An air-cooled temperature control system for a probe station

By adopting a temperature control system of a low-temperature refrigerator and a heating layer in semiconductor detection equipment, combined with the air circuit design of a closed chamber and a multi-stage heat rebate, the problems of high dew point and inaccurate temperature control of air-cooled equipment are solved, and the temperature stability and accuracy are improved, adapting to the high and low temperature detection of semiconductor chips.

CN116430919BActive Publication Date: 2025-08-12CHANGSHA YIWANG SEMICON CO LTD
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Patent Information

Application Number
CN202310229947.9
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-03-10
Publication Date
2025-08-12
Estimated Expiration
2043-03-10

AI Technical Summary

Technical Problem

The existing air-cooled semiconductor detection equipment has problems such as high dew point requirements and inaccurate temperature control, which cannot meet the process requirements of semiconductor chip production and testing.

Method used

The chuck is controlled by a low-temperature refrigerator and heating layer, combined with a closed chamber to isolate the external air, and the gas is circulated through the circulation gas path and the return air path. The air dryer and flow control unit are used to adjust the gas humidity and flow rate, and a multi-stage heat rebate and heat exchange system are set up to achieve temperature stability.

Benefits of technology

It realizes a dry working environment in the closed chamber, reduces energy losses, ensures the stability and accuracy of temperature control, and adapts to the high and low temperature detection needs of semiconductor chips.

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Abstract

The present invention provides an air-cooled temperature control system for a probe station, comprising: a closed chamber; a chuck structure, arranged in the closed chamber, the chuck structure comprising an air-cooling plate, a heating plate and a chuck, a first temperature sensing component for detecting the temperature of the chuck is arranged in the chuck; a controller controls the temperature of the heating plate; a low-temperature refrigerator adjusts the temperature of the air-cooling plate, and the low-temperature refrigerator is also connected to the controller by a signal; the low-temperature refrigerator comprises a circulating air circuit, the air inlet of the circulating air circuit is used to connect to an external air source, and the exhaust port is connected to the air-cooling plate; the air inlet is also connected to a regenerator group, the regenerator group is connected to a heater, the heater is connected to the exhaust port, and a second temperature sensing component is further arranged between the exhaust port and the heater; the low-temperature refrigerator also comprises a reflux air circuit, the return air port of the reflux air circuit is connected to the air-cooling plate, the return air outlet is connected to the closed chamber, a third regenerator and a third temperature sensing component are arranged between the return air port and the return air outlet, and the third temperature sensing component is close to the return air port.
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Description

Technical Field

[0001] The present invention relates to the field of semiconductor detection, and in particular to an air-cooled temperature control system for a probe station. Background Art

[0002] With the rapid development of the semiconductor industry, demands for the stability and reliability of chips such as smart sensors, power devices, and RF microwave devices in fields related to artificial intelligence, autonomous driving, big data, power electronics, and wireless communications are becoming increasingly stringent. Chips must exhibit a wider operating temperature range and greater temperature stability to accommodate a wider range of application scenarios. To accelerate product launch, companies are beginning to model and test the high and low-temperature performance of chips during the R&D phase. To reduce costs, chip manufacturers are gradually moving high and low-temperature testing from the packaging level to the wafer level.

[0003] Currently, wafer testing high and low temperature equipment on the market is primarily categorized as liquid-cooled and gas-cooled. Liquid-cooled chuck high and low temperature equipment has the following drawbacks: 1. The refrigerant evaporates, requiring regular refrigerant additions to maintain cooling; 2. Pipeline leaks can damage the equipment's circuit boards; 3. While the refrigerant and refrigerant are non-toxic, leaks can pollute the atmosphere. Air-cooled equipment, primarily used in the chemical industry or for domestic use, suffers from low temperature accuracy and instability, failing to meet the production and testing requirements of semiconductor chips. Existing chuck high and low temperature equipment also suffers from high air dew point requirements, high gas consumption, unstable or slow system temperature control, and low energy efficiency. Summary of the Invention

[0004] The present invention provides an air-cooled temperature control system for a probe station, which aims to solve the problems of high dew point requirement and inaccurate temperature control in existing air-cooled semiconductor detection equipment.

[0005] In order to achieve the above-mentioned object, an embodiment of the present invention provides an air-cooled temperature control system for a probe station, comprising:

[0006] Closed chamber;

[0007] A chuck structure is disposed in the sealed chamber, the chuck structure comprising, from bottom to top, an air cooling plate, a heating plate, and a chuck, wherein a first temperature sensing component for detecting the temperature of the chuck is disposed in the chuck;

[0008] a controller connected to the heating plate signal and controlling the temperature of the heating plate;

[0009] A low-temperature refrigerator, used to adjust the temperature of the air-cooled plate, wherein the low-temperature refrigerator is also connected to the controller by signal;

[0010] The low-temperature refrigerator comprises a circulating gas circuit, the circulating gas circuit comprises an air inlet and an exhaust port, the air inlet is used to connect to an external air source, and the exhaust port is connected to the air cooling plate;

[0011] The air inlet is further connected to a regenerator group, the regenerator group is connected to a heater, the heater is connected to the exhaust port, and a second temperature sensor assembly is further provided between the exhaust port and the heater;

[0012] The low-temperature refrigerator further includes a return air circuit, the return air circuit including a return air port and a return air outlet, the return air port is connected to the air cooling plate, the return air outlet is connected to the closed chamber, a third regenerator and a third temperature sensing assembly are provided between the return air port and the return air outlet, and the third temperature sensing assembly is close to the return air port;

[0013] The controller is in signal connection with the regenerator group, the heater, the second temperature sensor, the third regenerator, and the third temperature sensor.

[0014] Preferably, the circulating gas circuit further comprises an air dryer, the air dryer is connected to a first flow control unit, and the first flow control unit is connected to the regenerator group;

[0015] An air pressure sensor is also connected between the air inlet and the air dryer;

[0016] The air dryer, the first flow control unit and the air pressure sensor are respectively connected to the controller for signal communication.

[0017] Preferably, a circulating gas branch is provided between the regenerator group and the heater, the downstream of the circulating gas branch is connected between the third temperature sensor assembly and the third regenerator, and a second flow control unit is provided on the circulating gas branch.

[0018] Preferably, the regenerator group includes a primary regenerator and a secondary regenerator, the primary regenerator and the secondary regenerator are in communication, the primary regenerator is in communication with the first flow controller, and the secondary regenerator is in communication with the heater;

[0019] The low-temperature refrigerator further includes a primary heat exchange system and a secondary heat exchange system, the primary heat exchange system includes a primary compressor, the primary compressor is connected to a secondary heat regenerator, the secondary heat regenerator is connected to a condenser evaporator, the condenser evaporator is connected to a first filter, the first filter is connected to a condenser, and the condenser is connected to the primary compressor;

[0020] The secondary heat exchange system includes a secondary compressor, which is connected to the primary regenerator, which is connected to the condenser evaporator, which is connected to a second filter, which is connected to the third regenerator, which is connected to the condenser, and which is connected to the secondary compressor.

[0021] Preferably, the first-stage compressor is connected in parallel with a first pressure protection switch, and a first expansion valve is connected between the second-stage regenerator and the condenser evaporator.

[0022] Preferably, the condenser evaporator is further connected in parallel with a hot gas bypass valve, and the hot gas bypass valve is connected to the upstream and downstream of the condenser evaporator.

[0023] Preferably, the secondary compressor is connected in parallel with a second pressure protection switch.

[0024] Preferably, charging valves are provided upstream and downstream of the secondary compressor and upstream and downstream of the primary compressor, respectively.

[0025] Preferably, a dew point sensor is further provided in the sealed chamber, and the dew point sensor is signal-connected to the controller.

[0026] The above solution of the present invention has the following beneficial effects:

[0027] In this application, a low-temperature refrigerator and / or a heating layer are used to control the temperature of the chuck. At the same time, the closed chamber can effectively isolate the external air, preventing a large amount of water vapor from liquefying to form dew, thereby forming a dry working environment; the circulating gas path and the return gas path are connected, and the gas in the gas path is recycled, reducing energy loss.

[0028] Other features and advantages of the present invention will be described in detail in the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 is a schematic diagram of the present invention;

[0030] Figure 2 It is a connection diagram of the low-temperature refrigerator of the present invention.

[0031] [Description of Reference Numerals]

[0032] 1-sealed chamber, 21-air cooling plate, 22-heating plate, 23-chuck, 3-controller, 4-low temperature refrigerator, 411-air inlet, 412-exhaust port, 4131-first heat regenerator, 4132-second heat regenerator, 414-heater, 415-second temperature sensor assembly, 416-air dryer, 417-first flow control unit, 418-pressure sensor, 421-return air port, 422-return air outlet, 423-third Regenerator, 424-third temperature sensing assembly, 431-second flow control unit, 441-first compressor, 442-condenser evaporator, 443-first filter, 444-condenser, 445-first pressure protection switch, 446-first expansion valve, 447-hot gas bypass valve, 451-secondary compressor, 452-second filter, 453-second pressure protection switch, 5-dew point sensor, 6-inflating valve, 7-flow regulating switch. DETAILED DESCRIPTION

[0033] In order to make the technical problems, technical solutions and advantages to be solved by the present invention clearer, a detailed description will be given below with reference to the accompanying drawings and specific embodiments.

[0034] like Figure 1-2 As shown, an embodiment of the present invention provides an air-cooled temperature control system for a probe station, comprising a sealed chamber 1, wherein a chuck structure is provided in the sealed chamber 1, and the chuck structure comprises, from bottom to top, an air-cooling plate 21, a heating plate 22, and a chuck 23, wherein a first temperature sensing component for detecting the temperature of the chuck 23 is provided at the bottom of the chuck 23. The present application also includes a controller 3 and a cryogenic refrigerator 4, wherein the controller 3 is connected to the heating plate 22 signal and controls the heating temperature of the heating plate 22, and the cryogenic refrigerator 4 is used to adjust the temperature of the air-cooling plate 21, and the cryogenic refrigerator 4 is connected to the control signal and is controlled by the controller 3.

[0035] Specifically, the low-temperature refrigerator 4 includes a circulating gas circuit, which includes an air inlet 411 and an exhaust port 412. The air inlet 411 is used to connect to an external air source, and the exhaust port 412 is connected to the air cooling plate 21. The air inlet 411 is also connected to a regenerator group, and the regenerator group is connected to a heater 414. The heater 414 is connected to the exhaust port 412. A second temperature sensor component 415 is also arranged between the exhaust port 412 and the heater 414.

[0036] The aforementioned low-temperature refrigerator 4 also includes a return air circuit, which includes a return air port 421 and a return air outlet 422. The return air port 421 is connected to the air cooling plate 21, and the return air outlet 422 is connected to the closed chamber 1. A third heat regenerator 423 and a third temperature sensor assembly 424 are arranged between the return air port 421 and the return air outlet 422. The third temperature sensor assembly 424 is close to the return air port 421.

[0037] Preferably, a flow regulating switch 7 is provided between the return air outlet 422 and the sealed chamber 1 .

[0038] The aforementioned first temperature sensing assembly, regenerator group, heater 414 , second temperature sensing assembly 415 , third regenerator 423 and third temperature sensing assembly 424 are connected to the controller 3 for signal signals.

[0039] Furthermore, the circulating gas circuit also includes an air dryer 416 connected to the air inlet 411, the air dryer 416 is connected to a first flow control unit 417, the first flow control unit 417 is connected to the regenerator group, and the air dryer 416 dries the refrigerant entering the circulating gas circuit to reduce the liquid content in the gas.

[0040] The first flow control unit 417 can adjust the intake air volume according to the required temperature. Setting different intake air volumes for different temperatures helps to reduce fluctuations in gas temperature and maintain a stable temperature.

[0041] Preferably, an air pressure sensor 418 is connected between the air inlet 411 and the air dryer 416, and the air pressure sensor 418 is used to detect the pressure and flow rate of the gas entering the circulating air circuit.

[0042] The air dryer 416 is preferably an adsorption desiccant. The air dryer 416 and the air pressure sensor 418 are connected to the controller 3 by signals and are controlled by the controller 3.

[0043] A circulating gas branch is also connected between the aforementioned circulating gas circuit and the return gas circuit. The downstream portion of the circulating gas branch connects between the third temperature sensor assembly 424 and the third regenerator 423, and the upstream portion connects between the regenerator assembly and the heater 414. A second flow control unit 431 is provided on the circulating gas branch to control the flow rate of the circulating gas branch. The circulating gas branch is used to compensate for the return gas circuit. Because the gas in the circulating gas branch is dried by the air dryer 416, the water content in the gas is low. When the gas flows into the return gas circuit and then into the sealed chamber 1, liquefaction of the gas in the sealed chamber 1 can be effectively prevented.

[0044] The second flow control unit 431 controls the gas flow diverted from the circulating gas branch. On the one hand, it can reduce the volume of gas in the circulating gas circuit to increase the temperature of the remaining gas. On the other hand, it can cool the third regenerator 423 to save energy.

[0045] The aforementioned regenerator group includes a primary regenerator 4131 and a secondary regenerator 4132. The primary regenerator 4131 and the secondary regenerator 4132 are connected and the primary regenerator 4131 is located upstream of the secondary regenerator 4132. The primary regenerator 4131 is connected to the first flow controller 3, and the secondary regenerator 4132 is connected to the heater 414.

[0046] A primary heat exchange system and a secondary heat exchange system are also provided in the low-temperature refrigerator 4. The primary heat exchange system and the secondary heat exchange system perform heat exchange on the secondary regenerator 4132 and the primary regenerator 4131 respectively, thereby changing the temperature of the gas in the circulating gas path.

[0047] Specifically, the primary heat exchange system includes a primary compressor 441, which is connected to the secondary heat regenerator 4132, which is connected to the condenser evaporator 442, which is connected to the first filter 443, which is connected to the condenser 444, and the condenser 444 is connected to the primary compressor 441 to form a closed loop.

[0048] The secondary heat exchange system includes a secondary compressor 451, which is connected to the primary regenerator 4131, which is connected to the aforementioned condenser evaporator 442, and the condenser evaporator 442 is connected to the second filter 452, which is connected to the third regenerator 423, which is connected to the condenser 444, and the condenser 444 is connected to the aforementioned secondary compressor 451.

[0049] The primary heat exchange system exchanges heat with the circulating gas path through the secondary heat exchanger 4132 . The secondary heat exchange system exchanges heat with the primary heat exchanger 4131 and can also exchange heat with the return gas path through the third heat exchanger 423 .

[0050] Preferably, the first compressor 441 is connected in parallel with a first pressure protection switch 445, and a first expansion valve 446 is connected between the second regenerator 4132 and the condenser evaporator 442. The condenser evaporator 442 is also connected in parallel with a hot gas bypass valve 447, which is connected upstream and downstream of the condenser evaporator 442.

[0051] Preferably, the secondary compressor 451 is connected in parallel with a second pressure protection switch 453, and inflation valves 6 are respectively provided upstream and downstream of the secondary compressor 451 and upstream and downstream of the primary compressor 441 for replenishing refrigerant to the primary heat exchange system and the secondary heat exchange system.

[0052] A dew point sensor 5 is further provided in the aforementioned sealed chamber 1 . The dew point sensor is connected to the controller 3 for signal transmission. The dew point sensor 5 detects the dew point temperature of the sealed chamber 1 .

[0053] In the present application, external air enters the air inlet 411, and the external air is dried by the air dryer 416 to reduce the water content of the external air, and is cooled by the first-level heat regenerator 4131 and the second-level heat regenerator 4132 to achieve temperature stability of the external air. The external air is then heated by the heater 414 to stably heat up the external air. The heated external air is detected by the second temperature sensing component 415, and the second temperature sensing component 415 dynamically adjusts the power of the heater 414 so that the external air output from the exhaust port 412 reaches a stable temperature.

[0054] In the present application, the external gas is first cooled to a stable temperature, and then heated by the heater 414 to effectively ensure that during the gas input process, the external gas output from the exhaust port 412 is in a continuously stable state. Compared with directly cooling the external gas before use, the rapid response of the heater 414 can better keep the temperature fluctuation difference of the external gas low, thereby reducing the impact on the test.

[0055] The external air output from the aforementioned exhaust port 412 cools the air cooling plate 21 and can maintain the temperature at minus 80 degrees Celsius. The return air port 421 is also connected to the air cooling plate 21. The external air enters the return air port 421 and is connected to the closed chamber 1 through the return air outlet 422. The external air discharges the air in the closed chamber 1 to prevent condensation in the closed chamber 1. Preferably, the closed chamber 1 is provided with a one-way valve for discharging the air from the closed chamber 1.

[0056] The aforementioned primary heat exchange system and secondary heat exchange system perform heat exchange on the secondary regenerator 4132 and the primary regenerator 4131 respectively, so that the primary regenerator 4131 and the secondary regenerator 4132 can cool the external gas in the circulating gas path to a lower temperature, and the power consumption of the primary regenerator 4131 and the secondary regenerator 4132 is lower.

[0057] The primary heat exchange system and the secondary heat exchange system are equipped with recyclable refrigerant. When the refrigerant is insufficient, the two heat exchange systems can be replenished through the charging valve 6.

[0058] The refrigerant flows in the primary heat exchange system and circulates through the condenser 444. After the condenser 444 and the condensation evaporator 442 reduce the temperature of the refrigerant, it enters the secondary regenerator 4132 to cool the external air in the circulating gas path. At the same time, the heated refrigerant returns to the primary compressor 441 again to achieve cooling.

[0059] The primary heat exchange system is divided into two paths at the condenser 444. One path circulates within the primary heat exchange system, and the other path passes through the condenser 444 and enters the third regenerator 423. The third regenerator 423 is also connected to the condenser evaporator 442. The refrigerant after passing through the condenser evaporator 442 exchanges heat with the primary regenerator 4131 to cool the external air in the circulating gas path. The refrigerant then returns to the condenser 444 to circulate within the secondary heat exchange system.

[0060] The aforementioned return gas path performs heat exchange with the third regenerator 423 , and the secondary heat exchange system is cooled by utilizing the heat exchange between the return gas path and the third regenerator 423 .

[0061] In the present application, the external gas output from the exhaust port 412 cools the air-cooled plate 21, and at the same time, the external gas in the air-cooled plate 21 is discharged into the closed chamber 1 through the return air port 421 and the return air outlet 422, so that the chuck 23 is at a lower temperature. At the same time, the external gas discharged from the return air outlet 422 is used to discharge the air in the closed chamber 1. Because the external gas from the return air outlet 422 is dried by the air dryer 416, the moisture content therein is reduced, which can effectively prevent condensation from occurring.

[0062] The primary heat exchange system and the secondary heat exchange system pre-cool the primary regenerator 4131 and the secondary regenerator 4132, reducing the temperature to below the target value, and then heating them through the heater 414, which can effectively maintain temperature stability and prevent the primary regenerator 4131 and the secondary regenerator 4132 from being unable to accurately adjust the temperature to the required temperature.

[0063] The secondary heat exchange system is cooled by the non-heated external air in the circulating gas branch through the third regenerator 423, thereby reducing the energy consumption of the secondary heat exchange system.

[0064] This application adjusts the trend of external airflow, which can not only cool the air-cooled plate 21, but also reduce the power consumption of the third regenerator 423, and at the same time discharge the gas in the closed chamber 1 to create a low dew point test environment, fully ensuring the progress of the test.

[0065] The above is a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as within the scope of protection of the present invention.

Claims

1. An air-cooled temperature control system for a probe station, characterized in that: include: Sealed chamber (1); A chuck structure is arranged in a sealed chamber (1), the chuck structure comprising, from bottom to top, an air cooling plate (21), a heating plate (22), and a chuck (23), wherein a first temperature sensing component for detecting the temperature of the chuck (23) is arranged in the chuck (23); A controller (3) is connected to the heating plate (22) and controls the temperature of the heating plate (22); A low-temperature refrigerator (4) for regulating the temperature of the air-cooling plate (21), wherein the low-temperature refrigerator (4) is also signal-connected to the controller (3); The low-temperature refrigerator (4) comprises a circulating gas circuit, the circulating gas circuit comprising an air inlet (411) and an air outlet (412), the air inlet (411) being used to communicate with an external air source, and the air outlet (412) being communicated with the air cooling plate (21); The air inlet (411) is also connected to a regenerator group, the regenerator group is connected to a heater (414), the heater (414) is connected to the exhaust port (412), and a second temperature sensing component (415) is provided between the exhaust port (412) and the heater (414); The low-temperature refrigerator (4) further includes a return air circuit, the return air circuit including a return air port (421) and a return air outlet (422), the return air port (421) being in communication with the air cooling plate (21), the return air outlet (422) being in communication with the sealed chamber (1), a third regenerator (423) and a third temperature sensing component (424) being provided between the return air port (421) and the return air outlet (422), the third temperature sensing component (424) being close to the return air port (421); The controller (3) is signal-connected to the regenerator group, the heater (414), the second temperature sensor, the third regenerator (423), and the third temperature sensor; The circulating gas circuit further comprises an air dryer (416), the air dryer (416) is connected to a first flow control unit (417), and the first flow control unit (417) is connected to the regenerator group; An air pressure sensor (418) is also connected between the air inlet (411) and the air dryer (416); The air dryer (416), the first flow control unit (417) and the air pressure sensor (418) are respectively connected to the controller (3) for signal communication; A circulating gas branch is provided between the regenerator group and the heater (414), the downstream of the circulating gas branch is connected between the third temperature sensor assembly (424) and the third regenerator (423), and a second flow control unit (431) is provided on the circulating gas branch; The regenerator group comprises a primary regenerator (4131) and a secondary regenerator (4132), the primary regenerator (4131) and the secondary regenerator (4132) being in communication, the primary regenerator (4131) being in communication with a first flow controller (3), and the secondary regenerator (4132) being in communication with a heater (414); The low-temperature refrigerator (4) further includes a primary heat exchange system and a secondary heat exchange system, the primary heat exchange system including a primary compressor (441), the primary compressor (441) being in communication with a secondary heat regenerator (4132), the secondary heat regenerator (4132) being in communication with a condenser evaporator (442), the condenser evaporator (442) being in communication with a first filter (443), the first filter (443) being in communication with a condenser (444), the condenser (444) being in communication with the primary compressor (441); The secondary heat exchange system includes a secondary compressor (451), the secondary compressor (451) is connected to the primary regenerator (4131), the primary regenerator (4131) is connected to the condenser evaporator (442), the condenser evaporator (442) is connected to a second filter (452), the second filter (452) is connected to the third regenerator (423), the third regenerator (423) is connected to the condenser (444), and the condenser (444) is connected to the secondary compressor (451); the secondary heat exchange system can perform heat exchange with the primary regenerator (4131) while also performing heat exchange with the return gas path through the third regenerator (423).

2. The air-cooled temperature control system for a probe station according to claim 1, characterized in that: The first-stage compressor (441) is connected in parallel with a first pressure protection switch (445), and a first expansion valve (446) is connected between the second-stage regenerator (4132) and the condenser evaporator (442).

3. The air-cooled temperature control system for a probe station according to claim 2, characterized in that: The condenser evaporator (442) is also connected in parallel with a hot gas bypass valve (447), and the hot gas bypass valve (447) is connected to the upstream and downstream of the condenser evaporator (442).

4. The air-cooled temperature control system for a probe station according to claim 3, characterized in that: The secondary compressor (451) is connected in parallel with a second pressure protection switch (453).

5. The air-cooled temperature control system for a probe station according to claim 4, characterized in that: An inflation valve (6) is provided upstream and downstream of the secondary compressor (451) and upstream and downstream of the primary compressor (441), respectively.

6. The air-cooled temperature control system for a probe station according to claim 5, characterized in that: A dew point sensor (5) is also provided in the sealed chamber (1), and the dew point sensor (5) is connected to the controller (3) for signal transmission.

Citation Information

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