Cooling system and its usage

Abstract

This application provides a cooling system and its usage method. The cooling system includes: a cooling pipe disposed within a device, through which a cooling medium flows to cool the device and maintain its internal temperature; a first valve, a second valve, and a third valve disposed on the cooling pipe; and a storage cavity whose bottom communicates with the cooling pipe. The storage cavity stores the cooling medium. The first valve is located between the inlet of the cooling pipe and the storage cavity. The second valve is located between the storage cavity and the object to be cooled within the device. The third valve is located between the outlet of the cooling pipe and the object to be cooled. Both the first and third valves are one-way valves.

Description

Technical Field

[0001] This application relates to, but is not limited to, the field of semiconductor manufacturing equipment technology, and in particular to a cooling system and its usage method. Background Technology

[0002] In the semiconductor device manufacturing process, the temperature within the reaction chamber of the equipment has a significant impact on the manufacturing process, thus placing high demands on the cooling system. In the cooling system, cooling water flows through cooling pipes to the vicinity of the reaction chamber. Through water circulation, some excess heat is removed. Water's high specific heat capacity helps stabilize the temperature. The cooling water, along with the heating components, works together to maintain a stable temperature within the reaction chamber. However, unstable cooling water flow can affect the cooling effect on the devices within the reaction chamber, impacting the semiconductor wafers or substrates in the process and even shortening the lifespan of the semiconductor devices. Summary of the Invention

[0003] In view of this, embodiments of this application provide a cooling system and a method of using the same.

[0004] In a first aspect, embodiments of this application provide a cooling system, comprising: a cooling pipe disposed within a device, wherein a cooling medium flowing through the cooling pipe is used to cool the device to maintain the temperature within the device; a first valve, a second valve, and a third valve disposed on the cooling pipe; and a storage cavity whose bottom is connected to the cooling pipe; wherein the storage cavity is used to store the cooling medium; the first valve is located between the inlet of the cooling pipe and the storage cavity; the second valve is located between the storage cavity and the object to be cooled within the device; and the third valve is located between the outlet of the cooling pipe and the object to be cooled, wherein both the first valve and the third valve are one-way valves.

[0005] Secondly, embodiments of this application provide a method for using a cooling system, comprising: applying the above-mentioned cooling system, the method comprising: opening the first valve and closing the second valve, so that the cooling medium is stored in the storage chamber through the cooling pipe; when the cooling medium reaches a first liquid level line in the storage chamber, opening the second valve and the third valve, so that the cooling medium flowing through the cooling pipe cools the device.

[0006] In this embodiment, a first valve, a second valve, and a third valve are provided on the cooling pipe, along with a storage chamber at the bottom connected to the cooling pipe. The storage chamber stores the cooling medium. The first valve is located between the inlet of the cooling pipe and the storage chamber. The second valve is located between the storage chamber and the object to be cooled within the equipment. The third valve is located between the outlet of the cooling pipe and the object to be cooled, and both the first and third valves are one-way valves. This reduces the impact of the cooling medium flow rate at the supply end on the cooling effect on the object to be cooled within the equipment. When the cooling medium flow rate at the supply end is unstable, the cooling medium flowing through the equipment remains unaffected, maintaining a stable flow rate and thus not affecting the cooling effect on the object to be cooled. This results in good process continuity, high product yield, and long product lifespan. Attached Figure Description

[0007] In the accompanying drawings (which are not necessarily drawn to scale), similar reference numerals may describe similar parts in different views. Similar reference numerals with different letter suffixes may indicate different examples of similar parts. The drawings illustrate, by way of example and not limitation, the various embodiments discussed herein.

[0008] Figure 1a This is a schematic diagram of the composition and structure of a cooling system;

[0009] Figures 1b to 1c This is a schematic diagram of the composition structure of a cooling system provided in an embodiment of this application;

[0010] Figures 2a to 2b This is a schematic diagram of the composition structure of a cooling system provided in an embodiment of this application;

[0011] Figure 3 This is a schematic diagram of the composition structure of a cooling system provided in an embodiment of this application;

[0012] Figure 4 and Figure 5 This is a schematic diagram illustrating the implementation process of a cooling system usage method provided in an embodiment of this application. Detailed Implementation

[0013] Exemplary embodiments of the present application will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present application are shown in the drawings, it should be understood that the present application may be implemented in various forms and should not be limited to the specific embodiments set forth herein. Rather, these embodiments are provided to enable a more thorough understanding of the present application and to fully convey the scope of the disclosure of the present application to those skilled in the art.

[0014] In the following description, numerous specific details are set forth in order to provide a more thorough understanding of this application. However, it will be apparent to those skilled in the art that this application can be practiced without one or more of these details. In other instances, to avoid confusion with this application, some technical features well-known in the art have not been described; that is, not all features of actual embodiments are described herein, nor are well-known functions and structures described in detail.

[0015] In the accompanying drawings, for clarity, the dimensions of layers, areas, and elements, as well as their relative dimensions, may be exaggerated. The same reference numerals denote the same elements throughout.

[0016] It should be understood that when an element or layer is referred to as "on," "adjacent to," "connected to," or "coupled to" other elements or layers, it may be directly on, adjacent to, connected to, or coupled to other elements or layers, or there may be intervening elements or layers. Conversely, when an element is referred to as "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" other elements or layers, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc., may be used to describe various elements, components, areas, layers, and / or portions, these elements, components, areas, layers, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, component, area, layer, or portion from another element, component, area, layer, or portion. Therefore, without departing from the teachings of this application, the first element, component, area, layer, or portion discussed below may be referred to as a second element, component, area, layer, or portion. And the discussion of a second element, component, area, layer, or portion does not imply that the first element, component, area, layer, or portion necessarily exists in this application.

[0017] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of this application. When used herein, the singular forms “a,” “an,” and “the” are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising” and / or “including,” when used in this specification, identify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups. When used herein, the term “and / or” includes any and all combinations of the associated listed items.

[0018] To better understand the cooling system provided in the embodiments of this application, the problems existing in the cooling system will be explained below.

[0019] The cooling water system for semiconductor fabrication equipment has very high requirements, such as in Remote Plasma Nitridation (RPN) or photolithography processes. If the cooling water flow rate is insufficient, defects may occur in some components due to poor cooling. For example, heat accumulated on the inner surface of the remote plasma generator cannot dissipate in time, generating excessive nitride gaseous substances. These substances flow with the process gas flow to the surface of the wafer or substrate and condense, forming abnormal particles that affect product yield. Simultaneously, excessive heat accumulation causes changes in the conditions of the process reaction chamber, triggering machine alarms and interrupting the process, affecting process stability, and even shortening device lifespan. Therefore, it is necessary to maintain the temperature in the reaction chamber using cooling water, and the cooling water needs to fluctuate within a very small range. The main parameters of the fluid include pressure and flow rate.

[0020] like Figure 1a The cooling system includes an inlet 10, an outlet 20, and cooling pipes 30. The arrows indicate the direction of cooling water flow. Inlet 10 and outlet 20 are directly connected to the plant. Cooling pipes 30 enter the machine 40. A butterfly valve 43 and a water supply valve 44 are sequentially installed on the cooling pipes 30 in the machine 40. These two valves work together to allow cooling water to flow through the outer wall of the reaction chamber 41, maintaining a stable temperature within the reaction chamber. In implementation, there are multiple reaction chambers, and the cooling pipes can be divided into multiple branches, for example, three branches: a first branch 31, a second branch 32, and a third branch 33. Each branch has a needle valve 42 to control the flow rate of cooling water through the outer wall of the reaction chamber. Each branch can be connected to the cooling water inlet of the reaction chamber via a flexible hose. The outer wall of the reaction chamber has space for cooling water flow, forming a ring shape, to ensure the temperature within the reaction chamber reaches the standard value. Each branch then converges into the cooling pipe 30, which is equipped with a one-way valve 45 and a butterfly valve 46 in sequence, and then connected to the outlet 20, through which the cooling water is discharged to the plant end.

[0021] The cooling system has the following main problems: 1. The water inlet is directly connected to the plant terminal, and the cooling water is affected by the water supply from the plant terminal. When the cooling water flow rate at the plant terminal is unstable, the cooling water flowing through the machine will be affected, resulting in unstable flow rate. This affects the cooling effect of the components in the machine, impacts the wafers in the process, and may even shorten the lifespan of the components; 2. There are no monitoring or alarm components in the system, so it is impossible to predict the reduction of water volume at the plant terminal; 3. The system uses a needle valve to control the flow rate of the cooling water flowing through the outer wall of the reaction chamber, which has low flow control accuracy.

[0022] This application provides a cooling system, including a cooling pipe disposed within a device, a cooling medium flowing through the cooling pipe for cooling the device to maintain the temperature inside the device; a first valve, a second valve, and a third valve disposed on the cooling pipe; and a storage cavity whose bottom is connected to the cooling pipe; wherein the storage cavity is used to store the cooling medium; the first valve is located between the inlet of the cooling pipe and the storage cavity; the second valve is located between the storage cavity and the object to be cooled within the device; and the third valve is located between the outlet of the cooling pipe and the object to be cooled, wherein both the first valve and the third valve are one-way valves.

[0023] Here, the cooling medium can be water, as its high specific heat capacity helps stabilize the temperature, working in conjunction with the heating components in the equipment to maintain a stable temperature within the reaction chamber. The cooling medium can also be a mixture of ethanol and water, glycerol, or a gas. The equipment can be a semiconductor apparatus, or equipment used for vacuum deposition, magnetron sputtering, distillation, etc. The object to be cooled can be the reaction chamber in the apparatus, or a distillation flask in the distillation equipment.

[0024] The cooling pipes can be made of metal or plastic; the first valve can be made of corrosion-resistant and oxidation-resistant materials such as brass, or other metals such as cast iron. The second and third valves can be made of the same or different materials as the first valve. The storage chamber can be square, cylindrical, or other shapes, and its material can be corrosion-resistant and oxidation-resistant, such as stainless steel.

[0025] The following is combined Figure 1b A cooling system provided in this embodiment will be described. For example... Figure 1bAs shown, the cooling system includes a cooling pipe 102 installed inside the device 101. A cooling medium 103 flows through the cooling pipe 102 and through the device 101, carrying away heat from the device 101 to maintain the temperature inside the device 101, ensuring the normal operation of the reaction within the device or improving the yield of the product prepared in the device. A first valve 104, a second valve 105, and a third valve 106 are installed on the cooling pipe, and a storage chamber 107 is connected to the bottom of the cooling pipe 102. The storage chamber 107 stores the cooling medium 103, reducing its impact on the device 101 when the flow rate of the cooling medium 103 at the inlet 108 is too high or too low. The influence of the flow rate of cooling medium 103 in section 1: The first valve 104 is a one-way valve, located between the inlet 108 of the cooling pipe 102 and the storage chamber 107, used to prevent the cooling medium 103 in the storage chamber 107 from flowing back to the inlet; the second valve 105 is located between the storage chamber 107 and the object to be cooled 110 in the equipment 101. The second valve 105 can be a butterfly valve, which is convenient for controlling the connection and closure of the cooling pipe 102 when inspecting the equipment 101; the third valve 106 is a one-way valve, located between the outlet 109 of the cooling pipe 102 and the object to be cooled 110, used to prevent the cooling medium 103 from flowing back. Figure 1b The arrows in the diagram indicate the direction of the cooling medium flow. In this embodiment, the device can be a vacuum coating device, and the cooling medium can be water.

[0026] This embodiment of the application incorporates a first valve, a second valve, and a third valve on the cooling pipe, along with a storage chamber at the bottom connected to the cooling pipe. The storage chamber stores the cooling medium. The first valve is located between the inlet of the cooling pipe and the storage chamber. The second valve is located between the storage chamber and the object to be cooled within the equipment. The third valve is located between the outlet of the cooling pipe and the object to be cooled, and both the first and third valves are one-way valves. This reduces the impact of the cooling medium flow rate at the supply end on the cooling effect on the object to be cooled within the equipment. When the cooling medium flow rate at the supply end is unstable, the cooling medium flowing through the equipment remains unaffected, maintaining a stable flow rate and thus not affecting the cooling effect on the object to be cooled. This results in good process continuity, high product yield, and long product lifespan.

[0027] In some embodiments, the wall of the cooling pipe forms at least a portion of the bottom of the storage cavity, or the bottom of the storage cavity is connected to the cooling pipe via a connecting pipe. For example... Figure 1b As shown, the wall of the cooling pipe 102 serves as the bottom of the storage cavity 107, meaning the storage cavity and the cooling pipe are integrated, which facilitates processing. Figure 1cAs shown, the bottom of the storage chamber 107 is connected to the cooling pipe 102 via a connecting pipe, which facilitates the disassembly and cleaning of the storage chamber. In some embodiments, a valve can be installed on the connecting pipe. When the flow rate of the cooling medium at the inlet is detected to be stable, for example, when the flow rate is within 2.5 ± 0.5 liters per minute (L / min), 3.5 ± 0.5 L / min, 7.0 ± 1.0 L / min, or other preset ranges, the valve is closed. When the flow rate is not within the preset range, the valve is opened to stabilize the flow rate of the cooling medium in the device within the preset range.

[0028] This application provides a cooling system comprising: a cooling pipe disposed within a device, wherein a cooling medium flowing through the cooling pipe is used to cool the device to maintain the temperature within the device; a first valve, a second valve, and a third valve disposed on the cooling pipe; and a storage cavity whose bottom is connected to the cooling pipe; wherein the storage cavity is used to store the cooling medium; the first valve is located between the inlet of the cooling pipe and the storage cavity; the second valve is located between the storage cavity and the object to be cooled within the device; the third valve is located between the outlet of the cooling pipe and the object to be cooled, and both the first valve and the third valve are one-way valves; and a liquid level detection component located in the storage cavity for detecting the liquid level of the cooling medium in the storage cavity.

[0029] The level detection component here can be a level gauge, a water level sensor, or a level transmitter. It can be a contact type, such as a single-flange hydrostatic / dual-flange differential pressure level transmitter, a float-type level transmitter, a magnetic level transmitter, a submersible level transmitter, an electric internal float level transmitter, an electric float-type level transmitter, a capacitive level transmitter, a magnetostrictive level transmitter, or a servo level transmitter; or it can be a non-contact type, such as an ultrasonic level transmitter or a radar level transmitter. Those skilled in the art can choose according to their needs; there are no limitations here.

[0030] The following is combined Figure 2a The cooling system provided in the embodiments of this application will be described, such as... Figure 2a As shown, the cooling system includes a cooling pipe 102 disposed within the device 101, through which a cooling medium 103 flows, passing through the device 101 to maintain the temperature within the device 101, ensuring the normal operation of the reaction within the device or improving the yield of the product prepared in the device; a first valve 104, a second valve 105, and a third valve 106 disposed on the cooling pipe; and a storage cavity 107 whose bottom is connected to the cooling pipe 102; wherein,

[0031] Storage cavity 107 is used to store cooling medium 103.

[0032] The first valve 104 is a one-way valve located between the inlet 108 of the cooling pipe 102 and the storage chamber 107, used to prevent the cooling medium 103 in the storage chamber 107 from flowing back.

[0033] The second valve 105 is located between the storage chamber 107 and the object to be cooled 110 in the device 101. The second valve 105 can be a butterfly valve, which facilitates the control of the connection and closure of the cooling pipe 102 when inspecting the device 101.

[0034] The third valve 106 is a one-way valve located between the outlet 109 of the cooling pipe 102 and the object to be cooled at 110, and is used to prevent the cooling medium 103 from flowing back.

[0035] The liquid level detection component 111 located in the storage cavity 107 is used to detect the liquid level of the cooling medium 103 in the storage cavity 107.

[0036] The system also includes a control component ( Figure 2a Not shown, please refer to Figure 2b When the control component determines that the liquid level is low, it outputs an alert message to indicate that the cooling medium flow at the inlet is fluctuating and unstable. Production line engineers can then take timely measures to improve process continuity.

[0037] In some embodiments, such as Figure 2b As shown, the cooling system also includes a control component 112, which is located outside the wall of the cooling pipe 102 and is used to control the opening and closing of the first valve 104, the second valve 105, and the third valve 106. In some embodiments, the control component may also be disposed on the object to be cooled or may be located outside the equipment; the location of the control component is not limited here.

[0038] In some embodiments, such as Figure 2b As shown, the cooling system also includes an alarm component 113 for issuing alarm information; and a control component 112 for controlling the alarm component 113 to issue alarm information when the liquid level detection component 111 detects that the liquid level of the cooling medium 103 is lower than the first liquid level line.

[0039] Here, the first liquid level line can be a pre-set point value or a range value. For example, it can be half the height of the storage cavity, or one-half to three-quarters of the height of the storage cavity.

[0040] Here, the alarm components can be control panels, speakers, microphones, indicator lights, or other suitable components. Alarm information can be displayed on the control panel, such as a "low level" message, or it can be sent to a remote terminal control via a network connection. It can also be alarm information played through a speaker or microphone, or alarm information emitted by indicator lights. This way, when engineers on the production line see or receive alarm information, they can take timely measures to minimize the impact on the process and improve process continuity.

[0041] In some embodiments, the cooling system further includes a flow detection controller for detecting and controlling the flow rate of the cooling medium as it passes over the object to be cooled. The flow detection controller is a liquid flow controller (LFC), which can control the flow rate within ±1% of a set value, has a fast response time, and can achieve precise control of the liquid flow rate.

[0042] In this embodiment, the device is a semiconductor machine, the object to be cooled is a reaction chamber, and the cooling medium is cooling water. See also Figure 3 The cooling system in this application embodiment includes:

[0043] Cooling pipe 102 is installed inside semiconductor equipment 101, and cooling water 103 flows through cooling pipe 102 through semiconductor equipment 101 to maintain the temperature inside semiconductor equipment 101.

[0044] The first valve 104, the second valve 105, and the third valve 106 are installed on the cooling pipe 102, and the storage cavity 107 is connected to the cooling pipe 102 at the bottom.

[0045] The liquid level detection component 111 is located on the right wall of the storage cavity 107; the control component 112 and alarm component 113 are located at the lower end of the cooling pipe 102.

[0046] Storage chamber 107 is used to store cooling water 103.

[0047] The first valve 104 is located between the water inlet 108 of the cooling pipe 102 and the storage chamber 107.

[0048] The second valve 105 is located between the storage chamber 107 and the reaction chamber 110.

[0049] The third valve 106 is located between the outlet 109 of the cooling pipe 102 and the reaction chamber 110, and both the first valve 104 and the third valve 106 are one-way valves.

[0050] The cooling pipe 102 includes three cooling branch pipes 1021, 1022 and 1023; each cooling branch pipe 1021, 1022 and 1023 is disposed on the outer surface of each reaction chamber 110, and each cooling branch pipe 1021, 1022 and 1023 is provided with a flow detection controller 114.

[0051] The liquid level detection component 111 is used to detect the liquid level of cooling water 103 in the storage chamber 107.

[0052] Alarm component 113 is used to send alarm information.

[0053] The control component 112 is used to control the opening and closing of the first valve 104, the second valve 105 and the third valve 105; it is also used to control the alarm component 113 to issue an alarm message when the liquid level detection component 111 detects that the liquid level of the cooling water 103 is lower than the first liquid level line.

[0054] In this way, when the water flow rate at the plant end is unstable, it will only affect the water level in the storage chamber. Due to the presence of the first valve, the cooling water will not flow back to the plant end. At this time, the cooling water in the storage chamber will be supplied to the cooling pipe installed on the outer wall of the reaction chamber in the machine. When the cooling water flow rate at the plant end is unstable, such as when the flow rate is too small, the cooling water flow rate in the machine can still remain stable. The machine will not trigger an alarm due to the unstable cooling water flow rate at the plant end. Therefore, the semiconductor wafers or substrates in the process can still proceed normally without affecting the stability of the process.

[0055] Figure 3 The diagram shows a cooling pipe comprising three cooling branch pipes. In other embodiments, the cooling branch pipes may include one, two, or more, depending on the number of objects to be cooled. In other embodiments, the liquid level detection component, alarm component, and control component may also be located in other positions as needed.

[0056] In some embodiments, the size of the storage cavity is 0.5 to 3 cubic meters (m²). 3 For example, it can be 1m 3 During implementation, the size of the storage cavity can be customized according to the needs of the equipment, provided that the space occupied is appropriate, so as to meet different requirements.

[0057] In some embodiments, see continue to see Figure 3 The cooling system further includes: a fourth valve located between the second and third valves, and / or a fifth valve located between the cooling pipe outlet and the third valve. Here, the fourth valve can be a water supply valve, which regulates the flow rate of the cooling medium to meet our needs. The fifth valve can be a butterfly valve, facilitating the control of the cooling pipe's connection and disconnection during equipment inspection.

[0058] In some embodiments, the cooling system further includes a fourth valve located between the second valve and the third valve.

[0059] In some embodiments, the cooling system further includes a fifth valve located between the cooling pipe outlet and the third valve.

[0060] In some embodiments, such as Figure 3 As shown, the cooling system may simultaneously include a fourth valve 115, located between the second valve 105 and the third valve 106; and a fifth valve 116, located between the outlet 109 of the cooling pipe 102 and the third valve 106. The fourth valve 115 can regulate the cooling water flow rate to meet the demand. The fifth valve 116 can be used to connect or close the cooling pipe 102 during equipment inspection or maintenance, facilitating inspection and maintenance.

[0061] In some embodiments, the storage cavity is made of stainless steel; at least one of the first to fifth valves is made of brass or cast iron.

[0062] This application provides a method for using a cooling system, applicable to the cooling system described in the above embodiments. The cooling system can be referenced. Figure 1b .

[0063] like Figure 4 As shown, the method includes steps S401 and S402:

[0064] Step S401: Open the first valve and close the second valve to allow the cooling medium to be stored in the storage chamber through the cooling pipe.

[0065] Step S402: When the cooling medium reaches the second liquid level line of the storage chamber, open the second valve and the third valve to allow the cooling medium flowing through the cooling pipe to cool the equipment.

[0066] During implementation, after the cooling water passes through the cooling pipe, it first fills the space of the storage chamber. The second valve then flows through the object to be cooled in the machine. In this way, when the cooling water flow rate at the plant end is unstable, it will only affect the change in the water level in the storage chamber. Because of the presence of the first valve, the cooling water will not flow back to the plant end. When the cooling water flow rate at the plant end is unstable, such as when the flow rate is too low, the cooling water flow rate in the machine can still remain stable. The machine will not trigger an alarm due to the unstable cooling water flow rate at the plant end. Therefore, the semiconductor wafers or substrates in the process can still proceed normally without affecting the stability of the process.

[0067] In some embodiments, the system further includes a control component; step S401 includes:

[0068] The first valve is opened and the second valve is closed by the control component, so that the cooling medium is stored in the storage chamber through the cooling pipe;

[0069] Step S402 includes: when the cooling medium reaches the second liquid level line of the storage chamber, opening the second valve and the third valve through the control component, so that the cooling medium flowing through the cooling pipe cools the equipment. When the cooling medium in the storage chamber reaches the second liquid level line, it indicates that the storage chamber is full. This enables automated control, reduces user intervention, and improves the user experience.

[0070] In some embodiments, the system further includes a liquid level detection component and an alarm component; the method further includes steps S403 and S404:

[0071] Step S403: Detect the level of the cooling medium in the storage cavity using the liquid level detection component;

[0072] Step S404: When the level of the cooling medium is lower than the first level line, the control component controls the alarm component to issue an alarm message. Thus, an alarm is triggered when the level is low, indicating that the flow rate of the cooling medium at the inlet is fluctuating and unstable. Production line engineers can then take timely measures to improve process continuity.

[0073] In some embodiments, the device includes at least one object to be cooled; the system also includes a flow detection controller located on the cooling pipe;

[0074] The method further includes:

[0075] Step S407: Detect and control the flow rate of the cooling medium when it passes through the object to be cooled by the flow detection controller.

[0076] This application provides a method for using a cooling system, applied to, for example... Figure 3 In the cooling system. For example... Figure 5 As shown, the method includes:

[0077] Step S501: Open the first valve and close the second valve through the control component, so that the cooling medium is stored in the storage chamber through the cooling pipe.

[0078] Step S502: When the cooling medium reaches the second liquid level line of the storage chamber, the second valve and the third valve are opened by the control component to cool the equipment by the cooling medium flowing through the cooling pipe.

[0079] Step S503: Detect the level of the cooling medium in the storage cavity using the liquid level detection component.

[0080] Step S504: When the liquid level of the cooling medium is lower than the first liquid level line, the control component controls the alarm component to issue an alarm message.

[0081] Step S505: Detect and control the flow rate of the cooling medium as it passes through the object to be cooled by the flow detection controller on each cooling branch pipe.

[0082] In some embodiments, the size of the storage cavity is 0.5 to 3 m. 3 .

[0083] In the several embodiments provided in this application, it should be understood that the disclosed devices and methods can be implemented in a non-target manner. The device embodiments described above are merely illustrative. For example, the division of units is only a logical functional division, and in actual implementation, there may be other division methods, such as: multiple units or components may be combined, or integrated into another system, or some features may be ignored or not executed. In addition, the various components shown or discussed are coupled to each other or directly coupled.

[0084] The units described above as separate components may or may not be physically separate. The components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of the units may be selected to achieve the purpose of this embodiment according to actual needs.

[0085] The features disclosed in the several method or device embodiments provided in this application can be arbitrarily combined without conflict to obtain new method or device embodiments.

[0086] The above descriptions are merely some embodiments of this application, but the protection scope of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the embodiments of this application should be included within the protection scope of this application. Therefore, the protection scope of this application should be determined by the scope of the claims.

Claims

1. A cooling system, characterized by, The application relates to a cooling device for a device, and belongs to the technical field of cooling devices. The application comprises: a cooling pipe arranged in the device, wherein a cooling medium flowing through the cooling pipe is used to cool the device to maintain the temperature in the device; a first valve, a second valve and a third valve arranged on the cooling pipe, and a storage cavity arranged at the bottom of the cooling pipe and communicated with the cooling pipe; wherein the storage cavity is used to store the cooling medium; the first valve is arranged between the water inlet of the cooling pipe and the storage cavity, and is used to prevent the cooling medium in the storage cavity from flowing backward; the second valve is arranged between the storage cavity and an object to be cooled in the device, and is used to control the communication and closing of the cooling pipe; the third valve is arranged between the water outlet of the cooling pipe and the object to be cooled, and is used to prevent the cooling medium from flowing backward, and the first valve and the third valve are both one-way valves; a liquid level detection assembly arranged in the storage cavity is used to detect the liquid level of the cooling medium in the storage cavity; a control assembly is used to control the opening and closing of the first valve, the second valve and the third valve; an alarm assembly is used to send alarm information; the control assembly is further used to control the alarm assembly to send alarm information when the liquid level detection assembly detects that the liquid level of the cooling medium is lower than a first liquid level line; a flow detection controller arranged on the cooling pipe is used to detect and control the flow of the cooling medium when the cooling medium passes through the object to be cooled; 2. The system of claim 1, wherein, the device is a semiconductor machine, and the object to be cooled is a reaction chamber.

3. The system of claim 1, wherein, The pipe wall of the cooling pipe is at least partially the bottom of the storage cavity, or the bottom of the storage cavity is connected with the cooling pipe through a communication pipe. The cooling pipe comprises at least one cooling branch pipe; 4. The system according to any one of claims 1 to 3, characterized in that, The storage cavity has a size of 0.5 to 3 m 3 .

5. The system of claim 3, wherein, each cooling branch pipe is arranged on the outer surface of each reaction chamber, and the flow detection controller is arranged on each cooling branch pipe. The application further comprises:

6. The system of claim 5, wherein, a fourth valve arranged between the second valve and the third valve, and / or a fifth valve arranged between the water outlet of the cooling pipe and the third valve. The material of the storage cavity is stainless steel; 7. A method of using a cooling system according to any one of claims 1 to 6, wherein, at least the first valve among the first to fifth valves is made of at least one of the following materials: brass and cast iron. The method comprises: opening the first valve, closing the second valve, and storing the cooling medium in the storage cavity through the cooling pipe; when the cooling medium reaches a second liquid level line of the storage cavity, opening the second valve and the third valve, and allowing the cooling medium flowing through the cooling pipe to cool the device; wherein the opening of the first valve, the closing of the second valve and the storage of the cooling medium in the storage cavity through the cooling pipe comprise: opening the first valve, closing the second valve and storing the cooling medium in the storage cavity through the cooling pipe by the control assembly. The opening of the second valve and the third valve when the cooling medium reaches the second liquid level line of the storage cavity to cool the equipment by the cooling medium flowing in the cooling pipe includes: opening the second valve and the third valve by the control assembly when the cooling medium reaches the second liquid level line of the storage cavity to cool the equipment by the cooling medium flowing in the cooling pipe. The method further includes: detecting the liquid level of the cooling medium in the storage cavity by the liquid level detection assembly; and controlling the alarm assembly to send alarm information by the control assembly when the liquid level of the cooling medium is lower than the first liquid level line. The equipment includes at least one object to be cooled; and the method further includes: detecting and controlling the flow of the cooling medium when the cooling medium passes through the object to be cooled by the flow detection controller.

8. The method of claim 7, wherein, The cooling pipe includes at least one cooling branch pipe, each of which is arranged on the outer surface of each of the reaction chambers, and each of which is provided with the flow detection controller. The cooling pipe includes at least one cooling branch pipe, each of which is arranged on the outer surface of each of the reaction chambers, and each of which is provided with the flow detection controller.

9. The method of claim 8, wherein, The storage cavity has a size of 0.5 to 3 m 3 .

Images