Electronic devices that integrate speakers and microphones

Abstract

This application provides an electronic device integrating a speaker and a microphone. Based on this application, the speaker and microphone integrated in this electronic device can be respectively mounted in a first housing and a second housing to avoid resonance between the microphone and speaker within the same housing during speaker operation. Furthermore, the sealing medium between the first and second housings can absorb vibrations transmitted from the speaker to the microphone during operation. Therefore, even if vibrations generated by the speaker during operation are transmitted to the first housing, these vibrations are partially absorbed during transmission from the first housing to the second housing, thereby reducing microphone noise caused by vibrations generated by the speaker during operation. The sealing medium in the electronic device also provides isolation and noise reduction between the microphone, the speaker, and the exterior of the housing, thereby reducing microphone noise caused by sound wave interference from the speaker and the external environment.

Description

Technical Field

[0001] This application relates to the integration of a loudspeaker and a pickup, and more particularly to an electronic device that integrates a loudspeaker and a pickup. Background Technology

[0002] In scenarios such as remote audio and video conferencing, electronic devices that integrate speakers and microphones are often used. These devices can play the voice of the remote speaker locally or capture the voice of the local speaker for remote playback, thereby reducing the number of devices required for voice playback and voice capture.

[0003] However, speakers integrated into the same electronic device can easily interfere with the microphone, causing the audio picked up by the microphone to contain a lot of noise.

[0004] Therefore, how to reduce the pickup noise in electronic devices that integrate speakers and pickups has become a technical problem that needs to be solved in the existing technology. Summary of the Invention

[0005] In view of this, embodiments of this application provide an electronic device that helps reduce pickup noise in electronic devices that integrate speakers and pickups.

[0006] In one embodiment of this application, an electronic device may include:

[0007] First shell;

[0008] A loudspeaker, which is fixedly mounted on the first housing;

[0009] Second shell;

[0010] A microphone, which is fixedly mounted on the second housing;

[0011] A circuit board module, wherein the circuit board module is electrically connected to the speaker and the pickup via a flexible cable;

[0012] The first housing and the second housing are assembled and connected. The speaker, the pickup and the circuit board module are located in the inner cavity of the housing surrounded by the first housing and the second housing. The speaker is separate from the second housing and the pickup is separate from the first housing. A sealing medium for absorbing the vibration generated by the speaker during operation is provided between the first housing and the second housing.

[0013] In some examples, optionally, the first housing includes a device panel, and the speaker is fixedly mounted on the device panel; the second housing includes a device back panel, and the microphone is fixedly mounted on the device back panel; the device panel and the device back panel are arranged at intervals on opposite sides of the housing cavity; the sealing medium includes a panel gasket, and the circuit board module is stacked together with the panel gasket between the device panel and the device back panel.

[0014] In some examples, optionally, the device panel has a first mounting post on the inner surface of the panel facing the device back panel, and the device back panel has a second mounting post on the inner surface of the back panel facing the device panel, the first mounting post and the second mounting post being positioned opposite each other, the first housing and the second housing being assembled using screws passing through the first mounting post and the second mounting post, and the sealing medium further including a post sealing gasket, the post sealing gasket being pressed between the ends of the first mounting post and the second mounting post.

[0015] In some examples, the first housing may optionally include a panel periphery surrounding the device panel; the second housing may also include a back panel periphery surrounding the device back panel; the panel periphery and the back panel periphery may mat with each other around the housing cavity between the device panel and the device back panel; the sealing medium may also include a housing gasket that seals and fills the mating gap between the panel periphery and the back panel periphery.

[0016] In some examples, the panel sealing gasket optionally forms a soundproof sealing cavity that encloses and surrounds the speaker between the device panel and the device back panel, and the microphone is located outside the soundproof sealing cavity.

[0017] In some examples, optionally, the circuit board module has a clearance hole through which the speaker extends from the side of the circuit board module facing the device panel through the clearance hole to the side of the circuit board module facing the device back panel, and the sound insulation sealing cavity formed by the mounting gasket extends from the device panel through the clearance hole to the device back panel.

[0018] In some examples, the panel seal may optionally include: a first panel seal stacked between the circuit board module and the device panel, and the first panel seal closure surrounding the speaker and the clearance plate hole; and a second panel seal stacked between the circuit board module and the device back panel, and the second panel seal closure surrounding the clearance plate hole.

[0019] In some examples, optionally, the inner surface of the device panel facing the device back panel has panel ribs that enclose the sound-permeable mesh of the speaker, and the first panel sealing gasket is stacked between the circuit board module and the panel ribs; the inner surface of the device back panel facing the device panel has back panel ribs that enclose the alignment area of ​​the panel ribs on the device back panel, and the second panel sealing gasket is stacked between the circuit board module and the back panel ribs.

[0020] In some examples, optionally, the device panel has a key through-hole, the key contact area of ​​the circuit board module is provided with a flexible conductive medium, the flexible conductive medium is inserted into the key through-hole, the key through-hole is located in the soundproof sealing cavity, and the outer surface of the device panel facing away from the device back plate is provided with a touch key plate that seals and covers the key through-hole.

[0021] In some examples, the device panel may optionally have a panel light hole into which a light guide of a light guide module is inserted, the circuit board module is connected to the light guide module via a flexible cable, the panel light hole is located within the soundproof sealing cavity, and the touch key has an opening to avoid the panel light hole.

[0022] In some examples, optionally, the inner surface of the device back panel facing the device panel has a connector mounting base for fixing an interface connector that connects to the circuit board module, and the interface mounting base has a through hole for connecting the interface connector to a physical interface via a flexible external cable; the interface mounting base is located within the soundproof sealing cavity, and the interface connector is sealed with adhesive on the interface mounting base.

[0023] In some examples, the device may optionally include a device base, the device back panel having a mounting hole, and the device base being fixedly mounted on the outer surface of the device back panel facing away from the device panel by screws passing through the mounting hole; the mounting hole is located within the soundproof sealing cavity, and a back panel sealing gasket enclosing the mounting hole is stacked between the device base and the device back panel.

[0024] In some examples, optionally, the outer surface of the device back panel facing away from the device panel has a limiting boss, the mounting hole seat passes through the limiting boss, and the back panel sealing gasket surrounds the limiting boss; the device base has a press-fit rib frame, and the press-fit rib frame is in sealing contact with the back panel sealing gasket.

[0025] In some examples, optionally, the outer surface of the device back panel facing away from the device panel has a positioning groove, the device base has a positioning protrusion protruding towards the device back panel, and the positioning protrusion is adapted to be inserted into the positioning groove.

[0026] In some examples, optionally, the cavity of the positioning convex shell facing away from the device backplate houses a wireless communication adapter; the wireless communication adapter is covered by an elastic material, and the wireless communication adapter is interferentially held between the opposite side walls of the cavity.

[0027] In some examples, optionally, the surface of the device base facing away from the device backplate is fitted with a base damping pad.

[0028] In some examples, the first housing may optionally have a sound-permeable mesh, with the speaker's sound-permeable surface facing the sound-permeable mesh, and a speaker gasket stacked between the speaker and the first housing.

[0029] In some examples, the speaker gasket optionally closes the speaker cavity between the speaker's sound-emitting surface and the speaker's sound-transmitting mesh.

[0030] In some examples, the device panel may optionally also have a limiting flange surrounding the speaker sound-permeable mesh, and the speaker gasket is bonded to the device panel in the area surrounded by the limiting flange.

[0031] In some examples, the second housing may optionally have a pickup hole and a pickup slot communicating with the pickup hole, the pickup being inserted into the pickup slot by interference of a pickup gasket, and the opening of the pickup slot in the inner cavity of the housing is sealed with adhesive, and the adhesive seal avoids the pickup cavity between the pickup surface of the pickup and the pickup hole.

[0032] In some examples, optionally, at least two of the pickups surround the speaker within the housing cavity, and the distances between the at least two pickups and the speaker are not all the same.

[0033] In some examples, optionally, the first housing includes a device panel and a panel periphery surrounding the device panel, and the speaker is fixedly mounted on the device panel; the second housing includes a device back plate and a back plate periphery surrounding the device back plate, and the microphone is fixedly mounted on the device back plate; the device panel and the device back plate are spaced apart and arranged on opposite sides of the housing cavity, and the panel periphery and the back plate periphery are mated and engaged around the housing cavity; the device panel has a sound-permeable mesh, and the speaker's sound-permeable surface faces the sound-permeable mesh; the microphone is adjacent to the back plate periphery, and the back plate periphery has a sound-collecting hole.

[0034] Based on the above embodiments, the speaker and the pickup can be respectively installed in the first housing and the second housing, thereby avoiding resonance between the pickup and the speaker in the same housing during the operation of the speaker. Moreover, the sealing medium between the first housing and the second housing can absorb the vibration transmitted from the speaker to the pickup during the operation of the speaker. Therefore, even if the vibration generated by the speaker during the operation of the speaker is transmitted to the first housing, the vibration will be partially absorbed during the transmission from the first housing to the second housing, thereby reducing the pickup noise caused by the vibration generated by the speaker during the operation of the speaker. Attached Figure Description

[0035] The following figures are for illustrative purposes only and do not limit the scope of this application:

[0036] Figure 1 This is a schematic diagram of the assembly structure of an electronic device in one embodiment of this application;

[0037] Figure 2 For example Figure 1 A cross-sectional view of the electronic device in the illustrated embodiment;

[0038] Figure 3 For example Figure 1 An exploded view of the electronic device in the illustrated embodiment;

[0039] Figure 4 For example Figure 1 A schematic diagram of the component division of the electronic device in the illustrated embodiment;

[0040] Figure 5 For the basis of Figure 4 A schematic diagram showing the assembly relationship of the panel components.

[0041] Figure 6 For the basis of Figure 4 A schematic diagram showing the assembly relationship of the backplate components divided into components.

[0042] Figure 7 For the basis of Figure 4 The diagram shows the assembly relationship between the backplane assembly and the equipment base, as divided into components.

[0043] Figure Labels

[0044] 10 First Shell

[0045] 11 Device Panel

[0046] 110 Speaker Sound Transmission Mesh

[0047] 111 Limiting flange

[0048] 112 Panel Ribs

[0049] 113 Auxiliary stiffeners

[0050] 114 key through holes

[0051] 115 panel light hole

[0052] 116 Exterior Flange

[0053] 117 First Assembly Hole Column

[0054] 12 panel perimeter

[0055] 121 circumferential elongated aperture

[0056] 122 Limiting Protrusion

[0057] 13-panel mesh

[0058] 14 touch keys

[0059] 15 light guide modules

[0060] 16 Flexible light-shielding medium

[0061] 17 switch modules

[0062] 20 Second shell

[0063] 21 Equipment Back Panel

[0064] 210 pickup slot

[0065] 211 Assembly Hole Seat

[0066] 212 Backplate Ribs

[0067] 213 Supporting stiffener

[0068] 214 Installation Column

[0069] 215 connector mounting base

[0070] 217 Second Assembly Hole Column

[0071] 218 Limiting Boss

[0072] 219 positioning groove

[0073] 22 Backplate Perimeter

[0074] 220 pickup hole

[0075] 225 positioning edge

[0076] 25 interface connector

[0077] 26 physical interfaces

[0078] 30 Equipment Base

[0079] 31 threaded blind hole

[0080] 32 Press-jointed rib frame

[0081] 35 Limiting Ring Groove

[0082] 36 Wireless Communication Adapter

[0083] 39 Positioning Convex Shell

[0084] 40 circuit board modules

[0085] 41 clearance plate hole

[0086] 43 battery module

[0087] 44 Flexible Conductive Medium

[0088] 47 switch contacts

[0089] 50 speakers

[0090] 60 pickup

[0091] 81 First screw

[0092] 82 Second Screw

[0093] 83 Third Screw

[0094] 84 Fourth Screw

[0095] 91 speaker gasket

[0096] 92 housing gasket

[0097] 93 Plate Sealing Gasket

[0098] 931 First Plate Sealing Gasket

[0099] 932 Second Plate Sealing Gasket

[0100] 94 Backplate Sealing Gasket

[0101] 95 base vibration damping pad

[0102] 96 pickup sealing gasket

[0103] 97-hole column gasket Detailed Implementation

[0104] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided with reference to the accompanying drawings and embodiments.

[0105] Figure 1 This is a schematic diagram of the assembly structure of an electronic device in one embodiment of this application. Figure 2 For example Figure 1 A cross-sectional view of the electronic device in the illustrated embodiment. Figure 3 For example Figure 1 An exploded view of the electronic device in the illustrated embodiment. Please refer to [link / reference]. Figures 1 to 3 In embodiments of this application, the electronic device may include a first housing 10, a second housing 20, a speaker 50 and a pickup 60, and a circuit board module 40 electrically connected to the speaker 50 and the pickup 60.

[0106] The first housing 10 and the second housing 20 can be assembled together to form a device housing for an electronic device, and the device housing has an internal cavity for accommodating components. Accordingly, the speaker 50, the pickup 60, and the circuit board module 40 are all located in the internal cavity surrounded by the first housing 10 and the second housing 20.

[0107] When the electronic device is in use, the first housing 10 may be positioned facing or closer to the user, while the second housing 20 may be positioned away from or relatively away from the user. For example, if the electronic device is placed horizontally on a table, the first housing 10 may face upwards, and the second housing 20 may face downwards.

[0108] In this embodiment, the first housing 10 can be responsible for the sound wave emission of the speaker 50 and the human-computer interaction function of the electronic device. For example, the first housing 10 can be provided with a sound-transmitting mesh 110, operation components for human-computer interaction such as touch keys 14 and power buttons 17, and indicator light groups such as light guide modules 15 for generating indicator light to the user. Correspondingly, the first housing 10 can include a device panel 11 and a panel perimeter 12 surrounding the device panel 11. The panel perimeter 12 encloses and surrounds the device panel 11 on the inner surface of the device panel 11 facing the device back panel 21. The sound-transmitting mesh 110 and touch keys 14 can be located on the device panel 11, and the power button 17 can be located on the panel perimeter 12. The second housing 20 can be responsible for the installation of most of the components of the electronic device. Accordingly, the second housing 20 may include a device backplate 21 for mounting components and a backplate periphery 22 surrounding the device backplate 21, wherein the backplate periphery 22 closes around the device backplate 21 on the inner surface of the backplate facing the device panel 11. In this case, the device panel 11 and the device backplate 21 are arranged at intervals on opposite sides of the housing cavity, and the panel periphery 12 and the backplate periphery 22 are mated and engaged around the housing cavity between the device panel 11 and the device backplate 21.

[0109] When the electronic device is in use, the speaker 50, which is in operation, will vibrate, and this vibration is one of the main causes of noise collected by the pickup 60. Therefore, in the embodiments of this application, in order to avoid resonance between the pickup 60 and the speaker 50 in the same housing during the operation of the speaker 50, a separate housing deployment method is adopted, in which the speaker 50 and the pickup 60 are respectively installed in the first housing 10 and the second housing 20, instead of installing both the speaker 50 and the pickup 60 in the second housing 20, which is the device backplate 21 that houses most of the components of the electronic device.

[0110] The speaker 50 is fixedly mounted on the first housing 10. For example, the speaker 50 can be fixedly mounted on the device panel 11 (i.e., the inner surface of the device panel 11 facing the device back panel 20), and the speaker 50 is separate from the second housing 20.

[0111] The microphone 60 is fixedly mounted on the second housing 20 (e.g., fixedly mounted on the device back panel 21), and the microphone 60 is separate from the first housing 10.

[0112] Furthermore, in the embodiments of this application, in order to avoid the electrical connection between the circuit board module 40 and the speaker 50 and the pickup 60 having rigid characteristics that transmit vibration, the circuit board module 40 can be electrically connected to the speaker 50 and the pickup 60 via a flexible cable.

[0113] In addition, in the embodiments of this application, the first housing 10 and the second housing 20 can be housings made of hard materials such as plastic. Therefore, in order to avoid the transmission of vibrations generated by the speaker 50 during operation through direct and / or indirect rigid contact between the first housing 10 and the second housing 20, a sealing medium (such as silicone or foam) can be provided between the first housing 10 and the second housing 20 to absorb the vibrations generated by the speaker 50 during operation. That is, the sealing medium has an elastic deformation allowance in the assembled state.

[0114] Based on the embodiments of this application, the speaker 50 and the pickup 60 integrated in the electronic device can be respectively installed in the first housing 10 and the second housing 20 to avoid resonance between the pickup 60 and the speaker 50 in the same housing during the operation of the speaker 50. Moreover, the sealing medium between the first housing 10 and the second housing 20 can absorb the vibration transmitted from the speaker 50 to the pickup 60 during the operation. Therefore, even if the vibration generated by the speaker 50 during the operation is transmitted to the first housing 10, the vibration will be partially absorbed during the transmission from the first housing 10 to the second housing 20, thereby reducing the noise collected by the pickup 60 caused by the vibration generated by the speaker 50 during the operation.

[0115] In embodiments of this application, the circuit board 40 may be parallel or substantially parallel to the device panel 11 and the device back panel 21. In this case, the sealing medium for absorbing vibrations generated by the speaker 50 during operation may include a panel sealing gasket 93 (e.g., a silicone gasket), and the circuit board module 40 may be stacked together with the panel sealing gasket 93 between the device panel 11 and the device back panel 21.

[0116] When the sealing medium includes the plate sealing gasket 93, the sealing effect of the plate sealing gasket 93 can be mainly reflected in the local sealing protection of the area where the speaker 50 is located. That is, the plate sealing gasket 93 can form a soundproof sealing cavity that surrounds the speaker 50 between the device panel 11 and the device back panel 21, and the microphone 60 can be located outside the soundproof sealing cavity.

[0117] Please pay special attention Figure 2 and Figure 3 In an embodiment of this application, the circuit board module 40 may have a clearance hole 41, and the speaker 50 extends from the side of the circuit board module 40 facing the device panel 11 through the clearance hole 41 and into the side of the circuit board module 40 facing the device back plate 21. In this case, the mounting gasket 93 may include a first mounting gasket 931 and a second mounting gasket 932, wherein:

[0118] The first panel sealing gasket 931 seals the surround speaker 50 and the clearance plate hole 41. The first panel sealing gasket 931 is stacked between the circuit board module 40 and the device panel 11. For example, the inner surface of the device panel 11 facing the device back plate 21 may have panel ribs 112 that seal the surround speaker sound-permeable mesh 110. The first panel sealing gasket 931 may be stacked between the circuit board module 40 and the panel ribs 112.

[0119] The second mounting plate sealing gasket 932 closes the surrounding clearance plate hole 41, and the second mounting plate sealing gasket 932 is stacked between the circuit board module 40 and the device back plate 21. For example, the inner surface of the back plate facing the device panel 11 of the device back plate 21 may have a back plate rib 212. The back plate rib 212 closes the alignment area of ​​the surrounding panel rib 112 in the device back plate 21, and the second mounting plate sealing gasket 932 may be stacked between the circuit board module 40 and the back plate rib 212.

[0120] Thus, the soundproof sealing cavity formed by the plate sealing gasket 93 can extend from the equipment panel 11 through the clearance plate hole 41 to the equipment back plate 21.

[0121] In embodiments of this application, the sealing medium for absorbing vibrations generated by the speaker 50 during operation may further include a housing gasket 92 (e.g., a silicone gasket). The size of the housing gasket 92 may be adapted to the size of the opening formed by the periphery of the panel 12 and the periphery of the back panel 22, and the housing gasket 92 may seal and fill the mating gap between the periphery of the panel 12 and the periphery of the back panel 22.

[0122] The sealing medium includes the housing gasket 92, which provides sealing protection for the entire cavity of the housing surrounded by the first housing 10 and the second housing 20.

[0123] In the embodiments of this application, in order to avoid damaging the sealing characteristics of the housing gasket 92 (e.g., the continuity of the extension of the housing gasket 92 along the butt joint between the panel periphery 12 and the back plate periphery 22), the assembly of the first housing 10 and the second housing 20 can be achieved by using the fixed connection between the device panel 11 and the device back plate 21. One possible implementation is as follows:

[0124] The device panel 11 may have a first mounting hole post 117 on the inner surface of the panel facing the device back plate 21, and the device back plate 21 may have a second mounting hole post 217 on the inner surface of the back plate facing the device panel 11. The positions of the first mounting hole post 117 and the second mounting hole post 217 are corresponding. The first housing 10 and the second housing 20 may be assembled using a first screw 81 that passes through the first mounting hole post 117 and the second mounting hole post 217.

[0125] For example, the first mounting post 117 may have a through hole for the device panel 11, and the second mounting post 217 may have a threaded blind hole that does not penetrate to the outer surface of the device back plate 21 facing away from the device panel 11. When the device panel 11 and the device back plate 21 are opposite to each other, the positions of the first mounting post 117 and the second mounting post 217 correspond (for example, the first mounting post 117 may be located outside the sound insulation sealing cavity formed by the plate sealing gasket 93). Thus, by using the first screw 81 to pass through the through hole of the first mounting post 117 and screw it into the threaded blind hole of the second mounting post 217, the assembly of the first housing 10 and the second housing 20 can be realized.

[0126] When the first housing 10 and the second housing 20 are assembled using first screws 81 passing through the first mounting post 117 and the second mounting post 217, the sealing medium for absorbing the vibration generated by the speaker 50 during operation may also include a post sealing gasket 97 (e.g., a silicone gasket). The size of the post sealing gasket 97 may be adapted to the radial dimension of the ends of the first mounting post 117 and the second mounting post 217. Furthermore, the post sealing gasket 97 may be pressed between the ends of the first mounting post 117 and the second mounting post 217 so that the ends of the first mounting post 117 and the second mounting post 217 may also be sealed together by the post sealing gasket 97.

[0127] In addition, in the illustrations of the embodiments of this application, four pairs of first assembly hole posts 117 and second assembly hole posts 217 are used as an example. In this case, two pairs (e.g., two pairs diagonally distributed) of the first assembly hole posts 117 and second assembly hole posts 217 can also be positioned and fitted by mutual insertion.

[0128] Furthermore, the assembly between the first mounting post 117 and the second mounting post 217 ensures that the relative position between the first housing 10 and the second housing 20 satisfies the following conditions:

[0129] While sealing the panel gasket 93 in contact with the equipment panel 11 and the equipment back plate 21, it also retains an elastic deformation allowance for absorbing vibration.

[0130] While sealing the housing gasket 92 in contact with the periphery of the panel 12 and the periphery of the back panel 22, it also retains an elastic deformation allowance for absorbing vibration.

[0131] In other words, the strong sound source of the speaker 50 in the inner cavity of the housing, as well as the ambient noise in the environment where the electronic device is located, are also the causes of the noise collected by the microphone 60. However, based on the above structure, the isolation and noise reduction between the microphone 60 and the speaker 50 can be achieved by using the plate sealing gasket 93 provided in the electronic device (i.e., to prevent the microphone 60 from collecting the strong sound source of the speaker 50 in the inner cavity of the housing), and / or, the isolation and noise reduction between the microphone 60 and the outside of the device housing can be achieved by using the housing sealing gasket 92 provided in the electronic device (i.e., to reduce or even prevent the microphone 60 from collecting ambient noise from other directions except for the pickup hole 220 opened in the second housing 20). Thus, the noise collected by the microphone caused by the sound wave interference generated by the speaker and the external environment can be reduced.

[0132] In the embodiments of this application, in addition to the sealing medium between the first housing 10 and the second housing 20 for absorbing the vibration generated by the speaker 50 during operation, a sealing medium (such as silicone or foam, which has elastic deformation allowance in the assembled state) for absorbing the vibration generated by the speaker 50 during operation may also be provided between the speaker 50 and the first housing 10, and / or between the pickup 60 and the second housing 20. For example, the sealing medium between the speaker 50 and the first housing 10 may include a speaker sealing gasket 91 (e.g., a silicone sealing gasket), and the sealing medium between the pickup 60 and the second housing 20 may include foam and / or adhesive.

[0133] Figure 4 For example Figure 1 A schematic diagram illustrating the component division of the electronic device in the illustrated embodiment. Please refer to [link / reference]. Figure 4 In the embodiments of this application, the electronic device can adopt a modular assembly form, wherein the first housing 10 and the components installed in the first housing 10 can be regarded as a panel assembly M1, and the second housing 20 and the components installed in the second housing 20 can be regarded as a back panel assembly M2. The different assembly modules will be described in detail below.

[0134] Figure 5 For the basis of Figure 4 The diagram shows the assembly relationship of the panel components. Please refer to [link / reference needed]. Figure 4 At the same time, further combine Figure 5 The panel assembly M1 may include a first housing 10, a speaker 50, and the aforementioned speaker sealing gasket 91. As an optional optimization, the panel assembly M1 may also include the aforementioned power button 17, a light guide module 15, and a flexible light-shielding medium 16, which will be described later. Figure 5 The lead frame shows the structure of the inner side of the device panel 11 facing the device back plate 21.

[0135] As mentioned above, the device panel 11 of the first housing 10 may have a sound-permeable mesh 110. In this case, the sound-permeable surface of the speaker 50 faces the sound-permeable mesh 110, and a speaker gasket 91 (e.g., a silicone gasket) is stacked between the speaker 50 and the device panel 11. The speaker gasket 91 can be used as a sealing medium to absorb the vibrations generated by the speaker 50 during operation.

[0136] Furthermore, in addition to its damping function between the speaker 50 and the first housing 10, the speaker sealing gasket 91 can also seal and isolate the speaker cavity between the sound-emitting surface surrounding the speaker 50 and other areas within the housing by enclosing the sound-emitting cavity between the sound-emitting surface and the sound-transmitting mesh 110. Preferably, the thickness of the speaker sealing gasket 91 can be within a range of greater than or equal to 1 mm and less than or equal to 2 mm, so that the space occupied by the sound-emitting cavity is minimized.

[0137] Additionally, the device panel 11 may have a limiting flange 111 surrounding the speaker grille 110, and the speaker gasket 91 is bonded to the device panel 11 within the area surrounded by the limiting flange 111. Preferably, the fit tolerance between the speaker gasket 91 and the limiting flange 111 can be 0.1 mm. In this case, the speaker 50 can be fixed to the device panel 11 with the sound-emitting surface facing the speaker grille 110 using a second screw 82 that penetrates the speaker gasket 91.

[0138] from Figure 2 as well as Figure 4 and Figure 5 As can be seen, the device panel 11 may also have button through-holes 114. Correspondingly, the button contact area (e.g., exposed copper area) of the circuit board module 40 in the back panel assembly M2 may be equipped with a flexible conductive medium 44 (e.g., foam), and the flexible conductive medium 44 is inserted into the button through-holes 114. In this case, the aforementioned touch key 14 can cover the outer surface of the device panel 11 facing away from the device back panel 21 and cover the button through-holes 114. Thus, the pressing pressure applied by the user to the touch key 14 can cause the touch key 14 to undergo elastic deformation, and the touch key 14 can transmit the pressing pressure through the flexible conductive medium 44 to the button contacts of the circuit board module 40 through elastic deformation, thereby realizing button operation of the electronic device.

[0139] In the illustrated representation of the embodiments of this application, taking the key through hole 114 located in the sound insulation sealing cavity formed by the panel sealing gasket 93 (i.e., located in the closed surrounding area of ​​the panel rib 112) as an example, in this case, in order to avoid damaging the sealing performance of the sound insulation sealing cavity, the touch key 14 installed on the outer surface of the panel 11 facing away from the back panel 21 can be sealed and covered by means such as adhesive.

[0140] Furthermore, to provide multiple button functions, the button through-holes 114, the flexible conductive medium 44, and the button contact areas of the circuit board module 40 can all be configured to have multiple functions. For example, in the illustrated representation of this application, four buttons are used for the button through-holes 114, the flexible conductive medium 44, and the button contact areas of the circuit board module 40, respectively corresponding to the four button operation functions of the speaker 50 (on / off), the speaker 50 (volume up), the speaker 50 (volume down), and the microphone 60 (on / off). In this case, the size of the touch key piece 14 can be designed to cover multiple button through-holes 114. Moreover, by utilizing the local deformation of the local area corresponding to each button through-hole 114, the touch key piece 14 can independently trigger different button operation functions through the corresponding flexible conductive medium 44 and the corresponding button output area of ​​the circuit board module 40. Thus, while taking into account the independent operation of multiple buttons, the overall sealing coverage of multiple button through-holes 114 by a single touch key piece 14 can also ensure the sealing of multiple button through-holes 114.

[0141] from Figure 2 as well as Figure 4 and Figure 5 It can also be seen that the device panel 11 may have a panel light hole 115, and a light guide of the light guide module 15 is inserted into the panel light hole 115. For example, the light guide module 15 can be glued to the inner surface of the device panel 11 facing the device back plate 21 with adhesive, so that the end of the light guide is inserted into the panel light hole 115. Furthermore, the circuit board module 40 in the back plate assembly M2 can be connected to the light guide module 15 through a flexible cable.

[0142] In the illustrated representation of the embodiments of this application, the panel light hole 115 and the key through hole 114 are located together in the soundproof sealing cavity formed by the panel sealing gasket 93 (that is, in the closed surrounding area of ​​the panel rib 112). In this case, the touch key 14 has an opening that avoids the panel light hole 115.

[0143] Furthermore, the number of panel light holes 115 and the number of light guides included in the light guide module 15 can also be set to multiple. The light emission state (i.e., on or off state) of the light guides inserted into each panel light hole 115 of the light guide module 15 is used to generate a visual prompt representing the operating status of the electronic device. In order to avoid light pollution between the light guides inserted into adjacent panel light holes 115 of the light guide module 15, in the embodiments of this application, the panel assembly M1 may also include a flexible light-shielding medium 16 such as foam. The flexible light-shielding medium 16 can be installed in the light guide module 15 to form a light-shielding barrier between all the light guides of the light guide module 15. The circuit board module 40 can squeeze the flexible light-shielding medium 16 from the end of the light guide module 15 facing away from the device panel 11 to prevent the flexible light-shielding medium 16 from falling off. In addition, the flexible light-shielding medium 16 will not create a rigid fit between the circuit board module 40 and the device panel 11.

[0144] In embodiments of this application, the electronic device may further include a panel mesh 13. Although the panel mesh 13 and the touch key 14 are both mounted on the device panel 11 of the first housing 10, the panel mesh 13 and the touch key 14 can be regarded as appearance components independent of the panel assembly M1.

[0145] The panel mesh 13 can be attached to the outer surface of the device panel 11 facing away from the device back panel 21. The panel mesh 13 can be a plastic mesh made of materials such as PC (Polycarbonate), and it can have a cutout area that complements the touch key 14. To ensure the aesthetic appearance of the splicing between the panel mesh 13 and the touch key 14, the outer surface of the device panel 11 facing away from the device back panel 21 can also have an outer flange 116 surrounding the area where the key through holes 114 and panel light holes 115 are located. The outer contour of the touch key 14 can be the same as the inner contour of the outer flange 116, and the cutout area of ​​the panel mesh 13 can be the same as the outer contour of the outer flange 116. Thus, the attachment of the panel mesh 13 and the touch key 14 to the outer surface of the device panel 11 facing away from the device back panel 21 can be based on the outer flange 116 as the positioning reference.

[0146] In this embodiment of the application, the periphery 12 of the panel may be provided with at least one peripheral elongated hole 121 (two peripheral elongated holes 121 are shown as an example in the figure). The peripheral elongated hole 121 may extend in a direction parallel to the device panel 11. Furthermore, the switch module 17 is installed at the peripheral elongated hole 121 to form the periphery 12 of the panel. The switch module 17 may include a switch base 171 and a switch button 172 mounted on the switch base 171. For example, the switch button may be a switch element such as a TPU (Thermoplastic Urethane) switch. The number of switch buttons 172 in the switch module 17 is equal to the number of peripheral elongated holes 121. When the switch base 171 is mounted on the inner side of the panel perimeter 12, each switch button 172 included in the switch module 17 can protrude beyond the panel perimeter 12 through the corresponding peripheral elongated hole 121, so that the switch button 172 can be operated by the user within the length range of the peripheral elongated hole 121 to realize operations such as turning the electronic device on or off.

[0147] Accordingly, the circuit board module 40 may include switch contacts 47 corresponding to each on / off button 172 of the switch module 17. In order to ensure the reliability of the contact between the on / off button 172 and the switch contact 147, the gap distance between each on / off button 172 of the switch module 17 and the switch contact 147 of the circuit board module 40 is less than or equal to a preset effective contact distance (e.g., 0.2 mm).

[0148] Furthermore, the inner side of the panel periphery 12 may have a pair of limiting protrusions 122, and the switch base 171 of the switch module 17 may be clamped between the pair of limiting protrusions 122, so that the power button 17 can achieve limiting constraint in the direction parallel to the device panel 11 by means of limiting cooperation with the panel periphery 12, and the circuit board module 40 can form limiting constraint on the power button 17 in the direction perpendicular to the panel periphery 12.

[0149] Figure 6 For example Figure 4 This diagram illustrates the assembly relationship of the backplane components in a modular, semi-disassembled structure. Please refer to [link / reference]. Figure 4 At the same time, further combine Figure 6 The backplane assembly M2 may include a second housing 20, a circuit board module 40, a microphone 60, the aforementioned flexible conductive medium 44, the aforementioned housing gasket 92 and mounting gasket 93, and a battery module 43 for providing power to the electronic device. As a further preferred embodiment, the backplane assembly M2 may also include an interface connector 25 and a physical interface 26, which will be described in detail later. Figure 6 The lead frame shows the structure of the device back plate 21 facing the inner side of the device panel 11.

[0150] In the embodiments of this application, the first adhesive sealing gasket 931 of the board sealing gasket 93 can be adhered to the surface of the circuit board module 40 facing the device panel 11 using an adhesive medium such as adhesive backing, and the second adhesive sealing gasket 932 can be adhered to the surface of the circuit board module 40 facing the device back plate 21 using an adhesive medium such as adhesive backing. Preferably, both sides of the circuit board module 40 facing the device panel 11 and facing the device back plate 21 can have silkscreen printing for marking the adhesion position, so as to facilitate the adhesion and positioning of the first adhesive sealing gasket 931 and the second adhesive sealing gasket 932. Moreover, the device back plate 21 can have a mounting hole seat 211, and the circuit board module 40 with the adhesive sealing gasket 93 can be fixedly mounted on the device back plate 21 by a third screw 83 passing through the mounting post 214.

[0151] The mounting area of ​​the circuit board module 40 on the device back panel 21 can cover the mounting area of ​​the speaker 50 on the device front panel 11 (i.e., the area where the speaker sound transmission mesh 110 is located and is enclosed and surrounded by the panel ribs 112). That is, the mounting area of ​​the circuit board module 40 on the device back panel 21 can extend beyond the area enclosed and surrounded by the back panel ribs 212, and the mounting post 214 can be located outside the area enclosed and surrounded by the back panel ribs 212.

[0152] In this case, the microphone 60 is mounted on the device back panel 21 outside the area where the circuit board module 40 is located. For example, in the embodiments of this application, the number of microphones 60 can be set to at least two (four are shown in the illustration). The mounting positions of at least two microphones 60 on the device back panel 21 can be close to the corners of the rectangular device back panel 21, so that at least two microphones 60 surround the speaker 50 in the inner cavity of the housing. Furthermore, the distances between at least two microphones 60 and the speaker 50 are not all the same, thereby realizing a non-linear array arrangement of at least two microphones 60 relative to the speaker 50. This non-linear array arrangement also helps to reduce the noise collected by the microphones 60.

[0153] In the embodiments of this application, the second housing 20 may have a pickup hole 220 and a pickup insertion slot 210 communicating with the pickup hole 220. The pickup 60 can be fixedly installed in the second housing 20 by inserting and engaging with the pickup insertion slot 210.

[0154] In the illustrated representation of the embodiments of this application, taking the example of a pickup hole 220 opened on the periphery 22 of the back panel, a pickup slot 210 on the device back panel 21, and both the pickup slot 210 and the pickup 60 inserted into the pickup slot 210 being adjacent to the periphery 22 of the back panel, in this case, the pickup direction of the pickup 60 intersects with the sound-transmitting mesh 110 of the speaker 50 facing the sound-transmitting mesh 110 of the device panel 11. Therefore, the noise collected by the pickup 60 can be reduced by setting the pickup direction of the pickup 60 to intersect with the sound-transmitting direction of the speaker 50.

[0155] In this embodiment, to further improve the sealing and isolation between the pickup cavity of the pickup 60 and the speaker 50, the pickup 60 can utilize the interference connection between the pickup sealing gasket 96 (such as foam) and the pickup insertion slot 210. The opening of the pickup insertion slot 210 in the inner cavity of the housing can be sealed with adhesive, and the adhesive seal avoids obstructing the pickup cavity between the pickup surface of the pickup 60 and the pickup hole 220. Furthermore, the interference connection between the pickup sealing gasket 96 and the pickup insertion slot 210, as well as the adhesive application at the pickup insertion slot 210, can also prevent the pickup hole 220 from compromising the overall sealing of the inner cavity of the housing.

[0156] from Figure 6 It can also be seen that the inner surface of the device back plate 21 facing the device panel 11 can also be provided with a support rib 213 in the adjacent area of ​​the location of the circuit board module 40. The support rib 213 can have a conformal notch adapted to the outer contour shape of the battery module 43. For example, in the illustrated representation of the embodiment of this application, the battery module 43 includes a cylindrical battery. Correspondingly, the conformal notch of the support rib 213 can be an arc shape adapted to the outer cylindrical surface of the cylindrical battery. Thus, the battery module 43 can be placed at the conformal notch of the support rib 213, and the battery module 43 can be electrically connected to the circuit board module 40 through a flexible cable. Please review again. Figure 5 The inner surface of the device panel 11 facing the device back plate 21 may have an auxiliary rib 113 corresponding to the position of the support rib 213. The auxiliary rib 113 may have a break for avoiding the battery module 43. Thus, when the device panel 11 and the device back plate 21 are opposite to each other, the battery module 43 placed at the conformal notch of the support rib 213 may be simultaneously located in the break of the auxiliary rib 113, thereby achieving the coordinated positioning of the battery module 43 in the inner cavity of the housing by the auxiliary rib 113 and the support rib 213.

[0157] In the embodiments of this application, the outer periphery of the back panel 22 may have a circumferentially convex positioning edge 225. The housing sealing gasket 92 may be attached to the outer periphery of the back panel 22 with the positioning edge 225 as the positioning reference. Thus, when the panel periphery 12 and the back panel periphery 22 are mated and engaged around the inner cavity of the housing between the device panel 11 and the device back panel 21, the housing sealing gasket 92 may be squeezed between the edge of the panel periphery 12 and the positioning edge 225 of the back panel periphery 22 to form a shock-absorbing seal between the first housing 10 and the second housing 20 for absorbing the vibration of the speaker 50.

[0158] In embodiments of this application, if the electronic device has external connection requirements, such as communication requirements with other devices such as user terminals, the inner surface of the back panel 21 facing the device panel 11 may have a connector mounting base 215. The connector mounting base 215 is used to fix the interface connector 25. The interface connector 25 can be electrically connected to the circuit board module 40. Furthermore, the interface mounting base 215 has a cable pass hole for connecting the interface connector 25 to a physical interface 26 outside the device housing via a flexible external cable. For example, the physical interface 26 may be a USB (Universal Serial Bus) interface, and the interface connector 25 may be a USB bus connector.

[0159] In the illustrated representation of the embodiments of this application, taking the interface mounting base 215 located in the soundproof sealing cavity formed by the plate sealing gasket 93 (i.e., located in the closed surrounding area of ​​the back plate rib 212) as an example, in this case, the interface connector 25 is sealed with adhesive on the interface mounting base 215 to avoid damaging the sealing performance of the soundproof sealing cavity due to supporting wireless communication between electronic devices and other devices.

[0160] Please review Figures 1 to 4 In an embodiment of this application, the electronic device may optionally include a device base 30, which, in addition to preventing the device back plate 21 of the second housing 20 from directly and rigidly contacting a carrier such as a desktop or wall, can also be used to provide further sealing protection for the device back plate 21.

[0161] Figure 7 For the basis of Figure 4 The diagram shows the assembly relationship between the backplane assembly and the device base, divided into components. Please refer to further details. Figure 7As mentioned above, the device back panel 21 may have a mounting hole seat 211, and the mounting hole seat 211 is located within the soundproof sealing cavity formed by the panel sealing gasket 93 (i.e., the area surrounding the back panel rib 212). If the electronic device further includes a device base 30, the device base 30 may be fixedly mounted on the outer surface of the back panel 21 facing away from the device panel 11 by a fourth screw 84 passing through the mounting hole seat 211. For example, the surface of the device base 30 facing the device back panel 21 may have a threaded blind hole 31 for threaded engagement with the fourth screw 84. Based on such an assembly structure, the device back panel 30 can cover the area of ​​the device back panel 21 with the mounting hole seat 211. Figure 7 The lead frame shows the structure of the outer side of the device backplate 21 facing away from the device panel 11.

[0162] Furthermore, if the electronic device further includes a device base 30, then in order to further improve the sealing performance of the device back panel 21, the back panel assembly M2 may also include a back panel sealing gasket 94. The back panel sealing gasket 94 can be bonded to the outer surface of the back panel 21 facing away from the device panel 11 using an adhesive medium such as adhesive backing. The back panel sealing gasket 94 closes and surrounds the mounting hole seat 211. When the device base 30 is mounted on the device back panel 21, the back panel sealing gasket 94 is stacked between the device base 30 and the device back panel 21. That is, a back panel sealing gasket 94 that closes and surrounds the mounting hole seat 211 can be stacked between the device base 30 and the device back panel 21 to achieve sealing protection of the area where the mounting hole seat 211 is located at the gap between the device base 30 and the device back panel 21. At the same time, it can also minimize the transmission of external vibrations through the device base 30 to the second housing 20 where the microphone 60 is located. In addition, to avoid damaging the sealing of the back panel gasket 94, the connector mounting base 215 for the flexible external cable leading out of the physical interface 26 can be located outside the surrounding area of ​​the back panel gasket 94, and the physical interface 26 can be squeezed and limited between the device base 30 and the device back panel 21.

[0163] For example, the outer surface of the back panel 21 facing away from the device panel 11 may have a limiting boss 218. The mounting hole seat 211 may be deployed inside the limiting boss 218 and pass through the limiting boss 218. The connector mounting seat 215 may be deployed outside the limiting boss 218 and have a preset distance from the limiting boss 218. In this case, the back panel sealing gasket 94 surrounds the limiting boss 218 and abuts against the outer contour edge of the limiting boss 218 and avoids the connector mounting seat 215 outside the limiting boss 218.

[0164] For example, the equipment base 30 may have a crimped rib frame 32, which is in sealing contact with the back plate sealing gasket 94. Preferably, the inner contour of the crimped rib frame 32 can be adapted to the outer contour of the limiting boss 218 to seal and crimp the back plate sealing gasket 94 that is attached to the outer contour edge of the limiting boss 218. In addition, the limiting boss 218, the back plate sealing gasket 94 and the crimped rib frame 32 may be provided with anti-fool chamfers so that the equipment base 30 and the equipment back plate 21 can maintain a specified relative position.

[0165] For example:

[0166] The outer surface of the back plate 21 facing away from the equipment panel 11 may have a positioning groove 219. The positioning groove 219 may be located inside the limiting boss 218. In order to meet the equal wall thickness requirement when the mold of the second housing 20 to which the back plate 21 belongs is formed, the positioning groove 219 may be arched on the inner surface of the back plate 21 facing the equipment panel 11.

[0167] Accordingly, the device base 30 may have a positioning protrusion 39 protruding towards the device backplate 21, which is used to fit and insert into the positioning groove 219 of the device backplate 21. In this case, a wireless communication adapter 36 may be accommodated in the cavity of the positioning protrusion 39 facing away from the device backplate 21. The wireless communication adapter 36 may be covered by an elastic material such as TPU, and the wireless communication adapter 36 may be clamped between the opposite side walls of the cavity of the positioning protrusion 39. When the wireless communication adapter 36 is needed, it can be removed from the cavity of the positioning protrusion 39 and inserted into the physical interface 26 that is squeezed and limited between the device backplate 21 and the device base 30. In addition, similar to the wireless communication adapter 36, the physical interface 26 may also be covered by an elastic material such as TPU to facilitate clamping between the device backplate 21 and the device base 30.

[0168] As a further optimization, in the embodiments of this application, the surface of the device base 30 facing away from the device back plate 21 is covered with a base damping pad 95, such as foam. For example, the surface of the device base 30 facing away from the device back plate 21 may have a limiting annular groove 35, and the base damping pad 95 may be bonded to the limiting annular groove 35 using an adhesive medium such as adhesive backing.

[0169] In actual manufacturing, all structural features of the first housing 10 for modular assembly, the structural features of the second housing 20 for modular assembly, and the structural features of the equipment base 30 can be designed to facilitate mold opening, so as to facilitate the mass production of the equipment housing mold.

[0170] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. An electronic device integrating a speaker and a pickup, characterized in that, include: A first housing (10) includes a device panel (11). A loudspeaker (50) is fixedly mounted on the device panel (11). The second housing (20) includes a device backplate (21); A microphone (60) is fixedly mounted on the back panel (21) of the device. A circuit board module (40) is electrically connected to the speaker (50) and the pickup (60) via a flexible cable; in: The first housing (10) and the second housing (20) are assembled and connected. The speaker (50), the pickup (60) and the circuit board module (40) are located in the inner cavity of the housing surrounded by the first housing (10) and the second housing (20). The speaker (50) is separated from the second housing (20), and the pickup (60) is separated from the first housing (10). A sealing medium for absorbing the vibration generated by the speaker (50) during operation is provided between the first housing (10) and the second housing (20). The circuit board module (40) has a clearance plate hole (41), and the speaker (50) extends from the side of the circuit board module (40) facing the device panel (11) through the clearance plate hole (41) to the side of the circuit board module (40) facing the device back plate (21). The device panel (11) has a panel rib (112) on the inner surface of the panel facing the device back plate (21) that encloses and surrounds the sound-permeable mesh (110). The device back plate (21) has a back plate rib (212) on the inner surface of the back plate facing the device panel (11). A first panel sealing gasket (931) is stacked between the circuit board module (40) and the panel rib (112). A second panel sealing gasket (932) is stacked between the circuit board module (40) and the back plate rib (212) to form a soundproof sealing cavity that extends from the device panel (11) through the clearance plate hole (41) to the device back plate (21) and encloses and surrounds the speaker (50). The microphone (60) is located outside the soundproof sealing cavity.

2. The electronic device according to claim 1, characterized in that, The first housing (10) further includes a panel periphery (12) surrounding the device panel (11), and the second housing (20) further includes a back plate periphery (22) surrounding the device back plate (21). The device panel (11) and the device back plate (21) are arranged at intervals on opposite sides of the housing cavity, and the panel periphery (12) and the back plate periphery (22) are mated and engaged around the housing cavity.

3. The electronic device according to claim 2, characterized in that, The microphone (60) is adjacent to the periphery (22) of the back plate, and the periphery (22) of the back plate is provided with a pickup hole (220).

4. The electronic device according to claim 1, characterized in that, The first panel sealing gasket (931) seals around the speaker (50) and the clearance plate hole (41); and, The second plate sealing gasket (932) closes the hole (41) around the clearance plate.

5. The electronic device according to claim 1, characterized in that, The first housing (10) has the sound-transmitting mesh (110), and the sound-emitting surface of the loudspeaker (50) faces the sound-transmitting mesh (110). The back plate rib (212) encloses the area around the panel rib (112) in the alignment region of the device back plate (21).

6. The electronic device according to claim 5, characterized in that, A speaker gasket (91) is stacked between the speaker (50) and the first housing (10), and the speaker gasket (91) closes the sound cavity between the sound-emitting surface surrounding the speaker (50) and the sound-emitting mesh (110).

7. The electronic device according to claim 1, characterized in that, It also includes a device base (30), the device back plate (21) has a mounting hole seat (211), and the device base (30) is fixedly mounted on the outer surface of the back plate (21) facing away from the device panel (11) by screws passing through the mounting hole seat (211), the mounting hole seat (211) is located in the soundproof sealing cavity, and a back plate sealing gasket (94) is stacked between the device base (30) and the device back plate (21) to close and surround the mounting hole seat (211). The device back plate (21) has a limiting boss (218) on its outer surface facing away from the device panel (11). The mounting hole seat (211) passes through the limiting boss (218). The back plate sealing gasket (94) surrounds the limiting boss (218). The device base (30) has a crimped rib frame (32). The crimped rib frame (32) is in sealing contact with the back plate sealing gasket (94).

8. The electronic device according to claim 1, characterized in that, The device panel (11) has a first mounting post (117) on the inner surface of the panel facing the device back plate (21), and the device back plate (21) has a second mounting post (217) on the inner surface of the back plate facing the device panel (11). The first mounting post (117) and the second mounting post (217) are positioned opposite each other. The first housing (10) and the second housing (20) are assembled by screws passing through the first mounting post (117) and the second mounting post (217). The sealing medium also includes a post sealing gasket (97), which is pressed between the ends of the first mounting post (117) and the second mounting post (217). The first housing (10) further includes a panel periphery (12) surrounding the device panel (11), and the second housing (20) further includes a back panel periphery (22) surrounding the device back panel (21). The panel periphery (12) and the back panel periphery (22) are mated and fitted around the inner cavity of the housing between the device panel (11) and the device back panel (21). The sealing medium further includes a housing sealing gasket (92), which seals and fills the mating gap between the panel periphery (12) and the back panel periphery (22).

9. The electronic device according to claim 1, characterized in that, The second housing (20) has a pickup hole (220) and a pickup slot (210) communicating with the pickup hole (220). The pickup (60) is inserted into the pickup slot (210) by interference of the pickup sealing gasket (96). The opening of the pickup slot (210) in the inner cavity of the housing is sealed with adhesive, and the adhesive seal avoids the pickup cavity between the pickup surface of the pickup (60) and the pickup hole (220).

10. The electronic device according to claim 1, characterized in that, At least two of the pickups (60) surround the speaker (50) within the housing cavity, and the distances between at least two of the pickups (60) and the speaker (50) are not all the same.

Images