Probe cleaning plate

Abstract

The present application relates to a probe cleaning plate, comprising a support plate composed of a material selected from a group consisting of a glass fiber resin plate or a single-sided copper-clad glass fiber resin plate, a binder layer composed of a binder and disposed on an upper surface of the support plate and closely adhered to the support plate, and a cleaning layer disposed on an upper surface of the binder layer and closely adhered to the binder layer and composed of a material selected from a group consisting of silica gel, magnesium oxide, silicon carbide, aluminum oxide and zirconium oxide, wherein the melting temperature of the probe cleaning plate is above 200 DEG C.

Description

TECHNICAL FIELD

[0001] The present application relates to a probe cleaning plate, in particular to a probe cleaning plate capable of withstanding high-temperature processing. BACKGROUND

[0002] In the process of manufacturing semiconductor devices, a product test performed after packaging a wafer is called a final test. In the final test, a probe pin is often used to apply an electrical signal to a plurality of chips on a semiconductor wafer, and the output signal of the wafer is detected to confirm whether the semiconductor wafer functions normally. In the test, as the probe pin contacts an electrode, foreign matter such as particles of the electrode can adhere to the tip portion of the probe pin, causing noise and reducing the accuracy of the test. In some cases, a large foreign matter can cause short circuiting of adjacent probe pins, resulting in damage to the wafer. Therefore, a cleaning step is required to remove the foreign matter from the probe pin.

[0003] A method for cleaning a probe pin includes using a cleaning sheet in which abrasive particles such as silicon oxide, silicon carbide, aluminum oxide, or diamond are mixed in an elastic material such as silicone or polyurethane resin. The tip of the probe pin is inserted into the cleaning sheet, and the abrasive particles fixed to the elastic material grind the tip of the probe pin to remove foreign matter. Alternatively, a cleaning sheet having an adhesive layer formed on a surface of an abrasive plate having a micro concave-convex surface is used. The probe pin is inserted into the adhesive layer and moves on the concave-convex surface of the abrasive plate to remove foreign matter from the tip of the probe pin.

[0004] However, the cleaning sheet used in the prior art has a problem of not being resistant to high temperatures. In the final test of the wafer, there is a step of testing at a high temperature. If the probe pin, the wafer, or the environment is not properly cooled, the adhesive of the cleaning sheet can overflow, deform, or fall off, resulting in incomplete cleaning of the probe pin or even damage to the probe pin. SUMMARY

[0005] Therefore, the present application provides a probe cleaning plate that can withstand repeated heating and cooling processes without deforming.

[0006] The present application provides a probe cleaning plate, which includes a support plate made of a glass fiber resin plate or a single-sided copper-clad glass fiber resin plate, a binder layer disposed on the upper surface of the support plate and tightly attached to the support plate, the binder layer including a binder, and a cleaning layer disposed on the upper surface of the binder layer and tightly attached to the binder layer, the cleaning layer including silica gel, magnesium oxide, silicon carbide, aluminum oxide, and zirconium oxide. The melting temperature of the probe cleaning plate is above 200°C.

[0007] In one embodiment of the present application, there is provided a probe cleaning plate as previously described, wherein the cleaning layer has a Shore A hardness of 70 to 98.

[0008] In one embodiment of the present application, there is provided a probe cleaning plate as previously described, wherein the cleaning layer has a thickness of 0.2 to 0.5 mm.

[0009] In one embodiment of the present application, there is provided a probe cleaning plate as previously described, wherein the binder layer has a thickness of 0.01 to 0.025 mm.

[0010] In one embodiment of the present application, there is provided a probe cleaning plate as previously described, wherein the backing plate has a thickness of 0.1 to 6 mm.

[0011] By the technical means of the probe cleaning plate of the present application, a probe cleaning plate for probes used in wafer testing can be provided, which can withstand repeated heating and cooling processes without deforming. BRIEF DESCRIPTION OF DRAWINGS

[0012] Figure 1 FIG. 1 is a perspective view of a probe cleaning plate according to an embodiment of the present application.

[0013] Figure 2 FIG. 2 is a side view of a probe cleaning plate according to an embodiment of the present application.

[0014] Figure 3 FIG. 3 is a top view of a probe cleaning plate according to an embodiment of the present application.

[0015] Figure 4 FIG. 4 is a sectional view of a probe cleaning plate according to an embodiment of the present application.

[0016] Figure 5 FIG. 5 is a partially enlarged view of a sectional view of a probe cleaning plate according to an embodiment of the present application.

[0017] REFERENCE NUMERALS

[0018] 100 probe cleaning plate

[0019] 1 backing plate

[0020] 2 binder layer

[0021] 3 cleaning layer DETAILED DESCRIPTION

[0022] The embodiments of the present application will be described below with reference to the drawings. The description is not intended to limit the embodiments of the present application, but is one of the embodiments of the present application. Figures 1 to 5 As

[0023] and Figure 1 and Figure 2As shown, the probe cleaning plate 100 according to an embodiment of the present invention includes a support plate 1, a binder layer 2 and a cleaning layer 3.

[0024] According to an embodiment of the present invention, the probe cleaning plate 100 has a support plate 1 made of a material selected from glass fiber resin board or single-sided copper-clad glass fiber resin board.

[0025] According to an embodiment of the present invention, the probe cleaning plate 100 has a binder layer 2 containing a binder, which is disposed on the upper surface of the support plate 1 and is tightly attached to the support plate 1.

[0026] According to an embodiment of the present invention, the probe cleaning plate 100 has a cleaning layer 3 composed of silicone, magnesium oxide, silicon carbide, aluminum oxide and zirconium oxide. It is disposed on the upper surface of the binder layer 2 and is tightly attached to the binder layer 2. Magnesium oxide is used as a dehumidifying material, and zirconium oxide is used as the main probe cleaning material.

[0027] like Figure 3 As shown, in the probe cleaning plate 100 according to an embodiment of the present invention, the area of ​​the cleaning layer 3 and the binder layer 2 is slightly smaller than that of the support plate 1.

[0028] like Figure 4 As shown, the probe cleaning plate 100 according to an embodiment of the present invention has a Shore hardness A of 70 to 98 for the cleaning layer 3. Although the binder used in this embodiment is SA-257 manufactured by a specific company, the present invention is not limited thereto, and the most suitable product can be selected from the market according to the actual needs of use.

[0029] like Figure 5 As shown, in the probe cleaning plate 100 according to an embodiment of the present invention, the thicknesses of the cleaning layer 3, the binder layer 2 and the support plate 1 are respectively formed as T3, T2 and T1, wherein the thickness T3 of the cleaning layer 3 ranges from 0.2 to 0.5 mm, the thickness T2 of the binder layer 2 ranges from 0.01 to 0.025 mm, and the thickness T1 of the support plate 1 ranges from 0.1 to 6 mm.

[0030] The heat resistance test results of this technical solution in practical applications are as follows:

[0031] Multiple probe cleaning plates 100 according to embodiments of the present invention, probe cleaning plates manufactured in Japan and commercially available, and control groups for displaying the state of adhesive overflow after heating were prepared and subjected to heat resistance tests at different temperatures.

[0032] The heat resistance test includes the following steps:

[0033] Step 1: Simultaneously place the three sets of test samples into a heating chamber set with a specified test temperature;

[0034] Step 2: Heating the test objects, and taking out the test objects when the temperature reaches the specified test temperature;

[0035] Step 3: Observing under a microscope whether the three groups of test objects have melting, overflow, and deformation conditions;

[0036] Step 4: Preparing new three groups of test objects and specifying new test temperatures to repeat the above steps 1 to 3.

[0037] The melting, overflow, and deformation conditions of each group of test objects observed in step 3 are recorded and shown in Table 1, where the processing temperature 200°C is the destruction temperature, i.e. the probe cleaning plate known in the industry at this temperature will produce structural damage such as melting and deformation.

[0038]

[0039] As shown in Table 1, the probe cleaning plate manufactured in Japan and the probe cleaning plate 100 according to the embodiment of the present application and the control group are observed under a microscope and compared. If there is a condition of obvious overflow of the gel as shown in the control group, it is judged as overflow. At the same time, whether the surfaces of the cleaning plate are melted or deformed by heating is observed. If deformation is observed, the deformation condition is recorded.

[0040] As can be seen from Table 1, although the cleaning plate manufactured in Japan does not have the conditions of melting, overflow, and deformation when treated at temperatures of 35°C to 190°C, when the processing temperature is increased to 200°C, there are wrinkles on the surface of the cleaning plate, which means that the internal structure of the probe cleaning plate has been damaged by high temperature, and it cannot maintain a smooth surface, which may cause incomplete cleaning and even probe damage when used. It represents that when the cleaning plate manufactured in Japan is used in the test process requiring 200°C high temperature treatment, if the temperature of the cleaning plate is excessively increased to 200°C during cleaning, the cleaning plate may be deformed, which may cause incomplete cleaning and even probe damage, further affecting the subsequent wafer test. If you want to use it in the test process requiring 200°C high temperature treatment, an additional cooling step is needed, which increases the time and equipment cost.

[0041] In comparison, the probe cleaning plate 100 according to the embodiment of the present application does not melt, overflow or deform when treated at a temperature of 35-190°C, and even when the treatment temperature is increased to 200°C, no abnormal conditions such as deformation are observed under a microscope, that is, the probe cleaning plate 100 according to the embodiment of the present application can withstand high-temperature treatment at 200°C, and even if the temperature of the probe cleaning plate 100 according to the embodiment of the present application is increased to 200°C during cleaning, the probe cleaning plate 100 will not be affected to cause overflow or deformation, and can normally clean the probe, and therefore, even if the probe cleaning plate 100 according to the embodiment of the present application is applied to a test procedure requiring high-temperature treatment at 200°C, no additional cooling step is required, and the probe can be directly cleaned, and compared with the conventional probe cleaning plate, the required time and equipment cost can be reduced.

[0042] The above description and explanation is only for the preferred embodiment of the present application, and those skilled in the art can make other modifications according to the above defined protection scope and the above explanation, but these modifications should still be within the protection scope of the present application.

[0043] In this specification, the present application has been described with reference to specific embodiments thereof. It is, however, apparent to those skilled in the art that various modifications and changes can be made thereto without departing from the spirit and scope of the present application. Therefore, the description and drawings should be considered in an illustrative rather than a restrictive sense.

Claims

1. A probe cleaning plate characterized by, Comprising: a support plate, the material of which is selected from a group consisting of a glass fiber resin plate or a single-sided copper-clad glass fiber resin plate; a binder layer disposed on the upper surface of the support plate and closely adhered to the support plate, the binder layer comprising a binder; and a cleaning layer disposed on the upper surface of the binder layer and closely adhered to the binder layer, the material of the cleaning layer comprising silica gel, magnesium oxide, silicon carbide, aluminum oxide, diamond powder and zirconium oxide, wherein the melting temperature of the probe cleaning plate is above 200℃.

2. The probe cleaning board according to claim 1, wherein The Shore A hardness of the cleaning layer is 70 to 98.

3. The probe cleaning board of claim 1, wherein, The thickness of the cleaning layer is 0.2 to 0.5 mm.

4. The probe cleaning board of claim 1, wherein The thickness of the binder layer is 0.01 to 0.025 mm.

5. The probe cleaning board of claim 1, wherein The thickness of the support plate is 0.1 to 6 mm.

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