Light board and its preparation method, backlight module and display device

Abstract

The present invention provides a light board and a preparation method thereof, a backlight module and a display device. The light board includes a base substrate, on which a reflective cup and a driving circuit for powering a light source are formed; the reflective cups are enclosed to form a plurality of grooves, and a reflective layer is formed on the surface of the reflective cups; the base substrate and the reflective cups are both made of glass; and a light source, wherein the light source is arranged in the groove, and two adjacent light sources are electrically connected based on the driving circuit; the present invention is conducive to reducing the halo phenomenon generated by the display panel and improving the display effect of the display panel.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a lamp panel and a preparation method thereof, a backlight module and a display device. Background Art

[0002] The backlight module is a key component of a liquid crystal display panel. Its function is to provide sufficient brightness and evenly distributed light to properly display images. Traditional backlight modules are equipped with a light board, which uses light-emitting diodes (LEDs) and light-scattering structures to achieve uniform backlighting.

[0003] Generally speaking, the backlight module's luminous efficiency directly impacts the visual quality of the LCD display module. Backlight modules are categorized as edge-lit and direct-lit, depending on the light source's location. Direct-lit backlight modules feature LEDs that are aligned with the LCD glass, resulting in better local dimming and a higher dynamic contrast ratio for the display panel.

[0004] However, in a direct-lit backlight module, light interference occurs between the illuminated LEDs, thereby generating a halo phenomenon on the display panel, resulting in poor image display quality.

[0005] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present invention, and therefore may include information that does not constitute prior art known to ordinary technicians in this field. Summary of the Invention

[0006] In view of this, the present invention provides a light board and a preparation method thereof, a backlight module and a display device to solve the problem of halo on the display panel resulting in poor display image.

[0007] According to one aspect of the present invention, there is provided a light board, comprising:

[0008] A base substrate, on which a reflector cup and a driving circuit for powering a light source are formed; the reflector cup encloses a plurality of grooves, and a reflective layer is formed on the surface of the reflector cup; the base substrate and the reflector cup are both made of glass; and

[0009] The light source is arranged in the groove, and two adjacent light sources are electrically connected based on the driving circuit.

[0010] According to another aspect of the present invention, a method for preparing a light panel is provided, comprising the following steps:

[0011] A base substrate and a reflector cup are prepared; the reflector cup is enclosed to form a plurality of grooves; the base substrate and the reflector cup are both made of glass;

[0012] forming a driving circuit for supplying power to the light source on the base substrate;

[0013] forming a reflective layer on the surface of the reflective cup; and

[0014] A light source is prepared in the groove; and two adjacent light sources are electrically connected based on the driving circuit.

[0015] According to another aspect of the present invention, a backlight module is provided, comprising any one of the above-mentioned light panels.

[0016] According to another aspect of the present invention, a display device is provided, comprising the above-mentioned backlight module.

[0017] The beneficial effects of the present invention compared with the prior art are:

[0018] The light board and its preparation method, backlight module and display device provided by the present invention are based on the processing and molding of a glass substrate to form a reflective cup, which can avoid the problem of using a plastic substrate to process and mold the reflective cup, which makes it difficult to control the accuracy of the light source opening and the difficulty in controlling the curved surface of the reflective cup wall. Reflective cup structures of various shapes can be produced, and the light source light type can be arbitrarily redesigned, thereby reducing the halo phenomenon generated by the display panel and improving the display effect of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The accompanying drawings are incorporated into and constitute a part of this specification, illustrate embodiments consistent with the present invention, and together with the description, serve to explain the principles of the present invention. Obviously, the drawings described below are only some embodiments of the present invention, and it is clear that those skilled in the art can derive other drawings based on these drawings without inventive effort.

[0020] Figure 1 This is a schematic structural diagram of a light board disclosed in one embodiment of the present invention;

[0021] Figure 2 A schematic diagram of a light pattern of a light source on a light board disclosed in one embodiment of the present invention;

[0022] Figure 3 A schematic diagram of a light pattern of a light source on a lamp panel disclosed in another embodiment of the present invention;

[0023] Figure 4 A schematic diagram of the light pattern of a light source on a light board in the prior art;

[0024] Figure 5 This is a schematic diagram of the structure after the pad is assembled on the substrate according to one embodiment of the present invention;

[0025] Figure 6 This is a structural diagram of a light source disclosed in one embodiment of the present invention after assembly;

[0026] Figure 7 A partial cross-sectional view of a light panel disclosed in one embodiment of the present invention;

[0027] Figure 8 A schematic flow chart of a method for preparing a light panel disclosed in another embodiment of the present invention;

[0028] Figure 9 A schematic flow chart of another method for preparing a light panel disclosed in another embodiment of the present invention;

[0029] Figure 10 A schematic flow chart of another method for preparing a light panel disclosed in another embodiment of the present invention;

[0030] Figure 11 The figure is a flow chart of another method for preparing a light panel disclosed in another embodiment of the present invention.

[0031] Reference numerals

[0032] 11. Base substrate; 12. Reflector cup; 13. Groove; 14. Light source; 15. Solder pad; 16. Driving circuit; DETAILED DESCRIPTION

[0033] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention will be further described below with reference to the accompanying drawings and embodiments.

[0034] It should be noted that the following description sets forth specific details to facilitate a full understanding of the present invention. However, the present invention can be implemented in a variety of other ways than those described herein, and those skilled in the art may make similar generalizations without departing from the scope of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0035] The terms used in the embodiments of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The singular forms "a", "an", "the" and "the" used in the embodiments of the present invention and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise.

[0036] It should be noted that the directional terms such as "upper," "lower," "left," and "right" described in the embodiments of the present invention are described from the perspectives shown in the accompanying drawings and should not be construed as limiting the embodiments of the present invention. Furthermore, in the context, it should be understood that when an element is referred to as being formed "on" or "under" another element, it can be formed not only directly "on" or "under" the other element, but also indirectly "on" or "under" the other element through an intermediate element.

[0037] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention will be further described below with reference to the accompanying drawings and embodiments. However, the exemplary embodiments can be implemented in various forms and should not be understood as being limited to the embodiments described herein; on the contrary, these embodiments are provided to make the present invention more comprehensive and complete, and to fully convey the concept of the exemplary embodiments to those skilled in the art. The same figure marks in the figures represent the same or similar structures, and therefore their repeated descriptions will be omitted. The words expressing position and direction described in the present invention are all explained with reference to the accompanying drawings as examples, but they can also be changed as needed, and the changes made are all included in the scope of protection of the present invention. The drawings of the present invention are only used to illustrate the relative position relationship. The layer thickness of certain parts is exaggerated for ease of understanding. The layer thickness in the drawings does not represent the proportional relationship of the actual layer thickness. In addition, the embodiments of the present invention and the features in the embodiments can be combined with each other unless there is a conflict. The drawings of the various embodiments in this application use the same drawing marks.

[0038] like Figure 1 、 Figure 5 and Figure 6 As shown, an embodiment of the present invention discloses a light board. The light board includes a base substrate 11 and a light source 14. The light source 14 is connected to the base substrate 11 based on a solder pad 15. A reflective cup 12 is formed on the base substrate 11, and a reflective layer is formed on the surface of the reflective cup 12. The reflective cup 12 can play a secondary design role in the light pattern of the light source 14, which is conducive to reducing the halo phenomenon generated by the display panel. Figure 1 The reflective cups 12 are arranged on the base substrate 11 in a staggered manner. The four intersecting reflective cups 12 enclose a groove 13, and the light source 14 is arranged in the groove 13.

[0039] The light source 14 can be a light-emitting diode (LED), a mini-LED, or a micro-LED, and the present invention does not limit its specific type. The reflective layer can be formed by spraying, vapor deposition, or printing. The shape of the reflective cup 12 can be set as needed, such as square or rectangular; the present invention does not limit this.

[0040] In this embodiment, both the base substrate 11 and the reflector cup 12 are made of glass. Compared to the prior art, which typically uses plastic (such as PC polycarbonate) to make the base substrate 11, this embodiment of the application can avoid water absorption, thermal expansion, high-temperature aging, and low reflectivity due to material limitations.

[0041] Compared with the prior art of using plastic materials combined with injection molding or vacuum forming to prepare the base substrate 11, the embodiment of the present application can avoid the problems of complex mold design, difficulty in demolding; difficulty in controlling the opening accuracy of the light source 14; and difficulty in controlling the curved surface of the cup wall of the reflector cup 12. It has the advantages of reducing the complexity of mold design and facilitating the control of the opening accuracy of the light source 14 and the curved surface of the cup wall of the reflector cup 12 during the preparation process.

[0042] In some optional embodiments, the reflector cup 12 and the base substrate 11 are formed using an integrated molding process. Compared to the prior art method of assembling the reflector cup 12 and the base substrate 11 together to form a light panel, which results in complex processes and difficulty in attaching the reflector cup 12, this embodiment avoids these problems, offering advantages such as high manufacturing efficiency, low difficulty, and low production cost.

[0043] On the other hand, based on the one-piece molding process, reflective cup structures of various shapes can be produced, and any secondary design of the light type of the light source 14 can be realized based on various shapes, thereby reducing the halo phenomenon generated by the display panel and improving the display effect of the display panel.

[0044] refer to Figure 2 and Figure 3 , which corresponds to two different shapes of reflector cup 12 structures, then the light pattern emitted by the light source 14 of the light board is different. Figure 2 The corresponding reflective cup wall is a curved surface structure. Figure 3 The corresponding wall surface of the reflective cup body is a plane structure. Figure 2 The halo reduction effect in Figure 3 Reduces the halo effect in .

[0045] Compared to Figure 4 The light pattern emitted by the light source 14 of the light board of the prior art is shown. In the embodiment of the present application, the halo generated by the display panel is significantly smaller, which is beneficial to improving the display effect of the display panel.

[0046] In this embodiment, a drive circuit 16 for powering the light sources 14 is formed on the base substrate 11. Two adjacent light sources 14 on the base substrate 11 are electrically connected via the drive circuit 16. In a specific implementation, a channel for the drive circuit 16 to pass through is formed in the base substrate 11 through a process such as etching. This channel is formed on the back side of the base substrate 11. Both ends of the channel connect to the same side of the base substrate 11. The drive circuit can be formed by plating copper within the channel.

[0047] refer to Figure 5 and Figure 6A soldering pad 15 is provided in the groove 13. The soldering pad 15 is electrically connected to the driving circuit in the etched channel, for example, by welding. The soldering pad 15 is also electrically connected to the pin of the light source 14. The soldering pad 15 can be formed based on solder, for example, and the soldering pad 15 is fixedly connected to the base substrate 11. Exemplarily, the soldering pad 15 can be fixedly connected to the base substrate 11 by welding. It should be noted that the material of the driving circuit in this application is not limited to copper.

[0048] Specifically, the driving circuit 16 has a positive and negative pole. The positive line is connected to the pad 15 to form a positive connection terminal, and the negative line is connected to the pad 15 to form a negative connection terminal. The positive pin of the light source 14 is connected to the positive connection terminal, and the negative pin of the light source 14 is welded to the negative connection terminal, thereby achieving an electrical connection between the light source 14 and the driving circuit 16.

[0049] When wiring on the back side of the base substrate 11, all light sources 14 can be connected in parallel or in series as needed within a certain number of light sources. All light sources can be connected on the same layer of glass, and signal lines and data lines of the light board can be wired on other layers. This application does not limit the specific implementation methods.

[0050] It should be noted that Figure 7 The two adjacent light sources shown in the figure are connected based on two lines. The two adjacent light sources can be connected by the positive electrode of one light source to the positive electrode of the other light source, or by the positive electrode of one light source to the negative electrode of the other light source. Those skilled in the art can make the wiring as needed. Figure 7 The two lines shown in the figure do not necessarily mean that they are located in different layers of glass, but can be located in the same layer. This application does not impose any limitation on this.

[0051] Moreover, in the process of connecting the light source with the driving power supply to realize the layout of the driving power supply to the light source, the driving power supply can be set in an external form, that is, independent of the light board and set outside the light board, and does not need to be set inside the glass of the light board, so that the layout is more flexible.

[0052] In an optional embodiment, the light source 14 is provided on the first side of the base substrate 11, and the driving circuit 16 is formed on the second side of the base substrate 11 along the thickness direction of the light board. Figure 7 The drive circuit 16 is located below the curved surface of the reflective cup 12 and below the light source 14. This makes etching the channel easier. However, in other embodiments, the channel for routing the drive circuit 16 can also be etched on the curved surface of the cup wall. This is not a limitation of this application.

[0053] In this embodiment, the light emitting angle of the light source 14 is 140°-180°, and the cross section of the outer wall of the reflector cup 12 parallel to the thickness direction of the light board conforms to the Bezier curve. That is, the curve formed by the intersection of the cross section and the outer wall of the reflector cup 12 conforms to the Bezier curve. Figure 2 , Figure 2 The wall surface of the reflective cup shown in the figure is a Bezier curve structure. In the embodiment of the present application, a light source 14 with a large light-emitting angle is combined with a wall surface of the reflective cup 12 having a Bezier curve, so that the light pattern of the original light source is evenly distributed and the contraction effect is better, thereby improving the light utilization efficiency and further reducing the halo phenomenon generated by the display panel, thereby improving the display effect of the display panel.

[0054] In this embodiment, the reflectivity of the reflective layer is greater than 90%. That is, the reflective layer in the reflective cup 12 located on the front of the light panel is coated with a high-reflectivity coating. This further reduces the halo effect produced by the display panel and enhances the display quality. In this embodiment, the reflective layer is sprayed onto a glass reflective cup, making it easier for the coating to adhere and reducing the risk of yellowing and aging, thereby extending its lifespan.

[0055] It should be noted that the embodiment of the present application does not limit the reflectivity of the above-mentioned reflective layer and the light-emitting angle of the light source 14, and those skilled in the art can set them according to needs.

[0056] In this embodiment, the light source 14 includes a color conversion film and a blue light chip for emitting blue light. The color conversion film is used to convert the blue light emitted by the blue light chip into white light. In a specific implementation, the color conversion film can be placed above the blue light chip. Compared to the existing solution that uses a blue light chip and phosphor to form the light source 14, the embodiment of the present application has the advantages of a wider color gamut and lower cost.

[0057] In this embodiment, the groove 13 is filled with a light-transmitting adhesive for covering the light source 14. This light-transmitting adhesive protects the light source 14 and the solder pad 15, preventing contamination and toxic gases from corroding the solder pad 15, thereby ensuring the display quality of the display panel. In a specific implementation, the light-transmitting adhesive fills the groove completely and is flush with the top of the reflective cup.

[0058] like Figure 8 As shown, another embodiment of the present invention further discloses a method for preparing a light panel. The method is used to prepare the light panel disclosed in any of the above embodiments. The method comprises the following steps:

[0059] S110: Prepare a base substrate and a reflective cup, wherein the reflective cup is surrounded by a plurality of grooves.

[0060] S120 , forming a driving circuit for supplying power to the light source on the base substrate.

[0061] S130, forming a reflective layer on the surface of the reflective cup.

[0062] And S140, preparing a light source in the above groove, and electrically connecting two adjacent light sources based on a driving circuit.

[0063] In step S110, reflective cups can be formed on the base substrate using a mold. The reflective cups are arranged in a staggered pattern on the base substrate. The light source can be a light-emitting diode (LED), a mini-LED, or a micro-LED, and the present invention does not limit the specific type.

[0064] In step S130 , the reflective layer may be formed by spraying, evaporation or printing, and the shape of the reflective cup may be set as needed, such as square or rectangular, etc.; the present invention does not impose any limitation on this.

[0065] In this embodiment, both the base substrate and the reflector cup are made of glass. Compared to the prior art, which typically uses plastic (such as PC polycarbonate) to make the base substrate, this embodiment of the application can avoid water absorption, thermal expansion, high-temperature aging, and low reflectivity due to material limitations.

[0066] Compared with the prior art of using plastic materials combined with injection molding or vacuum forming to prepare a substrate, the embodiment of the present application can avoid problems such as complex mold design, difficulty in demolding, difficulty in controlling the accuracy of the light source opening, and difficulty in controlling the curved surface of the reflective cup wall. It has the advantages of reducing the complexity of mold design and facilitating the control of the light source opening accuracy and the curved surface of the reflective cup wall during the preparation process.

[0067] During the specific implementation of step S140, the light source and the driving circuit can be disposed on opposite sides of the base substrate, for example, the light source is disposed on a first side of the base substrate, and the driving circuit is formed on a second side of the base substrate.

[0068] In this embodiment, the light source has an illuminance angle of 140°-180°, and the outer wall of the reflector cup, measured along a cross-section parallel to the thickness of the light panel, conforms to a Bezier curve. In other words, the curve formed by the intersection of this cross-section and the outer wall of the reflector cup conforms to a Bezier curve. By combining the wide-angle light source with the Bezier-curved reflector cup surface, this embodiment further reduces haloing on the display panel, improving the display quality.

[0069] In this embodiment, the reflectivity of the reflective layer is greater than 90%. In other words, the reflective layer in the reflective cup located on the front of the light panel is coated with a high-reflectivity coating. This further reduces the halo effect produced by the display panel and enhances the display quality. In this embodiment, the reflective layer is sprayed onto a glass reflective cup, making it easier for the coating to adhere and reducing the risk of yellowing and aging, thereby extending its lifespan.

[0070] It should be noted that the embodiments of the present application do not limit the reflectivity of the above-mentioned reflective layer and the light-emitting angle of the light source, and those skilled in the art can set them according to needs.

[0071] In this embodiment, the light source includes a color conversion film and a blue light chip for emitting blue light. The color conversion film is used to convert the blue light emitted by the blue light chip into white light. In a specific implementation, the color conversion film can be placed above the blue light chip. Compared to existing light source solutions that use a combination of a blue light chip and phosphor, this embodiment of the present application offers the advantages of a wider color gamut and lower cost.

[0072] In this embodiment, the groove is filled with a light-transmitting adhesive to cover the light source. This light-transmitting adhesive protects the light source and solder pads, preventing contamination and toxic gases from corroding the solder pads, thereby ensuring the display quality of the display panel. In specific implementations, the light-transmitting adhesive completely fills the groove and is flush with the top of the reflective cup.

[0073] like Figure 9 As shown, another embodiment of the present invention discloses another method for preparing a light panel. Figure 8 On the basis of the corresponding embodiment, step S110 is replaced by step S111: the base substrate and the reflective cup are prepared by adopting an integrated molding process.

[0074] On the one hand, compared with the prior art in which the reflector cup and the base substrate are assembled together to form a lamp board based on an assembly process, which leads to problems such as complicated procedures and difficulty in attaching the reflector cup, this embodiment integrates the reflector cup structure with the base substrate, and there is no need to design the reflector cup separately, thereby avoiding these problems. It has the advantages of high preparation efficiency, low difficulty and low production cost.

[0075] On the other hand, based on the one-piece molding process, reflective cup structures of various shapes can be produced, and the light source light type can be arbitrarily redesigned, thereby reducing the halo phenomenon generated by the display panel and improving the display effect of the display panel.

[0076] like Figure 10 As shown, another embodiment of the present invention discloses another method for preparing a light panel. Figure 8On the basis of the corresponding embodiment, step S120 is replaced by step S121:

[0077] A channel for the driving circuit to pass through is prepared on the base substrate, with both ends of the channel connected to the same side of the base substrate, and the driving circuit is arranged in the channel.

[0078] In this embodiment, the above step S140 includes:

[0079] S141, preparing a pad in the groove; extending a driving circuit out of the base substrate along the channel to be electrically connected to the pad.

[0080] And S142, preparing a light source in the groove based on the solder pad. The solder pad is electrically connected to the pins of the light source.

[0081] In step S121, a channel for the drive circuit to pass through is formed on the base substrate by etching and other processes, and then copper is laid in the channel to form the drive circuit. The channel is formed on the back of the base substrate. The two ends of the above-mentioned channel are connected to the same side of the base substrate. This step also includes: arranging pads in the groove. The pads are electrically connected to the drive circuit and the light source respectively, for example, they can be connected by welding. The effect diagram after the pad arrangement is completed can be referred to Figure 5 The layout diagram of the drive circuit can be referred to Figure 7 .

[0082] In a specific implementation, the pads can be formed, for example, based on solder, and the pads are fixedly connected to the substrate. For example, the pads can be fixedly connected to the substrate by welding. It should be noted that the material of the drive circuit in this application is not limited to copper.

[0083] Specifically, the aforementioned drive circuit has positive and negative poles. The positive line is connected to the pad to form a positive connection terminal, and the negative line is connected to the pad to form a negative connection terminal. The positive pin of the light source is connected to the positive connection terminal, and the negative pin of the light source is welded to the negative connection terminal, thereby achieving electrical connection between the light source and the drive circuit.

[0084] The light source and the channel can be arranged on opposite sides of the base substrate, for example, the light source is arranged on a first side of the base substrate, and the driving circuit and the channel are formed on a second side of the base substrate.

[0085] like Figure 11 As shown, another embodiment of the present invention discloses another method for preparing a light board. In this embodiment, the reflector cup is located on the first side of the substrate. Figure 8 On the basis of the corresponding embodiment, step S120 is replaced by step S122:

[0086] A driving circuit is formed on the second side of the base substrate, where the second side of the base substrate is opposite to the first side.

[0087] It should be noted that all the above embodiments disclosed in this application can be freely combined, and the technical solutions obtained after the combination are also within the protection scope of this application.

[0088] One embodiment of the present invention further provides a backlight module, comprising the light panel described in any of the above embodiments. The detailed structural features and advantages of the light panel can be found in the description of the above embodiments and will not be repeated here. Optionally, the backlight module is a direct-lit backlight module that emits light vertically upward.

[0089] An embodiment of the present invention further provides a display device, which includes the backlight module described in the above embodiment.

[0090] It can be understood that the type of display device can be any one of an organic light-emitting diode (OLED) display device, a QLED (Quantum Dot Light Emitting Diodes) display device or a micro LED (μLED) display device, and the present invention does not specifically limit this.

[0091] The display devices provided by the above embodiments can be any device that displays images, whether in motion (e.g., video) or fixed (e.g., still images), and whether text or images. More specifically, it is contemplated that the embodiments described may be implemented in or associated with a variety of electronic devices. The various electronic devices include, but are not limited to, mobile phones, wireless devices, personal data assistants (PDAs), handheld or portable computers, GPS receivers / navigators, cameras, MP4 video players, video cameras, game consoles, watches, clocks, calculators, television monitors, flat-panel displays, computer monitors, automotive displays (e.g., odometer displays, etc.), navigation systems, cockpit controls and / or displays, displays of camera views (e.g., displays of rearview cameras in vehicles), electronic photographs, electronic billboards or signs, projectors, architectural structures, packaging, and aesthetic structures.

[0092] In summary, the light board and its manufacturing method, backlight module and display device provided by the present invention have at least the following advantages:

[0093] The lamp board and its preparation method, backlight module and display device disclosed in the embodiments of the present invention are based on the processing and molding of a glass substrate to form a reflective cup, which can avoid the problem of using a plastic substrate to process and mold the reflective cup, which makes it difficult to control the accuracy of the light source opening and the difficulty in controlling the curvature of the reflective cup wall. Reflective cup structures of various shapes can be produced, and the light source light type can be arbitrarily redesigned, thereby reducing the halo phenomenon generated by the display panel and improving the display effect of the display panel.

[0094] The above is a further detailed description of the present invention in conjunction with specific preferred embodiments, and the specific implementation of the present invention should not be considered to be limited to these descriptions. For those skilled in the art of the present invention, without departing from the concept of the present invention, several simple deductions or substitutions can be made, which should be considered to fall within the scope of protection of the present invention.

Claims

1. A light board, characterized in that: include: a base substrate on which a reflective cup and a driving circuit for powering the light source are formed; The reflective cup is enclosed to form a plurality of grooves, and a reflective layer is formed on the surface of the reflective cup; the base substrate and the reflective cup are both made of glass; and A light source is arranged in the groove, and two adjacent light sources are electrically connected based on the driving circuit; a soldering pad is provided in the groove, and the base substrate is provided with a channel for the driving circuit to pass through, and the two ends of the channel are connected to the same side of the base substrate; the driving circuit extends from the base substrate along the channel to be electrically connected to the soldering pad; and the soldering pad is electrically connected to the pin of the light source.

2. The light board according to claim 1, characterized in that: The reflective cup and the base substrate are integrally formed.

3. The light board according to claim 1, wherein: The light emitting angle of the light source is 140°-180°, and the cross section of the outer wall of the reflective cup along the thickness direction of the light board conforms to a Bezier curve.

4. The light board according to claim 1, wherein: The light source includes a color conversion film and a blue light chip for emitting blue light. The color conversion film is used to convert the blue light emitted by the blue light chip into white light.

5. The light board according to claim 1, wherein: The reflectivity of the reflective layer is greater than 90%.

6. The light board according to claim 1, wherein: The groove is filled with light-transmitting glue, and the light-transmitting glue covers the light source.

7. A method for preparing a light board, characterized in that: Including steps: A base substrate and a reflector cup are prepared; the reflector cup is enclosed to form a plurality of grooves; the base substrate and the reflector cup are both made of glass; forming a driving circuit for supplying power to the light source on the base substrate; forming a reflective layer on the surface of the reflective cup; and A light source is prepared in the groove; and two adjacent light sources are electrically connected based on the driving circuit.

8. The preparation method according to claim 7, wherein The method of preparing the substrate and the reflective cup includes: The base substrate and the reflective cup are prepared based on an integrated molding process.

9. The preparation method according to claim 7, wherein The light emitting angle of the light source is 140°-180°, and the cross section of the outer wall of the reflective cup along the thickness direction of the light board conforms to a Bezier curve.

10. The preparation method according to claim 7, wherein The light source includes a color conversion film and a blue light chip for emitting blue light. The color conversion film is used to convert the blue light emitted by the blue light chip into white light.

11. The preparation method according to claim 7, wherein The reflectivity of the reflective layer is greater than 90%.

12. The preparation method according to claim 7, wherein The step of preparing a driving circuit on the substrate for powering the light source includes: A channel for the driving circuit to pass through is formed on the base substrate, with both ends of the channel communicating with the same side of the base substrate; The step of preparing a light source in the groove includes: A pad is prepared in the groove; the driving circuit extends out of the base substrate along the channel to be electrically connected to the pad; A light source is prepared in the groove based on the soldering pad; the soldering pad is electrically connected to the pins of the light source.

13. The preparation method according to claim 7, wherein The reflective cup is located on the first side of the base substrate; The driving circuit for powering the light source is formed on the base substrate, comprising: A driving circuit is formed on the second side of the base substrate; the second side of the base substrate is opposite to the first side.

14. The preparation method according to claim 7, wherein The step of forming a reflective layer on the surface of the reflective cup includes: A reflective layer is formed on the surface of the reflective cup by an evaporation process.

15. A backlight module, characterized in that: The invention comprises a light board as claimed in any one of claims 1 to 6.

16. The backlight module according to claim 15, wherein: The backlight module is a direct-type backlight module that emits light vertically upward.

17. A display device, characterized in that: The invention comprises a backlight module as described in any one of claims 15-16.

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