Wafer cleaning device

Abstract

The present invention discloses a wafer cleaning device, comprising: a box body, a wafer supporting mechanism, a wafer brushing mechanism and a liquid supply component, wherein the wafer supporting mechanism comprises a roller and a mounting seat for carrying a wafer and driving the wafer to rotate, the mounting seat is used to fix the roller to the box body, a sealing component is arranged between the mounting seat and the box body, the sealing component comprises a sealing gasket, an outer pressure ring and an inner pressure ring, the inner pressure ring fixes the sealing gasket to the mounting seat, the outer pressure ring fixes the sealing gasket to the box body, and the inner pressure ring is located on the inner side of the outer pressure ring.

Description

Technical Field

[0001] The invention relates to the technical field of chemical mechanical polishing post-processing, and in particular to a wafer cleaning device. Background Art

[0002] In the semiconductor field, the cleanliness of the wafer surface is one of the important factors affecting the reliability of semiconductor devices. In the wafer manufacturing process, such as deposition, plasma etching, photolithography, electroplating, etc., it is possible to introduce contamination and / or particles on the wafer surface, resulting in reduced cleanliness of the wafer surface and low yield of manufactured semiconductor devices. Therefore, multiple surface cleanings are required during the wafer manufacturing process to remove pollutants such as metal ions, atoms, organic matter and particles attached to the wafer surface.

[0003] The scrubbing module used to clean the wafer is equipped with a roller that drives the wafer to rotate or a roller that rotates with the wafer. The roller is in direct contact with the wafer. In the actual production process, it is found that the edge of the wafer is difficult to clean. After the scrubbing process, contaminants will still remain on the edge of the wafer, which are difficult to remove completely. Summary of the invention

[0004] An embodiment of the present invention provides a wafer cleaning device, aiming to solve at least one of the technical problems existing in the prior art.

[0005] An embodiment of the present invention provides a wafer cleaning device, comprising: a box, a wafer supporting mechanism, a wafer brushing mechanism and a liquid supply assembly, wherein the wafer supporting mechanism comprises a roller and a mounting seat for carrying a wafer and driving the wafer to rotate, the mounting seat is used to fix the roller to the box, a sealing assembly is arranged between the mounting seat and the box, the sealing assembly comprises a sealing gasket, an outer pressure ring and an inner pressure ring, the inner pressure ring fixes the sealing gasket to the mounting seat, the outer pressure ring fixes the sealing gasket to the box, and the inner pressure ring is located on the inner side of the outer pressure ring.

[0006] In one embodiment, the upper portion of the outer pressure ring has a water retaining structure.

[0007] In one embodiment, the water retaining structure includes a water retaining eave extending outward from the outer peripheral edge of the outer pressure ring and a water guide groove formed between the water retaining eave and the box body.

[0008] In one embodiment, the water retaining eaves are a half-moon-shaped structure that gradually narrows from high to low.

[0009] In one embodiment, the water retaining eaves extend obliquely from inside to outside toward the roller.

[0010] In one embodiment, the lower portion of the outer pressure ring has a drainage structure.

[0011] In one embodiment, the drainage structure is a notch at the bottom of the outer pressure ring.

[0012] In one embodiment, the outer area of ​​the sealing gasket is located between the outer pressure ring and the housing, and the sealing gasket and the housing are sealed by fixing the outer pressure ring.

[0013] In one embodiment, the sealing gasket and the inner pressure ring are sleeved on the outer circumference of the mounting seat, and the lock nut with internal threads is threadedly connected to the portion of the mounting seat with external threads to press the inner pressure ring and the sealing gasket against the mounting seat.

[0014] The beneficial effects of the embodiments of the present invention include: achieving the sealing function of the wafer support mechanism and improving the pollution discharge capability. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The advantages of the present invention will become clearer and easier to understand through the detailed description made in conjunction with the following drawings, but these drawings are only schematic and do not limit the scope of protection of the present invention, wherein:

[0016] Figure 1 A wafer processing device provided by an embodiment of the present invention is shown;

[0017] Figure 2 A wafer cleaning device provided by an embodiment of the present invention is shown;

[0018] Figures 3 to 5 A sealing assembly provided by an embodiment of the present invention is shown;

[0019] Figures 6 to 8 A sealing assembly provided by another embodiment of the present invention is shown. DETAILED DESCRIPTION

[0020] The technical scheme of the present invention is described in detail below in conjunction with specific embodiments and their accompanying drawings. The embodiments recorded herein are specific embodiments of the present invention, which are used to illustrate the concept of the present invention; these descriptions are explanatory and exemplary, and should not be understood as limiting the embodiments of the present invention and the scope of protection of the present invention. It should be noted that, in the absence of conflict, the embodiments in this application and the features in the embodiments can be combined with each other. In addition to the embodiments recorded herein, those skilled in the art can also adopt other obvious technical solutions based on the contents disclosed in the claims of this application and its specification, which include technical solutions that adopt any obvious replacements and modifications to the embodiments recorded herein. It should be understood that, unless otherwise specified, for ease of understanding, the following description of the specific embodiments of the present invention is based on the description of the relevant equipment, devices, components, etc. in the original static natural state without external control signals and driving forces.

[0021] In addition, it should be noted that the terms used in this application to indicate orientation, such as front, back, up, down, left, right, top, bottom, front, back, horizontal, vertical, etc., are merely for convenience of description to help understand relative positions or directions, and are not intended to limit the orientation of any device or structure.

[0022] In order to illustrate the technical solution of the present invention, the following description will be given with reference to the accompanying drawings and in combination with embodiments.

[0023] In this application, chemical mechanical polishing is also referred to as chemical mechanical planarization, and wafer is also referred to as chip, silicon wafer, base wafer or substrate, etc., and their meanings and actual functions are equivalent.

[0024] like Figure 1 As shown, a wafer processing device 100 provided in an embodiment of the present invention includes: a cache module 110 , two processing modules 120 and a front-end module 150 .

[0025] The cache module 110 may be provided with multiple layers, and the multi-layer cache module 110 may cache multiple wafers at the same time.

[0026] The processing module 120 is used for polishing wafers, and the two processing modules 120 can work independently. Each processing module 120 can include: a polishing unit 121, a first robot 122, a transfer unit 123, a second robot 124 and a plurality of cleaning units 125.

[0027] like Figure 1 As shown, the wafer processing equipment 100 includes four polishing units 121, and the polishing units 121 may be chemical mechanical polishing units. When the wafer processing equipment 100 is working, the wafer may enter any one or more of the four polishing units 121 for polishing, and after completing one or more steps of polishing, the wafer is sent back to the transmission unit 123. Figure 1 As shown, each polishing unit 121 may include: a polishing plate 211 , a polishing head 212 , and a loading and unloading platform 213 . The loading and unloading platforms 213 of the two polishing units 121 are both disposed adjacent to the second robot 124 .

[0028] like Figure 2As shown, before the start of polishing, the second manipulator 124 transports the wafer to the loading and unloading platform 213, and the polishing head 212 loads the wafer from the loading and unloading platform 213 and moves radially to the top of the polishing disk 211 along the polishing disk 211. During the chemical mechanical polishing process, the polishing head 212 presses the wafer on the polishing pad covered on the surface of the polishing disk 211. The size of the polishing pad is larger than the size of the wafer to be polished, for example, 1.2 times or larger than the size of the wafer, thereby ensuring uniform polishing of the wafer. The polishing head 212 performs a rotational motion and reciprocates radially along the polishing disk 211 so that the surface of the wafer in contact with the polishing pad is gradually polished. At the same time, the polishing disk 211 rotates, and the polishing liquid supply device sprays the polishing liquid onto the surface of the polishing pad. Under the chemical action of the polishing liquid, the relative movement of the polishing head 212 and the polishing disk 211 causes the wafer to rub against the polishing pad for polishing. The polishing liquid composed of submicron or nano abrasive particles and chemical solution flows between the wafer and the polishing pad. The polishing liquid is evenly distributed under the transmission and rotating centrifugal force of the polishing pad to form a liquid film between the wafer and the polishing pad. The chemical components in the liquid react with the wafer to convert insoluble substances into soluble substances. These chemical reactants are then removed from the wafer surface by micromechanical friction of the abrasive particles and dissolved into the flowing liquid to be taken away. That is, the surface material is removed in the alternating process of chemical film formation and mechanical film removal to achieve surface flattening treatment, thereby achieving the purpose of global flattening. During polishing, the dresser is used to dress and activate the surface morphology of the polishing pad. The dresser can be used to remove impurity particles remaining on the surface of the polishing pad, such as abrasive particles in the polishing liquid and waste materials falling off the wafer surface, and can also flatten the surface deformation of the polishing pad caused by grinding, ensuring the consistency of the surface morphology of the polishing pad during polishing, thereby keeping the polishing removal rate stable. After polishing is completed, the polishing head 212 absorbs the wafer to place it on the loading and unloading platform 213 , and the second robot 124 takes the wafer from the loading and unloading platform 213 and transports the wafer to the cleaning unit 125 .

[0029] like Figure 1 As shown, a transfer module 130 may be formed between the polishing units 121 of the two processing modules 120, and the transfer units 123 may be arranged in the transfer module 130. The transfer unit 123 may transfer wafers between the first robot 122 and the second robot 124. The first robot 122 moves between the buffer module 110 and the transfer unit 123 and between the transfer unit 123 and the cleaning unit 125. The second robot 124 is used to transfer wafers to the polishing unit 121.

[0030] like Figure 1 As shown, an arrangement space 140 is reserved between the cleaning units 125 of the two processing modules 120 , and the two first manipulators 122 and the cache module 110 are arranged in the arrangement space 140 .

[0031] like Figure 1 As shown, each cleaning unit 125 may include: multiple cleaning modules 251, drying modules 252, vertical buffer modules 253 and flip modules 254, and the cleaning modules 251, drying modules 252, vertical buffer modules 253 and flip modules 254 are arranged side by side. Among them, the cleaning module 251 can use a variety of methods such as brushing, rotating, megasonic and / or spraying to achieve wafer cleaning. The drying module 252 can use a variety of methods such as rotating and / or pulling to achieve wafer drying. It can be understood that the number of cleaning modules 251 can also be other numbers, and is not limited to Figure 1 shown.

[0032] like Figure 1 As shown, each cleaning unit 125 may further include: a third robot 255 and a fourth robot 256 , the third robot 255 moves above the cleaning module 251 and the vertical buffer module 253 , and the fourth robot 256 moves above the cleaning module 251 , the drying module 252 and the flipping module 254 .

[0033] like Figure 2 As shown, an embodiment of the present invention provides a wafer cleaning device 1 for cleaning a wafer w, comprising: a box 10, a wafer supporting mechanism 20, a wafer scrubbing mechanism 30, a liquid supply component 40, etc.

[0034] like Figure 2 As shown, a process chamber is formed inside the box 10 to provide an environment for processing the wafer w.

[0035] like Figure 2 As shown, the wafer scrubbing mechanism 30 includes two cleaning brushes, a cleaning brush driving mechanism and a liquid inlet mechanism.

[0036] Two cleaning brushes are respectively arranged on the front and rear sides of the wafer w and roll to scrub the surface of the wafer w, wherein the two cleaning brushes roll in opposite directions. The two cleaning brushes are respectively a first cleaning brush and a second cleaning brush, which are respectively arranged on the front and rear sides of the wafer w to be cleaned and can roll around their own axes to contact the surface of the wafer w to be cleaned for scrubbing. The cleaning brush is a cylindrical roller structure, which is made of a material with good water absorption, such as polyvinyl alcohol (PVA).

[0037] like Figure 2As shown, liquid is continuously supplied to the cleaning brush through a liquid inlet mechanism connected to one end of the cleaning brush, so that the cleaning brush is kept moist. The cleaning brush is made of a porous material and can absorb a large amount of liquid. The liquid can be an acidic or alkaline solution, or deionized water. The liquid inlet mechanism is connected to the liquid inlet end of the cleaning brush to fill the cleaning brush with liquid. After the cleaning brush is filled with liquid, it becomes soft and can be used to brush the wafer w, so the cleaning brush needs to be kept filled with liquid at all times during the cleaning process.

[0038] like Figure 2 As shown, the cleaning brush driving mechanism is used to drive the two cleaning brushes to move toward each other and clamp the wafer w at a certain angle for rolling brushing. The cleaning brush can move in the horizontal direction to move away from or close to the wafer w. When the cleaning brush is away from the wafer w, a certain gap is reserved between the cleaning brush and the wafer w, and the wafer handling robot can clamp the wafer w to take away the wafer w that has been cleaned; when the cleaning brush moves close to the wafer w, the cleaning brush abuts against the wafer w and cleans the surface of the wafer w in a contact manner.

[0039] like Figure 2 As shown, the liquid supply assembly 40 is used to supply the cleaning liquid to the surface of the wafer w, specifically, the upper area of ​​the surface of the wafer w located above the cleaning brush. The supply angle of the cleaning liquid relative to the surface of the wafer w is 5° to 30°. The liquid supply assembly 40 is connected to the fluid source through a delivery pipeline.

[0040] like Figure 2 As shown, the wafer support mechanism 20 is used to support, position and drive the wafer w to rotate in a vertical plane. The wafer support mechanism 20 is fixed on the box 10 and extends into the process chamber. The wafer w to be cleaned is supported by the wafer support mechanism 20 and rotates in a vertical plane around a horizontal axis.

[0041] In one embodiment, the wafer support mechanism 20 includes a plurality of rollers 21 for carrying the wafer and driving the wafer to rotate. The plurality of rollers 21 may specifically be two driving wheels and a driven wheel for supporting the wafer w located below the wafer w. The two driving wheels play a driving role, and the motor is used to drive the wafer w to rotate. The driven wheel is arranged between the two driving wheels, and plays a role of auxiliary support and speed measurement.

[0042] like Figures 2 to 8As shown, the wafer support mechanism 20 passes through the side wall of the box 10 and extends into the box 10. A portion of the wafer support mechanism 20 is located inside the box 10 for supporting the wafer, and another portion of the wafer support mechanism 20 is located outside the box 10 for connecting with a driving mechanism located outside the box 10 or being fixed to the box 10, thereby forming a gap at the point where the box 10 is passed. The existence of this gap enables the roller 21 to adjust its position within a certain range to better accommodate the wafer. The roller 21 is used to abut against the wafer and drive the wafer to rotate. During cleaning, the wafer is confined in the slot of the roller 21 and rotates synchronously with the roller 21.

[0043] The mounting seat 23 is used to fix the roller 21 to the box body 10. The mounting seat 23 passes through the side wall of the box body 10 and extends into the box body 10. The portion of the mounting seat 23 located outside the box body 10 is connected to the box body 10 through a support member. Specifically, the mounting seat 23 is fixed to the support member using screws, and the support member and the box body 10 are fixed to the same base by screws respectively. There is a gap between the mounting seat 23 and the box body 10. The gap between the mounting seat 23 and the box body 10 is sealed by a sealing assembly 24.

[0044] The roller 21 is connected to the mounting seat 23 via a rotating shaft 22. The rotating shaft 22 is rotatably disposed in the mounting seat 23, and one end of the rotating shaft 22 is connected to the roller 21 to drive the roller 21 to rotate. A bearing is sleeved on the rotating shaft 22. The mounting seat 23 is sleeved on the outer peripheral side of the rotating shaft 22, and the mounting seat 23 and the rotating shaft 22 are connected via a bearing. When the roller 21 is a driving wheel, the driving mechanism is connected to the rotating shaft 22 to drive the rotating shaft 22 to rotate.

[0045] like Figure 3 As shown, a sealing assembly 24 is provided between the mounting seat 23 and the box body 10, and the sealing assembly 24 is respectively fixed to the mounting seat 23 and the box body 10, and is used to seal the gap between the mounting seat 23 and the box body 10. The sealing assembly 24 includes a sealing gasket 25, an outer pressure ring 28 and an inner pressure ring 26, the inner pressure ring 26 fixes the sealing gasket 25 to the mounting seat 23, the outer pressure ring 28 fixes the sealing gasket 25 to the box body 10, and the inner pressure ring 26 is located on the inner side of the outer pressure ring 28.

[0046] like Figure 3 As shown, the sealing gasket 25 is annular and is arranged around the mounting seat 23. The sealing gasket 25 is made of elastic material. The outer pressure ring 28 and the inner pressure ring 26 are both annular.

[0047] In one embodiment, the outer area of ​​the sealing gasket 25 is located between the outer pressure ring 28 and the side wall of the box body 10. A plurality of screw holes are provided around the outer pressure ring 28. The outer pressure ring 28 is fixed to the side wall of the box body 10 by screws, so that the annular outer area of ​​the sealing gasket 25 is compressed and fixed to the side wall of the box body 10 by the outer pressure ring 28, that is, the outer pressure ring 28 and the sealing gasket 25 are compressed and sealed with the box body 10.

[0048] In one embodiment, the sealing gasket 25 and the inner pressure ring 26 are sleeved on the outer periphery of the mounting seat 23. A circular hole is formed in the middle of the sealing gasket 25, and the portion of the mounting seat 23 with external threads passes through the circular hole of the sealing gasket 25 and then passes through the inner pressure ring 26. The inner area of ​​the sealing gasket 25 is located between the inner pressure ring 26 and the mounting seat 23. The lock nut 27 with internal threads is connected to the portion of the mounting seat 23 with external threads by threads, so that the inner pressure ring 26 and the sealing gasket 25 are pressed against the mounting seat 23. From the inside of the box body 10 toward the side wall of the box body 10, the lock nut 27, the inner pressure ring 26, the sealing gasket 25 and the mounting seat 23 are sequentially arranged, and the lock nut 27 is screwed in to press and fix the inner pressure ring 26 and the sealing gasket 25 to the front end surface of the mounting seat 23. After the fixing of the outer pressure ring 28 and the inner pressure ring 26 is completed, the gap between the box body 10 and the mounting seat 23 is sealed by the sealing gasket 25.

[0049] like Figure 3 and Figure 4 As shown, in one embodiment of the present invention, a gap is formed between the inner pressure ring 26 and the outer pressure ring 28, so as to accommodate the flexible deformation of the sealing gasket 25, so as to facilitate the position adjustment of the roller 21. When the contact position between the roller 21 and the wafer is adjusted, the size of the gaps at various locations between the mounting seat 23 and the box body 10 changes, thereby causing the flexible deformation of the sealing gasket 25, and the size of the gap between the inner pressure ring 26 and the outer pressure ring 28 also changes accordingly.

[0050] like Figures 3 to 5 As shown, in one embodiment of the present invention, a water retaining structure is provided on the upper portion of the outer pressure ring 28. During cleaning, some of the liquid flowing downward from the upper portion of the box body 10 will contact the sealing pad 25 from the upper edge and be contaminated. By providing a water retaining structure on the upper portion of the outer pressure ring 28, the liquid coming from above can be blocked, thereby preventing the contaminated liquid from contaminating the roller 21 and affecting the wafer cleaning effect.

[0051] In one embodiment, the water retaining structure includes a water retaining eave 281 extending outward from the outer peripheral edge of the outer pressure ring 28 and a water guide groove 282 formed between the water retaining eave 281 and the box body 10. In one embodiment, the water retaining eave 281 can be formed by extending the entire edge of the outer pressure ring 28 outward. In another embodiment, the water retaining eave 281 can be formed by extending part of the edge of the outer pressure ring 28 outward. The water retaining eave 281 can extend vertically upward or tilted upward, and the tilting direction is tilted from the inside to the outside toward the roller 21. It should be noted that the "inside" and "outside" referred to in this application document are all referenced to the rotation axis 22 as the center, "inside" refers to close to the rotation axis 22, and "outside" refers to away from the rotation axis 22. For example, the outer pressure ring 28, inner pressure ring 26, inward, outward, from the inside to the outside, etc. written in the text are all referenced to this. The upper and lower in the text are referenced to the directions drawn in the drawings of the specification.

[0052] like Figures 3 to 5 In the example shown, the water retaining eaves 281 are formed by extending upward from the outer edge of the upper half of the outer pressure ring 28 away from the housing 10. The water retaining eaves 281 extend obliquely from the inside to the outside toward the roller 21. The water retaining eaves 281 can block the liquid coming from above. Correspondingly, a water guide groove 282 surrounded by the water retaining eaves 281 and the peripheral surface of the outer pressure ring 28 is formed between the water retaining eaves 281 and the housing 10 or the water retaining eaves 281 and the sealing pad 25. Since the bottom surface of the water guide groove 282 is an arc with a high middle and low sides, the water guide groove 282 can collect the liquid blocked by the water retaining eaves 281 and drain it downward from both sides, that is, under the joint action of the water retaining eaves 281 and the water guide groove 282, the contaminated liquid can flow downward along the outer peripheral surface of the outer pressure ring 28, avoiding the contaminants from contaminating the roller 21 and the wafer.

[0053] like Figure 4 and Figure 5 As shown, in one embodiment, the water retaining eave 281 is a half-moon-shaped structure that gradually narrows from high to low. In other words, the width of the water retaining eave 281 gradually decreases from top to bottom.

[0054] In this embodiment, when the liquid coming from the peripheral direction of the roller 21 contacts the sealing gasket 25, the contaminated liquid can enter the water guide groove 282 formed between the semi-lunar water retaining eaves 281 on the top of the outer pressure ring 28 and the side wall of the box body 10, and then the liquid containing pollutants will be guided to flow toward both sides along the outer peripheral surface of the outer pressure ring 28. By setting up a water retaining structure, the liquid accumulated above the outer pressure ring 28 is prevented from being transferred from the front of the outer pressure ring 28 to the roller 21, thereby preventing the roller 21 and the wafer from being contaminated.

[0055] like Figures 6 to 8As shown, in another embodiment of the present invention, the lower portion of the outer pressure ring 28 has a drainage structure 283 for facilitating liquid drainage and preventing excessive accumulation of liquid at the bottom from contaminating the roller 21 nearby. Figure 7 and Figure 8 In the example shown, the drainage structure 283 is a notch at the bottom of the outer pressure ring 28. Alternatively, in another embodiment, the drainage structure 283 can also be a groove located on the bottom surface of the outer pressure ring 28, which can also allow liquid to drain.

[0056] like Figure 7 and Figure 8 As shown, in one embodiment, the drainage structure 283 is a notch at the bottom of the outer pressure ring 28, and the inner bottom of the outer pressure ring 28 is provided with an arc-shaped inclined surface at the edge of the notch to guide the liquid to flow down. Based on the structure of the outer pressure ring 28 in this embodiment, the liquid in other directions can only contact the surface of the sealing gasket 25 in the process chamber through the gap between the inner pressure ring 26 and the outer pressure ring 28. The liquid entering the gap will be restricted in the annular semi-enclosed space between the outer pressure ring 28 and the inner pressure ring 26, and flow out from the drainage structure 283 along the bottom of the annular semi-enclosed space. For example, the liquid flowing from the top of the outer pressure ring 28 to the inner circumference of the outer pressure ring 28 or the liquid flowing between the outer pressure ring 28 and the inner pressure ring 26 will enter the annular semi-enclosed space along the inner circumference of the outer pressure ring 28 or the outer circumference of the inner pressure ring 26, and the accumulated liquid will be drained downward and then flow out from the drainage structure 283. This avoids the contamination of the roller 21 due to the accumulation of dirty water.

[0057] In summary, the outer pressure ring 28 and the inner pressure ring 26 cooperate with each other to guide the liquid flowing through the sealing gasket 25 to flow downward, thereby cutting off the path of the liquid that contacts the sealing gasket 25 and is contaminated by it to propagate to the roller 21, blocking the propagation path of contaminants between the risk-of-pollution components and the wafers to be cleaned, thereby solving the problem of random contamination of the cleaned wafers by dirty water from the sealing gasket 25 when the wafers are vertically brushed, significantly improving the cleanliness near the edge of the wafer, and greatly improving the effect and stability of the cleaning process.

[0058] The drawings of this specification are schematic diagrams, which assist in explaining the concept of the present invention and schematically show the shapes of various parts and their mutual relationships. It should be understood that in order to clearly show the structures of various components of the embodiments of the present invention, the drawings are not drawn according to the same scale, and the same reference numerals are used to represent the same parts in the drawings.

[0059] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0060] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A wafer cleaning device, It is characterized in that include: A box, a wafer support mechanism, a wafer scrubbing mechanism and a liquid supply assembly, wherein the wafer support mechanism comprises a roller and a mounting seat for carrying a wafer and driving the wafer to rotate, the mounting seat is used to fix the roller to the box, a sealing assembly is arranged between the mounting seat and the box, the sealing assembly comprises a sealing gasket, an outer pressure ring and an inner pressure ring, the inner pressure ring fixes the sealing gasket to the mounting seat, the outer pressure ring fixes the sealing gasket to the box, and the inner pressure ring is located on the inner side of the outer pressure ring; The upper part of the outer pressure ring is provided with a water retaining structure, and the water retaining structure comprises a water retaining eave extending outward from the outer peripheral edge of the outer pressure ring and a water guide groove formed between the water retaining eave and the box body.

2. The wafer cleaning device according to claim 1, It is characterized in that The water retaining eaves are a half-moon-shaped structure that gradually narrows from high to low.

3. The wafer cleaning device according to claim 1, It is characterized in that The water retaining eaves extend obliquely from the inside to the outside toward the roller.

4. The wafer cleaning device according to claim 1, It is characterized in that The lower part of the outer pressure ring is provided with a drainage structure.

5. The wafer cleaning device according to claim 4, It is characterized in that The drainage structure is a notch at the bottom of the outer pressure ring.

6. The wafer cleaning device according to claim 1, It is characterized in that The outer area of ​​the sealing gasket is located between the outer pressure ring and the box body, and the sealing gasket and the box body are sealed by fixing the outer pressure ring.

7. The wafer cleaning device according to claim 1, It is characterized in that The sealing gasket and the inner pressure ring are sleeved on the outer periphery of the mounting seat, and the lock nut with internal threads is threadedly connected to the part of the mounting seat with external threads, so as to press the inner pressure ring and the sealing gasket tightly against the mounting seat.

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