Suction nozzle, patch device and method

Abstract

The present invention discloses a suction nozzle, a patch device, and a method. The suction nozzle comprises a body, the body comprising a suction end face and a mounting end face connected by a suction chamber; a suction hole connected to the suction chamber is provided in the middle of the suction end face; a vacuum hole is provided on the mounting end face, the suction hole being the lower opening of the suction chamber, the vacuum hole being the upper opening of the suction chamber; and a through hole connected to the suction chamber is further provided on the mounting end face. The suction nozzle can ensure the quality of material placement.

Description

Technical Field

[0001] The present invention relates to the technical field of mounting equipment, in particular to a suction nozzle, and also to a mounting device and method. Background Art

[0002] The placement machine is also called the placement machine or surface mount system. In the production line, the placement machine is used to accurately place one object on another object. The placement machine is the main equipment in the production line. Its principle is to take the component from the material picking position through the suction nozzle installed on the placement head, adjust the position and direction of the component, and then place the component on the placement position.

[0003] For automated placement equipment, if the nozzle assembly is uneven, the material will be tilted during placement. Existing technology relies primarily on visual inspection to determine nozzle flatness, which is inaccurate. Furthermore, any changes in nozzle flatness during production can affect material placement accuracy. Summary of the Invention

[0004] On the one hand, an embodiment of the present invention provides a suction nozzle that can ensure the quality of material placement.

[0005] Another aspect of the present invention is to provide a patch device and method, which can automatically detect the flatness of a suction nozzle during the material placement process, thereby ensuring the quality of material placement.

[0006] On the one hand, an embodiment of the present invention provides a suction nozzle, which includes: a main body, which includes an adsorption end face and an installation end face connected by an adsorption chamber; an adsorption hole connected to the adsorption chamber is provided in the middle position of the adsorption end face, and a vacuum hole is provided on the installation end face, the adsorption hole is the lower opening of the adsorption chamber, and the vacuum hole is the upper opening of the adsorption chamber, and a through hole connected to the adsorption chamber is also provided on the installation end face.

[0007] Optionally, there are multiple through holes, and they are arranged around the periphery of the vacuum hole.

[0008] Optionally, the plurality of through holes are symmetrically distributed.

[0009] Optionally, the adsorption end surface is circular or square.

[0010] Optionally, a limiting structure is provided on the installed end surface.

[0011] Optionally, the limiting structure is a flange or a limiting column arranged on the edge of the mounting end surface.

[0012] Optionally, there are multiple flanges or limiting columns, and they are evenly distributed.

[0013] Optionally, the upper opening of the adsorption chamber is larger than the lower opening.

[0014] Optionally, guide structures are further provided on both sides of the mounting end surface.

[0015] On the other hand, an embodiment of the present invention further provides a patch device, which includes: a placement head, an air pump, and a suction nozzle as described above; the suction nozzle is installed under the placement head, and the air pump is connected to the vacuum hole through an air pipe.

[0016] Optionally, the device further comprises a pressure gauge for monitoring the pressure value of the adsorption chamber.

[0017] Optionally, the placement head is driven by a motor.

[0018] On the other hand, an embodiment of the present invention further provides a patch method, the method comprising:

[0019] Driving the placement head to position the suction nozzle to a position aligned with the patch, the suction nozzle being the suction nozzle described above;

[0020] Drive the placement head to move the nozzle downward, and extract air through the air pump to make the patch adsorb on the adsorption end surface of the nozzle;

[0021] Drive the placement head to position the nozzle to align with the chip;

[0022] The placement head is driven to move the suction nozzle downward, and air is transported into the adsorption cavity through the air pump, air pipe and vacuum hole to pre-solidify the patch and the chip.

[0023] Optionally, the method further includes:

[0024] During the process of extracting air through the air pump, monitor the pressure value of the adsorption chamber when the air is extracted to the set vacuum state;

[0025] If the pressure value is greater than the set value, the nozzle assembly flatness is adjusted.

[0026] The suction nozzle provided by the embodiment of the present invention has an adsorption chamber provided on the main body, and the adsorption chamber connects the adsorption end face and the mounting end face, an adsorption hole is provided in the middle position of the adsorption end face as the lower opening of the adsorption chamber, a vacuum hole connected to the upper opening of the adsorption chamber is provided on the mounting end face, and a through hole connected to the adsorption chamber is provided on the periphery of the vacuum hole. When mounting materials, since these through holes are connected to the adsorption chamber, if the suction nozzle is tilted, the pressure of the air in the adsorption chamber cannot reach the set pressure value. If the suction nozzle is severely tilted, it may even be impossible to adsorb the patch to the adsorption end face of the suction nozzle, thereby prompting the operator to check the relevant parts of the equipment and adjust the suction nozzle to keep its adsorption surface flat. Furthermore, the equipment can also automatically determine the assembly flatness of the suction nozzle based on the pressure value, thereby improving the mounting quality and efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 2 is a schematic diagram of the three-dimensional structure of a nozzle provided in an embodiment of the present invention;

[0028] Figure 2 yes Figure 1 Schematic diagram of the installation structure of the suction nozzle and the placement head;

[0029] Figure 3 yes Figure 1 The diagram shows the nozzle being installed tilted.

[0030] Figure 4 1 is a schematic structural diagram of a patch device provided by an embodiment of the present invention;

[0031] Figure 5 This is a flow chart of a patch method provided by an embodiment of the present invention;

[0032] Figure 6 This is another flow chart of the patch method provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0033] In order to make the above-mentioned objects, features and beneficial effects of the present invention more obvious and easy to understand, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0034] The suction nozzle of the SMT placement machine uses the principle of vacuum suction, that is, it uses the force formed by the pressure difference between the vacuum system and the atmosphere to grasp and move the material, and then places the component adsorbed on the suction nozzle on the coordinate axis of the circuit board by blowing air. The ideal state is that after the suction nozzle is installed, the component is in the center of the suction nozzle and the adsorption surface remains flat to ensure that the material is placed flat. However, sometimes due to problems with the installation operation or problems such as the nozzle becoming loose during long-term use, the flatness of the suction nozzle may change, thereby affecting the accuracy of material placement. To this end, an embodiment of the present invention provides a suction nozzle that can better ensure the quality of material placement.

[0035] Please refer to Figure 1 and Figure 2 ,in, Figure 1 : is a schematic diagram of the three-dimensional structure of the suction nozzle provided in an embodiment of the present invention, Figure 2 It is a schematic diagram of the installation structure of the suction nozzle and the placement head provided in an embodiment of the present invention.

[0036] like Figure 2 As shown, when in use, the suction nozzle 10 needs to be installed on the mounting head 51. The mounting head 51 is used to fix the suction nozzle 10. The suction nozzle 10 is used to absorb the material 70. The material 70 can be, for example, a component, a chip, etc.

[0037] The suction nozzle 10 of this embodiment comprises a main body, which includes a suction end face 12 and a mounting end face, both connected by a suction chamber 11. A suction hole 21 is provided in the center of the suction end face 12, communicating with the suction chamber 11. A vacuum hole 23 is provided on the mounting end face. The suction hole 21 is the lower opening of the suction chamber 11, while the vacuum hole 23 is the upper opening of the suction chamber 11. Furthermore, a through hole 22 is provided on the mounting end face, communicating with the suction chamber 11.

[0038] In a non-limiting embodiment, a plurality of through holes 22 may be provided and arranged around the periphery of the vacuum hole 23. The plurality of through holes 22 may be symmetrically distributed.

[0039] It should be noted that, in a specific application, the number and distribution of the through holes 22 can be determined according to the shape and size of the mounting end surface. For example, the mounting end surface can be circular or square or other shapes. If a circular mounting surface is used, such as Figure 1 As shown in , the plurality of through holes 22 may be evenly distributed around the center of the circular mounting end surface. If a square mounting end surface is used, through holes of the same number and spacing may be provided on the four sides.

[0040] In addition, the adsorption end surface 12 may also be circular, square, or other shapes, which is not limited in this embodiment of the present invention.

[0041] Furthermore, a limiting structure 40 may be provided on the mounting end surface. The limiting structure 40 may protrude or be recessed from the mounting end surface. For example, the limiting structure 40 may be a flange or a limiting post provided at the edge of the mounting end surface. Of course, the limiting structure 40 may also have other shapes, which are not limited in this embodiment of the present invention. Furthermore, there may be multiple flanges or limiting posts, which may be evenly distributed.

[0042] Furthermore, the upper opening of the adsorption chamber may be larger than the lower opening to facilitate installation of the suction nozzle.

[0043] Furthermore, guide mechanisms 50 may be provided on both sides of the installation end surface to pre-position the suction nozzle during installation.

[0044] The suction nozzle provided in the embodiment of the present invention has an adsorption cavity provided on the main body, which connects the adsorption end face and the mounting end face, an adsorption hole is provided in the middle of the adsorption end face as the lower opening of the adsorption cavity, a vacuum hole connected to the upper opening of the adsorption cavity is provided on the mounting end face, and a through hole connected to the adsorption cavity is provided on the periphery of the vacuum hole. When placing materials, since these through holes are connected to the adsorption cavity, if the suction nozzle is tilted, such as Figure 3 As shown, the air pressure in the adsorption chamber cannot reach the set pressure value. If the suction nozzle is severely tilted, it may even be impossible to adsorb the patch to the adsorption end face of the suction nozzle. This can prompt the operator to check the relevant parts of the equipment and adjust the suction nozzle to keep its adsorption surface flat.

[0045] Accordingly, an embodiment of the present invention further provides a patch device including the above-mentioned nozzle, such as Figure 4 The figure shows the structure of the patch device.

[0046] The patch device comprises a placement head 51, an air pump 52, and a suction nozzle 10. The suction nozzle 10 is mounted below the placement head 51, and the air pump 52 is connected to the vacuum hole 23 on the mounting end face of the suction nozzle 10 via an air pipe.

[0047] The placement head 51 may be driven by a motor. The embodiment of the present invention does not limit the specific structure of the placement head 51 . It only needs to be compatible with the mounting end surface of the nozzle 10 .

[0048] Furthermore, in order to improve the automation capability of the placement device, in another non-limiting embodiment of the placement device, the device may further include: a pressure gauge for monitoring the pressure value of the adsorption chamber.

[0049] Based on the above patch device, the embodiment of the present invention also provides a patch method, referring to Figure 5 , shows a flow chart of a patch method provided by an embodiment of the present invention. The patch method mainly includes the following steps:

[0050] Step 501, driving the placement head to position the nozzle to align with the patch;

[0051] Step 502: driving the placement head to move the nozzle downward, and pumping air through the air pump to adsorb the patch onto the adsorption end surface of the nozzle;

[0052] Step 503: driving the placement head to position the nozzle to align with the chip;

[0053] Step 504 , driving the placement head to move the suction nozzle downward, and delivering air into the adsorption chamber through the air pump, air pipe, and vacuum hole to pre-solidify the patch and the chip.

[0054] like Figure 6 FIG. 1 is another flow chart of a patch method according to an embodiment of the present invention, comprising the following steps:

[0055] Step 601, driving the placement head to position the nozzle to align with the patch;

[0056] Step 602: Drive the placement head to move the nozzle downward, pump air through the air pump, so that the patch is adsorbed on the adsorption end surface of the nozzle, and monitor the pressure value of the adsorption chamber when the air is pumped to a set vacuum state;

[0057] Step 603: Determine whether the pressure value is normal; if so, execute step 604; otherwise, execute step 606;

[0058] Specifically, a set value, ie, a normal pressure value, can be determined through pre-testing. If the monitored pressure value is greater than the set value, it is determined that the current pressure value is abnormal.

[0059] Step 604 , driving the placement head to position the nozzle to align with the chip;

[0060] Step 605 , driving the placement head to move the suction nozzle downward, and delivering air into the adsorption chamber through the air pump, air pipe, and vacuum hole to pre-solidify the patch and the chip.

[0061] Step 606, adjust the nozzle assembly flatness, then return to step 601 and start again.

[0062] It should be noted that the adjustment of the nozzle assembly flatness may be performed manually or automatically through a corresponding driving mechanism, which is not limited in this embodiment of the present invention.

[0063] The patch method provided by the embodiment of the present invention can not only ensure the patch mounting quality, but also automatically detect and make timely adjustments if a condition such as nozzle tilt that affects assembly flatness occurs, thereby effectively improving the mounting efficiency.

[0064] It should be understood that the term "and / or" in this document simply describes a relationship between related objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A exists alone, A and B exist simultaneously, or B exists alone. Furthermore, the character " / " in this document indicates that the related objects are in an "or" relationship.

[0065] The term “plurality” used in the embodiments of the present invention refers to two or more than two.

[0066] The first, second, etc. descriptions appearing in the embodiments of the present invention are only used for illustration and distinction of the description objects. There is no order, nor does it indicate any special limitation on the number of devices in the embodiments of the present application, and cannot constitute any limitation on the embodiments of the present application.

[0067] The “connection” appearing in the embodiments of the present invention refers to various connection modes such as direct connection or indirect connection to achieve communication between devices, and the embodiments of the present application do not impose any limitations on this.

[0068] Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be based on the scope defined by the claims.

Claims

1. A nozzle, characterized in that: The suction nozzle includes: a main body, which includes an adsorption end face and a mounting end face connected by an adsorption chamber; an adsorption hole connected to the adsorption chamber is provided in the middle position of the adsorption end face, and a vacuum hole is provided on the mounting end face, the adsorption hole is the lower opening of the adsorption chamber, and the vacuum hole is the upper opening of the adsorption chamber; a through hole connected to the adsorption chamber is also provided on the mounting end face, and the through hole is provided on the periphery of the vacuum hole.

2. The nozzle according to claim 1, characterized in that There are multiple through holes.

3. The nozzle according to claim 2, characterized in that The plurality of through holes are symmetrically distributed.

4. The nozzle according to claim 1, wherein: The adsorption end surface is circular or square.

5. The nozzle according to claim 1, wherein: A limiting structure is provided on the installed end surface.

6. The nozzle according to claim 5, characterized in that The limiting structure is a flange or a limiting column arranged on the edge of the installation end surface.

7. The nozzle according to claim 6, characterized in that There are multiple flanges or limiting columns, and they are evenly distributed.

8. The nozzle according to claim 1, wherein: The upper opening of the adsorption chamber is larger than the lower opening.

9. The suction nozzle according to any one of claims 1 to 8, characterized in that Guide structures are also provided on both sides of the installation end surface.

10. A patch device, characterized in that: The device comprises: a mounting head, an air pump, and a suction nozzle according to any one of claims 1 to 9; the suction nozzle is installed below the mounting head, and the air pump is connected to the vacuum hole through an air pipe.

11. The patch device according to claim 10, wherein: The device also includes a pressure gauge for monitoring the pressure value of the adsorption chamber.

12. The patch device according to claim 10 or 11, characterized in that: The placement head is driven by a motor.

13. A patch method, characterized in that: The method comprises: driving the placement head to position the suction nozzle to a position aligned with the patch, wherein the suction nozzle is the suction nozzle according to any one of claims 1 to 9; Drive the placement head to move the nozzle downward, and extract air through the air pump to make the patch adsorb on the adsorption end surface of the nozzle; Drive the placement head to position the nozzle to align with the chip; The placement head is driven to move the suction nozzle downward, and air is transported into the adsorption cavity through the air pump, air pipe and vacuum hole to pre-solidify the patch and the chip.

14. The method according to claim 13, characterized in that The method further comprises: During the process of extracting air through the air pump, monitor the pressure value of the adsorption chamber when the air is extracted to the set vacuum state; If the pressure value is greater than the set value, the nozzle assembly flatness is adjusted.

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