A new type of electroplated chip appearance defect detection device and its detection method

Abstract

The present invention relates to the technical field of electroplated chip appearance detection, and specifically, to a new type of electroplated chip appearance defect detection equipment and a detection method thereof. It includes an equipment body, where a loading device, a detection device, a marking device and a unloading device are arranged in sequence along the horizontal lateral direction at the equipment body; a discharge track for transporting electroplated chip strips is formed in the horizontal lateral direction at the loading device, a detection track connected to the discharge track is formed at the detection device, and a detection component for performing appearance defect detection on the electroplated chip strip is arranged at the detection track; specifically, the electroplated chip strip is in the shape of a long strip and the material is hard; therefore, it is preferred to use the discharge track, the detection track, the marking track and the unloading track arranged in sequence along the horizontal lateral direction to transport the electroplated chip strip throughout the entire process; thereby making the layout of the entire equipment more compact and convenient for subsequent detection personnel to perform stable timing control for each stage.

Description

Technical Field

[0001] The present invention relates to the technical field of electroplating chip appearance detection, and in particular to a novel electroplating chip appearance defect detection device and a detection method thereof. Background Art

[0002] Before electroplated chips are put into use, they usually need to be inspected for appearance defects to eliminate defective products with substantial defects in appearance.

[0003] In the prior art, the commonly used detection methods for electroplated chips are mostly manual detection or detection using more general detection equipment. The detection efficiency of manual detection is low. At the same time, since most electroplated chips are in strip shape and made of hard materials, the appearance detection equipment commonly used in the prior art is difficult to be directly applied to electroplated chips.

[0004] Therefore, the prior art lacks a complete set of equipment that can efficiently and stably detect the appearance defects of electroplated chips from loading to the end of testing and complete sorting and unloading. Summary of the invention

[0005] The present invention provides a novel electroplating chip appearance defect detection device, which can overcome certain defects of the prior art.

[0006] According to the present invention, a new type of electroplated chip appearance defect detection equipment includes an equipment body, on which a loading device, a detection device, a marking device and a unloading device are arranged in sequence along a horizontal lateral direction; a discharging track for transporting electroplated chip strips is formed along a horizontal lateral direction at the loading device, a detection track connected to the discharging track is formed at the detection device, and a detection component for performing appearance defect detection on the electroplated chip strips is arranged at the detection track; a marking track co-linearly connected to the detection track is formed at the marking device; a marking component for marking the electroplated chip strips based on the detection results of the detection component is arranged at the marking track; a unloading track co-linearly connected to the marking track for transporting electroplated chip strips is formed at the unloading device.

[0007] Further, based on the above equipment body, the inspector can inspect the electroplated chip strips by the following inspection methods;

[0008] Step 1: The inspector places the electroplated chip strip to be inspected on the discharge track of the loading device;

[0009] Step 2: The electroplated chip strip to be inspected enters the inspection track via the discharge track, and is inspected for appearance defects by the inspection component at the inspection track;

[0010] Step 3: The electroplated chip strip to be detected after being detected by the detection component enters the marking track via the detection track, and at the marking component, a qualified or unqualified mark is made on the electroplated chip strip according to the detection result obtained by the detection component in Step 2.

[0011] Step 4: The electroplated chip strip after marking enters the blanking track via the marking track, and is sorted and blanked at the blanking track.

[0012] Specifically, the electroplated chip strip is long and hard in material; therefore, preferably, an outlet track, a detection track, a marking track, and a blanking track arranged horizontally in sequence are used to transport the electroplated chip strip throughout the process; thus, the layout of the entire device is more compact and facilitates subsequent inspectors to perform stable timing control for each stage.

[0013] Preferably, the loading device includes a loading device main body. Along the horizontal direction, a pushing mechanism, a loading mechanism, and an outlet mechanism are arranged in sequence at the loading device main body. The loading mechanism is used to stack electroplated chip strips vertically at intervals. An outlet track along the horizontal direction is formed at the outlet mechanism; the pushing mechanism is used to push the electroplated chip strips located at the loading mechanism into the outlet track one by one along the horizontal direction.

[0014] Preferably, the loading mechanism includes a cuboid-shaped loading magazine and a loading lifting linear module (selected as a lead screw type) for lifting the loading magazine in the vertical direction. A plurality of loading placement positions are formed at intervals in the vertical direction at the loading magazine. The electroplated chip strips can be placed horizontally at the loading placement positions, and the electroplated chip strips and the loading placement positions are slidably matched along the horizontal direction; the loading lifting linear module includes a loading lifting slider that slides in the vertical direction. A loading lifting support frame for placing the loading magazine is connected to the loading lifting slider. The uppermost end and the lowermost end of the loading lifting slider during vertical movement respectively form an upper limit and a lower limit.

[0015] Preferably, the loading lifting support frame includes a loading lifting baffle formed in the vertical direction and a loading lifting horizontal plate formed in the horizontal direction. The loading lifting baffle is used for abutting and cooperating with the vertical side wall of the loading magazine, and the loading lifting horizontal plate is used for cooperating with the horizontal bottom wall of the loading magazine to form a support; strip-shaped limiting grooves are recessed horizontally on the inner sides of the two vertical side walls of the loading magazine. The limiting grooves at the same height on the two side walls are used to cooperate to form a loading placement position; a plurality of loading placement positions are linearly distributed at intervals in the vertical direction, and the vertical interval distance between adjacent loading placement positions is consistent with the single movement distance of the loading lifting linear module in the vertical direction.

[0016] Preferably, a loading section magazine conveying assembly for conveying the loading magazine and a loading section magazine pushing-out assembly for recycling the loading magazine are also arranged at the main body of the loading device. The loading section magazine conveying assembly includes a loading section magazine conveying belt arranged horizontally longitudinally. One end in the conveying direction of the loading section magazine conveying belt forms a loading section full magazine loading position, which is used to receive the loading magazine full of electroplated chip strips. The other end in the conveying direction of the loading section magazine conveying belt is used to cooperate with the loading lifting support frame to convey the loading magazine to the loading lifting support frame when the loading lifting slider is at the lower limit position.

[0017] The loading section magazine pushing-out assembly includes a loading section magazine pushing-out track and a loading section magazine pushing-out cylinder arranged horizontally longitudinally. One end in the conveying direction of the loading section magazine pushing-out track forms a loading section empty magazine receiving position, which is used to receive the empty loading magazine after the electroplated chip strips have all been pushed out. The other end in the conveying direction of the loading section magazine pushing-out track forms a loading section magazine discharging position, which is used for manual or machine collection of the empty loading magazine. The piston rod of the loading section magazine pushing-out cylinder is arranged horizontally longitudinally and movably. One end of the piston rod close to the loading section magazine pushing-out track is connected with a loading section magazine pushing plate. The loading section magazine pushing plate moves horizontally longitudinally along with the piston rod and is used to push the empty loading magazine located at the loading section empty magazine receiving position to the loading section empty magazine receiving position.

[0018] Preferably, the pushing mechanism includes a blanking device and a pushing gear-rack module. The blanking device includes a blanking top plate arranged horizontally transversely, a blanking cylinder, and a blanking sliding guide rail that slidably cooperates with the blanking cylinder horizontally transversely. The blanking device also includes blanking springs arranged horizontally transversely on both sides of the blanking sliding guide rail, and the blanking springs are used to prevent the blanking cylinder from moving horizontally transversely towards the side far from the blanking top plate.

[0019] Preferably, the blanking device further includes a blanking mounting seat for mounting the blanking cylinder, the blanking sliding guide rail, and the blanking springs. One end of the blanking spring is fixedly mounted at the blanking mounting seat, and the other end forms a free end. The free end of the blanking spring is used to abut and cooperate with the blanking cylinder, and a reserved space for the movement of the blanking cylinder is formed between the free end of the blanking spring in the original length state and the blanking cylinder.

[0020] Specifically, the blanking mounting seat can ensure the stable installation of the blanking device and provide a stable fixing position for the blanking springs.

[0021] A top material ejection plate is connected to the upper part of the ejection cylinder, and two ejection push blocks are formed at one end of the ejection plate far from the ejection cylinder along the horizontal transverse direction, and the two ejection push blocks are symmetrically distributed on both sides of the central plane of the electroplating chip strip along the horizontal longitudinal direction; the ejection plate and the ejection cylinder are connected by a rectangular ejection cross plate, and a ejection sensing mounting plate is arranged at the side wall of the ejection cross plate; the ejection sensing mounting plate includes an ejection sensing mounting cross plate positioned and installed at the side wall of the ejection cross plate along the horizontal transverse direction, and a plurality of ejection sensing waist-shaped holes are formed at the ejection sensing mounting cross plate along the horizontal transverse direction, and the ejection sensing mounting plate also includes an L-shaped ejection sensing mounting plate connected to the ejection sensing mounting cross plate, and the ejection sensing mounting plate is used to install an ejection sensor, and the ejection sensor is used to identify the matching condition of the ejection cylinder and the ejection spring in the inductive ejection mounting seat;

[0022] The pusher gear rack module includes a pusher rack plate arranged along the horizontal transverse direction and a pusher gear meshing with the pusher rack plate. The pusher gear rack module also includes a pusher drive servo motor for driving the pusher gear to rotate, and the output end of the pusher drive servo motor is connected to the pusher gear; the pusher drive servo motor is installed on a square pusher motor mounting seat that can slide along the horizontal transverse direction, the top material mounting seat is horizontally installed on the upper end surface of the pusher motor mounting seat, and a pusher linear slider is connected to the lower end surface of the pusher motor mounting seat, and the pusher linear slider is slidably arranged on a pusher linear guide rail parallel to the pusher rack plate; the length of the pusher rack plate is longer than the length of the electroplated chip strip to leave a margin.

[0023] Specifically, when in use, the push drive servo motor drives the push motor mounting seat to move along the push linear guide rail, and also drives the top mounting seat and the aforementioned top plate to move horizontally to push out the electroplated chip strip; the whole process is easy to operate and has high effect.

[0024] Preferably, the discharging mechanism includes two discharging mounting frames arranged in the vertical direction, and discharging transmission belts for horizontally transmitting are arranged and installed on the inner walls on both sides of the two discharging mounting frames, and the upper sides of the discharging transmission belts on both sides form a discharging track, and the upper side surface of the discharging transmission belt is used to frictionally cooperate with the lower side surface of the electroplated chip strip to transmit the electroplated chip strip in the horizontally transverse direction; a discharging driving servo motor for synchronously driving the two discharging transmission belts is installed on the side wall of the discharging mounting frame, and the output shaft of the discharging driving servo motor is transmission-connected to the driving wheel of the discharging transmission belt on one side; the output end of the discharging driving servo motor is also connected to a discharging transition transmission shaft through a coupling, and the discharging transition transmission shaft is transmission-connected to the driving wheel of the discharging transmission belt on the other side.

[0025] Specifically, when the preferred loading device body is in use, the discharge drive belt can better receive the electroplated chip strips pushed out by the aforementioned pushing mechanism, and the discharge drive servo motor is used as a power source to drive and ensure synchronous transmission of the discharge drive belts on both sides.

[0026] Preferably, a first discharging photoelectric sensor is arranged at the entrance position of the discharging track between the discharging mounting frames on both sides, and the first discharging photoelectric sensor is used to identify the electroplated chip strips entering the discharging track, and a second discharging photoelectric sensor is arranged at the exit position of the discharging track between the discharging mounting frames on both sides, and the second discharging photoelectric sensor is used to identify the electroplated chip strips moving out of the discharging track and output signals to the pushing mechanism to push the next electroplated chip strip; a discharging stopper assembly is also arranged at the exit position of the discharging track between the discharging mounting frames on both sides, and the discharging stopper assembly includes a discharging stopper cylinder arranged in a vertical direction, and an L-shaped discharging stopper plate is connected to the upper part of the piston rod of the discharging stopper cylinder, and the vertical part of the discharging stopper plate is used to abut against the electroplated chip strips at the discharging track to form a blockage.

[0027] Specifically, when in use, when the first discharging photoelectric sensor identifies the electroplated chip strip entering the discharging track, the timing control set in advance is started; first, the discharging transmission belt starts to transmit the electroplated chip strip, and the delay is 1-2s (adjusted and set according to the specific size of the electroplated chip strip), and the discharging stop cylinder drives the discharging baffle to move upward to block the electroplated chip strip at the discharging track. At the same time, the discharging transmission belt stops transmission and waits for the control signal of the next workstation. After the inspection of the electroplated chip strip at the next workstation (preferably the next workstation is the inspection workstation) is completed, the discharging baffle falls and is released, the discharging transmission belt starts and transports the electroplated chip strip to the next workstation. When the second discharging photoelectric sensor senses that the electroplated chip strip flows out of the discharging track, it outputs a signal to the aforementioned pushing mechanism and pushes the next electroplated chip strip into the discharging track. Repeating the above operations can continuously and stably carry out the loading process.

[0028] It can be understood that the entire loading device body has a compact structure and is relatively simple to control, thereby being able to maintain a better loading efficiency.

[0029] A discharging adjustment assembly is also provided at the lower part of the side wall of the discharging mounting frame, and the discharging adjustment assembly includes a discharging adjustment shaft arranged along the horizontal longitudinal direction and connected to the discharging mounting frames on both sides, and the discharging adjustment shaft is respectively formed with a rotating part, a first connecting part and a second connecting part along its axial direction; the rotating part is used to drive the discharging adjustment shaft to rotate, and the first connecting part is used to be installed and connected with the discharging mounting frame on one side, the first connecting part is rotatably connected relative to the discharging mounting frame on the one side, and the second connecting part is threadedly connected to the discharging mounting frame on the other side, and the bottom of the discharging mounting frame on the other side is connected to the discharging adjustment guide rail arranged along the horizontal longitudinal direction.

[0030] Preferably, a second material discharging mechanism is further arranged beside the discharging track. The second material discharging mechanism includes a material discharging rack in the shape of a cuboid arranged in the vertical direction and a two-axis module for material discharging arranged above the material discharging rack. A vertical space with an open upper part for stacking and placing electroplated chip strips is formed in the material discharging rack in the vertical direction; L-shaped material discharging limiting baffles are arranged at the bottoms of the side walls of the material discharging rack. The horizontal part of the material discharging limiting baffle is used for positioning and cooperating with the installation platform, and the vertical part of the material discharging limiting baffle is used for abutting and cooperating with the material discharging rack to form a limit; a material discharging baffle waist-shaped hole with an extending direction perpendicular to the side wall of the corresponding material discharging rack is formed in the horizontal part of the material discharging limiting baffle.

[0031] The two-axis module for material discharging includes a horizontal part of the two-axis module moving horizontally longitudinally and a vertical part of the two-axis module moving vertically. A material discharging adsorption component is installed at the mover of the vertical part of the two-axis module. The material discharging adsorption component includes a vacuum chuck with an adsorption direction facing downward and a material discharging proximity sensor for identifying the electroplated chip strips at the material discharging rack. The moving area of the horizontal part of the two-axis module horizontally longitudinally can cover directly above the material discharging rack and directly above the discharging track.

[0032] Understandably, the electroplated chip strips can be preferably transported between the discharging track and the material discharging rack through the two-axis module for material discharging.

[0033] Preferably, the detection device includes a detection device main body. The detection device main body includes a detection part feeding component for receiving the electroplated chip strips at the discharging track and conveying them to the detection track and a detection part conveying component arranged horizontally transversely. A detection part mover sliding horizontally transversely is arranged at the detection part conveying component. The moving route of the detection part mover horizontally transversely forms a detection track; the detection component includes a front detection component located above the detection track and a back detection component located below the detection track; a detection part discharging component for receiving the electroplated chip strips at the detection part mover is formed at the end of the detection track.

[0034] Preferably, the inspection unit loading component includes two inspection unit loading mounting plates arranged relatively parallel to each other. On the inner walls of the two opposite sides of the two inspection unit loading mounting plates, inspection unit loading conveyor belts are symmetrically installed. The inspection unit loading conveyor belts on both sides are respectively driven by inspection unit loading drive motors on both sides; the inspection unit loading drive motors on both sides are controlled by the same controller; the upper surfaces of the inspection unit loading conveyor belts on both sides form an inspection unit loading transfer channel along the horizontal transverse direction, and the inspection unit loading transfer channel is parallelly docked with the discharge track; between the two inspection unit loading mounting plates, an inspection unit loading photoelectric sensor with the sensing optical path facing the entrance of the inspection unit loading transfer channel is installed; the inspection unit loading photoelectric sensor is used to identify the electroplated chip strip entering the inspection unit loading transfer channel; between the two inspection unit loading mounting plates, an inspection unit loading lifting cylinder arranged vertically is also provided, and the upper part of the piston rod of the inspection unit loading lifting cylinder is installed with a horizontally arranged inspection unit loading top plate; the inspection unit loading top plate is used to lift the electroplated chip strip at the inspection unit loading transfer channel upward and transfer it to the inspection unit slider.

[0035] Specifically, during the inspection process, first, the inspection unit loading conveyor belt can preferably receive the electroplated chip strip from the previous station (preferably the discharge track of the loading station), and then the inspection unit loading photoelectric sensor identifies the electroplated chip strip received and entering the inspection unit loading transfer channel and transmits a signal to the previous station (preferably the loading station) after identification to control the previous station to prepare for transporting the next electroplated chip strip; at the same time, after the electroplated chip strip enters the inspection unit loading conveyor belt, timing control starts. Specifically, the timing control includes the electroplated chip strip flowing into the inspection unit loading transfer channel → the inspection unit loading photoelectric sensor completing the acceptance → the inspection unit loading lifting cylinder lifting the electroplated chip strip upward through the inspection unit loading top plate → maintaining the lift (delay) → the inspection unit slider receiving (such as receiving through devices such as jaws or suction cups) → the inspection unit slider carrying the electroplated chip strip moving along the inspection track → completing the front and back surface inspections during the movement → the inspection being completed and flowing out to the next station;

[0036] The specific process of the inspection being completed and flowing out will be discussed later; it can be understood that preferably during the inspection process, the electroplated chip strip flowing into the inspection unit loading transfer channel is identified by the inspection unit loading photoelectric sensor and a signal can be output to the previous station, so that the entire control process is more stable, avoiding the situation of electroplated chip strips stacking and congesting between each track, and thus effectively ensuring that only a single electroplated chip strip remains at each track for easy control and management, and therefore preferably avoiding chaos during the inspection process.

[0037] Moreover, preferably, a feeding photoelectric sensor of the detection unit is only provided at the entrance of the feeding conveyor channel of the detection unit for sensor recognition, and subsequent detection segments are all controlled by timing, so as to better simplify the control and reserve space for subsequent speed increase.

[0038] Preferably, the conveying assembly of the detection unit includes a linear motor of the detection unit and a linear guide rail of the detection unit which are arranged parallel to each other horizontally. The mover of the detection unit is installed at the mover of the linear motor of the detection unit and moves horizontally along with the mover of the motor. The mover of the detection unit includes a main board of the mover of the detection unit. One end of the main board of the mover of the detection unit in the vertical direction is connected to the mover of the linear motor and moves along with it, and the other end is formed with a sliding part for sliding cooperation with the linear guide rail of the detection unit. The middle part of the main board of the mover of the detection unit is formed with a rectangular clamping opening located directly above the feeding channel of the detection unit. Pneumatic clamping jaws of the detection unit for clamping the electroplated chip strip are installed on both sides of the clamping opening in the vertical direction; both the front detection assembly and the back detection assembly include a main body of the detection assembly. The main body of the detection assembly includes an integrated standard light source and a vision detection camera. The irradiation optical path of the integrated standard light source and the shooting lens of the vision detection camera both face the detection track.

[0039] Preferably, the discharging assembly of the detection unit includes two discharging mounting plates of the detection unit arranged relatively parallel to each other. Discharging conveyor belts of the detection unit are symmetrically installed at the inner walls on both sides of the two discharging mounting plates facing each other. The discharging conveyor belts on both sides are respectively driven by discharging driving motors on both sides; the discharging driving motors on both sides are controlled by the same controller; the upper surfaces of the discharging conveyor belts on both sides form a discharging conveyor channel of the detection unit in the horizontal direction. The discharging conveyor channel of the detection unit is parallelly docked with the marking track; a discharging photoelectric sensor of the detection unit with a sensing optical path facing the discharging conveyor channel of the detection unit is installed between the two discharging mounting plates; the discharging photoelectric sensor of the detection unit is used to identify the electroplated chip strip entering the discharging conveyor channel of the detection unit; a discharging lifting cylinder of the detection unit arranged in the vertical direction is further provided between the two discharging mounting plates. The upper part of the piston rod of the discharging lifting cylinder of the detection unit is installed with a horizontally arranged discharging top plate; the discharging top plate is used to receive the electroplated chip strip at the mover of the detection unit and lower it for handover to the discharging conveyor channel of the detection unit.

[0040] Specifically, the detecting part blanking component and the detecting part loading component are generally mirror structures as a whole. Continuing to supplement the aforementioned timing control, when the electroplated chip strip to be detected completes the detection along the detection channel and reaches above the detecting part blanking conveyor channel → the detecting part blanking lifting cylinder jacks up → maintains the jacking (with a time delay) → the detecting part pneumatic gripper releases → the detecting part blanking top plate receives the electroplated chip strip → the detecting part blanking top plate drops and at the same time the electroplated chip strip falls into the detecting part blanking conveyor channel. At this time, it waits for the signal of the next station. If the signal that the material has flowed out is sent from the next station, then the detecting part blanking driving motor starts and drives the detecting part blanking conveyor belt to convey the electroplated chip strip out of the detecting part blanking conveyor channel and into the next station (preferably the marking track).

[0041] Preferably, the marking device includes a marking device main body. A marking track is formed horizontally and transversely at the marking device main body, and a marking position is formed above the marking track; a marking stopping component for stopping the electroplated chip strip directly below the marking position is arranged below the marking track, and a marking lifting component for lifting the electroplated chip strip to the marking position is also arranged below the marking track; a marking component is arranged beside the marking track, and the marking component is used for marking the electroplated chip strip located at the marking position.

[0042] Specifically, during use, first, the electroplated chip strip to be marked flows into the marking track from the previous station (preferably the detection track). After flowing into the marking track, the marking stopping component can stop the electroplated chip strip located at the marking track and jack up the stopped electroplated chip strip to the marking position through the marking lifting component, and the marking component marks the electroplated chip strip located at the marking position.

[0043] Preferably, the marking device main body includes relatively parallelly arranged marking mounting plates. Marking conveyor belts that are horizontally and transversely conveyed are installed at the inner walls on the opposite sides of the marking mounting plates. The marking track is formed above the upper sides of the two marking conveyor belts. A marking entrance photoelectric sensor, a marking lifting component, a marking stopping component, and a marking exit photoelectric sensor are sequentially arranged between the two marking mounting plates along the conveying direction of the marking track.

[0044] Furthermore, the marking track can preferably be docked with the previous station (preferably the detection track), and preferably, the marking entrance photoelectric sensor can preferably identify the electroplated chip strip entering the marking track. After the marking entrance photoelectric sensor identifies the electroplated chip strip, the subsequent marking process is controlled by timing. The specific control process is as follows: the marking conveyor belt starts and drives the electroplated chip strip to move horizontally → the marking stop component starts to stop the electroplated chip strip (when stopping, the marking conveyor belt stops through timing control) → the marking lifting component starts to lift the electroplated chip strip to the marking position → the marking component marks the electroplated chip strip located at the marking position (the marked identification can be based on the detection results obtained from the previous station).

[0045] Specifically, the present invention only uses the marking entrance photoelectric sensor for sensing and identification, and subsequent processes are all controlled by timing, which can preferably simplify the control, making the overall control more stable and concise and facilitating setting. In addition, since the time consumed by each process in the entire marking process (similarly for the foregoing feeding process and detection process) is relatively determined and the fluctuation range is small; therefore, preferably, the marking process using timing control can preferably facilitate subsequent speed increase and can also be adjusted and applied according to electroplated chip strips of different sizes.

[0046] Preferably, the marking entrance photoelectric sensor is used to identify the electroplated chip strip entering the marking track. The marking lifting component includes a marking lifting cylinder arranged in the vertical direction, and a horizontally arranged marking top plate is installed on the upper part of the piston rod of the marking lifting cylinder. The marking stop component includes a marking stop vertical cylinder arranged in the vertical direction, a marking stop horizontal cylinder is arranged horizontally on the upper part of the marking stop vertical cylinder, and a vertical baffle plate facing the marking position is provided at the end of the piston rod of the marking stop horizontal cylinder and can be used to stop the electroplated chip strip. The marking exit photoelectric sensor is used to identify the electroplated chip strip flowing out of the marking track.

[0047] Preferably, both the marking lifting cylinder and the marking stop vertical cylinder are installed on the side wall of the same marking mounting plate; a horizontally extending cylinder mounting plate is horizontally arranged on the upper part of the piston rod of the marking stop vertical cylinder; the marking stop horizontal cylinder is fixedly installed on the side of the cylinder mounting plate far from the marking top plate, and a moving area for the vertical baffle plate to move horizontally is formed directly above the cylinder mounting plate.

[0048] Preferably, two reference plates are provided at the marking track. The reference plates are horizontally and longitudinally arranged between the marking mounting plates on both sides, and the reference plates are respectively located at both ends of the marking position along the horizontal transverse direction; the marking assembly beside the marking track includes a two-axis marking module and a marking device; the two-axis marking module includes a horizontally transverse part (electric cylinder) of the two-axis marking arranged along the horizontal transverse direction and a horizontally longitudinal part of the two-axis marking arranged along the horizontal longitudinal direction; the marking device is vertically installed at the mover of the horizontally longitudinal part of the two-axis marking. A marking head for marking the electroplated chip strip is provided at the lower part of the marking device. A marking area is formed below the marking head. During the movement of the marking head along with the two-axis marking module, its marking area can cover the aforementioned marking position.

[0049] Specifically, the specific position of the marking position can be preferably determined through the reference plates, and it can be preferably applicable to electroplated chip strips of different sizes through mechanical references. When it is to be used for electroplated chip strips of different sizes, only the position of the mechanical reference needs to be adjusted accordingly.

[0050] In addition, in the present invention, the two-axis marking module is used to drive the marking device to move. The moving range of the two-axis marking module can preferably ensure that the marking area of the marking head can cover the marking position; and when marking different electroplated chip strips, the corresponding marking time needs to be adjusted in the timing control. It takes about 10 s for large materials and usually 5 s for small materials.

[0051] Preferably, marking drive belts for horizontally transverse transmission are installed on the inner walls of the opposite sides of the two marking mounting plates. The marking track is formed above the marking drive belts on both sides. The upper surface of the marking drive belt is used for frictional cooperation with the lower surface of the electroplated chip strip to horizontally transmit the electroplated chip strip.

[0052] Specifically, during use, the marking drive belt can preferably carry the electroplated chip strip to move along the marking track, and its operation and stop are controlled by timing.

[0053] Preferably, a marking drive motor for synchronously driving the two marking drive belts is installed on the side wall of the marking mounting plate. The output shaft of the marking drive servo motor is drivingly connected to the marking driving wheel of one side marking drive belt; the end of the output end of the marking drive servo motor is also connected with a marking transition drive shaft through a coupling, and the marking transition drive shaft is drivingly connected to the marking driving wheel of the other side marking drive belt.

[0054] Specifically, when the preferred marking device main body is in use, the marking drive belt can preferably receive the electroplated chip strip flowing out from the detection track, and is driven by the marking drive servo motor as the power source to ensure synchronous transmission and transportation of the discharge drive belts on both sides.

[0055] Preferably, a plurality of marking tensioning wheel assemblies for tensioning the marking drive belt and marking guide wheels arranged at intervals in the horizontal transverse direction are installed on the marking mounting plate. The marking tensioning wheel assemblies include a first marking tensioning wheel and a second marking tensioning wheel, a third marking tensioning wheel and a fourth marking tensioning wheel respectively located diagonally above and diagonally below the two sides of the marking driving wheel in the horizontal transverse direction. The marking drive belt is in a W shape via the marking driving wheel and the marking tensioning wheel assemblies.

[0056] Preferably, a marking adjusting assembly is further provided at the lower part of the side wall of the marking mounting plate. The marking adjusting assembly includes a marking adjusting shaft arranged in the horizontal longitudinal direction and connected to the marking mounting plates on both sides. The marking adjusting shaft is respectively formed with a rotating part, a first connecting part and a second connecting part along its axial direction.

[0057] The rotating part is used to drive the marking adjusting shaft to rotate. The first connecting part is used to be installed and connected to the marking mounting plate on one side. The first connecting part is rotatably connected relative to the marking mounting plate on the said one side. The second connecting part is threadedly connected to the marking mounting plate on the other side. The bottom of the marking mounting plate on the said other side is connected to the marking adjusting guide rail arranged in the horizontal longitudinal direction.

[0058] Preferably, the blanking device includes a blanking device main body. A blanking sorting mechanism and a material collecting mechanism are sequentially formed on the blanking device main body in the horizontal transverse direction. A blanking track for transporting the electroplated chip strip is formed in the sorting mechanism in the horizontal transverse direction. A defective product collecting part is arranged on one side of the blanking track in the horizontal longitudinal direction. The blanking device main body further includes a sorting two-axis module for picking up the defective products at the blanking track to the defective product collecting part. The blanking device main body further includes a blanking pushing mechanism for pushing the electroplated chip strip at the blanking track into the material collecting mechanism.

[0059] Specifically, during the blanking process, the blanking track can receive the electroplated chip strip that has been marked at the previous station (preferably the marking track). The electroplated chip strip reaching the blanking track can be sorted by the aforementioned marking identification. The electroplated chip strip with the marking identification (obtained from the detection results of the front detection component and the back detection component at the detection track) being a defective product will be picked up by the sorting two-axis module at the blanking track and placed into the defective product collecting part. The electroplated chip strip with the marking identification being a qualified product will be pushed into the material collecting mechanism by the blanking pushing mechanism at the blanking track. Thus, the recovery of the qualified products is completed and the defective products are separated.

[0060] Preferably, the blanking and pushing mechanism includes a belt linear module arranged obliquely above the blanking track in the horizontal transverse direction. A pushing cylinder arranged vertically is connected to the moving slider of the belt linear module through an L-shaped connecting plate. A pushing component for pushing the electroplated chip strip is installed at the lower part of the piston rod of the pushing cylinder. The pushing component includes a pushing spring fixed to the lower part of the piston rod of the pushing cylinder in the horizontal transverse direction. A spring seat for placing the spring is formed on the side of the pushing spring far from the pushing cylinder. A pushing push plate arranged vertically is provided at the spring seat. The pushing push plate is used to push against the electroplated chip strip at the blanking track.

[0061] Preferably, the receiving mechanism includes a receiving magazine in the shape of a cuboid and a receiving lifting linear module (selected as a lead screw type) for lifting the receiving magazine in the vertical direction. A plurality of receiving placement positions are formed at intervals in the vertical direction at the receiving magazine. The electroplated chip strip can be placed horizontally at the receiving placement positions. The electroplated chip strip and the receiving placement positions are slidably matched in the horizontal transverse direction. The receiving lifting linear module includes a receiving lifting slider that slides in the vertical direction. A receiving lifting support frame for placing the receiving magazine is connected to the receiving lifting slider. The upper limit and the lower limit are respectively formed at the uppermost end and the lowermost end when the receiving lifting slider moves in the vertical direction.

[0062] Preferably, the receiving lifting support frame includes a receiving lifting baffle formed in the vertical direction and a receiving lifting horizontal plate formed in the horizontal direction. The receiving lifting baffle is used to abut and cooperate with the vertical side wall of the receiving magazine. The receiving lifting horizontal plate is used to cooperate with the horizontal bottom wall of the receiving magazine to form a support. Strip-shaped limiting grooves are recessed in the inner sides of the two vertical side walls of the receiving magazine in the horizontal transverse direction. The limiting grooves at the same height on the two side walls are used to cooperate with each other to form a receiving placement position. A plurality of receiving placement positions are linearly spaced in the vertical direction. The vertical interval distance between adjacent receiving placement positions is consistent with the single moving distance of the receiving lifting linear module in the vertical direction.

[0063] Specifically, during the blanking process, the receiving lifting support frame can preferably stably place the receiving magazine and will not block the subsequent recovery of the receiving magazine. In addition, preferably, each time the receiving lifting linear module rotates, the receiving lifting slider can drive the receiving magazine to move the height of one groove to facilitate the pushing in of the next electroplated chip strip. The whole process runs stably and efficiently, and can preferably realize the sequential pushing of the electroplated chip strips into the corresponding receiving placement positions of the receiving magazine one by one, and then preferably facilitate the overall recovery of the subsequent full receiving magazines.

[0064] Preferably, a receiving section clip conveying assembly for conveying receiving clips and a receiving section full clip pushing assembly for recovering full clips are also arranged at the main body of the unloading device. The receiving section clip conveying assembly includes a receiving section clip conveying drive belt arranged along the horizontal longitudinal direction. An empty clip loading position of the receiving section is formed at one end of the receiving section clip conveying drive belt in the conveying direction. The empty clip loading position of the receiving section is used to receive empty receiving clips. The other end of the receiving section clip conveying drive belt in the conveying direction is used to cooperate with the receiving lifting support frame to convey the receiving clip to the receiving lifting support frame when the receiving lifting actuator is at the lower limit position.

[0065] The receiving section clip pushing assembly comprises a receiving section clip pushing track and a receiving section clip pushing cylinder arranged along the horizontal longitudinal direction, a receiving section full clip upper material position is formed at one end of the receiving section clip pushing track in the conveying direction, and the receiving section full clip upper material position is used to receive the receiving section clips that have been full, and a receiving section full clip discharging position is formed at the other end of the receiving section clip pushing track in the conveying direction, and the receiving section full clip discharging position is used to manually or machine collect the receiving section clips that have been full of electroplated chip strips; the piston rod of the receiving section clip pushing cylinder is movably arranged along the horizontal longitudinal direction, and the end of the piston rod near the receiving section clip pushing track is connected to the receiving section clip pushing plate, and the receiving section clip pushing plate moves along the horizontal longitudinal direction with the piston rod and is used to push the full clip located at the full clip discharging position to the full clip receiving position.

[0066] Preferably, the sorting mechanism includes two sorting mounting plates arranged opposite to each other in the vertical direction, and sorting transmission belts for horizontally transmitting are arranged and installed on the inner walls on both sides of the two sorting mounting plates, and the upper sides of the sorting transmission belts on both sides form a unloading track, and the upper side surface of the sorting transmission belt is used to frictionally cooperate with the lower side surface of the electroplated chip strip to transmit the electroplated chip strip along the horizontal transverse direction; a sorting drive servo motor for synchronously driving the two sorting transmission belts is installed on the side wall of the sorting mounting plate, and the output shaft of the sorting drive servo motor is transmission-connected to the driving wheel of the sorting transmission belt on one side; the output end of the sorting drive servo motor is also connected to a sorting transition transmission shaft through a coupling, and the sorting transition transmission shaft is transmission-connected to the driving wheel of the sorting transmission belt on the other side.

[0067] Specifically, as an optimal sorting transmission belt, it is able to better transport the electroplated chip strips; at the same time, the sorting drive servo motor is also able to better drive the sorting transmission belts on both sides at the same time to achieve synchronization; thereby ensuring that the sorting transmission belts maintain stable synchronization during the process of transporting the electroplated chip strips.

[0068] Preferably, a sorting entrance photoelectric sensor is installed between the sorting mounting plates on both sides at the position of the entrance of the unloading track, and the sorting entrance photoelectric sensor is used to identify the electroplated chip strips entering the unloading track. A sorting material blocking assembly is also arranged between the sorting mounting plates, and the sorting material blocking assembly includes a sorting material blocking cylinder and a sorting material pushing cylinder arranged in a vertical direction, and a sorting top plate is horizontally installed on the upper part of the piston rod of the sorting material pushing cylinder, and a sorting area is formed on the upper surface of the sorting top plate; an L-shaped sorting baffle is provided on the upper part of the piston rod of the sorting material blocking cylinder; the sorting baffle is used to block defective products passing through the unloading track at the sorting area.

[0069] Specifically, the photoelectric sensor at the sorting entrance can better identify the electroplated chip strips entering the unloading track; when it is identified that the electroplated chip strips flow into the unloading track, the subsequent processes are all controlled by timing, and the specific processes are divided into two types: defective products and qualified products. The process of defective products is as follows: Identify the inflow → the sorting transmission belt starts and transports it to the sorting area (the sorting transmission belt stops at this time) → the sorting blocking cylinder lifts the sorting baffle upward and blocks the defective products → the sorting top cylinder lifts the defective products through the sorting top plate → the sorting two-axis module picks up the electroplated chip strips located in the sorting area to the defective product collection part → the sorting top cylinder and the sorting blocking cylinder are retracted. The process of qualified products is as follows: Identify the inflow → the sorting transmission belt starts and moves it to a position close to the receiving clip → the transmission belt linear module can drive the push plate to push the electroplated chip strips into the receiving clip.

[0070] As the preferred timing control, except for marking and testing, which need to be adjusted according to different electroplating chip strips, most of the others only need a delay of 1-2s, which can ensure a smooth process while maintaining a faster speed.

[0071] Preferably, the sorting two-axis module includes a sorting two-axis horizontal part (electric cylinder) arranged along the horizontal longitudinal direction, a sorting two-axis vertical part (electric cylinder) arranged along the vertical direction is provided at the sorting two-axis horizontal part which moves along the horizontal longitudinal direction, and a sorting suction cup with the adsorption direction facing downward is installed at the lower part of the mover which moves along the vertical direction at the sorting two-axis vertical part; a sorting adsorption area is formed at the sorting suction cup, and the sorting adsorption area can cover the aforementioned sorting area; the moving area of ​​the sorting suction cup that moves with the sorting two-axis module can cover the above-mentioned defective product collection part.

[0072] Specifically, the sorting two-axis module of the present invention can relatively stably and accurately achieve the sorting of defective products. During the sorting process, the sorting two-axis module drives the sorting suction cup to move, thereby picking up the defective products to the defective product collection part. The sorting two-axis vertical part can drive the sorting suction cup to move in the vertical direction, so that it can approach the defective products to be sorted in the vertical direction and when reaching the appropriate position, adsorb them, then rise in the vertical direction and move horizontally longitudinally by the sorting two-axis horizontal part, so that during the sorting process, it will not interfere with other components. At the same time, the adjustability of the entire picking process can be made more flexible through the height adjustment in the vertical direction.

[0073] Preferably, a sorting adjustment component is further provided at the lower part of the side wall of the sorting mounting plate. The sorting adjustment component includes a sorting adjustment shaft arranged horizontally longitudinally and connected to the sorting mounting plates on both sides. The sorting adjustment shaft is respectively formed with a rotating part, a first connecting part and a second connecting part along its axial direction; the rotating part is used to drive the sorting adjustment shaft to rotate, the first connecting part is used to be installed and connected to the receiving mounting frame on one side, the first connecting part is rotatably connected relative to the discharging mounting frame on the said one side, the second connecting part is threadedly connected to the sorting mounting plate on the other side, and the bottom of the sorting mounting plate on the said other side is connected to the discharging adjustment guide rail arranged horizontally longitudinally.

[0074] Specifically, the distance between the sorting mounting plates can be adjusted through the sorting adjustment component, so that the width adjustment of the blanking track can also be realized, and then it is applicable to electroplated chip strips of different sizes, having better applicability. BRIEF DESCRIPTION OF THE DRAWINGS

[0075] Figure 1 is a schematic structural diagram of the equipment main body in Embodiment 1; Figure 2 is a schematic structural diagram of the feeding device main body in Embodiment 1; Figure 3 is Figure 2 a schematic structural diagram of part of the structure in Figure 4 is Figure 2 a schematic structural diagram from another perspective; Figure 5 is Figure 2 an enlarged structural diagram of part A in Figure 6 is Figure 4 an enlarged structural diagram of part B in Figure 7 is a schematic structural diagram of the ejecting device in Embodiment 1; Figure 8 is Figure 7 a schematic structural diagram of the structure inside the ejecting mounting seat in Figure 9 is Figure 2 a schematic structural diagram from another perspective; Figure 10 is Figure 9 an enlarged structural diagram of part C in Figure 11 is a schematic structural diagram of the detection device main body in Embodiment 1;Figure 12 for Figure 11 The structural diagram of the main body of the detection component; Figure 13 for Figure 11 Structural diagram of the feeding assembly of the middle detection part; Figure 14 for Figure 11 Structural schematic diagram of the blanking assembly of the middle detection part; Figure 15 for Figure 14 A schematic diagram of the structure from another perspective; Figure 16 It is a structural schematic diagram of the main body of the marking device in Example 1; Figure 17 for Figure 16 Schematic diagram of the enlarged structure at D in the middle; Figure 18 for Figure 16 A schematic diagram of the structure from another perspective; Figure 19 for Figure 18 Schematic diagram of the enlarged structure at E in the middle; Figure 20 It is a structural schematic diagram of the main body of the feeding device in Example 1; Figure 21 for Figure 20 The enlarged structural diagram at F in the middle; Figure 22 for Figure 20 Schematic diagram of the enlarged structure at G in the middle; Figure 23 for Figure 20 A schematic diagram of the structure from another perspective; Figure 24 for Figure 23 Schematic diagram of the enlarged structure at H in the middle. DETAILED DESCRIPTION

[0076] The present embodiment provides a new type of electroplated chip appearance defect detection equipment, including an equipment body 100, on which a loading device, a detection device, a marking device and a unloading device are arranged in sequence along a horizontal lateral direction; a discharging track for transporting electroplated chip strips is formed along a horizontal lateral direction at the loading device, a detection track connected to the discharging track is formed at the detection device, and a detection component for performing appearance defect detection on the electroplated chip strips is arranged at the detection track; a marking track is formed at the marking device and is connected in a colinear manner to the detection track; a marking component for marking the electroplated chip strips based on the detection results of the detection component is arranged at the marking track; a unloading track for transporting electroplated chip strips is formed at the unloading device and is connected in a colinear manner to the marking track.

[0077] Further, based on the above-mentioned device body 100, the inspector can inspect the electroplated chip strips by the following inspection method;

[0078] Step 1: The inspector places the electroplated chip strip to be inspected on the discharge track of the loading device;

[0079] Step 2: The electroplated chip strip to be inspected enters the inspection track via the discharge track, and is inspected for appearance defects by the inspection component at the inspection track;

[0080] Step 3: The electroplated chip strip to be detected after being detected by the detection component enters the marking track via the detection track, and at the marking component, an identification of qualified product or defective product is marked on the electroplated chip strip according to the detection result obtained by the detection component in Step 2;

[0081] Step 4: The electroplated chip strip after marking enters the blanking track via the marking track and is sorted and blanked at the blanking track.

[0082] Specifically, the electroplated chip strip is in a long strip shape and has a hard material; therefore, in this embodiment, the discharge track, the detection track, the marking track, and the blanking track arranged horizontally in sequence are used to transport the electroplated chip strip throughout the process; thus making the layout of the entire device more compact and facilitating subsequent inspectors to perform stable timing control for each stage.

[0083] In this embodiment, the feeding device includes a feeding device main body 110. Along the horizontal direction, a pushing mechanism 111, a feeding mechanism 112, and a discharging mechanism 113 are arranged in sequence at the feeding device main body 110. The feeding mechanism 112 is used to stack the electroplated chip strips vertically at intervals, and a discharge track along the horizontal direction is formed at the discharging mechanism 113; the pushing mechanism 111 is used to push the electroplated chip strips located at the feeding mechanism 112 into the discharge track one by one along the horizontal direction.

[0084] Specifically, when the device main body in this embodiment is in use, first, the feeding personnel can stack the electroplated chip strips at intervals with each other at the feeding mechanism 112 manually or by mechanical equipment, and then push the stacked electroplated chip strips into the discharge track one by one through the pushing mechanism 111; the feeding device main body 110 in this embodiment can be preferably applicable to the feeding of the electroplated chip strips to perform subsequent appearance detection on each of the electroplated chip strips to be detected.

[0085] The electroplated chip strip itself is in a strip shape and has a hard material, so it can be fed by the method of pushing. The method of pushing is easier to implement, has a lower cost, can maintain a high feeding efficiency compared with the common vacuum suction and release or manual feeding in the prior art, and does not have a high requirement for the pushing accuracy, only needs to be pushed in place.

[0086] In this embodiment, the loading mechanism 112 includes a loading magazine 1121 in the shape of a cuboid and a loading lifting linear module 1122 (selected as a lead screw type) for lifting the loading magazine 1121 in the vertical direction. A plurality of loading positions are formed at intervals in the vertical direction at the loading magazine 1121. The electroplated chip strips can be placed horizontally at the loading positions, and the electroplated chip strips and the loading positions are slidably matched horizontally; the loading lifting linear module 1122 includes a loading lifting mover that slides in the vertical direction. A loading lifting support frame 1123 for placing the loading magazine 1121 is connected to the loading lifting mover. The uppermost end and the lowermost end of the loading lifting mover during vertical movement form an upper limit and a lower limit respectively.

[0087] Further, during the use of the loading mechanism 112 in this embodiment, first, the electroplated chip strips are arranged at intervals in the vertical direction by the loading magazine 1121; and the loading magazine 1121 is arranged on the loading lifting mover arranged in the vertical direction so as to realize vertical movement through the loading lifting linear module 1122. Thus, during the process of the loading magazine 1121 cooperating with the pushing mechanism 111 for pushing, the height of the pushing mechanism 111 does not need to be adjusted accordingly. Since the pushing mechanism 111 needs to be realized through a linear module, if the pushing mechanism 111 needs to be continuously adjusted in the height direction, then the mechanical equipment layout and circuit layout of the entire pushing mechanism 111 will be relatively complex and the cost will be relatively high. Therefore, this embodiment adopts the method of adjusting the height of the loading magazine 1121 to push the electroplated chip strips at the loading magazine 1121 one by one from top to bottom (or from bottom to top) in sequence. Therefore, generally speaking, the loading magazine 1121 in the loading mechanism 112 can stably provide a placement position for the electroplated chip strips to be placed at intervals in the vertical direction, and at the same time, the loading lifting linear module 1122 at the loading mechanism 112 can carry the loading magazine 1121 to move in the vertical direction to cooperate with the pushing mechanism 111 for pushing.

[0088] In this embodiment, the loading lifting support frame 1123 includes a loading lifting baffle 11231 formed in the vertical direction and a loading lifting horizontal plate 11232 formed in the horizontal direction. The loading lifting baffle 11231 is used for abutting and cooperating with the vertical side wall of the loading magazine 1121, and the loading lifting horizontal plate 11232 is used for cooperating with the horizontal bottom wall of the loading magazine 1121 to form a support; strip-shaped limiting grooves 11211 are recessed horizontally on the inner sides of the two vertical side walls of the loading magazine 1121. The limiting grooves 11211 at the same height on the two side walls are used for cooperating to form a loading position; a plurality of loading positions are linearly distributed at intervals in the vertical direction, and the vertical interval distance between adjacent loading positions is consistent with the single moving distance of the loading lifting linear module 1122 in the vertical direction.

[0089] Specifically, since the loading magazine 1121 has a cuboid structure, the loading lifting support frame 1123 in this embodiment uses a loading lifting baffle 11231 and a loading lifting horizontal plate 11232 to jointly support and position the magazine to ensure the stability of the loading magazine 1121 throughout the process. The loading lifting baffle 11231 and the loading lifting horizontal plate 11232 are jointly combined into an L shape. On the one hand, it can fit with one side corner of the loading magazine 1121 to achieve limit. At the same time, it is also convenient for the subsequent recycling of the empty loading magazine 1121, because the loading lifting support frame 1123 will not restrict the movement of the loading magazine 1121 towards the side far from the loading lifting support frame 1123, thus facilitating subsequent recycling.

[0090] In addition, the limiting groove 11211 in the loading magazine 1121 can preferably provide a loading placement position for the electroplated chip strip, and there is enough margin in the height direction of the limiting groove 11211. Therefore, the electroplated chip strip will not be stuck in the limiting groove 11211 and is easy to push out, but the margin left in the limiting groove 11211 is within the distance accuracy range of the single vertical movement of the loading linear module. The loading lifting linear module 1122 in this embodiment can be a ball screw linear module, a synchronous belt type linear module, an electric cylinder type linear module, or a linear motor type linear module. In this embodiment, the screw type is preferably used. Each time the screw rotates once, the loading magazine 1121 rises by the height of one groove along with the loading lifting slider. Then, the subsequent pushing mechanism 111 pushes again. Through such repeated operations, the electroplated chip strips at the loading magazine 1121 can be successively pushed out and enter the discharge track.

[0091] Generally speaking, through the cooperation between the loading magazine 1121 and the loading lifting linear module 1122, the inspectors can preferably achieve automated assembly line operations through unified timing control. That is, the pushing mechanism 111 pushes one, sets a delay time, and after the delay time, the loading lifting linear module 1122 moves up by the height of one groove, and the pushing mechanism 111 pushes the next one, thus achieving efficient continuous automatic feeding. However, during such continuous automatic feeding, in case a certain electroplated chip strip is stuck in the groove obliquely, it may cause the skew material not to be pushed out, which may damage the subsequent pushing mechanism 111 and directly affect the normal progress of the automatic feeding process. In this embodiment, this problem is mainly solved by the ejector device 1111, and the corresponding part of the subsequent ejector device 1111 will be discussed. Next, this embodiment first explains the recycling process of the loading magazine 1121 after the pushing is completed.

[0092] In this embodiment, a loading section cartridge conveying assembly 114 for conveying the loading cartridge 1121 and a loading section cartridge ejecting assembly 115 for recycling the loading cartridge 1121 are further arranged at the main body 110 of the loading device. The loading section cartridge conveying assembly 114 includes a loading section cartridge conveying belt 1141 arranged along the horizontal longitudinal direction. One end in the conveying direction of the loading section cartridge conveying belt 1141 forms a loading section full cartridge loading position for receiving the loading cartridge 1121 fully loaded with electroplated chip strips. The other end in the conveying direction of the loading section cartridge conveying belt 1141 is used to cooperate with the loading lifting support frame 1123 to convey the loading cartridge 1121 to the loading lifting support frame 1123 when the loading lifting slider is at the lower limit position.

[0093] The loading section cartridge ejecting assembly 115 includes a loading section cartridge ejecting track 1151 and a loading section cartridge ejecting cylinder 1152 arranged along the horizontal longitudinal direction. One end in the conveying direction of the loading section cartridge ejecting track 1151 forms a loading section empty cartridge receiving position for receiving the empty loading cartridge 1121 after the electroplated chip strips have been fully ejected. The other end in the conveying direction of the loading section cartridge ejecting track 1151 forms a loading section cartridge discharging position for manually or mechanically collecting the empty loading cartridge 1121. The piston rod of the loading section cartridge ejecting cylinder 1152 is arranged to be horizontally longitudinally movable. One end of the piston rod near the loading section cartridge ejecting track 1151 is connected with a loading section cartridge pushing plate 1153. The loading section cartridge pushing plate 1153 moves along the horizontal longitudinal direction with the piston rod and is used to push the empty loading cartridge 1121 located at the loading section empty cartridge receiving position to the loading section empty cartridge receiving position.

[0094] Specifically, during use, the loading section cartridge conveying belt 1141 in this embodiment can convey the loading cartridge 1121 fully loaded with electroplated chip strips to the loading lifting support frame 1123. Then, the loading cartridge 1121 can move along the vertical direction with the loading lifting slider and the electroplated chip strips in the loading cartridge 1121 are successively ejected to the discharging track by the pushing mechanism 111. After the electroplated chip strips in the loading cartridge 1121 are fully pushed, the loading cartridge 1121 also reaches the upper limit position with the loading lifting slider. At this time, it can be ejected by the loading section cartridge ejecting cylinder 1152 and reach the loading section cartridge discharging position, thus completing the recycling of the empty cartridge.

[0095] Understandably, the loading process in this embodiment can preferably combine the processes of loading a full magazine, the pusher mechanism 111 pushing the materials one by one, and discharging an empty magazine in a compact manner, and the entire process can be stably realized through timing control, thereby ensuring the efficiency of the entire loading process. Furthermore, it can effectively ensure that subsequent appearance defect detection can be carried out on the electroplated chip strips one by one. Therefore, the loading device main body 110 can preferably ensure the efficient and stable progress of the entire detection process.

[0096] In this embodiment, the pusher mechanism 111 includes a blanking device 1111 and a pusher gear and rack module 1112. The blanking device 1111 includes a blanking top plate 11111 arranged horizontally in the transverse direction, a blanking cylinder 11112, and a blanking sliding guide rail 11113 that is slidably matched with the blanking cylinder 11112 in the horizontal transverse direction. The blanking device 1111 further includes blanking springs 11114 arranged on both sides of the blanking sliding guide rail 11113 in the horizontal transverse direction. The blanking springs 11114 are used to prevent the blanking cylinder 11112 from moving horizontally towards the side far from the blanking top plate 11111.

[0097] Specifically, during the detection process, the blanking top plate 11111 at the blanking device 1111 can abut against the electroplated chip strip to be detected. After abutting, the pusher gear and rack module 1112 can preferably drive the blanking top plate 11111 to move to push the electroplated chip strip into place. Since the position accuracy requirements during the pushing process are low, the pusher gear and rack module 1112 is selected to preferably reduce costs. Further, during the entire pushing process, the blanking cylinder 11112 can preferably play a pre-adjustment role. Specifically, before being pushed into place at one time by the pusher gear and rack module 1112, it is necessary to first pre-position the electroplated chip strip to be pushed out through the blanking cylinder 11112 and the blanking top plate 11111. The purpose of this process is to prevent the situation where the aforementioned skewed materials cannot be pushed out. When the blanking cylinder 11112 drives the blanking top plate 11111 to push the electroplated chip strip horizontally, if the electroplated chip strip is stuck due to skewed materials, then the blanking cylinder 11112 will be stuck by the spring because it cannot be pushed, thereby being able to remind the duty personnel or send an alarm signal through a sensor for adjustment. In this embodiment, it is preferably to send an alarm signal through a sensor. After sending the alarm signal, directly skip this electroplated chip strip, and then the loading lifting slider drives the loading magazine 1121 to move up by the height of one groove. Then, for the next electroplated chip strip, continue with: pre-adjustment by the blanking cylinder 11112 → adjustment completed → the pusher gear and rack module 1112 is pushed into place at one time. If an alarm still occurs during the pre-adjustment process, continue to skip to the next one.

[0098] Therefore, generally speaking, the ejector cylinder 11112 in this embodiment can preferably perform the function of skew material warning to avoid affecting the feeding process or even damaging the equipment. Moreover, the ejector cylinder 11112 cooperating with the ejector top plate 11111 can also correct the slightly skewed electroplated chip strip, making the subsequent process of pushing it in place at one time smoother.

[0099] In this embodiment, the ejector device 1111 further includes an ejector mounting seat 11115 for mounting the ejector cylinder 11112, the ejector sliding guide rail 11113, and the ejector spring 11114. One end of the ejector spring 11114 is fixedly installed at the ejector mounting seat 11115, and the other end forms a free end. The free end of the ejector spring 11114 is used to abut and cooperate with the ejector cylinder 11112. A reserved space for the movement of the ejector cylinder 11112 is formed between the free end of the ejector spring 11114 in its original length state and the ejector cylinder 11112.

[0100] Specifically, the ejector mounting seat 11115 can ensure the stable installation of the ejector device 1111 and provide a stable fixed position for the ejector spring 11114.

[0101] The upper part of the ejector cylinder 11112 is connected to an ejector top plate 11111. Two ejector blocks 11116 are formed at one end of the ejector top plate along the horizontal transverse direction away from the ejector cylinder 11112. The two ejector blocks 11116 are symmetrically distributed on both sides of the central plane of the electroplated chip strip along the horizontal longitudinal direction. The ejector top plate 11111 and the ejector cylinder 11112 are connected by an ejector cross plate 11117 in the shape of a cuboid. An ejector induction mounting plate 11118 is arranged on the side wall of the ejector cross plate 11117. The ejector induction mounting plate 11118 includes an ejector induction mounting cross plate 111181 horizontally and longitudinally positioned on the side wall of the ejector cross plate 11117. A plurality of ejector induction waist-shaped holes 111182 are formed along the horizontal transverse direction on the ejector induction mounting cross plate 111181. The ejector induction mounting plate 11118 further includes an L-shaped ejector sensing mounting plate 111183 connected to the ejector induction mounting cross plate 111181. The ejector sensing mounting plate 111183 is used to mount an ejector sensor 11119, and the ejector sensor 11119 is used to identify and sense the cooperation situation of the ejector cylinder 11112 and the ejector spring 11114 in the ejector mounting seat 11115.

[0102] Specifically, the ejector blocks 11116 can make the process of pushing out the electroplated chip strip smoother. The two ejector blocks 11116 need to be kept on both sides respectively, and the distance between them needs to be adjusted according to the actual size of the electroplated chip strip. Within the adjustable range, a larger distance can make the pushing process smoother.

[0103] In addition, the top material sensing waist-shaped hole 111182 can be used as a reference for the length of the top material sensing mounting plate 11118 during processing. By adjusting the length of the top material sensing waist-shaped hole 111182, the length of the top material sensing mounting plate 11118 can be adjusted, thereby changing the installation position of the top material sensor 11119, and then adjusting the installation position of the top material sensor 11119 to adapt to electroplated chip strips of different sizes.

[0104] The push gear rack module 1112 includes a push rack plate 11121 arranged horizontally and a push gear 11122 meshing with the push rack plate 11121. The push gear rack module 1112 also includes a push drive servo motor 11123 for driving the push gear 11122 to rotate. The output end of the push drive servo motor 11123 is connected to the push gear 11122. The push drive servo motor 11123 is installed on a square along the water The push motor mounting seat 11124 is flat and transversely slidable, and the top material mounting seat 11115 is horizontally installed on the upper end surface of the push motor mounting seat 11124. The lower end surface of the push motor mounting seat 11124 is connected with a push linear slider 11125. The push linear slider 11125 is slidably arranged on a push linear guide rail 11126 parallel to the push rack plate 11121; the length of the push rack plate 11121 is longer than the length of the electroplated chip strip to leave a margin.

[0105] Specifically, when in use, the push drive servo motor 11123 drives the push motor mounting seat 11124 to move along the push linear guide rail 11126, and also drives the top material mounting seat 11115 and the aforementioned top material top plate 11111 to move horizontally to push out the electroplated chip strip; the whole process is easy to operate and the effect is high.

[0106] In this embodiment, the discharging mechanism 113 includes two discharging mounting frames 1131 arranged in the vertical direction, and the inner walls on both sides of the two discharging mounting frames 1131 are arranged and installed with discharging transmission belts 1132 for horizontal transverse transmission. The upper sides of the discharging transmission belts 1132 on both sides form a discharging track, and the upper side surface of the discharging transmission belt 1132 is used to frictionally cooperate with the lower side surface of the electroplated chip strip to transport the electroplated chip strip in the horizontal transverse direction; a discharging driving servo motor 1133 for synchronously driving the two discharging transmission belts 1132 is installed on the side wall of the discharging mounting frame 1131, and the output shaft of the discharging driving servo motor is transmission-connected to the driving wheel of the discharging transmission belt 1132 on one side; the output end of the discharging driving servo motor is also connected to a discharging transition transmission shaft 1139 through a coupling 11310, and the discharging transition transmission shaft 1139 is transmission-connected to the driving wheel of the discharging transmission belt 1132 on the other side.

[0107] Specifically, when the loading device main body 110 in this embodiment is in use, the discharging conveyor belt 1132 can preferably receive the electroplated chip strips pushed out by the aforementioned pushing mechanism 111, and uses the discharging driving servo motor 1133 as the power source to drive, thereby ensuring the synchronous transmission and transportation of the discharging conveyor belts 1132 on both sides.

[0108] In this embodiment, a first discharging photoelectric sensor 1134 is arranged at the entrance position of the discharging track between the discharging mounting frames 1131 on both sides. The first discharging photoelectric sensor 1134 is used to identify the electroplated chip strips entering the discharging track. A second discharging photoelectric sensor 1135 is arranged at the exit position of the discharging track between the discharging mounting frames 1131 on both sides. The second discharging photoelectric sensor 1135 is used to identify the electroplated chip strips exiting the discharging track and output a signal to the pushing mechanism 111 to push the next electroplated chip strip; a discharging material blocking component is also arranged at the exit position of the discharging track between the discharging mounting frames 1131 on both sides. The discharging material blocking component includes a discharging material blocking cylinder 1136 arranged in the vertical direction. The upper part of the piston rod of the discharging material blocking cylinder 1136 is connected with an L-shaped discharging material baffle 1137. The vertical part of the discharging material baffle 1137 is used to abut against the electroplated chip strips at the discharging track to form a block.

[0109] Specifically described, in use, when the first discharging photoelectric sensor 1134 identifies the electroplated chip strips entering the discharging track, the pre-set timing control is started; first, the discharging conveyor belt 1132 starts to drive and transport the electroplated chip strips. At this time, a delay of 1-2 s (adjusted and set according to the specific size of the electroplated chip strips) is set. The discharging material blocking cylinder 1136 drives the discharging material baffle 1137 to move upward to block the electroplated chip strips at the discharging track. At the same time, the discharging conveyor belt 1132 stops driving and waits for the control signal of the next working station. When the detection of the electroplated chip strips at the next working station (the next working station in this embodiment is the detection station) is completed, the discharging material baffle 1137 drops and releases, the discharging conveyor belt 1132 starts and transports the electroplated chip strips to the next working station. When the second discharging photoelectric sensor 1135 senses that the electroplated chip strips flow out of the discharging track, it outputs a signal to the aforementioned pushing mechanism 111 and pushes the next electroplated chip strip into the discharging track. Repeating the above operations can continuously and stably perform the loading process.

[0110] It can be understood that the structure of the entire loading device main body 110 is compact and the control is relatively simple, so as to be able to maintain a better loading efficiency.

[0111] The lower part of the side wall of the discharge mounting bracket 1131 is also provided with a discharge adjusting assembly 1138. The discharge adjusting assembly 1138 includes a discharge adjusting shaft 11381 arranged along the horizontal longitudinal direction and connected to the discharge mounting brackets 1131 on both sides. The discharge adjusting shaft 11381 is respectively formed with a rotating part, a first connecting part and a second connecting part along its axial direction; the rotating part is used to drive the discharge adjusting shaft 11381 to rotate, the first connecting part is used to be installed and connected to the discharge mounting bracket 1131 on one side, the first connecting part is rotatably connected relative to the discharge mounting bracket 1131 on the said one side, the second connecting part is threadedly connected to the discharge mounting bracket 1131 on the other side, and the bottom of the discharge mounting bracket 1131 on the said other side is connected to a discharge adjusting guide rail 11382 arranged along the horizontal longitudinal direction.

[0112] Specifically, through the discharge adjusting shaft 11381 and the discharge adjusting guide rail 11382, the horizontal longitudinal distance between the discharge mounting brackets 1131 on both sides can be preferably adjusted. It only needs to rotate the discharge adjusting shaft 11381 through the rotating part, and it can be rotated manually or by a machine. During the rotation process, the screw fit between the second connecting part and the discharge mounting bracket 1131 controls the discharge mounting bracket 1131 to move along the discharge adjusting guide rail 11382, so as to realize the distance adjustment and thus be applicable to electroplated chip strips of different sizes. Therefore, it has better versatility.

[0113] In this embodiment, a second feeding mechanism 114 is also arranged beside the discharge track. The second feeding mechanism 114 includes a feeding rack 1141 arranged in a rectangular parallelepiped shape along the vertical direction and a two-axis feeding module 1142 arranged above the feeding rack 1141. A vertically open vertical space for stacking and placing electroplated chip strips is formed along the vertical direction at the feeding rack 1141; L-shaped feeding limiting baffles 1143 are arranged at the bottom of the side walls of the feeding rack 1141. The horizontal part of the feeding limiting baffle 1143 is used for positioning and cooperating with the installation platform, and the vertical part of the feeding limiting baffle 1143 is used for abutting and cooperating with the feeding rack 1141 to form a limit; a feeding baffle waist-shaped hole with an extending direction perpendicular to the side wall of the corresponding feeding rack 1141 is formed in the horizontal part of the feeding limiting baffle 1143.

[0114] Specifically, through the two-axis feeding module 1142, the electroplated chip strips at the feeding rack 1141 can be sucked and placed at the discharge track, so that it can be used during the transition period of replacing the feeding magazine 1121; thus making the whole feeding process more compact, with less idle time and higher feeding efficiency. In addition, through the feeding baffle waist-shaped hole, it can be used as a reference during the processing of the feeding limiting baffle 1143. Only by adjusting the length of the feeding baffle waist-shaped hole can the size of the corresponding feeding rack 1141 be correspondingly controlled, so that the corresponding feeding rack 1141 is applicable to electroplated chip strips of different sizes.

[0115] The two-axis module for material feeding 1142 includes a horizontal part 11421 of the two-axis module that moves along the horizontal longitudinal direction and a vertical part 11422 of the two-axis module that moves along the vertical direction. A material-feeding adsorption component 11423 is installed at the mover of the vertical part 11422 of the two-axis module. The material-feeding adsorption component 11423 includes a vacuum chuck with an adsorption direction facing downward and a material-feeding proximity sensor for identifying the electroplated chip strip at the material-feeding rack 1141. The moving area of the horizontal part 11421 of the two-axis module along the horizontal longitudinal direction can cover directly above the material-feeding rack 1141 and directly above the discharge track.

[0116] Understandably, the electroplated chip strip can be preferably transported between the discharge track and the material-feeding rack 1141 through the two-axis module for material feeding 1142.

[0117] In this embodiment, the detection device includes a detection device main body 120. The detection device main body 120 includes a detection part loading component 121 for receiving the electroplated chip strip at the discharge track and transporting it to the detection track, and a detection part transporting component 122 arranged horizontally in the transverse direction. A mover of the detection part is provided at the detection part transporting component 122, and the moving route of the mover of the detection part along the horizontal transverse direction forms a detection track; the detection component includes a front detection component located above the detection track and a back detection component located below the detection track; a detection part unloading component 123 for receiving the electroplated chip strip at the mover of the detection part is formed at the end of the detection track.

[0118] Specifically, during the detection process, the detection track first receives the electroplated chip strip from the previous station, which is the loading station in this embodiment, and then the mover of the detection part carries the electroplated chip strip to be detected and moves along the detection track, and the upper surface and the lower surface of the electroplated chip strip are detected by the detection component during the movement. Understandably, the detection process in this embodiment can be preferably applied to the detection of the electroplated chip strip, and the required detection parts can be preferably covered through the front and back detection, thereby ensuring the accuracy of the detection result.

[0119] In this embodiment, the inspection part feeding component 121 includes two inspection part feeding mounting plates 1211 arranged relatively parallel to each other. At the inner walls of the two opposite sides of the two inspection part feeding mounting plates 1211, inspection part feeding transmission belts 1212 are symmetrically installed. The inspection part feeding transmission belts 1212 on both sides are respectively driven by inspection part feeding drive motors on both sides; the inspection part feeding drive motors on both sides are controlled by the same controller; the upper surfaces of the inspection part feeding transmission belts 1212 on both sides form an inspection part feeding transfer channel along the horizontal transverse direction, and the inspection part feeding transfer channel is parallelly docked with the discharge track; between the two inspection part feeding mounting plates 1211, an inspection part feeding photoelectric sensor 1224 with a sensing optical path facing the entrance of the inspection part feeding transfer channel is installed; the inspection part feeding photoelectric sensor 1224 is used to identify the electroplated chip strip entering the inspection part feeding transfer channel; between the two inspection part feeding mounting plates 1211, an inspection part feeding lifting cylinder 1225 arranged in the vertical direction is also provided. At the upper part of the piston rod of the inspection part feeding lifting cylinder 1225, a horizontally arranged inspection part feeding top plate 1226 is installed; the inspection part feeding top plate 1226 is used to lift the electroplated chip strip at the inspection part feeding transfer channel upward and hand it over to the inspection part mover.

[0120] Specifically, during the inspection process, first, the inspection part feeding transmission belt 1212 can preferably receive the electroplated chip strip from the previous station (in this embodiment, it is the discharge track of the feeding station), and then the inspection part feeding photoelectric sensor 1224 identifies the electroplated chip strip received and entering the inspection part feeding transfer channel and transmits a signal to the previous station (in this embodiment, it is the feeding station) after identification to control the previous station to make preparations for transporting the next electroplated chip strip; at the same time, after the electroplated chip strip enters the inspection part feeding transmission belt 1212, timing control is started. Specifically, the timing control includes the electroplated chip strip flowing into the inspection part feeding transfer channel → the inspection part feeding photoelectric sensor 1224 completing the acceptance → the inspection part feeding lifting cylinder 1225 lifting the electroplated chip strip upward through the inspection part feeding top plate 1226 → maintaining the lift (delay) → the inspection part mover receiving (such as receiving through devices such as jaws or suction cups) → the inspection part mover carrying the electroplated chip strip moving along the inspection track → completing the front and back inspections during the movement → the inspection being completed and flowing out to the next station;

[0121] The specific detection and completion of the outflow process will be discussed later; it can be understood that in this embodiment, during the detection process, the electroplated chip strip flowing into the detection section loading conveyor channel is identified by the detection section loading photoelectric sensor 1224 and a signal can be output to the previous station, so that the entire control process is more stable, preventing the electroplated chip strips from forming stacks and congestion between the tracks, and effectively ensuring that only a single electroplated chip strip remains at each track for easy control and management, thus preferably avoiding confusion during the detection process.

[0122] Moreover, in this embodiment, the detection section loading photoelectric sensor 1224 is only provided at the entrance of the detection section loading conveyor channel for sensor identification, and the subsequent detection sections are all controlled by timing, which can preferably simplify the control and reserve for subsequent speed increase.

[0123] In this embodiment, the detection section conveying assembly 122 includes a detection section linear motor 1221 and a detection section linear guide rail 1223 arranged parallel to each other along the horizontal transverse direction. The detection section mover is installed at the linear motor mover of the detection section linear motor 1221 and moves along the horizontal transverse direction with the motor mover. The detection section mover includes a detection section mover main board 1222. One end of the detection section mover main board 1222 in the horizontal longitudinal direction is connected to the linear motor mover and moves therewith, and the other end is formed with a sliding portion for slidingly cooperating with the detection section linear guide rail 1223. A rectangular clamping opening 12221 located directly above the detection section loading channel is formed in the middle of the detection section mover main board 1222. Detection section pneumatic grippers 12222 for clamping the electroplated chip strip are installed on both sides of the clamping opening 12221 in the horizontal longitudinal direction; both the front detection assembly and the back detection assembly include a detection assembly main body 124, and the detection assembly main body 124 includes an integrated standard light source 1241 and a vision detection camera 1242. The illumination light path of the integrated standard light source 1241 and the shooting lens of the vision detection camera 1242 both face the detection track.

[0124] Specifically, the movement of the linear motor mover with high control accuracy can be achieved through the detection section linear motor 1221 and the detection section linear guide rail 1223, so as to carry the electroplated chip strip to be detected along the detection track for transportation. In addition, in this embodiment, the electroplated chip strip is clamped by the detection section pneumatic grippers 12222, which is preferably applicable to the electroplated chip strip because the electroplated chip strip has a hard material and a certain weight. Therefore, clamping by the detection section pneumatic grippers 12222 will not cause significant appearance damage to the electroplated chip strip and can also provide sufficient clamping force.

[0125] In this embodiment, the detection unit blanking component 123 includes two detection unit blanking mounting plates 1231 arranged relatively parallel to each other. On the inner walls of the two opposite sides of the two detection unit blanking mounting plates 1231, detection unit blanking drive belts 1232 are symmetrically installed. The detection unit blanking drive belts 1232 on both sides are respectively driven by the detection unit blanking drive motors 1233 on both sides; the detection unit blanking drive motors 1233 on both sides are controlled by the same controller; on the upper surfaces of the detection unit blanking drive belts 1232 on both sides, a detection unit blanking transfer channel is formed along the horizontal direction, and the detection unit blanking transfer channel is in parallel docking with the marking track; between the two detection unit blanking mounting plates 1231, a detection unit blanking photoelectric sensor 1234 with a sensing optical path facing the detection unit blanking transfer channel is installed; the detection unit blanking photoelectric sensor 1234 is used to identify the electroplated chip strip entering the detection unit blanking transfer channel; between the two detection unit blanking mounting plates 1231, a detection unit blanking lifting cylinder 1235 arranged in the vertical direction is also provided, and on the upper part of the piston rod of the detection unit blanking lifting cylinder 1235, a horizontally arranged detection unit blanking top plate 1236 is installed; the detection unit blanking top plate 1236 is used to receive the electroplated chip strip at the detection unit mover and lower it for handover to the detection unit blanking transfer channel.

[0126] Specifically, the detection unit blanking component 123 and the detection unit loading component 121 are generally in a mirror image structure as a whole. Continuing to supplement the aforementioned timing control, when the electroplated chip strip to be detected completes the detection along the detection channel and reaches above the detection unit blanking transfer channel → the detection unit blanking lifting cylinder 1235 jacks up → maintains the jacking (with a time delay) → the detection unit pneumatic gripper 12222 releases → the detection unit blanking top plate 1236 receives the electroplated chip strip → the detection unit blanking top plate 1236 drops and at the same time the electroplated chip strip falls into the detection unit blanking transfer channel. At this time, it waits for the signal of the next station. If the signal that the material has flowed out is sent from the next station, then the detection unit blanking drive motor 1233 starts and drives the detection unit blanking drive belt 1232 to convey the electroplated chip strip out of the detection unit blanking transfer channel and into the next station (in this embodiment, it is the marking track).

[0127] In this embodiment, the marking device includes a marking device main body 130. A marking track is formed along the horizontal direction at the marking device main body 130, and a marking position is formed above the marking track; a marking stopping component 135 for stopping the electroplated chip strip directly below the marking position is arranged on the lower side of the marking track, and a marking lifting component 134 for lifting the electroplated chip strip to the marking position is also provided on the lower side of the marking track; a marking component is arranged beside the marking track, and the marking component is used to mark the electroplated chip strip located at the marking position.

[0128] Specifically, during use, first, the electroplated chip strip to be marked flows into the marking track from the previous station (the inspection track in this embodiment). After flowing into the marking track, the marking stop component 135 can stop the electroplated chip strip located at the marking track and lift the stopped electroplated chip strip upward to the marking position by the marking lifting component 134, and the marking component marks the electroplated chip strip located at the marking position.

[0129] In this embodiment, the main body 130 of the marking device includes marking mounting plates 131 arranged relatively parallel to each other. Marking drive belts 1312132 that are horizontally and transversely conveyed are installed on the inner walls of the two opposite sides of the marking mounting plates 131. The upper sides of the two marking drive belts 1312132 form a marking track. A marking entrance photoelectric sensor 133, a marking lifting component 134, a marking stop component 135, and a marking exit photoelectric sensor 136 are sequentially arranged between the two marking mounting plates 131 along the conveying direction of the marking track.

[0130] Further, the marking track can preferably be docked with the previous station (the inspection track in this embodiment), and the marking entrance photoelectric sensor 133 in this embodiment can preferably identify the electroplated chip strip entering the marking track. After the marking entrance photoelectric sensor 133 identifies the electroplated chip strip, the subsequent marking process is controlled by timing. The specific control process is as follows: The marking drive belt 1312132 starts and drives the electroplated chip strip to move horizontally and transversely → the marking stop component 135 starts to stop the electroplated chip strip (when stopping, the marking drive belt 1312132 stops through timing control) → the marking lifting component 134 starts to lift the electroplated chip strip to the marking position → the marking component marks the electroplated chip strip located at the marking position (the marked identifier can be marked according to the detection result obtained from the previous station).

[0131] Specifically, in this embodiment, only the marking entrance photoelectric sensor 133 is used for sensing and identification, and subsequent operations are all controlled by timing, which can preferably simplify the control, making the overall control more stable and concise and easier to set. In addition, since the time taken for each process in the entire marking process (the same applies to the feeding process and the detection process mentioned above) is relatively determined and the fluctuation range is small; therefore, using timing control in the marking process of this embodiment can preferably facilitate subsequent speed increase and can also be adjusted and applied according to electroplated chip strips of different sizes.

[0132] In this embodiment, the marking inlet optoelectronic sensor 133 is used to identify the electroplated chip strip entering the marking track. The marking lifting assembly 134 includes a marking lifting cylinder 1341 arranged in the vertical direction. A horizontally arranged marking top plate 1342 is installed on the upper part of the piston rod of the marking lifting cylinder 1341. The marking stop assembly 135 includes a marking stop vertical cylinder 1351 arranged in the vertical direction. A marking stop horizontal cylinder 1352 is arranged horizontally on the upper part of the marking stop vertical cylinder 1351. A vertical baffle 1353 that can be used to stop the electroplated chip strip and faces the marking position is arranged at the end of the piston rod of the marking stop horizontal cylinder 1352. The marking outlet optoelectronic sensor 136 is used to identify the electroplated chip strip flowing out of the marking track.

[0133] Specifically, the marking top plate 1342 at the marking lifting cylinder 1341 can preferably lift the electroplated chip strip to the standard position. At the same time, the marking stop vertical cylinder 1351 can preferably drive the marking stop horizontal cylinder 1352 and the vertical baffle 1353 to move in the vertical direction, so as to stop and release the electroplated chip strip. At the same time, the marking stop horizontal cylinder 1352 can control the vertical baffle 1353 to push the electroplated chip strip horizontally when stopping. The main purpose of doing this is to prevent the electroplated chip strip from interfering with the vertical baffle 1353 when being lifted and lowered by the marking lifting cylinder 1341, so as to ensure the stable progress of the entire marking process.

[0134] In this embodiment, both the marking lifting cylinder 1341 and the marking stop vertical cylinder 1351 are installed on the side wall of the same marking mounting plate 131. A horizontally arranged cylinder mounting plate 137 extends horizontally on the upper part of the piston rod of the marking stop vertical cylinder 1351. The marking stop horizontal cylinder 1352 is fixedly installed on the side of the cylinder mounting plate 137 far from the marking top plate 1342. A moving area for the vertical baffle 1353 to move horizontally is formed directly above the cylinder mounting plate 137.

[0135] Specifically, installing the marking lifting cylinder 1341 and the marking stop vertical cylinder 1351 on the same side can preferably make the overall layout more compact. And the cylinder mounting plate 137 can preferably provide an installation position for the marking stop vertical cylinder 1351. And the vertical baffle 1353 can move in the moving area directly above the cylinder mounting plate 137, so as to ensure that the vertical baffle 1353 remains stable in the vertical direction and does not fall.

[0136] In this embodiment, two reference plates 138 are provided at the marking track. The reference plates 138 are horizontally and longitudinally arranged between the two marking mounting plates 131 on both sides, and the reference plates 138 are respectively located at both ends of the marking position along the horizontal transverse direction. The marking assembly beside the marking track includes a two-axis marking module 139 and a marker 1310. The two-axis marking module 139 includes a horizontally transverse part 1391 (electric cylinder type) of the two-axis marking module arranged along the horizontal transverse direction and a horizontally longitudinal part 1392 of the two-axis marking module arranged along the horizontal longitudinal direction. The marker 1310 is vertically installed at the mover of the horizontally longitudinal part 1392 of the two-axis marking module. A marking head 1311 for marking the electroplated chip strip is provided at the lower part of the marker 1310. A marking area is formed below the marking head 1311. During the movement of the marking head 1311 along with the two-axis marking module 139, its marking area can cover the aforementioned marking position.

[0137] Specifically, the reference plate 138 can preferably determine the specific position of the marking position, and can preferably be applicable to electroplated chip strips of different sizes through mechanical reference. When it is to be used for electroplated chip strips of different sizes, only the position of the mechanical reference needs to be adjusted accordingly.

[0138] In addition, in this embodiment, the two-axis marking module 139 is used to drive the marker 1310 to move. The movement range of the two-axis marking module 139 can preferably ensure that the marking area of the marking head 1311 can cover the marking position. And when marking different electroplated chip strips, the corresponding marking time needs to be adjusted in the timing control. It takes about 10 s for large materials and usually 5 s for small materials.

[0139] In this embodiment, marking transmission belts 1312132 for horizontal transmission are arranged and installed on the inner walls of the opposite sides of the two marking mounting plates 131. The marking track is formed above the marking transmission belts 1312132 on both sides. The upper surface of the marking transmission belt 1312132 is used for frictional cooperation with the lower surface of the electroplated chip strip to horizontally transmit the electroplated chip strip.

[0140] Specifically, in use, the marking transmission belt 1312132 can preferably carry the electroplated chip strip to move along the marking track, and its operation and stop are controlled by timing.

[0141] In this embodiment, a marking driving servo motor 1313 for synchronously driving two marking transmission belts 1312132 is installed on the side wall of the marking mounting plate 131. The output shaft of the marking driving servo motor 1313 is in transmission connection with the marking driving wheel 1316 of one side marking transmission belt 1312132; the end of the output end of the marking driving servo motor 1313 is also connected with a marking transition transmission shaft 1314 through a coupling 11310, and the marking transition transmission shaft 1314 is in transmission connection with the marking driving wheel 1316 of the other side marking transmission belt 1312132.

[0142] Specifically, when the marking device main body 130 in this embodiment is in use, the marking transmission belt 1312132 can preferably receive the electroplated chip strips flowing out from the detection track, and is driven by the marking driving servo motor 1313 as a power source to ensure the synchronous transmission and transportation of the two discharging transmission belts 1132 on both sides.

[0143] In this embodiment, a plurality of marking tensioning wheel assemblies for tensioning the marking transmission belt 1312132 and marking guide wheels 1315 arranged at intervals along the horizontal transverse direction are installed on the marking mounting plate 131. The marking tensioning wheel assemblies include a first marking tensioning wheel and a second marking tensioning wheel, a third marking tensioning wheel and a fourth marking tensioning wheel respectively located diagonally above and diagonally below both sides of the marking driving wheel 1316 along the horizontal transverse direction. The marking transmission belt 1312132 is in a W shape via the marking driving wheel 1316 and the marking tensioning wheel assemblies.

[0144] It can be understood that during the operation process, the marking guide wheels 1315 can preferably ensure that the marking transmission belt 1312132 maintains the transportation direction along the horizontal transverse direction, thereby effectively ensuring the stability of the electroplated chip strips during transportation on the marking track; in addition, the marking tensioning wheels can preferably keep the marking transmission belt 1312132 tensioned during the entire transportation process, thereby ensuring the stable operation of the marking transmission belt 1312132.

[0145] In this embodiment, a marking adjusting assembly 1317 is further provided at the lower part of the side wall of the marking mounting plate 131. The marking adjusting assembly 1317 includes a marking adjusting shaft 1318 arranged along the horizontal longitudinal direction and connected to the two side marking mounting plates 131. The marking adjusting shaft 1318 is respectively formed with a rotating part, a first connecting part and a second connecting part along its axial direction.

[0146] The rotating part is used to drive the marking adjusting shaft 1318 to rotate. The first connecting part is used to be installed and connected to one side marking mounting plate 131. The first connecting part is rotatably connected to the one side marking mounting plate 131. The second connecting part is in threaded connection with the other side marking mounting plate 131. The bottom of the other side marking mounting plate 131 is connected to a marking adjusting guide rail 1319 arranged along the horizontal longitudinal direction.

[0147] Specifically, by means of the marking adjustment shaft 1318 and the marking adjustment guide rail 1319, the horizontal longitudinal distance between the two marking mounting plates 131 can be preferably adjusted. It only needs to rotate the discharging adjustment shaft 11381 through the rotating part, which can be rotated manually or driven by a machine. During the rotation process, the threaded fit between the second connecting part and the marking mounting plate 131 controls the marking mounting plate 131 to move along the marking adjustment guide rail 1319, so as to realize the distance adjustment and thus be applicable to electroplated chip strips of different sizes. Therefore, it has better versatility.

[0148] In this embodiment, the blanking device includes a blanking device main body 140. Along the horizontal transverse direction, a blanking sorting mechanism and a material receiving mechanism are sequentially formed at the blanking device main body 140; at the sorting mechanism, a blanking track for transporting electroplated chip strips is formed along the horizontal transverse direction, and a defective product collection part 141 is arranged on one side of the blanking track along the horizontal longitudinal direction; the blanking device main body 140 further includes a sorting two-axis module 142, and the sorting two-axis module 142 is used to pick up the defective products at the blanking track to the defective product collection part 141; the blanking device main body 140 further includes a blanking pushing mechanism 143143; the blanking pushing mechanism 143143 is used to push the electroplated chip strips at the blanking track into the material receiving mechanism.

[0149] Specifically, during the blanking process, the blanking track can receive the electroplated chip strips that have been marked at the previous station (the marking track in this embodiment). The electroplated chip strips reaching the blanking track can be sorted by the aforementioned marking identifiers. The electroplated chip strips with marking identifiers (obtained from the detection results of the front detection component and the back detection component at the detection track) being defective products will be picked up by the sorting two-axis module 142 at the blanking track and placed in the defective product collection part 141; the electroplated chip strips with marking identifiers being qualified products will be pushed into the material receiving mechanism by the blanking pushing mechanism 143143 at the blanking track; thus, the recovery of qualified products is completed and the defective products are separated.

[0150] In this embodiment, the blanking pushing mechanism 143143 includes a transmission belt linear module 144 arranged obliquely above the blanking track along the horizontal transverse direction. At the moving slider of the transmission belt linear module 144, a pushing cylinder 146 arranged along the vertical direction is connected through an L-shaped connecting plate 145. A pushing component for pushing the electroplated chip strips is installed at the lower part of the piston rod of the pushing cylinder 146; the pushing component includes a pushing spring 147 fixed to the lower part of the piston rod of the pushing cylinder 146 along the horizontal transverse direction. On the side of the pushing spring 147 far from the pushing cylinder 146, a spring seat for placing the spring is formed; at the spring seat, a pushing plate 148 arranged along the vertical direction is provided; the pushing plate 148 is used to push against the electroplated chip strips at the blanking track.

[0151] Specifically, during the blanking process, the belt linear module 144 can drive the pusher plate 148 to push out the electroplated chip strip at the blanking track horizontally. The pusher cylinder 146 can drive the pusher assembly to move vertically. When not pushing materials, the pusher cylinder 146 drives the pusher assembly to move upward, so as not to affect the electroplated chip strip at the blanking track. And it can move to the entrance position of the blanking track along with the belt linear module 144 to wait. After the electroplated chip strip marked as a qualified product enters the blanking track completely, the pusher cylinder 146 can drive the pusher assembly to descend and ensure that the pusher plate 148 is at the corresponding height with the electroplated chip strip to push against it; and then drive the pusher plate 148 through the belt linear module 144 to push the electroplated chip strip in place to enter the material receiving mechanism. Since the requirement for position accuracy in this pushing process is relatively low, the cost-effective belt linear module 144 is selected in this embodiment, which can better save costs. In addition, the pusher spring 147 can play a better buffering role during the pushing process to avoid damaging the electroplated chip strip due to brute force.

[0152] In this embodiment, the material receiving mechanism includes a rectangular parallelepiped-shaped material receiving magazine 149 and a material receiving lifting linear module 1410 (selected as a lead screw type) for lifting the material receiving magazine 149 vertically. A plurality of material receiving placement positions are formed at intervals along the vertical direction in the material receiving magazine 149. The electroplated chip strip can be placed horizontally in the material receiving placement positions, and the electroplated chip strip and the material receiving placement positions are slidably matched horizontally; the material receiving lifting linear module 1410 includes a material receiving lifting slider that slides vertically. A material receiving lifting support frame 1411 for placing the material receiving magazine 149 is connected to the material receiving lifting slider. The uppermost end and the lowermost end when the material receiving lifting slider moves vertically form an upper limit position and a lower limit position respectively.

[0153] Specifically, the material receiving mechanism in this embodiment is similar to the feeding mechanism 112 on the feeding device main body 110 in this embodiment. The material receiving mechanism in this embodiment also uses the material receiving lifting linear module 1410 to drive the material receiving magazine 149 to move vertically. The material receiving lifting linear module 1410 can be selected from commonly used ball screw type linear modules, synchronous belt type linear modules, linear motor type linear modules, and electric cylinder type linear modules in automation equipment. In this embodiment, the lead screw type linear module is preferably selected; the material receiving magazine 149 is also consistent with the structure of the aforementioned feeding magazine 1121. The material receiving placement positions at the material receiving magazine 149 can be used to receive the electroplated chip strips pushed by the aforementioned blanking pusher mechanism 143143, and can receive them one by one in sequence until the material receiving placement positions at the material receiving magazine 149 are full.

[0154] It can be understood that the material receiving mechanism in this embodiment can better receive the electroplated chip strips, and the material receiving efficiency is relatively high.

[0155] In this embodiment, the receiving and lifting support frame 1411 includes a receiving and lifting baffle 1412 formed in the vertical direction and a receiving and lifting horizontal plate 1413 formed in the horizontal direction. The receiving and lifting baffle 1412 is used to abut and cooperate with the vertical side wall of the receiving magazine 149, and the receiving and lifting horizontal plate 1413 is used to cooperate with the horizontal bottom wall of the receiving magazine 149 to form a support. On the inner sides of the two vertical side walls of the receiving magazine 149, strip-shaped limiting grooves 11211 are recessed in the horizontal transverse direction. The limiting grooves 11211 at the same height on the two side walls are used to cooperate with each other to form a receiving placement position. A plurality of receiving placement positions are linearly spaced in the vertical direction, and the vertical spacing distance between adjacent receiving placement positions is consistent with the single moving distance of the receiving and lifting linear module 1410 in the vertical direction.

[0156] Specifically, during the blanking process, the receiving and lifting support frame 1411 can preferably stably place the receiving magazine 149 and will not block the subsequent recovery of the receiving magazine 149. In addition, each time the receiving and lifting linear module 1410 rotates in this embodiment, the receiving and lifting slider can drive the receiving magazine 149 to move the height of one groove to facilitate the pushing in of the next electroplated chip strip. The whole process runs stably and efficiently, and can preferably realize the sequential pushing in of the electroplated chip strips into the corresponding receiving placement positions of the receiving magazine 149 one by one, and then preferably facilitate the overall recovery of the subsequent fully loaded receiving magazine 149.

[0157] In this embodiment, a receiving part magazine conveying assembly 1414 for conveying the receiving magazine 149 and a receiving part full magazine pushing assembly 1415 for recovering the full magazine are also arranged at the blanking device main body 140. The receiving part magazine conveying assembly 1414 includes a receiving part magazine conveying belt 14141 arranged in the horizontal longitudinal direction. One end in the conveying direction of the receiving part magazine conveying belt 14141 forms a receiving part empty magazine loading position for receiving the empty receiving magazine 149. The other end in the conveying direction of the receiving part magazine conveying belt 14141 is used to cooperate with the receiving and lifting support frame 1411 to convey the receiving magazine to the receiving and lifting support frame 1411 when the receiving and lifting slider is at the lower limit position.

[0158] The magazine ejection component of the material receiving part includes a material receiving part magazine ejection track 14151 arranged along the horizontal longitudinal direction and a material receiving part magazine ejection cylinder 14152. One end in the conveying direction of the material receiving part magazine ejection track 14151 forms a full magazine loading position of the material receiving part, which is used to receive the fully loaded material receiving magazine 149. The other end in the conveying direction of the material receiving part magazine ejection track 14151 forms a full magazine discharging position of the material receiving part, where the fully loaded material receiving magazine 149 with electroplated chip strips is collected manually or by a machine; the piston rod of the material receiving part magazine ejection cylinder 14152 is arranged movably along the horizontal longitudinal direction, and one end of the piston rod close to the material receiving part magazine ejection track 14151 is connected with a material receiving part magazine push plate 14153. The material receiving part magazine push plate 14153 moves along the horizontal longitudinal direction with the piston rod and is used to push the full magazine at the full magazine discharging position to the full magazine receiving position.

[0159] Specifically, first, the blanking operator can place the empty material receiving magazine 149 at the empty magazine loading position of the material receiving part and transport it to the material receiving lifting support frame 1411 through the material receiving part magazine conveying belt 14141 for receiving the pushed electroplated chip strips; while the material receiving magazine 149 is receiving the electroplated chip strips until it is full, the material receiving magazine 149 also rises to the upper limit position with the material receiving lifting slider. At this time, the material receiving part magazine ejection cylinder 14152 pushes the material receiving magazine 149 that has been fully loaded with electroplated chip strips into the material receiving part magazine ejection track 14151 and moves along the material receiving part magazine ejection track 14151 to the full magazine discharging position of the material receiving part for easy collection manually or by a machine.

[0160] It can be understood that through the material receiving part magazine conveying component 1414, it is better for the blanking operator to continuously transport the empty magazine to the material receiving lifting support frame 1411. At the same time, the material receiving part magazine ejection component can be directly arranged directly above the material receiving part magazine conveying component 1414 for recovering the full magazine. At the same time, the material receiving magazine 149 can naturally rise to the full magazine loading position of the material receiving part during the process of loading the electroplated chip strips, so that it can be directly ejected by the material receiving part magazine ejection cylinder 14152; the whole process is very compact and there are few useless processes, thus ensuring the efficient progress of the whole material receiving process.

[0161] In this embodiment, the sorting mechanism includes two sorting mounting plates 1416 arranged oppositely in the vertical direction. On the inner walls of the two opposite sides of the two sorting mounting plates 1416, sorting conveyor belts 1417 for horizontal transverse conveyance are arranged and installed. A blanking track is formed above the two sorting conveyor belts 1417. The upper surface of the sorting conveyor belt 1417 is used to frictionally cooperate with the lower surface of the electroplated chip strip to horizontally and transversely convey the electroplated chip strip; at the side wall of the sorting mounting plate 1416, a sorting drive servo motor 1418 for synchronously driving the two sorting conveyor belts 1417 is installed. The output shaft of the sorting drive servo motor 1418 is in transmission connection with the driving wheel of one side of the sorting conveyor belt 1417; at the end of the output end of the sorting drive servo motor 1418, a sorting transition transmission shaft 1419 is further connected through a coupling 11310. The sorting transition transmission shaft 1419 is in transmission connection with the driving wheel of the other side of the sorting conveyor belt 1417.

[0162] Specifically, the sorting conveyor belt 1417 in this embodiment can preferably convey the electroplated chip strip; at the same time, the sorting drive servo motor 1418 can also preferably drive the two sorting conveyor belts 1417 on both sides simultaneously to achieve synchronization; thereby ensuring that the sorting conveyor belt 1417 maintains stable synchronization during the process of conveying the electroplated chip strip.

[0163] In this embodiment, a sorting inlet photoelectric sensor 1420 is installed at the position of the blanking track inlet between the two sorting mounting plates 1416. The sorting inlet photoelectric sensor 1420 is used to identify the electroplated chip strip entering the blanking track. A sorting material blocking component is further arranged between the sorting mounting plates 1416. The sorting material blocking component includes a sorting material blocking cylinder and a sorting top material cylinder 11112 arranged in the vertical direction. On the upper part of the piston rod of the sorting top material cylinder 11112, a sorting top plate 1421 is horizontally installed. The upper surface of the sorting top plate 1421 forms a sorting area; on the upper part of the piston rod of the sorting material blocking cylinder, an L-shaped sorting baffle 1422 is provided; the sorting baffle 1422 is used to block the defective products passing through the blanking track at the sorting area.

[0164] Specifically, the sorting entrance photoelectric sensor 1420 can better identify the electroplated chip strips entering the unloading track; when it is identified that the electroplated chip strips flow into the unloading track, the subsequent processes are all controlled by timing, and the specific processes are divided into defective products and qualified products. The process of defective products is as follows: identify the flow → the sorting transmission belt 1417 starts and transports it to the sorting area (the sorting transmission belt 1417 stops at this time) → the sorting blocking cylinder lifts the sorting baffle 1422 upward and forms a barrier for defective products → the sorting lifting cylinder 11112 lifts the defective products through the sorting top plate 1421 → the sorting two-axis module 142 picks up the electroplated chip strips located in the sorting area to the defective product collection part 141 → the sorting lifting cylinder 11112 and the sorting blocking cylinder are retracted. The process of qualified products is as follows: identify the inflow → start the sorting transmission belt 1417 and move it to a position close to the receiving clip 149 → the transmission belt linear module 144 can drive the pushing plate 148 to push the electroplated chip strip into the receiving clip 149.

[0165] In this embodiment, the timing control, except for marking and testing, needs to be adjusted according to different electroplating chip strips, and the rest of the delay is mostly 1-2s, so as to ensure that the process is smooth while maintaining a faster speed.

[0166] In the present embodiment, the sorting two-axis module 142 includes a sorting two-axis horizontal part 14201 (electric cylinder type) arranged along the horizontal longitudinal direction, and a sorting two-axis vertical part 14202 (electric cylinder type) arranged along the vertical direction is provided at the sorting two-axis horizontal part 14201, and a sorting two-axis vertical part 14202 (electric cylinder type) is installed at the lower part of the mover moving along the vertical direction at the sorting two-axis vertical part 14202; a sorting suction cup with the adsorption direction facing downward is formed at the sorting suction cup, and the sorting adsorption area can cover the aforementioned sorting area; the moving area of ​​the sorting suction cup moving with the sorting two-axis module 142 can cover the above-mentioned defective product collection part 141.

[0167] Specifically, this embodiment can stably and accurately sort defective products through the sorting two-axis module 142. During the sorting process, the sorting suction cup is driven to move by the sorting two-axis module 142, so that the defective products are picked up to the defective product collection part 141. The sorting two-axis vertical part 14202 can drive the sorting suction cup to move in the vertical direction, so that it can approach the defective products to be sorted in the vertical direction and when it reaches the appropriate position, it can be adsorbed, then raised in the vertical direction and moved horizontally and longitudinally through the sorting two-axis horizontal part 14201, so that there will be no interference with other components during the sorting process. At the same time, the height adjustment in the vertical direction can also make the adjustability of the entire picking process more flexible.

[0168] In this embodiment, a sorting adjustment component 1423 is further provided at the lower part of the side wall of the sorting mounting plate 1416. The sorting adjustment component 1423 includes a sorting adjustment shaft arranged horizontally longitudinally and connected to the sorting mounting plates 1416 on both sides. The sorting adjustment shaft is respectively formed with a rotating part, a first connecting part and a second connecting part along its axial direction; the rotating part is used to drive the sorting adjustment shaft to rotate, the first connecting part is used to be installed and connected to the receiving mounting frame on one side, the first connecting part is rotatably connected relative to the discharging mounting frame 1131 on the said one side, the second connecting part is threadedly connected to the sorting mounting plate 1416 on the other side, and the bottom of the sorting mounting plate 1416 on the said other side is connected to a sorting adjustment guide rail 1424 arranged horizontally longitudinally.

[0169] Specifically, the distance between the sorting mounting plates 1416 can be adjusted through the sorting adjustment component 1423, so that the width adjustment of the blanking track can also be realized, and thus it is applicable to electroplated chip strips of different sizes, having better applicability.

[0170] To further understand the content of the present invention, the present invention will be described in detail in combination with the embodiments. It should be understood that the embodiments are only for explaining the present invention and not for limiting it.

[0171] It is easy to understand that those skilled in the art can combine, split, recombine, etc. the embodiments of the present application on the basis of one or several embodiments provided by the present application to obtain other embodiments, and these embodiments do not exceed the protection scope of the present application.

[0172] The above schematically describes the present invention and its embodiments. This description is not restrictive, and what is shown in the embodiments is only part of the embodiments of the present invention, and the actual structure is not limited thereto. Therefore, if those of ordinary skill in the art are inspired by it and design structural modes and embodiments similar to this technical solution without creative work without departing from the purpose of the present invention, they should all fall within the protection scope of the present invention.

Claims

1. An electroplated chip appearance defect detection device, characterized in that: The device comprises an equipment body (100), wherein a loading device, a detection device, a marking device and a unloading device are arranged in sequence along a horizontal lateral direction on the equipment body (100); a discharge track for transporting electroplated chip strips is formed along a horizontal lateral direction on the loading device, a detection track connected to the discharge track is formed on the detection device, and a detection component for performing appearance defect detection on the electroplated chip strips is arranged on the detection track; a marking track connected to the detection track is formed on the marking device; a marking component for marking the electroplated chip strips based on the detection result of the detection component is arranged on the marking track; and a unloading track for transporting the electroplated chip strips is formed on the unloading device, which is connected to the marking track in a colinear manner; The detection device comprises a detection device body (120), the detection device body (120) comprising a detection part loading assembly (121) for receiving a strip of electroplated chips at a discharge track and conveying it to the detection track, and a detection part conveying assembly (122) arranged in a horizontal and transverse direction, the detection part conveying assembly (122) is provided with a detection part mover sliding in a horizontal and transverse direction, and the detection part mover forms a detection track along a horizontal and transverse movement route; the detection assembly comprises a front detection assembly located above the detection track and a back detection assembly located below the detection track; and a detection part unloading assembly (123) for receiving a strip of electroplated chips at the detection part mover is formed at the end of the detection track; The detection part feeding assembly (121) comprises two detection part feeding installation plates (1211) arranged relatively in parallel, and detection part feeding transmission belts (1212) are symmetrically installed on the inner walls on both sides of the two detection part feeding installation plates (1211) facing each other, and the detection part feeding transmission belts (1212) on both sides are driven by detection part feeding drive motors on both sides respectively; the detection part feeding drive motors on both sides are controlled by the same controller; the upper surfaces of the detection part feeding transmission belts (1212) on both sides form detection part feeding transmission channels along the horizontal transverse direction, and the detection part feeding transmission channels are parallel to and connected with the discharge track; A detection section loading photoelectric sensor (1224) with a sensing light path facing the entrance of the detection section loading and conveying channel is installed between the detection section loading installation plates (1211) on both sides; the detection section loading photoelectric sensor (1224) is used to identify the electroplated chip strips entering the detection section loading and conveying channel; a detection section loading lifting cylinder (1225) arranged in a vertical direction is also provided between the detection section loading installation plates (1211) on both sides, and a horizontally arranged detection section loading top plate (1226) is installed on the upper part of the piston rod of the detection section loading lifting cylinder (1225); the detection section loading top plate (1226) is used to lift the electroplated chip strips at the detection section loading and conveying channel upwards and transfer them to the detection section mover; The detection unit transport component (122) includes a detection unit linear motor (1221) and a detection unit linear guide rail (1223) arranged parallel to each other along the horizontal transverse direction. The detection unit mover is installed at the linear motor mover of the detection unit linear motor (1221) and moves along the horizontal transverse direction with the motor mover. The detection unit mover includes a detection unit mover main board (1222). One end of the detection unit mover main board (1222) in the horizontal longitudinal direction is connected to the linear motor mover and moves therewith, and the other end is formed with a sliding part for slidingly cooperating with the detection unit linear guide rail (1223). The middle part of the detection unit mover main board (1222) is formed with a rectangular clamping opening (12221) located directly above the detection unit loading channel. Detection unit pneumatic jaws (12222) for clamping the electroplated chip strip are installed on both sides of the clamping opening (12221) in the horizontal longitudinal direction; both the front detection component and the back detection component include a detection component main body (124). The detection component main body (124) includes an integrated standard light source (1241) and a vision detection camera (1242). The illumination light path of the integrated standard light source (1241) and the shooting lens of the vision detection camera (1242) both face the detection track; The detection unit unloading component (123) includes two detection unit unloading mounting plates (1231) arranged relatively parallel to each other. Detection unit unloading conveyor belts (1232) are symmetrically installed at the inner walls on both sides of the two detection unit unloading mounting plates (1231) facing each other. The detection unit unloading conveyor belts (1232) on both sides are respectively driven by the detection unit unloading drive motors (1233) on both sides; the detection unit unloading drive motors (1233) on both sides are controlled by the same controller; the upper surfaces of the detection unit unloading conveyor belts (1232) on both sides form a detection unit unloading transfer channel along the horizontal transverse direction, and the detection unit unloading transfer channel is parallelly docked with the marking track; a detection unit unloading photoelectric sensor (1234) with a sensing light path facing the detection unit unloading transfer channel is installed between the two detection unit unloading mounting plates (1231); the detection unit unloading photoelectric sensor (1234) is used to identify the electroplated chip strip entering the detection unit unloading transfer channel; a detection unit unloading lifting cylinder (1235) arranged in the vertical direction is further provided between the two detection unit unloading mounting plates (1231). A horizontally arranged detection unit unloading top plate (1236) is installed on the upper part of the piston rod of the detection unit unloading lifting cylinder (1235); the detection unit unloading top plate (1236) is used to receive the electroplated chip strip at the detection unit mover and lower it for handover to the detection unit unloading transfer channel.

2. The appearance defect detection device for electroplated chips according to claim 1, characterized in that: The loading device includes a loading device main body (110). Along the horizontal transverse direction, a pushing mechanism (111), a loading mechanism (112), and a discharging mechanism (113) are sequentially arranged at the loading device main body (110). The loading mechanism (112) is used for vertically stacking electroplated chip strips at intervals. An unloading track along the horizontal transverse direction is formed at the discharging mechanism (113). The pushing mechanism (111) is used for pushing the electroplated chip strips located at the loading mechanism (112) into the unloading track one by one along the horizontal transverse direction. The loading mechanism (112) includes a loading magazine (1121) in the shape of a cuboid and a loading lifting linear module (1122) for lifting the loading magazine (1121) in the vertical direction. A plurality of loading placement positions are formed at intervals in the vertical direction at the loading magazine (1121). The electroplated chip strips can be placed at the loading placement positions along the horizontal transverse direction. The electroplated chip strips and the loading placement positions are slidably matched along the horizontal transverse direction. The loading lifting linear module (1122) includes a loading lifting slider that slides in the vertical direction. A loading lifting support frame (1123) for placing the loading magazine (1121) is connected to the loading lifting slider. The uppermost end and the lowermost end of the loading lifting slider during vertical movement respectively form an upper limit position and a lower limit position. The loading lifting support frame (1123) includes a loading lifting baffle (11231) formed in the vertical direction and a loading lifting horizontal plate (11232) formed in the horizontal direction. The loading lifting baffle (11231) is used for abutting and cooperating with the vertical side wall of the loading magazine (1121). The loading lifting horizontal plate (11232) is used for cooperating with the horizontal bottom wall of the loading magazine (1121) to form a support. Strip-shaped limiting grooves (11211) are recessed in the inner sides of the two vertical side walls of the loading magazine (1121) along the horizontal transverse direction. The limiting grooves (11211) at the same height on the two side walls are used for cooperating to form a loading placement position. A plurality of loading placement positions are linearly distributed at intervals in the vertical direction. The vertical interval distance between adjacent loading placement positions is consistent with the single moving distance of the loading lifting linear module (1122) in the vertical direction. A loading section magazine conveying assembly (114) for conveying the loading magazine (1121) and a loading section magazine pushing assembly (115) for recycling the loading magazine (1121) are also arranged at the loading device main body (110). The loading section magazine conveying assembly (114) includes a loading section magazine conveying belt (1141) arranged along the horizontal longitudinal direction. One end in the conveying direction of the loading section magazine conveying belt (1141) forms a loading section full magazine loading position, which is used for receiving the loading magazine (1121) fully loaded with electroplated chip strips. The other end in the conveying direction of the loading section magazine conveying belt (1141) is used for cooperating with the loading lifting support frame (1123) to convey the loading magazine (1121) to the loading lifting support frame (1123) when the loading lifting slider is at the lower limit position. The magazine pushing component (115) of the loading section includes a loading-section magazine pushing track (1151) arranged horizontally longitudinally and a loading-section magazine pushing cylinder (1152). At one end in the conveying direction of the loading-section magazine pushing track (1151), a loading-section empty magazine receiving position is formed, which is used to receive the empty loading magazines (1121) after the electroplated chip strips have been completely pushed. At the other end in the conveying direction of the loading-section magazine pushing track (1151), a loading-section magazine discharging position is formed, which is used for manually or mechanically collecting the empty loading magazines (1121). The piston rod of the loading-section magazine pushing cylinder (1152) is arranged to be horizontally movable longitudinally. At one end of the piston rod close to the loading-section magazine pushing track (1151), a loading-section magazine pushing plate (1153) is connected. The loading-section magazine pushing plate (1153) moves horizontally longitudinally along with the piston rod and is used to push the empty loading magazine (1121) located at the loading-section empty magazine receiving position to the loading-section empty magazine receiving position.

3. An electroplated chip appearance defect detection device according to claim 2, characterized in that: The material pushing mechanism (111) includes a blanking device (1111) and a material pushing gear-rack module (1112). The blanking device (1111) includes a blanking top plate (11111) arranged horizontally transversely, a blanking cylinder (11112), and a blanking sliding guide rail (11113) that slidably cooperates with the blanking cylinder (11112) horizontally transversely. The blanking device (1111) further includes blanking springs (11114) arranged horizontally transversely on both sides of the blanking sliding guide rail (11113), and the blanking springs (11114) are used to prevent the blanking cylinder (11112) from moving horizontally transversely towards the side far from the blanking top plate (11111). The blanking device (1111) further includes a blanking mounting seat (11115) for mounting the blanking cylinder (11112), the blanking sliding guide rail (11113), and the blanking springs (11114). One end of the blanking spring (11114) is fixedly installed at the blanking mounting seat (11115), and the other end forms a free end. The free end of the blanking spring (11114) is used to abut and cooperate with the blanking cylinder (11112), and a reserved space for the movement of the blanking cylinder (11112) is formed between the free end of the blanking spring (11114) in its original length state and the blanking cylinder (11112). The upper part of the ejector cylinder (11112) is connected with an ejector top plate (11111). Two ejector push blocks (11116) are formed at one end of the ejector top plate along the horizontal transverse direction away from the ejector cylinder (11112). The two ejector push blocks (11116) are symmetrically distributed on both sides of the central plane of the electroplated chip strip along the horizontal longitudinal direction. The ejector top plate (11111) is connected with the ejector cylinder (11112) through a rectangular ejector cross plate (11117). An ejector induction mounting plate (11118) is arranged at the side wall of the ejector cross plate (11117). The ejector induction mounting plate (11118) includes an ejector induction mounting cross plate (111181) horizontally and transversely positioned and mounted at the side wall of the ejector cross plate (11117). A plurality of ejector induction waist-shaped holes (111182) are formed along the horizontal transverse direction at the ejector induction mounting cross plate (111181). The ejector induction mounting plate (11118) further includes an L-shaped ejector sensing mounting plate (111183) connected with the ejector induction mounting cross plate (111181). The ejector sensing mounting plate (111183) is used for mounting an ejector sensor (11119). The ejector sensor (11119) is used for identifying and sensing the cooperation condition of the ejector cylinder (11112) and the ejector spring (11114) in the ejector mounting seat (11115). The pusher gear-rack module (1112) includes a pusher rack plate (11121) arranged along the horizontal transverse direction and a pusher gear (11122) meshing with the pusher rack plate (11121). The pusher gear-rack module (1112) further includes a pusher driving servo motor (11123) for driving the pusher gear (11122) to rotate. The output end of the pusher driving servo motor (11123) is connected with the pusher gear (11122). The pusher driving servo motor (11123) is mounted at a square pusher motor mounting seat (11124) which can slide horizontally and transversely. The ejector mounting seat (11115) is horizontally mounted at the upper end surface of the pusher motor mounting seat (11124). A pusher linear slider (11125) is connected to the lower end surface of the pusher motor mounting seat (11124). The pusher linear slider (11125) is slidably arranged at a pusher linear guide rail (11126) parallel to the pusher rack plate (11121). The length of the pusher rack plate (11121) is longer than the length of the electroplated chip strip to leave a margin. The discharge mechanism (113) comprises two discharge mounting frames (1131) arranged in a vertical direction, and discharge transmission belts (1132) for horizontally transmitting are arranged and installed on the inner walls on both sides of the two discharge mounting frames (1131), and the upper sides of the discharge transmission belts (1132) on both sides form a discharge track, and the upper side surface of the discharge transmission belt (1132) is used for frictionally cooperating with the lower side surface of the electroplated chip strip to transmit the electroplated chip strip in the horizontal direction; the side wall of the discharge mounting frame (1131) is provided with a discharge transmission belt (1132) for transmitting the electroplated chip strip in the horizontal direction. A discharging drive servo motor (1133) for synchronously driving two discharging drive belts (1132) is provided, and the output shaft of the discharging drive servo motor (1133) is drivingly connected to the driving wheel of the discharging drive belt (1132) on one side; the output end of the discharging drive servo motor (1133) is also connected to a discharging transition drive shaft (1139) through a coupling (11310), and the discharging transition drive shaft (1139) is drivingly connected to the driving wheel of the discharging drive belt (1132) on the other side; A first discharge photoelectric sensor (1134) is provided between the discharge mounting frames (1131) on both sides at the entrance of the discharge track. The first discharge photoelectric sensor (1134) is used to identify the electroplated chip strip entering the discharge track. A second discharge photoelectric sensor (1135) is provided between the discharge mounting frames (1131) on both sides at the exit of the discharge track. The second discharge photoelectric sensor (1135) is used to identify the electroplated chip strip moving out of the discharge track and output a signal to the pusher. The material mechanism (111) is used to push the next electroplated chip strip; a material discharging stop assembly is also provided between the discharging mounting frames (1131) on both sides at the exit position of the discharging track, and the material discharging stop assembly includes a material discharging stop cylinder (1136) arranged in the vertical direction, and the upper part of the piston rod of the material discharging stop cylinder (1136) is connected to an L-shaped material discharging stop plate (1137), and the vertical part of the material discharging stop plate (1137) is used to abut against the electroplated chip strip at the discharging track to form a block; A discharging adjustment assembly (1138) is also provided at the lower portion of the side wall of the discharging mounting frame (1131). The discharging adjustment assembly (1138) includes a discharging adjustment shaft (11381) arranged along the horizontal longitudinal direction and connected to the discharging mounting frames (1131) on both sides. The discharging adjustment shaft (11381) is respectively formed with a rotating portion, a first connecting portion, and a second connecting portion along its axial direction; the rotating portion is used to drive the discharging adjustment shaft (11381) to rotate, the first connecting portion is used to be installed and connected to the discharging mounting frame (1131) on one side, the first connecting portion is rotatably connected relative to the discharging mounting frame (1131) on one side, the second connecting portion is threadedly connected to the discharging mounting frame (1131) on the other side, and the bottom of the discharging mounting frame (1131) on the other side is connected to the discharging adjustment guide rail (11382) arranged along the horizontal longitudinal direction.

4. An electroplated chip appearance defect detection device according to claim 1, wherein the marking device includes a marking device main body (130). A marking track is formed horizontally along the transverse direction at the marking device main body (130), and a marking position is formed above the marking track. A marking stop component (135) for stopping the electroplated chip strip directly below the marking position is arranged below the marking track, and a marking lifting component (134) for lifting the electroplated chip strip to the marking position is also arranged below the marking track. A marking component is arranged beside the marking track, and the marking component is used for marking the electroplated chip strip located at the marking position. The marking device main body (130) includes relatively parallelly arranged marking mounting plates (131). Marking drive belts (1312132) that are horizontally and transversely conveyed are installed on the inner walls of the opposite sides of the marking mounting plates (131). The marking track is formed above the upper sides of the two marking drive belts (1312132). A marking entrance photoelectric sensor (133), a marking lifting component (134), a marking stop component (135), and a marking exit photoelectric sensor (136) are sequentially arranged between the two marking mounting plates (131) along the conveying direction of the marking track. The marking entrance photoelectric sensor (133) is used for identifying the electroplated chip strip entering the marking track. The marking lifting component (134) includes a marking lifting cylinder (1341) arranged vertically. A horizontally arranged marking top plate (1342) is installed on the upper part of the piston rod of the marking lifting cylinder (1341). The marking stop component (135) includes a marking stop vertical cylinder (1351) arranged vertically. A marking stop horizontal cylinder (1352) is horizontally arranged on the upper part of the marking stop vertical cylinder (1351). A vertical baffle (1353) that can be used to stop the electroplated chip strip and faces the marking position is arranged at the end of the piston rod of the marking stop horizontal cylinder (1352). The marking exit photoelectric sensor (136) is used for identifying the electroplated chip strip flowing out of the marking track. Both the marking lifting cylinder (1341) and the marking stop vertical cylinder (1351) are installed on the side wall of the marking mounting plate (131) on the same side. A horizontally extending cylinder mounting plate (137) is horizontally arranged on the upper part of the piston rod of the marking stop vertical cylinder (1351). The marking stop horizontal cylinder (1352) is fixedly installed on the side of the cylinder mounting plate (137) far from the marking top plate (1342). A moving area for the vertical baffle (1353) to move horizontally is formed directly above the cylinder mounting plate (137).

5. The appearance defect detection device for electroplated chips according to claim 1, characterized in that: The blanking device includes a blanking device main body (140). A blanking and sorting mechanism and a material receiving mechanism are sequentially formed along the horizontal transverse direction at the blanking device main body (140). A blanking track for transporting electroplated chip strips is formed along the horizontal transverse direction at the sorting mechanism. A defective product collection part (141) is arranged on one side of the blanking track along the horizontal longitudinal direction. The blanking device main body (140) further includes a sorting two-axis module (142), and the sorting two-axis module (142) is used to pick up defective products at the blanking track and place them into the defective product collection part (141). The blanking device main body (140) further includes a blanking pushing mechanism (143143). The blanking pushing mechanism (143143) is used to push the electroplated chip strips at the blanking track into the material receiving mechanism. The blanking pushing mechanism (143143) includes a belt linear module (144) arranged obliquely above the blanking track along the horizontal transverse direction. A pushing cylinder (146) arranged along the vertical direction is connected to the moving slider of the belt linear module (144) through an L-shaped connecting plate (145). A pushing component for pushing the electroplated chip strips is installed at the lower part of the piston rod of the pushing cylinder (146). The pushing component includes a pushing spring (147) fixed to the lower part of the piston rod of the pushing cylinder (146) along the horizontal transverse direction. A spring seat for placing the spring is formed on the side of the pushing spring (147) far from the pushing cylinder (146). A pushing push plate (148) arranged along the vertical direction is provided at the spring seat. The pushing push plate (148) is used to push against the electroplated chip strips at the blanking track. The material receiving mechanism includes a rectangular parallelepiped-shaped material receiving magazine (149) and a material receiving lifting linear module (1410) for lifting the material receiving magazine (149) along the vertical direction. A plurality of material receiving placement positions are formed at intervals along the vertical direction at the material receiving magazine (149). The electroplated chip strips can be placed along the horizontal transverse direction at the material receiving placement positions. The electroplated chip strips and the material receiving placement positions are slidably matched along the horizontal transverse direction. The material receiving lifting linear module (1410) includes a material receiving lifting slider that slides along the vertical direction. A material receiving lifting support frame (1411) for placing the material receiving magazine (149) is connected to the material receiving lifting slider. The upper limit and the lower limit are respectively formed at the uppermost end and the lowermost end when the material receiving lifting slider moves along the vertical direction. The material receiving lifting support frame (1411) includes a material receiving lifting baffle (1412) formed in the vertical direction and a material receiving lifting horizontal plate (1413) formed in the horizontal direction. The material receiving lifting baffle (1412) is used to abut and cooperate with the vertical side wall of the material receiving magazine (149), and the material receiving lifting horizontal plate (1413) is used to cooperate with the horizontal bottom wall of the material receiving magazine (149) to form a support; on the inner sides of the two vertical side walls of the material receiving magazine (149), strip-shaped limiting grooves (11211) are formed by horizontal transverse depressions. The limiting grooves (11211) at the same height on the two side walls are used to cooperate to form a material receiving placement position; a plurality of material receiving placement positions are linearly spaced in the vertical direction, and the vertical spacing distance between adjacent material receiving placement positions is consistent with the single movement distance of the material receiving lifting linear module (1410) in the vertical direction.

6. A method for detecting appearance defects of electroplated chips, characterized in that: It is realized based on the electroplated chip appearance defect detection device according to any one of claims 1-5; Specifically, it includes the following steps: Step 1: The tester places the electroplated chip strip to be detected at the discharge track of the feeding device. Step 2: The electroplated chip strip to be detected enters the detection track via the discharge track and undergoes appearance defect detection by the detection component at the detection track. Step 3: The electroplated chip strip to be detected after being detected by the detection component enters the marking track via the detection track, and the marking component marks the electroplated chip strip with a qualified or unqualified mark according to the detection result obtained by the detection component in Step 2. Step 4: The electroplated chip strip after marking enters the blanking track via the marking track and is sorted and blanked at the blanking track.

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