Silicon rod cutting apparatus

Abstract

The application relates to a silicon rod cutting device which comprises a cutting tool and a conveying platform located below the cutting tool, the conveying platform is provided with positioning clamping jaws for clamping silicon rods; a floating support structure is further arranged on the conveying platform, the floating support structure comprises a lifting mechanism and a receiving box for receiving head and tail materials arranged above the lifting mechanism on the conveying platform, and the conveying platform is further provided with a suction disc assembly in the shape of a suction sheet. The application can realize the automation of silicon rod cutting of a silicon rod excess material cutting machine, meet the automatic transfer of materials, has high overall efficiency, is easy to operate and has good safety.

Description

Technical Field

[0001] This invention relates to the field of cutting machine equipment technology, and more particularly to a silicon rod cutting device. Background Technology

[0002] After the monocrystalline silicon rod is cut to the required thickness by the cutting equipment, it is output. Before forming silicon wafers, the ends of the silicon rod need to be cut off. Then, the silicon rod is cut into wafers by the cutting mechanism. The wafers are transferred to the wafer collection box by suction cups and robotic arms or are removed from the silicon rod by manual operation.

[0003] Existing designs, such as patent number CN201610037191.8, entitled "A Single Crystal Silicon Cutting Machine," include a base, winding chambers on the left and right sides of the base, a cutting chamber, and a cooling spray device installed in the bottom control cabinet. This design can simultaneously cut a silicon rod into multiple segments, and can meet the requirement of cutting single crystal silicon rods that are approximately 4.5 meters long.

[0004] For example, patent number CN216914422U, entitled "A cutting machine lifting and wafer picking mechanism", designed a crystal holder device for a single crystal silicon cutting machine. Since the end of the silicon rod is a combination of conical and cylindrical material, the crystal holder device described above cannot stably hold the end of the silicon rod.

[0005] The aforementioned equipment can only complete a single cutting length process or transfer the cut material. It cannot achieve automated production of silicon rod cutting and slicing. During the material acquisition process, the silicon rod residue falling from a height can easily cause damage to the surface of the residue or the receiving box. On the other hand, personnel need to enter the cutting area or parallel area of ​​the cutting area during the transfer of silicon wafer products, which poses a safety risk. Summary of the Invention

[0006] To address the issue that existing silicon rod cutting methods can only achieve a single cut, require manual assistance for material handling and transfer, resulting in low work efficiency and potential safety risks.

[0007] The technical solution of the present invention is as follows: a silicon rod cutting device includes a cutting tool and a conveying platform located below the cutting tool. The conveying platform has positioning grippers for clamping silicon rods. The conveying platform is also provided with a floating support structure, which includes a lifting mechanism and a receiving box on the conveying platform above the lifting mechanism for receiving head and tail materials. The conveying platform is also provided with a suction cup assembly for absorbing sheet-like materials.

[0008] Preferably, a transfer platform is provided next to the conveying platform, and the gripping device can hold the receiving box and place it between the transfer platform and the conveying platform. The gripping device is provided above the conveying platform and the transfer platform. The gripping device includes a support frame and a gripper jaw located below the support frame. The gripper jaw is driven to lift and move laterally by a gripper drive mechanism.

[0009] Preferably, the suction cup assembly includes a suction cup capable of generating negative pressure and a telescopic mechanism for driving the suction cup to extend and retract toward the silicon wafer; the suction cup assembly is mounted on a suction cup holder, and the suction cup assembly or suction cup holder has a first sensor for sensing the extension and retraction length of the suction cup, and the suction cup holder or suction cup assembly has a second sensor for sensing the distance between the suction cup and the silicon rod.

[0010] Preferably, the receiving box has an opening in the middle for the upper end of the lifting mechanism to pass through, and the upper end of the lifting mechanism is provided with a support platform, the upper surface of which has a lifting surface that is inclined downward from both sides toward the center.

[0011] Preferably, the transfer platform is further provided with a mobile trolley that can move along the transfer platform. The mobile trolley has two or more silicon rod feeding plates fixed on it. The silicon rod feeding plates have a recessed receiving groove in the middle. The mobile trolley is also provided with a wafer receiving box for receiving wafer-shaped silicon wafers. The wafer receiving box includes an outer box, and a partition is fixed inside the outer box. A receiving area is formed between adjacent partitions.

[0012] Preferably, the positioning gripper includes a bracket and a pair of clamps located on the bracket and driven by a drive mechanism to open and close. The clamps are recessed in the middle and fixed at the lower part on the clamp slider. The clamp slider is slidably engaged with the bracket and is driven by a cylinder, hydraulic cylinder or electric cylinder to clamp the silicon rod.

[0013] Preferably, the gripper jaws include a pair of clamping plates, each fixed to a gripper slider. The middle of the gripper slider slides in cooperation with a gripper guide rail. The gripper slider is driven by a cylinder or a lead screw and nut mechanism to move along the gripper guide rail, thereby causing the pair of clamping plates to move towards or away from each other to clamp the docking box or silicon rod. The gripper driving mechanism includes a translation electric cylinder fixed to the upper part of the support frame and a gripper lifting electric cylinder fixedly connected to the movable end of the translation electric cylinder. The movable end of the gripper lifting electric cylinder fixes the gripper jaws.

[0014] Preferably, the gripper claw also has a finger cylinder for gripping the silicon wafer. The finger cylinder is connected to the telescopic end of the silicon wafer gripping lifting cylinder to drive lifting. The silicon wafer gripping lifting cylinder is driven to move laterally by the gripper drive mechanism.

[0015] Preferably, the bottom of the positioning gripper, the floating support structure, and the suction cup frame are all fixed with a moving component to drive the positioning gripper, the floating support, and the suction cup assembly to move along the length direction of the conveying platform. The moving component includes a moving plate, a moving motor is fixed at the lower part of the moving plate, a gear is fixed at the output end of the moving motor, and a rack that meshes with the gear is fixed on the conveying platform.

[0016] Preferably, the receiving box has a retaining edge fixed on one side of its exterior to prevent the cut material from falling off, and the receiving box has a groove on one side to avoid the cut material.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] (1) This invention utilizes a silicon rod cutting machine that can automate the cutting of silicon rod scraps and meet the automatic transfer of materials. It has high overall efficiency, is easy to operate, and has good safety.

[0019] (2) The present invention utilizes a receiving box and a floating support mechanism to avoid damage caused by the direct fall of the silicon rod cutting waste from a height, and to stably realize the receiving and dropping of the silicon rod waste.

[0020] (3) In this embodiment of the invention, the receiving box and the support mechanism are detachable and have an opening for the tray to pass through, which can satisfy the separation and combination of the receiving box and the support structure, making it easy for the receiving box to transport materials and improving the compactness of the structure.

[0021] (4) In the embodiments of the invention, a mobile trolley is also designed. After the mobile trolley moves, the finished product and the leftover material can be easily taken away from the cutting work area. It can also feed silicon rods, which improves the efficiency and safety of material transfer.

[0022] (5) In the embodiments of the present invention, the floating support structure adopts a slide rail to drive the platform to rise and fall, and uses the linear guide rail pair composed of the slide rail and the slider to drive the platform to rise and fall, without the need to design an anti-rotation structure;

[0023] (6) The gripping device can be used to transfer the horizontal receiving box and silicon rod, thereby improving the silicon rod cutting efficiency.

[0024] (7) The present invention utilizes sensors and air pressure control with telescopic devices to achieve no overload pressure during the contact process between the suction cup and the silicon wafer, thereby avoiding the silicon wafer from being crushed by the suction cup. Attached Figure Description

[0025] Figure 1 Overall schematic diagram of an embodiment of the present invention;

[0026] Figure 2 This is a schematic diagram of the positioning gripper in an embodiment of the present invention;

[0027] Figure 3This is a schematic diagram of the clamp structure;

[0028] Figure 4 This is a schematic diagram showing the connection between the receiving box and the floating support structure.

[0029] Figure 5 This is a schematic diagram of the receiving trolley located on the mobile trolley.

[0030] Figure 6 This is a schematic diagram of the three-dimensional structure of the positioning gripper of the present invention;

[0031] Figure 7 This is a schematic diagram of the interior of the floating support structure;

[0032] Figure 8 This is a schematic diagram of the gripping device structure;

[0033] Figure 9 This is a schematic diagram of the overall structure of the gripping device;

[0034] Figure 10 This is a schematic diagram of the finger cylinder's location structure;

[0035] Figure 11 A schematic diagram showing the position and structure of the finger cylinder and the silicon wafer clamping and lifting cylinder;

[0036] Figure 12 This is a schematic diagram of the suction cup assembly structure;

[0037] Figure 13 This is a partially enlarged schematic diagram of the suction cup assembly;

[0038] Figure 14 Side view of the suction cup assembly;

[0039] Figure 15 This is a schematic diagram of the overall structure of the silicon rod cutting device;

[0040] Figure 16 This is a side view of the silicon rod cutting device.

[0041] In the diagram: 100-Conveying platform, 101-Silicon rod, 102-Cutting tool, 10-Positioning gripper, 110-Bracket, 120-Clamping clamp, 130-Clamping slider, 20-Floating support structure, 210-Lifting cylinder, 211-Slide rail, 220-Platform, 30-Receiving box, 310-Opening, 320-Groove, 330-Side guard, 40-Gripping device, 410-Support frame, 411-Transfer electric cylinder, 412-Lifting gripper cylinder, 420-Gripper gripper, 421-Clamping plate, 4 22-Gripper slider, 423-Gripper guide rail, 430-Finger cylinder, 440-Silicon wafer clamping and lifting cylinder, 50-Moving component, 510-Moving plate, 520-Moving motor, 530-Gear, 540-Rack, 60-Moving trolley, 610-Silicon rod feeding plate, 620-Wafer receiving box, 621-Partition, 70-Suction cup assembly, 710-Suction cup frame, 720-Suction cup, 740-First sensor, 730-Second sensor, 750-Locking cylinder, 760-Sensing slider. Detailed Implementation

[0042] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments.

[0043] See Figure 1-3 A silicon rod cutting device includes a cutting tool and a conveying platform 100 located below the cutting tool. The conveying platform has positioning grippers 10 for holding silicon rods. The conveying platform is also provided with a floating support structure 20, which includes a lifting mechanism and a receiving box 30 on the conveying platform above the lifting mechanism for receiving head and tail materials. The conveying platform is also provided with a suction cup assembly 70 for absorbing sheet-like materials.

[0044] In this embodiment, during operation, the silicon material in its initial state is conical at both ends. Before cutting it into silicon wafers, the conical parts at the beginning and end need to be removed. In order to prevent the cut silicon rod from falling directly into the receiving box 30 and causing damage, the receiving box 30 has an opening 310 in the middle for the support platform to pass through. The receiving box 30 is set on a floating support.

[0045] In this embodiment, the cutting tool 102 is a conventional wire cutting tool, which uses a high-speed moving steel wire rope to cut the silicon rod.

[0046] In this embodiment, the movable end of the lifting mechanism is fixedly connected to a support platform 220 via a slide rail 211.

[0047] The support mechanism is located below the opening 310. When the material is ready to be cut, the support mechanism extends from below the receiving box through the opening 310, thereby extending into the part supporting the silicon rod to be cut.

[0048] In the above embodiments, the lifting device is driven by a hydraulic cylinder, a pneumatic cylinder, or an electric cylinder. In this embodiment, the lifting device is a lifting pneumatic cylinder 210. The lifting pneumatic cylinder 210 is vertically arranged, and its movable end is fixedly connected to the support platform 220.

[0049] In one embodiment of the invention, the upper surface of the support platform has a support surface that slopes downward from both sides toward the center to facilitate support of the bottom of the cylindrical silicon rod. When the receiving box 30 is not placed, it can be used to support the rod material, helping to support the rod body after the silicon rod head is cut, and then cut.

[0050] The specific steps for receiving head and tail materials are as follows:

[0051] (1) The positioning gripper 10 holds the silicon rod below the cutting tool 102, and the floating support structure is located below both ends of the silicon rod to be cut on the conveying platform;

[0052] (2) A receiving box 30 for receiving head and tail materials is placed on the conveying platform above the floating support structure;

[0053] (3) The support platform of the floating support structure can pass through the bottom of the receiving box 30 and make its upper edge contact the position below the silicon rod to be cut. The cutting tool cuts the excess material at the end of the silicon rod, and the excess material from the silicon rod falls on the support platform 220 of the floating support.

[0054] (4) The lifting mechanism of the floating support descends to retain the silicon rod residue in the receiving box 30.

[0055] After the collection of head and tail materials is completed, the receiving box 30 is transferred to the side, and the silicon rod slicing process continues on the conveying platform. During slicing, the positioning gripper 10 holds the silicon rod, the cutting tool is used for slicing, and the suction cup assembly is used to adsorb the slicing silicon wafer.

[0056] like Figure 12-14 As shown, the suction cup assembly 70 includes a suction cup 720 capable of generating negative pressure and a telescopic mechanism for driving the suction cup to extend and retract toward the silicon wafer; the suction cup assembly is mounted on a suction cup holder 710, and the suction cup assembly or suction cup holder has a first sensor for sensing the extension and retraction length of the suction cup, and the suction cup holder or suction cup assembly has a second sensor for sensing the distance between the suction cup and the silicon rod.

[0057] In this embodiment, the telescopic mechanism is a locking cylinder 750. In step (4), the locking cylinder 750 itself has a locking mechanism. When it is necessary to ensure the limitation of the locking cylinder stroke, the locking mechanism is used to lock the stroke.

[0058] (1) Before slicing, the telescopic mechanism drives the suction cup to extend to a set length, the telescopic mechanism releases the pressure on the suction cup, and the suction cup assembly is moved to bring the suction cup close to the end of the contact silicon rod.

[0059] (2) When the suction cup encounters the silicon rod, the telescopic end of the telescopic mechanism will be pushed back by the silicon rod.

[0060] In this embodiment, a first sensor 740 is fixed on the suction cup holder 710. The first sensor is a contact sensor.

[0061] In this embodiment, the telescopic mechanism is a locking cylinder 750. In step (4), the locking cylinder 750 itself has a locking mechanism. When it is necessary to ensure the limitation of the locking cylinder stroke, the locking mechanism is used to lock the stroke.

[0062] In one embodiment of the present invention, a sensing slider 760 that can contact the telescopic rod of the locking cylinder 750 is fixed thereon. When the telescopic rod of the locking cylinder 750 is pushed back by the silicon rod, the sensing slider 760 contacts the contact sensor and the moving component stops moving.

[0063] (1) The suction cup generates negative pressure to hold the surface of the crystal rod, the telescopic mechanism locks the stroke to maintain the position of the suction cup, and the suction cup maintains the suction force;

[0064] (2) After the cutting tool cuts the silicon rod, the silicon wafers are adsorbed onto the suction cup.

[0065] In this embodiment, the second sensor 730 is a photoelectric sensor used for distance measurement.

[0066] In one embodiment of the present invention, in order to collect the silicon wafers after slicing, a wafer receiving box 620 is designed. The wafer receiving box 620 includes an outer box, and a partition 621 is fixed inside the outer box, forming a receiving area between adjacent partitions.

[0067] like Figure 10-11 As shown, in order to place the silicon wafer on the suction cup into the wafer receiving box 620, the gripper 420 also has a finger cylinder 430 for holding the silicon wafer. The finger cylinder 430 is connected to the telescopic end of the silicon wafer holding lifting cylinder 440 to drive lifting. The silicon wafer holding lifting cylinder 440 is driven to move laterally by the gripper driving mechanism.

[0068] The telescopic end of the silicon wafer clamping lifting cylinder 440 extends and retracts, driving the finger cylinder 430 to rise and fall. The clamping lifting cylinder 440 is driven to move laterally by the gripper drive mechanism. When picking up the wafer, the finger cylinder opens and is positioned above the silicon wafer adsorbed by the suction cup. Then, it clamps the silicon wafer. After the suction cup releases its suction force, the finger cylinder moves to the receiving area of ​​the wafer receiving box 620 and puts the silicon wafer in.

[0069] To facilitate material transfer and achieve independent separation between personnel picking up materials and the work area, a transfer platform 200 is provided next to the conveying platform 100. The gripping device can hold the receiving box or / and the sheet material receiving box 620 and place it between the transfer platform and the conveying platform. A gripping device 40 is provided above the conveying platform and the transfer platform 200. The gripping device includes a support frame 410 and a gripper 420 located below the support frame. The gripper is driven to lift and move laterally by a gripper drive mechanism.

[0070] In step (1) above, the receiving box is transferred from the transfer platform to the floating support structure by the gripping device. In step (4), after the remaining material is retained in the receiving box, the receiving box carrying the silicon rod residue is transferred to the transfer platform 200 by the gripping device.

[0071] In one embodiment of the present invention, the transfer platform is further provided with a mobile trolley 60, on which two or more silicon rod feeding plates 610 are fixed. The silicon rod feeding plates have a recessed receiving groove in the middle. In step (1), the silicon rods are pre-placed on the silicon rod feeding plates and then placed into the positioning jaws of the conveying platform by the gripping device.

[0072] The spacing between the silicon rod feeding plates 610 on the mobile trolley 60 can be used to place the receiving box 30 and the wafer receiving box 620, thereby facilitating the transfer of start-up and end-product materials and finished products between the conveying platform 100 and the transfer platform 200. When the receiving box 30 and the wafer receiving box 620 are located on the mobile trolley 60, the mobile trolley can move along the transfer platform 200 by means of its own moving wheels or chain dragging. In this way, the operator can obtain the start-up and end-product materials in the receiving box 30 and the silicon wafers in the wafer receiving box 620 in an environment away from the cutting area.

[0073] The positioning gripper 10 includes a bracket 110 and a pair of clamps 120 located on the bracket and driven by a drive mechanism to open and close. The clamps are concave in the middle and fixed at the lower part to clamp sliders 130. The clamp sliders 130 are slidably engaged with the bracket 110 and are driven by a cylinder, hydraulic cylinder, electric cylinder, or lead screw and nut mechanism to clamp the silicon rod. In this embodiment, each clamp slider 130 has a thread in the middle, and the pair of clamp sliders 130 are threaded onto a lead screw. The lead screw rotates in the opposite direction to the two clamp sliders 130, so that the pair of clamps 120 can close or separate during rotation.

[0074] like Figure 5As shown, during operation, the positioning gripper 10 can be designed in multiple ways to accommodate different silicon rod lengths. The clamp 120 and the support 110 are in sliding engagement. The opening and closing size of the clamp 120 can accommodate silicon rods of different diameters. In addition to the clamp slider 130 described in this embodiment being driven by an independent cylinder, the clamp can also be opened and closed by means of a finger cylinder, a lead screw and nut pair, etc.

[0075] like Figure 7 and Figure 8 As shown, similar to the positioning gripper structure, the gripper gripper 420 includes a pair of clamping plates. The pair of clamping plates 421 are respectively fixed on a gripper slider 422. The middle part of the gripper slider is slidably engaged with a gripper guide rail. The gripper slider 422 is driven by a cylinder or a lead screw and nut mechanism to move along the gripper guide rail 423, thereby causing the pair of clamping plates to move towards or away from each other to achieve the clamping of the docking box or silicon rod.

[0076] In this embodiment, the gripper driving mechanism includes a translation electric cylinder 411 fixed to the upper part of the support frame 410, and a lifting gripper electric cylinder 412 fixedly connected to the movable end of the translation electric cylinder. The gripper guide rail 423 is driven to move up and down by the action of the screw and nut mechanism of the gripper electric cylinder 412.

[0077] In the initial state, the receiving box that has not been transferred to silicon rods can be moved across the conveying platform 100 and the transfer platform 200 by the translation electric cylinder 411, and the lifting gripper cylinder 412 can lift the gripper 420 to pick up silicon rods or receiving boxes.

[0078] As shown in the figure, in this invention, a longitudinal rack is fixed to the top of the support frame 410, the translation electric cylinder 411 is fixedly connected to the transfer bracket, a longitudinal motor is fixed on the transfer bracket, and a longitudinal drive gear that meshes with the longitudinal rack is fixed to the output end of the longitudinal motor.

[0079] In actual design, the gripper 420 can be set at the movable end of the three-axis slide to realize the three-axis displacement of the gripper 420 in the Cartesian coordinate system in space.

[0080] like Figure 2 , 6 As shown in Figure 14, the bottom of the positioning gripper, floating support structure and suction cup frame are all fixed with moving components to drive the positioning gripper, floating support and suction cup assembly to move along the length direction of the conveying platform. In this embodiment, the moving component 50 includes a moving plate 510, a moving motor is fixed at the lower part of the moving plate, a gear 530 is fixed at the output end of the moving motor 520, and a rack 540 that meshes with the gear 530 is fixed on the conveying platform.

[0081] In step (1), the clamping of the silicon rod is adjusted or moved to the position of the silicon rod residue to be cut as needed. The bottom of the positioning gripper and the floating support structure are both fixed with moving components 50 to drive the positioning gripper and the floating support to move along the length direction of the conveying platform.

[0082] The moving suction cup assembly uses the moving component 50 to bring the suction cup closer to the end of the silicon rod to be sliced. During this process, when the second sensor 730 senses that the distance is too close, it can decelerate to prevent the suction cup and silicon rod from impacting each other due to excessive speed.

[0083] In actual design, the moving component 50 uses gear and rack meshing to realize the movement of the positioning gripper and floating support structure along the conveying platform. In this embodiment, the bracket 110 of the positioning gripper is fixedly connected to or integrated with the moving plate 510, and the lifting mechanism of the floating support structure 20 is fixedly connected to the moving plate 510 via a base.

[0084] Since the residual material ends of the cut silicon rod are a combination of conical and cylindrical shapes, the receiving box has a groove 320 on one side to avoid the cut material. The groove 320 is used to avoid the conical side.

[0085] The cylindrical silicon rod is heavier on one side. A baffle 330 is fixed on the outside of the receiving box to prevent the cut material from falling. The baffle can help support the heavier side of the silicon rod, thereby preventing the remaining silicon rod material from flipping over during the up-and-down movement due to the different weights at both ends.

[0086] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural or procedural transformations made based on the content of the present invention's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. A silicon rod cutting device, characterized in that, The device includes a cutting tool and a conveying platform located below the cutting tool. The conveying platform has positioning grippers for holding silicon rods. The conveying platform is also provided with a floating support structure, which includes a lifting mechanism and a receiving box on the conveying platform above the lifting mechanism for receiving head and tail materials. The conveying platform also has a suction cup assembly for picking up wafer-shaped silicon wafers. The receiving box has an opening in the middle for the upper end of the lifting mechanism to pass through. The upper end of the lifting mechanism is provided with a support platform, and the upper surface of the support platform has a lifting surface that is inclined downward from both sides toward the center.

2. The silicon rod cutting device according to claim 1, characterized in that, A transfer platform is provided next to the conveying platform. The gripping device can hold the receiving box and place it between the transfer platform and the conveying platform. The gripping device is provided above the conveying platform and the transfer platform. The gripping device includes a support frame and a gripper jaw located below the support frame. The gripper jaw is driven to move laterally by a gripper drive mechanism and is driven to rise and fall by a gripper lifting electric cylinder.

3. The silicon rod cutting device according to claim 2, characterized in that, The suction cup assembly includes a suction cup capable of generating negative pressure and a telescopic mechanism for driving the suction cup to extend and retract toward the silicon wafer; the suction cup assembly is mounted on a suction cup holder, and the suction cup assembly or suction cup holder has a first sensor for sensing the extension and retraction length of the suction cup, and the suction cup holder or suction cup assembly has a second sensor for sensing the distance between the suction cup and the silicon rod.

4. The silicon rod cutting device according to claim 3, characterized in that, The transfer platform is also equipped with a mobile trolley that can move along the transfer platform. The mobile trolley has two or more silicon rod feeding plates fixed on it. The silicon rod feeding plates have a recessed receiving groove in the middle. The mobile trolley is also equipped with a wafer receiving box for receiving wafer-shaped silicon wafers. The wafer receiving box includes an outer box, and a partition is fixed inside the outer box. A receiving area is formed between adjacent partitions.

5. A silicon rod cutting device according to claim 3, characterized in that, The positioning gripper includes a bracket and a pair of clamps located on the bracket and driven by a drive mechanism to open and close. The clamps are recessed in the middle and fixed at the bottom to a clamp slider. The clamp slider is slidably engaged with the bracket and is driven by a cylinder, hydraulic cylinder or electric cylinder to clamp the silicon rod.

6. A silicon rod cutting device according to claim 3, characterized in that, The gripper jaws include a pair of clamping plates, which are respectively fixed on a gripper slider. The middle part of the gripper slider is slidably engaged with a gripper guide rail. The gripper slider is driven by a cylinder or a lead screw and nut mechanism to move along the gripper guide rail, thereby causing the pair of clamping plates to move towards or away from each other to achieve clamping of the docking box or silicon rod. The gripper driving mechanism includes a translation electric cylinder fixed to the upper part of the support frame. The movable end of the translation electric cylinder is fixedly connected to the gripper lifting electric cylinder. The movable end of the gripper lifting electric cylinder fixes the gripper jaws.

7. A silicon rod cutting device according to claim 2, characterized in that, The gripper also has a finger cylinder for holding silicon wafers on its side. The finger cylinder is connected to the telescopic end of the silicon wafer holding lifting cylinder to drive lifting. The silicon wafer holding lifting cylinder is driven to move laterally by the gripper drive mechanism.

8. A silicon rod cutting device according to claim 3, characterized in that, The bottom of the positioning gripper, floating support structure, and suction cup frame are all fixed with a moving component to drive the positioning gripper, floating support structure, and suction cup assembly to move along the length direction of the conveying platform. The moving component includes a moving plate, a moving motor is fixed at the lower part of the moving plate, a gear is fixed at the output end of the moving motor, and a rack that meshes with the gear is fixed on the conveying platform.

9. A silicon rod cutting device according to claim 3, characterized in that, The receiving box has a retaining edge fixed on one side to prevent the cut material from falling, and the receiving box has a groove on one side to avoid the cut material.

Images