19) arranged above the machine (17), characterized in that: one end of a base plate (20) is mounted on the driving shaft of the rotating seat (18), the other end of the base plate (20) extends toward the other end of the machine (17), the upper surface of the base plate (20) is detachably mounted with a carrier plate (1) directly below the cutter head (21) mounted on the processing spindle (19), the upper surface of the carrier plate (1) is provided with a first limit block (2) and a second limit block (3) parallel to each other, a third limit block (4) and a fourth limit block (5) each perpendicular to the first limit block (2) are provided between the first limit block (2) and the second limit block (3), so that a clamping area (7) for embedding a thin-walled shell (6) is formed between the first limit block (2), the second limit block (3), the third limit block (4) and the fourth limit block (5); The first limit block (2) and the third limit block (4) fixedly mounted on the carrier (1) are each fitted with the outer surface of a wall panel of the thin-walled shell (6); the second limit block (3) and the fourth limit block (5) are both slidably mounted on the carrier (1) via a movable seat (9); each movable seat (9) is connected to the carrier (1) via an elastic member (16); when the movable seat (9) drives the second limit block (3) and the fourth limit block (5) to move toward the thin-walled shell (6) under the action of an external force until they fit with the outer surface of the wall panel of the thin-walled shell (6), the elastic member (16) is in a compressed state, and the movable seat (9) and the carrier (1) are connected to the bolt (11) via mutually matching strip-shaped mounting holes (10); A third limiting block (4) that is in contact with the wall panel to be processed of the thin-walled shell (6) is provided with interconnected air grooves (13) on its surface facing the thin-walled shell (6), and a vacuum generator is connected to the air grooves (13) via a pipeline (14).

2. The precision processing device for ultra-thin electronic devices according to claim 1, characterized in that: The vacuum generator is arranged below the machine platform (17), and an air hole is provided on the machine platform (17) for connecting the pipeline (14) and the vacuum generator.

3. The precision processing device for ultra-thin electronic devices according to claim 1 or 2, characterized in that: The first limiting block (2) and the third limiting block (4) are each fixedly mounted on the carrier plate (1) via a mounting seat (8).

4. The precision processing device for ultra-thin electronic devices according to claim 3, characterized in that: The pipeline (14) is opened on the carrier plate (1), the mounting seat (8) on which the third limiting block (4) is mounted, and the third limiting block (4).

5. The precision processing device for ultra-thin electronic devices according to claim 1, characterized in that: The third limiting block (4) is provided with a sealing groove (15) at an edge of the surface of the thin-walled shell (6) and outside the air groove (13).

6. The precision processing device for ultra-thin electronic devices according to claim 1, characterized in that: Each of the two ends of the carrier plate (1) has an outward extension portion (101), and a cylinder (22) is provided on the lower surface of the base plate (20) and directly below the two extension portions (101). The upper end of the piston rod of the cylinder (22) passes through the mounting notches (102) on the base plate (20) and the extension portion (101) in sequence, and is provided with a pressure block (23) that can press against the upper surface of the extension portion (101).

7. The precision processing device for ultra-thin electronic devices according to claim 1, characterized in that: The base plate (20) comprises a vertical portion (201) connected to the rotating seat (18) and a horizontal portion (202) for mounting the carrier plate (1).

8. The precision processing device for ultra-thin electronic devices according to claim 1, characterized in that: The processing spindle (19) mounted on a three-axis driving mechanism can move in horizontal and vertical directions.

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