Dfn integrated circuit bonding apparatus

Abstract

The application discloses a DFN integrated circuit bonding device, a pressing plate for extruding contact with a to-be-processed chip above a to-be-processed substrate is installed on a piston rod of a pneumatic cylinder, a strip-shaped groove extending in a horizontal direction is formed in a side surface of a supporting plate, one side of a sliding plate is slidably arranged in the strip-shaped groove, a pneumatic cylinder is installed on a lower surface of the other side of the sliding plate, the lower surface of the horizontally arranged sliding plate is connected with a vertically arranged first mounting plate at both ends, a bidirectional screw rod is rotationally connected between two first mounting plates symmetrically arranged at both sides of the pneumatic cylinder, an L-shaped plate is installed on the opposite surfaces of the two first mounting plates, one end of the L-shaped plate connected with the first mounting plate extends to the lower bending of the sucking disc in the upward direction and is installed with a piston cylinder, and the piston cylinder is connected with a corresponding second mounting plate through an air bag. The application guarantees that the chip is closely attached to the sucking disc, improves the safety of the chip in the transfer process, and improves the reliability of the device as a whole.

Description

TECHNICAL FIELD

[0001] The application relates to the field of semiconductor device processing, and particularly relates to a DFN integrated circuit bonding device. BACKGROUND

[0002] Chip bonding is a key process step in the packaging process of semiconductor devices, and typical bonding technologies include tape automated bonding technology, wire bonding technology and flip-chip bonding technology. The wire bonding technology is divided into hot-press bonding, ultrasonic bonding and thermal ultrasonic bonding. At present, most chip bonding devices adopt a single-chip bonding method, that is, a chip picking mechanism picks up a chip, the chip is moved to a bonding table through a conveying part, and then the chip is bonded.

[0003] However, the existing bonding device has the problem of chip falling during the transfer of the chip, which causes damage to the chip. SUMMARY

[0004] The application aims to provide a DFN integrated circuit bonding device which can effectively avoid the problem of chip falling and causing damage to the chip during the movement of the chip, further ensure the close adhesion of the chip and the suction cup, improve the safety of the chip during the transfer process, and improve the reliability of the device as a whole.

[0005] To achieve the above-mentioned purpose, the technical scheme adopted by the application is as follows: a DFN integrated circuit bonding device comprises a workbench, a top plate located directly above the workbench, and a support plate vertically connected between the workbench and the top plate, an installation seat for placing a substrate to be processed is installed on the workbench, a storage plate for placing a chip to be processed is arranged outside the installation seat, an electric cylinder is slidingly installed on the side surface of the support plate, a suction cup for picking up a chip to be processed is installed on the output end of the electric cylinder and can move from above the storage plate to above the installation seat, a pneumatic cylinder is installed on the top plate and located directly above the installation seat, and a pressing plate for pressing and contacting a chip to be processed above the substrate to be processed is installed on the piston rod of the pneumatic cylinder.

[0006] A horizontally extending groove is formed on the side surface of the support plate. One side of a sliding plate is slidably disposed in the groove. The electric cylinder is mounted on the lower surface of the other side of the sliding plate. A vertically arranged first mounting plate is connected to each end of the lower surface of the horizontally arranged sliding plate. A bidirectional screw is rotatably connected between the two first mounting plates symmetrically arranged on both sides of the electric cylinder. One end of the bidirectional screw passes through a first mounting plate and is connected to the output shaft of a motor mounted on the first mounting plate. A second mounting plate is fitted on the bidirectional screw and on each side of the electric cylinder. A baffle is installed at the bottom of the second mounting plate. An L-shaped plate is installed on the opposite surfaces of the two first mounting plates. The other end of the L-shaped plate, which is connected to the first mounting plate at one end, extends to the top of the suction cup, bends downward, and is fitted with a piston cylinder. An air bladder is connected between the piston cylinder and the corresponding second mounting plate. One end of the air bladder is fixed to the second mounting plate, and the other end communicates with the cavity inside the piston cylinder. A third mounting plate for cooperating with the top surface of the suction cup is installed at the lower end of the extension rod of the piston cylinder.

[0007] The following are further improvements to the above technical solution:

[0008] 1. In the above scheme, the mounting base further includes: a carrier plate mounted on a workbench via a support shell, a gear located below the carrier plate inside the support shell, and a rack meshing with the gear. The other end of the rack, which meshes with the gear at one end, extends outward from inside the support shell and slides in cooperation with the side wall of the support shell. The gear is rotatably mounted on the workbench via a vertically arranged rotating shaft. At least two arc-shaped through slots are equally spaced along the circumferential direction on the upper surface of the gear. A rectangular through slot corresponding to the arc-shaped through slot and extending in the radial direction is provided on the carrier plate. The lower end of a vertically arranged straight rod is embedded in the arc-shaped through slot and slides in cooperation with the inner wall of the arc-shaped through slot. The upper end of the straight rod passes through the corresponding rectangular through slot and is fitted with a locking block. At least two locking blocks that slide in cooperation with the upper surface of the carrier plate form a clamping area for placing the substrate to be processed.

[0009] 2. In the above scheme, a groove is provided in the center of the upper surface of the carrier plate, and a heat insulation layer is installed on the inner wall of the groove containing the heating wire. A heat-conducting plate is installed at the opening of the groove.

[0010] 3. In the above scheme, the number of the arc-shaped through groove, the rectangular through groove, the straight rod and the locking block are all 4.

[0011] 4. In the above scheme, at least one limiting block is fitted on the straight rod, which slides in cooperation with the lower surface of the carrier plate or gear.

[0012] 5. In the above scheme, the carrier plate is a circular plate.

[0013] 6. In the above scheme, the piston rod of the cylinder is connected to the pressure plate by a push rod, the upper end of the push rod is mounted on the piston rod of the cylinder, and the lower end of the push rod is connected to the upper surface of the pressure plate.

[0014] 7. In the above scheme, each L-shaped plate is connected to a guide rod between itself and the corresponding first mounting plate, and the upper end of the second mounting plate is slidably engaged with the corresponding guide rod.

[0015] 8. In the above scheme, the telescopic rod of the piston cylinder is connected to the third mounting plate by a connecting rod.

[0016] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art:

[0017] The present invention relates to a DFN integrated circuit bonding device, wherein a horizontally extending strip groove is formed on the side surface of a support plate, a sliding plate is slidably disposed on one side within the strip groove, and an electric cylinder is mounted on the lower surface of the other side of the sliding plate. A vertically arranged first mounting plate is connected to each end of the lower surface of the horizontally arranged sliding plate. A bidirectional screw is rotatably connected between two first mounting plates symmetrically arranged on both sides of the electric cylinder. One end of the bidirectional screw passes through one of the first mounting plates and is connected to the output shaft of a motor mounted on the first mounting plate. A second mounting plate is fitted onto the bidirectional screw on each side of the electric cylinder. A baffle is mounted on the bottom of the second mounting plate. An L-shaped plate is mounted on each of the opposing surfaces of the two first mounting plates, one end of which... The other end of the L-shaped plate connected to the first mounting plate extends downward above the suction cup and is fitted with a piston cylinder. An air bladder is connected between the piston cylinder and the corresponding second mounting plate. One end of the air bladder is fixed to the second mounting plate, and the other end communicates with the cavity inside the piston cylinder. A third mounting plate is installed at the lower end of the piston cylinder's telescopic rod to cooperate with the top surface of the suction cup. In addition to adsorbing and transferring the chip to be processed, the baffle can be moved to the underside of the chip to effectively prevent the chip from falling and being damaged during the movement. Furthermore, the cooperation between the baffle and the third mounting plate further ensures that the chip is tightly attached to the suction cup, improving the safety of the chip during the transfer process and enhancing the overall reliability of the device. Attached Figure Description

[0018] Appendix Figure 1 This is a cross-sectional view of the overall structure of the DFN integrated circuit bonding device of the present invention;

[0019] Appendix Figure 2 This is a partial three-dimensional view of the DFN integrated circuit bonding device of the present invention;

[0020] Appendix Figure 3 For the present invention Figure 1 Enlarged view of point A;

[0021] Appendix Figure 4For the present invention Figure 1 Enlarged view of point B.

[0022] In the attached diagrams: 1. Workbench; 2. Top plate; 3. Support plate; 4. Mounting base; 5. Storage plate; 6. Electric cylinder; 7. Suction cup; 8. Pneumatic cylinder; 9. Pressure plate; 10. Strip groove; 11. Sliding plate; 12. First mounting plate; 13. Bidirectional screw; 14. Motor; 15. Second mounting plate; 16. Baffle; 17. L-shaped plate; 18. Piston cylinder; 19. Airbag; 20. Third mounting plate; 21. Support shell; 22. Carrier plate; 23. Gear; 24. Rack; 25. Rotating shaft; 26. Arc-shaped through groove; 27. Rectangular through groove; 28. Straight rod; 29. ​​Locking block; 30. Push rod; 31. Limiting block; 32. Guide rod; 33. Connecting rod; 34. Heating wire; 35. Heat insulation layer; 36. Heat conducting plate. Detailed Implementation

[0023] In the description of this patent, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used solely for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. The terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Furthermore, unless otherwise explicitly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this patent based on the specific circumstances.

[0024] Example 1: A DFN integrated circuit bonding device includes: a worktable 1, a top plate 2 located directly above the worktable 1, and a support plate 3 vertically connected between the worktable 1 and the top plate 2. A mounting base 4 for placing a substrate to be processed is installed on the worktable 1. A placement plate 5 for placing a chip to be processed is provided on the outer side of the mounting base 4. An electric cylinder 6 is slidably installed on the side surface of the support plate 3. A suction cup 7 for picking up the chip to be processed is installed on the output end of the electric cylinder 6 and can move with the electric cylinder 6 from above the placement plate 5 to above the mounting base 4. A cylinder 8 is installed on the top plate 2 and directly above the mounting base 4. A pressure plate 9 for pressing and contacting the chip to be processed above the substrate is installed on the piston rod of the cylinder 8. The substrate is placed on the mounting base, and the chip is placed on the placement plate. The electric cylinder drives the suction cup to move downward, adsorbing the chip onto the suction cup. Moving the suction cup moves the chip above the substrate. The cylinder pushes the pressure plate to achieve bonding between the substrate and the semiconductor chip.

[0025] A horizontally extending slot 10 is formed on the side surface of the support plate 3. One side of a sliding plate 11 is slidably disposed in the slot 10. The electric cylinder 6 is mounted on the lower surface of the other side of the sliding plate 11. A vertically arranged first mounting plate 12 is connected to each end of the lower surface of the horizontally arranged sliding plate 11. A bidirectional screw 13 is rotatably connected between the two first mounting plates 12 symmetrically arranged on both sides of the electric cylinder 6. One end of the bidirectional screw 13 passes through a first mounting plate 12 and is connected to the output shaft of a motor 14 mounted on the first mounting plate 12. A second mounting plate 15 is fitted on the bidirectional screw 13 and on each side of the electric cylinder 6. A baffle 16 is installed at the bottom of the second mounting plate 15. An L-shaped plate 17 is mounted on each of the two opposing surfaces of the first mounting plates 12. The other end of the L-shaped plate 17, which is connected to the first mounting plate 12 at one end, extends to the suction point. A piston cylinder 18 is bent downwards and installed on the top of the disk 7. An air bladder 19 is connected between the piston cylinder 18 and the corresponding second mounting plate 15. One end of the air bladder 19 is fixed to the second mounting plate 15, and the other end is connected to the cavity inside the piston cylinder 18. A third mounting plate 20 for cooperating with the top surface of the suction cup 7 is installed at the lower end of the telescopic rod of the piston cylinder 18. When the two second mounting plates move towards each other, the second mounting plates will squeeze the air bladder, allowing the gas inside the air bladder to enter the cavity of the piston cylinder. This will cause the piston rod to drive the connecting rod to move downwards, so that the third mounting plate presses on the top of the suction cup, preventing the suction cup from becoming loose. When the suction cup adsorbs the semiconductor chip, the motor is started, causing the motor to drive the bidirectional screw to rotate, which will cause the two second mounting plates to move towards each other, so that the two baffles are located at the bottom of the semiconductor chip, preventing the semiconductor chip from falling onto the worktable during movement.

[0026] The aforementioned mounting base 4 further includes: a carrier plate 22 mounted on the workbench 1 via a support shell 21, a gear 23 located below the carrier plate 22 inside the support shell 21, and a rack 24 meshing with the gear 23. The other end of the rack 24, which meshes with the gear 23 at one end, extends outward from inside the support shell 21 and slides against the side wall of the support shell 21. The gear 23 is rotatably mounted on the workbench 1 via a vertically arranged rotating shaft 25. At least two arc-shaped through slots 26 are equally spaced along the circumferential direction on the upper surface of the gear 23. A rectangular through slot 27, corresponding to the arc-shaped through slots 26 and extending radially, is provided on the carrier plate 22. The lower end of a vertically arranged straight rod 28 is embedded in the arc-shaped through slot 27. The straight rod 28 slides within the inner wall of the arc-shaped through groove 26. The upper end of the straight rod 28 passes through the corresponding rectangular through groove 27 and is fitted with a locking block 29. At least two locking blocks 29 that slide with the upper surface of the carrier plate 22 form a clamping area for the substrate to be processed. The substrate is placed on the upper surface of the carrier plate, and the rack is pushed, causing the rack to drive the gear to rotate. This causes the straight rod in the arc-shaped through groove of the gear to slide along the arc-shaped through groove, and the straight rod will also slide along the rectangular through groove. This causes the four locking blocks to move toward the position closer to the center of the carrier plate, thereby clamping the substrate. This avoids the substrate from moving during the bonding process, which would lead to inaccurate bonding position. The structure is simple, easy to operate, and can adapt to the fixing of substrates of different sizes.

[0027] A groove is provided in the center of the upper surface of the carrier plate 22. A heat insulation layer 35 is installed on the inner wall of the groove, which contains a heating wire 34. A heat-conducting plate 36 is installed at the opening of the groove. This can achieve uniform and rapid heating of the substrate to reach the temperature at which bonding can occur. The heat insulation layer can prevent heat loss.

[0028] The number of the aforementioned arc-shaped through slot 26, rectangular through slot 27, straight rod 28, and locking block 29 are all 4.

[0029] At least one limiting block 31 is fitted onto the straight rod 28, which slides in cooperation with the lower surface of the carrier plate 22 or the gear 23.

[0030] The aforementioned carrier plate 22 is a circular plate.

[0031] The telescopic rod of the piston cylinder 18 is connected to the third mounting plate 20 via a connecting rod 33.

[0032] Example 2: A DFN integrated circuit bonding device includes: a worktable 1, a top plate 2 located directly above the worktable 1, and a support plate 3 vertically connected between the worktable 1 and the top plate 2. A mounting base 4 for placing a substrate to be processed is installed on the worktable 1. A placement plate 5 for placing a chip to be processed is provided on the outer side of the mounting base 4. An electric cylinder 6 is slidably installed on the side surface of the support plate 3. A suction cup 7 for picking up the chip to be processed is installed on the output end of the electric cylinder 6 and can move with the electric cylinder 6 from above the placement plate 5 to above the mounting base 4. A cylinder 8 is installed on the top plate 2 and directly above the mounting base 4. A pressure plate 9 for pressing and contacting the chip to be processed above the substrate is installed on the piston rod of the cylinder 8. The substrate is placed on the mounting base, and the chip is placed on the placement plate. The electric cylinder drives the suction cup to move downward, adsorbing the chip onto the suction cup. Moving the suction cup moves the chip above the substrate. The cylinder pushes the pressure plate to achieve bonding between the substrate and the semiconductor chip.

[0033] A horizontally extending slot 10 is formed on the side surface of the support plate 3. One side of a sliding plate 11 is slidably disposed in the slot 10. The electric cylinder 6 is mounted on the lower surface of the other side of the sliding plate 11. A vertically arranged first mounting plate 12 is connected to each end of the lower surface of the horizontally arranged sliding plate 11. A bidirectional screw 13 is rotatably connected between the two first mounting plates 12 symmetrically arranged on both sides of the electric cylinder 6. One end of the bidirectional screw 13 passes through a first mounting plate 12 and is connected to the output shaft of a motor 14 mounted on the first mounting plate 12. A second mounting plate 15 is fitted on the bidirectional screw 13 and on each side of the electric cylinder 6. A baffle 16 is installed at the bottom of the second mounting plate 15. An L-shaped plate 17 is mounted on each of the two opposing surfaces of the first mounting plates 12. The other end of the L-shaped plate 17, which is connected to the first mounting plate 12 at one end, extends to the suction point. A piston cylinder 18 is bent downwards and installed on the top of the disk 7. An air bladder 19 is connected between the piston cylinder 18 and the corresponding second mounting plate 15. One end of the air bladder 19 is fixed to the second mounting plate 15, and the other end is connected to the cavity inside the piston cylinder 18. A third mounting plate 20 for cooperating with the top surface of the suction cup 7 is installed at the lower end of the telescopic rod of the piston cylinder 18. When the two second mounting plates move towards each other, the second mounting plates will squeeze the air bladder, allowing the gas inside the air bladder to enter the cavity of the piston cylinder. This will cause the piston rod to drive the connecting rod to move downwards, so that the third mounting plate presses on the top of the suction cup, preventing the suction cup from becoming loose. When the suction cup adsorbs the semiconductor chip, the motor is started, causing the motor to drive the bidirectional screw to rotate, which will cause the two second mounting plates to move towards each other, so that the two baffles are located at the bottom of the semiconductor chip, preventing the semiconductor chip from falling onto the worktable during movement.

[0034] The aforementioned mounting base 4 further includes: a carrier plate 22 mounted on the workbench 1 via a support shell 21, a gear 23 located below the carrier plate 22 inside the support shell 21, and a rack 24 meshing with the gear 23. The other end of the rack 24, which meshes with the gear 23 at one end, extends outward from inside the support shell 21 and slides against the side wall of the support shell 21. The gear 23 is rotatably mounted on the workbench 1 via a vertically arranged rotating shaft 25. At least two arc-shaped through slots 26 are equally spaced along the circumferential direction on the upper surface of the gear 23. A rectangular through slot 27, corresponding to the arc-shaped through slots 26 and extending radially, is provided on the carrier plate 22. The lower end of a vertically arranged straight rod 28 is embedded in the arc-shaped through slot 27. The straight rod 28 slides within the inner wall of the arc-shaped through groove 26. The upper end of the straight rod 28 passes through the corresponding rectangular through groove 27 and is fitted with a locking block 29. At least two locking blocks 29 that slide with the upper surface of the carrier plate 22 form a clamping area for the substrate to be processed. The substrate is placed on the upper surface of the carrier plate, and the rack is pushed, causing the rack to drive the gear to rotate. This causes the straight rod in the arc-shaped through groove of the gear to slide along the arc-shaped through groove, and the straight rod will also slide along the rectangular through groove. This causes the four locking blocks to move toward the position closer to the center of the carrier plate, thereby clamping the substrate. This avoids the substrate from moving during the bonding process, which would lead to inaccurate bonding position. The structure is simple, easy to operate, and can adapt to the fixing of substrates of different sizes.

[0035] A groove is provided in the center of the upper surface of the carrier plate 22. A heat insulation layer 35 is installed on the inner wall of the groove, which contains a heating wire 34. A heat-conducting plate 36 is installed at the opening of the groove. This can achieve uniform and rapid heating of the substrate to reach the temperature at which bonding can occur. The heat insulation layer can prevent heat loss.

[0036] The number of the aforementioned arc-shaped through slot 26, rectangular through slot 27, straight rod 28, and locking block 29 are all 4.

[0037] At least one limiting block 31 is fitted onto the straight rod 28, which slides in cooperation with the lower surface of the carrier plate 22 or the gear 23.

[0038] The piston rod of the cylinder 8 is connected to the pressure plate 9 by a push rod 30. The upper end of the push rod 30 is mounted on the piston rod of the cylinder 8, and the lower end of the push rod 30 is connected to the upper surface of the pressure plate 9.

[0039] Each of the aforementioned L-shaped plates 17 is connected to a corresponding first mounting plate 12 by a guide rod 32, and the upper end of the aforementioned second mounting plate 15 is slidably engaged with the corresponding guide rod 32.

[0040] Working principle: The substrate is placed on top of the carrier plate. Pushing the rack causes it to rotate, which in turn causes the straight rod in the arc-shaped groove of the gear to slide along the arc-shaped groove. This straight rod then slides along the rectangular groove, causing the four locking blocks to move towards the center of the carrier plate, thus securing the substrate and preventing movement during bonding, which could lead to inaccurate bonding positions. The heating wire and heat-conducting plate facilitate heating of the substrate, ensuring it reaches the bonding temperature. The heat insulation layer prevents heat transfer to other parts of the carrier plate. The semiconductor chip is placed on top of the mounting plate. Moving the sliding plate positions the suction cup at the top of the mounting plate, and activating the electric cylinder, which moves the first connecting rod and the suction cup downwards, adsorbing the chip onto the suction cup. Moving the sliding plate again moves the semiconductor chip... The device moves to the top of the carrier board and places the semiconductor chip on top of the substrate. Once the chuck holds the semiconductor chip, the motor is activated, causing the bidirectional screw to rotate. This causes the two second mounting plates to move towards each other, positioning the two baffles at the bottom of the semiconductor chip to prevent it from falling onto the worktable during movement. The opposing movement of the two second mounting plates compresses the air bladder, allowing gas to enter the rodless chamber of the piston cylinder. This causes the piston rod to move the connecting rod downwards, pressing the third mounting plate against the top of the chuck to prevent it from loosening. When the substrate reaches the appropriate temperature and the semiconductor chip is on top, the cylinder is activated, causing the push rod to move downwards. This causes the pressure plate to press the semiconductor chip, bonding it to the substrate.

[0041] When using the above-mentioned DFN integrated circuit bonding device, a horizontally extending strip groove is opened on the side surface of the support plate. One side of a sliding plate is slidably disposed in the strip groove, and an electric cylinder is installed on the lower surface of the other side of the sliding plate. A vertically disposed first mounting plate is connected to each end of the lower surface of the horizontally disposed sliding plate. A bidirectional screw is rotatably connected between the two first mounting plates symmetrically disposed on both sides of the electric cylinder. One end of the bidirectional screw passes through a first mounting plate and is connected to the output shaft of a motor mounted on the first mounting plate. A second mounting plate is fitted on the bidirectional screw and on both sides of the electric cylinder. A baffle is installed at the bottom of the second mounting plate. During the chip transfer process, the chip can be moved to the bottom of the chip through the baffle at the bottom of the second mounting plate, effectively preventing the chip from falling onto the worktable and causing chip damage, thereby ensuring the safety of the chip during the pick-up and transfer process.

[0042] Furthermore, an L-shaped plate is mounted on each of the two opposing surfaces of the first mounting plates. The other end of the L-shaped plate, which is connected to the first mounting plate at one end, extends above the suction cup, bends downward, and is fitted with a piston cylinder. An airbag is connected between the piston cylinder and the corresponding second mounting plate. One end of the airbag is fixed to the second mounting plate, and the other end communicates with the cavity inside the piston cylinder. A third mounting plate is mounted on the lower end of the piston cylinder's telescopic rod for engaging with the top surface of the suction cup. The telescopic rod of the piston cylinder and the third mounting plate are connected by a connecting rod. Through the interaction between the third mounting plate and the baffle, the suction cup and the chip are further ensured to fit tightly together, preventing the chip from falling off the suction cup. During the process of placing the chip on the mounting base, the baffle moves away from below the chip, causing the chip to fall. This further improves the safety of the chip during the moving and placement process and also improves the overall reliability of the device.

[0043] Furthermore, the mounting base further includes: a carrier plate mounted on the workbench via a support shell, a gear located below the carrier plate inside the support shell, and a rack meshing with the gear. One end of the rack meshes with the gear, while the other end extends outward from inside the support shell and slides against the side wall of the support shell. The gear is rotatably mounted on the workbench via a vertically positioned shaft. At least two equally spaced arc-shaped through slots are provided on the upper surface of the gear. A rectangular through slot corresponding to the arc-shaped through slots and extending radially is provided on the carrier plate. A vertically positioned... The lower end of the rod is embedded in the arc-shaped through groove and slides against the inner wall of the arc-shaped through groove. The upper end of the straight rod passes through the corresponding rectangular through groove and is fitted with a locking block. At least two locking blocks that slide against the upper surface of the carrier plate form a clamping area for the substrate to be processed. Through the interaction of the rack, straight rod, gear and arc-shaped rod on the gear, the locking block can be conveniently and quickly fixed to the substrate, effectively avoiding the situation where the substrate moves during the bonding process and the bonding position is inaccurate. It can also fix substrates of different sizes, improving the applicability of the device.

[0044] The above embodiments are only for illustrating the technical concept and features of the present invention, and are intended to enable those skilled in the art to understand the content of the present invention and implement it accordingly. They should not be construed as limiting the scope of protection of the present invention. All equivalent changes or modifications made in accordance with the spirit and essence of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A DFN integrated circuit bonding apparatus, comprising: The workbench (1), the top plate (2) located directly above the workbench (1), and the support plate (3) vertically connected between the workbench (1) and the top plate (2) are characterized in that: a mounting base (4) for placing a substrate to be processed is installed on the workbench (1), a placement plate (5) for placing a chip to be processed is provided on the outside of the mounting base (4), an electric cylinder (6) is slidably installed on the side surface of the support plate (3), a suction cup (7) for picking up the chip to be processed is installed on the output end of the electric cylinder (6) and can move from above the placement plate (5) to above the mounting base (4) with the electric cylinder (6), a cylinder (8) is installed on the top plate (2) and directly above the mounting base (4), and a pressure plate (9) for squeezing and contacting the chip to be processed above the substrate is installed on the piston rod of the cylinder (8); A horizontally extending slot (10) is formed on the side surface of the support plate (3). One side of a sliding plate (11) is slidably disposed in the slot (10). The electric cylinder (6) is mounted on the lower surface of the other side of the sliding plate (11). A vertically arranged first mounting plate (12) is connected to each end of the lower surface of the horizontally arranged sliding plate (11). A bidirectional screw (13) is rotatably connected between the two first mounting plates (12) symmetrically arranged on both sides of the electric cylinder (6). One end of the bidirectional screw (13) passes through a first mounting plate (12) and is connected to the output shaft of a motor (14) mounted on the first mounting plate (12). The bidirectional screw (13) is located on and on the electric cylinder (6). A second mounting plate (15) is fitted on each side. A baffle (16) is installed at the bottom of the second mounting plate (15). An L-shaped plate (17) is installed on each of the two first mounting plates (12) facing each other. The other end of the L-shaped plate (17) connected to the first mounting plate (12) extends to the top of the suction cup (7), bends downward, and is fitted with a piston cylinder (18). An airbag (19) is connected between the piston cylinder (18) and the corresponding second mounting plate (15). One end of the airbag (19) is fixed on the second mounting plate (15), and the other end is connected to the cavity inside the piston cylinder (18). A third mounting plate (20) for cooperating with the top surface of the suction cup (7) is installed at the lower end of the telescopic rod of the piston cylinder (18).

2. The DFN integrated circuit bonding apparatus according to claim 1, characterized in that: The mounting base (4) further includes: a carrier plate (22) mounted on the workbench (1) via a support shell (21), a gear (23) located below the carrier plate (22) inside the support shell (21), and a rack (24) meshing with the gear (23). The other end of the rack (24), which meshes with the gear (23) at one end, extends outward from inside the support shell (21) and slides in cooperation with the side wall of the support shell (21). The gear (23) is rotatably mounted on the workbench (1) via a vertically arranged rotating shaft (25). The upper surface of the gear (23) has a... At least two arc-shaped through slots (26) are equally spaced along the circumference. The carrier plate (22) has a rectangular through slot (27) that corresponds to the arc-shaped through slots (26) and extends radially. The lower end of a vertically arranged straight rod (28) is embedded in the arc-shaped through slot (26) and slides in cooperation with the inner wall of the arc-shaped through slot (26). The upper end of the straight rod (28) passes through the corresponding rectangular through slot (27) and is fitted with a locking block (29). A clamping area for the substrate to be processed is formed between at least two locking blocks (29) that slide in cooperation with the upper surface of the carrier plate (22).

3. The DFN integrated circuit bonding apparatus according to claim 2, characterized in that: A groove is provided in the center of the upper surface of the carrier plate (22), and a heat insulation layer (35) is installed on the inner wall of the groove containing the heating wire (34). A heat-conducting plate (36) is installed at the opening of the groove.

4. The DFN integrated circuit bonding apparatus according to claim 2, characterized in that: The number of each of the arc-shaped through slot (26), rectangular through slot (27), straight rod (28) and locking block (29) is 4.

5. The DFN integrated circuit bonding apparatus according to claim 2, characterized in that: At least one limiting block (31) is fitted on the straight rod (28) and slides with the lower surface of the carrier plate (22) or gear (23).

6. The DFN integrated circuit bonding apparatus according to claim 2, characterized in that: The carrier plate (22) is a circular plate.

7. The DFN integrated circuit bonding apparatus according to claim 1, characterized in that: The piston rod of the cylinder (8) is connected to the pressure plate (9) by a push rod (30). The upper end of the push rod (30) is mounted on the piston rod of the cylinder (8), and the lower end of the push rod (30) is connected to the upper surface of the pressure plate (9).

8. The DFN integrated circuit bonding apparatus according to claim 1, characterized in that: Each L-shaped plate (17) is connected to a guide rod (32) of the corresponding first mounting plate (12), and the upper end of the second mounting plate (15) is slidably engaged with the corresponding guide rod (32).

9. The DFN integrated circuit bonding apparatus according to claim 1, characterized in that: The telescopic rod of the piston cylinder (18) is connected to the third mounting plate (20) by a connecting rod (33).

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