Wafer alignment mechanism and alignment method

Abstract

The application relates to the field of semiconductor devices, in particular to a wafer alignment mechanism and an alignment method, which comprises a clamping block assembly and a poking assembly; the poking assembly comprises a mounting plate base and a fixing frame, and a rotating plate is arranged in the fixing frame; a swing plate is arranged below the rotating plate, one side of the swing plate extends to the outside of the fixing frame, and the upper surface of the swing plate and the side surface of the fixing frame are connected through springs; the lower end of a poking rod penetrates downwards from the middle part of the rotating plate and is fixed on the swing plate; the upper end of the poking rod penetrates out from the top surface of the fixing frame; a bearing is arranged on the swing plate, and a pneumatic cylinder is arranged above the bearing; the clamping block assembly comprises a clamping block connecting plate, the lower part of the front side surface of the clamping block connecting plate is fixed with a guide rail connecting plate, a linear guide rail is fixed on the guide rail connecting plate, and the upper part of the front side surface of the clamping block connecting plate is fixed with a clamping block poking head; and the upper part of the poking rod is located behind the clamping block connecting plate. The wafer alignment mechanism can accurately position the upper and lower wafers during the alignment bonding process, and the bonding process can be performed.

Description

Technical Field

[0001] This invention relates to the field of semiconductor equipment technology, and in particular to a wafer alignment mechanism and alignment method. Background Technology

[0002] With economic development and social progress, people's demand for precision electronic instruments is growing, and the development of integrated circuits is particularly rapid. As a basic material for integrated circuits, wafers are becoming increasingly indispensable in modern production processes.

[0003] SOI wafers (Silicon On Insulator, referring to a structure where silicon single crystals are formed on an insulator) are a newly developed chip manufacturing method in recent years, and are now receiving increasing attention from chip manufacturers both domestically and internationally. Research on SOI wafer bonding equipment can effectively improve the quality of SOI wafer products and simultaneously compensate for the lack of domestically produced equipment.

[0004] The wafer alignment structure is an important component of the alignment / bonding unit in SOI wafer bonding equipment, directly affecting the alignment and bonding process and having a significant impact on wafer bonding quality.

[0005] Therefore, in order to achieve alignment of the upper and lower wafers in the SOI wafer bonding equipment, it is urgent to develop a wafer alignment structure. Summary of the Invention

[0006] The technical problem to be solved by the present invention is to provide a wafer alignment mechanism and alignment method. This mechanism can realize the mechanical alignment of the upper and lower wafers during the SOI wafer bonding process.

[0007] To address the aforementioned technical problems, this application provides the following technical solution:

[0008] A wafer alignment mechanism includes a clamping block assembly and a toggle assembly;

[0009] The actuating component includes a mounting plate base and a fixing bracket fixed on the mounting plate base, with a rotating plate installed inside the fixing bracket;

[0010] A swing plate is provided below the rotating plate, one side of which extends to the outside of the fixed frame. The upper surface of the swing plate and the side of the fixed frame are connected by a spring.

[0011] A buffer is provided below the swing plate, and the buffer is fixed to the mounting plate base by a buffer mounting plate; a potentiometer mounting plate is installed below the buffer mounting plate, and a linear potentiometer is installed on the potentiometer mounting plate.

[0012] The lower end of the lever extends downward from the middle of the rotating plate and is fixed to the swing plate; the upper end of the lever extends from the top surface of the fixed frame; the swing plate is equipped with a bearing, and a cylinder is located above the bearing;

[0013] The clamping block assembly includes a clamping block connecting plate, a guide rail connecting plate fixed to the lower part of the front side of the clamping block connecting plate, a linear guide rail fixed to the guide rail connecting plate, and a clamping block lever fixed to the upper part of the front side of the clamping block connecting plate; the upper part of the lever is located behind the clamping block connecting plate.

[0014] Furthermore, the lever is covered with a corrugated tube, one end of which is fixed to the upper surface of the rotating plate, and the other end is fixed to the top of the fixing frame.

[0015] Furthermore, a lever head is fixed to the top of the lever, and the lever head is located behind the clamping block connecting plate.

[0016] Furthermore, a spring mounting plate is installed on the upper surface of the swing plate and the side of the fixing frame, and the two ends of the spring are connected to the two spring mounting plates.

[0017] Furthermore, the mounting plate base is provided with two adjustment pins.

[0018] Furthermore, a clamping block core is fixed to the front end of the clamping block dial.

[0019] Furthermore, the cylinder is driven downward to the bearing, which will cause the lever to swing by pressing down the swing plate.

[0020] Furthermore, the linear potentiometer can monitor and provide feedback on the final position of the clamping block assembly.

[0021] Furthermore, a spring is installed inside the linear guide.

[0022] The alignment method of the wafer alignment mechanism of the present invention is as follows: During the alignment process, the cylinder slides down to the bearing, and the cylinder continues to slide down to drive the lever to swing through the swing plate, so that the lever head installed on the lever contacts and pushes the clamping block assembly, and pushes the clamping block assembly to the designated position to achieve wafer positioning.

[0023] When the clamping block assembly retracts, the cylinder returns to its original position, and the spring on the actuating assembly pulls, causing the swing plate to disengage the lever from the clamping block assembly, and the clamping block assembly retracts along the linear guide rail.

[0024] Compared with the prior art, the present invention has at least the following beneficial effects:

[0025] The wafer alignment mechanism of the present invention enables precise positioning of the upper and lower wafers during the alignment and bonding process of SOI wafers, so as to perform the bonding process.

[0026] The buffer effectively reduces impact, allowing the cylinder's output force to be absorbed. Furthermore, since the impactor is a bearing, damage to the components is minimal. A linear potentiometer mounted below the mechanism monitors and provides feedback on the wafer position. It provides a fixed value each time the wafer is fully positioned. After setting limit values ​​in the software, the software can determine the wafer's position for precise positioning. The lever's travel is also adjustable, depending on the buffer's mounting position and the selection of different spring specifications.

[0027] The wafer alignment mechanism and alignment method of the present invention will be further described below with reference to the accompanying drawings. Attached Figure Description

[0028] Figure 1 This is a schematic diagram showing the position of the wafer alignment mechanism of the present invention during use;

[0029] Figure 2 This is a schematic diagram of the actuation component of the wafer alignment mechanism of the present invention;

[0030] Figure 3 This is a diagram illustrating the adjustment pin.

[0031] Figure 4 This is a schematic diagram of the clamping block assembly of the wafer alignment mechanism of the present invention;

[0032] Figure 5 This is a schematic diagram of the overall assembly of the wafer alignment mechanism of the present invention.

[0033] Among them, 1-cylinder; 2-spring; 3-bearing; 4-spring mounting plate; 5-swing plate; 6-buffer; 7-potentiometer mounting plate; 8-linear potentiometer; 9-lever; 10-bellows; 11-fixed bracket; 12-screw; 13-rotating plate; 14-mounting plate base; 15-adjusting pin; 16-buffer mounting plate; 17-lever head; 18-clamping block head; 19-clamping block connecting plate; 20-guide rail connecting plate; 21-clamping block head core; 22-linear guide rail.

[0034] 100-Wafer; 101-Wafer positioning block; 102-Suction cup; 103-Auxiliary fixing bearing; 104-Clamping block assembly; 105-Toggle assembly. Detailed Implementation

[0035] like Figure 2-5 As shown, a wafer alignment mechanism includes a clamping block assembly 104 and a toggle assembly 105.

[0036] The actuating assembly 105 includes a mounting plate base 14 and a fixing frame 11 fixed on the mounting plate base 14. A rotating plate 13 parallel to the top surface of the fixing frame 11 is provided inside the fixing frame 11. The rotating plate 13 is installed inside the fixing frame 11 via bearings, screws, and washers. The function of the rotating plate 13 is to press the bellows tightly against the lever, providing a sealing effect for the vacuum requirements of the vacuum chamber.

[0037] One end of the bellows 10 is fixed to the upper surface of the rotating plate 13, and the other end is fixed to the top of the fixing frame 11. A lever 9 is provided inside the bellows 10. The upper end of the lever 9 protrudes from the top surface of the fixing frame 11, and a lever head 17 is fixed to the top of the lever 9 by screws. The function of the bellows is to seal the lever connector and ensure the overall sealing performance of the vacuum chamber.

[0038] Below the rotating plate 13 is a swing plate 5, one side of which extends to the outside of the fixed frame 11. A spring mounting plate 4 is mounted on the upper surface of the swing plate 5 and the side of the fixed frame 11, with both ends of the spring 2 connected to the two spring mounting plates 4. Below the swing plate 5 is a buffer 6, which is fixed to the mounting plate base 14 via a buffer mounting plate 16. Below the buffer mounting plate 16 is a potentiometer mounting plate 7, on which a linear potentiometer 8 is mounted.

[0039] The rotating plate 13 has a through hole in its center. The lower end of the lever 9 passes through the through hole of the rotating plate 13 and is fixed to the swing plate 5. The upper surface of the rotating plate 13 has an integrally formed upright plate. The upright plate of the rotating plate 13 is fixed to the inner surface of the fixing frame 11 by screws 12. A bearing is provided between the upright plate of the rotating plate 13 and the screws 12, which allows the rotating plate 13 to rotate within a small range around the screws 12.

[0040] The swing plate 5 is equipped with a bearing 3, and a cylinder 1 is located above the bearing 3.

[0041] The mounting plate base 14 is provided with two adjusting pins 15, which can adjust the distance between the swing plate and the mounting plate base.

[0042] The clamping block assembly 104 includes a clamping block connecting plate 19. A guide rail connecting plate 20 is fixed to the lower part of the front side of the clamping block connecting plate 19. A linear guide rail 22 is fixed to the guide rail connecting plate 20 by screws. A clamping block dial 18 is fixed to the upper part of the front side of the clamping block connecting plate 19. A clamping block dial core 21 is fixed to the front end of the clamping block dial 18. The lever head 17 is located behind the clamping block connecting plate 19.

[0043] Cylinder 1 drives downwards to bearing 3, which in turn drives lever 9 to swing via swing plate 5. Buffer 6 effectively prevents excessive impact during the pushing process from damaging the wafer. Linear potentiometer 8 monitors and provides feedback on the final position of clamping block assembly 104. Each time positioning is complete, a fixed value is set. After setting the limit value in the software, the software can determine the wafer position to achieve precise wafer positioning. The lever's travel is also adjustable, depending on the buffer's installation position and the selection of different spring specifications.

[0044] The alignment method of the wafer alignment mechanism is as follows: During the alignment process, the cylinder 1 slides down to the bearing 3. The cylinder 1 continues to slide down and drives the lever 9 to swing through the swing plate 5, so that the lever head 17 installed on the lever 9 contacts and pushes the clamping block assembly 104, pushing the clamping block assembly 104 to the designated position to achieve wafer positioning. During this process, the linear potentiometer 8 monitors and provides feedback on the final position of the clamping block assembly 104.

[0045] When the clamping block assembly 104 retracts, the cylinder 1 returns to its original position, and the spring 2 on the actuating assembly 105 is pulled, causing the swing plate 5 to disengage the lever 9 from the clamping block assembly 104. The clamping block assembly 104 then retracts along the linear guide rail under the control of the internal spring.

[0046] The overall model and distribution plan view of the wafer alignment mechanism of the present invention are as follows: Figure 1 As shown (the actuating component 105 is not shown, but is located in the same position as the clamping block component 104), the alignment and positioning of the wafer are achieved through reasonable control.

[0047] Its working principle is as follows: by swinging the lever in the toggle assembly 105, the position of the wafer is clamped at fixed points (wafer positioning block 101, auxiliary fixed bearing 103 and clamping block assembly 104 respectively), and then the wafer itself is slid smoothly along the fixed guide structure (wafer positioning block 101) onto the suction cup 102 that supports the wafer in the process.

[0048] The wafer alignment mechanism of this invention uses a cylinder to push a lever forward to press the wafer firmly. At the same time, because the impact force of the cylinder is large, a buffer mounting plate with a buffer installed below reduces the buffering. Finally, the reading of a linear potentiometer is used to determine whether the wafer is accurately positioned.

[0049] The lever and the swing plate are fixed by a threaded connection, and the angle between the swing plate and the fixed frame is fixed by a spring connection. In the absence of impact force, the swing plate swings upward and remains stable due to the spring action between the swing plate and the fixed plate. Under the impact force of the cylinder, the cylinder presses against the bearing mounted on the swing plate, causing the swing plate to move downward. Simultaneously, the lever moves inward, pushing the clamping block assembly 104 on the suction cup 102 to squeeze the wafer, completing the positioning. When the clamping block assembly 104 retracts, the lever 9 is pulled away from the clamping block assembly 104 by the spring inside the lever assembly 105. The clamping block assembly 104 is then pushed back along the linear guide by the spring inside the linear guide.

[0050] The embodiments described above are merely preferred embodiments of the present invention and are not intended to limit the scope of the present invention. Various modifications and improvements made by those skilled in the art to the technical solutions of the present invention without departing from the spirit of the present invention should fall within the protection scope defined by the claims of the present invention.

Claims

1. A wafer alignment mechanism, characterized in that: Includes a clamping block assembly (104) and a toggle assembly (105); The actuating assembly (105) includes a mounting plate base (14) and a fixing frame (11) fixed on the mounting plate base (14). The fixing frame (11) contains a rotating plate (13). The upper surface of the rotating plate (13) is provided with an integrally formed upright plate. The upright plate of the rotating plate (13) is fixed to the inner surface of the fixing frame (11) by screws (12). A bearing is provided between the upright plate of the rotating plate (13) and the screws (12) so that the rotating plate (13) can rotate within a certain range around the screws (12). A swing plate (5) is provided below the rotating plate (13). One side of the swing plate (5) extends to the outside of the fixed frame (11). The upper surface of the swing plate (5) and the side of the fixed frame (11) are connected by a spring (2). A buffer (6) is provided below the swing plate (5), and the buffer (6) is fixed on the mounting plate base (14) by a buffer mounting plate (16); a potentiometer mounting plate (7) is installed below the buffer mounting plate (16), and a linear potentiometer (8) is installed on the potentiometer mounting plate (7). The lower end of the lever (9) extends downward from the middle of the rotating plate (13) and is fixed on the swing plate (5); the upper end of the lever (9) extends from the top surface of the fixed frame (11); a bearing (3) is mounted on the swing plate (5), and a cylinder (1) is provided above the bearing (3); the cylinder (1) is driven downward to the bearing (3), which will drive the lever (9) to swing by pressing down the swing plate (5); The clamping block assembly (104) includes a clamping block connecting plate (19), a guide rail connecting plate (20) is fixed to the lower part of the front side of the clamping block connecting plate (19), a linear guide rail (22) is fixed on the guide rail connecting plate (20), and a clamping block dial (18) is fixed to the upper part of the front side of the clamping block connecting plate (19); the upper part of the lever (9) is located behind the clamping block connecting plate (19).

2. The wafer alignment mechanism according to claim 1, characterized in that: The lever (9) is covered with a corrugated tube (10), one end of which is fixed to the upper surface of the rotating plate (13), and the other end is fixed to the top of the fixing frame (11).

3. The wafer alignment mechanism according to claim 2, characterized in that: The top of the lever (9) is fixed with a lever head (17), which is located behind the clamping block connecting plate (19).

4. The wafer alignment mechanism according to claim 3, characterized in that: The upper surface of the swing plate (5) and the side of the fixed frame (11) are each equipped with a spring mounting plate (4), and the two ends of the spring (2) are connected to the two spring mounting plates (4).

5. The wafer alignment mechanism according to claim 4, characterized in that: The mounting plate base (14) is provided with two adjusting pins (15), and the two adjusting pins (15) are located below the swing plate, which are used to adjust the distance between the swing plate and the mounting plate base.

6. The wafer alignment mechanism according to claim 5, characterized in that: The clamping block dial (18) has a clamping block dial core (21) fixed at its front end.

7. The wafer alignment mechanism according to claim 6, characterized in that: The linear potentiometer (8) can monitor and provide feedback on the final position of the clamping block assembly (104).

8. The wafer alignment mechanism according to claim 7, characterized in that: The linear guide (22) is equipped with a spring.

9. The alignment method of the wafer alignment mechanism according to any one of claims 1-8, characterized in that: During the alignment process, the cylinder (1) slides down to the bearing (3), and the cylinder (1) continues to slide down to drive the lever (9) to swing through the swing plate (5), so that the lever head (17) installed on the lever (9) contacts and pushes the clamping block assembly (104), and pushes the clamping block assembly (104) to the designated position to achieve wafer positioning; When the clamping block assembly (104) retracts, the cylinder (1) returns to its original position, and the spring (2) on the actuating assembly (105) is pulled, causing the swing plate (5) to drive the lever (9) to disengage from the clamping block assembly (104), and the clamping block assembly (104) retracts along the linear guide rail.

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