Gas sensor temperature measurement structure, constant temperature control device and constant temperature gas probe module

Abstract

The present invention provides a gas sensor temperature measurement structure, comprising a first temperature sensor and an insulating heat-conducting unit, wherein the insulating heat-conducting unit is arranged in contact with multiple electrode lead pins of the gas sensor to achieve heat conduction; the first temperature sensor is arranged in close proximity to the insulating heat-conducting unit and is used to collect the temperature of the gas sensor. The present invention also provides a gas sensor constant temperature control device, comprising: the aforementioned gas sensor temperature measurement structure, which is used to collect the temperature of the gas sensor; a heating structure, which is arranged in close proximity to the gas sensor housing and is used to heat the gas sensor; and a signal processing circuit, which is electrically connected to the temperature measurement structure and the heating structure, respectively. The present invention also provides a constant temperature gas probe module, comprising a flameproof housing and a constant temperature control device, a gas sensor, and a signal processing circuit board arranged inside the flameproof housing.

Description

Technical Field

[0001] The present invention relates to the field of temperature-adjustable gas detection, and in particular to a gas sensor temperature measurement structure, a constant temperature control device and a constant temperature gas probe module. Background Art

[0002] Currently, industrial gas detectors used in industrial sites in cold regions, particularly those outdoors where temperatures drop below -20°C, rarely function properly due to the extreme cold. To eliminate the threat posed by toxic and explosive gases to a safe production environment, ensuring that detector alarm systems can operate properly in ultra-low temperature environments is crucial. This requires efficient sensor heating, precise temperature measurement, and control to ensure optimal operating conditions.

[0003] CN2021211732047 discloses a temperature-compensating infrared photoconductive sensor. This sensor incorporates a bare thermistor chip within an optical detection cavity to detect the ambient temperature within the cavity and perform temperature compensation on the first detection signal output by the main sensor chip. However, this technical solution requires modifying the internal structure of the conventional infrared photoconductive sensor, which is costly and difficult to implement.

[0004] CN217484301U discloses a gas sensor constant temperature control system, which is arranged outside the gas sensor body and uses an NTC temperature measuring device to monitor the surrounding ambient temperature. When the external temperature is detected to be too low, the power resistor in the heating device is used to generate heat, and the heat is transferred from the outside of the gas sensor body to the inside of the gas sensor body through an insulating thermal pad. This prevents the gas sensor from operating in an excessively low temperature environment and affecting the sensitivity of the gas sensor, thereby achieving temperature control of the gas sensor, avoiding failure of the gas sensor due to excessively low external ambient temperature, expanding the operating temperature range of the gas sensor, extending the service life in low-temperature environments, and making the operating environment temperature more constant. However, the above-mentioned gas sensor constant temperature control system uses the method of measuring the ambient temperature. The ambient temperature still deviates from the temperature inside the optical detection cavity inside the gas sensor. Therefore, when the temperature of the gas sensor is controlled based on the detected ambient temperature, the operating environment temperature obtained may be higher or lower than the normal operating temperature.

[0005] In order to solve the above problems, people have been seeking an ideal technical solution. Summary of the Invention

[0006] The purpose of the present invention is to address the deficiencies of the existing technology and thus provide a gas sensor temperature measurement structure, a constant temperature control device and a constant temperature gas probe module, which can accurately measure and control the internal temperature of the gas sensor on the outside.

[0007] In order to achieve the above-mentioned objectives, the first aspect of the present invention provides a gas sensor temperature measurement structure, including a first temperature sensor and an insulating heat-conducting unit, wherein the insulating heat-conducting unit is arranged in contact with multiple electrode lead pins of the gas sensor to achieve heat conduction; the first temperature sensor is arranged in close contact with the insulating heat-conducting unit to collect the temperature of the gas sensor.

[0008] In specific implementation, due to the influence of the heat conduction process and the surrounding environment, there is still a certain error between the temperature measured by the first temperature sensor and the internal temperature of the gas sensor. Therefore, a temperature compensation unit is required. The temperature compensation unit includes a second temperature sensor and an MCU controller. The second temperature sensor is used to collect the ambient temperature. The MCU controller is connected to the first temperature sensor and the second temperature sensor respectively, and is used to compensate the gas sensor temperature according to the ambient temperature. The compensation formula is: T=T 测 +T 补 , where T 补 =0.131—0.0136T 环 , T 环 -40 to 10°C, which is the ambient temperature collected by the second temperature sensor; T 测 The gas sensor temperature collected by the first temperature sensor.

[0009] In one embodiment, the insulating heat-conducting unit includes an insulating heat-conducting layer and a plurality of heat-conducting columns arranged corresponding to the electrode lead-out pins of the gas sensor. A through hole with an inner diameter equal to the outer diameter of the electrode lead-out pin of the gas sensor is opened in the heat-conducting column. The electrode lead-out pin of the gas sensor passes through the heat-conducting column and is installed on a signal processing circuit board to achieve electrical connection with the signal processing circuit board; the outer side of the heat-conducting column is arranged to abut against the insulating heat-conducting layer.

[0010] In another embodiment, the insulating heat-conducting unit includes an insulating heat-conducting layer and a plurality of conductive heat-conducting columns arranged corresponding to the electrode lead-out pins of the gas sensor, and the outer sides of the conductive heat-conducting columns are arranged in contact with the insulating heat-conducting layer; one end of the conductive heat-conducting column is installed on the signal processing circuit board to achieve electrical connection with the signal processing circuit board, and the other end is provided with a accommodating cavity, and the electrode lead-out pins of the gas sensor are inserted into the accommodating cavity.

[0011] A second aspect of the present invention provides a gas sensor constant temperature control device, comprising:

[0012] A temperature measurement structure, which is the aforementioned gas sensor temperature measurement structure, is used to collect the gas sensor temperature;

[0013] The heating structure is arranged close to the gas sensor housing and is used to heat the gas sensor;

[0014] A signal processing circuit is electrically connected to the temperature measuring structure and the heating structure respectively.

[0015] In a specific implementation, the heating structure includes a heater and a heat-conducting ring. The heater is tightly arranged on the heat-conducting ring. The heat-conducting ring is sleeved on the outside of the gas sensor. The outside of the heat-conducting ring is also sleeved with a heat-insulating sleeve.

[0016] In a specific implementation, in order to increase the contact area between the triode heater and the thermally conductive ring and improve the heating efficiency, a plurality of heating planes are evenly distributed on the thermally conductive ring, each heating plane is fitted with a triode heater, and a plurality of accommodating cavities are provided on the inner wall of the thermal insulation sleeve corresponding to the plurality of heating planes.

[0017] A third aspect of the present invention provides a constant temperature gas probe module, comprising a flameproof housing and a constant temperature control device, a gas sensor, and a signal processing circuit board arranged inside the flameproof housing.

[0018] The constant temperature control device is the aforementioned gas sensor constant temperature control device, which is electrically connected to the signal processing circuit board to achieve constant temperature control of the gas sensor;

[0019] The gas sensor is mounted on the signal processing circuit board and is electrically connected to the signal processing circuit board to achieve gas detection.

[0020] A fourth aspect of the present invention provides a gas detector comprising the aforementioned constant temperature gas probe module.

[0021] The present invention has outstanding substantive features and significant progress compared to the prior art. Specifically, the present invention indirectly measures the temperature inside the gas sensor by measuring the temperature of the electrode connected to the inner cavity of the gas sensor, and accurate temperature measurement can be achieved without modifying the internal structure of the gas sensor.

[0022] The present invention takes into account the heat loss caused by the influence of the surrounding environment during the heat conduction process, and further proposes a method for temperature compensation using the ambient temperature. The compensation formula is T=T 测 +T 补 , where T 补 =0.131—0.0136T 环 , T 环 -40 to 10°C, which is the ambient temperature collected by the second temperature sensor; T 测 The gas sensor temperature collected by the first temperature sensor.

[0023] The present invention utilizes a heater, a heat-conducting ring and a heat-insulating sleeve to form a heating structure, which cooperates with a temperature measuring structure to achieve constant temperature control of the gas sensor. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 Schematic diagram of the exploded structure of the gas sensor temperature measurement structure according to embodiment 1 of the present invention.

[0025] Figure 2 It is a structural schematic diagram of the insulating heat-conducting unit described in Example 1 of the present invention.

[0026] Figure 3 Schematic diagram of the exploded structure of the gas sensor temperature measurement structure according to embodiment 3 of the present invention.

[0027] Figure 4 Schematic diagram of the explosion structure of the gas sensor constant temperature control device according to Example 4 of the present invention.

[0028] Figure 5 It is a schematic cross-sectional structural diagram of the constant temperature gas probe module described in Example 5 of the present invention.

[0029] In the figure, 1. First temperature sensor; 2. Gas sensor; 3. Electrode lead pin; 4. Thermal conductive column; 5. Insulating thermal conductive layer; 6. Signal processing circuit board; 7. Second temperature sensor; 8. MCU controller; 9. Sensor seat; 10. Heater; 11. Thermal conductive ring; 12. Thermal insulation sleeve; 13. Probe seat; 14. Protective cover; 15. Fixing ring; 17. Sealing ring; 19. Output wire; 20. Dust cover; 21. Semipermeable membrane molecular sieve. DETAILED DESCRIPTION

[0030] The technical solution of the present invention is further described in detail below through specific implementation methods.

[0031] Example 1

[0032] This embodiment provides a triode heater type explosion-proof gas probe module, such as Figure 1 As shown, it includes a first temperature sensor 1 and an insulating heat-conducting unit, and the insulating heat-conducting unit is arranged to abut against multiple electrode lead pins of the gas sensor 2 to achieve heat conduction; the first temperature sensor 1 is arranged close to the insulating heat-conducting unit and is used to collect the inner cavity temperature of the gas sensor 2.

[0033] Since the electrode lead pin 3 of the gas sensor 2 is connected to the inner cavity of the gas sensor 2, according to thermal conductivity, the electrode lead pin 3 of the gas sensor should be equal to the temperature of the inner cavity of the gas sensor. Therefore, the first temperature sensor can be used to measure the electrode lead pin 3 of the gas sensor 2; and since the volume of the electrode lead pin 3 of the gas sensor 2 is small, the first temperature sensor 1 cannot be set close to it. Therefore, an insulating heat-conducting unit is set. Without affecting the electrical performance of the electrode lead pin 3 of the gas sensor 2, the insulating heat-conducting unit is used to conduct the temperature on the electrode lead pin 3, and the first temperature sensor 1 is set close to the insulating heat-conducting unit to achieve temperature measurement of the electrode lead pin 3, and then indirectly achieve accurate measurement of the inner cavity temperature of the gas sensor 2 without the need to modify the internal structure of the gas sensor 2.

[0034] In specific implementation, Figure 1 As shown, the insulating heat-conducting unit includes an insulating heat-conducting layer 5 and a plurality of heat-conducting columns 4 arranged corresponding to the electrode lead-out pins 3 of the gas sensor 2. A through hole with an inner diameter equal to the outer diameter of the electrode lead-out pin 3 of the gas sensor 2 is opened in the heat-conducting column 4. The electrode lead-out pin 3 of the gas sensor 2 passes through the heat-conducting column and is installed on the signal processing circuit board 6 to achieve electrical connection with the signal processing circuit board 6; the outer side of the heat-conducting column 4 is arranged in contact with the insulating heat-conducting layer 5.

[0035] In this case, the electrode lead pin 3 of the gas sensor 2 is directly electrically connected to the signal processing circuit board 6; at the same time, the heat conducted by the electrode lead pin 3 of the gas sensor 2 will be transferred to the insulating heat-conducting layer 5, and the first temperature sensor 1 can measure the temperature of the inner cavity of the gas sensor 2 by measuring the temperature of the insulating heat-conducting layer 5.

[0036] It can be understood that the insulating heat-conducting layer 5 and the heat-conducting column 4 are made of heat-conducting materials, such as silicone materials and foam materials, to play the role of insulation and heat conduction.

[0037] Further, such as Figure 2 As shown, in order to reduce the improvement of the signal processing circuit board 6, the insulating heat-conducting unit also includes a sensor seat 9, and a plurality of through holes are opened on the sensor seat 9 for the thermally conductive column 4 to pass through. The insulating heat-conducting layer 5 is arranged on the signal processing circuit board 6 and is arranged in contact with the outer side of the thermally conductive column 4; when in use, the electrode lead pin 3 of the gas sensor 2 is sleeved in the thermally conductive column 4 and realizes electrical connection with the signal processing circuit board 6.

[0038] In other embodiments, the insulating heat-conducting unit may also include only an insulating heat-conducting layer 5, wherein the insulating heat-conducting layer 5 can be arranged on the signal processing circuit board 6 and directly abut the pad connected to the electrode lead pin 3 of the gas sensor 2.

[0039] Example 2

[0040] This embodiment provides another specific embodiment of the insulating heat-conducting unit, which includes an insulating heat-conducting layer 5 and a plurality of conductive heat-conducting columns arranged corresponding to the electrode lead pins 3 of the gas sensor 2, and the outer sides of the conductive heat-conducting columns are arranged in contact with the insulating heat-conducting layer 5; one end of the conductive heat-conducting column is installed on the signal processing circuit board 6 to achieve electrical connection with the signal processing circuit board 6, and the other end is provided with a accommodating cavity, and the electrode lead pins 3 of the gas sensor 2 are inserted into the accommodating cavity.

[0041] In this case, the electrode lead pin 3 of the gas sensor 2 is electrically connected to the signal processing circuit board 6 through the conductive heat-conducting column; at the same time, the heat conducted by the electrode lead pin 3 of the gas sensor 2 is transferred to the insulating heat-conducting layer 5 through the conductive heat-conducting column, and the first temperature sensor 1 can measure the temperature of the inner cavity of the gas sensor 2 by measuring the temperature of the insulating heat-conducting layer 5.

[0042] It can be understood that the insulating heat-conducting layer 5 and the conductive heat-conducting column are made of conductive heat-conducting materials, such as silver and copper metal materials, so as to play the dual role of electrical conduction and heat conduction.

[0043] Example 3

[0044] The difference between this embodiment and embodiment 1 or 2 is that: it also includes a temperature compensation unit, which includes a second temperature sensor 7 and an MCU controller 8. The second temperature sensor 7 is used to collect the ambient temperature; the MCU controller 8 is connected to the first temperature sensor 1 and the second temperature sensor 7 respectively, and is used to compensate the temperature of the gas sensor according to the ambient temperature. The compensation formula is: T = T 测 +T 补 , where T 补 =0.131—0.0136T 环 , T 环 -40 to 10°C, which is the ambient temperature collected by the second temperature sensor 7; T 测 It is the gas sensor temperature collected by the first temperature sensor 1.

[0045] Since the heat conduction process is easily affected by the surrounding environment and generates heat loss, there is a certain error between the measured temperature of the electrode lead pin 3 and the temperature of the gas sensor cavity. This embodiment performs temperature compensation on the measured temperature of the electrode lead pin 3 based on the surrounding environment temperature, which can make the measured temperature of the electrode lead pin 3 closer to the temperature of the gas sensor 2 cavity.

[0046] In a specific implementation, the second temperature sensor 7 and the MCU controller 8 can be arranged on the signal processing circuit board 6, as shown in FIG. Figure 3 As shown, it can also be a structure independent of the signal processing circuit board 6.

[0047] Example 4

[0048] This embodiment provides a gas sensor constant temperature control device, comprising:

[0049] A temperature measurement structure, wherein the temperature measurement structure is the gas sensor temperature measurement structure described in any one of embodiments 1-3, and is used to collect the temperature of the gas sensor;

[0050] The heating structure is arranged close to the gas sensor housing and is used to heat the gas sensor;

[0051] A signal processing circuit is electrically connected to the temperature measuring structure and the heating structure respectively.

[0052] The present invention utilizes a heating structure in conjunction with a temperature measurement structure to achieve constant temperature control of the gas sensor 2. Specifically, when the outside temperature is too low, the gas sensor 2 is affected by the ambient temperature, and its internal temperature also drops, becoming unable to stabilize at its operating ambient temperature. At this point, the first temperature sensor 1 senses the internal temperature of the gas sensor 2, and the heating structure heats the gas sensor 2, ensuring that the temperature of the reaction chamber of the gas sensor 2 is always maintained within a normal operating range, unaffected by the outside temperature, thereby preventing detection from being affected or failing.

[0053] For ease of understanding, this embodiment provides a specific embodiment of the heating structure.

[0054] like Figure 4 As shown, in this embodiment, the heating structure includes a heater 10 and a heat-conducting ring 11. The heater 10 is tightly arranged on the heat-conducting ring 11. The heat-conducting ring 11 is sleeved on the outside of the gas sensor 2. An insulating sleeve 12 is also sleeved on the outside of the heat-conducting ring 11.

[0055] Preferably, the heater 10 is a triode heater, which has the advantages of simple temperature control, high heat conversion rate, long life and low cost; and the heat-conducting ring 11 is sleeved on the outside of the gas sensor 2, and the heat-conducting ring 11 is used to achieve uniform heating of the gas sensor 2, and the heat-insulating sleeve 12 is added outside the heat-conducting ring 11 to prevent internal and external heat loss and improve heating efficiency; thereby achieving efficient heating, precise temperature measurement and control of the gas sensor 2, ensuring that the gas sensor 2 always operates in an optimal temperature environment.

[0056] In a specific embodiment, the heat-conducting ring 11 is an annular aluminum alloy heating ring. The heat-insulating sleeve 12 is formed by hot-pressing asbestos and phenolic resin, offering the advantages of compact structure, insulation, and heat resistance. Phenolic resin is a thermosetting plastic and does not soften upon heating after molding. Preferably, the wall thickness of the heat-conducting ring 11 is 2-2.5 mm.

[0057] In a specific implementation, in order to increase the contact area between the triode heater and the thermally conductive ring 11 and improve the heating efficiency, a plurality of heating planes are evenly distributed on the thermally conductive ring 11, and each heating plane is fitted with a heater 10, and a plurality of accommodating cavities are provided on the inner wall of the thermal insulation sleeve 12 corresponding to the plurality of heating planes.

[0058] Example 5

[0059] This embodiment provides a constant temperature gas probe module, including a flameproof housing, a constant temperature control device arranged inside the flameproof housing, a gas sensor 2, and a signal processing circuit board 6.

[0060] The constant temperature control device is the gas sensor constant temperature control device described in Example 4, and is electrically connected to the signal processing circuit board 6 to achieve constant temperature control of the gas sensor 2;

[0061] The gas sensor 2 is mounted on the signal processing circuit board 6 and is electrically connected to the signal processing circuit board 6 to achieve gas detection.

[0062] The provision of the constant temperature control device improves the working range of the constant temperature gas probe module.

[0063] In a specific embodiment, the flameproof enclosure is provided with a split structure, specifically, Figure 5As shown, the flameproof enclosure includes a protective cover 14, a probe seat 13 and a fixing ring 15 for connecting the protective cover 14 and the probe seat 13; an opening is provided in the middle of one end face of the probe seat 13, and the rear end of the protective cover 14 contracts smoothly inwardly and is inserted into the interior of the probe seat 13 through the opening; wherein, the outer diameter of the rear end is smaller than the middle section of the protective cover 14; a flange structure is provided in the middle of the protective cover 14, and a sealing ring 17 is provided on the side of the flange structure inserted into the probe seat 13 to abut and seal with the opening of the probe seat 13; the fixing ring 15 is sleeved on the middle flange of the protective cover 14 and is threadedly connected to the probe seat 13; a sink is provided at the front end opening of the protective cover 14, and a breathing element is interference fit in the sink.

[0064] The gas sensor 2 is disposed in the cavity of the protective cover 14 and is electrically connected to the signal processing circuit board 6;

[0065] The signal processing circuit board 6 is disposed in the probe base 13 and is connected to the output wire 19 and then led out from one end of the probe base 13 .

[0066] It can be seen that the protective cover 14 and the probe base 13 adopt an insert-type flat joint surface, and the two parts are threadedly connected by a fixing ring 15. When in use, the fixing ring 15 rotates while the protective cover 14 and the probe base 13 do not rotate, which effectively prevents torsional damage to internal components and makes it easy to disassemble and maintain each part.

[0067] In a specific application, an annular groove is further provided on the outer wall of the protective cover 14 between the rear end and the flange structure. The sealing ring 17 is installed in the annular groove. The sealing ring 17 protrudes from the annular groove to seal the connection between the probe base 13 and the protective cover 14. An epoxy resin sealant layer is also provided between the inner wall of the probe base 13 and the signal processing circuit board 6.

[0068] In a specific application, the epoxy resin sealing layer can fix the signal processing circuit board 6. When in use, the signal processing circuit board 6 is first placed in a fixed position and then sealed with epoxy resin.

[0069] In order to filter out particulate impurities, water droplets and adsorbed oil vapor, the flameproof enclosure further includes a dust cover 20, which is threadedly connected to the protective cover 11. Preferably, the dust cover 20 is a louvered wire mesh structure.

[0070] At the same time, in order to prevent water, dust and heat, the front end faces of the gas sensor 2, the heat-conducting ring 11 and the heat-insulating sleeve 12 are abutted against the inner side of the respiratory element through a semi-permeable membrane molecular sieve 21 and a sealing gasket. The combination of the sealing gasket and the semi-permeable membrane molecular sieve 21 can filter out mist water and organic vapor aerosols.

[0071] The combination of the dust cover 20 , the sealing gasket, and the semi-permeable molecular sieve 21 can make the gas diffused into the gas sensor 2 relatively pure, which can effectively improve the lifespan and accuracy of the gas sensor 2 .

[0072] Example 6

[0073] This embodiment provides a gas detector, including the constant temperature gas probe module described in Example 5.

[0074] The provision of the constant temperature gas probe module expands the operating temperature range of the gas detector, enabling it to be used in any harsh environment, thus broadening its scope of application.

[0075] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention and not to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, ordinary technicians in the field should understand that the specific implementation methods of the present invention can still be modified or some technical features can be replaced by equivalents without departing from the spirit of the technical solution of the present invention. They should all be included in the scope of the technical solution for protection of the present invention.

Claims

1. A gas sensor temperature measurement structure, characterized in that: The device comprises a first temperature sensor and an insulating heat-conducting unit, and also comprises a temperature compensation unit; the insulating heat-conducting unit is arranged in contact with a plurality of electrode lead pins of the gas sensor to achieve heat conduction; the first temperature sensor is arranged closely to the insulating heat-conducting unit for collecting the temperature of the gas sensor; The temperature compensation unit includes a second temperature sensor and an MCU controller. The second temperature sensor is used to collect the ambient temperature. The MCU controller is connected to the first temperature sensor and the second temperature sensor respectively, and is used to compensate the gas sensor temperature according to the ambient temperature. The compensation formula is: T = T 测 +T 补 , where T 补 =0.131—0.0136T 环 , T 环 -40 to 10°C, which is the ambient temperature collected by the second temperature sensor; T 测 The gas sensor temperature collected by the first temperature sensor.

2. The gas sensor temperature measurement structure according to claim 1, characterized in that: The insulating heat-conducting unit includes an insulating heat-conducting layer and a plurality of heat-conducting columns arranged corresponding to the electrode lead-out pins of the gas sensor. A through hole with an inner diameter equal to the outer diameter of the electrode lead-out pins of the gas sensor is opened in the heat-conducting column. The electrode lead-out pins of the gas sensor pass through the heat-conducting column and are installed on the signal processing circuit board to achieve electrical connection with the signal processing circuit board; the outer side of the heat-conducting column is arranged to abut the insulating heat-conducting layer.

3. The gas sensor temperature measurement structure according to claim 1, characterized in that: The insulating heat-conducting unit includes an insulating heat-conducting layer and a plurality of conductive heat-conducting columns arranged corresponding to the electrode lead pins of the gas sensor, and the outer sides of the conductive heat-conducting columns are arranged in contact with the insulating heat-conducting layer; one end of the conductive heat-conducting column is installed on the signal processing circuit board to achieve electrical connection with the signal processing circuit board, and the other end is provided with a accommodating cavity, and the electrode lead pins of the gas sensor are inserted into the accommodating cavity.

4. A gas sensor constant temperature control device, characterized in that: include: A temperature measuring structure, wherein the temperature measuring structure is the gas sensor temperature measuring structure according to any one of claims 1 to 3, and is used to collect the temperature of the gas sensor; The heating structure is arranged close to the gas sensor housing and is used to heat the gas sensor; A signal processing circuit is electrically connected to the temperature measuring structure and the heating structure respectively.

5. The gas sensor constant temperature control device according to claim 4, characterized in that: The heating structure includes a heater and a heat-conducting ring. The heater is tightly arranged on the heat-conducting ring. The heat-conducting ring is sleeved on the outside of the gas sensor. The outside of the heat-conducting ring is also sleeved with a heat-insulating sleeve.

6. The gas sensor constant temperature control device according to claim 5, characterized in that: A plurality of heating planes are evenly distributed on the heat-conducting ring, each heating plane is fitted with a heater, and a plurality of accommodating cavities are provided on the inner wall of the heat-insulating sleeve corresponding to the plurality of heating planes.

7. The gas sensor constant temperature control device according to claim 5 or 6, characterized in that: The heater is a triode heater.

8. A constant temperature gas probe module, characterized in that: It includes a flameproof enclosure and a constant temperature control device, a gas sensor and a signal processing circuit board arranged inside the flameproof enclosure. The constant temperature control device is the gas sensor constant temperature control device according to any one of claims 4 to 7, and is electrically connected to the signal processing circuit board to achieve constant temperature control of the gas sensor; The gas sensor is mounted on the signal processing circuit board and is electrically connected to the signal processing circuit board to achieve gas detection.

9. A gas detector, characterized in that: Including the constant temperature gas probe module described in claim 8.

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