Composition, UV anti-tack adhesive and UV anti-tack film

Abstract

This invention provides a composition, a UV anti-tack adhesive, and a UV anti-tack film. The composition, by weight percentage, comprises: 18-50 wt% of a resin matrix, 40-80 wt% of an active monomer diluent, 0.01-5 wt% of a photoinitiator, 0.01-5 wt% of a curing agent, and 0.01-40 wt% of a solvent; wherein the resin matrix is ​​a photosensitive resin, including bifunctional acrylic resins and multifunctional acrylic resins; the active monomer diluent includes non-photosensitive monomers, including monomers containing hydroxyl groups and epoxy group monomers, any one or more of these. By controlling the content of each component in the above composition within the aforementioned range and through the synergistic effect of the remaining components, the UV anti-tack adhesive possesses suitable crosslinking density, hardness, and viscosity, thereby helping to reduce the probability of adhesive overflow, reduce peeling difficulty during the process, and improve process yield.

Description

Technical Field

[0001] This invention relates to the field of UV anti-adhesion film technology, and more specifically, to a composition, a UV anti-adhesion adhesive, and a UV anti-adhesion film. Background Technology

[0002] When optical glass and semiconductors require cutting and grinding during processing, a special protective film is needed for bonding and fixing. After processing, the processed material can be easily peeled off from the fixing film without affecting the material itself. UV anti-adhesion film, also known as UV release tape, UV anti-adhesion tape, UV release tape, or UV anti-adhesion temporary bonding film, is a single-sided tape made by coating a special film with a special adhesive that exhibits high adhesion under normal conditions (2000gf / 25mm for SUS), but whose adhesion drops sharply after ultraviolet irradiation (10gf / 25mm for SUS).

[0003] UV anti-adhesion film provides high adhesion during cutting, ensuring that materials do not scatter, leave residue, or break during cutting, grinding, and other processing, preventing damage and expansion. The rapid UV irradiation reaction ensures processing quality and effectively improves work efficiency. There is no residue or adhesive breakage upon peeling, guaranteeing the smooth progress of subsequent processes. Furthermore, it is anti-static and resistant to acids and alkalis.

[0004] However, on flexible panels or in many irregular or curved shapes with large angles, a UV anti-adhesion film with greater adhesion is needed for fixation. Insufficient adhesion can lead to weak adhesion and affect the manufacturing process. Therefore, it has limitations in its widespread application in the manufacturing of flexible or curved AMOLED displays. Currently, UV anti-adhesion films have low adhesion (<2000gf / 25mm for SUS) and generate static electricity during use, which can easily damage the processed materials and cause them to fall off during the process. There is also the problem of adhesive overflow; even with increased bonding strength, UV anti-adhesion films still experience adhesive overflow, which can easily adhere to the flexible panel, thus affecting process yield. Summary of the Invention

[0005] The main objective of this invention is to provide a composition, a UV anti-tack adhesive, and a UV anti-tack film to solve the problems of adhesive overflow and low process yield in existing UV anti-tack films.

[0006] To achieve the above objectives, according to one aspect of the present invention, a composition is provided, comprising, by weight percentage: 18-50 wt% of a resin matrix, 40-80 wt% of an active monomer diluent, 0.01-5 wt% of a photoinitiator, 0.01-5 wt% of a curing agent, and 0.01-40 wt% of a solvent; wherein the resin matrix is ​​a photosensitive resin, the photosensitive resin including bifunctional acrylic resins and multifunctional acrylic resins, and the active monomer diluent includes non-photosensitive monomers, the non-photosensitive monomers including any one or more of monomers containing hydroxyl groups and epoxy group monomers.

[0007] Furthermore, the mass ratio of the above-mentioned difunctional acrylic resin to the multifunctional acrylic resin is 1 to 4:1.

[0008] Furthermore, the mass ratio of the resin matrix to the active monomer diluent is 1:0.5 to 4.

[0009] Further, the weight-average molecular weight (Mw) of the above-mentioned photosensitive resin is 3,000 to 100,000, preferably 5,000 to 50,000. Preferably, the difunctional acrylic resin is selected from any one or more of bisphenol A epoxy acrylate resin, polyurethane acrylate resin, and polyester acrylate resin. Preferably, the content of the difunctional acrylic resin is 10 to 40 wt%. Preferably, the multifunctional acrylic resin is selected from any one or more of graft-modified acrylate resin, phenolic epoxy acrylate resin, and polyurethane acrylate resin. The graft-modified acrylate resin is an acrylate resin with (meth)acrylate monomers side-linked. Preferably, the (meth)acrylate monomers are selected from any one or more of hydroxyethyl acrylate, hydroxyethyl methacrylate, and hydroxypropyl acrylate. Preferably, the content of the multifunctional acrylic resin is 10 to 30 wt%.

[0010] Furthermore, the above-mentioned active monomer diluent also includes a photosensitive monomer, the content of which is ≤40wt% and the content of which is ≥30wt%. Preferably, the photosensitive monomer includes any one or more of monofunctional monomers, difunctional monomers, and multifunctional monomers. The mass of the difunctional monomer and / or multifunctional monomer is denoted as m. Preferably, the mass ratio of the monofunctional monomer to m is 1:0.4 to 4.5.

[0011] Further, the content of the above-mentioned photoinitiator is 0.05-3 wt%, preferably a free radical photoinitiator, and preferably selected from any one or more of methyl benzoylformate, 1-hydroxycyclohexanebenzophenone, benzoyl dimethyl ether, diphenylphosphine oxide, tetraethylmiechone, and diphenyltitanium fluoride.

[0012] Further, the content of the curing agent is 0.5-2 wt%, preferably the curing agent includes isocyanate curing agents, preferably selected from toluene diisocyanate, diphenylmethane diisocyanate, aromatic polyisocyanate, alicyclic polyisocyanate, or any one or more. Preferably the curing agent also includes amine curing agents, preferably the mass ratio of isocyanate curing agent to amine curing agent is 1:0.01-0.4. Preferably the amine curing agent is selected from ethylenediamine, diethylenetriamine, triethylenetetramine, tetraethylenepentamine, hexamethylenediamine, polyethylenepolyamine, or any one or more.

[0013] Furthermore, the above composition further includes 0.1 to 5 wt% of an antistatic agent, preferably 0.05 to 3%, and the antistatic agent is preferably selected from any one or more of polythiophene derivatives, polyaniline derivatives, surface-modified single-walled or multi-walled carbon nanotubes, graphene or its derivatives, fullerenes, carbon black, lithium bis(trifluoromethanesulfonyl)imide, tributylmethylammonium bis(trifluoromethanesulfonyl)imide salt, and nanowires.

[0014] Furthermore, the content of the solvent is 10-30 wt%, and the solvent is preferably selected from any one or more of ethyl acetate, butyl acetate, acetone, butanone, methyl isobutyl ketone, isopropanol, n-butanol, propylene glycol methyl ether, and toluene.

[0015] According to another aspect of the present invention, a UV-resistant adhesive is provided, which is prepared by mixing the components of a composition, wherein the composition is the aforementioned composition.

[0016] According to another aspect of the present invention, a UV anti-adhesion film is provided, comprising a substrate film, a UV anti-adhesion adhesive, and a release film covering layer stacked sequentially, wherein the UV anti-adhesion adhesive is the aforementioned UV anti-adhesion adhesive.

[0017] Applying the technical solution of this invention, the photosensitive resin of this application participates in the photocuring reaction. Adding too much photosensitive resin easily increases viscosity and makes film formation difficult; adding too little easily leads to low adhesion, reduced crosslinking density, and poor heat resistance, affecting the mechanical storage modulus G and cutability, thus failing to meet the requirements for flexible / curved panel manufacturing processes. The non-photosensitive monomers contain active groups such as hydroxyl and epoxy groups, which react with the curing agent to produce hydroxyl groups, which can further react with the curing agent, further crosslinking and curing, increasing the overall crosslinking density, and simultaneously increasing adhesion. The synergistic effect of the above-mentioned resin matrix and non-photosensitive monomers allows the UV anti-tack adhesive to undergo both photocuring and thermal curing simultaneously. By controlling its content within the above-mentioned range and through the synergistic effect of the other components, the UV anti-tack adhesive has suitable crosslinking density, hardness, and viscosity, thereby helping to reduce the probability of adhesive overflow, reduce peeling difficulty during the process, and improve process yield. Detailed Implementation

[0018] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the embodiments.

[0019] As analyzed in the background section, existing UV anti-tack films suffer from problems such as adhesive overflow and low process yield. To solve this problem, the present invention provides a composition, a UV anti-tack adhesive, and a UV anti-tack film.

[0020] In a typical embodiment of this application, a composition is provided, comprising, by weight percentage: 18-50 wt% of a resin matrix, 40-80 wt% of an active monomer diluent, 0.01-5 wt% of a photoinitiator, 0.01-5 wt% of a curing agent, and 0.01-40 wt% of a solvent; wherein the resin matrix is ​​a photosensitive resin, the photosensitive resin includes bifunctional acrylic resins and multifunctional acrylic resins, and the active monomer diluent includes non-photosensitive monomers, the non-photosensitive monomers including any one or more of monomers containing hydroxyl groups and epoxy group monomers.

[0021] The photosensitive resin in this application participates in the photocuring reaction. Adding too much photosensitive resin can easily increase viscosity and make film formation difficult, while adding too little can lead to lower adhesion, reduced crosslinking density, and poor heat resistance, affecting the mechanical storage modulus G and cutability, thus failing to meet the requirements for flexible / curved panel manufacturing processes. The non-photosensitive monomers contain active groups such as hydroxyl and epoxy groups, which react with the curing agent to produce hydroxyl groups, which can further react with the curing agent, further crosslinking and curing, increasing the overall crosslinking density, and also increasing adhesion. The synergistic effect of the above-mentioned resin matrix and non-photosensitive monomers allows the UV anti-tack adhesive to undergo both photocuring and thermal curing simultaneously. By controlling its content within the aforementioned range and through the synergistic effect of the other components, the UV anti-tack adhesive has suitable crosslinking density, hardness, and viscosity, thereby helping to reduce the probability of adhesive overflow, reduce peeling difficulty during the process, and improve process yield.

[0022] In one embodiment of this application, the mass ratio of the above-mentioned bifunctional acrylic resin to the multifunctional acrylic resin is 1 to 4:1.

[0023] Bifunctional acrylic resins help improve the flexibility of UV anti-tack adhesives, but excessive addition results in a softer adhesive layer after curing. Multifunctional acrylic resins help increase crosslinking density, but excessive addition results in a harder adhesive layer after curing, which is not conducive to improving bonding strength and limits their application in flexible or curved component manufacturing processes. Therefore, the preferred mass ratio range of the above-mentioned bifunctional acrylic resins and multifunctional acrylic resins (non-photosensitive resins) is more conducive to their synergistic complementarity, thereby giving the UV anti-tack adhesive suitable crosslinking density, hardness, and viscosity. This helps to reduce the probability of adhesive overflow, reduce the difficulty of peeling during the process, and improve the process yield.

[0024] In one embodiment of this application, the mass ratio of the resin matrix to the active monomer diluent is 1:0.5 to 4.

[0025] The active monomer diluent primarily functions to dissolve and dilute the resin matrix, adjust the viscosity of the composition, and participate in the curing reaction. Adding too much can reduce the viscosity of the UV tack reducer, affecting coating application, and due to its low molecular weight, it has high volatility, resulting in a strong odor and flammability. Adding too little can lead to insufficient cross-linking, resulting in lower curing speed and adhesion. Ideally, the mass ratio of the resin matrix to the active monomer diluent should be within the aforementioned range. This helps control the viscosity, cross-linking density, and hardness of the UV tack reducer, thereby improving both the overall performance of the UV tack reducer and the process yield.

[0026] In one embodiment of this application, the weight-average molecular weight (Mw) of the photosensitive resin is 3,000 to 100,000, preferably 5,000 to 50,000. Preferably, the difunctional acrylic resin is selected from any one or more of bisphenol A epoxy acrylate resin, polyurethane acrylate resin, and polyester acrylate resin. Preferably, the content of the difunctional acrylic resin is 10 to 40 wt%. Preferably, the multifunctional acrylic resin is selected from any one or more of graft-modified acrylate resin, phenolic epoxy acrylate resin, and polyurethane acrylate resin. The graft-modified acrylate resin is an acrylate resin with (meth)acrylate monomers side-branched. Preferably, the (meth)acrylate monomers are selected from any one or more of hydroxyethyl acrylate, hydroxyethyl methacrylate, and hydroxypropyl acrylate. Preferably, the content of the multifunctional acrylic resin is 10 to 30 wt%.

[0027] The preferred resin matrix of the above-mentioned types and molecular weights helps to control the viscosity of UV anti-tack adhesives and balance their adhesion, crosslinking density, flexibility, hardness, and strength. This facilitates easy formulation and coating, reducing the likelihood of adhesive overflow, lowering peeling difficulty during the process, improving process yield, and providing excellent heat resistance, further meeting the requirements of flexible panel manufacturing processes. In particular, the grafted modified acrylate resin has more active groups in its side chains, which is more conducive to increasing the overall crosslinking density of the UV anti-tack adhesive, thereby improving its mechanical storage modulus G and cutability.

[0028] In some embodiments of this application, the preferred resin body further includes a non-photosensitive resin, which includes epoxy resin, hydroxyl-containing resin and / or polyurethane resin, and the mass ratio of non-photosensitive resin to photosensitive resin is preferably 0.8 to 1.6:1.

[0029] Epoxy resin can increase crosslinking density and raise the glass transition temperature (Tg). Hydroxyl-containing resins have high adhesion and good flexibility, which helps to improve viscosity and control coatability. Polyurethane resins have high strength, which helps to improve bond strength and have excellent weather resistance. The epoxy resin content in the resin matrix is ​​5-30 wt%, and the preferred mass ratio of epoxy resin, hydroxyl-containing resin and polyurethane resin is 1:0.4-4:0.4-4.

[0030] In some embodiments of this application, the weight-average molecular weight Mw of the epoxy resin is 5,000 to 60,000, such as 5,000, 8,000, 10,000, 15,000, 20,000, 25,000, 30,000, 35,000, 40,000, 45,000, 50,000, 55,000, 60,000, etc. Preferably, the epoxy resin is selected from any one or more of bisphenol A epoxy resin, phenolic epoxy resin, phenolic epoxy resin, o-cresol epoxy resin, and bisphenol F type epoxy resin.

[0031] In some embodiments of this application, the weight-average molecular weight (Mw) of the hydroxyl-containing resin is 3,000 to 60,000, such as 3,000, 5,000, 8,000, 10,000, 15,000, 20,000, 25,000, 30,000, 35,000, 40,000, 45,000, 50,000, 55,000, 60,000, etc. Preferably, the hydroxyl-containing resin is selected from any one or more of polyether polyol resin, polyester diol resin, alkyl diol resin, and diepoxyethylene glycol diglycidyl ether resin.

[0032] In some embodiments of this application, the weight-average molecular weight (Mw) of the polyurethane resin is 5,000 to 100,000, such as 5,000, 8,000, 10,000, 15,000, 20,000, 25,000, 30,000, 35,000, 40,000, 45,000, 50,000, 55,000, 60,000, 70,000, 80,000, 90,000, 100,000, etc. Preferably, the polyurethane resin is selected from any one or more of polyurethane epoxy resin, polyether-type polyurethane resin, and polyester-type polyurethane resin. Among these, the smaller the side chain groups and the more methylene groups between ether or ester bonds in the aforementioned polyester-type and polyether-type polyurethane resins, the higher the molecular weight of the crystalline soft segment, resulting in higher crystallinity and greater adhesive strength of the polyurethane resin.

[0033] Photosensitive reactive monomer diluents primarily function to dissolve and dilute oligomers, adjust system viscosity, and most importantly, participate in the photocuring reaction. Insufficient content leads to insufficient cross-linking, resulting in lower curing speed and adhesion. Excessive addition reduces the viscosity of the UV-curing adhesive, affecting coating application. Faster curing speed and higher cross-linking density after curing result in a harder, more brittle adhesive layer, hindering improved bonding strength and limiting its application in flexible or curved component manufacturing. Therefore, it is preferable that the aforementioned reactive monomer diluent also includes photosensitive monomers, with a content ≤40wt% and a non-photosensitive monomer content ≥30wt%. The combination of photosensitive and non-photosensitive monomers primarily increases molecular weight and improves adhesion, thereby enhancing the bonding strength of the UV-curing adhesive and expanding its application in flexible or curved component manufacturing.

[0034] The preferred photosensitive monomers include any one or more of monofunctional monomers, difunctional monomers, and multifunctional monomers, which, in combination with the resin matrix or photosensitive monomer structure, have a synergistic effect. The preferred monofunctional monomers are selected from any one or more of hydroxyethyl methacrylate, ethoxyethyl acrylate, ethyl methacrylate, hydroxyethyl acrylate, hydroxypropyl acrylate, butyl acrylate, methyl methacrylate, acrylic acid, diisooctyl maleate, and monomers containing functional groups. The preferred monomers containing functional groups are selected from any one or more of ethoxylated neopentyl glycol methoxy monoacrylate, 1,6-hexanediol methoxy monoacrylate, ethoxyethoxyethyl acrylate, and methoxyethyl acrylate. A combination of hydroxyethyl methacrylate and methyl methacrylate is further preferred. Excessive addition of monofunctional monomers results in a softer cured adhesive layer, while insufficient addition results in a harder cured adhesive layer. Therefore, the preferred content of monofunctional monomers in the photosensitive monomers is 20–40 wt%. To further enhance the synergistic effect of difunctional and multifunctional monomers with monofunctional monomers, the difunctional monomers are preferably selected from any one or more of tripropylene glycol diacrylate, dipropylene glycol diacrylate, hexanediol diacrylate, neopentyl glycol diacrylate, diethylene glycol divinyl ether, and bisphenol A epoxy acrylate. The multifunctional monomers are preferably selected from any one or more of trimethylolpropane triacrylate, pentaerythritol triacrylate, bis(trimethylolpropane)tetraacrylate, and bis(pentaerythritol) penta / hexaacrylate. Further preferred... The adhesive film contains one or a combination of two of pentapentaerythritol penta- and hexaacrylates. However, if too many difunctional and polyfunctional monomers are added, the cured adhesive layer will be too hard, which is not conducive to improving the bonding strength and limits its application in the manufacturing process of flexible or curved components. Therefore, it is preferred that the content of difunctional monomers is 10-20 wt%, and the content of polyfunctional monomers is preferred to be 5-15 wt%. The non-photosensitive monomers are preferably selected from any one or more of epoxyethylene glycol diglycidyl ether, polyester diol, polyether diol, and alkyl diol, so as to take into account the peel strength of the UV anti-adhesion film before and after UV irradiation.

[0035] The mass of the bifunctional monomer and / or multifunctional monomer is denoted as m. Preferably, the mass ratio of the monofunctional monomer to m is 1:0.4 to 4.5, which is beneficial to further improve the synergistic effect between photosensitive monomers with different functionalities and obtain a UV anti-sticking film with excellent performance.

[0036] When exposed to ultraviolet light, the photoinitiator absorbs the light energy and splits into multiple active free radicals, initiating a chain polymerization reaction between the photosensitive resin and the reactive monomer diluent, thus causing the UV anti-tack adhesive to crosslink and cure. If too much photoinitiator is added, the coating surface will absorb excessive ultraviolet light, reducing the penetration ability of ultraviolet light and resulting in incomplete curing of the underlying layer. This can lead to excessive peel strength of the UV anti-tack film after UV irradiation, as well as issues with residual adhesive and storage thermal stability, which are detrimental to improving process yield. Conversely, if too little photoinitiator is added, the photosensitive resin and reactive monomer diluent will not react completely, still easily resulting in excessive peel strength of the UV anti-tack film after UV irradiation and residual adhesive, which is also detrimental to improving process yield. Therefore, the preferred content of the above-mentioned photoinitiator is 0.05 to 3 wt%, such as the preferred content of the photoinitiator in this application being 0.5 wt%, 1 wt%, 1.5 wt%, 2 wt%, 3 wt%, etc. The preferred photoinitiator is a free radical type photoinitiator, and the preferred free radical type photoinitiator is selected from any one or more of methyl benzoylformate, 1-hydroxycyclohexanebenzophenone, benzoyladium dimethyl ether, diphenylphosphine oxide, tetraethylmiechone, and diphenyltitanium fluoride.

[0037] Excessive addition of curing agent will cause the non-photosensitive resin to react completely, which is not conducive to reducing the peel strength before UV irradiation. Insufficient addition will result in insufficient reaction of the non-resin matrix, leading to excessive peel strength. At the same time, it will also cause excessive peel strength after UV irradiation and leave residual adhesive. In order to balance the peel strength before and after UV irradiation, the content of the above-mentioned curing agent is preferably 0.5-2 wt%. For example, the preferred curing agent content in this application is 0.5 wt%, 0.51 wt%, 1 wt%, 1.5 wt%, 2 wt%, etc. The preferred curing agent includes isocyanate curing agents. The preferred isocyanate curing agents are selected from any one or more of toluene diisocyanate, diphenylmethane diisocyanate, aromatic polyisocyanate, and alicyclic polyisocyanate. Further, the preferred isocyanate curing agents are selected from any one or more of Coronate LS, 2037, Desmodur L-75, Takenate D-101E, Risheng SC-75LT, and Wanhua Chemical TL-75E. Isocyanate curing agents contain a highly unsaturated structure of isocyanate groups (-NCO), which determines their high reactivity. The curing agent reacts with the epoxy groups in the epoxy resin to generate hydroxyl groups, and the hydroxyl groups react with isocyanates again. At the same time, it also includes the reaction between isocyanates and polyols and their small molecule alcohols, which is more conducive to exerting its curing performance.

[0038] In some embodiments, the curing agent preferably further includes an amine curing agent, and the mass ratio of isocyanate curing agent to amine curing agent is preferably 1:0.01 to 0.4. The amine curing agent is preferably selected from any one or more of ethylenediamine, diethylenetriamine, triethylenetetramine, tetraethylenepentamine, hexamethylenediamine, and polyethylenepolyamine. The isocyanate curing agent is used in combination with the amine curing agent, and the amine ions in the amine curing agent can also react with the epoxy groups and isocyanates in the epoxy resin, thereby further improving the curing efficiency of the resin matrix.

[0039] To reduce the impact of static electricity on the processed parts and improve the process yield, the above composition preferably further includes 0.1 to 5 wt% of an antistatic agent. For example, the preferred content of the antistatic agent in this application is 0.1 wt%, 0.5 wt%, 0.7 wt%, 1 wt%, 1.5 wt%, 2 wt%, 2.5 wt%, 3 wt%, 3.5 wt%, 4 wt%, 4.9 wt%, 5 wt%, etc., and more preferably 0.05 to 3%. For example, the preferred content of the antistatic agent in this application is 0.1 wt%, 0.5 wt%, 0.7 wt%, 1 wt%, 1.5 wt%, 2 wt%, 2.5 wt%, 3 wt%, etc. The preferred antistatic agent is selected from any one or more of polythiophene derivatives, polyaniline derivatives, surface-modified single-walled or multi-walled carbon nanotubes, graphene or its derivatives, fullerenes, carbon black, lithium bis(trifluoromethanesulfonyl)imide, tributylmethylammonium bis(trifluoromethanesulfonyl)imide salt, and nanowires.

[0040] In one embodiment of this application, the content of the solvent is 10-30 wt%, and the solvent is preferably selected from any one or more of ethyl acetate, butyl acetate, acetone, butanone, methyl isobutyl ketone, isopropanol, n-butanol, propylene glycol methyl ether, and toluene.

[0041] Solvents can adjust the viscosity of adhesive compositions, thus preventing excessive viscosity from increasing the difficulty of coating and insufficient viscosity from preventing the formation of thick adhesive layers. This also avoids prolonged baking times after coating, which would reduce production efficiency. In this application, the preferred solvent content is 0.1 wt%, 1.88 wt%, 5.5 wt%, 10 wt%, 15 wt%, 17.49 wt%, 18.09 wt%, 18.49 wt%, 20 wt%, 22.45 wt%, 25 wt%, 27 wt%, 30 wt%, 35 wt%, 40 wt%, etc., and more preferably 10 wt%, 15 wt%, 17.49 wt%, 18.09 wt%, 18.49 wt%, 20 wt%, 22.45 wt%, 25 wt%, 27 wt%, 30 wt%.

[0042] In another typical embodiment of this application, a UV-resistant adhesive is provided, which is prepared by mixing the components of a composition as described above.

[0043] By controlling the content of each component in the composition within the aforementioned range and through the synergistic effect of the remaining components, the UV anti-adhesive adhesive achieves suitable crosslinking density, hardness, and viscosity, thereby helping to reduce the probability of adhesive overflow. Furthermore, the UV anti-adhesive film, including the UV anti-adhesive adhesive of this application, exhibits high adhesion and acid / alkali resistance when used for cutting, ensuring that the material does not scatter, leave residue, expand, or break during cutting, grinding, and other processing. Even on flexible panels or many irregularly shaped or curved surfaces, it provides protection, fixation, and support for flexible or curved adhered objects. The rapid UV irradiation reaction time ensures quality during processing and effectively improves work efficiency. There is no residue or adhesive breakage during peeling, reducing peeling force during the process, improving process yield, and ensuring the smooth operation of subsequent processes.

[0044] In another typical embodiment of this application, a UV anti-adhesion film is provided, comprising a substrate film, a UV anti-adhesion adhesive, and a release film covering layer stacked sequentially, wherein the UV anti-adhesion adhesive is the aforementioned UV anti-adhesion adhesive.

[0045] The UV anti-tack film, including the UV anti-tack adhesive described in this application, reduces peeling force during the manufacturing process, improves process yield, and ensures the smooth operation of subsequent processes.

[0046] The preferred method for preparing the UV anti-adhesion film includes: adding the resin matrix, active monomer diluent, antistatic agent and solvent into a reaction vessel and mechanically stirring at a constant speed for 1 to 3 hours to obtain the main agent A.

[0047] Under yellow light or in the dark, add the photoinitiator to the main agent A in the specified proportion and stir mechanically for 15-60 minutes. Then add the curing agent and stir mechanically for another 15-60 minutes to obtain the antistatic UV anti-tack adhesive. The proportions of each component should refer to the corresponding proportions in the adhesive composition. Finally, coat the adhesive onto a 50μm thick PET, PO, or PVC substrate using a coating machine or a slot coater. After coating, bake it in an oven at 80-110℃ for 1-5 minutes. After drying, the film thickness should be approximately 10-30μm. Then, apply the release film using a flatbed laminator. Select the release surface of the PET light release film and apply it to the dried UV anti-tack adhesive to obtain the final UV anti-tack film.

[0048] The beneficial effects of this application will be explained below with reference to specific embodiments and comparative examples.

[0049] Example 1

[0050] The composition of the composition in Example 1 is shown in Table 1.

[0051] Table 1

[0052]

[0053]

[0054] Example 2

[0055] The difference between Example 2 and Example 1 is that,

[0056] The composition was obtained by combining a bifunctional photosensitive resin (Changxing DR-U394) with a content of 20.7 wt% and a multifunctional photosensitive resin (Changxing DR-U202) with a content of 10.3 wt%.

[0057] Example 3

[0058] The difference between Example 3 and Example 1 is that,

[0059] The composition was obtained by combining a bifunctional photosensitive resin (Changxing DR-U394) with a content of 24.8 wt% and a multifunctional photosensitive resin (Changxing DR-U202) with a content of 6.2 wt%.

[0060] Example 4

[0061] The difference between Example 4 and Example 1 is that,

[0062] The composition was obtained by using a bifunctional photosensitive resin, Changxing DR-U394, with a content of 10.3 wt% and a multifunctional photosensitive resin, Changxing DR-U202, with a content of 20.7 wt%.

[0063] Example 5

[0064] The difference between Example 5 and Example 1 is that,

[0065] The composition was obtained by combining a bifunctional photosensitive resin (Changxing DR-U394) with a content of 25.8 wt% and a multifunctional photosensitive resin (Changxing DR-U202) with a content of 5.2 wt%.

[0066] Example 6

[0067] The difference between Example 6 and Example 1 is that,

[0068] The content of the bifunctional photosensitive resin, Changxing DR-U394, is 7.8 wt%, and the content of the multifunctional photosensitive resin, Changxing DR-U202, is 7.8 wt%.

[0069] The composition is obtained by comprising 10.92 wt% hydroxyethyl methacrylate, 5.46 wt% tripropylene glycol diacrylate, 5.46 wt% dipentaerythritol hexaacrylate, 20.28 wt% polyester diol, and 20.28 wt% monoepoxy propenyl glycidyl ether.

[0070] Example 7

[0071] The difference between Example 7 and Example 1 is that,

[0072] Bifunctional photosensitive resin: Changxing DR-U394 content is 26wt%; Multifunctional photosensitive resin: Changxing DR-U202 content is 26wt%.

[0073] The composition is obtained by comprising 4.55 wt% hydroxyethyl methacrylate, 2.28 wt% tripropylene glycol diacrylate, 2.27 wt% dipentaerythritol hexaacrylate, 8.45 wt% polyester diol, and 8.45 wt% monoepoxy propenyl glycidyl ether.

[0074] Example 8

[0075] The difference between Example 8 and Example 1 is that,

[0076] The content of the bifunctional photosensitive resin, Changxing DR-U394, is 6.5wt%, and the content of the multifunctional photosensitive resin, Changxing DR-U202, is 6.5wt%.

[0077] The composition was obtained by comprising 11.38 wt% hydroxyethyl methacrylate, 5.68 wt% tripropylene glycol diacrylate, 5.69 wt% dipentaerythritol hexaacrylate, 21.13 wt% polyester diol, and 21.12 wt% monoepoxy propenyl glycidyl ether.

[0078] Example 9

[0079] The difference between Example 9 and Example 1 is that,

[0080] Bifunctional photosensitive resin: Changxing DR-U394 content is 30wt%; Multifunctional photosensitive resin: Changxing DR-U202 content is 30wt%.

[0081] The composition is obtained by comprising 3.15 wt% hydroxyethyl methacrylate, 1.57 wt% tripropylene glycol diacrylate, 1.58 wt% dipentaerythritol hexaacrylate, 5.85 wt% polyester diol, and 5.85 wt% monoepoxy propylene glycidyl ether.

[0082] Example 10

[0083] The difference between Example 10 and Example 1 is that,

[0084] The bifunctional photosensitive resin was Dow DEN431, the multifunctional photosensitive resin was double-bonded DM88, and the weight-average molecular weight (Mw) of the photosensitive resin was 50,000, thus obtaining the composition.

[0085] Example 11

[0086] The difference between Example 11 and Example 1 is that,

[0087] The bifunctional photosensitive resin was Guonengda AC3266, and the multifunctional photosensitive resin was Sartamomer CN9010NS. The weight-average molecular weight (Mw) of the photosensitive resin was 5000, thus obtaining the composition.

[0088] Example 12

[0089] The difference between Example 12 and Example 1 is that,

[0090] The bifunctional photosensitive resin was Jiangsu Sanmu E51, and the multifunctional photosensitive resin was Changxing DR-U110. The weight-average molecular weight (Mw) of the photosensitive resin was 3000, and the composition was obtained.

[0091] Example 13

[0092] The difference between Example 13 and Example 1 is that,

[0093] The composition was obtained by comprising 11.43 wt% hydroxyethyl methacrylate, 2.28 wt% tripropylene glycol diacrylate, and 2.29 wt% dipentaerythritol hexaacrylate.

[0094] Example 14

[0095] The difference between Example 14 and Example 1 is that,

[0096] The composition was obtained by comprising 2.9 wt% hydroxyethyl methacrylate, 6.55 wt% tripropylene glycol diacrylate, and 6.55 wt% dipentaerythritol hexaacrylate.

[0097] Example 15

[0098] The difference between Example 15 and Example 1 is that,

[0099] The composition was obtained by comprising 13.33 wt% hydroxyethyl methacrylate, 1.34 wt% tripropylene glycol diacrylate, and 1.33 wt% dipentaerythritol hexaacrylate.

[0100] Example 16

[0101] The difference between Example 16 and Example 1 is that,

[0102] The composition was obtained by comprising 2.67 wt% hydroxyethyl methacrylate, 6.66 wt% tripropylene glycol diacrylate, and 6.67 wt% dipentaerythritol hexaacrylate.

[0103] Example 17

[0104] The difference between Example 17 and Example 1 is that,

[0105] The composition was obtained by containing 0.307 wt% toluene diisocyanate and 0.003 wt% diethylenetriamine.

[0106] Example 18

[0107] The difference between Example 18 and Example 1 is that,

[0108] The composition was obtained by containing 0.221 wt% toluene diisocyanate and 0.089 wt% diethylenetriamine.

[0109] Example 19

[0110] The difference between Example 19 and Example 1 is that,

[0111] The composition was obtained by containing 0.308 wt% toluene diisocyanate and 0.002 wt% diethylenetriamine.

[0112] Example 20

[0113] The difference between Example 20 and Example 1 is that,

[0114] The composition was obtained by containing 0.207 wt% toluene diisocyanate and 0.103 wt% diethylenetriamine.

[0115] Example 21

[0116] The difference between Example 21 and Example 1 is that,

[0117] Bifunctional photosensitive resin: Changxing DR-U394 content is 12wt%, multifunctional photosensitive resin: Changxing DR-U202 content is 6wt%.

[0118] The content of hydroxyethyl methacrylate is 8 wt%, the content of tripropylene glycol diacrylate is 8 wt%, the content of dipentaerythritol hexaacrylate is 8 wt%, the content of polyester diol is 28 wt%, and the content of monoepoxy propenyl glycidyl ether is 28 wt%.

[0119] The content of ethyl acetate is 1.88 wt%.

[0120] The content of lithium bis(trifluoromethanesulfonyl)imide (LiTFSI) is 0.1 wt%.

[0121] The content of benzoyl dimethyl ether (651) is 0.01 wt%;

[0122] The composition was obtained by containing 0.0097 wt% toluene diisocyanate and 0.0003 wt% diethylenetriamine.

[0123] Example 22

[0124] The difference between Example 22 and Example 1 is that,

[0125] The content of the bifunctional photosensitive resin, Changxing DR-U394-1, is 30wt%, and the content of the multifunctional photosensitive resin, Changxing DR-U202, is 20wt%.

[0126] The content of hydroxyethyl methacrylate is 8 wt%, the content of tripropylene glycol diacrylate is 2 wt%, the content of dipentaerythritol hexaacrylate is 2 wt%, the content of polyester diol is 14 wt%, and the content of monoepoxy propenyl glycidyl ether is 14 wt%.

[0127] The content of ethyl acetate is 0.1 wt%.

[0128] The content of lithium bis(trifluoromethanesulfonyl)imide (LiTFSI) is 4.9 wt%.

[0129] The content of benzoyl dimethyl ether (651) is 3 wt%;

[0130] The composition was obtained by containing 1.95 wt% toluene diisocyanate and 0.05 wt% diethylenetriamine.

[0131] Example 23

[0132] The difference between Example 23 and Example 1 is that,

[0133] The content of the bifunctional photosensitive resin, Changxing DR-U394-1, is 12wt%, and the content of the multifunctional photosensitive resin, Changxing DR-U202, is 6wt%.

[0134] The content of hydroxyethyl methacrylate is 8 wt%, the content of tripropylene glycol diacrylate is 2 wt%, the content of dipentaerythritol hexaacrylate is 2 wt%, the content of polyester diol is 14 wt%, and the content of monoepoxy propenyl glycidyl ether is 14 wt%.

[0135] The content of ethyl acetate is 40 wt%;

[0136] The content of lithium bis(trifluoromethanesulfonyl)imide (LiTFSI) is 0.5 wt%.

[0137] The content of benzoyl dimethyl ether (651) is 1 wt%;

[0138] The composition was obtained by containing 0.49 wt% toluene diisocyanate and 0.01 wt% diethylenetriamine.

[0139] Example 24

[0140] The difference between Example 24 and Example 1 is that,

[0141] The content of the bifunctional photosensitive resin, Changxing DR-U394-1, is 12wt%, and the content of the multifunctional photosensitive resin, Changxing DR-U202, is 6wt%.

[0142] The content of hydroxyethyl methacrylate is 8 wt%, the content of tripropylene glycol diacrylate is 2 wt%, the content of dipentaerythritol hexaacrylate is 2 wt%, the content of polyester diol is 14 wt%, and the content of monoepoxy propenyl glycidyl ether is 14 wt%.

[0143] The content of ethyl acetate is 27 wt%.

[0144] The content of lithium bis(trifluoromethanesulfonyl)imide (LiTFSI) is 5 wt%.

[0145] The content of benzoyl dimethyl ether (651) is 5 wt%;

[0146] The composition was obtained by containing 4.9 wt% toluene diisocyanate and 0.1 wt% diethylenetriamine.

[0147] The composition of the adhesive composition of Example 25 is shown in Table 2, the composition of the adhesive composition of Example 26 is shown in Table 3, the composition of the adhesive composition of Example 27 is shown in Table 4, the composition of the adhesive composition of Example 28 is shown in Table 5, and the composition of the adhesive composition of Example 29 is shown in Table 6.

[0148] Table 2

[0149]

[0150]

[0151] Table 3

[0152]

[0153] Table 4

[0154]

[0155]

[0156] Table 5

[0157]

[0158] Table 6

[0159]

[0160] Example 30

[0161] The UV adhesive composition of Example 30 is shown in Table 7.

[0162] The specific mixed resins included are as follows:

[0163] Resin A1 (hydroxyl-containing resin): VORANOL 3003N;

[0164] Resin A2 (polyether polyurethane resin): Mw = 60000;

[0165] Resin A3 (epoxy resin): E-20 (601);

[0166] Resin B1 (bifunctional acrylic resin): Changxing DR-U394; Resin B2 (polyfunctional acrylic resin): Changxing DR-U202.

[0167] Table 7

[0168]

[0169] Example 31

[0170] The difference between Example 31 and Example 30 is that,

[0171] The content of resin A1 is 8 wt%, the content of resin A2 is 8 wt%, and the content of butyl acetate is 21.69 wt%, thus obtaining a UV adhesive composition.

[0172] Example 32

[0173] The difference between Example 32 and Example 30 is that,

[0174] The content of resin A1 is 16 wt%, the content of resin A2 is 16 wt%, and the content of butyl acetate is 5.69 wt%, thus obtaining a UV adhesive composition.

[0175] Example 33

[0176] The difference between Example 33 and Example 30 is that,

[0177] The content of resin A1 is 18 wt%, the content of resin A2 is 18 wt%, and the content of butyl acetate is 1.69 wt%, thus obtaining a UV adhesive composition.

[0178] Example 34

[0179] The difference between Example 34 and Example 30 is that,

[0180] The content of resin A1 is 6 wt%, the content of resin A2 is 6 wt%, and the content of butyl acetate is 25.69 wt%, thus obtaining a UV adhesive composition.

[0181] The composition of the adhesive composition of Comparative Example 1 is shown in Table 8, the composition of the adhesive composition of Comparative Example 2 is shown in Table 9, and the composition of the adhesive composition of Comparative Example 3 is shown in Table 10.

[0182] Table 8

[0183]

[0184] Table 9

[0185]

[0186]

[0187] Table 10

[0188]

[0189]

[0190] UV anti-adhesion films were prepared using the following method:

[0191] The resin matrix, active monomer diluent, antistatic agent and solvent are added to the reaction vessel and mechanically stirred at a constant speed for 2 hours to obtain the main agent A.

[0192] Under yellow light or in the dark, add the photoinitiator to the main agent A in proportion and stir mechanically for 30 minutes, then add the curing agent and stir mechanically for another 30 minutes to obtain the antistatic UV anti-tack adhesive. The proportions of each component are as described in the adhesive compositions of Examples 1 to 34 and Comparative Examples 1 to 3. Finally, coat the adhesive onto 50μm thick PET, PO, and PVC substrates using a coating machine or a slot coater. After coating, bake the adhesive in a 100℃ oven for 3 minutes. The film thickness after drying is approximately 20μm. Then, apply the release film using a flatbed laminator. Select the release surface of the PET light release film and apply it to the dried UV anti-tack adhesive to obtain the UV anti-tack film.

[0193] Peel strength test:

[0194] The UV anti-adhesion films prepared above were cut into 25mm wide and 150mm long pieces, and the release film was removed and attached to stainless steel plate (SUS), PET and glass substrates respectively. Each film was pressed 6 times with a 2kg roller. Under normal temperature, the peel strength before UV was tested using an Instron 34SC1. After standing under yellow light for 20 minutes, the peel strength after UV was tested using a Topbo 8203S.

[0195] Trustworthiness test:

[0196] The UV anti-adhesion films prepared above were cut into 25mm wide and 150mm long pieces, and the release film was removed. They were then attached to stainless steel (SUS), PET and glass substrates, respectively. Each film was pressed with a 2kg roller 6 times. The peel strength before UV exposure was tested at 85℃ and RH85%. After standing under yellow light for 240h, the peel strength after UV exposure was tested with a Topbo 8203S.

[0197] Resistance test:

[0198] The SIMCO ST-4 surface resistivity meter was used.

[0199] Table 11 shows the test requirements for peel strength at room temperature, at 85℃ and RH85% (after standing for 240 hours), and for resistance. Table 12 shows the test results for peel strength at room temperature, and Table 13 shows the test results for peel strength at 85℃ and RH85% (after standing for 240 hours).

[0200] Table 11

[0201]

[0202]

[0203] Table 12

[0204]

[0205]

[0206] Table 13

[0207]

[0208]

[0209]

[0210] As can be seen from the above description, the embodiments of the present invention achieve the following technical effects:

[0211] The photosensitive resin in this application participates in the photocuring reaction. Adding too much photosensitive resin can easily increase viscosity and make film formation difficult, while adding too little can lead to lower adhesion, reduced crosslinking density, and poor heat resistance, affecting the mechanical storage modulus G' and cutability, thus failing to meet the requirements for flexible / curved panel manufacturing processes. The non-photosensitive monomers contain active groups such as hydroxyl and epoxy groups, which react with the curing agent to produce hydroxyl groups, allowing for further reaction and crosslinking, increasing the overall crosslinking density and simultaneously increasing adhesion. The synergistic effect of the aforementioned resin matrix and non-photosensitive monomers allows the UV anti-tack adhesive to undergo both photocuring and thermal curing. By controlling its content within the aforementioned range and through the synergistic effect of other components, the UV anti-tack adhesive achieves suitable crosslinking density, hardness, and viscosity, thereby helping to reduce the probability of adhesive overflow, lower the difficulty of peeling during the process, and improve process yield.

[0212] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A composition, characterized in that, The composition comprises, by weight percentage: 18~50wt% resin matrix; 40~80wt% active monomer diluent; 0.01~5wt% photoinitiator; 0.01~5wt% curing agent; Solvents ranging from 0.01% to 40 wt%; The resin body is a photosensitive resin, which includes bifunctional acrylic resins and multifunctional acrylic resins. The active monomer diluent includes non-photosensitive monomers, which include any one or more of monomers containing hydroxyl groups and epoxy group monomers. The active monomer diluent also includes a photosensitive monomer, the content of which is ≤40wt%, and the photosensitive monomer includes any one or more of monofunctional monomers, difunctional monomers, and multifunctional monomers. The bifunctional acrylic resin is selected from any one or more of bisphenol A epoxy acrylic resin, polyurethane acrylic resin, and polyester acrylic resin; The multifunctional acrylic resin is selected from any one or more of grafted modified acrylate resin, phenolic epoxy acrylate resin, and polyurethane acrylate resin.

2. The composition according to claim 1, characterized in that, The mass ratio of the difunctional acrylic resin to the multifunctional acrylic resin is 1 to 4:

1.

3. The composition according to claim 1 or 2, characterized in that, The mass ratio of the resin matrix to the active monomer diluent is 1:0.5~4.

4. The composition according to claim 1, characterized in that, The weight-average molecular weight (Mw) of the photosensitive resin is 3000~100000. And / or, the content of the bifunctional acrylic resin is 10~40 wt%. And / or, the multifunctional acrylic resin is selected from any one or more of graft-modified acrylic resin, phenolic epoxy acrylic resin, and polyurethane acrylic resin, wherein the graft-modified acrylic resin is an acrylic resin with (meth)acrylic monomers side-branched, and / or, the content of the multifunctional acrylic resin is 10~30wt%.

5. The composition according to claim 4, characterized in that, The weight-average molecular weight (Mw) of the photosensitive resin is 5000-50000, and / or the (meth)acrylic monomer is selected from any one or more of hydroxyethyl acrylate, hydroxyethyl methacrylate, and hydroxypropyl acrylate.

6. The composition according to claim 1, characterized in that, The content of the non-photosensitive monomer is ≥30 wt%. The mass of the difunctional monomer and / or the multifunctional monomer is denoted as m, and the ratio of the mass of the monofunctional monomer to m is 1:0.4~4.

5.

7. The composition according to claim 1, characterized in that, The content of the photoinitiator is 0.05~3wt%, and / or the photoinitiator is a free radical type photoinitiator.

8. The composition according to claim 7, characterized in that, The free radical photoinitiator is selected from any one or more of methyl benzoylformate, 1-hydroxycyclohexanebenzophenone, benzoyl dimethyl ether, diphenylphosphine oxide, tetraethylmiechone, and diphenyltitanium fluoride.

9. The composition according to claim 1, characterized in that, The curing agent has a content of 0.5~2wt%, and / or the curing agent includes isocyanate curing agents, and / or the curing agent further includes amine curing agents.

10. The composition according to claim 9, characterized in that, The isocyanate curing agent is selected from any one or more of toluene diisocyanate, diphenylmethane diisocyanate, aromatic polyisocyanate, and alicyclic polyisocyanate; and / or, the mass ratio of the isocyanate curing agent to the amine curing agent is 1:0.01~0.4; and / or, the amine curing agent is selected from any one or more of ethylenediamine, diethylenetriamine, triethylenetetramine, tetraethylenepentamine, hexamethylenediamine, and polyethylenepolyamine.

11. The composition according to claim 1, characterized in that, The composition further includes 0.1-5 wt% of an antistatic agent, and / or the antistatic agent is selected from any one or more of polythiophene derivatives, polyaniline derivatives, surface-modified single-walled or multi-walled carbon nanotubes, graphene or its derivatives, fullerenes, carbon black, lithium bis(trifluoromethanesulfonyl)imide, tributylmethylammonium bis(trifluoromethanesulfonyl)imide salt, and nanowires.

12. The composition according to claim 11, characterized in that, The composition also includes 0.1 to 3 wt% of an antistatic agent.

13. The composition according to claim 1, characterized in that, The solvent content is 10-30 wt%, and / or the solvent is selected from any one or more of ethyl acetate, butyl acetate, acetone, butanone, methyl isobutyl ketone, isopropanol, n-butanol, propylene glycol methyl ether, and toluene.

14. A UV-resistant adhesive, prepared by mixing the components of a composition, characterized in that, The composition is the composition according to any one of claims 1 to 13.

15. A UV anti-adhesion film, comprising a substrate film, a UV anti-adhesion adhesive, and a release film covering layer stacked sequentially, characterized in that, The UV anti-tack adhesive is the UV anti-tack adhesive as described in claim 14.

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