Heat dissipation mechanism and electronic device thereof

Abstract

The present application provides a heat dissipation mechanism and an electronic device thereof. The heat dissipation mechanism is adapted to contact a heat generating element of an electronic device to dissipate heat thereof. The heat generating element is connected to a circuit board. The heat dissipation mechanism comprises a rotating shaft and a heat dissipation member. The rotating shaft is disposed on the circuit board. The heat dissipation member is rotatably connected to the rotating shaft. The heat dissipation member comprises a stop surface and a fin body. The stop surface is a bottom surface of the fin body. The stop surface contacts the heat generating element. The heat dissipation mechanism and the electronic device thereof do not need to use complex tools to assemble and disassemble the heat generating element. Not only can the disassembly time be accelerated, but also the risk of product damage can be reduced.

Description

Technical Field

[0001] The present invention provides a heat dissipation mechanism and its electronic device, particularly a heat dissipation mechanism and its electronic device with quick-release function. Background Technology

[0002] Traditional heat dissipation mechanisms require the heat-conducting fins to be inserted into corresponding grooves to contact the heat-generating element during assembly. External tools (such as screwdrivers) are then used to secure the fins with screws or bolts. This process is time-consuming and prone to scratching the fins or element. Replacing the fins or element requires further external tools to remove the screws or bolts and extract the replacement. Therefore, existing heat dissipation mechanisms are inefficient and prone to accidental damage during assembly and disassembly. Designing a tool-free, quick-assembly and easy-to-operate heat dissipation mechanism is a key development challenge for the related equipment manufacturing industry. Summary of the Invention

[0003] The present invention provides a heat dissipation mechanism with quick-release function and its electronic device to solve the above-mentioned problems.

[0004] The claims of this invention disclose a heat dissipation mechanism adapted to contact a heat-generating element to dissipate its heat. The heat-generating element is connected to a circuit board. The heat dissipation mechanism includes a pivot and a heat sink. The pivot is disposed on the circuit board. The heat sink is rotatably connected to the pivot. The heat sink includes a stop surface and a fin body, the stop surface being a bottom surface of the fin body, and the stop surface contacting the heat-generating element.

[0005] The claims of this invention further disclose that the heat sink includes a shaft portion, which is disposed on one side of the fin body and cooperates with the rotating shaft to allow the heat sink to rotate relative to it.

[0006] The claims of this invention further disclose that the heat sink includes a traction portion. The fin body includes a plurality of fin units, the fin units and the traction portion extending from the fin body in opposite directions. The traction portion detachably abuts against the heat-generating element.

[0007] The scope of the patent application of this invention further discloses that the pivot includes a base and a pivot portion, the pivot portion being disposed on one side of the base, the base being located on the circuit board, and cooperating with the heat sink to clamp the heat-generating element.

[0008] The scope of the patent application of this invention further discloses that the base is provided with a plurality of heat dissipation fins.

[0009] The claims of this invention further disclose that the heat sink includes a support portion. The fin body includes a plurality of fin units, and the plurality of fin units and the support portion extend from the fin body in opposite directions. The support portion detachably abuts against the circuit board.

[0010] The claims of this invention further disclose that the heat sink includes a pushing portion. The fin body includes multiple fin units, and the multiple fin units and the pushing portion are respectively disposed on both sides of the pivot member. The pushing portion detachably abuts against the circuit board.

[0011] The claims of this invention also disclose an electronic device comprising a circuit board, a heating element, and a heat dissipation mechanism. The heating element is connected to the circuit board. The heat dissipation mechanism is used to fix the heating element to dissipate its heat. The heat dissipation mechanism includes a pivot and a heat sink. The pivot is disposed on the circuit board. The heat sink is rotatably connected to the pivot. The heat sink includes a stop surface and a fin body, the stop surface being a bottom surface of the fin body, and the stop surface contacting the heating element.

[0012] The claims of this invention further disclose that the circuit board includes a support portion and the heat sink includes a positioning portion, which is disposed on one side of the fin body and can be detachably abutted against the support portion.

[0013] The claims of this invention further disclose a heat dissipation mechanism disposed within a chassis, adapted to contact a heat-generating element to dissipate its heat. The heat dissipation mechanism includes a pivot and a heat sink. The pivot is disposed on a housing of the chassis. The heat sink is rotatably connected to the pivot. The heat sink includes a stop surface and a fin body. The stop surface is a bottom surface of the fin body and contacts the heat-generating element.

[0014] The electronic device of the present invention provides three embodiments of heat dissipation mechanisms for fixing heat-generating elements. In the first embodiment, the heat dissipation mechanism mounts a heat sink on a circuit board via a pivot, and the heat sink's abutment surface has a traction portion. When the heat-generating element is flipped towards the circuit board and positioned, pressure is applied to the traction portion, simultaneously causing the heat sink to rotate relative to the circuit board and press against the heat-generating element. In the second embodiment, the heat dissipation mechanism provides a support portion and a pushing portion on two opposing surfaces of the heat sink. The support portion supports the fin body to prevent strong impact on the heat-generating element, while the pushing portion provides a force application point and further abuts against the circuit board to constrain the heat sink at a specific angle. In the third embodiment, the heat dissipation mechanism positions one side of the heat sink on the circuit board via a pivot, while the other side is detachably locked to the circuit board using a combination of a positioning portion and a supporting portion. In this way, the heat dissipation mechanism and electronic device of the present invention do not require complex tools for assembling and disassembling the heat-generating element, which not only speeds up assembly and disassembly time but also reduces the risk of product damage. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of some components of an electronic device according to an embodiment of the present invention.

[0016] Figures 2 to 4 This is a schematic diagram of the heat dissipation mechanism of the first embodiment of the present invention at different operating stages.

[0017] Figure 5 This is a schematic diagram of other variations of the rotating shaft component according to the first embodiment of the present invention.

[0018] Figure 6 and Figure 7 This is a schematic diagram of the heat dissipation mechanism of the second embodiment of the present invention at different operating stages. Figure 8 and Figure 9 This is a schematic diagram of the heat dissipation mechanism of the third embodiment of the present invention at different operating stages. Figure 10 This is a schematic diagram of the heat dissipation mechanism of the first embodiment of the present invention in other variations.

[0019] Explanation of symbols in the attached drawings:

[0020] 1. Electronic devices;

[0021] 10. Circuit board;

[0022] 101. Connector;

[0023] 102. Supporting part;

[0024] 12. Heating element;

[0025] 12f, Front end;

[0026] 12r, backend;

[0027] 14, 14A, 14B, heat dissipation mechanism;

[0028] 15. Housing;

[0029] 142, 142A, 142B, pivot components;

[0030] 1421, 1421', base;

[0031] 1422. Pivot joint;

[0032] 143, 143A, 143B, heat sinks;

[0033] 143s, stop surface;

[0034] 1431. Fin body;

[0035] 1432, Shaft;

[0036] 1433. Traction unit;

[0037] 1434. Support section;

[0038] 1435. Promotion Department;

[0039] 1436. Positioning section;

[0040] 16. Fixing components. Detailed Implementation

[0041] Please see Figure 1 , Figure 1 This is a schematic diagram of some components of an electronic device 1 according to an embodiment of the present invention. The electronic device 1 may be various types of computer equipment or server equipment, and its application is not limited herein. The electronic device 1 may include a circuit board 10, a heat-generating element 12, and a heat dissipation mechanism 14. The circuit board 10 is disposed within the electronic device 1 and connected to the heat-generating element 12. The heat-generating element 12 may be a hard drive, an interface card, or any electronic component that generates heat. The heat dissipation mechanism 14 contacts the heat-generating element 12 and is adapted to dissipate the heat generated by the heat-generating element 12. The heat dissipation mechanism 14 provides a tool-free quick-release function, allowing users to quickly and conveniently remove and install the heat-generating element 12 without occupying additional internal space in the electronic device 1.

[0042] Please see Figures 2 to 4 and Figure 10 , Figures 2 to 4 This is a schematic diagram of the heat dissipation mechanism 14 of the first embodiment of the present invention at different operating stages. Figure 10 This is a schematic diagram illustrating other variations of the heat dissipation mechanism 14 according to the first embodiment of the present invention. The heat dissipation mechanism 14 may include a pivot 142 and a heat sink 143. The heat dissipation mechanism 14 may be disposed on the circuit board 10 or the housing 15 of the electronic device 1, but the present invention is not limited thereto. In some embodiments, the heat dissipation mechanism 14 is disposed on the circuit board 10, which is used to support the heat-generating element 12, the heat dissipation mechanism 14, and other electronic components; however, the actual application is not limited to this. The circuit board 10 is provided with a connector 101, through which the heat-generating element 12 is connected to the circuit board 10.

[0043] In some embodiments, the pivot member 142 may include a base 1421 and a pivot portion 1422. The base 1421 is placed on the circuit board 10. The pivot portion 1422 is disposed beside the base 1421. The shape and size of the base 1421, and the style and number of the pivot portions 1422 are not limited to the embodiments shown in the figures, and are determined according to design requirements.

[0044] The heat sink 143 is rotatably connected to the pivot 142. Further, the heat sink 143 may optionally include a fin body 1431, a shaft portion 1432, and a traction portion 1433. The fin body 1431 is made of a high thermal conductivity material and designed as a multi-fin unit to increase the contact area with air, significantly improving heat dissipation efficiency. The shaft portion 1432 is located on the side of the fin body 1431. The pivot portion 1422 may be a C-groove structure used to connect the columnar shaft portion 1432. The shapes of the shaft portion 1432 and the pivot portion 1422 are not limited to the embodiments shown in the drawings; for example, the shaft portion 1432 may be designed as a C-groove structure, and the pivot portion 1422 may be designed as a corresponding columnar structure, or other structures capable of pivoting with each other are all within the scope of this invention.

[0045] The heat sink 143 uses the plane of the fin body 1431 facing the heat dissipation element as its stop surface 143s. The stop surface 143s contacts the heat-generating element 12, allowing the heat-generating element 12 to conduct the accumulated heat energy to the heat sink 143, thereby cooling the heat-generating element 12. In some embodiments, the pivot 142 includes a base 1421 disposed on the circuit board 10, so the heat-generating element 12 can be clamped between the base 1421 and the heat sink 143. In some embodiments, such as Figure 5 The base 1421' of the pivot 142 can be designed as a multi-fin unit to increase the contact area with air, which can greatly improve heat dissipation efficiency.

[0046] In some embodiments, the heat sink 143 is provided with a traction portion 1433, which protrudes from the stop surface 143s toward the opposite fin body 1431, and the plurality of fin units of the fin body 1431 and the traction portion 1433 extend in opposite directions respectively. Figures 2 to 4 As shown, the traction part 1433 is preferably located adjacent to the shaft part 1432 and away from the connector 101. In this way, when the traction part 1433 is pushed by the heat dissipation element 12, it can drive the shaft part 1432 to rotate, thereby pulling the fin body 1431 of the heat dissipation element 143 to rotate relative to the circuit board 10.

[0047] The disassembly and assembly process of the heating element 12 and the heat dissipation mechanism 14 is described below. First, as... Figure 2 As shown, the front end 12f of the heating element 12 can be inserted into the connector 101 of the circuit board 10. Then, pressure is applied to the rear end 12r of the heating element 12, causing the heating element 12 to rotate relative to the connector 101 toward the circuit board 10 with the front end 12f as its axis, as shown. Figure 3As shown. The rear end 12r of the heating element 12 continues to be pressed down until the heating element 12 touches the traction part 1433; at this time, the traction part 1433 rotates towards the circuit board 10 along with the heating element 12, causing the heat sink 143 to rotate relative to the rotating shaft 142. When the heat sink 143 rotates relative to the rotating shaft 142 to a predetermined angle (e.g., rotates to a horizontal position), as... Figure 4 As shown, when the heat sink 143 is in the closed state, the stop surface 143s of the heat sink 143 contacts the upper surface of the heating element 12, allowing the accumulated heat energy of the heating element 12 to be transferred to the heat sink 143 through heat conduction and discharged; the lower surface of the heating element 12 is pressed against the base 1421 of the rotating shaft 142, achieving the function of supporting the heating element 12. The value of the predetermined angle depends on the angle between the fin body 1431 and the traction part 1433, so it will not be described in detail.

[0048] When the heating element 12 is positioned, it can be secured to the electronic device 1 by the fixing element 16 to prevent it from flipping upwards, thereby improving assembly stability. The fixing element 16 can be disposed on the circuit board 10 or the housing 15 of the electronic device 1, and its position depends on the size of the heating element 12. The style, quantity, and locking mechanism of the fixing element 16 are not limited to the illustrated embodiment and are determined according to design requirements. If the heating element 12 is secured to the circuit board 10 by the fixing element 16, the heat dissipation mechanism 14 may not require an additional fixing mechanism to prevent the heat sink 143 from flipping upwards, thereby saving structural space and material costs; or, of course, additional fixing mechanisms can be selectively designed to restrict the flipping action of the heat sink 143 according to actual needs, and the various possible variations will not be described in detail here.

[0049] To remove the heating element 12, first release the fixing element 16, then apply force to the heat sink 143 to flip it away from the circuit board 10. Figure 4 The closed state shown is switched to Figure 3 In the open state shown, the traction portion 1433 of the heat sink 143 pushes the rear end 12r of the heating element 12 away from the circuit board 10. Since the traction portion 1433 can detachably abut against the heating element 12, the heating element 12 can be directly pulled out from the connector 101 of the circuit board 10, separating it from the heat dissipation mechanism 14.

[0050] Please see Figure 5 , Figure 5 This is a schematic diagram showing other variations of the rotating shaft 142 according to the first embodiment of the present invention. For example... Figures 2 to 4 As shown, the base 1421 of the previous embodiment is a plate-like structure that supports the heating element 12, and is preferably made of a material with high thermal conductivity. Figure 5In another variant shown, the base 1421' of the pivot 142 is made of a material with high thermal conductivity and may further have a plurality of heat dissipation fins 1423, in order to increase the contact area with air and improve the overall heat dissipation efficiency of the heat dissipation mechanism 14.

[0051] Please see Figure 6 and Figure 7 , Figure 6 and Figure 7 This is a schematic diagram of the heat dissipation mechanism 14A according to the second embodiment of the present invention at different operating stages. In the second embodiment, the components with the same numbers as those in the first embodiment have the same structure and function, and will not be described again here. The heat dissipation mechanism 14 may include a pivot 142A and a heat sink 143A. The pivot 142A is disposed on the circuit board 10. The heat sink 143A is pivotally connected to the pivot 142A and can rotate freely relative to the circuit board 10. The heat sink 143A may optionally include a fin body 1431, a support portion 1434, and a pushing portion 1435. The support portion 1434 may extend and protrude from the abutment surface 143s toward the opposite fin body 1431, and the plurality of fin units of the fin body 1431 and the support portion 1434 extend in opposite directions respectively. The pushing part 1435 may be provided with a shaft part 1432 opposite to the side of the fin body 1431, and the support part 1434 and the pushing part 1435 extend outward in different directions relative to the fin body 1431.

[0052] In some embodiments, the heating element 12 can be inserted into the connector 101 of the circuit board 10 at any angle, and then pressure is applied to the heating element 12 to cause it to flip relative to the connector 101 toward the circuit board 10, such as... Figure 6 As shown. Next, the heat sink 143A is pushed to rotate relative to the circuit board 10 using the pivot 142A, so that the heat sink 143A is moved from... Figure 6 Rotate to the position shown Figure 7 The indicated position means that the stop surface 143s of the heat sink 143 contacts the heating element 12 and dissipates the heat it generates; in this state, the support portion 1434 of the heat sink 143A can abut against the circuit board 10, ensuring that the stop surface 143s of the heat sink 143A can contact the heating element 12. The distance between the circuit board 10 and the stop surface 143s of the heat sink 143A is approximately equivalent to the thickness of the heating element 12. To remove the heating element 12, force can be applied to the pushing portion 1435 to rotate the heat sink 143A relative to the rotating shaft 142A, allowing the heat sink 143A to rotate away from the circuit board 10. Figure 7 Switch to the indicated location Figure 6 At the position shown, the heating element 12 can be freely removed; furthermore, the pushing part 1435 will also abut against the circuit board 10, thereby limiting the flipping angle of the heat sink 143A and preventing the heat sink 143A from suddenly falling back and accidentally hitting the heating element 12.

[0053] Please see Figure 8 and Figure 9 , Figure 8 and Figure 9 This is a schematic diagram of the heat dissipation mechanism 14B according to a third embodiment of the present invention at different operating stages. In the third embodiment, components with the same numbers as those in the previous embodiments have the same structure and function, and will not be described again here. The heat dissipation mechanism 14B may include a pivot 142B and a heat sink 143B. The circuit board 10 may include a support portion 102, the position of which depends on the size of the heat-generating element 12. The height of the support portion 102 is equal to or slightly greater than the thickness of the heat-generating element 12. The pivot 142B is disposed on the circuit board 10 near the connector 101. The heat sink 143B may include a fin body 1431 and a positioning portion 1436. The positioning portion 1436 is located on the side of the fin body 1431 opposite to the pivot portion 1432, and its position corresponds to the support portion 102.

[0054] To install the heating element 12 and the heat dissipation mechanism 14, first insert the heating element 12 into the connector 101 of the circuit board 10, then apply pressure to the heating element 12 so that it flips relative to the connector 101 toward the circuit board 10. Figure 8 The position shown is transformed to Figure 9 As shown in the diagram, the positioning portion 1436 of the heat sink 143B abuts against the support portion 102. Since the height of the support portion 102 is equal to or slightly greater than the thickness of the heating element 12, it protects the heating element 12 from strong impacts from the heat sink 143B. Furthermore, the positioning portion 1436 of the heat sink 143B can be further secured to the support portion 102 of the circuit board 10 using an external component (not shown in the diagram). The locking between the positioning portion 1436 and the support portion 102 restricts the rotation of the heat sink 143B, allowing the heating element 12 to be stably held between the circuit board 10 and the heat sink 143B. To remove the heating element 12, the support portion 102 and the positioning portion 1436 can be separated first, and then the heat sink 143B can be pushed away from the circuit board 10 and rotated to remove the heating element 12 from the connector 101.

[0055] In summary, the electronic device of the present invention provides three embodiments of heat dissipation mechanisms for fixing heat-generating elements. The first embodiment's heat dissipation mechanism mounts a heat sink on a circuit board via a pivot, and the heat sink's abutment surface has a traction portion; when the heat-generating element is flipped towards the circuit board and positioned, pressure is applied to the traction portion, simultaneously causing the heat sink to rotate relative to the circuit board and press against the heat-generating element. The second embodiment's heat dissipation mechanism provides a support portion and a pushing portion on two opposing surfaces of the heat sink; the support portion supports the fin body to prevent strong impact on the heat-generating element, while the pushing portion provides a force application point and further abuts against the circuit board to restrict the heat sink at a specific angle. The third embodiment's heat dissipation mechanism positions one side of the heat sink on the circuit board via a pivot, while the other side is detachably locked to the circuit board using a combination of a positioning portion and a supporting portion. In this way, the heat dissipation mechanism and electronic device of the present invention do not require complex tools for assembling and disassembling the heat-generating element, which not only speeds up assembly and disassembly time but also reduces the risk of product damage.

[0056] The above description is only a preferred embodiment of the present invention. All equivalent changes and modifications made within the scope of the claims of the present invention should be included in the scope of the present invention.

Claims

1. A heat dissipation mechanism, characterized in that, Suitable for contacting a heating element to dissipate its heat, the heating element being connected to a circuit board, the heat dissipation mechanism comprising: A pivot component is mounted on the circuit board; and A heat sink is rotatably connected to the pivot member. The heat sink includes a stop surface and a fin body. The stop surface is a bottom surface of the fin body. The heat sink also includes a traction portion disposed on the stop surface near the heat-generating element; The heating element is adapted to press against the traction part to drive the heat sink to rotate relative to the circuit board via the rotating shaft, so that the heat sink contacts the heating element with the stop surface.

2. The heat dissipation mechanism as described in claim 1, characterized in that, The heat sink includes a shaft portion, which is disposed on one side of the fin body and cooperates with the pivot to allow the heat sink to rotate relative to it.

3. The heat dissipation mechanism as described in claim 1, characterized in that, The fin body comprises multiple fin units, and the multiple fin units and the traction portion extend from the fin body in opposite directions, and the traction portion can detachably abut against the heating element.

4. The heat dissipation mechanism as described in claim 1, characterized in that, The pivot component includes a base and a pivot portion, which is disposed on one side of the base. The base is located on the circuit board and cooperates with the heat sink to clamp the heat-generating element.

5. The heat dissipation mechanism as described in claim 4, characterized in that, The base has multiple heat dissipation fins.

6. The heat dissipation mechanism as described in claim 1, characterized in that, The heat sink includes a support portion, the fin body includes multiple fin units, the multiple fin units and the support portion extend from the fin body in opposite directions, and the support portion is detachably abutted against the circuit board.

7. The heat dissipation mechanism as described in claim 1, characterized in that, The heat sink includes a pushing part, and the fin body includes multiple fin units. The multiple fin units and the pushing part are respectively disposed on both sides of the rotating shaft. The pushing part can be detachably abutted against the circuit board.

8. An electronic device, characterized in that, It includes: A circuit board; A heating element is connected to the circuit board; and A heat dissipation mechanism is used to fix the heat-generating element to dissipate its heat, the heat dissipation mechanism comprising: A pivot component is mounted on the circuit board; and A heat sink is rotatably connected to the pivot member. The heat sink includes a stop surface and a fin body. The stop surface is a bottom surface of the fin body. The heat sink also includes a traction portion disposed on the stop surface near the heat-generating element; The heating element is adapted to press against the traction part to drive the heat sink to rotate relative to the circuit board via the rotating shaft, so that the heat sink contacts the heating element with the stop surface.

9. The electronic device as claimed in claim 8, characterized in that, The heat sink includes a shaft portion which is disposed on one side of the fin body and cooperates with the pivot to allow the heat sink to rotate relative to it.

10. The electronic device as claimed in claim 8, characterized in that, The fin body comprises multiple fin units, and the multiple fin units and the traction portion extend from the fin body in opposite directions, and the traction portion can detachably abut against the heating element.

11. The electronic device as claimed in claim 8, characterized in that, The pivot component includes a base and a pivot portion, which is disposed on one side of the base. The base is located on the circuit board and cooperates with the heat sink to clamp the heat-generating element.

12. The electronic device as claimed in claim 11, characterized in that, The base has multiple heat dissipation fins.

13. The electronic device as claimed in claim 8, characterized in that, The heat sink includes a support portion, the fin body includes multiple fin units, the multiple fin units and the support portion extend from the fin body in opposite directions, and the support portion can be detachably abutted against the circuit board.

14. The electronic device as claimed in claim 8, characterized in that, The heat sink includes a pushing part, and the fin body includes multiple fin units. The multiple fin units and the pushing part are respectively disposed on both sides of the rotating shaft. The pushing part can be detachably abutted against the circuit board.

15. The electronic device as claimed in claim 8, characterized in that, The circuit board includes a support portion, and the heat sink includes a positioning portion disposed on one side of the fin body and detachably abutting against the support portion.

16. A heat dissipation mechanism, characterized in that, Located within a chassis, and adapted to contact a heat-generating element for heat dissipation, the heat dissipation mechanism includes: A pivot component is mounted on a housing of the chassis; and A heat sink is rotatably connected to the pivot member. The heat sink includes a stop surface and a fin body. The stop surface is a bottom surface of the fin body. The heat sink also includes a traction portion disposed on the stop surface near the heat-generating element; The heating element is adapted to press against the traction part to drive the heat sink to rotate relative to the housing via the rotating shaft, so that the heat sink contacts the heating element with the stop surface.

17. The heat dissipation mechanism as described in claim 16, characterized in that, The heat sink includes a shaft portion, which is disposed on one side of the fin body and cooperates with the pivot to allow the heat sink to rotate relative to it.

18. The heat dissipation mechanism as described in claim 16, characterized in that, The fin body comprises multiple fin units, and the multiple fin units and the traction portion extend from the fin body in opposite directions, and the traction portion can detachably abut against the heating element.

19. The heat dissipation mechanism as described in claim 16, characterized in that, The heat sink includes a support portion, the fin body includes multiple fin units, the multiple fin units and the support portion extend from the fin body in opposite directions, and the support portion is detachably abutted against the housing.

20. The heat dissipation mechanism as described in claim 16, characterized in that, The heat sink includes a pushing part, and the fin body includes multiple fin units. The multiple fin units and the pushing part are respectively disposed on both sides of the rotating shaft. The pushing part can be detachably abutted against the housing.

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