Method, device and readable storage medium for improving underflow line
By analyzing the flow direction and confluence line position of the filler during plastic injection molding, adjusting the flow direction of the filler and increasing the wall thickness, the problem of underflow line defects in plastic injection molding was solved, thereby improving the appearance quality of injection molded parts and increasing production efficiency.
Patent Information
- Application Number
- CN202310288120.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-03-22
- Publication Date
- 2025-12-12
- Estimated Expiration
- 2043-03-22
AI Technical Summary
During plastic injection molding, uneven pressure in the convergence area of plastic filler flows can lead to flow line defects, affecting the product's appearance. Existing technologies make it difficult to identify and optimize these defects in advance.
By acquiring the model file of the target object, the flow direction and confluence position of the filler material are analyzed using process analysis software. The flow direction of the filler material is adjusted to reduce the angle difference, and the wall thickness of the target area is increased to balance the pressure. Model files are generated using modeling software to achieve the prediction and optimization of underflow defects.
Effectively predict and optimize surface flow line defects of injection molded parts, avoid mold repair and rectification after production, improve appearance quality and save rectification cycle and cost.
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Figure CN116442459B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of automobiles, in particular to the technical field of plastic injection molding, and specifically to a method and device for improving a potential flow line and a readable storage medium. BACKGROUND
[0002] In the process of plastic product injection molding, a potential flow line is formed at the confluence area of the plastic filling flow. When the pressures of the confluence filling flows are inconsistent, that is, the pressure of the melt flow on one side of the confluence line is significantly greater than that on the other side, the melt flow on the high-pressure side will extrude to the low-pressure side, that is, the melt flow direction in this area will obviously deviate to one side of the confluence line, causing the confluence line in this area to extrude and deviate to the low-pressure side, and a raised mark is formed on the surface of the plastic product. This mark is the potential flow line.
[0003] Therefore, how to identify the risk of potential flow line defects in advance and optimize and improve them is a technical problem to be solved. SUMMARY
[0004] One of the purposes of the present application is to provide a method and device for improving a potential flow line and a readable storage medium to identify the risk of potential flow line defects in advance and optimize and improve them.
[0005] In a first aspect, a method for improving a potential flow line is provided, which includes: obtaining a model file of a target object; processing the model file by using a preset process analysis software to obtain a molding evaluation result of the target object; the molding evaluation result includes a filling flow direction of the target object and a confluence line position of the filling flow; determining whether the target object has a potential flow line according to the filling flow direction and the confluence line position of the filling flow; and adjusting the filling flow direction in the case that the target object has a potential flow line; the angle difference between the adjusted filling flow direction and the confluence line position is less than a first threshold value.
[0006] According to the above technical means, the model file is processed by using a preset process analysis software to obtain a molding evaluation result of the target object; the filling flow direction of the target object and the confluence line position of the filling flow can be obtained. Further, whether the target object has a potential flow line is determined according to the filling flow direction and the confluence line position of the filling flow; the filling flow direction is adjusted in the case that the target object has a potential flow line; the angle difference between the adjusted filling flow direction and the confluence line position is less than a first threshold value, so that the risk of potential flow line on the surface of the injection molded part can be predicted and optimized and improved. The problem of surface potential flow line defects of the injection molded part after production is avoided, the appearance quality of the injection molded part is improved, and the product rectification period and cost are saved.
[0007] Further, the target object has the potential flow line or not is determined according to the filling flow direction and the meeting line position of the filling flow, comprising: determining a detection area, the detection area is located on both sides of the meeting line position of the filling flow and the distance from the meeting line position of the filling flow is less than a second threshold; in the case that there is an abnormal filling flow direction in the detection area, the abnormal filling flow direction has an angle difference greater than a first threshold with the meeting line position, determining whether the target object has the potential flow line.
[0008] According to the above technical means, in the case that the angle difference between the filling flow direction and the meeting line position is greater than the first threshold, it can be determined that the flow filling pressure on one side of the meeting line is obviously greater than the flow filling pressure on the other side, and then it is determined in advance whether the target object has the potential flow line defect.
[0009] Further, the filling flow direction is adjusted, comprising: determining a target area according to the abnormal filling flow direction, the abnormal filling flow direction is directed to one side of the meeting line position, and the target area is located on the other side of the meeting line position; increasing the wall thickness of the target area according to a first mapping relationship to adjust the filling flow direction; the first mapping relationship has different angle differences and corresponding wall thicknesses.
[0010] According to the above technical means, by increasing the wall thickness of the target area, the flow filling pressure on one side of the meeting line and the flow filling pressure on the other side can be made approximately the same, and then the filling flow direction is adjusted to avoid the mold modification and design change of the surface potential flow line defect of the injection molded part after production, improve the appearance quality of the injection molded part, and save the product modification period and cost.
[0011] Further, the model file of the target object is obtained, comprising: obtaining three-dimensional data of the target object; processing the three-dimensional data by using a preset modeling software to obtain the model file of the target object.
[0012] According to the above technical means, the model file of the target object is obtained, and the target object can be more accurately analyzed.
[0013] In a second aspect, a potential flow line improvement device is provided, the device comprising: an acquisition unit, a processing unit, and a determination unit; the acquisition unit is configured to acquire a model file of a target object; the processing unit is configured to process the model file by using a preset process analysis software to obtain a molding evaluation result of the target object; the molding evaluation result comprises a filling flow direction of the target object and a meeting line position of the filling flow; the determination unit is configured to determine whether the target object has a potential flow line according to the filling flow direction and the meeting line position of the filling flow; and the processing unit is further configured to adjust the filling flow direction in the case that the target object has the potential flow line; the angle difference between the adjusted filling flow direction and the meeting line position is less than a first threshold.
[0014] Further, the determining unit is specifically configured to: determine a detection area, the detection area being located on two sides of the confluence line position of the filling flow and having a distance less than a second threshold value from the confluence line position of the filling flow; and in a case where an abnormal filling flow direction exists in the detection area, the abnormal filling flow direction having an angle difference greater than a first threshold value from the confluence line position, determine whether the target object has a potential flow line.
[0015] Further, the processing unit is specifically configured to: determine a target area according to the abnormal filling flow direction, the abnormal filling flow direction being directed to one side of the confluence line position, and the target area being located on the other side of the confluence line position; and increase a wall thickness of the target area according to a first mapping relationship to adjust the filling flow direction, the first mapping relationship being different in angle difference and corresponding wall thickness.
[0016] Further, the obtaining unit is specifically configured to: obtain three-dimensional data of the target object; and process the three-dimensional data by using a preset modeling software to obtain a model file of the target object.
[0017] In a third aspect, a potential flow line improvement device is provided, which can implement the functions performed by the potential flow line improvement device in the above aspects or possible designs, and the functions can be implemented by hardware, for example, in a possible design, the potential flow line improvement device can include a processor and a communication interface, the processor can be used to support the potential flow line improvement device to implement the functions involved in the first aspect or any possible design of the first aspect.
[0018] In another possible design, the potential flow line improvement device can further include a memory, the memory being used to save computer-executed instructions and data necessary for the potential flow line improvement device. When the potential flow line improvement device is running, the processor executes the computer-executed instructions stored in the memory, so that the potential flow line improvement device performs the potential flow line improvement method in the first aspect or any possible design of the first aspect.
[0019] In a fourth aspect, a computer readable storage medium is provided, which can be a readable nonvolatile storage medium, and the computer readable storage medium stores computer instructions or programs, when the computer instructions or programs are run on a computer, the computer can execute the potential flow line improvement method in the first aspect or any possible design of the aspect.
[0020] In a fifth aspect, a computer program product containing instructions is provided, when the computer program product is run on a computer, the computer can execute the potential flow line improvement method in the first aspect or any possible design of the aspect.
[0021] In a sixth aspect, an electronic device is provided, which includes one or more processors and one or more memories. The one or more memories are coupled to the one or more processors, and the one or more memories are configured to store computer program codes comprising computer instructions, which, when executed by the one or more processors, cause the electronic device to perform the method for improving underflow lines as described in the first aspect or any possible design of the first aspect.
[0022] In a seventh aspect, a chip system is provided, which includes a processor and a communication interface, and can be used to implement the functions performed by the device for improving underflow lines as described in the first aspect or any possible design of the first aspect. In a possible design, the chip system further includes a memory for storing program instructions and / or data. The chip system can be composed of a chip, or can include a chip and other discrete devices, without limitation.
[0023] In an eighth aspect, a vehicle is provided, which includes a processor, a memory for storing instructions executable by the processor, and the processor is configured to execute the instructions to perform the functions performed by the device for improving underflow lines as described in the first aspect or any possible design of the first aspect.
[0024] Therefore, the above technical features of the present application have the following beneficial effects:
[0025] According to the above technical means, the preset process analysis software is used to process the model file to obtain the molding evaluation result of the target object. The filling flow direction of the target object and the position of the filling flow convergence line can be obtained. Further, according to the filling flow direction and the position of the filling flow convergence line, it is determined whether the target object has an underflow line. In the case that the target object has an underflow line, the filling flow direction is adjusted. The angle difference between the adjusted filling flow direction and the position of the convergence line is less than a first threshold value. In this way, the risk of surface underflow lines of the injection molded part can be predicted and optimized. The surface underflow line defect problem of the injection molded part after production is avoided, the appearance quality of the injection molded part is improved, and the product rectification period and cost are saved.
[0026] It should be noted that the technical effects brought by any one of the implementation manners of the second aspect to the fifth aspect can refer to the technical effects brought by the corresponding implementation manners in the first aspect, which will not be described here.
[0027] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present application. BRIEF DESCRIPTION OF DRAWINGS
[0028] The accompanying drawings, which are incorporated herein and constitute part of the specification, illustrate embodiments consistent with the application and, together with the description, function to explain the principles of the application, but are not intended to limit the application to the embodiments illustrated in the drawings.
[0029] Figure 1 A schematic diagram of a subsurface flow line improvement system according to an embodiment of the application;
[0030] Figure 2 A schematic diagram of a subsurface flow line improvement device according to an embodiment of the application;
[0031] Figure 3 A schematic diagram of a subsurface flow line improvement method according to another embodiment of the application;
[0032] Figure 4 A schematic diagram of a junction line location according to an embodiment of the application;
[0033] Figure 5 A schematic diagram of a fill stream direction according to an embodiment of the application;
[0034] Figure 6 A schematic diagram of a fill stream direction according to another embodiment of the application;
[0035] Figure 7 A schematic diagram of a subsurface flow line improvement method according to an embodiment of the application;
[0036] Figure 8 A schematic diagram of a subsurface flow line improvement device according to another embodiment of the application. DETAILED DESCRIPTION
[0037] In order to make the ordinary person skilled in the art better understand the technical solutions of the present disclosure, the technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings.
[0038] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and do not necessarily mean a specific order or sequence. It should be understood that the data thus used can be interchanged under appropriate circumstances, so that the embodiments of the present disclosure described herein can be implemented in an order other than that illustrated or described herein. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. Rather, they are merely examples of devices and methods consistent with some aspects of the embodiments of the present application as detailed in the appended claims.
[0039] It should also be understood that the word "comprising" does not exclude the presence of elements or components other than those listed and / or stated in a given statement.
[0040] It should be noted that the drawings provided in the following embodiments only schematically illustrate the basic concept of the present application, and only the components related to the present application are shown in the drawings, rather than being drawn according to the number, shape and size of the components in actual implementation. The actual implementation of each component can be a random change, and the component layout pattern can be more complex.
[0041] In the injection molding process of a plastic product, a convergence line is formed at the convergence area of the plastic filling flow. When the pressures of the convergence filling flows are inconsistent, that is, the pressure of the melt flow on one side of the convergence line is significantly greater than that on the other side, the melt flow on the high-pressure side extrudes to the low-pressure side, that is, the melt flow direction in this area is obviously deviated to one side of the convergence line, so that the convergence line is extruded and deviated to the low-pressure side, and a protruding mark is formed on the appearance surface of the plastic product. The mark is the potential flow line.
[0042] Therefore, how to identify the risk of potential flow line defects in advance and optimize and improve it is a technical problem to be solved.
[0043] In view of this, the embodiment of the present application provides a potential flow line improvement method applied to a controller in a potential flow line improvement system. The engine heat dissipation system further comprises a first water pump, a second water pump, a temperature regulator, a radiator, and a liquid supplement kettle. The outlet of the first water pump is in communication with the inlet of the engine. The first inlet of the first water pump is in communication with the outlet of the second water pump. The second inlet of the first water pump is in communication with the liquid supplement kettle. The inlet of the temperature regulator is in communication with the outlet of the engine. The first outlet of the temperature regulator is in communication with the liquid supplement kettle. The temperature regulator is configured to be in communication with the radiator through the second outlet of the temperature regulator when the outlet temperature of the improvement liquid after passing through the engine is greater than or equal to a first threshold value. The radiator is in communication with the inlet of the second water pump and the liquid supplement kettle, respectively. The method comprises the following steps: when the engine operates at a first environmental temperature, if the outlet temperature is greater than or equal to the first threshold value, the second water pump is controlled to be in a closed state; the first environmental temperature is less than a second threshold value; when the engine operates at a second environmental temperature, if the outlet temperature is greater than or equal to the first threshold value, the second water pump is controlled to be in an operating state; the second environmental temperature is greater than or equal to a third threshold value, and the third threshold value is greater than or equal to the second threshold value.
[0044] The method provided by the embodiment of the present application will be described in detail below with reference to the drawings of the specification.
[0045] It should be noted that the undercurrent line improvement system described in the embodiments of the present application is used to more clearly illustrate the technical solutions of the embodiments of the present application, and does not constitute a limitation on the technical solutions provided by the embodiments of the present application. Those skilled in the art can know that, with the evolution of the undercurrent line improvement system and the appearance of other undercurrent line improvement systems, the technical solutions provided by the embodiments of the present application are also applicable to similar technical problems.
[0046] Figure 1 A schematic diagram of an undercurrent line improvement system provided by an embodiment of the present application is shown. As shown in the figure, Figure 1 The undercurrent line improvement system 10 can include an undercurrent line improvement device 11 and an injection molding device 12. The undercurrent line improvement device 11 is connected to the injection molding device 12. The undercurrent line improvement device 11 and the injection molding device 12 can be connected in a wireless manner or in a wired manner, which is not limited.
[0047] In the embodiments of the present application, the undercurrent line improvement device 11 can be any electronic device with data processing function. For example, the undercurrent line improvement device 11 can be a computer, a server, etc. The server can be a single server or a server cluster composed of multiple servers. In some embodiments, the server cluster can also be a distributed cluster. The embodiments of the present application do not limit the specific technology, the specific number and the specific device form of the improvement device 11.
[0048] In the embodiments of the present application, the injection molding device 12 can be any device for producing injection molding products. For example, the injection molding device 12 can be an injection molding machine, etc. The embodiments of the present application do not limit the specific technology, the specific number and the specific device form of the injection molding device 12.
[0049] The undercurrent line improvement device 11 is configured to obtain a model file of a target object; process the model file by using a preset process analysis software to obtain a molding evaluation result of the target object; the molding evaluation result includes a filling flow direction of the target object and a position of a convergence line of the filling flow; determine whether the target object has an undercurrent line according to the filling flow direction and the position of the convergence line of the filling flow; and adjust the filling flow direction in the case that the target object has the undercurrent line.
[0050] The injection molding device 12 is configured to produce injection molding products based on the control of the undercurrent line improvement device.
[0051] In different application scenarios, the undercurrent line improvement device 11 and the injection molding device 12 can be independent devices or can be integrated into the same device. The embodiments of the present application do not limit this.
[0052] It should be noted that Figure 1This is just an example framework diagram. Figure 1 The names of the various devices included are unrestricted, and except for Figure 1 In addition to the functional nodes shown, other nodes may also be included, but this application embodiment does not limit this.
[0053] It should be noted that, Figure 1 This is just an example framework diagram. Figure 1 The names of the modules included are unrestricted, and except for Figure 1 In addition to the functional modules shown, other modules may also be included, but this application embodiment does not limit this.
[0054] In practical implementation, Figure 1 Each device in the process can be adopted Figure 2 The shown composition structure, or including Figure 2 The components shown. Figure 2 This is a schematic diagram illustrating the composition of an improvement device 200 provided in an embodiment of this application. The improvement device 200 can be a server, or it can be a chip or system-on-a-chip within the server. Figure 2 As shown, the improvement device 200 includes a processor 201, a communication interface 202, and a communication line 203.
[0055] Furthermore, the improvement device 200 may also include a memory 204. The processor 201, memory 204, and communication interface 202 can be connected via a communication line 203.
[0056] The processor 201 can be a CPU, a general-purpose processor, a network processor (NP), a digital signal processor (DSP), a microprocessor, a microcontroller, a programmable logic device (PLD), or any combination thereof. The processor 201 can also be other devices with processing capabilities, such as circuits, devices, or software modules, without limitation.
[0057] Communication interface 202 is used to communicate with other devices or other communication networks. Communication interface 202 can be a module, circuit, communication interface, or any device capable of enabling communication.
[0058] Communication line 203 is used to transmit information between the components included in the improvement device 200.
[0059] Memory 204 is used to store instructions. These instructions can be computer programs.
[0060] The memory 204 can be a read-only memory (ROM) or other type of static storage device that can store static information and / or instructions, a random access memory (RAM) or other type of dynamic storage device that can store information and / or instructions, an electrically erasable programmable read-only memory (EEPROM), a compact disc read-only memory (CD-ROM) or other optical disk storage, a magneto-optical disk, a magnetic disk storage or other magnetic storage devices, and the like, without limitation.
[0061] It should be noted that the memory 204 can exist independently of the processor 201, or can be integrated with the processor 201. The memory 204 can be used to store instructions or program codes or some data, etc. The memory 204 can be located in the improvement device 200, or can be located outside the improvement device 200, without limitation. The processor 201 is configured to execute the instructions stored in the memory 204, so as to implement the subsurface flow line improvement method provided in the embodiments described below.
[0062] In an example, the processor 201 can include one or more CPUs, for example, the CPU0 and the CPU1 in the CPU 201. Figure 2
[0063] As an optional implementation, the improvement device 200 includes multiple processors, for example, in addition to the processor 201 in the CPU 201, the processor 205 can also be included. Figure 2
[0064] It should be noted that the constituent structures shown in the CPU 201 do not constitute a limitation on each device in the CPU 201, except for the components shown in the CPU 201, each device in the CPU 201 can include more or less components, or combine some components, or different component arrangements. Figure 2 Figure 1 It should be noted that the constituent structures shown in the CPU 201 do not constitute a limitation on each device in the CPU 201, except for the components shown in the CPU 201, each device in the CPU 201 can include more or less components, or combine some components, or different component arrangements. Figure 2 Figure 1 It should be noted that the constituent structures shown in the CPU 201 do not constitute a limitation on each device in the CPU 201, except for the components shown in the CPU 201, each device in the CPU 201 can include more or less components, or combine some components, or different component arrangements. Figure 2
[0065] In the embodiments of the present application, the chip system can be composed of a chip, or can include a chip and other discrete devices.
[0066] In addition, the actions, terms and the like related among the embodiments of the present application can be mutually referenced and are not limited. The message names or parameter names in the messages exchanged between various devices in the embodiments of the present application are only examples, and other names can also be used in specific implementation, which are not limited.
[0067] In order to clearly describe the technical solutions of the embodiments of the present application, in the embodiments of the present application, the same items or similar items with basically the same functions and effects are distinguished by using "first", "second" and the like. The skilled in the art can understand that "first", "second" and the like do not limit the quantity and execution order, and "first", "second" and the like do not necessarily mean different.
[0068] It should be noted that in the present application, the words "exemplary" or "for example" are used to mean serving as an example, instance, or illustration. Any embodiment or design described as "exemplary" or "for example" in the present application should not be construed as being more preferred or advantageous than other embodiments or designs. Rather, the use of the words "exemplary" or "for example" is intended to present concepts in a concrete manner.
[0069] In the present application, "at least one" means one or more, and "multiple" means two or more. The association relationship of the associated objects is described, which means that there can be three relationships, for example, A and / or B, which can represent the following three cases: A exists alone, A and B exist together, and B exists alone, where A and B can be singular or plural. The character " / " generally represents an "or" relationship between the associated objects. "At least one of the following" or similar expressions means any combination of these items, including any combination of single item or multiple items. For example, at least one of a, b, or c can represent a, b, c, a-b, a-c, b-c, or a-b-c, where a, b, and c can be single or multiple.
[0070] The following describes the flow line improvement method provided by the embodiments of the present application in combination with the flow line improvement system shown in the drawings. Figure 1 The flow line improvement method provided by the embodiments of the present application is described in combination with the flow line improvement system shown in the drawings.
[0071] Figure 3 A flow line improvement method is provided for the embodiments of the present application, which is applied to an improvement device and can also be applied to a controller in a flow line improvement system. The controller can be Figure 1 The flow line improvement device 11 in the flow line improvement system 10 can also be a device such as a chip in the flow line improvement device 11.
[0072] The embodiments of the present application are described by taking the flow line improvement device 11 as an example, as shown in the drawings, and the method includes the following S301-S304: Figure 3 The flow line improvement method provided by the embodiments of the present application is described in combination with the flow line improvement system shown in the drawings.
[0073] S301, the undercurrent line improvement device obtains a model file of a target object.
[0074] The target object can be an injection molding product. For example, it can be an automobile pillar interior panel. The model file of the target object can include modeling grid size, grid aspect ratio, etc.
[0075] For example, the grid size of a large injection molding product is 7mm-10mm, the grid size of a medium product is 4mm-6mm, and the grid size of a small product is 1mm-3mm. The grid aspect ratio of a large product is ≤10, and the grid aspect ratio of a medium and small product is ≤5. (For example, a large injection molding product can be 1000mm*500mm, and a medium injection molding product can be 500mm*500mm.)
[0076] As a possible implementation, the undercurrent line improvement device can obtain three-dimensional data of the target object; and use a preset modeling software to process the three-dimensional data to obtain the model file of the target object.
[0077] For example, the preset modeling software can be CADdoctor, HyperMesh, Moldex3D, etc.
[0078] S302, the undercurrent line improvement device uses a preset process analysis software to process the model file to obtain a molding evaluation result of the target object.
[0079] The preset process analysis software can be set as needed. For example, it can be MoldFlow, Moldex3D, etc. The molding evaluation result includes the filling flow direction of the target object and the position of the filling flow convergence line, and can also include the average velocity of the filling flow, etc. The material of the filling flow can be set as needed. For example, it can be plastic, synthetic metal, etc.
[0080] For example, the position of the convergence line can be as shown in Figure 4 .
[0081] As a possible implementation, the undercurrent line improvement device can input the model file into the preset process analysis software to obtain the molding evaluation result of the target object.
[0082] S303, the undercurrent line improvement device determines whether the target object has an undercurrent line according to the filling flow direction and the position of the filling flow convergence line.
[0083] As a possible implementation, the potential flow line improvement device can determine the confluence line position area of the filling flow, and determine whether the direction of the filling flow is obviously deviated, and in the case that the direction of the filling flow is obviously deviated, determine whether the target object has a potential flow line.
[0084] For example, as shown in Figure 5 , the potential flow line improvement device can determine that the direction of the filling flow is obviously deviated in the case that the angle difference between the filling flow direction and the confluence line position is greater than a first threshold. The first threshold can be set as needed, for example, it can be 10 degrees, or 15 degrees, etc. That is, the filling pressure of the left flow of the confluence line is obviously greater than that of the right flow, so that the confluence line is extruded and deviated to the right side, and the appearance surface of the area will appear the protruding potential flow line defect, and it is determined that the appearance surface of the area has the potential flow line defect.
[0085] For another example, as shown in Figure 6 , the potential flow line improvement device can determine that the direction of the filling flow is not obviously deviated in the case that the angle difference between the filling flow direction and the confluence line position is less than or equal to the first threshold. That is, the filling pressure of the left and right flows of the confluence line is basically the same, and the confluence line is not extruded and deviated, so that the appearance surface of the area will not appear the protruding potential flow line defect, and it is determined that the appearance surface of the area has no potential flow line defect.
[0086] For another example, in the case that the preset process analysis software is MoldFlow molding analysis software, the potential flow line improvement device can confirm the confluence line position of the appearance surface of the injection molded product through the output evaluation item Weld lines (confluence line or weld line, which can be used to evaluate the confluence line distribution position and quality of the injection molded product surface).
[0087] It should be noted that the specific description of whether the target object has a potential flow line according to the filling flow direction and the confluence line position of the filling flow in the possible implementation will be described in the subsequent part, and the present application will not be described here.
[0088] S304, the potential flow line improvement device adjusts the filling flow direction in the case that the target object has a potential flow line.
[0089] Among them, the angle difference between the adjusted filling flow direction and the confluence line position is less than the first threshold.
[0090] As a possible implementation, the potential flow line improvement device can adjust the filling flow direction by increasing the wall thickness of the target area.
[0091] It should be noted that the specific description of adjusting the filling flow direction in the possible implementation will be described in the subsequent part, and the present application will not be described here.
[0092] Based on the technical solutions provided in the present application, the preset process analysis software is used to process the model file to obtain the molding evaluation result of the target object; the filling flow direction of the target object and the position of the filling flow convergence line can be obtained. Further, according to the filling flow direction and the position of the filling flow convergence line, it is determined whether the target object has a potential flow line; in the case that the target object has a potential flow line, the filling flow direction is adjusted; the angle difference between the adjusted filling flow direction and the position of the filling flow convergence line is less than a first threshold value, so that the risk of surface potential flow line of the injection molded part can be predicted and optimized and improved. The surface potential flow line defect problem of the injection molded part after production is avoided, mold modification and design change are avoided, the appearance quality of the injection molded part is improved, and the product modification cycle and cost are saved.
[0093] As shown in FIG. 1, in order to determine whether the target object has a potential flow line, S303 in the improvement method of the present application can further include S401-S402. Figure 7
[0094] S401, the potential flow line improvement device determines a detection area.
[0095] The detection area is located on both sides of the position of the filling flow convergence line, and the distance from the position of the filling flow convergence line is less than a second threshold value. The second threshold value can be set as needed. For example, it can be 30 mm.
[0096] As a possible implementation, in the case that the convergence line is a straight line, after determining the position of the convergence line, the potential flow line improvement device can extend to both sides based on the convergence line, and determine the extended area as the detection area.
[0097] As another possible implementation, in the case that the convergence line is a curve, the potential flow line improvement device can correct the convergence line (for example, based on the midpoint of the convergence line, extend in a direction parallel to the target object), obtain the corrected position of the convergence line, and extend to both sides based on the corrected convergence line, and determine the extended area as the detection area.
[0098] S402, the potential flow line improvement device determines whether the target object has a potential flow line in the case that there is an abnormal filling flow direction in the detection area.
[0099] The angle difference between the abnormal filling flow direction and the position of the convergence line is greater than a first threshold value.
[0100] As a possible implementation manner, the underflow line improvement apparatus can divide the detection area into a plurality of sub-areas, determine the filling flow direction of each sub-area, further compare the filling flow direction of each sub-area with the abnormal filling flow direction, determine the angle difference between the filling flow direction of each sub-area and the position of the confluence line, and determine that the target object has the underflow line in a case where the angle difference between the filling flow direction of each sub-area and the position of the confluence line is greater than a first threshold value.
[0101] As another possible implementation manner, the underflow line improvement apparatus can divide the detection area into a plurality of sub-areas, determine the filling flow direction of each sub-area, further compare the filling flow direction of each sub-area with the abnormal filling flow direction, determine the angle difference between the filling flow direction of each sub-area and the position of the confluence line, and determine that the target object has the underflow line in a case where the angle difference between the filling flow direction of each sub-area and the position of the confluence line is greater than a first threshold value.
[0102] It should be noted that the preset proportion can be set as required. For example, the preset proportion can be 10% or the like.
[0103] In a possible embodiment, in order to adjust the filling flow direction, S304 in the improvement method of the application can further specifically include the following S501-S502.
[0104] S501, the underflow line improvement apparatus determines a target area according to the abnormal filling flow direction.
[0105] The abnormal filling flow direction is directed to one side of the position of the confluence line, and the target area is located on the other side of the position of the confluence line.
[0106] For example, in a case where the abnormal filling flow direction is the northeast direction, the underflow line improvement apparatus can determine that the target area is the left area of the position of the confluence line.
[0107] For another example, in a case where the abnormal filling flow direction is the northwest direction, the underflow line improvement apparatus can determine that the target area is the right area of the position of the confluence line.
[0108] S502, the underflow line improvement apparatus increases the wall thickness of the target area according to the first mapping relationship to adjust the filling flow direction.
[0109] The first mapping relationship is different angle difference and corresponding wall thickness. For example, in a case where the angle difference is 15 degrees, the corresponding wall thickness can be +1 mm, and in a case where the angle difference is 16 degrees, the corresponding wall thickness can be +2 mm.
[0110] It should be noted that the above first mapping relationship is only an exemplary description and is not limited.
[0111] In a possible embodiment, to obtain the model file of the target object, S301 in the method for improving the potential flow line can further include the following S601-S602.
[0112] S601, the potential flow line improvement device obtains three-dimensional data of the target object.
[0113] The three-dimensional data of the target object can reflect the installation structure, the reinforcing structure, the flanging structure, the wall thickness design, and the draft design of the target object.
[0114] As a possible implementation manner, the potential flow line improvement device can obtain the three-dimensional data of the target object in response to an input operation of a user. For example, the input operation can be an operation input by an operator through an input device (such as a keyboard) of a computer.
[0115] S602, the potential flow line improvement device processes the three-dimensional data by using a preset modeling software to obtain the model file of the target object.
[0116] The preset modeling software includes but is not limited to CADdoctor, HyperMesh, Moldex3D, and the like.
[0117] As a possible implementation manner, the potential flow line improvement device can perform CAE modeling on the three-dimensional data by using the preset modeling software to obtain the model file of the target object.
[0118] For example, the potential flow line improvement device can output a udm model file by using the CADdoctor modeling software.
[0119] The various schemes in the above embodiments of the present application can be combined under the premise of no contradiction.
[0120] The embodiments of the present application can divide the functions of the improvement device into function modules or function units according to the above method examples. For example, each function module or function unit can be divided according to each function, or two or more functions can be integrated into one processing module. The integrated module can be realized in the form of hardware or in the form of a software function module or function unit. The division of modules or units in the embodiments of the present application is illustrative, and is only a logical function division. Actual implementation can have another division manner.
[0121] In the case of dividing each function module according to each function, Figure 8 A structural schematic diagram of an improvement device is shown. The improvement device can be a server or a chip applied to the server. The improvement device can be used to execute the functions of the server related in the above embodiments. Figure 8The shown improvement device can include: an acquisition unit 701, a processing unit 702, a determination unit 703; the acquisition unit 701 is used for acquiring a model file of a target object; the processing unit 702 is used for processing the model file by using a preset process analysis software, to obtain a forming evaluation result of the target object; the forming evaluation result includes a filling flow direction of the target object and a position of a confluence line of the filling flow; the determination unit 703 is used for determining whether the target object has a potential flow line according to the filling flow direction and the position of the confluence line of the filling flow; the processing unit 702 is further used for adjusting the filling flow direction in a case where the target object has the potential flow line; an angle difference between the adjusted filling flow direction and the position of the confluence line is less than a first threshold value.
[0122] In a possible design, the determination unit 703 is specifically configured to: determine a detection area, the detection area being located on both sides of the position of the confluence line of the filling flow and having a distance less than a second threshold value from the position of the confluence line of the filling flow; and determine whether the target object has the potential flow line in a case where there is an abnormal filling flow direction in the detection area, the angle difference between the abnormal filling flow direction and the position of the confluence line being greater than the first threshold value.
[0123] In a possible design, the processing unit 702 is specifically configured to: determine a target area according to the abnormal filling flow direction; the abnormal filling flow direction is directed to one side of the position of the confluence line, and the target area is located on the other side of the position of the confluence line; and increase a wall thickness of the target area according to a first mapping relationship, to adjust the filling flow direction; the first mapping relationship is different angle differences and corresponding wall thicknesses.
[0124] In a possible design, the acquisition unit 701 is specifically configured to: acquire three-dimensional data of the target object; and process the three-dimensional data by using a preset modeling software, to obtain the model file of the target object.
[0125] The embodiments of the present application further provide a computer readable storage medium. All or part of the processes of the above method embodiments can be instructed by a computer program to relevant hardware to complete, the program can be stored in the above computer readable storage medium, and the program can include the processes of the above method embodiments when executed. The computer readable storage medium can be an internal storage unit of the improved device (including the data sending end and / or the data receiving end) of any of the preceding embodiments, such as a hard disk or a memory of the improved device. The computer readable storage medium can also be an external storage device of the terminal device, such as a plug-in hard disk, a smart media card (SMC), a secure digital (SD) card, a flash card, etc. equipped on the terminal device. Further, the computer readable storage medium can include both the internal storage unit and the external storage device of the improved device. The computer readable storage medium is used to store the computer program and other programs and data required by the improved device. The computer readable storage medium can also be used to temporarily store data that has been output or will be output.
[0126] It should be noted that the terms "first" and "second" and the like in the specification, claims and drawings of the present application are used to distinguish different objects, and are not used to describe a particular order. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device including a series of steps or units is not limited to the listed steps or units, but can optionally include steps or units not listed, or can optionally include other steps or units inherent to the process, method, product or device.
[0127] It should be understood that in the present application, "at least one" means one or more, "multiple" means two or more, "at least two" means two or three and more, and "and / or" is used to describe the association relationship of the associated objects, which means that there can be three relationships, for example, "A and / or B" can mean that there are three cases of only A, only B and A and B at the same time, where A and B can be singular or plural. The character " / " generally represents an "or" relationship between the associated objects. "At least one of the following" or similar expressions means any combination of these items, including any combination of single or multiple items. For example, at least one of a, b or c can mean a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b and c can be single or multiple.
[0128] Those skilled in the art can clearly understand the above-mentioned technical solutions from the description of the above-embodiment, and for the convenience and brevity of description, only the above-mentioned division of functional modules is taken as an example, and in actual application, the above-mentioned functions can be completed by different functional modules according to needs, that is, the internal structure of the device is divided into different functional modules to complete all or part of the functions described above.
[0129] In several embodiments provided in the present application, it should be understood that the disclosed device and method can be implemented in other ways. For example, the device embodiment described above is only illustrative, for example, the division of the modules or units is only a logical function division, and actual implementation can have another division manner, for example, a plurality of units or components can be combined or integrated into another device, or some features can be ignored or not executed. In addition, the coupling or direct coupling or communication connection between the units or components shown or discussed can be indirect coupling or communication connection through some interfaces, devices or units, which can be electrical, mechanical or other forms.
[0130] The units described as separate components can or can not be physically separated, and the components shown as units can be one physical unit or multiple physical units, that is, can be located in one place or can be distributed to multiple different places. Part or all of the units can be selected according to actual needs to achieve the purpose of the embodiment scheme.
[0131] In addition, each functional unit in each embodiment of the present application can be integrated in one processing unit, or each unit can exist physically, or two or more units can be integrated in one unit. The integrated unit can be realized in the form of hardware or in the form of a software functional unit.
[0132] When the integrated unit is realized in the form of a software functional unit and sold or used as an independent product, it can be stored in a readable storage medium. Based on such understanding, the technical solutions of the embodiments of the present application essentially or the parts that make contributions to the prior art or all or part of the technical solutions can be embodied in the form of a software product, which is stored in a storage medium, including a plurality of instructions to make a device (which can be a single chip, a chip, etc.) or a processor execute all or part of the steps of the method described in the embodiments of the present application. The foregoing storage medium includes: a U disk, a mobile hard disk, a ROM, a RAM, a magnetic disk or an optical disk, and various program code storage media.
[0133] The above merely provides the specific implementation of the present application, but the protection scope of the present application is not limited to this. Any change or replacement within the technical scope disclosed by the present application should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.
Claims
1. A method for improving undercurrent lines, characterized in that, The method includes: Obtain the model file of the target object; The model file is processed using pre-set process analysis software to obtain the molding evaluation result of the target object; the molding evaluation result includes the filler flow direction of the target object and the position of the confluence line of the filler flow. Based on the direction of the filler flow and the location of the confluence line of the filler flow, determine whether the target object has a flow line; If the target object has a flow line, adjust the direction of the filler flow; the angle difference between the adjusted filler flow direction and the confluence line position is less than a first threshold.
2. The method according to claim 1, characterized in that, Determining whether the target object has a flow line based on the direction of the filler flow and the position of the confluence line of the filler flow includes: A detection area is defined, wherein the detection area is located on both sides of the confluence line of the filler flow, and the distance from the confluence line of the filler flow is less than a second threshold. If an abnormal filler flow direction exists in the detection area, it is determined whether the target object has a flow line, and the angle difference between the abnormal filler flow direction and the confluence line position is greater than the first threshold.
3. The method according to claim 2, characterized in that, The adjustment of the filler flow direction includes: The target area is determined based on the abnormal filler flow direction; the abnormal filler flow direction points to one side of the confluence line position, and the target area is located on the other side of the confluence line position. The wall thickness of the target region is increased according to the first mapping relationship to adjust the flow direction of the filler material; the first mapping relationship is used to indicate the mapping relationship between different angle differences and corresponding wall thicknesses.
4. The method according to any one of claims 1-3, characterized in that, The process of obtaining the model file of the target object includes: Obtain the 3D data of the target object; The three-dimensional data is processed using pre-set modeling software to obtain a model file of the target object.
5. A subsurface flow improvement device, characterized in that, The device includes: an acquisition unit, a processing unit, and a determination unit; The acquisition unit is used to acquire the model file of the target object; The processing unit is used to process the model file using preset process analysis software to obtain the molding evaluation result of the target object; the molding evaluation result includes the filler flow direction of the target object and the position of the confluence line of the filler flow. The determining unit is used to determine whether the target object has a flow line based on the direction of the filler flow and the position of the confluence line of the filler flow; The processing unit is further configured to adjust the direction of the filler flow when the target object has a flow line; the angle difference between the adjusted filler flow direction and the confluence line position is less than a first threshold.
6. The apparatus according to claim 5, characterized in that, The determining unit is specifically used for: A detection area is defined, wherein the detection area is located on both sides of the confluence line of the filler flow, and the distance from the confluence line of the filler flow is less than a second threshold. If an abnormal filler flow direction exists in the detection area, it is determined whether the target object has a flow line, and the angle difference between the abnormal filler flow direction and the confluence line position is greater than the first threshold.
7. The apparatus according to claim 6, characterized in that, The processing unit is specifically used for: The target area is determined based on the abnormal filler flow direction; the abnormal filler flow direction points to one side of the confluence line position, and the target area is located on the other side of the confluence line position. The wall thickness of the target region is increased according to the first mapping relationship to adjust the flow direction of the filler material; the first mapping relationship is used to indicate the mapping relationship between different angle differences and corresponding wall thicknesses.
8. The apparatus according to any one of claims 5-7, characterized in that, The acquisition unit is specifically used for: Obtain the 3D data of the target object; The three-dimensional data is processed using pre-set modeling software to obtain a model file of the target object.
9. An electronic device, characterized in that, include: processor; Memory used to store the processor's executable instructions; The processor is configured to execute the instructions to implement the method as described in any one of claims 1 to 4.
10. A computer-readable storage medium, characterized in that, When the computer-executable instructions stored in the computer-readable storage medium are executed by the processor of the electronic device, the electronic device is capable of performing the method as described in any one of claims 1 to 4.
Citation Information
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