Waveguide rod for high-temperature environments

Abstract

This invention discloses a waveguide rod for enhancing acoustic emission in high-temperature environments, comprising a waveguide rod body, an acoustic black hole structure, and a sensor coupling platform. The acoustic black hole structure is wedge-shaped, with the end with the largest cross-section serving as the connecting end and the end with the smallest cross-section serving as the end point. The connecting end is connected end-to-end to one end of the waveguide rod body. The acoustic black hole structure enhances the acoustic emission signal. The sensor coupling platform is fixed to the end face of the end point. This invention can reduce the conduction temperature at the end point while increasing the acoustic emission signal intensity, and has a simple structure.

Description

Technical Field

[0001] This invention relates to the field of acoustic emission detection technology, and in particular to a waveguide-enhanced acoustic emission waveguide rod for high-temperature environments. Background Technology

[0002] Waveguide rods, as auxiliary tools in acoustic emission detection technology, can solve the problem of not being able to directly mount sensors on the surface of test equipment in special environments such as high temperature, cryogenic, and radiation. However, in high-temperature environments, the excessively high surface temperature of the equipment requires the waveguide rod to be of considerable length to meet the temperature requirements of the sensor, resulting in a high degree of acoustic emission wave attenuation and poor signal quality received by the sensor, making effective monitoring of the equipment impossible. Furthermore, due to the complexity of engineering practice environments, when the length of the waveguide rod is limited and cannot meet the sensor temperature requirements, acquiring acoustic emission signals from the surface of high-temperature equipment is also a problem that traditional waveguide rods struggle to solve. Summary of the Invention

[0003] This invention aims to at least solve one of the technical problems existing in the prior art. Therefore, one object of this invention is to provide a waveguide-enhanced acoustic emission waveguide rod for high-temperature environments, which can reduce the conduction temperature at the end while increasing the acoustic emission signal intensity at the end, and has a simple structure.

[0004] A waveguide-enhanced acoustic emission waveguide rod for high-temperature environments according to an embodiment of the present invention includes:

[0005] Waveguide rod body;

[0006] An acoustic black hole structure, which is wedge-shaped, has a connection end at the end with the largest cross-section and an end end at the end with the smallest cross-section. The connection end is connected end-to-end to one end of the waveguide rod body. The acoustic black hole structure is used to enhance acoustic emission signals.

[0007] A sensor coupling platform, wherein the sensor coupling platform is fixed to the end face.

[0008] According to an embodiment of the present invention, a waveguide-enhanced transmitting waveguide for high-temperature environments utilizes a wedge-shaped acoustic black hole structure. The cross-sectional area of ​​the acoustic black hole structure gradually decreases from the connecting end to the end, with the connecting end and one end of the waveguide rod body connected end-to-end. This allows the acoustic black hole structure to converge the acoustic emission waves propagating along the waveguide rod body to the end, effectively enhancing the acoustic emission signal by utilizing the energy focusing effect of the acoustic black hole structure. This ensures that the length of the waveguide-enhanced acoustic emission waveguide for high-temperature environments meets the requirements. Due to the small end face area, the sensor coupling platform is fixed on the end face, resulting in a small contact area (i.e., a small thermal conduction contact area). Simultaneously, the sensor coupling platform facilitates sensor installation, allowing for effective measurement of the acoustic emission signal while meeting the sensor's temperature requirements. Therefore, the waveguide-enhanced transmitting waveguide for high-temperature environments of this embodiment of the present invention achieves a reduction in the conduction temperature at the end while increasing the acoustic emission signal intensity, solving the problem that traditional waveguide rods cannot simultaneously achieve cooling and effective acoustic emission signal conduction in high-temperature environments. Furthermore, the waveguide rod for high-temperature environments in this embodiment of the invention has a simple structure.

[0009] Compared to traditional waveguides, the waveguide-enhanced transmitting waveguide of this invention, designed for high-temperature environments, can suppress the attenuation of acoustic waves during propagation by increasing the intensity of the acoustic emission signal reaching the sensor 7 mounted on the sensor coupling platform. Simultaneously, the reduction in the heat conduction cross-sectional area also weakens temperature transmission to some extent. Compared to noise reduction methods such as Fast Fourier Transform and wavelet analysis, the waveguide-enhanced transmitting waveguide of this invention, designed for high-temperature environments, can achieve selective frequency band signal enhancement by changing structural parameters.

[0010] In some embodiments, the acoustic black hole structure has at least one subtractive surface.

[0011] In some embodiments, there are four subtractive surfaces.

[0012] In some embodiments, any cross-section of the acoustic black hole structure is square.

[0013] In some embodiments, the side length of the square cross-section of the acoustic black hole structure gradually decreases in a power function manner from the connecting end to the end.

[0014] In some embodiments, the side length of the square cross-section of the acoustic black hole structure is:

[0015]

[0016] in, d ( x ) represents the side length of the square cross-section of the acoustic black hole structure;d 0 represents the side length of the end face of the acoustic black hole structure; ɛ It is a constant; m It is a power exponent; l 2 represents the length of the acoustic black hole structure from the connecting end to the end.

[0017] In some embodiments, the power exponent is: The constant is: .

[0018] In some embodiments, the acoustic hole structure and the waveguide rod are integrally formed.

[0019] In some embodiments, the thickness of the sensor coupling platform is no greater than 1 mm.

[0020] In some embodiments, the cross-section of the waveguide rod body is square or circular.

[0021] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0022] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0023] Figure 1 This is a three-dimensional schematic diagram of a waveguide-enhanced acoustic emission waveguide rod for high-temperature environments according to an embodiment of the present invention;

[0024] Figure 2 This is a side view of a waveguide-enhanced acoustic emission waveguide rod for high-temperature environments according to an embodiment of the present invention;

[0025] Figure 3 This is one of the schematic diagrams of a simulation experiment of a waveguide-enhanced acoustic emission waveguide rod for high-temperature environments according to an embodiment of the present invention;

[0026] Figure 4 This is the second schematic diagram of a simulation experiment of a waveguide-enhanced acoustic emission waveguide rod for high-temperature environments according to an embodiment of the present invention;

[0027] Figure 5 This is one of the schematic diagrams of a simulation experiment of a traditional waveguide rod;

[0028] Figure 6 This is the second schematic diagram of a simulation experiment of a traditional waveguide rod;

[0029] Figure 7 This is a schematic diagram illustrating the temperature experiment results of the simulation.

[0030] Figure 8 This is a schematic diagram illustrating the experimental effect of acoustic emission signals in a simulation experiment.

[0031] Figure Labels

[0032] Waveguide rod 1000 for high-temperature environment enhancement of acoustic emission; waveguide rod body 1; acoustic black hole structure 2; connection end 201; end 202; subtractive curved surface 203; sensor coupling platform 3; uniform plate 4; acoustic emission source 5; traditional waveguide rod 6; sensor 7. Detailed Implementation

[0033] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0034] The following is combined with Figures 1 to 8 This invention describes a waveguide-enhanced acoustic emission waveguide rod 1000 designed for high-temperature environments, according to an embodiment of the present invention.

[0035] like Figures 1 to 4 As shown, the waveguide rod 1000 for high-temperature environments according to an embodiment of the present invention includes a waveguide rod body 1, an acoustic black hole structure 2, and a sensor coupling platform 3. The acoustic black hole structure 2 is wedge-shaped, with the end with the largest cross-section being the connecting end 201 and the end with the smallest cross-section being the end 202. The connecting end 201 is connected end-to-end to one end of the waveguide rod body 1. The acoustic black hole structure 2 is used to enhance the acoustic emission signal. The sensor coupling platform 3 is fixed to the end face of the end 202.

[0036] According to an embodiment of the present invention, the waveguide rod for high-temperature environments is designed with a wedge-shaped acoustic black hole structure 2. The cross-sectional area of ​​the acoustic black hole structure 2 gradually decreases from the connecting end 201 to the end 202. The connecting end 201 is connected end-to-end to one end of the waveguide rod body 1. This allows the acoustic black hole structure 2 to converge the acoustic emission waves propagating along the waveguide rod body 1 to the end 202, effectively enhancing the acoustic emission signal by utilizing the energy focusing effect of the acoustic black hole structure 2. This ensures that the length of the waveguide rod 1000 for high-temperature environments meets the requirements. Because the end face area of ​​the end 202 is small, and the sensor coupling platform 3 is fixed on the end face of the end 202, the contact area between them is small, resulting in a small thermal conductivity contact area. Simultaneously, the sensor coupling platform 3 facilitates the installation of the sensor 7. The sensor 7, mounted on the sensor coupling platform 3, can effectively measure the acoustic emission signal while also meeting the temperature requirements of the sensor 7. Therefore, the waveguide-enhanced acoustic emission waveguide rod 1000 for high-temperature environments of this invention achieves a reduction in the conduction temperature of the end 202 while increasing the acoustic emission signal intensity at the end 202, thus solving the problem that traditional waveguide rods 6 cannot simultaneously achieve cooling and effective acoustic emission signal conduction in high-temperature environments. Furthermore, the waveguide-enhanced acoustic emission waveguide rod 1000 for high-temperature environments of this invention has a simple structure.

[0037] Compared to a conventional waveguide rod 6, the high-temperature environment-oriented waveguide enhancement transmitting waveguide rod 1000 of this invention can suppress the attenuation of acoustic emission waves during propagation by increasing the intensity of the acoustic emission signal before it reaches the sensor 7 mounted on the sensor coupling platform 3. Simultaneously, the reduction in the heat conduction cross-sectional area can also weaken temperature transmission to some extent. Compared to noise reduction methods such as Fast Fourier Transform and wavelet analysis, the high-temperature environment-oriented waveguide enhancement transmitting waveguide rod of this invention can achieve selective frequency band signal enhancement by changing structural parameters.

[0038] In some embodiments, the acoustic black hole structure 2 has at least one subtractive surface 203. For example, one, two, three, or four subtractive surfaces 203 can be fabricated at one end of a square-section, unidirectional rod by a subtractive processing method. Figure 1 As shown, the acoustic black hole structure 2 is wedge-shaped, and the energy focusing effect of the acoustic black hole structure 2 can be used to enhance the acoustic emission signal of the end 202 of the waveguide rod for high-temperature environment in this embodiment of the invention. This enables the sensor 7 installed on the sensor coupling platform 3 to effectively measure the acoustic emission signal. At the same time, the contact area of ​​the end face of the end 202 is reduced, thereby satisfying the temperature requirements of the sensor 7.

[0039] In some embodiments, such as Figure 1As shown, there are four subtractive surfaces 203, meaning that there are four subtractive surfaces 203 on the acoustic black hole structure 2. This results in better energy focusing of acoustic emission signals, a smaller contact area at the end face of the end 202, better measurement performance of the sensor 7, and better fulfillment of the temperature requirements of the sensor 7.

[0040] In some embodiments, the acoustic black hole structure 2 has a square cross-section, which makes the acoustic black hole structure 2 relatively simple.

[0041] In some embodiments, the side length of the square cross-section of the acoustic black hole structure 2 gradually decreases from the connecting end 201 to the end 202 in a power function manner, so that the acoustic emission signal energy of the acoustic black hole structure 2 has a good focusing effect.

[0042] In some embodiments, the side length of the square cross-section of the acoustic black hole structure 2 is:

[0043]

[0044] in, d ( x () represents the side length of the square cross-section of acoustic black hole structure 2; d 0 represents the side length of the end face 202 at the end of the acoustic black hole structure 2; ɛ It is a constant; m It is a power exponent; l 2 represents the length of the acoustic black hole structure 2 from the connecting end 201 to the end 202. This design ensures good energy focusing of the acoustic emission signal from the acoustic black hole structure 2.

[0045] In some embodiments, the power exponent is: The constant is: In this way, the acoustic emission signal energy focusing effect of acoustic black hole structure 2 is good.

[0046] In some embodiments, the thickness of the sensor coupling platform 3 l1 The diameter should not exceed 1 mm. This allows sensor 7 to effectively measure the acoustic emission signal.

[0047] In some embodiments, the cross-section of the waveguide rod body 1 is square or circular, thus the structure of the waveguide rod 1000 for high-temperature environments in this embodiment is simple.

[0048] like Figures 3 to 8 As shown, the following is a comparative simulation experiment of the waveguide-enhanced acoustic emission waveguide rod 1000 for high-temperature environments and the traditional waveguide rod 6 according to an embodiment of the present invention.

[0049] In this simulation comparison experiment, Figure 3 and Figure 4This is a test scheme for a waveguide-enhanced acoustic emission waveguide rod 1000 designed for high-temperature environments, according to an embodiment of the present invention. Figure 5 and Figure 6 The test scheme for the conventional waveguide rod 6 is as follows. To examine the heat insulation and waveguide enhancement effects of the high-temperature environment-oriented waveguide-enhanced acoustic emission waveguide rod 1000 of this specific embodiment, steady-state heat conduction simulation and lead breakage simulation were performed on the high-temperature environment-oriented waveguide-enhanced acoustic emission waveguide rod 1000 and the conventional waveguide rod 6 under the same working conditions using finite element simulation software. Figure 3 and Figure 4 The specific dimensions of the waveguide rod 1000 for high-temperature environments are as follows: the side length of the square cross-section of the waveguide rod body 1. D 2 and length l 3 can be 10mm and 80mm respectively, the side length of the square cross-section of the acoustic black hole structure 2. d ( x ) and length l 2 are respectively And 20mm, the diameter of sensor coupling platform 3 D 1 and thickness l 1 can be either 20mm or 1mm. Figure 3 and Figure 4 Waveguide 1000 for high-temperature environments and Figure 5 Both the conventional waveguide rod 6 shown in the figure and the acoustic emission source 5 are fixed on the uniform plate 4. The waveguide rod 1000 for high-temperature environment in this specific embodiment has the same length as the conventional waveguide rod 6. The cross-sectional area of ​​the main body 1 of the waveguide rod 1000 for high-temperature environment in this specific embodiment is the same as the cross-sectional area of ​​the main body of the conventional waveguide rod 6. At the same time, sensors 7 are respectively arranged on the sensor coupling platform 3 of the waveguide rod 1000 for high-temperature environment in this specific embodiment and on the end face of the conventional waveguide rod 6.

[0050] By comparing the temperature of the sensor end (i.e., end 202) of the waveguide-enhanced acoustic emission waveguide rod 1000 for high-temperature environments and the acoustic emission signal received by the sensor 7 of the conventional waveguide rod 6, it can be seen that the waveguide-enhanced acoustic emission waveguide rod 1000 for high-temperature environments can further reduce the temperature of the sensor end (i.e., end 202), and the amplitude of the received acoustic emission wave is also significantly improved. This shows that the waveguide-enhanced acoustic emission waveguide rod 1000 for high-temperature environments can effectively solve the problem that the conventional waveguide rod 6 cannot simultaneously achieve cooling and effective conduction of acoustic emission signals in high-temperature environments.

[0051] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0052] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A waveguide rod for enhancing acoustic emission in high-temperature environments, characterized in that, include: Waveguide rod body; An acoustic black hole structure, wedge-shaped, is described. The end with the largest cross-section is the connecting end, and the end with the smallest cross-section is the ending end. The connecting end is connected end-to-end to one end of the waveguide rod body. The acoustic black hole structure is used to enhance acoustic emission signals. The acoustic black hole structure has at least one subtractive material surface; there are four subtractive material surfaces. Any cross-section of the acoustic black hole structure is square. The side length of the square cross-section of the acoustic black hole structure gradually decreases from the connecting end to the ending end in a power function manner. The side length of the square cross-section of the acoustic black hole structure is: in, d ( x ) represents the side length of the square cross-section of the acoustic black hole structure; d 0 represents the side length of the end face of the acoustic black hole structure; ɛ It is a constant; m It is a power exponent; l 2 represents the length of the acoustic black hole structure from the connecting end to the end; the power exponent is: The constant is: ; A sensor coupling platform, wherein the sensor coupling platform is fixed to the end face.

2. The waveguide rod for high-temperature environments as described in claim 1, characterized in that, The acoustic black hole structure and the waveguide rod are integrated into one piece.

3. The waveguide rod for high-temperature environments as described in claim 1, characterized in that, The thickness of the sensor coupling platform is no more than 1 mm.

4. The waveguide rod for high-temperature environments as described in claim 1, characterized in that, The cross-section of the waveguide rod body is square or circular.

Images